JPH0774143A - Substrate holder - Google Patents

Substrate holder

Info

Publication number
JPH0774143A
JPH0774143A JP24042893A JP24042893A JPH0774143A JP H0774143 A JPH0774143 A JP H0774143A JP 24042893 A JP24042893 A JP 24042893A JP 24042893 A JP24042893 A JP 24042893A JP H0774143 A JPH0774143 A JP H0774143A
Authority
JP
Japan
Prior art keywords
substrate
rotation
rotary table
pressing member
center
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP24042893A
Other languages
Japanese (ja)
Inventor
Masayuki Itabane
昌行 板羽
Koji Nakagawa
幸治 中川
Katsuji Yoshioka
勝司 吉岡
Nobuyasu Hiraoka
伸康 平岡
Masashi Takeoka
正史 武岡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dainippon Screen Manufacturing Co Ltd
Original Assignee
Dainippon Screen Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Screen Manufacturing Co Ltd filed Critical Dainippon Screen Manufacturing Co Ltd
Priority to JP24042893A priority Critical patent/JPH0774143A/en
Publication of JPH0774143A publication Critical patent/JPH0774143A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To avoid the slippage of a substrate in the initial stage of acceleration of rotation and in the final stage of deceleration in which the slippage is easily produced by a method wherein a substrate pressure member is pressed against the substrate. CONSTITUTION:A substrate W is held on a horizontal rotary table 1. A pendulum type pressure member 11 which can be turned in a plane not perpendicular to the rotary table 1 is provided on the outer edge side of the rotary table 1. In a period in which the absolute value of the acceleration of the rotation is small, the pressure member 11 is separated from the substrate W. In the initial stage of the acceleration of the rotation and the final stage of the deceleration of the rotation in which the absolute value of the acceleration of the rotation is large, the pressing member 11 is turned and displaced significantly by an inertia and the predetermined part of the member 11 is brought into contact with the outer edge Wa of the substrate W to prevent the substrate W from slippage.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】この発明は、例えば、オリエンテ
ーションフラットやノッチ等の切欠きが形成された半導
体ウエハ等の略円形の基板、あるいは光ディスク用基板
などのように全く切欠きを有しない円形の基板を回転台
上に支持し、基板の上面に洗浄液やエッチング液等の各
種処理液を供給する等により基板の処理を行う回転式基
板処理装置に用いられる基板保持装置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substantially circular substrate such as a semiconductor wafer having a notch such as an orientation flat or notch, or a circular substrate having no notch such as an optical disk substrate. The present invention relates to a substrate holding device used in a rotary substrate processing apparatus that processes a substrate by supporting the substrate on a turntable and supplying various processing liquids such as cleaning liquid and etching liquid to the upper surface of the substrate.

【0002】[0002]

【従来の技術】半導体ウェハ、フォトマスク用ガラス基
板などの、高いクリーン度が要求される基板を処理する
回転式基板処理装置においては、基板の回転時に基板を
保持する部材と基板との間のすべりを極力抑えることが
要求される。すべりが生じると、基板の表面が削られる
ことにより、基板が損傷するばかりでなく、発塵と基板
自身の汚染の原因ともなる。また、処理液の流動が不均
一となるために、基板の処理における品質にも問題を生
じる。このため、例えば特開昭51−132972号公
報、および特公平3−77585号公報などにおいて、
基板の回転時のすべりを抑える技術が開示されている。
これらの従来技術における装置では、水平に載置された
基板の外縁に当接し得る遠心性のアームが水平回転台に
設けられており、水平回転台の回転に伴う遠心力の作用
により、アームが基板の外縁に押圧付勢される。押圧付
勢されるアームと基板の外縁との間の摩擦力によって、
基板のすべりを防止する効果が得られる。
2. Description of the Related Art In a rotary substrate processing apparatus for processing a substrate such as a semiconductor wafer or a glass substrate for a photomask, which requires a high degree of cleanliness, a substrate between a member for holding the substrate during rotation of the substrate and the substrate. It is required to minimize slippage. When slippage occurs, the surface of the substrate is scraped, which not only damages the substrate, but also causes dust generation and contamination of the substrate itself. Further, since the flow of the processing liquid becomes non-uniform, there arises a problem in the quality of processing the substrate. Therefore, for example, in Japanese Unexamined Patent Publication No. 51-132927 and Japanese Patent Publication No. 3-77585,
A technique for suppressing slippage during rotation of a substrate is disclosed.
In these conventional devices, a centrifugal arm that can come into contact with the outer edge of a horizontally placed substrate is provided on the horizontal rotary table, and the arm is moved by the action of centrifugal force associated with the rotation of the horizontal rotary table. It is pressed and urged against the outer edge of the substrate. Due to the frictional force between the pressure-biased arm and the outer edge of the substrate,
The effect of preventing slippage of the substrate can be obtained.

【0003】[0003]

【発明が解決しようとする課題】しかしながら、これら
の従来技術では遠心力を利用して基板を挟持するもので
あるために、回転加速時および回転減速時において回転
速度が十分には高くない期間、すなわち回転加速の初期
および回転減速の最終期においては、すべりを十分に抑
制することはできないという問題点を有していた。
However, since these prior arts use the centrifugal force to sandwich the substrate, the period during which the rotation speed is not sufficiently high during rotation acceleration and rotation deceleration, That is, there is a problem that slip cannot be sufficiently suppressed in the initial stage of rotational acceleration and the final stage of rotational deceleration.

【0004】この発明は、上記の従来の技術が有する欠
点を解消することを目指したもので、回転加速の初期お
よび回転減速の最終期を含めて、基板のすべりを抑える
ことができる基板保持装置を提供することを目的とす
る。
The present invention is aimed at eliminating the above-mentioned drawbacks of the prior art, and is capable of suppressing the slippage of the substrate including the initial stage of rotational acceleration and the final stage of rotational deceleration. The purpose is to provide.

【0005】[0005]

【課題を解決するための手段】この発明にかかる基板保
持装置は、鉛直軸周りで所定の回転方向に基板を水平回
転させつつ前記基板の主面に所定の処理を行うにあたっ
て、前記基板を保持するために用いられる基板保持装置
であって、(a) 水平回転台と、(b) 前記水平回転台の上
面側に設けられて前記基板を保持する基板保持部材と、
(c) 前記水平回転台の外周側に軸支され、非鉛直面内で
双方向に回動自在であって、重心を回動軸上から偏位し
た位置に有する押さえ部材と、を備え、前記押さえ部材
の重心の回動角度が所定の第1と第2の臨界角度に至っ
たときにのみ前記押さえ部材の所定部位が前記基板の外
縁に当接し、前記第1と第2の臨界角度は、前記水平回
転台の回転中心と前記軸支の位置とを結ぶ方向を基準と
して前記所定の回転方向とは反対方向側にずれた範囲内
で規定されていることを特徴とする。
A substrate holding device according to the present invention holds a substrate when performing a predetermined process on a main surface of the substrate while horizontally rotating the substrate in a predetermined rotation direction around a vertical axis. A substrate holding device used for, (a) a horizontal rotary table, (b) a substrate holding member provided on the upper surface side of the horizontal rotary table to hold the substrate,
(c) a pressing member that is axially supported on the outer peripheral side of the horizontal rotary table, is bidirectionally rotatable within a non-vertical plane, and has a center of gravity at a position offset from the rotational axis, Only when the rotation angle of the center of gravity of the pressing member reaches the predetermined first and second critical angles, the predetermined portion of the pressing member contacts the outer edge of the substrate, and the first and second critical angles are reached. Is defined within a range deviated to the direction opposite to the predetermined rotation direction with reference to the direction connecting the rotation center of the horizontal rotary table and the position of the shaft support.

【0006】[0006]

【作用】この発明における基板保持装置は、回転台が回
転加速を行う過程の初期には、加速に伴う慣性力の作用
により、押さえ部材の重心が回転方向後方に接近するよ
うに押さえ部材が回動する。このため、重心は第1およ
び第2の臨界角度の中の回転方向後方に近い方(例えば
これを第1の臨界角度とする)に位置し、押さえ部材の
所定部位が基板の外縁に当接し押圧付勢する。その結
果、所定部位と基板の外縁との間に摩擦力が生じるの
で、基板のすべりが防止される。一方、加速が十分に行
われ回転台が比較的高速で回転するときには、慣性力よ
りも遠心力が強く作用するため、押さえ部材の重心が回
動軸に対して回転の径方向外方に接近するように押さえ
部材が回動する。このため、重心はもう1つの臨界角度
(例えば第2の臨界角度)に位置し、所定部位が基板の
外縁に当接し押圧付勢する。その結果、所定部位と基板
の外縁との間に摩擦力が生じるので、基板のすべりが防
止される。更に回転台が回転減速を行うときには、減速
に伴う慣性力が遠心力に加わるため、重心は例えば第2
の臨界角度に同じく位置し、所定部位が基板の外縁に当
接し押圧付勢する。その結果、所定部位と基板の外縁と
の間に摩擦力が生じるので、基板のすべりが防止され
る。以上のようにこの発明の装置では、回転加速の初期
および回転減速の最終期を含めて、基板のすべりを抑え
ることができる。
In the substrate holding device according to the present invention, in the initial stage of the process in which the rotary base accelerates the rotation, the holding member is rotated so that the center of gravity of the holding member approaches the direction of rotation rearward by the action of the inertial force associated with the acceleration. Move. Therefore, the center of gravity is located closer to the rear in the rotational direction of the first and second critical angles (for example, this is the first critical angle), and the predetermined portion of the pressing member contacts the outer edge of the substrate. Press and urge. As a result, a frictional force is generated between the predetermined portion and the outer edge of the substrate, so that the substrate is prevented from slipping. On the other hand, when acceleration is sufficient and the turntable rotates at a relatively high speed, centrifugal force acts more strongly than inertial force, so the center of gravity of the pressing member approaches the rotation axis radially outward of the rotation. The pressing member rotates so as to move. Therefore, the center of gravity is located at another critical angle (for example, the second critical angle), and the predetermined portion comes into contact with the outer edge of the substrate and presses and biases it. As a result, a frictional force is generated between the predetermined portion and the outer edge of the substrate, so that the substrate is prevented from slipping. Further, when the rotary table performs rotational deceleration, the inertial force associated with deceleration is added to the centrifugal force, so that the center of gravity is
Is also positioned at the critical angle of, and a predetermined portion comes into contact with the outer edge of the substrate and presses and biases it. As a result, a frictional force is generated between the predetermined portion and the outer edge of the substrate, so that the substrate is prevented from slipping. As described above, in the apparatus of the present invention, the slippage of the substrate can be suppressed including the initial stage of rotational acceleration and the final stage of rotational deceleration.

【0007】重心が第1の臨界角度と第2の臨界角度と
の間に位置するときには、押さえ部材は基板の外縁を解
放する。このため、押さえ部材の回動位置をこの位置に
設定することによって、基板の基板保持部材への載置、
および基板保持部材からの取り外しが容易に行い得る。
When the center of gravity is located between the first critical angle and the second critical angle, the pressing member releases the outer edge of the substrate. Therefore, by setting the rotation position of the pressing member to this position, the substrate can be placed on the substrate holding member,
Also, it can be easily removed from the substrate holding member.

【0008】[0008]

【実施例】<回転式基板処理装置10>[Example] <Rotary substrate processing apparatus 10>

【0009】この発明の実施例における基板保持装置の
構成と機能についての説明に先だって、実施例の装置を
搭載した回転式基板処理装置について説明する。図2の
部分的に切欠きを有する側面図は、回転式基板処理装置
の全体の概略構成を模式的に示す。
Prior to the description of the structure and function of the substrate holding apparatus in the embodiment of the present invention, a rotary substrate processing apparatus equipped with the apparatus of the embodiment will be described. The side view of FIG. 2 partially having a notch schematically shows the general configuration of the rotary substrate processing apparatus.

【0010】回転式基板処理装置10は、モータ6によ
って回転駆動される基板保持装置100と、基板保持装
置100によって保持されている基板Wの上面に、例え
ば酸やアルカリ、各種溶剤、純水等を含む洗浄液や、フ
ォトレジスト液、現像液、あるいはエッチング液等の各
種処理液を供給する処理液供給ノズル7と、モータ6の
回転駆動軸6aを挿通し、基板Wの側方および下方を囲
って、基板Wから飛散する処理液を回収する処理液回収
カップ8とを具備している。モータ6は、その回転駆動
軸6aが鉛直になるように設けられ、基板保持装置10
0は、モータ6によって水平回転される回転台1と、回
転台1上の周縁部に固定的に配設された複数の基板保持
部材2と、同じく周縁部に回動自在に付設された押さえ
部材(図2には図示しない)とを具備している。
The rotary substrate processing apparatus 10 includes a substrate holding device 100 that is driven to rotate by a motor 6 and an upper surface of a substrate W held by the substrate holding device 100. The cleaning liquid containing the cleaning liquid, the processing liquid supply nozzle 7 for supplying various processing liquids such as the photoresist liquid, the developing liquid, and the etching liquid, and the rotary drive shaft 6a of the motor 6 are inserted to surround the side and the lower side of the substrate W. And a processing liquid recovery cup 8 for recovering the processing liquid scattered from the substrate W. The motor 6 is provided such that its rotation drive shaft 6a is vertical, and the substrate holding device 10
Reference numeral 0 denotes a rotary table 1 which is horizontally rotated by a motor 6, a plurality of substrate holding members 2 fixedly arranged on the peripheral edge of the rotary table 1, and a pressing member which is also rotatably attached to the peripheral edge. And a member (not shown in FIG. 2).

【0011】基板保持装置100で保持されつつ水平回
転する基板Wの上面に、所要の処理液を供給することに
より基板Wの表面処理が行われる。図示しない昇降手段
により、処理液回収カップ8は鉛直方向、言い替えると
基板保持装置100の回転軸の方向に昇降可能である。
基板Wを基板保持装置100に載置する際および基板保
持装置100から取り出す際には、処理液回収カップ8
は相対的に下方に位置し、基板Wを回転し処理を施す工
程では相対的に上方に位置する。図2は、後者の処理を
施す工程にある処理液回収カップ8を示している。
The surface treatment of the substrate W is performed by supplying a required treatment liquid to the upper surface of the substrate W which is horizontally rotated while being held by the substrate holding device 100. The processing liquid recovery cup 8 can be lifted and lowered in the vertical direction, in other words, in the direction of the rotation axis of the substrate holding device 100, by a lifting means (not shown).
When the substrate W is placed on the substrate holding device 100 and taken out from the substrate holding device 100, the processing liquid recovery cup 8 is used.
Is relatively lower, and is relatively higher in the process of rotating the substrate W to perform processing. FIG. 2 shows the treatment liquid recovery cup 8 in the step of performing the latter treatment.

【0012】<基板保持装置100の構成><Structure of Substrate Holding Device 100>

【0013】図1は、回転式基板処理装置10に用いら
れる基板保持装置100の斜視図である。モータ6の回
転駆動軸6aと一致する鉛直な回転軸Aの周りに回転す
る回転台1の上面には、基板保持部材2と押さえ部材1
1とが、載置されるべき円形の基板Wの周囲に配設され
ている。基板保持部材2は、基板Wを所定の位置に保持
する部材であり、基板支持部3と水平位置規制部4とを
一体に成形して成る。押さえ部材11は、回動軸12a
(詳細は後述する)の周りに回動自在に回転台1に支持
されている。
FIG. 1 is a perspective view of a substrate holding device 100 used in a rotary substrate processing apparatus 10. The substrate holding member 2 and the pressing member 1 are provided on the upper surface of the turntable 1 that rotates about a vertical rotation axis A that coincides with the rotation drive shaft 6 a of the motor 6.
1 and 1 are arranged around a circular substrate W to be placed. The substrate holding member 2 is a member that holds the substrate W at a predetermined position, and is formed by integrally forming the substrate supporting portion 3 and the horizontal position regulating portion 4. The pressing member 11 has a rotating shaft 12a.
The turntable 1 is rotatably supported around (details will be described later).

【0014】図3は、基板保持装置100の平面図であ
る。基板保持部材2は、好ましくはその複数の水平位置
規制部4からみて回転軸Aの側でそれらの水平位置規制
部4に接するように規定される円Rの中心Cが、回転台
の回転軸Aから水平方向に所定の距離Lだけ偏位するよ
うに配置される。すなわち、基板Wが基板保持部材2に
保持されたとき、切り欠きを有しない円形の基板W(図
3に示す)の場合にはその外縁Waの中心の位置、ノッ
チ等が形成された略円形の基板(図示せず)の場合には
その外縁の円弧部分の中心の位置は、Cと一致し、回転
軸Aから水平方向に偏位した位置にある。押さえ部材1
1は、回転軸Aに対して上述の中心Cと反対の側、すな
わち基板Wの外縁Waが回転軸Aに最も近接する位置に
設置される。
FIG. 3 is a plan view of the substrate holding device 100. The substrate holding member 2 preferably has a center C of a circle R defined so as to be in contact with the horizontal position restricting portions 4 on the side of the rotating shafts A when viewed from the plurality of horizontal position restricting portions 4 such that the center of rotation C of the rotary table is the rotational axis. It is arranged so as to be displaced from A by a predetermined distance L in the horizontal direction. That is, when the substrate W is held by the substrate holding member 2, in the case of a circular substrate W having no notch (shown in FIG. 3), the center position of the outer edge Wa, a notch, etc. are formed in a substantially circular shape. In the case of the substrate (not shown), the position of the center of the arc portion of the outer edge thereof coincides with C and is displaced from the rotation axis A in the horizontal direction. Holding member 1
1 is installed on the side opposite to the center C described above with respect to the rotation axis A, that is, at a position where the outer edge Wa of the substrate W is closest to the rotation axis A.

【0015】図4は、回動軸12aに一致するB−B線
(図1および図3)すなわち押さえ部材11の取り付け
部分における回動軸12aと重心Gとを含む面での基板
保持装置100の部分断面図である。基板保持部材2を
構成する基板支持部3は、その上面が基板Wの外縁に近
い底面部分Wbに当接することにより、基板Wを回転台
1から離間して水平に支持する。水平位置規制部4の側
面は、基板Wの外縁Waに当接して基板Wの水平方向の
位置を規制する。なお、基板保持装置100への基板W
の載置を容易にするため、水平位置規制部4は、その側
面が基板Wの外縁Waに対して若干の遊びを有していて
もよく、実質的に基板Wの水平方向の位置が規制できて
いればよい。
FIG. 4 shows the substrate holding device 100 on the line BB (FIGS. 1 and 3) which coincides with the rotating shaft 12a, that is, on the surface including the rotating shaft 12a and the center of gravity G in the mounting portion of the pressing member 11. FIG. The substrate support portion 3 that constitutes the substrate holding member 2 supports the substrate W horizontally away from the rotary table 1 by abutting the upper surface thereof on the bottom surface portion Wb near the outer edge of the substrate W. The side surface of the horizontal position regulating portion 4 contacts the outer edge Wa of the substrate W to regulate the horizontal position of the substrate W. Note that the substrate W to the substrate holding device 100 is
In order to facilitate the placement of the substrate W, the horizontal position restricting portion 4 may have some play with respect to the outer edge Wa of the substrate W so that the horizontal position of the substrate W is substantially restricted. It should be done.

【0016】基板保持装置100において、回転台1の
上面はほぼ水平面に形成され、回転台1の、回転軸Aか
らみて上述の中心Cと反対の側の部分には、傾斜面1a
が形成されている。傾斜面1aは、回転台1の上面か
ら、回転軸Aから中心Cと反対の向きに対し回転台1の
上側から見て角度αだけ時計方向にずれた角度で、半径
方向外側へ向かって低くなるように形成されている。押
さえ部材11は、中心Cから回転軸Aに向かった延長上
の傾斜面1aに、回転軸Aとねじれの位置関係にあり且
つ傾斜面1aに垂直、すなわち上方ほど回転台1の回転
軸Aから離れるように傾斜した回動軸12aのまわりで
回転自在に設けられている。本発明としては、回動軸1
2aの方向が、水平面に対して傾いているものであれば
良い。言い換えれば、回動軸12aの周りで回転する押
さえ部材11の回転面が鉛直面に対して傾いた非鉛直面
であればよい。
In the substrate holding apparatus 100, the upper surface of the rotary table 1 is formed substantially in the horizontal plane, and the inclined surface 1a is formed on a portion of the rotary table 1 on the side opposite to the center C when viewed from the rotation axis A.
Are formed. The inclined surface 1a is an angle deviated from the upper surface of the rotary table 1 in the clockwise direction by an angle α when viewed from the upper side of the rotary table 1 with respect to a direction opposite to the center C from the rotation axis A, and is lowered outward in the radial direction. Is formed. The pressing member 11 has a twisted positional relationship with the rotation axis A on the extended inclined surface 1a extending from the center C toward the rotation axis A and is perpendicular to the inclined surface 1a, that is, from the rotation axis A of the turntable 1 toward the upper side. It is rotatably provided around a rotating shaft 12a inclined so as to separate. According to the present invention, the rotating shaft 1
It is sufficient that the direction of 2a is inclined with respect to the horizontal plane. In other words, the rotation surface of the pressing member 11 that rotates around the rotation shaft 12a may be a non-vertical surface that is inclined with respect to the vertical surface.

【0017】押さえ部材11は、回動軸受け部材12を
介して双方向に回動自在になるように、回転台1に支持
されている。押さえ部材11は、樹脂製の押さえ部材本
体11a、金属の錘部材11b、および押さえ部材本体
11aと錘部材11bとを接続する樹脂製の接続部材1
1dとを有している。錘部材11bの表面は防錆のため
薄い樹脂膜(図示せず)で覆われている。押さえ部材本
体11aは、基板外縁Waに当接し得る面である押圧面
11cを有している。押さえ部材本体11aは、ナット
14によって接続部材11dに固定的に結合されてい
る。押さえ部材本体11aと回動軸受け部材12とを、
例えばフッ素樹脂で構成することにより、押さえ部材本
体11aと回動軸受け部材12の間に作用する回動摩擦
力を低くすることができる。
The pressing member 11 is supported by the rotary table 1 so as to be bidirectionally rotatable via a rotary bearing member 12. The pressing member 11 includes a resin pressing member main body 11a, a metal weight member 11b, and a resin connecting member 1 that connects the pressing member main body 11a and the weight member 11b.
1d and. The surface of the weight member 11b is covered with a thin resin film (not shown) for rust prevention. The pressing member main body 11a has a pressing surface 11c that is a surface that can come into contact with the substrate outer edge Wa. The pressing member main body 11a is fixedly coupled to the connecting member 11d by a nut 14. The pressing member main body 11a and the rotary bearing member 12 are
By using, for example, a fluororesin, the rotational frictional force acting between the pressing member main body 11a and the rotational bearing member 12 can be reduced.

【0018】錘部材11bは、押さえ部材11の重心G
が、回動軸受け部材12によって規定される回動軸12
aから偏位した位置となるように設けられる。回動軸1
2aは、前述の如く回転軸Aに対して所定の傾斜角をも
って傾斜しており、その上方向は回転の径方向外方Rd
(図3)と回転方向後方Bdの間の所定の方向P0 に向
っている。回転台1は、押さえ部材11の回動を妨げな
いように、押さえ部材11が設置される位置において傾
斜面1aを有する。
The weight member 11b is the center of gravity G of the pressing member 11.
Is the rotation shaft 12 defined by the rotation bearing member 12.
It is provided so as to be displaced from a. Rotation axis 1
2a is inclined with respect to the rotation axis A at a predetermined inclination angle as described above, and the upward direction thereof is the outer radial direction Rd of rotation.
It is directed in a predetermined direction P0 between (FIG. 3) and the backward direction Bd in the rotational direction. The rotary table 1 has an inclined surface 1a at a position where the pressing member 11 is installed so as not to hinder the rotation of the pressing member 11.

【0019】<基板保持装置100の動作><Operation of Substrate Holding Device 100>

【0020】図5は、基板保持装置100の動作を説明
する模式図である。基板Wの処理を行う前および後、す
なわち基板Wを基板保持部材2上に載置するとき、およ
び基板保持部材2から除去するときには、回転台1は回
転することなく静止している。このとき、回動軸12a
が傾斜していることから、押さえ部材11の重心Gは重
力の作用によって、回動軸12aの上方向の傾斜する方
向P0 に位置する。押圧面11cは、重心Gがこの位置
にあるときには、基板外縁Waには当接しないように形
成されている(図5(a))。このため、基板Wの載置
および取り外しが容易に行い得る。
FIG. 5 is a schematic view for explaining the operation of the substrate holding device 100. Before and after the processing of the substrate W, that is, when the substrate W is placed on the substrate holding member 2 and when it is removed from the substrate holding member 2, the rotary table 1 is stationary and does not rotate. At this time, the rotating shaft 12a
Is inclined, the center of gravity G of the pressing member 11 is positioned in the upwardly inclined direction P0 of the rotating shaft 12a by the action of gravity. The pressing surface 11c is formed so as not to contact the substrate outer edge Wa when the center of gravity G is at this position (FIG. 5A). Therefore, the substrate W can be easily placed and removed.

【0021】基板Wが基板保持部材2に載置された後、
回転台1が図5(b)中、反時計回りに回転を開始し所
定の回転加速度をもって回転速度が上昇する過程におい
て、回転速度が十分に大きくない初期の期間では、重心
Gには加速度による慣性力が主要に作用する。このた
め、重心Gの位置は、方向P0 から回転方向後方Bdへ
と向かう。重心Gが方向P0 と回転方向後方Bdとの間
の所定の方向P1 (例えば第1の臨界角度に対応する方
向)にあるときに、押圧面11cが基板外縁Waに当接
する(図5(b))。したがって押圧面11cは、回転
加速度に対応したある大きさの押圧力をもって基板外縁
Waに押圧付勢する。この押圧力によって生じる押圧面
11cと基板外縁Waとの間の摩擦力により、基板Wと
回転台1との間の相対的なすべりが抑えられる。
After the substrate W is placed on the substrate holding member 2,
In the process in which the rotary table 1 starts rotating counterclockwise in FIG. 5B and the rotational speed increases at a predetermined rotational acceleration, the center of gravity G is affected by the acceleration during the initial period when the rotational speed is not sufficiently high. The inertial force mainly acts. Therefore, the position of the center of gravity G moves from the direction P0 toward the rearward direction Bd in the rotational direction. When the center of gravity G is in a predetermined direction P1 (for example, a direction corresponding to the first critical angle) between the direction P0 and the backward direction Bd of the rotational direction, the pressing surface 11c abuts the outer edge Wa of the substrate (FIG. 5 (b). )). Therefore, the pressing surface 11c presses the substrate outer edge Wa with a certain amount of pressing force corresponding to the rotational acceleration. Due to the frictional force between the pressing surface 11c and the substrate outer edge Wa generated by this pressing force, the relative slip between the substrate W and the turntable 1 is suppressed.

【0022】回転台1の回転速度がある大きさを超える
と、押さえ部材11には慣性力よりも遠心力が主要に作
用するために、重心Gは径方向外方Rdへと向かう。重
心Gが方向P0 と径方向外方Rdとの間の所定の方向P
2 (例えば第2の臨界角度に対応する方向)にあるとき
に、押圧面11cが基板外縁Waに当接する(図5
(c))。したがって押圧面11cは、遠心力すなわち
回転速度に対応したある大きさの押圧力をもって基板外
縁Waに押圧付勢する。この押圧力によって生じる押圧
面11cと基板外縁Waとの間の摩擦力により、基板W
と回転台1との間の相対的なすべりが抑えられる。
When the rotational speed of the rotary table 1 exceeds a certain value, the centrifugal force rather than the inertial force acts mainly on the pressing member 11, so that the center of gravity G moves outward in the radial direction Rd. The center of gravity G is a predetermined direction P between the direction P0 and the radially outward Rd.
2 (for example, the direction corresponding to the second critical angle), the pressing surface 11c contacts the substrate outer edge Wa (see FIG. 5).
(C)). Therefore, the pressing surface 11c presses and urges the substrate outer edge Wa with a centrifugal force, that is, a certain pressing force corresponding to the rotation speed. Due to the frictional force between the pressing surface 11c and the outer edge Wa of the substrate generated by this pressing force, the substrate W
The relative slip between the rotary table 1 and the rotary table 1 is suppressed.

【0023】回転台1の回転加速が終了し、定速回転に
移行した後も重心Gは同様の方向P2 にあって、押さえ
部材11は基板外縁Waを押圧付勢する。更に、定速回
転が終了し、所定の回転減速度をもって回転台1の回転
速度が減少する過程においては、減速度による慣性力と
遠心力とが互いに強め合う。このため、重心Gはやはり
同様の方向P2 に位置し、押さえ部材11は基板外縁W
aに押圧付勢する。
The center of gravity G is still in the same direction P2 after the rotational acceleration of the rotary table 1 is completed and the rotation of the rotary table 1 is changed to the constant speed rotation, and the pressing member 11 presses and biases the outer edge Wa of the substrate. Further, in the process in which the constant speed rotation is completed and the rotation speed of the rotary table 1 decreases at a predetermined rotation deceleration, the inertial force and the centrifugal force due to the deceleration reinforce each other. Therefore, the center of gravity G is also located in the same direction P2, and the pressing member 11 has the substrate outer edge W.
Press and urge to a.

【0024】図6は、押さえ部材11における以上の作
用をグラフで表現したものである。図6は、回転速度V
が、加速期間T1 においては一定の加速度をもって増加
し、定速期間T2 においては一定値を保持し、減速期間
T3 においては一定の減速度をもって減少する例を示し
ている。回転速度Vに起因する遠心力Fは、加速期間T
1 において時間とともに放物線状に増加し、定速期間T
2 では一定値を保持し、減速期間T3 では放物線状に減
少する。回転加速度および減速度に起因する慣性力H
は、加速期間T1 では負の一定値であり、定速期間T2
ではゼロであり、減速期間T3 では正の一定値となる。
FIG. 6 is a graph showing the above operation of the pressing member 11. FIG. 6 shows the rotation speed V
However, in the acceleration period T1, the acceleration is increased with a constant acceleration, the constant speed period T2 is maintained with a constant value, and the deceleration period T3 is decreased with a constant deceleration. The centrifugal force F caused by the rotation speed V is the acceleration period T
1 increases parabolically with time, and the constant speed period T
At 2, it maintains a constant value, and during the deceleration period T3, it decreases in a parabolic shape. Inertial force H due to rotational acceleration and deceleration
Is a constant negative value during the acceleration period T1, and the constant speed period T2
Is zero and has a positive constant value during the deceleration period T3.

【0025】慣性力Hと遠心力Fとの和F+H(厳密に
はそれぞれにある重みを付した値同士の和)は、加速期
間T1 においては負の値から正の値へと時間とともに放
物線状に上昇し、定速期間T2 では正の一定値であり、
減速期間T3 では正の高い値から同じく正の低い値へと
放物線状に下降する。和F+Hは、加速期間T1 内のあ
る時点t0 で、ゼロの値を有する。和F+Hは、時点t
0 を境として、時点t0 以前では負であり、時点t0 以
後では減速期間T3 が終了するに至るまで一貫して正で
ある。和F+Hが負であるとき、重心Gは方向P1 に位
置し、正であるときには方向P2 に位置する。すなわ
ち、回転台1の回転が加速される期間のある瞬間t0 な
いしその前後の一定期間において、押さえ部材11は基
板外縁Waにすべりを防止するに必要な程に十分な押圧
力を付勢しない。それより以前の期間およびそれ以後の
期間においては、押さえ部材11は基板外縁Waに十分
に大きな押圧力を及ぼし、基板Wのすべりを防止する。
The sum F + H of the inertial force H and the centrifugal force F (strictly speaking, the sum of the values weighted with each other) is a parabolic curve with time from a negative value to a positive value during the acceleration period T1. To a constant constant value during the constant speed period T2,
In the deceleration period T3, the value is parabolic from a high positive value to a low positive value. The sum F + H has a value of zero at some point in time t0 within the acceleration period T1. Sum F + H is time t
With 0 as a boundary, it is negative before time t0, and is consistently positive after time t0 until the deceleration period T3 ends. The center of gravity G is located in the direction P1 when the sum F + H is negative, and in the direction P2 when the sum F + H is positive. That is, the pressing member 11 does not apply sufficient pressing force to the outer edge Wa of the substrate at a certain time t0 or a certain period before and after the time when the rotation of the rotary table 1 is accelerated. In the period before that and the period after that, the pressing member 11 exerts a sufficiently large pressing force on the outer edge Wa of the substrate to prevent the substrate W from slipping.

【0026】この実施例の装置100では、中心Cが回
転軸Aから所定の距離をもって偏位しているので、基板
Wには回転速度に対応した遠心力が作用する。その結
果、回転台1の回転速度がある程度以上に大きければ、
水平位置規制部4によって基板Wのすべりが抑制され
る。このため、回転速度が十分に高いときには、押さえ
部材11による押圧力が弱くてもすべりを生じない。逆
に回転台1の回転速度が十分に高くないとき、例えば回
転加速の初期、および回転減速の最終期などにおいて
は、中心Cの偏位によるすべりの防止効果は得られな
い。
In the apparatus 100 of this embodiment, since the center C is deviated from the rotation axis A with a predetermined distance, the centrifugal force corresponding to the rotation speed acts on the substrate W. As a result, if the rotation speed of the turntable 1 is higher than a certain level,
The horizontal position restricting portion 4 suppresses slippage of the substrate W. Therefore, when the rotation speed is sufficiently high, slip does not occur even if the pressing force of the pressing member 11 is weak. On the contrary, when the rotation speed of the turntable 1 is not sufficiently high, for example, in the initial stage of rotation acceleration and the final stage of rotation deceleration, the slip prevention effect due to the deviation of the center C cannot be obtained.

【0027】そこで、好ましくは加速期間T1 において
中心Cの偏位によるすべりの防止効果が時点t0 に至る
よりも以前に現れるように、偏位の大きさL、回動軸1
2aと重心Gの距離、方向P0 、P1 、P2 などが設定
される。このことによって、中心Cの偏位の効果と押さ
え部材11による基板外縁Waへの押圧付勢の効果とが
相互に補い合って、加速期間T1 〜減速期間T3 の全期
間にわたって基板Wのすべりが防止される。
Therefore, preferably, in the acceleration period T1, the magnitude of the deviation L and the rotating shaft 1 are set so that the effect of preventing the slip due to the deviation of the center C appears before the time t0.
The distance between 2a and the center of gravity G, the directions P0, P1, P2, etc. are set. As a result, the effect of the center C displacement and the effect of the pressing member 11 pressing the outer peripheral edge Wa of the substrate C complement each other, preventing the substrate W from slipping over the entire period from the acceleration period T1 to the deceleration period T3. To be done.

【0028】<変形例><Modification>

【0029】(1)基板保持部材2は図1などに示した
ような、基板支持部3と水平位置規制部4とが一体に形
成されたものでなくてもよい。すなわち、図7に示すよ
うに基板保持部材2を、回転台1の上面に基板支持部3
と水平位置規制部4とに分離して構成してもよい。な
お、図7では押さえ部材11は図示を略している。
(1) The substrate holding member 2 does not have to have the substrate supporting portion 3 and the horizontal position regulating portion 4 integrally formed as shown in FIG. In other words, as shown in FIG.
And the horizontal position regulating portion 4 may be separately configured. Note that the pressing member 11 is omitted in FIG. 7.

【0030】(2)押さえ部材11の形状は、図1など
に示した形状に限定されない。上述した所定の機能を果
たし得る限り他の形状であってもよい。好ましくは、回
転台1が回転するときに押さえ部材11に作用する空気
抵抗を減少し得る形状が選択される。
(2) The shape of the pressing member 11 is not limited to the shape shown in FIG. Other shapes may be used as long as they can perform the predetermined functions described above. Preferably, a shape that can reduce the air resistance acting on the pressing member 11 when the rotary table 1 rotates is selected.

【0031】(3)回転式基板処理装置10は、処理液
を供給して基板の上面に処理を行う装置だけではなく、
例えば基板を水平回転しつつ基板の乾燥を行う回転式基
板処理装置などであってもよい。
(3) The rotary substrate processing apparatus 10 is not only an apparatus for supplying a processing liquid to perform processing on the upper surface of a substrate, but also
For example, it may be a rotary substrate processing apparatus or the like that horizontally rotates the substrate while drying the substrate.

【0032】[0032]

【発明の効果】この発明における基板保持装置は、回転
台が回転加速を行う過程の初期には、加速に伴う慣性力
が主として作用することにより、押さえ部材の重心が回
転方向後方に接近するように押さえ部材が回動し、押さ
え部材が基板の外縁に当接し押圧付勢する。一方、加速
が十分に行われ回転台が高速で回転するとき、または減
速時には、慣性力よりも遠心力が強く作用するため、あ
るいは遠心力に慣性力が付加されるために、押さえ部材
の重心が回動軸に対して回転の径方向外方に接近するよ
うに押さえ部材が回動する。このため、押さえ部材が同
様に基板の外縁に当接し押圧付勢する。押さえ部材が押
圧付勢することによって基板の外縁との間に摩擦力が生
じるので、基板のすべりが防止される。すなわちこの発
明の装置は、回転加速の初期および回転減速の最終期を
含めて、基板のすべりを防止する効果を有する。
According to the substrate holding apparatus of the present invention, the center of gravity of the pressing member approaches the rear side in the rotational direction at the beginning of the process of rotational acceleration of the rotary table, because the inertial force accompanying the acceleration mainly acts. The pressing member rotates, and the pressing member comes into contact with the outer edge of the substrate and presses and urges it. On the other hand, when acceleration is sufficiently performed and the turntable rotates at high speed, or during deceleration, the centrifugal force acts stronger than the inertial force, or the centrifugal force exerts an inertial force, so that the center of gravity of the pressing member is increased. The pressing member rotates so that the arrow approaches the rotation axis in the radially outward direction of rotation. Therefore, the pressing member also comes into contact with the outer edge of the substrate and presses and biases it. Since the pressing force of the pressing member causes a frictional force between the pressing member and the outer edge of the substrate, the substrate is prevented from slipping. That is, the apparatus of the present invention has the effect of preventing the substrate from slipping, including the initial stage of rotational acceleration and the final stage of rotational deceleration.

【図面の簡単な説明】[Brief description of drawings]

【図1】この発明の実施例における基板保持装置の斜視
図である。
FIG. 1 is a perspective view of a substrate holding device according to an embodiment of the present invention.

【図2】この発明の実施例における回転式基板処理装置
の部分切断正面図である。
FIG. 2 is a partially cut front view of the rotary substrate processing apparatus according to the embodiment of the present invention.

【図3】この発明の実施例における基板保持装置の平面
図である。
FIG. 3 is a plan view of the substrate holding device according to the embodiment of the present invention.

【図4】この発明の実施例における基板保持装置の部分
断面正面図である。
FIG. 4 is a partial cross-sectional front view of the substrate holding device according to the embodiment of the present invention.

【図5】この発明の実施例における基板保持装置の模式
図である。
FIG. 5 is a schematic view of a substrate holding device according to an embodiment of the present invention.

【図6】この発明の実施例における動作原理を示すグラ
フである。
FIG. 6 is a graph showing the operating principle in the embodiment of the present invention.

【図7】この発明の変形例における基板保持装置の正面
図である。
FIG. 7 is a front view of a substrate holding device according to a modified example of the present invention.

【符号の説明】[Explanation of symbols]

1 回転台 2 基板保持部材 10 回転式基板処理装置 11 押さえ部材 12a 回動軸 100 基板保持装置 A 回転軸 G 重心 W 基板 Wa 基板外縁 Bd 回転方向後方 Rd 径方向外方 P1 方向(第1または第2の臨界角度に対応する方
向) P2 方向(第2または第1の臨界角度に対応する方
向)
DESCRIPTION OF SYMBOLS 1 rotary table 2 substrate holding member 10 rotary substrate processing apparatus 11 pressing member 12a rotation axis 100 substrate holding apparatus A rotation axis G center of gravity W substrate Wa substrate outer edge Bd rotation direction rear Rd radial direction outside P1 direction (first or first) 2 direction (corresponding to the critical angle) P2 direction (direction corresponding to the 2nd or 1st critical angle)

───────────────────────────────────────────────────── フロントページの続き (72)発明者 吉岡 勝司 京都市伏見区羽束師古川町322番地 大日 本スクリーン製造株式会社洛西工場内 (72)発明者 平岡 伸康 京都市伏見区羽束師古川町322番地 大日 本スクリーン製造株式会社洛西工場内 (72)発明者 武岡 正史 京都市伏見区羽束師古川町322番地 大日 本スクリーン製造株式会社洛西工場内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Katsuji Yoshioka, inventor Katsuji Yoshioka, 322 Hazushishi Furukawa-cho, Fushimi-ku, Kyoto Daini Nippon Screen Mfg. Co., Ltd. Rakusai factory Dainichi Main Screen Manufacturing Co., Ltd. Rakusai Factory (72) Inventor Masafumi Takeoka 322 Hazushishi Furukawacho, Fushimi-ku, Kyoto Dainichi Screen Manufacturing Co., Ltd. Rakusai Factory

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 鉛直軸周りで所定の回転方向に基板を水
平回転させつつ前記基板の主面に所定の処理を行うにあ
たって、前記基板を保持するために用いられる基板保持
装置であって、 (a) 水平回転台と、 (b) 前記水平回転台の上面側に設けられて前記基板を保
持する基板保持部材と、 (c) 前記水平回転台の外周側に軸支され、非鉛直面内で
双方向に回動自在であって、重心を回動軸上から偏位し
た位置に有する押さえ部材と、 を備え、 前記押さえ部材の重心の回動角度が所定の第1と第2の
臨界角度に至ったときにのみ前記押さえ部材の所定部位
が前記基板の外縁に当接し、 前記第1と第2の臨界角度は、前記水平回転台の回転中
心と前記軸支の位置とを結ぶ方向を基準として前記所定
の回転方向とは反対方向側にずれた範囲内で規定されて
いることを特徴とする基板保持装置。
1. A substrate holding device used for holding a substrate when performing a predetermined process on a main surface of the substrate while horizontally rotating the substrate in a predetermined rotation direction around a vertical axis, comprising: a) a horizontal rotary table; (b) a substrate holding member provided on the upper surface side of the horizontal rotary table to hold the substrate; (c) axially supported on the outer peripheral side of the horizontal rotary table in a non-vertical plane. And a pressing member having a center of gravity at a position deviated from an axis of rotation on the rotation axis, and the rotation angle of the center of gravity of the pressing member is a predetermined first and second critical value. Only when the angle is reached, the predetermined portion of the pressing member abuts the outer edge of the substrate, and the first and second critical angles are the directions connecting the rotation center of the horizontal rotary table and the position of the shaft support. Is specified within the range deviated to the side opposite to the predetermined rotation direction. A substrate holding device comprising:
JP24042893A 1993-08-31 1993-08-31 Substrate holder Pending JPH0774143A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP24042893A JPH0774143A (en) 1993-08-31 1993-08-31 Substrate holder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24042893A JPH0774143A (en) 1993-08-31 1993-08-31 Substrate holder

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JPH0774143A true JPH0774143A (en) 1995-03-17

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JP24042893A Pending JPH0774143A (en) 1993-08-31 1993-08-31 Substrate holder

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Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11289002A (en) * 1998-04-03 1999-10-19 Toshiba Microelectronics Corp Single wafer processing mechanism
CN100449408C (en) * 2004-09-06 2009-01-07 东京毅力科创株式会社 Substrate processing apparatus and substrate positioning device
WO2011001767A1 (en) * 2009-07-03 2011-01-06 国立大学法人東北大学 Wet treatment device and wet treatment method
CN103206973A (en) * 2012-01-11 2013-07-17 昆山允升吉光电科技有限公司 Electric control object stage
CN103203726A (en) * 2012-01-11 2013-07-17 昆山允升吉光电科技有限公司 Object stage with accurately-controlled position
CN103206975A (en) * 2012-01-11 2013-07-17 昆山允升吉光电科技有限公司 Electric control object stage
CN103206977A (en) * 2012-01-11 2013-07-17 昆山允升吉光电科技有限公司 Position electrically controllable object stage
CN103203725A (en) * 2012-01-11 2013-07-17 昆山允升吉光电科技有限公司 Object stage with accurately-controlled position
JP2017143298A (en) * 2017-04-21 2017-08-17 芝浦メカトロニクス株式会社 Substrate holding device

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11289002A (en) * 1998-04-03 1999-10-19 Toshiba Microelectronics Corp Single wafer processing mechanism
CN100449408C (en) * 2004-09-06 2009-01-07 东京毅力科创株式会社 Substrate processing apparatus and substrate positioning device
WO2011001767A1 (en) * 2009-07-03 2011-01-06 国立大学法人東北大学 Wet treatment device and wet treatment method
JP5544642B2 (en) * 2009-07-03 2014-07-09 国立大学法人東北大学 Wet treatment apparatus and wet treatment method
CN103206973A (en) * 2012-01-11 2013-07-17 昆山允升吉光电科技有限公司 Electric control object stage
CN103203726A (en) * 2012-01-11 2013-07-17 昆山允升吉光电科技有限公司 Object stage with accurately-controlled position
CN103206975A (en) * 2012-01-11 2013-07-17 昆山允升吉光电科技有限公司 Electric control object stage
CN103206977A (en) * 2012-01-11 2013-07-17 昆山允升吉光电科技有限公司 Position electrically controllable object stage
CN103203725A (en) * 2012-01-11 2013-07-17 昆山允升吉光电科技有限公司 Object stage with accurately-controlled position
CN103206973B (en) * 2012-01-11 2017-04-12 昆山允升吉光电科技有限公司 Electric control object stage
CN103206975B (en) * 2012-01-11 2017-06-06 昆山允升吉光电科技有限公司 Electric control object stage
JP2017143298A (en) * 2017-04-21 2017-08-17 芝浦メカトロニクス株式会社 Substrate holding device

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