CN114649233A - Wafer cleaning device and method for cleaning wafer - Google Patents

Wafer cleaning device and method for cleaning wafer Download PDF

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Publication number
CN114649233A
CN114649233A CN202110286304.9A CN202110286304A CN114649233A CN 114649233 A CN114649233 A CN 114649233A CN 202110286304 A CN202110286304 A CN 202110286304A CN 114649233 A CN114649233 A CN 114649233A
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CN
China
Prior art keywords
wafer
nozzle
cleaning solution
cleaning
spraying
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Pending
Application number
CN202110286304.9A
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Chinese (zh)
Inventor
吕庚陆
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Nanya Technology Corp
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Nanya Technology Corp
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Publication of CN114649233A publication Critical patent/CN114649233A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B08B3/022—Cleaning travelling work
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H01L21/0206—Cleaning during device manufacture during, before or after processing of insulating layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02082—Cleaning product to be cleaned
    • H01L21/02087—Cleaning of wafer edges
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02082—Cleaning product to be cleaned
    • H01L21/0209—Cleaning of wafer backside

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

The invention discloses a wafer cleaning device and a method for cleaning a wafer. The bearing table is used for bearing a wafer, and the top surface of the wafer is coated with photoresist. At least one nozzle is used to spray the cleaning solution toward the wafer. The chassis is used for recovering the cleaning solution. The lower shell is arranged on the chassis. The upper shell is arranged on the lower shell, the base plate, the lower shell and the upper shell surround and contain the bearing platform, the upper shell and the lower shell jointly form a liquid flow channel extending towards the bearing platform and the base plate, and the liquid flow channel is used for guiding the cleaning solution to flow to the base plate. Therefore, the wafer cleaning device can effectively spray the cleaning solution to the wafer and recover the cleaning solution.

Description

Wafer cleaning device and method for cleaning wafer
Technical Field
The present invention relates to a cleaning apparatus and a cleaning method, and more particularly to a cleaning apparatus and a cleaning method for cleaning a wafer.
Background
Photoresists have been widely used in today's integrated circuit processing. Photoresist is typically sprayed and shaped by a coating apparatus onto the surface of a silicon wafer as it is rotated.
During spin coating, the protective shield around the silicon wafer prevents sputtered photoresist from contaminating the surrounding environment. However, the protective cover prevents contamination and also easily causes pattern defects on the surface of the silicon wafer, which is more serious in the case of edge bead cleaning (Bevel ring).
Therefore, how to provide a wafer cleaning apparatus capable of solving the above problems is one of the problems in the industry that needs to be solved by research and development resources.
Disclosure of Invention
Accordingly, one objective of the present invention is to provide a wafer cleaning apparatus that can solve the above-mentioned problems.
In order to achieve the above objects, according to one embodiment of the present invention, a wafer cleaning apparatus includes a susceptor, at least one nozzle, a base plate, an upper housing, and a lower housing. The bearing table is used for bearing a wafer, and the top surface of the wafer is coated with photoresist. At least one nozzle is used to spray the cleaning solution toward the wafer. The chassis is used for recovering the cleaning solution. The lower shell is arranged on the chassis. The upper shell is arranged on the lower shell, the base plate, the lower shell and the upper shell surround and contain the bearing platform, the upper shell and the lower shell jointly form a liquid flow channel extending towards the bearing platform and the base plate, and the liquid flow channel is used for guiding the cleaning solution to flow to the base plate.
In one or more embodiments of the invention, the inner end of the upper housing extends above the bearing surface of the carrier, and the inner end of the lower housing extends below the carrier.
In one or more embodiments of the present invention, the at least one nozzle includes a first nozzle and a second nozzle. The first nozzle is arranged on the base plate and used for spraying cleaning solution towards the bottom surface of the wafer when the bearing platform drives the wafer to rotate. The second nozzle is arranged on the top surface of the lower shell and used for spraying cleaning solution towards the edge of the wafer when the bearing platform drives the wafer to rotate.
In one or more embodiments of the invention, the wafer cleaning apparatus includes a controller, and the controller is configured to control the first nozzle to spray the cleaning solution toward the bottom surface of the wafer and then to control the second nozzle to spray the cleaning solution toward the edge of the wafer.
In one or more embodiments of the present invention, the wafer cleaning apparatus includes a controller, and the controller is configured to control the first nozzle to spray the cleaning solution toward the bottom surface of the wafer after the second nozzle sprays the cleaning solution toward the edge of the wafer.
Another objective of the present invention is to provide a method for cleaning a wafer, which can solve the above problems.
In order to achieve the above object, according to an embodiment of the present invention, a method for cleaning a wafer is provided, which includes: providing a bearing platform, at least one nozzle, a chassis, a lower shell and an upper shell, wherein the lower shell is arranged on the chassis, the upper shell is arranged on the lower shell, the chassis, the lower shell and the upper shell surround and contain the bearing platform, the upper shell and the lower shell jointly form a liquid flow channel extending towards the bearing platform and the chassis, and the liquid flow channel is used for guiding a cleaning solution to flow to the chassis; adsorbing the wafer by using the bearing table, rotating the wafer by using the bearing table and coating a photoresist on the top surface of the wafer; spraying a cleaning solution toward the bottom surface and the edge of the wafer by using at least one nozzle; and recovering the cleaning solution using the chassis.
In one or more embodiments of the present invention, at least one nozzle includes a first nozzle and a second nozzle, and the at least one nozzle sprays the cleaning solution toward the bottom surface and the edge of the wafer, including: spraying a cleaning solution toward the bottom surface of the wafer using a first nozzle; and spraying a cleaning solution toward the wafer edge using a second nozzle.
In one or more embodiments of the present invention, after spraying the cleaning solution toward the bottom surface of the wafer using the first nozzle is completed, the cleaning solution is then sprayed toward the edge of the wafer using the second nozzle.
In one or more embodiments of the present invention, after spraying the cleaning solution toward the edge of the wafer using the second nozzle is finished, spraying the cleaning solution toward the bottom surface of the wafer using the first nozzle is then finished.
In one or more embodiments of the present invention, a first nozzle and a second nozzle are used to spray a cleaning solution toward the bottom surface and the edge of the wafer, respectively, at the same time.
In summary, the wafer cleaning apparatus of the present invention not only can effectively recover the cleaning solution, but also can prevent the cleaning solution from splashing back to the surface of the wafer due to the wafer rotating too fast when cleaning the wafer, so as to prevent the wafer edge and the bottom surface from being damaged when cleaning the wafer.
The foregoing is merely illustrative of the problems to be solved, solutions to problems, and effects produced by the present invention, and specific details thereof are set forth in the following description and the related drawings.
Drawings
To the accomplishment of the foregoing and related ends, the principles briefly described above are explained in greater detail with reference to embodiments, illustrated in the accompanying drawings. The drawings are only for purposes of illustrating the invention and are not to be construed as limiting the scope of the invention. The principles of the present invention will be clearly explained with reference to the accompanying drawings, in which:
FIG. 1 is a schematic perspective view of a portion of a wafer cleaning apparatus according to one or more embodiments of the invention;
FIG. 2 illustrates a schematic cross-sectional view of a wafer cleaning apparatus, according to one or more embodiments of the present disclosure; and
FIG. 3 is a diagram illustrating method steps for cleaning a wafer according to one or more embodiments of the invention.
Description of the main reference numerals:
100-a wafer cleaning device; 110-a carrier table; 110 a-a bearing surface; 120-a nozzle; 120 a-a first nozzle; 120 b-a second nozzle; 130-a chassis; 140-a lower housing; 140 a-an inner end; 150-an upper housing; 150 a-an inner end; 160-upper cover; 161-annular inner wall; 170-a controller; 200-method; 210,230,250,270-step; a P-flow channel; s1, S2-spraying direction; w-a wafer; w1-top surface; w2-bottom surface; w3-edge.
Detailed Description
In the following description, numerous implementation details are set forth in order to provide a thorough understanding of the present invention. It should be understood, however, that these implementation details are not to be interpreted as limiting the invention. That is, in some embodiments of the invention, such implementation details are not necessary. In addition, for the sake of simplicity, some conventional structures and elements are shown in the drawings in a simplified schematic manner.
Please refer to fig. 1 and fig. 2. Fig. 1 is a schematic perspective view of a portion of a wafer cleaning apparatus 100 according to one or more embodiments of the invention. Fig. 2 is a cross-sectional view of the wafer cleaning apparatus 100. In some embodiments of the present invention, the wafer cleaning apparatus 100 includes a rotatable susceptor 110, at least one nozzle 120, a base plate 130, an annular lower housing 140, and an annular upper housing 150. The susceptor 110 is used for supporting a wafer W, and a top surface W1 of the wafer W is coated with photoresist. The nozzle 120 is used for spraying a cleaning solution toward the wafer W on the susceptor 110. The chassis 130 is used for recycling the cleaning solution, the lower casing 140 is disposed on the chassis 130, and the upper casing 150 is disposed on the lower casing 140, wherein the chassis 130, the lower casing 140 and the upper casing 150 surround and accommodate the susceptor 110. The lower housing 140 and the upper housing 150 together form a flow path P extending toward the carrier platform 110 and the bottom plate 130, the flow path P tapering away from the carrier platform 110, wherein the flow path P is used to guide the cleaning solution to the bottom plate 130. In addition, the chassis 130 may be provided with a pipe or a device for recovering the cleaning solution, but the present invention is not limited thereto.
Specifically, the inner end 150a of the upper housing 150 extends above the carrying surface 110a of the stage 110, and the inner end 140a of the lower housing 140 extends below (e.g., directly below) the stage 110. Therefore, the carrier table 110 is located between the inner end 140a of the lower housing 140 and the inner end 150a of the upper housing 150, and the lower housing 140 and the upper housing 150 can simultaneously block and guide the photoresist solution or the cleaning solution sprayed by the rotation of the carrier table 110.
In one or more embodiments of the present invention, the wafer cleaning apparatus 100 further includes an annular upper cover 160, wherein the upper cover 160 is disposed on the upper housing 150 and surrounds the susceptor 110. Specifically, the upper cover 160 includes an annular inner wall 161, wherein the annular inner wall 161 surrounds and faces the susceptor 110, so that the upper cover 160 can effectively prevent the contaminants from being splashed out, but the invention is not limited thereto.
In one or more embodiments of the present invention, the at least one nozzle 120 includes a first nozzle 120a and a second nozzle 120 b. The first nozzle 120a is disposed on the base plate 130, and when the wafer W is driven by the susceptor 110 to rotate, the first nozzle 120a selectively sprays the cleaning solution toward the bottom surface W2 of the wafer W. For example, referring to the spraying direction S1, the first nozzle 120a sprays the cleaning solution toward the bottom surface W2 of the wafer W through a hollow channel formed by the cylindrical structure 131 of the base plate 130 and the inner end 140a of the lower housing 140. The second nozzle 120b is disposed on the top surface of the lower housing 140 and is positioned in the flow channel P to be aligned with the wafer edge W3 of the wafer W. Referring to the spraying direction S2, when the susceptor 110 rotates the wafer W, the second nozzle 120b selectively sprays the cleaning solution toward the edge W3 of the wafer W. Therefore, the pollutants and/or impurities on the bottom surface W2 and the edge W3 of the wafer W can be effectively removed. Specifically, the rotation speed of the susceptor 110 for rotating the wafer W is between 600RPM and 1500 RPM. Preferably, the rotation speed of the wafer W is between 600RPM and 1200RPM, but the invention is not limited thereto.
In some embodiments of the invention, the wafer cleaning apparatus 100 includes a controller 170, the controller 170 is connected to the first nozzle 120a and the second nozzle 120b, and the controller 170 is configured to control the first nozzle 120a to spray the cleaning solution toward the bottom surface W2 of the wafer W, and then the second nozzle 120b to spray the cleaning solution toward the edge W3 of the wafer W. Specifically, the first nozzle 120a sprays the cleaning solution to the bottom surface W2 of the rotating wafer W for 5 to 20 seconds and stops, and then the second nozzle 120b sprays the cleaning solution to the edge W3 of the rotating wafer W for 5 to 20 seconds to completely clean the bottom surface W2 and the edge W3 of the wafer W, but the invention is not limited thereto. The controller 170 is a computing device with computing function, which can be a central processing unit or a microprocessor and loaded with suitable software or firmware to control the first nozzle 120a, the second nozzle 120b or other hardware.
In other embodiments of the present invention, after the controller 170 controls the second nozzle 120b to spray the cleaning solution toward the edge W3 of the wafer W, the first nozzle 120a is then caused to spray the cleaning solution toward the bottom W2 of the wafer W. Specifically, after the second nozzle 120b first sprays the cleaning solution onto the wafer edge W3 of the rotating wafer W for 5 to 20 seconds and stops, the first nozzle 120a then sprays the cleaning solution onto the bottom surface W2 of the rotating wafer W for 5 to 20 seconds, so as to completely clean the bottom surface W2 and the wafer edge W3 of the wafer W. Since the first nozzle 120a and the second nozzle 120b do not spray the cleaning solution onto the wafer W on the susceptor 110 at the same time, the defect on the surface of the wafer W caused by the back-splash of the cleaning solution can be avoided, but the invention is not limited thereto.
In other embodiments of the present invention, the controller 170 controls the first nozzle 120a and the second nozzle 120b to spray the cleaning solution toward the bottom surface W2 and the edge W3 of the wafer W, respectively. Specifically, the first nozzle 120a and the second nozzle 120b spray the cleaning solution on the bottom surface W2 and the edge W3 of the wafer W for 5 seconds to 20 seconds, thereby effectively cleaning the bottom surface W2 and the edge W3 of the wafer W, but the invention is not limited thereto.
In some embodiments of the present invention, the controller 170 controls the first nozzle 120a to spray the cleaning solution toward the bottom surface W2 of the wafer W, and when the first nozzle 120a sprays the cleaning solution for a predetermined time, the controller 170 controls the second nozzle 120b to spray the cleaning solution toward the edge W3 of the wafer W. Assuming that the controller 170 controls the first nozzle 120a to spray the cleaning solution toward the bottom surface W2 of the wafer W for a total of 20 seconds, it may be preset that the controller 170 controls the second nozzle 120b to subsequently spray the cleaning solution toward the wafer edge W3 of the wafer W for 20 seconds while the first nozzle 120a sprays the cleaning solution toward the wafer W for 15 seconds. Accordingly, the controller 170 controls the first nozzle 120a and the second nozzle 120b to effectively clean the bottom surface W2 and the edge W3 of the wafer W, but the invention is not limited thereto.
In other embodiments of the present invention, the controller 170 controls the second nozzle 120b to spray the cleaning solution toward the edge W3 of the wafer W, and when the second nozzle 120b sprays the cleaning solution for a predetermined time, the controller 170 controls the first nozzle 120a to spray the cleaning solution toward the bottom W2 of the wafer W. Assuming that the controller 170 controls the second nozzle 120b to spray the cleaning solution toward the edge W3 of the wafer W for 20 seconds, it may be preset that when the second nozzle 120b sprays the cleaning solution toward the wafer W for 15 seconds, the controller 170 controls the first nozzle 120a to also spray the cleaning solution toward the bottom surface W2 of the wafer W. Thereby, the controller 170 controls the first nozzle 120a and the second nozzle 120b to effectively clean the bottom surface W2 and the edge W3 of the wafer W.
Referring to fig. 1-3, fig. 3 is a process diagram illustrating a method 200 for cleaning a wafer W using the wafer cleaning apparatus 100 according to one or more embodiments of the present invention. In some embodiments of the present invention, the method 200 starts at step 210, where step 210 is: providing a carrier platform 110, at least one nozzle 120, a base plate 130, a lower housing 140 and an upper housing 150, wherein the lower housing 140 is disposed on the base plate 130, the upper housing 150 is disposed on the lower housing 140, the base plate 130, the lower housing 140 and the upper housing 150 surround and accommodate the carrier platform 110, and the upper housing 150 and the lower housing 140 together form a liquid flow channel P extending toward the carrier platform 110 and the base plate 130. The method 200 then proceeds to step 230, where step 230 is: the wafer W is placed on the susceptor 110, and the susceptor 110 is rotated to coat the photoresist on the top surface W1 of the wafer W. The method 200 then proceeds to step 250, where step 250 is: the at least one nozzle 120 sprays the cleaning solution toward the bottom surface W2 and the edge W3 of the wafer W. The method 200 then proceeds to step 270, where step 270 is: the chassis 130 recovers the cleaning solution.
In step 210, details regarding the susceptor 110, the at least one nozzle 120, the base plate 130, the lower housing 140 and the upper housing 150 are already described in the previous paragraphs, and thus are not repeated herein.
In step 230, the susceptor 110 rotates the wafer W coated with photoresist, so as to uniformly coat the photoresist on the top surface W1 of the wafer W by centrifugal force, thereby obtaining a photoresist film with uniform thickness, thereby completing the process of spin coating the photoresist.
In step 250, the at least one nozzle 120 includes a first nozzle 120a and a second nozzle 120b, and step 250 further includes: the controller 170 controls the first nozzle 120a to spray the cleaning solution toward the bottom surface W2 of the wafer W; and the controller 170 controls the second nozzle 120b to spray the cleaning solution toward the wafer edge W3 of the wafer W. In some embodiments, after the controller 170 controls the first nozzle 120a to spray the cleaning solution toward the bottom surface W2 of the wafer W, the controller 170 controls the second nozzle 120b to spray the cleaning solution toward the wafer edge W3 of the wafer W. In other embodiments, after the controller 170 controls the second nozzle 120b to spray the cleaning solution toward the edge W3 of the wafer W, the controller 170 controls the first nozzle 120a to spray the cleaning solution toward the bottom W2 of the wafer W. In some embodiments of the present invention, the controller 170 controls the first nozzle 120a and the second nozzle 120b to spray the cleaning solution toward the bottom surface W2 and the edge W3 of the wafer W at the same time. The invention is not limited thereto.
In summary, the wafer cleaning apparatus of the present invention not only can effectively recover the cleaning solution, but also can prevent the cleaning solution from splashing back to the surface of the wafer due to the wafer rotating too fast when cleaning the wafer, so as to prevent the wafer edge and the bottom surface from being damaged when cleaning the wafer.
While various embodiments of the present invention have been described above, it should be understood that they have been presented by way of example only, and not limitation. Many modifications may be made to the embodiments of the invention in light of the disclosure herein without departing from the spirit and scope of the invention. Thus, the breadth and scope of the present invention should not be limited by any of the above-described exemplary embodiments.

Claims (10)

1. A wafer cleaning apparatus, comprising:
the bearing table is used for bearing a wafer, and the top surface of the wafer is coated with photoresist;
at least one nozzle for spraying a cleaning solution toward the wafer;
a chassis for recovering the cleaning solution;
the lower shell is arranged on the chassis; and
the upper shell is arranged on the lower shell, the base plate, the lower shell and the upper shell surround and contain the bearing platform, a liquid flow channel extending towards the bearing platform and the base plate is formed by the upper shell and the lower shell together, and the liquid flow channel is used for guiding cleaning solution to flow to the base plate.
2. The wafer cleaning apparatus as claimed in claim 1, wherein the inner end of the upper housing extends above the carrying surface of the susceptor and the inner end of the lower housing extends below the susceptor.
3. The wafer cleaning apparatus of claim 1, wherein the at least one nozzle comprises:
the first nozzle is arranged on the base plate and used for selectively spraying cleaning solution towards the bottom surface of the wafer when the bearing platform drives the wafer to rotate; and
and the second nozzle is arranged on the top surface of the lower shell and used for selectively spraying a cleaning solution towards the edge of the wafer when the bearing platform drives the wafer to rotate.
4. The wafer cleaning apparatus as claimed in claim 3, further comprising a controller for spraying the cleaning solution toward the edge of the wafer by the second nozzle after the spraying of the cleaning solution toward the bottom surface of the wafer by the first nozzle is finished.
5. The apparatus of claim 3, further comprising a controller configured to spray the cleaning solution toward the bottom surface of the wafer from the first nozzle after spraying the cleaning solution toward the edge of the wafer from the second nozzle is completed.
6. A method for cleaning a wafer, comprising:
providing a bearing platform, at least one nozzle, a chassis, a lower shell and an upper shell, wherein the lower shell is arranged on the chassis, the upper shell is arranged on the lower shell, the chassis, the lower shell and the upper shell surround and contain the bearing platform, the upper shell and the lower shell jointly form a liquid flow channel extending towards the bearing platform and the chassis, and the liquid flow channel is used for guiding a cleaning solution to flow to the chassis;
adsorbing the wafer by using the bearing table, rotating the bearing table to the wafer and coating a photoresist on the top surface of the wafer;
spraying a cleaning solution towards the bottom surface and the edge of the wafer by using the at least one nozzle; and
the chassis is used to recover the cleaning solution.
7. The method of claim 6, wherein the at least one nozzle comprises a first nozzle and a second nozzle, and the at least one nozzle sprays the cleaning solution toward the bottom surface and the edge of the wafer, comprising:
spraying a cleaning solution toward the bottom surface of the wafer using the first nozzle; and
spraying a cleaning solution toward the edge of the wafer using the second nozzle.
8. The method of claim 7, wherein after spraying the cleaning solution toward the bottom surface of the wafer using the first nozzle is completed, spraying the cleaning solution toward the edge of the wafer using the second nozzle is followed.
9. The method of claim 7, wherein spraying a cleaning solution toward the edge of the wafer using the second nozzle is terminated, and then spraying a cleaning solution toward the bottom surface of the wafer using the first nozzle is terminated.
10. The method of claim 7, wherein the first nozzle and the second nozzle are used to spray cleaning solution toward the bottom surface and the edge of the wafer, respectively, at the same time.
CN202110286304.9A 2020-12-18 2021-03-17 Wafer cleaning device and method for cleaning wafer Pending CN114649233A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW109145147A TWI770727B (en) 2020-12-18 2020-12-18 Wafer rinsing device and method for rinsing wafer
TW109145147 2020-12-18

Publications (1)

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CN114649233A true CN114649233A (en) 2022-06-21

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117153739A (en) * 2023-10-31 2023-12-01 沈阳芯达科技有限公司 Wafer cleaning device

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Publication number Priority date Publication date Assignee Title
TWI826286B (en) * 2023-03-10 2023-12-11 弘塑科技股份有限公司 Anti-splash fluid supplying device and single-wafer processing apparatus

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Publication number Priority date Publication date Assignee Title
JP3573504B2 (en) * 1994-11-04 2004-10-06 株式会社ルネサステクノロジ Method for manufacturing semiconductor device
JPH08261648A (en) * 1995-03-28 1996-10-11 Hitachi Ltd Drying apparatus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117153739A (en) * 2023-10-31 2023-12-01 沈阳芯达科技有限公司 Wafer cleaning device
CN117153739B (en) * 2023-10-31 2024-01-30 沈阳芯达科技有限公司 Wafer cleaning device

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TW202224795A (en) 2022-07-01

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