JP2007207807A - Testpiece positioning device - Google Patents

Testpiece positioning device Download PDF

Info

Publication number
JP2007207807A
JP2007207807A JP2006021875A JP2006021875A JP2007207807A JP 2007207807 A JP2007207807 A JP 2007207807A JP 2006021875 A JP2006021875 A JP 2006021875A JP 2006021875 A JP2006021875 A JP 2006021875A JP 2007207807 A JP2007207807 A JP 2007207807A
Authority
JP
Japan
Prior art keywords
sample
positioning
testpiece
pin
positioning device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006021875A
Other languages
Japanese (ja)
Inventor
Satoshi Hirokawa
智 廣川
Shogo Kosuge
正吾 小菅
Tetsuaki Fukamachi
哲昭 深町
Shigenobu Otsuka
重信 大塚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Kokusai Electric Inc
Original Assignee
Hitachi Kokusai Electric Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Kokusai Electric Inc filed Critical Hitachi Kokusai Electric Inc
Priority to JP2006021875A priority Critical patent/JP2007207807A/en
Publication of JP2007207807A publication Critical patent/JP2007207807A/en
Pending legal-status Critical Current

Links

Images

Abstract

<P>PROBLEM TO BE SOLVED: To keep accuracy of testpiece positioning in a positioning device by using an elevation pin having reduced sliding resistance even if the testpiece becomes large in size. <P>SOLUTION: In a testpiece positioning method and a device, the tip of an elevation pin 2 is made like a ball so as to reduce siding resistance. Thus, the positioning device is applicable to a large-sized testpiece, and the accuracy of testpiece positioning can be improved. Furthermore, a position control unit is obliquely arranged and a clamp pin 4 is elevated, thereby avoiding interference caused by contact with an objective lens. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、線幅等を測定する検査装置に関する。特に、アクチュエータ等の位置制御ユニットによって摺動抵抗の小さい試料を位置決めする技術に関する。   The present invention relates to an inspection apparatus that measures line width and the like. In particular, the present invention relates to a technique for positioning a sample having a small sliding resistance by a position control unit such as an actuator.

被検査対象物を試料として、試料台上にエアー吹き出し穴を設け、試料台と試料の間にエアーを吹き込み試料が十分浮上させる。各辺にアクチュエータを(両長手方向に例えば各2箇所、両短手方向に例えば各1箇所〜各2箇所)配置し、アクチュエータによって試料を押し当て位置決めを行う(例えば、特許文献1参照。)。
特開2004−186681号公報段落 0002 〜 0016 、及び図3〜図5
Using the object to be inspected as a sample, an air blowing hole is provided on the sample table, and air is blown between the sample table and the sample to sufficiently float the sample. Actuators are placed on each side (for example, two locations in both longitudinal directions, for example, one location to two locations in both lateral directions), and a sample is pressed and positioned by the actuator (see, for example, Patent Document 1). .
JP 2004-186681 A paragraphs 0002 to 0016 and FIGS.

本発明は、試料が大きくなったことから試料台からのエアー吹き出しでは、十分試料が浮上しない。そのため試料と試料台の摺動抵抗が大きくなり、アクチュエータが十分機能せず、必要な位置決め精度を確保できなかった。
本発明の目的は、上記のような問題を解決し、試料が大きくなっても、試料位置決め精度が確保できる位置決め装置を提供することにある。
In the present invention, since the sample becomes large, the sample does not sufficiently float by air blowing from the sample stage. As a result, the sliding resistance between the sample and the sample stage increased, the actuator did not function sufficiently, and the required positioning accuracy could not be ensured.
An object of the present invention is to solve the above-described problems and provide a positioning device that can ensure sample positioning accuracy even when the sample becomes large.

上記の目的を達成するために、本発明の試料位置決め方法及び装置は、昇降ピンの先端をボール形状にすることにより、摺動抵抗を小さくした。それに伴い、大型試料にも対応し、試料位置決め精度の向上を図ることができた。また、位置制御ユニットを斜めに配置し、クランプピンを昇降させ対物レンズとの接触による干渉を回避した。   In order to achieve the above object, in the sample positioning method and apparatus of the present invention, the tip of the elevating pin is formed into a ball shape to reduce the sliding resistance. Along with this, it was possible to cope with large samples and improve sample positioning accuracy. In addition, the position control unit was arranged obliquely, and the clamp pin was raised and lowered to avoid interference due to contact with the objective lens.

即ち、本発明の位置決め装置は、搬入される試料を載置する試料台であって、試料を試料台の所定の位置に位置決めする位置決め手段とを有し、位置決め手段は、試料を位置決めするまでの間に、試料の摺動抵抗を小さくするための接触面が球面状の昇降ピンを備えたことを特徴とする。
また、本発明の試料位置決め装置の位置決め手段は、試料の設置方向に対して所定の角度を有することを特徴とする。
That is, the positioning device of the present invention is a sample stage on which a sample to be carried is placed, and has positioning means for positioning the sample at a predetermined position on the sample stage, and the positioning means until the sample is positioned. In the meantime, the contact surface for reducing the sliding resistance of the sample is provided with a spherical lifting pin.
Further, the positioning means of the sample positioning device of the present invention is characterized by having a predetermined angle with respect to the sample installation direction.

本発明によれば、摺動抵抗を小さくした昇降ピンを用いることにより、大型試料でも摺動抵抗が小さくでき、比較的小さな浮力であっても、試料を容易に位置決め可能となった。 また、位置制御ユニットを斜めに配置し、クランプピンを昇降させ対物レンズとの干渉を回避した。   According to the present invention, by using the elevating pins having a reduced sliding resistance, the sliding resistance can be reduced even with a large sample, and the sample can be easily positioned even with a relatively small buoyancy. In addition, the position control unit was arranged obliquely, and the clamp pin was moved up and down to avoid interference with the objective lens.

本発明の一実施形態を、図1と図2の測定装置によって説明する。図1は、LCD 線幅測定装置を上方から見た場合の図である。また図2は、図1の LCD 線幅測定装置を横方向(図1矢印Aの方向)から見た図である。
図1と図2において、試料 1 が試料台 3 に位置決めされるまでの測定装置での位置決めの手順を説明する。
One embodiment of the present invention will be described with reference to the measuring apparatus of FIGS. FIG. 1 is a view of the LCD line width measuring device as viewed from above. FIG. 2 is a diagram of the LCD line width measuring apparatus of FIG. 1 viewed from the lateral direction (the direction of arrow A in FIG. 1).
In FIG. 1 and FIG. 2, the positioning procedure in the measuring apparatus until the sample 1 is positioned on the sample stage 3 will be described.

まず、図示しない搬送ロボットが試料 1 を昇降ピン 2 上に搬入することによって試料 1 が試料台 3 に搭載される。このとき、昇降ピン 2 の先端は、ボール状になっている。このため試料 1 と昇降ピン 2 との間に発生する摺動抵抗は、昇降ピン 2 の先端が平坦であったときよりも小さくなる。
次に、昇降ピン 2 が、試料台 3 の直上まで降下してから停止する。
その後、位置制御ユニット上に配置したクランプピン 4 が可動し、試料 1 の端面を押し付け、位置決めを行う。位置制御ユニットは、例えば、エアシリンダ、モータ等のアクチュエータである。
位置決め終了後、昇降ピン 2 は、試料台 3 の下部まで移動したあと、クランプピン 4 が元の位置に戻る(押し付けを終了する)。ここで、クランプピン 4 は、各辺にアクチュエータを(両長手方向に例えば各2箇所、両短手方向に例えば各1箇所〜各2箇所)あり、両長手方向及び両短手方向のそれぞれ一辺が基準面で他辺が押し付ける面となっている。
First, the sample 1 is mounted on the sample table 3 by carrying the sample 1 onto the lifting pins 2 by a transfer robot (not shown). At this time, the tip of the lifting pin 2 has a ball shape. Therefore, the sliding resistance generated between the sample 1 and the lifting pin 2 is smaller than when the tip of the lifting pin 2 is flat.
Next, the elevating pin 2 descends to just above the sample table 3 and then stops.
After that, the clamp pin 4 placed on the position control unit moves and presses the end face of the sample 1 for positioning. The position control unit is, for example, an actuator such as an air cylinder or a motor.
After the positioning is completed, the lift pin 2 moves to the lower part of the sample stage 3, and then the clamp pin 4 returns to the original position (the pressing is finished). Here, the clamp pin 4 has an actuator on each side (for example, two locations in both longitudinal directions, for example, one location to two locations in both lateral directions), and one side in both the longitudinal direction and both lateral directions. Is the reference surface and the other side is the surface to be pressed.

試料 1 が試料台 3 の直上に停止したときの詳細を図2に示す。
試料台 3 の直上に試料 1 が停止したとき、試料 1 と試料台 3 の距離が近いと、試料 1 の「たわみ」によって試料 1 と試料台 3 とが接触する。このため、摺動抵抗が大きくなり、試料位置決め精度が悪くなる。
The details when sample 1 stops right above sample table 3 are shown in FIG.
When sample 1 stops immediately above sample table 3 and sample 1 and sample table 3 are close to each other, sample 1 will come into contact with sample table 3 due to the “deflection” of sample 1. For this reason, sliding resistance becomes large and sample positioning accuracy deteriorates.

この問題は、試料 1 と試料台 3 との距離を長くすることにより解決できるが、クランプピン 4 の位置を高くする必要性がある。クランプピン 4 の位置を高くした場合には、測定時に、撮像装置の一部である対物レンズ 5 と試料 1 とが接触する。この対物レンズ 5 と試料 1 との接触を避けるため、位置制御ユニットを傾斜させ、位置決め時はクランプピン 4 を上昇させ、それ以外のとき(例えば、測定時)には、クランプピン 4 が位置決め時より下がった位置に停止するようにした。試料位置決め時には、対物レンズ 5 が退避位置に留まっているため、クランプピン 4 と対物レンズ 5 とは接触しない。   This problem can be solved by increasing the distance between the sample 1 and the sample stage 3, but it is necessary to increase the position of the clamp pin 4. When the position of the clamp pin 4 is increased, the objective lens 5 that is a part of the imaging device and the sample 1 are in contact with each other during measurement. To avoid contact between the objective lens 5 and the sample 1, the position control unit is tilted, the clamp pin 4 is raised during positioning, and the clamp pin 4 is positioned during other times (for example, during measurement). Stopped at a lower position. At the time of sample positioning, the objective lens 5 remains in the retracted position, so that the clamp pin 4 and the objective lens 5 do not contact each other.

以上述べたように、上記実施例では、昇降ピン 2 の先端をボール形状にすることにより、摺動抵抗を小さくした。それに伴い、大型試料にも対応し、試料位置決め精度の向上を図ることができる。
更に、位置制御ユニットを斜めに配置し、クランプピン 4 を昇降させ、対物レンズ 5 と接触しない構成とした。
As described above, in the above embodiment, the sliding resistance is reduced by making the tip of the elevating pin 2 into a ball shape. Accordingly, it is possible to cope with a large sample and improve the sample positioning accuracy.
Further, the position control unit is arranged obliquely, and the clamp pin 4 is lifted and lowered so as not to contact the objective lens 5.

次に、本発明の昇降ピン 2 の一実施例を図3によって説明する。
図3は、昇降ピンの一実施例の断面を示す図である。図3において、昇降ピンの下部分 52 は省略し、試料 1 と接触する頭部を中心に描いている。頭部には、ボールベアリング部 51 があり、球状の面が試料 1 と接触し、かつ、試料 1 のクランプ時に試料 1 の移動に合せてボール部分が回転し、摺動抵抗が少なくなるようにしている。
なお、この実施例のほか、昇降ピンを、その内部に微小な上下動が可能なスプリングを設けたスプリングピンを用いて試料 1 との接触の圧力が高い場合に、スプリングによって昇降ピンの頭部の高さが少し下がることによって摺動抵抗を少なくするようにしても良い。
Next, an embodiment of the lifting pin 2 according to the present invention will be described with reference to FIG.
FIG. 3 is a view showing a cross section of one embodiment of the lifting pins. In FIG. 3, the lower portion 52 of the lifting pin is omitted, and the head that contacts the sample 1 is drawn. There is a ball bearing part 51 on the head, the spherical surface is in contact with the sample 1, and the ball part rotates with the movement of the sample 1 when the sample 1 is clamped so that the sliding resistance is reduced. ing.
In addition to this embodiment, when the pressure of contact with the sample 1 is high by using a spring pin provided with a spring that can move up and down slightly, the head of the lift pin is moved by the spring. The sliding resistance may be reduced by slightly lowering the height.

また、本発明の一実施例を説明する図2において、試料 1 が波打っているように描いているが、これは、試料 1 がその大きさに比べ十分薄いガラス基板である場合の例をやや大げさに描いているものである。
更に、図2において、クランプピン 4 は、水平に設置された試料台 3 に対して斜めの角度(例えば、10°(≒17.4 rd ))を持って設置している。そして、クランプピン 4 を移動させ試料 1 を押し付けるためのクランプローラの移動方向もまた、同じ角度を有している。ただし、クランプローラ(クランプピン 4 )と試料 1 との接触面は、水平面に対して垂直になるように、クランプピン 4 の端面に角度を持たせている。
また、クランプピン 4 の端面は、位置決めが終わると試料 1 から、例えば 25 mm離すようにする。このストロークは、試料 1 の基板寸法が大きくなればその搬入誤差も大きくなるため、基板寸法の大きさに対応して大きくする。
In FIG. 2 for explaining an embodiment of the present invention, the sample 1 is drawn as a wave, but this is an example in which the sample 1 is a sufficiently thin glass substrate compared to its size. It is a little exaggerated.
Further, in FIG. 2, the clamp pin 4 is installed with an oblique angle (for example, 10 ° (≈17.4 rd)) with respect to the horizontally placed sample table 3. The moving direction of the clamp roller for moving the clamp pin 4 and pressing the sample 1 also has the same angle. However, the contact surface between the clamp roller (clamp pin 4) and the sample 1 has an angle on the end surface of the clamp pin 4 so that it is perpendicular to the horizontal plane.
Also, the end face of the clamp pin 4 should be separated from the sample 1 by 25 mm, for example, after positioning. This stroke is increased corresponding to the size of the substrate because the loading error increases as the substrate size of Sample 1 increases.

本発明の一実施例の LCD 線幅測定装置を上方から見た場合の図。The figure at the time of seeing the LCD line | wire width measuring apparatus of one Example of this invention from upper direction. 本発明の一実施例の LCD 線幅測定装置を横方向から見た図。The figure which looked at the LCD line | wire width measuring apparatus of one Example of this invention from the horizontal direction. 本発明の一実施例の昇降ピンを説明するための図。The figure for demonstrating the raising / lowering pin of one Example of this invention.

符号の説明Explanation of symbols

1:試料、 2:昇降ピン、 3:試料台、 4:クランプピン、 51:ボールベアリング部、 52:昇降ピンの下部分。   1: Sample, 2: Lifting pin, 3: Sample stage, 4: Clamp pin, 51: Ball bearing part, 52: Lower part of lifting pin.

Claims (2)

搬入される試料を載置する試料台であって、上記試料を上記試料台の所定の位置に位置決めする位置決め手段とを有し、上記位置決め手段は、上記試料を位置決めするまでの間に、上記試料の摺動抵抗を小さくするための接触面が球面状の昇降ピンを備えたことを特徴とする試料位置決め装置。 A sample stage on which a sample to be carried is placed, the positioning unit positioning the sample at a predetermined position of the sample stage, and the positioning unit is configured to position the sample until the sample is positioned. A sample positioning device comprising a lifting pin having a spherical contact surface for reducing the sliding resistance of the sample. 請求項1記載の試料位置決め装置において、上記位置決め手段は、上記試料の設置方向に対して所定の角度を有することを特徴とする試料位置決め装置。 2. The sample positioning device according to claim 1, wherein the positioning means has a predetermined angle with respect to the installation direction of the sample.
JP2006021875A 2006-01-31 2006-01-31 Testpiece positioning device Pending JP2007207807A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006021875A JP2007207807A (en) 2006-01-31 2006-01-31 Testpiece positioning device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006021875A JP2007207807A (en) 2006-01-31 2006-01-31 Testpiece positioning device

Publications (1)

Publication Number Publication Date
JP2007207807A true JP2007207807A (en) 2007-08-16

Family

ID=38487037

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006021875A Pending JP2007207807A (en) 2006-01-31 2006-01-31 Testpiece positioning device

Country Status (1)

Country Link
JP (1) JP2007207807A (en)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003171146A (en) * 2001-12-04 2003-06-17 Toppan Printing Co Ltd Glass substrate positioning apparatus
JP2003270155A (en) * 2002-03-15 2003-09-25 Olympus Optical Co Ltd Substrate holding device and inspection device
JP2004026365A (en) * 2002-06-24 2004-01-29 Dainippon Printing Co Ltd Working platform
JP2004165643A (en) * 2002-10-25 2004-06-10 Tokyo Electron Ltd Substrate alignment apparatus, substrate processing apparatus, and substrate transfer apparatus
JP2004179513A (en) * 2002-11-28 2004-06-24 Tokyo Electron Ltd Substrate holding apparatus and substrate treatment apparatus
JP2004186681A (en) * 2002-11-21 2004-07-02 Hitachi Kokusai Electric Inc Substrate-positioning method and inspecting apparatus using the method
WO2005117097A1 (en) * 2004-05-28 2005-12-08 Oc Oerlikon Balzers Ag Lift pin with roller glide for reducing friction
JP2006073931A (en) * 2004-09-06 2006-03-16 Tokyo Electron Ltd Substrate processing equipment and substrate positioning device

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003171146A (en) * 2001-12-04 2003-06-17 Toppan Printing Co Ltd Glass substrate positioning apparatus
JP2003270155A (en) * 2002-03-15 2003-09-25 Olympus Optical Co Ltd Substrate holding device and inspection device
JP2004026365A (en) * 2002-06-24 2004-01-29 Dainippon Printing Co Ltd Working platform
JP2004165643A (en) * 2002-10-25 2004-06-10 Tokyo Electron Ltd Substrate alignment apparatus, substrate processing apparatus, and substrate transfer apparatus
JP2004186681A (en) * 2002-11-21 2004-07-02 Hitachi Kokusai Electric Inc Substrate-positioning method and inspecting apparatus using the method
JP2004179513A (en) * 2002-11-28 2004-06-24 Tokyo Electron Ltd Substrate holding apparatus and substrate treatment apparatus
WO2005117097A1 (en) * 2004-05-28 2005-12-08 Oc Oerlikon Balzers Ag Lift pin with roller glide for reducing friction
JP2006073931A (en) * 2004-09-06 2006-03-16 Tokyo Electron Ltd Substrate processing equipment and substrate positioning device

Similar Documents

Publication Publication Date Title
KR102044085B1 (en) Board holding method, board holding device, processing method and processing apparatus
KR102229364B1 (en) Test apparatus of display apparatus and testing method using the same
KR101144593B1 (en) Wafer Prober for Semiconductor Inspection and Inspection Method
TWI416095B (en) Substrate inspection apparatus
TW200906695A (en) Substrate adsorption device, substrate transportation device and external inspection equipment
TWI595594B (en) Substrate holding device, coating device, substrate holding method
KR20130105397A (en) Probe apparatus and providing method for probe card of probe apparatus
JP2009168860A (en) Stage device for substrate
JP2012094770A (en) Inspection device and substrate positioning method
JP5005945B2 (en) Board inspection equipment
JP2003344294A5 (en)
JP2007207807A (en) Testpiece positioning device
KR20130011263A (en) Bending apparatus for display panel device
JP2012023104A (en) Substrate-setting device
JP2018069536A (en) Scribe device and scribe method
JP4965273B2 (en) Mounting device
JP4704756B2 (en) Substrate transfer device
CN103386823B (en) Patterning device
TWI751344B (en) Probe device and needle trace transcription method
JP4552441B2 (en) Liquid crystal panel component mounting equipment
JP2006023139A (en) Liquid crystal panel inspection device
JP2006066747A (en) Positioning apparatus and method of substrate
JP2010066242A (en) Substrate inspection device and substrate inspection method
US11940482B2 (en) Inspection device
JP2016020821A (en) Flattening correction mechanism for inspected circuit board in circuit board inspection device

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20080925

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20100630

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20100706

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20100901

RD02 Notification of acceptance of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7422

Effective date: 20100901

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20110301

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20110705