JP2004165643A - Substrate alignment apparatus, substrate processing apparatus, and substrate transfer apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To safely, accurately, and efficiently perform alignment of a substrate, without causing flaws or scratches or generating particles on the substrate to be processed. <P>SOLUTION: By ejecting a high-pressure gas, for example air (may be also nitrogen gas or the like), supplied from a high-pressure gas supply source, from a gas-ejecting part 116 via a gas supply pipe 118 and a vent line 114a inside a cylindrical support 114 at a prescribed pressure, namely a pressure that cancels the gravity of the substrate G or a pressure which exceeds the same, when the substrate G is loaded on a stage 100, the substrate G substantially floats from support pins 108. Since the gas-ejecting part 116 is formed into a horn shape, air which hits the lower face of the substrate G smoothly passes to the outside through a gap g without producing vortices. <P>COPYRIGHT: (C)2004,JPO

Description

  The present invention relates to a substrate alignment device, a substrate processing device, and a substrate transfer device used in a manufacturing process of a liquid crystal display (LCD) or the like, and particularly to a technique for mechanically aligning a substrate to be processed.

2. Description of the Related Art Conventionally, in order to position a substrate to be processed (glass substrate) in a XY direction on a stage before or during processing in a manufacturing process of an LCD, a plurality of substrates provided at predetermined intervals on the stage. A mechanical alignment mechanism is used in which a support pin is used to support a substrate substantially horizontally, and a corner of the substrate or a side surface of each side is pressed in a predetermined direction with an appropriate jig for positioning. Reference 1 and Patent Document 2). When the substrate is fixedly held at the set position on the stage, a plurality of vacuum suction pads are provided at predetermined intervals on the stage, and each pad is placed immediately after the substrate is placed on the pad at the set position. Is connected to a vacuum source so that the substrate is vacuum-sucked (for example, see Patent Document 3).
JP 2001-44118 A (page 6, FIG. 2) JP-A-6-143177 (page 3, FIG. 5, FIG. 6) JP-A-10-106945 (page 5, FIG. 4)

  The conventional mechanical alignment mechanism as described above can perform alignment without trouble when the substrate is small. However, recently, the size of substrates has been considerably increased, for example, to 850 × 1000 mm, 1000 × 1200 mm, and weighing 2 to 4 kg per sheet. In the case of such a large substrate, with the conventional alignment mechanism, even if the side surface of the substrate is pressed with a jig, the substrate bends without sliding on the support pins, or even if it slides, the back surface of the substrate is strongly rubbed by the pin tips This causes problems such as damage and particle generation.

  The present invention has been made in view of the problems of the related art, and makes it possible to safely and accurately align a substrate without causing scratches or scratches on a substrate to be processed and without generating particles, and furthermore, efficiently. It is an object of the present invention to provide a substrate alignment apparatus that can perform well.

  It is another object of the present invention to provide a substrate processing apparatus that performs safe, accurate, and efficient alignment of a substrate to be processed to improve processing quality and efficiency.

  It is another object of the present invention to provide a substrate transfer apparatus that performs safe, accurate, and efficient alignment of a substrate to be processed to improve the accuracy, reliability, and efficiency of substrate transfer.

  In order to achieve the above object, a substrate alignment device of the present invention includes a plurality of support portions discretely arranged for mounting and supporting a substrate to be processed substantially horizontally, and each of the support portions. A floating means for applying a gas pressure to the substrate from below to substantially float the substrate, and a positioning means for pressing the floating substrate in a predetermined direction in a horizontal plane to perform positioning.

  According to the present invention, when positioning the substrate, the floating means sets the substrate in a substantially floating state from the support portion, and presses the floating substrate in a predetermined direction in a horizontal plane to position the substrate by the positioning means. Therefore, the substrate can be positioned smoothly and accurately without causing scratches or abrasion marks on the lower surface of the substrate and without generating contamination. Further, since the floating means locally floats the substrate in the vicinity of the support portion, it is possible to reduce the consumption of utilities such as high-pressure gas.

  In a preferred aspect of the present invention, the support portion has a support pin mounted vertically upward on a substantially horizontal stage for mounting the substrate on the tip of the pin. In this case, in order to obtain an efficient levitation function, preferably, the levitation means may have a structure having a gas discharge portion for discharging gas at a predetermined pressure toward the lower surface of the substrate around the support pin, and more preferably gas The discharge section may have a horn-type discharge member whose diameter gradually increases toward the upper end.

  Another preferred aspect is a configuration in which the support unit includes a support member having an upper surface on which the substrate is placed and a through hole extending in a vertical direction. In this case, in order to obtain an efficient levitation function, preferably, the levitation means may have a gas discharge portion that discharges gas at a predetermined pressure from the through hole of the support member toward the lower surface of the substrate, More preferably, a lower cylinder body in which the support member is fixed vertically upward to a substantially horizontal stage, and an upper cylinder body displaceably mounted vertically upward on the lower cylinder body via a gas discharge unit. And a configuration having:

  In another preferred embodiment, the supporting portion is mounted on a substantially horizontal stage having a top surface for mounting a substrate and a bottom surface receiving gas pressure, and the pad is vertically mounted within a predetermined range. And a pad supporting means for supporting the movable member in a direction and a horizontal direction. In this case, in order to obtain an efficient levitation function, preferably, the levitation means may include a gas discharge unit that discharges gas at a predetermined pressure toward the lower surface of the pad.

  In the present invention, it is possible to use a fixing means for fixing the substrate to the supporting portion with a vacuum attraction force. As a preferred embodiment, a common gas guide may be provided for the fixing means and the floating means.

  A second substrate alignment apparatus according to the present invention includes a horizontally displaceable supporting portion discretely arranged on a substantially horizontal stage to place and support the substrate to be processed substantially horizontally; Positioning means for pressing and positioning the substrate placed on the support in a predetermined direction in a horizontal plane.

  In the second substrate alignment apparatus, when the substrate is aligned, the support portion is also displaced in a horizontal direction so as to follow the displacement of the substrate, thereby making it difficult to make scratches or rubbing marks on the lower surface of the substrate, thereby generating contamination. Can be suppressed.

  In the present invention, the positioning means may preferably position the substrate by pressing a pair of opposing corners of the substrate in a diagonal direction, or make the side surfaces of some or all sides of the substrate orthogonal to the side. The substrate may be positioned by pressing in the direction.

  A substrate processing apparatus according to the present invention includes the substrate alignment apparatus according to the present invention, and processing means for performing a predetermined process on a substrate to be processed aligned by the substrate alignment apparatus. Since the substrate can be aligned safely, accurately, and quickly using the substrate alignment apparatus of the present invention, desired processing on the substrate can be performed safely, accurately, and efficiently.

  A substrate processing apparatus according to the present invention includes the substrate alignment apparatus according to the present invention, and a transport unit that transports a substrate to be processed, which has been aligned by the substrate alignment apparatus, to a predetermined location. The substrate alignment can be performed safely, accurately, and quickly by using the substrate alignment apparatus of the present invention, so that the accuracy, reliability, and efficiency of substrate transfer can be improved.

  According to the substrate alignment device of the present invention, by the above-described configuration and operation, the substrate can be safely and accurately aligned without causing scratches or scratches on the substrate to be processed and without generating particles. It can be performed efficiently.

  According to the substrate processing apparatus of the present invention, by the above-described configuration and operation, the processing quality and efficiency can be improved by performing safe, accurate, and efficient positioning of the substrate to be processed.

  Further, according to the substrate transfer apparatus of the present invention, the configuration and operation as described above improve the accuracy, reliability, efficiency, and the like of the substrate transfer by performing safe, accurate, and efficient alignment of the substrate to be processed. be able to.

  Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

  FIG. 1 shows a coating and developing system as a configuration example to which the alignment apparatus, the substrate processing apparatus, and the substrate transport apparatus of the present invention can be applied. This coating and developing processing system is installed in a clean room, and performs, for example, cleaning, resist coating, pre-baking, developing, and post-baking in a photolithography step in an LCD manufacturing process, using an LCD substrate as a substrate to be processed. is there. The exposure processing is performed by an external exposure apparatus (not shown) installed adjacent to this system.

  The coating and developing system is roughly composed of a cassette station (C / S) 10, a process station (P / S) 12, and an interface unit (I / F) 14.

  A cassette station (C / S) 10 installed at one end of the system includes a cassette stage 16 on which a plurality of cassettes C containing a plurality of substrates G can be placed, for example, up to four, and a side on the cassette stage 16. And a transfer mechanism 17 provided in parallel with the direction in which the cassettes C are arranged, and a transfer mechanism 20 which is movable on the transfer path 17 and takes in and out of the substrate G with respect to the cassette C on the stage 16. The transfer mechanism 20 has a unit capable of holding the substrate G, for example, a transfer arm, is operable in four axes of X, Y, Z, and θ. And the substrate G can be transferred.

  The process station (P / S) 12 sequentially connects the cleaning process unit 22, the coating process unit 24, and the development process unit 26 to the substrate relay unit 23, the chemical solution supply unit 25, They are provided in a horizontal row with a space 27 therebetween.

  The cleaning process unit 22 includes two scrubber cleaning units (SCRs) 28, two upper and lower ultraviolet irradiation / cooling units (UV / COL) 30, a heating unit (HP) 32, and a cooling unit (COL) 34. Contains.

  The coating process unit 24 includes a resist coating unit (CT) 40, a reduced-pressure drying unit (VD) 42, an edge remover unit (ER) 44, an upper / lower two-stage adhesion / cooling unit (AD / COL) 46, An upper / lower two-stage heating / cooling unit (HP / COL) 48 and a heating unit (HP) 50 are included.

  The developing process section 26 includes three developing units (DEV) 52, two upper and lower two-stage heating / cooling units (HP / COL) 53, and a heating unit (HP) 55.

  Transport paths 36, 51, and 58 are provided in the center of each of the process units 22, 24, and 26 in the longitudinal direction, and the main transport units 38, 54, and 60 move along the respective transport paths, and The unit is accessed to carry in / out or carry in the substrate G. In this system, in each of the process units 22, 24, and 26, a spinner system unit (SCR, CT, DEV, etc.) is arranged on one side of the transport paths 36, 51, 58, and a heat treatment system is arranged on the other side. (HP, COL, etc.) are arranged.

  An interface unit (I / F) 14 provided at the other end of the system has an extension (substrate transfer unit) 56 and a buffer stage 57 provided on the side adjacent to the process station 12 and transports it to the side adjacent to the exposure apparatus. A mechanism 59 is provided. The transport mechanism 59 is movable on the transport path 19 extending in the Y direction, and moves the substrate G in and out of the buffer stage 57 and communicates with an extension (substrate transfer section) 56 and an adjacent exposure device. The transfer of the substrate G is performed.

  FIG. 2 shows a processing procedure in this coating and developing processing system. First, at the cassette station (C / S) 10, the transport mechanism 20 takes out one substrate G from the predetermined cassette C on the stage 12 and transports the substrate G to the cleaning process unit 22 of the process station (P / S) 12. It is passed to the device 38 (step S1).

  In the cleaning process unit 22, the substrate G is first carried into the ultraviolet irradiation / cooling unit (UV / COL) 30 sequentially, and in the first ultraviolet irradiation unit (UV), dry cleaning is performed by ultraviolet irradiation, and the next cooling unit (UV) is applied. (COL), the temperature is cooled to a predetermined temperature (step S2). This ultraviolet cleaning mainly removes organic substances on the substrate surface.

  Next, the substrate G undergoes a scrubbing cleaning process in one of the scrubber cleaning units (SCR) 28 to remove particulate dirt from the substrate surface (step S3). After the scrubbing cleaning, the substrate G undergoes dehydration by heating in the heating unit (HP) 32 (step S4), and is then cooled to a constant substrate temperature in the cooling unit (COL) 34 (step S5). With this, the preprocessing in the cleaning process unit 22 is completed, and the substrate G is transported to the coating process unit 24 via the substrate transfer unit 23 by the main transport unit 38.

  In the coating process unit 24, the substrate G is firstly sequentially carried into an adhesion / cooling unit (AD / COL) 46, and subjected to a hydrophobic treatment (HMDS) in the first adhesion unit (AD) (step S6). Is cooled to a constant substrate temperature by the cooling unit (COL) (step S7).

  Thereafter, the substrate G is coated with a resist solution in a resist coating unit (CT) 40, and then subjected to a drying process under reduced pressure in a reduced-pressure drying unit (VD) 42, and then in an edge remover unit (ER) 44. Excess (unnecessary) resist is removed (step S8).

  Next, the substrate G is sequentially carried into the heating / cooling unit (HP / COL) 48, and baking (pre-baking) after application is performed in the first heating unit (HP) (step S9), and then the cooling unit (HP). (COL) to cool the substrate to a certain temperature (step S10). The heating unit (HP) 50 can be used for baking after the application.

  After the coating process, the substrate G is transferred to the interface unit (I / F) 14 by the main transfer device 54 of the coating process unit 24 and the main transfer device 60 of the development process unit 26, and is transferred to the exposure device therefrom. (Step S11). In the exposure apparatus, a predetermined circuit pattern is exposed on the resist on the substrate G. Then, the substrate G that has been subjected to the pattern exposure is returned to the interface unit (I / F) 14 from the exposure apparatus. The transport mechanism 59 of the interface unit (I / F) 14 transfers the substrate G received from the exposure apparatus to the developing process unit 26 of the process station (P / S) 12 via the extension 56 (Step S11).

  In the developing process section 26, the substrate G undergoes a developing process in one of the developing units (DEV) 52 (step S12), and is sequentially carried into one of the heating / cooling units (HP / COL) 53. Post baking is performed in the first heating unit (HP) (step S13), and then cooled to a certain substrate temperature in the cooling unit (COL) (step S14). A heating unit (HP) 55 can be used for this post-baking.

  The substrate G that has been subjected to a series of processing in the developing process unit 26 is returned to the cassette station (C / S) 10 by the transfer devices 60, 54, and 38 in the process station (P / S) 24, where the transfer mechanism 20 is provided. Is stored in any one of the cassettes C (step S1).

  In this coating and developing processing system, the present invention can be applied to, for example, an edge remover unit (ER) 44 of the coating processing section 24. Hereinafter, an embodiment in which the present invention is applied to an edge remover unit (ER) 44 will be described with reference to FIGS.

  FIGS. 3 and 4 show the configuration of the main parts of the resist coating unit (CT) 40, the reduced-pressure drying unit (VD) 42, and the edge remover unit (ER) 44 in the coating processing unit 12.

  These coating system processing unit groups (CT) 40, (VD) 42, and (ER) 44 are arranged in a row on the support base 60 in the order of processing steps. A pair of guide rails 62, 62 are laid on both sides of the support base 60, and the board G is directly transferred between the units by one or more sets of transfer arms 64, 64 that move in parallel along the two guide rails 62, 62. (Without the intermediation of the main transport device 54 on the side of the main transport path 52).

  The resist coating unit (CT) 40 includes a cup-shaped processing container 66 having an open upper surface, a vertically movable stage 68 for horizontally mounting and holding the substrate G in the processing container 66, A lifting drive unit 70 provided below the processing vessel 66 for raising and lowering the stage 68, and a nozzle for driving a resist nozzle 72 for dropping a resist solution from above onto the substrate G on the stage 68 in the XY directions. It has a scanning mechanism 74, a nozzle maintenance unit 76 for maintaining the inactive resist nozzle 72 outside the processing container 66, and a controller (not shown) for controlling each unit. The nozzle maintenance unit 76 includes a nozzle cleaning unit 78 and a nozzle standby unit 80.

  The nozzle scanning mechanism 74 arranges a pair of Y guide rails 82, 82 extending in the Y direction on both sides of the processing container 66, and includes an X guide rail 84 extending in the X direction between the Y guide rails 82, 82. It is movably bridged in the Y direction. A Y-direction drive unit 86 disposed at a predetermined position, for example, at one end of one Y guide rail 82, moves the X guide rail 84 along the Y guide rails 82, 82 via a transmission mechanism (not shown) such as an endless belt. Drive in the Y direction. Further, a carriage (transport body) 88 that can move in the X direction along the X guide rail 84 in, for example, a self-propelled manner or an externally driven manner is provided, and the registration nozzle 72 is detachably attached to the carriage 88.

  The vacuum drying unit (VD) 42 includes a tray or a shallow-bottomed lower chamber 90 having an open upper surface, and a lid-shaped upper chamber configured to be airtightly fitted or fitted to the upper surface of the lower chamber 90. 92. The lower chamber 90 has a substantially square shape, and a stage 94 for horizontally mounting and supporting the substrate G is disposed at the center, and exhaust ports 96 are provided at four corners on the bottom surface. An exhaust pipe 98 connected to each exhaust port 96 from below the lower chamber 90 communicates with a vacuum pump (not shown). With the lower chamber 90 covered with the upper chamber 92, the processing space in both chambers 90, 92 can be depressurized to a predetermined degree of vacuum by the vacuum pump.

  The edge remover unit (ER) 44 includes a stage 100 made of, for example, an aluminum plate on which the substrate G is placed horizontally, an alignment mechanism 102 according to the first embodiment for positioning the substrate G on the stage 100, and a substrate G There are provided four remover heads 104 and the like for removing extra resist from the four edges. With the alignment mechanism 102 positioning the substrate G at the set position on the stage 100 and fixing and holding the substrate G in a horizontal posture, each remover head 104 moves along each side of the substrate G, and the periphery of each side of the substrate G The excess resist adhering to the substrate is removed by dissolving with a solvent such as a thinner.

  The alignment mechanism 102 according to the first embodiment has a pair of pressing portions 106, 106 that are arranged facing each other in the diagonal direction of the stage 100 and are movable in the same direction. As shown in FIG. 3, each of the pressing portions 106 has an end effector whose distal end is opened at a substantially right angle (90 °) in a horizontal plane. When aligning the substrate G on the stage 100, the two pressing portions 106 and 106 are positioned so that the two end effectors in the diagonal direction of the substrate G are exactly engaged with opposing corners of the substrate G from both sides. It moves from the standby position to a predetermined forward movement position toward the center of the stage 100.

  Further, as shown in FIG. 5, the alignment mechanism 102 includes support pins 108 for horizontally supporting the substrate G, which are discretely arranged at predetermined intervals on the stage 100, and support pins 108 for supporting the substrate G. It has a floating part 110 for substantially floating from the substrate 108 and a suction fixing part 112 for fixing the substrate G by vacuum suction. In the illustrated example, the rows of the support pins 108 and the floating sections 110 and the rows of the suction fixing sections 112 are alternately arranged in the row direction.

  As shown in FIG. 6, the support pins 108 extend or protrude vertically above the center of the upper end of the cylindrical support 114 fixedly mounted on the stage 100, and receive the lower surface of the substrate G at the tip of the pins. I have. The floating portion 110 includes a horn-shaped gas discharge portion 116 extending upward from a peripheral edge of an upper end of the cylindrical support 114, and a gas passage 114 a and a gas supply pipe 118 in the cylindrical support 114. And a high-pressure gas supply source (not shown) connected through the An on / off control on-off valve (not shown) is provided in the gas supply pipe 118. The upper end of the gas discharge unit 116 may be set at a height such that a slight gap g is formed between the gas discharge unit 116 and the back surface (lower surface) of the substrate G placed on the support pins 108.

  As shown in FIG. 7, in a state where the substrate G is mounted on the stage 100, a high-pressure gas such as air (or nitrogen gas or the like) from the high-pressure gas supply source is supplied to the gas supply pipe 118 and the cylindrical support. When the gas is discharged from the gas discharge unit 116 at a predetermined pressure, that is, the gravity of the substrate G via the ventilation path 114a in the body 114 or at a pressure higher than the predetermined pressure, the substrate G substantially floats from the support pins 108. ing. Since the gas discharge portion 116 is formed in a horn shape, the air hitting the lower surface of the substrate G smoothly flows out through the gap g without generating a vortex.

  The material of the support pin 108 may be any material having high physical strength because it hardly rubs strongly with the substrate G, but rubber or resin having a low coefficient of friction with respect to the substrate G is preferable. The gas discharge portion 116 of the floating portion 110 may be made of any material, but a flexible material such as rubber, cloth, engineering plastic, or the like, which is elastically bent and not easily damaged even when touching the substrate G, can be suitably used.

  As shown in FIG. 5, the suction fixing portion 112 is formed of a cylindrical body which is mounted on the upper surface of the stage 100 at substantially the same height as the support pins 108 and vertically upward, and an intake pipe (not shown) is provided at the back of the stage 100. ) Is connected to a vacuum source such as a vacuum pump or an ejector (not shown). With the substrate G placed on the stage 100, an on / off control opening / closing valve (not shown) provided in the middle of the intake pipe is turned on, and the suction fixing section 112 is set to a vacuum source. When connected, the substrate G is fixed and held on the suction fixing portion 112 by a vacuum suction force. Note that the material of the suction fixing portion 112 is preferably rubber, resin, or the like that at least has an upper end portion that comes into contact with the substrate G and does not easily damage the substrate.

  Here, the overall operation of the alignment mechanism 102 in this embodiment will be described. As described above, the substrate G coated with the resist liquid by the resist coating unit (CT) 40 and then dried by the reduced-pressure drying unit (VD) 42 is transferred to the edge remover unit (ER) by the transfer arms 64, 64. 44, and is placed substantially horizontally on the stage 100, more precisely, on the support pins 108. At the time of carrying in the substrate, the floating unit 110 and the suction fixing unit 112 are in a non-operating state.

  After the substrate is loaded, first, the floating unit 110 operates, and high-pressure air is discharged from the gas discharging unit 116 as described above, and the substrate G is substantially lifted from the support pins 108 by the pressure of the air. In a state where the substrate G is lifted in this way, the pressing portions 106 and 106 are operated, and both end effectors are moved until they are exactly engaged with the corners on both sides in the diagonal direction of the substrate G as described above. Then, the position of the substrate G is finely adjusted in the X and Y directions to position the substrate G at a set position on the stage 100.

  In this alignment, the substrate G may be completely suspended in the air, or may be in light contact with some or all of the support pins 108. The gravity of the substrate G is almost negated by the pressure of the air, and even if the lower surface of the substrate G comes into contact with the support pins 108, the substrate G slides smoothly, so that no scratches or abrasion marks are formed, and contamination may occur. Absent. Further, the substrate G in the floating state only needs to be locally higher than the pin tip at least in the vicinity of each support pin 108, and is bent downward between the adjacent pins 108, 108 and the peripheral portion of the substrate to be bent downward. It may be lower than the height position.

  After the positioning of the substrate G is completed as described above, the floating unit 110 is turned off, and the discharge of the high-pressure air is stopped. Then, instead of this, the suction fixing section 112 operates to apply the vacuum suction force to fix and hold the substrate G at a set position in a horizontal posture. At this stage or immediately after the completion of the previous alignment, the pressing portions 106 may be separated from the substrate G and retracted to the standby position.

  In this way, the substrate G is positioned at the set position on the stage 100 by the alignment mechanism 102, and is fixed and held in a horizontal posture. In this state, the remover head 104 operates as described above to remove excess resist from the peripheral portion of the substrate G and to perform rinsing. After the end of the edge rinsing, the suction fixing portion 112 in the alignment mechanism 102 is turned off to release the vacuum suction force. Immediately after, the transfer arms 64, 64 or another transfer means unloads the processed substrate G from the stage 100 and transfers it to a processing section in a later process.

  As described above, in the alignment mechanism 102 of the present embodiment, when the positioning in the XY directions is performed on the stage 100 by the pressing units 106 and 106 in a mechanical manner, the floating unit 110 substantially moves the substrate G from the support pins 108. By setting the substrate G in a floating state, the substrate G is smoothly and accurately positioned at a set position on the stage 100 without causing scratches or scratches on the lower surface of the substrate G and without generating contamination. be able to. Furthermore, since the gas discharge portion 116 of the floating portion 110 is provided near the support pin 108 so as to surround the support pin 108, the substrate G can be locally and efficiently floated from the support pin 108, and the high-pressure gas The consumption can be reduced as much as possible.

  Further, in the edge remover unit (ER) 44 of this embodiment, the substrate G can be safely, accurately and quickly positioned at the set position on the stage 100 by the alignment mechanism 102. On the other hand, the edge rinse processing by the remover head 104 can be performed safely, accurately, and efficiently.

  Next, an alignment mechanism 102 according to a second embodiment will be described with reference to FIGS. The alignment mechanism 102 of the second embodiment is also applicable to, for example, the edge remover unit (ER) 44 of this embodiment, and has a pressing portion 106 (FIGS. 3 and 4) similar to that of the first embodiment. Have.

  As shown in FIG. 8, in this embodiment, for example, cylindrical projections which serve as a supporting portion, a floating portion, and a suction fixing portion in a grid-like arrangement pattern at predetermined intervals on a stage 100 discretely. The part 120 is arranged.

  As shown in FIGS. 9, 11 and 13, the projection 120 is provided on the lower cylinder 122 fixedly mounted on the upper surface of the stage 100 and on the lower cylinder 122 via a horn-type gas guide 124. And an upper cylindrical body 126 mounted so as to be displaceable in the vertical and horizontal directions. An annular groove 122a for fitting and fixing a flange-shaped lower end 124a of the gas guide 124 is formed on the inner wall of the lower cylindrical body 122, and a horn upper end 124b of the gas guide 124 is formed on the inner wall of the upper cylindrical 126. An annular groove 126a for fitting and fixing is formed. The lower end of the gas guide 124 is connected to a gas pipe 128 penetrating the stage 100.

  The material of the lower cylindrical body 122 may be any member having high physical strength. The material of the upper cylindrical body 126 is preferably rubber or resin which does not easily damage the substrate G because it directly contacts the lower surface of the substrate G. The material of the gas guide 124 is preferably a flexible rubber or cloth.

  As shown in FIGS. 10 and 12, a gas pipe 128 connected to the protrusion 120 (more precisely, the gas guide 124) is provided with an on / off control on-off valve 130 and a two-position type 3 for switching the flow path. A high-pressure gas supply source 134 and a vacuum source 136 are communicated via a one-way valve 132. The on-off valve 130 and the three-way valve 132 are, for example, electromagnetic valves, and the control unit 138 controls the on / off position of the on-off valve 130 and the switching position of the three-way valve 132. The high-pressure gas supply source 134 and the vacuum source 136 each include a pressure control device (not shown).

  When the substrate G is mounted on the stage 100 and the on-off valve 130 is switched to the ON position and the three-way valve 132 is switched to the high-pressure gas supply source 134 as shown in FIG. A high-pressure gas such as air (or nitrogen gas or the like) from 134 is supplied to a gas guide 124 in each cylinder 120 via a gas pipe 128. Thereby, as shown in FIG. 11, the gas guide part 124 acts as a discharge part, and blows a vertically upward high-pressure air to the lower surface of the substrate G. By setting the air pressure on the high-pressure gas supply source 134 side such that the pressure of the vertical upward air cancels or exceeds the gravity of the substrate G, the substrate G can be floated from the upper surface of the upper cylindrical body 126. . At this time, the air discharged vertically upward from the gas guide portion 124 escapes through a gap g formed between the lower surface of the substrate G and the upper surface of the upper cylindrical body 126. As shown in FIG. 11, the gas guide 124 is pulled upward by the pressure of the vertically upward air, and the upper cylindrical body 126 floats upward from the lower cylindrical body 122.

  Also in this embodiment, the lower surface of the substrate G may lightly contact the upper surface of the upper cylindrical body 126 in a floating state. In this case, when the substrate G is displaced or moved in the horizontal direction by the horizontal pressing force of the pressing portions 106, 106, the upper cylindrical body 126 is supported by the flexible gas guide portion 124, so that the substrate G can be moved. They can be displaced in the same direction following each other. Therefore, the substrate G is not scratched or scratched. Therefore, the substrate G can be safely, quickly and accurately positioned at the set position on the stage 100.

  When the three-way valve 132 is switched to the vacuum source 136 as shown in FIG. 12 after the above-described positioning is completed, the high-pressure gas supply source 134 is shut off, and the vacuum source 136 is replaced with the gas source. It is connected to a gas guide 124 in each cylinder 120 via a pipe 128. As a result, as shown in FIG. 13, the gas guide portion 124 functions as an intake portion, and the substrate G is fixed and held so as to be adsorbed on the upper surface of the upper cylindrical body 126. At this time, the gas guide portion 124 and the upper cylindrical body 126 are attracted vertically downward by the vacuum suction force, and the upper cylindrical body 126 is fixed so as to be seated on the lower cylindrical body 122. Thus, the substrate G is fixedly held at the set position on the stage 100. In this state, in the edge remover unit (ER) 44, by operating the remover head 104 as described above, the edge rinsing process can be favorably performed on the peripheral portion of the substrate G.

  As described above, also in the second embodiment, when the positioning in the XY directions is performed on the stage 100 by the pressing portions 106 and 106 by the mechanical method, the substrate is provided by the levitation function provided on the projection 120 on the stage 100. By making G substantially floating above the substrate support (the upper surface of the upper cylindrical body 126), the lower surface of the substrate G is not scratched or rubbed, and no contamination occurs. The substrate G can be positioned at a set position on the stage 100 smoothly and with high precision. In addition, since the levitation mechanism is provided inside the substrate support in the protrusion 120, the substrate G can be locally and efficiently lifted from the substrate support, and the consumption of high-pressure gas is reduced as much as possible. be able to.

  Further, in the second embodiment, since the cylindrical body 120 on the stage 100 also has a vacuum suction function, it is possible to omit a dedicated suction fixing portion, thereby reducing component costs and flatness of the stage mounting surface. Can be improved.

  The shape and structure of the protrusion 120 can be variously modified. For example, a configuration in which the protrusion 120 is formed in a rectangular cylindrical body, or a configuration in which the upper cylindrical body 126 and the lower cylindrical body 122 are integrally formed is also possible. A configuration in which the gas guide portion 124 is formed in a cylindrical shape instead of the horn type, or a configuration in which the gas guide portion 124 is replaced with a through hole of a cylindrical body is also possible.

  14 and 15 show a configuration of a main part of an alignment mechanism 102 according to the third embodiment. The alignment mechanism 102 of this embodiment is also applicable to, for example, the edge remover unit (ER) 44 of this embodiment, and has a pressing portion 106 (FIGS. 3 and 4) similar to that of the first embodiment. I have.

  In the third embodiment, a movable support pad 140 which doubles as a support part and a floating part is discretely arranged on the stage 100 at a predetermined interval. The function of fixing and holding the substrate G may be performed by a dedicated suction member, for example, the suction fixing portion 112 in the first embodiment.

  14 and 15, the support pad 140 is formed as a disk having a flange 140a at the lower end, and is horizontally and vertically displaced into a circular recess 142a formed on the upper surface of the cylindrical base member 142. Housed as possible. More specifically, a flat protrusion or seat 144 on the upper surface is formed at the center of the bottom surface of the recess 142a, and the support pad 140 can be seated on the upper surface of the seat 144. An annular flange portion 142c horizontally projecting from the upper peripheral edge of the base member 142 above the recess 142a has a support function of mounting the substrate G on the upper surface and a stopper function of receiving the flange portion 140a of the support pad 140 on the lower surface. And

  As shown in FIG. 14, when the support pad 140 is seated on the seat 144, the upper surface of the support pad 140 is set to be lower than the upper surface of the flange 142 c of the base member 142. The seat part 144 is provided with a plurality of gas discharge holes 144a penetrating in the vertical direction, and these gas discharge holes 144a are connected to a gas passage or a gas supply pipe 146 penetrating the base member 142 and the stage 100. . The gas supply pipe 146 communicates with a high-pressure gas generation source (not shown) via an on / off control on-off valve (not shown).

  A plurality of exhaust ports 142d are formed on the bottom surface of the recess 142a of the base member 142. These exhaust ports 142d communicate with an exhaust system such as an exhaust duct (not shown) through an exhaust path or an exhaust pipe 148 that penetrates the base member 142 and the stage 100.

  In this embodiment, when positioning the substrate G on the stage 100, as shown in FIG. 15, a high-pressure gas such as air from a high-pressure gas generation source is discharged from the seat 144 through a gas supply pipe 146. Air is supplied to the hole 144a, and air is discharged from the gas discharge hole 144a at a predetermined pressure. The air that has hit the lower surface of the substrate G is guided to the downwardly curved lower surface of the flange portion 140a of the support pad 140, passes through the side of the seat 144, and is exhausted from the exhaust port 142d. Under the vertical upward pressure of the high-pressure air, the support pad 140 floats from the seat 144 while the substrate G is mounted. By operating the pressing portions 106 and 106 in this floating state, the substrate G can be displaced integrally with the support pad 140 and positioned at the set position on the stage 100.

  After the positioning is completed, the high pressure gas from the high pressure gas generation source is shut off, and the support pad 140 is lowered. The substrate G moves onto the flange portion 142c of the base member 142 while the support pad 140 is descending, and is fixed and held at the height position by the vacuum suction force of the suction fixing portion (112).

  In this embodiment, it is preferable that the support pad 140 places the substrate G at the center position in the base member recess 142a in the neutral state immediately before the pressing portions 106 and 106 are operated. In order to realize such a neutral position function, as shown in FIG. 16, for example, a plurality of (for example, 120 ° in the circumferential direction) are radially provided between the outer peripheral surface of the support pad 140 and the inner surface of the recess 142a. A configuration in which three (3) coil springs 150 are provided at intervals may be used.

  Also in this embodiment, when the positioning in the XY directions is performed on the stage 100 by the pressing units 106 and 106 by a mechanical method, the gas pressure type floating function via the support pads 140 discretely arranged on the stage 100 is used. By setting the substrate G in a substantially floating state, the substrate G can be smoothly moved to a set position on the stage 100 without causing scratches or scratches on the lower surface of the substrate G and without causing contamination. And accurate positioning. Further, since the support pad 140 or the floating mechanism acts discretely and locally on the stage 100, the substrate G can be efficiently floated, and the consumption of high-pressure gas can be reduced.

  FIG. 17 shows a configuration of a main part of an alignment mechanism 102 according to the fourth embodiment. The alignment mechanism 102 of this embodiment is also applicable to, for example, the edge remover unit (ER) 44 of this embodiment, and has a pressing portion 106 (FIGS. 3 and 4) similar to that of the first embodiment. I have.

  In the alignment mechanism 102 according to this embodiment, a support portion 152 that can be discretely displaced in the horizontal direction is disposed on the stage 100 at a predetermined interval. The function of fixing and holding the substrate G may be performed by a dedicated suction member, for example, the suction fixing portion 112 in the first embodiment.

  As shown in FIG. 17, a recess 100a is formed on the upper surface of the stage 100, and a ball-shaped caster 154 that can roll in any direction in the horizontal direction is formed in the recess 100a. The support portion 152 is supported by a plurality of radially arranged coil springs 156 (for example, three coil springs 156 arranged at 120 ° intervals in the circumferential direction).

  When positioning the substrate G on the stage 100, as shown in FIG. 17, the substrate G is placed on the upper surface of the support portion 152, and the pressing portions 106, 106 are operated in this state. The support 152 is displaced in the horizontal direction integrally with the substrate G, and the substrate G is positioned at the set position.

  In the fourth embodiment, the substrate G cannot be displaced in the vertical direction at the time of positioning because the gas pressure type levitation mechanism as in the first to third embodiments is not provided. The mechanism for displacing the support portion 152 so as to follow the displacement of the substrate G in the direction can make it difficult to make scratches or rub marks on the lower surface of the substrate G. In addition, the support part 152 is not limited to a cylindrical body, but various shapes are possible.

  In the coating and developing processing system of this embodiment, in addition to the edge remover unit (ER) 44 of the coating process unit 24, the transport mechanism 20 of the cassette station (C / S) 10 and the interface unit (I / F) The present invention can be applied to the fourteen transport mechanisms 59. ,

  FIG. 18 shows a configuration of the transport mechanism 59 according to one embodiment. The transport mechanism 59 is a substantially horizontal rectangular transport stage mounted on a transport body (not shown) movable along the transport path 19 so as to be rotatable in the θ direction and movable (elevated up and down). 160.

  On the upper surface of the transfer stage 160, a transfer arm 162 that can move forward and backward in the longitudinal direction of the stage horizontally is attached. In FIG. 18, the transfer arm 162 is located at the home position on the stage 160. A plurality of plate-like suction pads 162a for suction-fixing the substrate G are provided on the upper surface of the transfer arm 162.

  Further, on the upper surface of the transfer stage 160, a plurality of (for example, four) support pins 164 and a plurality of (for example, four) push pins 166 for positioning at positions not interfering with the transfer arm 162 are respectively movable up and down or retractable. It is provided in. When the support pins 164 protrude (raise) from the retracted position to a predetermined height position in a state where the transfer arm 162 releases the suction holding of the substrate G at the home position, the substrate G is transferred from the transfer arm 162 to the support pins 164. Is to be passed.

  Each pressing pin 166 is arranged close to the outside of the substrate G placed on the transport arm 162 or the support pin 164 at the home position in the longitudinal direction (arm moving direction) of the transport stage 160, and has a guide groove or a slot 168. The stage can be moved in the longitudinal direction of the stage. When each of the pressing pins 166 moves to a predetermined forward position toward the center of the substrate while the substrate G is mounted on the support pins 164, the substrate G is pressed by the pressing pins 166 from both sides in the longitudinal direction of the stage. It is designed to be positioned. A roller (not shown) made of rubber or resin rotatable around a vertical axis may be attached to a portion of each pressing pin 166 that comes into contact with the substrate G.

  Further, a pair of left and right pressing arms 170, 170 movable in the width direction are provided on the stage 100 in order to perform positioning in the width direction orthogonal to the stage longitudinal direction (arm moving direction). The pressing pads 172 and 172 attached to the pressing arms 170 and 170 respectively press opposing side surfaces of the substrate G mounted on the support pins 164 from both sides. A roller 174 made of rubber or resin rotatable around a vertical axis may be attached to these pressing pads 172 in order to reduce the impact and friction when coming into contact with the substrate G.

  In this embodiment, for example, the floating portion 110 in the first embodiment can be coupled to the support pin 164. That is, the same configuration as that in which the floating portion 110 is coupled to the support pin 108 in the first embodiment (FIGS. 5 to 7) may be applied to the support pin 164. However, instead of being fixedly attached to the stage 160, it is necessary to transform the stage 160 into an elevating type. Also in this embodiment, a high-pressure gas is supplied to the floating unit 110, and the substrate G can be substantially lifted from the support pins 108 as in the first embodiment. Then, by applying the pressing pins 166 and the pressing arms 170 to the substrate G in the floating state as described above, the lower surface of the substrate G is not scratched or rubbed, and contamination is generated. Without any trouble, the substrate G can be smoothly and accurately positioned at the set position on the stage 100.

  After the completion of the above positioning, the floating portion 110 is turned off, and the substrate G is supported by the support pins 164 at the set position. Next, the pressing pins 166 and the pressing arms 170 are separated from the substrate G and retracted to a predetermined original position, and the support pins 164 are also retracted to the original position, that is, lowered vertically downward. The substrate G is transferred from the support pins 164 to the transfer arm 162 by the lowering of the support pins 164. Upon receiving the substrate G, the transfer arm 162 fixedly holds the substrate G by the vacuum suction force of the suction pad 162a. In this manner, the transport mechanism 59 can transport the substrate G positioned on the stage 160 to the buffer stage 57, the extension 56, and an adjacent exposure apparatus.

  In this embodiment, although the mechanism is complicated and the size is increased, a configuration in which the movable support pad 140 (FIGS. 14 to 16) according to the third embodiment is applied instead of the support pin 164 is also possible. It is.

  Also, when the present invention is applied to the transport mechanism 20 of the cassette station (C / S) 10, the same configuration, operation and effect as described above can be obtained.

  In the fourth embodiment (FIG. 17), the supporting portion 152 having a rollable ball-shaped caster is horizontally displaced integrally with the substrate G so that the substrate G is positioned at the set position. Had become. However, a support structure in which a rotatable ball member 184 is disposed on a fixed support 182 as shown in FIG. 19 is also possible. In FIG. 19, a support 182 has a small-diameter portion threaded on the outer periphery and a large-diameter portion having a concave portion on an end surface, and the small-diameter portion is screwed into a screw hole provided on the upper surface of the stage 100 and fixed. You. In the concave portion of the large diameter portion, for example, a ceramic ball member 184 is attached so as to be able to rotate (self-rotate) in an arbitrary direction while keeping the ball center point at a fixed position. The substrate G is supported by the support 182 via the ball member 184. When the pressing portions 106, 106 (FIGS. 3 and 4) are operated in the alignment of the substrate, the substrate G is smoothly displaced in the horizontal direction by the rotational movement of the ball member 184, and is positioned at the set position.

  FIG. 20 shows a main part of the support 182. A ball bearing 186 is provided in the concave portion on the upper surface of the support 182, and the ball member 186 allows the ball member 184 to rotate (rotate) in an arbitrary direction in the concave portion.

  FIG. 21 shows a further modification. In this modification, instead of providing a ball bearing (186) in a concave portion on the upper surface of the support 182, an air passage 188 penetrating in the axial direction is provided inside the support 182. The lower end of the ventilation passage 188 is connected to a high-pressure gas supply source (not shown). In this modification, before the substrate G is placed on the ball member 184, a high-pressure gas, for example, air (or nitrogen gas or the like) may be sent from the high-pressure gas supply source into the ventilation path 188 to float the ball member 184. The substrate G is placed in the state in which the substrate G is held. When the pressing portions 106 and 106 are operated in this floating state, the ball member 184 rotates in the concave portion, and the substrate G is displaced in the horizontal direction and positioned at the set position. Next, when the supply of air to the ventilation path 188 is stopped, the ball member 184 descends and rotation is suppressed. Thereafter, the pressing on the substrate G at the pressing portions 106, 106 is released. When the rotation of the ball member 184 is suppressed, the air passage 188 may be connected to a vacuum source (not shown), and the rotation of the ball member 184 may be stopped or fixed by a vacuum suction force. The air supply function, the air supply stop function, the vacuum suction function, and the mode switching function as described above can be realized by a configuration similar to that shown in FIGS. 10 and 12, for example.

  As described above, when the substrate G is displaced in the horizontal direction on the stage 100, the ball member 184 is floated to enable rotation (rotation), and after the positioning of the substrate G is completed, the rotation of the ball member 184 is suppressed. In addition, the positioning can be performed without making any scratches or scratches on the substrate G.

  The present invention is applicable to various substrate processing apparatuses or substrate transport apparatuses other than the above embodiments. The substrate to be processed in the present invention is not limited to an LCD substrate, but may be various substrates for flat panel displays, semiconductor wafers, CD substrates, glass substrates, photomasks, printed substrates, and the like.

FIG. 1 is a plan view illustrating a configuration of a coating and developing processing system to which a substrate alignment device, a substrate processing device, and a substrate transfer device of the present invention can be applied. 2 is a flowchart illustrating a procedure of processing in the coating and developing processing system of FIG. 1. FIG. 2 is a plan view illustrating a configuration of a main part of a coating processing unit group in the coating and developing processing system of FIG. 1. FIG. 2 is a side view showing a configuration of a main part of a coating processing unit group in the coating and developing processing system of FIG. 1. FIG. 2 is a perspective view illustrating a configuration of a main part of the alignment mechanism according to the first embodiment. FIG. 3 is a diagram illustrating a configuration and a state of a main part of the alignment mechanism according to the first embodiment. FIG. 2 is a partial cross-sectional side view showing a configuration and a state of a main part of the alignment mechanism according to the first embodiment. FIG. 9 is a perspective view illustrating a configuration of a main part of an alignment mechanism according to a second embodiment. FIG. 11 is a partially enlarged perspective view illustrating a configuration of a main part of an alignment mechanism according to a second embodiment. FIG. 11 is a block diagram illustrating a configuration of a main part of an alignment mechanism according to a second embodiment. FIG. 11 is a longitudinal sectional view illustrating a configuration and a state of a main part of an alignment mechanism according to a second embodiment. FIG. 11 is a block diagram illustrating a configuration of a main part of an alignment mechanism according to a second embodiment. FIG. 11 is a longitudinal sectional view illustrating a configuration and a state of a main part of an alignment mechanism according to a second embodiment. FIG. 11 is a longitudinal sectional view illustrating a configuration and a state of a main part of an alignment mechanism according to a third embodiment. FIG. 11 is a longitudinal sectional view illustrating a configuration and a state of a main part of an alignment mechanism according to a third embodiment. It is a longitudinal section showing the composition and one state of a modification of a 3rd example. FIG. 14 is a longitudinal sectional view illustrating a configuration and a state of a main part of an alignment mechanism according to a fourth embodiment. FIG. 2 is a plan view illustrating a configuration of a transport mechanism according to one embodiment. FIG. 14 is a cross-sectional view illustrating a configuration of a main part in a modification of the fourth embodiment. FIG. 20 is a cross-sectional view illustrating a configuration of a main part of the support unit of FIG. 19. It is sectional drawing which shows the structure of the principal part in another modification of 4th Example.

Explanation of reference numerals

20,59 Transport mechanism 44 Edge remover unit (ER)
REFERENCE SIGNS LIST 100 stage 102 alignment mechanism 106 pressing part 108 supporting pin 110 floating part 112 suction fixing part 114 supporting member 116 gas discharging part 120 protruding part 122 lower cylindrical body 124 gas guiding part 126 upper cylindrical body 134 high-pressure gas supply source 136 vacuum source 140 support Pad 142 Base member 144 Seat 150 Coil spring 152 Support 154 Caster 156 Coil spring
160 stage 164 support pin 166 pressing pin 170 pressing arm 182 support 184 ball member 186 ball bearing 188 air passage

Claims (16)

A plurality of support portions discretely arranged to support the substrate to be processed substantially horizontally,
Floating means for applying a gas pressure to the substrate from below in the vicinity of each of the support portions to substantially float the substrate,
And a positioning means for positioning the substrate in a floating state by pressing the substrate in a predetermined direction in a horizontal plane.   The substrate alignment apparatus according to claim 1, wherein the support portion includes a support pin mounted vertically upward on a substantially horizontal stage for mounting the substrate on a pin tip.   3. The substrate alignment apparatus according to claim 2, wherein the floating means has a gas discharge unit that discharges the gas at a predetermined pressure around the support pins toward a lower surface of the substrate.   4. The substrate alignment apparatus according to claim 3, wherein the gas discharge unit has a horn-type discharge member whose diameter gradually increases toward an upper end.   The substrate alignment apparatus according to claim 1, wherein the support unit includes a support member having an upper surface on which the substrate is placed and a through hole extending in a vertical direction.   6. The substrate alignment apparatus according to claim 5, wherein the floating unit has a gas discharge unit configured to discharge the gas at a predetermined pressure from a through hole of the support member toward a lower surface of the substrate.   A lower cylinder fixed to the substantially horizontal stage facing vertically upward, and an upper cylinder displaceably mounted vertically upward on the lower cylinder via the gas discharge portion; The substrate alignment apparatus according to claim 6, comprising:   The support portion is mounted on a substantially horizontal stage, and has a pad having an upper surface for mounting the substrate and a lower surface receiving the pressure of the gas, and the pad is vertically and horizontally moved within a predetermined range. 2. The substrate alignment apparatus according to claim 1, further comprising: a pad supporting means for displaceably supporting the substrate.   9. The substrate alignment apparatus according to claim 8, wherein the floating means has a gas discharge unit for discharging the gas at a predetermined pressure toward a lower surface of the pad.   The substrate alignment apparatus according to claim 1, further comprising a fixing unit configured to fix the substrate to the support unit with a vacuum suction force.   The substrate alignment apparatus according to claim 10, wherein the fixing unit has a common gas guide with the floating unit. A horizontally displaceable supporting portion discretely arranged on a substantially horizontal stage to place and support the substrate to be processed substantially horizontally,
Positioning means for pressing and positioning the substrate placed on the support in a predetermined direction in a horizontal plane.   The substrate positioning apparatus according to claim 1, wherein the positioning unit positions the substrate by pressing a pair of opposite corners of the substrate in a diagonal direction.   The substrate positioning device according to claim 1, wherein the positioning unit positions the substrate by pressing a side surface of a part or all of the side of the substrate in a direction orthogonal to the side. A substrate alignment device according to any one of claims 1 to 14,
Processing means for performing a predetermined process on the substrate to be processed aligned by the substrate alignment device. A substrate alignment device according to any one of claims 1 to 14,
Transport means for transporting the substrate to be processed aligned by the substrate alignment apparatus to a predetermined location.

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