JP2006269498A - Device and method for holding substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To reliably hold a glass substrate at a prescribed position by regulating the travel of the floated glass substrate. <P>SOLUTION: A through-hole 26 is provided on a unit body 20 of a suction conveyance unit 17 for sucking, holding, and conveying the glass substrate W; and a sucking/holding mechanism 25 is provided at the through-hole 26. The sucking/holding mechanism 25 has a cylindrical elastic member 31 connected to a compressed air supply 30, and a suction pad 33 is fitted to the upper end 32 of the elastic member 31. In the suction pad 33, a suction hole 36 communicating with the elastic member 31 is formed. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a substrate holding apparatus that regulates and holds movement of a floating substrate and a substrate holding method.

When inspecting a glass substrate in the manufacturing process of a flat panel display (FPD) such as a liquid crystal display (LCD) or a plasma display (PDP), a positioning and holding device that positions and holds the glass substrate at a reference position is used. It has been.
Here, as a conventional positioning and holding device, a holding stage is movably provided on the uppermost X stage of the XY stage via a ball caster, and a glass substrate is sucked and held on this holding stage and held by an abutting cylinder. There is one in which a stage is moved and a glass substrate is directly pressed against a reference pin fixed to the X stage for positioning (see, for example, Patent Document 1).

However, in the positioning and holding device as disclosed in Patent Document 1, a movement space that is four times the area of the glass substrate is required for the XY stage to move in the XY direction. There was a problem that the whole was enlarged. Furthermore, since the weight of the XY stage increases as the size of the glass substrate increases, the moment of inertia of the XY stage becomes very large when the side surface of the glass substrate on the XY stage is directly pressed against the reference pin. There is a risk of damage when the substrate abuts against the reference pin, and a complicated mechanism for preventing this is required.
This enlarged glass substrate is placed on a roller transport section in which a plurality of rollers are rotatably provided, a cylinder is abutted against the glass substrate, and the side surface of the glass substrate is brought into contact with a positioning pin for positioning. An apparatus has been developed (see, for example, Patent Document 2).
JP-A-8-313815 JP 2000-9661 A

However, in the apparatus disclosed in Patent Document 2, in order to support the glass substrate with a large number of rollers, when the glass substrate is pushed in a direction orthogonal to the rotation direction of the rollers, the glass substrate moves while sliding on the rollers. As a result, the frictional resistance between the roller and the glass substrate may cause a roller friction mark on the back surface of the glass substrate.
Here, in order to reduce the frictional resistance during movement of the glass substrate, a method of positioning the glass substrate while using a levitation stage to float the glass substrate with air can be considered. Thus, when the glass substrate is levitated by air, the frictional resistance between the levitation stage and the glass substrate becomes very small, so that even if a slight external force is applied, the glass substrate moves greatly, and the glass substrate There arises a problem that the positioning is not stable, for example, it hits the reference pin and rebounds. In addition, it is conceivable to have a transport mechanism that forcibly transports the end of the glass substrate that has floated, but when transferring this glass substrate from one transport mechanism to the other transport mechanism during transport There arises a problem that the glass substrate moves due to a small external force or an inertial force of the glass substrate itself.
The present invention has been made in view of these circumstances, and an object of the present invention is to restrict the movement of the floated glass substrate so that the glass substrate can be reliably held at a predetermined position.

The present invention for solving the above-described problems is a substrate holding device that positions and holds the substrate while levitating the substrate from the levitation stage, and a contact member that can contact the back surface of the substrate, A positioning mechanism that positions the substrate at a predetermined position in a state where the contact member is brought into contact with the back surface of the substrate and the movement of the substrate is regulated, and suction that holds the substrate positioned by the positioning mechanism by suction And a mechanism for holding the substrate.
In this substrate holding device, the substrate made of glass or the like is floated in a freely movable state, the contact member is brought into contact with the back surface of the substrate, and then the substrate is positioned by the positioning mechanism. The movement of the substrate that is levitated by the small frictional force between the substrate and the contact member is restricted by the small frictional force between the substrate and the contact member. Thus, if positioning is performed while restricting movement of the substrate, the substrate is sucked and held. Note that the contact area between the contact member and the substrate is set to be sufficiently smaller than the area of the substrate.

The present invention also includes a step of levitating the substrate, a step of bringing a contact member into contact with the back surface of the levitated substrate to restrict movement of the substrate, and maintaining a contact state between the contact member and the substrate. However, the substrate holding method includes: a step of moving the substrate to position the substrate; and a step of sucking and holding the substrate after positioning.
In this substrate holding method, positioning is performed while adsorbing and holding the substrate while restricting movement of the substrate by a small frictional force between the contact member and the back surface of the substrate, so that the substrate can be positioned reliably and promptly.

  According to the present invention, the contact member is pressed against the back surface of the substrate while the substrate is levitated, and then the substrate is moved to the reference position by the positioning mechanism and is then held by suction. The substrate can be positioned while the movement of the substrate is restricted by a small frictional force between the two. Therefore, it is possible to regulate the movement of the substrate by generating a small frictional force that does not move the substrate on the back surface of the substrate that is levitated in a freely movable state, and to ensure stable and reliable positioning of the substrate. And efficient. By restricting the movement of the substrate in this way, the substrate can be moved with a small pressing force, and the substrate is prevented from being damaged during positioning. In addition, the frictional force generated between the contact member and the contact member at this time is sufficiently small as compared with the case where the entire surface of the substrate is in contact with the support member. And downsizing.

A first embodiment for carrying out the invention will be described in detail with reference to the drawings. The substrate holding device in the first embodiment is applied to a levitation conveyance device that floats and conveys a glass substrate for FPD, and FIGS. 1 and 2 are schematic configuration diagrams of the levitation conveyance device. Has been.
As shown in FIG. 1, the levitation transfer apparatus 1 has a base portion 2 installed on a vibration isolation table (not shown) installed on a floor surface, and a levitation stage 3 is fixed on the base portion 2. . As shown in FIG. 2, a plurality of air blowing holes 4 are regularly arranged on the upper surface of the levitation stage 3. In addition, on the glass substrate carry-in side (base end 3 a side) of the levitation stage 3, a plurality of lifters 5 that mechanically lift and lower the glass substrate W as a workpiece are placed in the through holes 6 formed in the levitation stage 3. It is arranged so that it can project and retract. An example of the lifter 5 is shown in FIG. The lifter 5 includes a U-shaped support member 7 provided on the lower surface side of the through hole 6 and a pneumatic cylinder 8 fixed to the bottom of the support member 7. A rod-like lift pin 11 is attached via the connecting member 10. The lift pin 11 can be moved by a pneumatic cylinder 8 from a standby position immersed in the through hole 6 to a support position protruding from the upper surface of the levitation stage 3 as indicated by a broken line in FIG.

  As shown in FIGS. 1 and 2, guide rails 15 and 16 are provided along the side surfaces on the side surfaces along the longitudinal direction of the base portion 2. Adsorption transport units 17 and 18 are attached to the guide rails 15 and 16 so as to be reciprocally movable. Both suction conveyance units 17 and 18 are controlled to move in synchronization by a control device (not shown).

  As shown in FIG. 2, the suction conveyance unit 17 has a unit main body 20 that moves along the guide rail 15 by a drive source such as a linear motor (not shown), and a positioning mechanism is formed on the upper surface of the unit main body 20. A plurality of reference pins 21, 22, 23 and a plurality of pressing pins 24 are disposed. In order to position one long side Wa of the glass substrate W, the reference pin 21 and the reference pin 22 are fixed on the unit main body 20 at a predetermined interval in parallel with the guide rail 15. In order to position one short side Wb of the glass substrate W, the reference pin 23 is fixed on the unit body 20 at a position closer to the transport path side than the reference pins 21 and 22. The pressing pin 24 is disposed on the unit main body 20 so as to face the reference pin 23 with the glass substrate W interposed therebetween, and is connected to an air cylinder (not shown) or the like so as to be movable toward the facing reference pin 23. It has become. Furthermore, between the pressing pin 24 and the reference pin 23, six suction holding mechanisms 25 that hold the side edge portion of one long side Wa of the glass substrate W by air suction are arranged at equal intervals. ing.

  As shown in FIG. 4, the suction holding mechanism 25 is provided in a through hole 26 that vertically penetrates the unit body 20 and is fixed via a support member 27 that covers the opening on the lower surface of the unit body 20. It has a mechanism. The suction mechanism includes a pipe 28, a valve 29 is provided in the pipe 28, and a compressed air supply unit 30 is connected to a lower end portion of the pipe 28. A substantially cylindrical elastic member 31 is connected to the upper end of the pipe 28. The upper end portion 32 of the elastic member 31 has a bellows shape, and is extendable in the vertical direction. A suction pad 33, which is a contact member, is airtightly attached to the tip of the elastic member 31, and is fitted into the through hole 26 so as to swing freely. The elastic member 31 is set to such a length that the upper part (suction surface 34a) of the suction pad 33 is at a predetermined position in a natural state (suction stop state). Here, the predetermined position is a position where the upper surface of the suction pad 33 is slightly higher than the flying height of the glass substrate W that has floated from the upper surface of the floating stage 3.

  The suction pad 33 is manufactured from a resin having wear resistance, and a suction surface 34 a that contacts the glass substrate W and a curved portion 35 that extends downward from the suction portion 34 are integrally formed. The outer diameter of the suction portion 34 is substantially equal to the diameter of the through hole 26 of the unit body 20, and a suction surface 34 a that is pressed against the glass substrate W is formed on the upper surface thereof. Here, since the suction hole 36 penetrating the suction part 34 vertically is formed at the center of the suction part 34, the suction surface 34a is annular. The suction hole 36 has a stepped portion 38 between the suction surface 34 a and the lower surface 34 b of the suction portion 34, and the lower surface 34 b side is reduced in diameter by the stepped portion 38. Further, the diameter-reduced portion 36a of the suction hole 36 is formed in a taper shape so that the diameter is reduced toward the lower surface 34b, and the diameter-reduced portion of the upper end portion 32 of the elastic member 31 is locked thereto. Yes. For this reason, the inside of the elastic member 31 and the suction hole 36 are in communication.

  Further, the suction conveyance unit 18 as shown in FIG. 2 has a substantially symmetric configuration with the suction conveyance unit 17. That is, the unit main body 40 is provided with a reference pin 41, pressing pins 42, 43, and 44, and a suction holding mechanism 25, and can be reciprocated along the guide rail 16 by a driving source such as a linear motor (not shown). Has been. The reference pin 41 and the pressing pin 42 opposite to the reference pin 41 have the same arrangement and configuration as the suction conveyance unit 17. The pressing pin 43 and the pressing pin 44 are respectively arranged so as to face the reference pin 21 and the reference pin 22 of the suction conveyance unit 17, and each is connected to a cylinder (not shown) or the like, and the facing reference pin 21. , 22 is configured to be movable toward the head. The configuration and arrangement of the suction holding mechanism 25 are the same as the suction holding mechanism 25 of the suction conveyance unit 17.

The levitation transport apparatus 1 is provided with a microscope (not shown) or the like above the levitation stage 3 so that the surface of the glass substrate W can be inspected for defects.
The reference pins 21, 22, 23, and 41 and the pressing pins 24, 42, and 43 function as a positioning mechanism that positions the glass substrate W at a predetermined reference position, and the suction holding mechanism 25 is positioned by the positioning mechanism. It functions as a suction mechanism that holds the glass substrate W by suction.

Next, the operation of this embodiment will be described.
First, as shown in FIG. 1, the suction conveyance units 17 and 18 are arranged at the base end portion 3 a of the levitation stage 3, and the lift pins 11 protrude upward from the upper surface of the levitation stage 3 as indicated by broken lines in FIG. 3. Let Air is blown out from the air blowing hole 4. At this time, the suction holding mechanism 25 is not in operation, and the suction surface 34 a (see FIG. 4) is higher than the upper surface of the levitation stage 3. When loading the glass substrate W, the loading robot transfers the glass substrate W to the lift pins 11.

When the glass substrate W is carried in, the lift pins 11 are lowered and the glass substrate W is brought into contact with the suction pad 33 of the suction holding mechanism 25. The suction surface 34 a is in close contact with the back surface of the glass substrate W, and the suction hole 36 of the suction pad 33 is sealed by the glass substrate W. When the glass substrate W is warped or inclined, the contact position between the curved portion 35 of the suction pad 33 and the through hole 26 is shifted, and the suction pad 33 swings, so that the glass substrate W and the suction are absorbed. A close contact state with the surface 34a is formed.
As shown in FIG. 2, the suction holding mechanism 25 is arranged so as to be distributed six by six on the left and right sides of the glass substrate W in parallel with the transport direction F, and the area of each suction surface 34 a is the back surface of the glass substrate W. Since the glass substrate W is placed on the suction pad 33, a small frictional force is generated between the glass substrate W and the suction surface 34a. The movement of the substrate W is restricted. In this state, when the pressing pins 24, 42, 43, 44 are moved and pressed against the respective side surfaces of the glass substrate W with a pressing force larger than a small frictional force, the glass substrate W is pressed against each pressing pin 24, 42, In response to the pressing force from 43, 44, it moves so as to slide on the suction pad 33, and its side surface is brought into contact with the reference pins 21, 22, 23, 41, thereby being positioned at the reference position.

  When the positioning of the glass substrate W is completed, the compressed air supply unit 30 of the suction holding mechanism 25 shown in FIG. The pressure in the pipe 28 and the elastic member 31 gradually decreases, and the glass substrate W is sucked to the suction pad 33 through the suction hole 36. Furthermore, when the pressure in the pipe 28, the elastic member 31, and the suction hole 36 is reduced, the elastic member 31 is contracted, and the glass substrate W is more securely held by suction. As a result, the glass substrate W is attracted and held on both sides in a positioned state, and the air is levitated on the levitating stage 3.

Then, the two suction conveyance units 17 and 18 shown in FIG. 2 are slid in synchronization toward the tip 3b side of the levitation stage 3, and the glass substrate W held by the suction conveyance units 17 and 18 is held. Transport. During this time, defect inspection is performed with a microscope provided above the floating stage 3.
When the defect inspection is completed, the glass substrate W is unloaded from the tip 3b of the levitation stage 3. At the time of carrying out, the suction by the suction holding mechanism 25 is released, and the glass substrate W is held with a small frictional force generated between the glass substrate W and the suction pad 33 using a carry-out robot (not shown). W is carried out. In addition, as a method of canceling | sucking adsorption | suction, supplying compressed air in the elastic member 31 or opening the inside of the elastic member 31 to the atmosphere is mention | raise | lifted.

  According to this embodiment, the suction holding mechanism 25 is provided on the back surface of the glass substrate W that floats on the air, and the suction holding mechanism 25 includes the suction mechanism including the elastic member 31 and the suction pad 33, and this suction Since the glass substrate W is supported by the pad 33 with a contact area sufficiently smaller than the area of the glass substrate W that is air levitated, the small friction generated between the glass substrate W and the suction pad 33. The movement of the glass substrate W can be regulated by force, and the movement of the glass substrate W when pressed by the pressing pins 24, 42, 43, 44 can be easily controlled. Therefore, stability at the time of positioning is improved, and damage to the glass substrate W can be prevented. Furthermore, the time required for positioning can be shortened, and the working efficiency is improved.

Further, the suction holding mechanism 25 can suck and hold the glass substrate W after the positioning is completed as it is, so that it is possible to quickly hold the positioned state with a simple configuration. At this time, since the elasticity of the suction pad 33 is given by the elastic member 31, the suction pad 33 can be brought into contact with the glass substrate W while having flexibility, and the back surface of the glass substrate W is damaged. Never give.
Further, since the suction holding mechanism 25 is provided in each of the two suction transfer units 17 and 18, the glass substrate W can be transferred along the floating stage 3 in a state of positioning and suction holding. Since the glass substrate W is conveyed in a positioned state, a correct inspection result can be obtained when a defect is observed with a microscope. At this time, since the other portions of the glass substrate W are floated on the air, the back surface of the glass substrate W is not damaged when the glass substrate W is moved.

Further, since the suction by the suction holding mechanism 25 is released while the air is floated on the levitation stage 3, the movement of the glass substrate W is caused by a small frictional force between the glass substrate W and the suction surface 34a of the suction pad 33. Since it is regulated, the glass substrate W can be carried out stably.
Furthermore, when the glass substrate W is positioned, the glass substrate W is sucked and held by the sucking and holding mechanism 25 while the glass substrate W is supported. Therefore, the glass substrate W is positioned and sucked and held continuously with a simple configuration. It is possible to prevent misalignment during this period.
In addition, since the two suction transfer units 17 and 18 are provided so as to sandwich the floating stage 3, the glass substrate W can be sucked and held with high accuracy, and position shift during transfer can be prevented.

  Here, the levitation stage 3 may not carry the lift pins 11 but may carry the glass substrate W in and out by the carry-in robot in a state where the suction holding mechanism 25 is raised and the glass substrate W is lifted from the levitation stage 3. In this case, the same operation and effect as described above can be obtained with a simple configuration.

  Further, it is possible to perform positioning in a state where the glass substrate W floated by the lift pins 11 is held. Specifically, the lift pins 11 are lowered while the glass substrate W is supported, and the lift pins 11 are stopped at a position slightly higher than the height at which the glass substrate W is lifted by air. At this time, since the glass substrate W is lifted upward by the air, the load of the glass substrate W applied to the lift pins 11 is reduced, and the frictional force generated between the lift pins 11 is reduced. Thus, the glass substrate W slides on the lift pins 11 by pressing the glass substrate W with the pressing pins 24, 42, 43, 44 in a state where the frictional force generated between the lift pins 11 and the glass substrate W is reduced. To move to the reference position. After the positioning, the lift pin 11 is lowered simultaneously with the suction holding mechanism 25 holding the glass substrate W by suction.

Next, a second embodiment of the present invention will be described with reference to the drawings. In addition, the same code | symbol is attached | subjected to the same component as 1st Embodiment. In addition, overlapping description is omitted.
As shown in FIGS. 5 and 6, in this embodiment, the substrate holding device is applied to a stage on which a glass substrate W for FPD is placed.
A plurality of air blowing holes (not shown) for floating the glass substrate W are provided on the substrate placement surface of the stage 51. A substrate holding mechanism 50 is provided at a predetermined position below the placement position of the glass substrate W. Four are arranged. This stage 51 positions and holds the glass substrate W, and the reference pins 52, 53, 54, and 55 and the pressing pins 56, 57, 58, and 59 that constitute the positioning mechanism face each other with the glass substrate W interposed therebetween. A plurality are arranged.

  As shown in FIG. 6, the substrate holding mechanism 50 has a support member 61 that covers the opening on the lower surface side of the through hole 60 formed in the stage 51, and the hole formed in the center of the support member 61 includes The upper end of the pipe 62 is inserted and fixed. An air pressure adjusting valve 63 is provided in the pipe 62, and a compressed air supply unit 64 is connected to the lower end of the pipe 62. The air pressure adjusting valve 63 adjusts the flow rate of the air supplied to the through hole 60 or interrupts the air supply by opening and closing the valve. A wear-resistant resin contact member 65 is inserted into the opening on the upper surface side of the through hole 60 so as to be slidable in the vertical direction. The contact member 65 has a cylindrical shape whose upper surface is closed, and the upper surface serves as a contact portion 66 that contacts the glass substrate W. The outer periphery of the contact member 65 is substantially equal to the diameter of the through hole 60, and the air tightness of the through hole 60 is secured by inserting the contact member 65. Furthermore, a stopper 67 extends annularly toward the outer side in the radial direction at the lower edge of the contact member 65. An annular groove 68 is formed on the inner peripheral surface of the through hole 60 so as to accommodate the stopper 67.

  The annular groove 68 is formed to be parallel to the height direction of the through hole 60 and to increase the diameter of the through hole 60, and the upper end of the annular groove 68 stops below the upper surface of the stage 51. The contact member 65 can be moved up and down by the height of the annular groove 68. Here, as other forms of the stopper 67, there are a stopper protruding in one place in the circumferential direction, a stopper protruding in plural, for example, one at a position shifted by a half circumference in the circumferential direction, etc. can give. In these cases, a groove for loosely fitting the stopper 67 is formed according to the number of stoppers and the formation position.

  The stage 51 is provided with a suction mechanism 69 that holds the positioned glass substrate W on the mounting surface of the stage 51 at a position corresponding to the peripheral edge of the glass substrate W. The suction mechanism 69 is constituted by, for example, a suction pad connected to a suction pump (not shown) by piping.

The operation of this embodiment will be described.
First, in a state where air is blown out from the air blowing hole and the glass substrate W is floated, the compressed air supply unit 64 and the air pressure adjusting valve 63 are driven, and compressed air having a predetermined pressure is supplied to the through hole 60 through the pipe 62. . The air flow rate at this time is adjusted by the valve opening degree of the air pressure adjustment valve 63.
As described above, since the through hole 60 has an airtight structure, the internal pressure of the through hole 60 gradually increases and the pressure acting on the contact member 65 also gradually increases. As a result, the contact member 65 is pushed upward and comes into contact with the back surface of the glass substrate W, whereby the glass substrate W is supported by the contact member. At this time, the contact member 65 comes into contact with the glass substrate W with flexibility by the elasticity of the compressed air.

Here, by controlling the supply amount and pressure of the compressed air, the frictional force generated between the contact member 65 and the back surface of the glass substrate W can be adjusted so as to be small. When the pressing pins 56, 57, 58, 59 are pressed against the glass substrate W, the glass substrate W moves so as to slide on the contact member 65, contacts the reference pins 52, 53, 54, 55, and reaches the reference position. Positioned.
Thereafter, the air pressure adjustment valve 63 is closed, the compressed air in the through hole 60 is exhausted, the contact member 65 is lowered, the air blowing from the air blowing hole of the stage 51 is stopped, and the glass substrate W is placed on the stage 51. Placed on. In this state, the back surface of the peripheral edge portion of the glass substrate W is sucked and held by the suction mechanism 69.

According to this embodiment, the glass substrate W is floated on the stage 51 with air, and the contact member 65 is lifted and lowered by air pressure, thereby reducing the friction between the glass substrate W and the stage 51, and the contact member. The movement by the pressing pins 56, 57, 58, 59 becomes possible while restricting the movement of the glass substrate W using the frictional force between 65 and 65. Thereby, regardless of the size of the glass substrate W, the glass substrate W can be reliably and stably positioned and held with a simple configuration. In particular, since the substrate holding mechanism 50 using air pressure can be reduced in size as described above, it can be easily incorporated into a substrate inspection apparatus such as an LCD equipped with a microscope.
Moreover, since it can prevent that the force from the contact member 65 acts on the glass substrate W by controlling the supply amount and pressure of compressed air, or utilizing the elastic force of compressed air, a glass substrate No damage or the like occurs on the back surface of W.
Furthermore, since the stopper 67 is provided on the contact member 65, the contact member 65 is prevented from coming out of the through hole 60, and the substrate holding mechanism 50 can be driven stably.

The present invention is not limited to the above embodiments, and can be modified without departing from the scope of the invention.
For example, in FIG. 5, four substrate holding mechanisms 50 are arranged at positions corresponding to the apexes of the square, but the substrate holding mechanism 50 can support the floating glass substrate W from the back surface, and If the frictional force does not increase unnecessarily, the arrangement and number can be arbitrarily set. Similarly, the number and arrangement of the suction holding mechanisms 25 shown in FIG. 2 are not limited to the embodiment.
In FIG. 2, the suction conveyance units 17 and 18 may be provided only on one side portion of the levitation stage 3. The mechanism can be simplified.
Furthermore, the workpiece to be positioned and attracted and held is not limited to the glass substrate W, and various substrates can be applied. Moreover, the gas used for the floating of the glass substrate W is not limited to air.

  Further, the substrate holding apparatus can use a suction holding mechanism 70 as shown in FIG. The suction holding mechanism 70 includes a suction mechanism including a support member 27, a pipe 28 including a valve 29, an air intake / exhaust unit 71, and a suction pad 72. The air intake / exhaust unit 71 is configured to be able to perform intake and exhaust of air. The suction pad 72 is a contact member that includes the suction portion 73 and the bending portion 35. The suction portion 73 has an annular suction surface 73 a with a circular recess 74 provided at the center, and a reverse support valve 76 is provided at the bottom of the recess 74. The reverse support valve 76 includes a hole 77 penetrating from the concave portion 74 to the lower surface 73b of the suction portion 73, and a valve body 78 that covers the hole 77 from the lower surface 73b side. The valve body 78 is larger than the diameter of the hole 77, and a part thereof is fixed to the lower surface 73b. Further, the valve body 78 closes the hole 77 in a natural state, and when the air in the through hole 26 is sucked by the air intake / exhaust part 71, the valve body 78 is deformed to open the hole 77 and is made of a material and a thickness. Is set. In the suction holding mechanism 70, when compressed air is supplied from the air intake / exhaust portion 71 to the through hole 26, the suction pad 72 rises along the through hole 26 and comes into contact with the glass substrate W. Therefore, positioning can be performed in the same manner as in the first embodiment by using the frictional force generated between the suction pad 72 and the suction pad 72. Thereafter, when the air in the through hole 26 is sucked by the air intake / exhaust portion 71, the reverse support valve 76 is opened as shown by the broken line, and the concave portion 74 is communicated with the through hole 26. As a result, the glass substrate W is sucked and held. The As described above, the suction holding mechanism 70 can perform vertical movement and suction holding. A stopper 67 as shown in FIG. 6 may be provided at the lower end of the curved portion 35 and an annular groove 68 corresponding to the stopper 67 may be formed in the through hole 26.

It is a side view which shows schematic structure of the levitation conveyance apparatus which is a board | substrate holding | maintenance apparatus in embodiment of this invention. It is a top view which shows schematic structure of a levitation conveyance apparatus. It is sectional drawing of a levitation conveyance apparatus, Comprising: It is a figure which shows the structure of a lift pin. It is sectional drawing of a levitation conveyance apparatus, Comprising: It is a figure which shows the structure of the adsorption holding mechanism which is a board | substrate holding apparatus. It is a figure which shows the structure of a levitation conveyance apparatus. It is sectional drawing of a levitation conveyance apparatus, Comprising: It is a figure which shows the structure of a board | substrate holding | maintenance apparatus. It is sectional drawing of a levitation conveyance apparatus, Comprising: It is a figure which shows the structure of the adsorption holding mechanism which is a board | substrate holding apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Levitation conveyance apparatus 3 Levitation stage 11 Lift pin (contact member)
17, 18 Adsorption transport unit 25 Adsorption holding mechanism 21, 22, 23, 41, 52, 53, 54, 55 Reference pin (positioning mechanism)
24, 42, 43, 44, 56, 57, 58, 59 Pressing pin (positioning mechanism)
28 Piping (suction mechanism)
29 Valve (Suction mechanism)
30 Compressed air supply unit (suction mechanism)
31 Elastic member (suction mechanism)
33,72 Suction pad (contact member)
50 Substrate holding mechanism 51 Stage (substrate holding device)
65 Contact member 69 Suction mechanism W Glass substrate

Claims (4)

A substrate holding device that positions and holds the substrate while levitating the substrate from the levitation stage,
A contact member capable of contacting the back surface of the substrate;
A positioning mechanism for positioning the substrate at a predetermined position in a state where the contact member is brought into contact with the back surface of the floating substrate and the movement of the substrate is regulated;
A suction mechanism for sucking and holding the substrate positioned by the positioning mechanism;
A substrate holding apparatus comprising:   The substrate holding apparatus according to claim 1, wherein the contact member is a suction pad connected to the suction mechanism.   The substrate holding apparatus according to claim 1, wherein the contact member, the suction mechanism, and the positioning mechanism are provided in a transport unit that can reciprocate along the floating stage. A step of floating the substrate;
A step of restricting the movement of the substrate by bringing a contact member into contact with the back surface of the floating substrate;
A step of positioning the substrate by moving the substrate while maintaining a contact state between the contact member and the substrate;
Sucking and holding the substrate after positioning;
A method for holding a substrate, comprising:

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