JP2006269498A5 - - Google Patents

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Publication number
JP2006269498A5
JP2006269498A5 JP2005081608A JP2005081608A JP2006269498A5 JP 2006269498 A5 JP2006269498 A5 JP 2006269498A5 JP 2005081608 A JP2005081608 A JP 2005081608A JP 2005081608 A JP2005081608 A JP 2005081608A JP 2006269498 A5 JP2006269498 A5 JP 2006269498A5
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JP
Japan
Prior art keywords
substrate
holding
positioning
contact member
contact
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Application number
JP2005081608A
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Japanese (ja)
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JP2006269498A (en
JP4895518B2 (en
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Priority to JP2005081608A priority Critical patent/JP4895518B2/en
Priority claimed from JP2005081608A external-priority patent/JP4895518B2/en
Publication of JP2006269498A publication Critical patent/JP2006269498A/en
Publication of JP2006269498A5 publication Critical patent/JP2006269498A5/ja
Application granted granted Critical
Publication of JP4895518B2 publication Critical patent/JP4895518B2/en
Expired - Fee Related legal-status Critical Current
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Claims (6)

浮上ステージから基板を浮上させつつ、前記基板を位置決めして保持する基板保持装置であって、
前記基板の裏面に当接して前記基板を支持する接触部材と、
浮上している前記基板の裏面に前記接触部材を当接させて前記基板を支持した状態で、前記基板を所定位置に位置決めする位置決め機構と、
前記位置決め機構により位置決めされた前記基板を吸着保持させる吸引機構と、
を具備したことを特徴とする基板保持装置。 A substrate holding device for positioning and holding the substrate while levitating the substrate from the levitation stage,
A contact member that contacts the back surface of the substrate and supports the substrate ;
A positioning mechanism for positioning the substrate at a predetermined position in a state in which the contact member is brought into contact with the back surface of the floating substrate and the substrate is supported ;
A suction mechanism for sucking and holding the substrate positioned by the positioning mechanism;
A substrate holding apparatus comprising: 前記接触部材は、前記吸引機構に接続された吸着パッドであることを特徴とする請求項１に記載の基板保持装置。 The substrate holding apparatus according to claim 1, wherein the contact member is a suction pad connected to the suction mechanism. 前記接触部材と、前記吸引機構とを、前記浮上ステージに沿って往復移動させる搬送ユニットを有することを特徴とする請求項１に記載の基板保持装置。 The substrate holding apparatus according to claim 1 , further comprising a transfer unit that reciprocates the contact member and the suction mechanism along the floating stage. 基板を浮上させる工程と、
浮上した前記基板の裏面に接触部材を当接させて前記基板の移動を規制する工程と、
前記接触部材と前記基板との当接状態を維持しつつ前記基板を移動させて、前記基板の位置決めをする工程と、
位置決め後に前記基板を吸着保持する工程と、
を備えることを特徴とする基板の保持方法。 A step of floating the substrate;
A step of restricting the movement of the substrate by bringing a contact member into contact with the back surface of the floating substrate;
A step of positioning the substrate by moving the substrate while maintaining a contact state between the contact member and the substrate;
Sucking and holding the substrate after positioning;
A method for holding a substrate, comprising: 搬送される基板を、浮上ステージから突設した支持部材に載置する工程と、Placing the substrate to be transported on a support member protruding from the levitation stage;
前記浮上ステージから吐出されるエアーによって前記基板を浮上させる工程と、A step of levitating the substrate by air discharged from the levitating stage;
前記支持部材に前記基板の裏面を支持させた状態で前記支持部材を降下させる工程と、Lowering the support member in a state where the back surface of the substrate is supported by the support member;
前記下降した前記基板を接触部材に支持させる工程と、Supporting the lowered substrate on a contact member;
前記接触部材に支持された状態で、位置決め手段により前記基板を移動させて前記基板の位置決めを行う工程と、A step of positioning the substrate by moving the substrate by positioning means while being supported by the contact member;
前記位置決め後に前記基板を吸着保持する工程と、Sucking and holding the substrate after the positioning;
を備えることを特徴とする基板の保持方法。A method for holding a substrate, comprising: 前記吸着保持された前記基板を浮上させた状態で、前記浮上ステージに沿って移動させる工程をさらに含むことを特徴とする請求項５記載の基板の保持方法。6. The substrate holding method according to claim 5, further comprising a step of moving along the levitation stage in a state where the substrate held by suction is levitated.
JP2005081608A 2005-03-22 2005-03-22 Substrate holding device and substrate holding method Expired - Fee Related JP4895518B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005081608A JP4895518B2 (en) 2005-03-22 2005-03-22 Substrate holding device and substrate holding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005081608A JP4895518B2 (en) 2005-03-22 2005-03-22 Substrate holding device and substrate holding method

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2010117895A Division JP2010251769A (en) 2010-05-24 2010-05-24 Substrate holding device and method of holding substrate

Publications (3)

Publication Number Publication Date
JP2006269498A JP2006269498A (en) 2006-10-05
JP2006269498A5 true JP2006269498A5 (en) 2008-05-01
JP4895518B2 JP4895518B2 (en) 2012-03-14

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ID=37205179

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005081608A Expired - Fee Related JP4895518B2 (en) 2005-03-22 2005-03-22 Substrate holding device and substrate holding method

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JP (1) JP4895518B2 (en)

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JP5084356B2 (en) * 2007-06-11 2012-11-28 Ｎｓｋテクノロジー株式会社 Substrate transport mechanism for exposure apparatus and substrate position adjusting method using the same
JP5279207B2 (en) * 2007-06-11 2013-09-04 Ｎｓｋテクノロジー株式会社 Substrate transport mechanism for exposure equipment
KR100920934B1 (en) 2007-07-10 2009-10-12 한미반도체 주식회사 Table for Seating Semiconductor Packages
DE102007052183A1 (en) 2007-10-31 2009-06-25 Grenzebach Maschinenbau Gmbh Apparatus and method for aligning shock-sensitive glass plates in clean rooms
JP5081710B2 (en) * 2008-04-28 2012-11-28 株式会社アルバック Deposition equipment
JP2010040788A (en) * 2008-08-05 2010-02-18 Olympus Corp Lift device and substrate inspection device
JP5550882B2 (en) * 2009-10-19 2014-07-16 東京応化工業株式会社 Coating device
JP4896236B2 (en) * 2010-01-21 2012-03-14 東京エレクトロン株式会社 Substrate transport apparatus and substrate transport method
TWI462215B (en) * 2010-03-29 2014-11-21 Dainippon Screen Mfg Substrate processing apparatus, changing method and transferring method
JP5254269B2 (en) * 2010-03-29 2013-08-07 大日本スクリーン製造株式会社 Substrate processing apparatus and transfer method
JP2012076877A (en) * 2010-10-01 2012-04-19 Nitto Denko Corp Workpiece transport method and workpiece transport apparatus
JP2012146783A (en) * 2011-01-11 2012-08-02 Murata Mfg Co Ltd Substrate sucking device
US10381256B2 (en) * 2015-03-12 2019-08-13 Kla-Tencor Corporation Apparatus and method for chucking warped wafers
JP6874314B2 (en) * 2016-09-30 2021-05-19 株式会社ニコン Object holding device, exposure device, flat panel display manufacturing method, and device manufacturing method
JP6842948B2 (en) * 2017-02-24 2021-03-17 リンテック株式会社 Positioning device and positioning method
CN108426897B (en) * 2018-05-07 2021-03-12 芜湖良匠机械制造有限公司 Glass substrate defect detection device
JP6568986B1 (en) * 2018-06-28 2019-08-28 平田機工株式会社 Alignment apparatus, semiconductor wafer processing apparatus, and alignment method
WO2021095327A1 (en) * 2019-11-12 2021-05-20 パナソニックＩｐマネジメント株式会社 Positioning device
US11315823B2 (en) * 2019-12-27 2022-04-26 Kawasaki Jukogyo Kabushiki Kaisha Substrate suction-holding structure and substrate transfer robot

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI226303B (en) * 2002-04-18 2005-01-11 Olympus Corp Substrate carrying device
JP4175988B2 (en) * 2002-10-25 2008-11-05 東京エレクトロン株式会社 Substrate alignment apparatus, substrate processing apparatus, and substrate transfer apparatus
TWI368757B (en) * 2003-04-30 2012-07-21 Olympus Corp Device for floating a substrate
JP4553841B2 (en) * 2003-05-06 2010-09-29 オリンパス株式会社 Substrate adsorption device

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