TW201137009A - Thermoplastic resin composition with high heat dissipation function, and molded products thereof - Google Patents

Thermoplastic resin composition with high heat dissipation function, and molded products thereof Download PDF

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Publication number
TW201137009A
TW201137009A TW99144066A TW99144066A TW201137009A TW 201137009 A TW201137009 A TW 201137009A TW 99144066 A TW99144066 A TW 99144066A TW 99144066 A TW99144066 A TW 99144066A TW 201137009 A TW201137009 A TW 201137009A
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TW
Taiwan
Prior art keywords
mass
parts
resin composition
boron nitride
thermoplastic resin
Prior art date
Application number
TW99144066A
Other languages
English (en)
Chinese (zh)
Inventor
Yuichi Shimokoba
Tetsuo Noguchi
Kouichi Shimizu
Satoshi Ishii
Original Assignee
Denki Kagaku Kogyo Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denki Kagaku Kogyo Kk filed Critical Denki Kagaku Kogyo Kk
Publication of TW201137009A publication Critical patent/TW201137009A/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C08K2003/382—Boron-containing compounds and nitrogen
    • C08K2003/385—Binary compounds of nitrogen with boron

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW99144066A 2009-12-15 2010-12-15 Thermoplastic resin composition with high heat dissipation function, and molded products thereof TW201137009A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009283819A JP2013040220A (ja) 2009-12-15 2009-12-15 高放熱性熱可塑性樹脂組成物及びその成形体

Publications (1)

Publication Number Publication Date
TW201137009A true TW201137009A (en) 2011-11-01

Family

ID=44167305

Family Applications (1)

Application Number Title Priority Date Filing Date
TW99144066A TW201137009A (en) 2009-12-15 2010-12-15 Thermoplastic resin composition with high heat dissipation function, and molded products thereof

Country Status (3)

Country Link
JP (1) JP2013040220A (ja)
TW (1) TW201137009A (ja)
WO (1) WO2011074552A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111499391A (zh) * 2013-06-03 2020-08-07 电化株式会社 树脂浸渗氮化硼烧结体及其用途
CN115991927A (zh) * 2022-11-15 2023-04-21 西安建筑科技大学 一种阻燃导热环氧树脂复合材料及其制备方法

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5688409B2 (ja) * 2010-04-07 2015-03-25 電気化学工業株式会社 Ｌｅｄ照明筐体用の放熱性樹脂組成物及びそのｌｅｄ照明用放熱性筐体
JP5791488B2 (ja) * 2011-12-20 2015-10-07 三菱電機株式会社 熱伝導性シート用樹脂組成物、熱伝導性シート及びパワーモジュール
CN104177821B (zh) * 2013-05-27 2017-09-08 杜邦公司 具有改善的抗冲击性的阻燃性聚酰胺组合物
JP6397180B2 (ja) * 2013-11-14 2018-09-26 国立研究開発法人産業技術総合研究所 繊維強化樹脂組成物、および繊維強化成形体
JP6310240B2 (ja) * 2013-11-21 2018-04-11 三菱エンジニアリングプラスチックス株式会社 レーザーダイレクトストラクチャリング用熱可塑性樹脂組成物、樹脂成形品、および樹脂成形品の製造方法
JP2015204352A (ja) * 2014-04-14 2015-11-16 株式会社オートネットワーク技術研究所 リアクトルおよび注型樹脂
EP3133103A1 (de) * 2015-08-21 2017-02-22 LANXESS Deutschland GmbH Polyamidzusammensetzungen

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3948834B2 (ja) * 1998-07-16 2007-07-25 電気化学工業株式会社 樹脂添加用窒化硼素とそれを用いた樹脂組成物、放熱部品
JP3844455B2 (ja) * 2002-06-28 2006-11-15 電気化学工業株式会社 六方晶窒化ほう素粉末およびその製造方法、用途
JP5028873B2 (ja) * 2006-06-09 2012-09-19 株式会社カネカ 高熱伝導性熱可塑性樹脂組成物
JP5024071B2 (ja) * 2008-01-18 2012-09-12 テクノポリマー株式会社 放熱性樹脂組成物
JP5767809B2 (ja) * 2008-03-18 2015-08-19 株式会社カネカ 高熱伝導性樹脂成形体
JP5109186B2 (ja) * 2008-04-24 2012-12-26 大塚化学株式会社 高熱伝導性樹脂組成物
JP5415058B2 (ja) * 2008-11-14 2014-02-12 ユニチカ株式会社 熱伝導性樹脂組成物およびそれからなる成形体

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111499391A (zh) * 2013-06-03 2020-08-07 电化株式会社 树脂浸渗氮化硼烧结体及其用途
CN115991927A (zh) * 2022-11-15 2023-04-21 西安建筑科技大学 一种阻燃导热环氧树脂复合材料及其制备方法
CN115991927B (zh) * 2022-11-15 2023-08-11 西安建筑科技大学 一种阻燃导热环氧树脂复合材料及其制备方法

Also Published As

Publication number Publication date
WO2011074552A1 (ja) 2011-06-23
JP2013040220A (ja) 2013-02-28

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