TW201133716A - Processing method of wafer - Google Patents

Processing method of wafer Download PDF

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Publication number
TW201133716A
TW201133716A TW100104573A TW100104573A TW201133716A TW 201133716 A TW201133716 A TW 201133716A TW 100104573 A TW100104573 A TW 100104573A TW 100104573 A TW100104573 A TW 100104573A TW 201133716 A TW201133716 A TW 201133716A
Authority
TW
Taiwan
Prior art keywords
wafer
substrate
along
layer
functional layer
Prior art date
Application number
TW100104573A
Other languages
English (en)
Chinese (zh)
Inventor
Masaru Nakamura
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of TW201133716A publication Critical patent/TW201133716A/zh

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  • Laser Beam Processing (AREA)
  • Dicing (AREA)
TW100104573A 2010-03-04 2011-02-11 Processing method of wafer TW201133716A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010047936A JP2011187479A (ja) 2010-03-04 2010-03-04 ウエーハの加工方法

Publications (1)

Publication Number Publication Date
TW201133716A true TW201133716A (en) 2011-10-01

Family

ID=44793481

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100104573A TW201133716A (en) 2010-03-04 2011-02-11 Processing method of wafer

Country Status (2)

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JP (1) JP2011187479A (ja)
TW (1) TW201133716A (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103489772A (zh) * 2012-06-07 2014-01-01 株式会社迪思科 晶片的加工方法
TWI614798B (zh) * 2013-02-25 2018-02-11 Disco Corp 積層晶圓之加工方法
TWI625775B (zh) * 2013-03-15 2018-06-01 Disco Corp Wafer processing method (3)
TWI703625B (zh) * 2015-12-04 2020-09-01 日商迪思科股份有限公司 晶圓的加工方法

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5985896B2 (ja) * 2012-06-12 2016-09-06 株式会社ディスコ ウエーハの加工方法およびレーザー加工装置
JP6124547B2 (ja) * 2012-10-16 2017-05-10 株式会社ディスコ 加工方法
JP2014229702A (ja) * 2013-05-21 2014-12-08 株式会社ディスコ レーザー加工装置
US20150034613A1 (en) * 2013-08-02 2015-02-05 Rofin-Sinar Technologies Inc. System for performing laser filamentation within transparent materials
JP2015095508A (ja) * 2013-11-11 2015-05-18 株式会社ディスコ ウェーハの加工方法
JP6305853B2 (ja) * 2014-07-08 2018-04-04 株式会社ディスコ ウエーハの加工方法
JP6440558B2 (ja) * 2015-04-10 2018-12-19 株式会社ディスコ 被加工物の加工方法
JP6558973B2 (ja) * 2015-06-18 2019-08-14 株式会社ディスコ デバイスチップの製造方法
JP2017017098A (ja) * 2015-06-29 2017-01-19 株式会社ディスコ ウェーハの加工方法
JP6815692B2 (ja) * 2016-12-09 2021-01-20 株式会社ディスコ ウェーハの加工方法
JP2019016731A (ja) * 2017-07-10 2019-01-31 株式会社ディスコ ウェーハの加工方法
WO2020105150A1 (ja) * 2018-11-19 2020-05-28 株式会社東京精密 レーザ加工装置及びその制御方法
JP7257604B2 (ja) * 2018-11-19 2023-04-14 株式会社東京精密 レーザ加工装置及びその制御方法
JP7474406B2 (ja) 2020-07-07 2024-04-25 株式会社東京精密 レーザ加工システム及びレーザ加工方法
JP2023108398A (ja) * 2022-01-25 2023-08-04 浜松ホトニクス株式会社 レーザ加工方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5495511B2 (ja) * 2008-05-27 2014-05-21 株式会社ディスコ ウエーハの分割方法
JP5122378B2 (ja) * 2008-06-09 2013-01-16 株式会社ディスコ 板状物の分割方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103489772A (zh) * 2012-06-07 2014-01-01 株式会社迪思科 晶片的加工方法
TWI614798B (zh) * 2013-02-25 2018-02-11 Disco Corp 積層晶圓之加工方法
TWI625775B (zh) * 2013-03-15 2018-06-01 Disco Corp Wafer processing method (3)
TWI703625B (zh) * 2015-12-04 2020-09-01 日商迪思科股份有限公司 晶圓的加工方法

Also Published As

Publication number Publication date
JP2011187479A (ja) 2011-09-22

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