TW201120985A - Treatment device and method for operating same - Google Patents

Treatment device and method for operating same Download PDF

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Publication number
TW201120985A
TW201120985A TW099123959A TW99123959A TW201120985A TW 201120985 A TW201120985 A TW 201120985A TW 099123959 A TW099123959 A TW 099123959A TW 99123959 A TW99123959 A TW 99123959A TW 201120985 A TW201120985 A TW 201120985A
Authority
TW
Taiwan
Prior art keywords
rotating
floating
floating body
rotation
group
Prior art date
Application number
TW099123959A
Other languages
English (en)
Chinese (zh)
Inventor
Masamichi Nomura
Kenjiro Koizumi
Shigeru Kasai
Sumi Tanaka
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW201120985A publication Critical patent/TW201120985A/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7626—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/24—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using chemical vapour deposition [CVD]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
TW099123959A 2009-07-22 2010-07-21 Treatment device and method for operating same TW201120985A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2009171558 2009-07-22
JP2009274987 2009-12-02
JP2010144572A JP5533335B2 (ja) 2009-07-22 2010-06-25 処理装置及びその動作方法

Publications (1)

Publication Number Publication Date
TW201120985A true TW201120985A (en) 2011-06-16

Family

ID=43499133

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099123959A TW201120985A (en) 2009-07-22 2010-07-21 Treatment device and method for operating same

Country Status (6)

Country Link
US (1) US20120118504A1 (https=)
JP (1) JP5533335B2 (https=)
KR (1) KR20120030564A (https=)
CN (1) CN102473670A (https=)
TW (1) TW201120985A (https=)
WO (1) WO2011010661A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
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CN104425331A (zh) * 2013-09-09 2015-03-18 北京北方微电子基地设备工艺研究中心有限责任公司 转盘定位装置、装载传输系统及等离子体加工设备

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US9548223B2 (en) * 2011-12-23 2017-01-17 Lam Research Ag Apparatus for treating surfaces of wafer-shaped articles
JP5937850B2 (ja) * 2012-02-29 2016-06-22 株式会社ブリヂストン 研削方法
KR101512560B1 (ko) 2012-08-31 2015-04-15 가부시키가이샤 스크린 홀딩스 기판처리장치
JP6010398B2 (ja) * 2012-08-31 2016-10-19 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP5973299B2 (ja) * 2012-09-25 2016-08-23 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP5936505B2 (ja) * 2012-09-25 2016-06-22 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP5973300B2 (ja) * 2012-09-25 2016-08-23 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
US10600673B2 (en) * 2015-07-07 2020-03-24 Asm Ip Holding B.V. Magnetic susceptor to baseplate seal
CN107022754B (zh) * 2016-02-02 2020-06-02 东京毅力科创株式会社 基板处理装置
WO2017221631A1 (ja) * 2016-06-23 2017-12-28 株式会社アルバック 保持装置
CN106637141B (zh) * 2017-01-20 2019-08-27 广东爱康太阳能科技有限公司 一种太阳能电池镀膜石墨舟片及石墨舟
JP6763321B2 (ja) * 2017-03-01 2020-09-30 東京エレクトロン株式会社 自転検出用冶具、基板処理装置及び基板処理装置の運転方法
EP3413340B1 (en) 2017-06-08 2021-11-17 Brooks Automation (Germany) GmbH Method for inspecting a container and inspection system
KR102789159B1 (ko) * 2018-11-05 2025-03-28 어플라이드 머티어리얼스, 인코포레이티드 자기 하우징 시스템들
KR102721972B1 (ko) * 2019-07-08 2024-10-29 삼성전자주식회사 회전체 모듈 및 이를 구비하는 화학 기계적 연마 장치
KR102943116B1 (ko) * 2020-03-04 2026-03-23 에이에스엠 아이피 홀딩 비.브이. 반응기 시스템용 정렬 고정구
CN115679294A (zh) * 2021-07-23 2023-02-03 北京北方华创微电子装备有限公司 半导体工艺腔室及半导体工艺设备
KR102766145B1 (ko) * 2021-12-16 2025-02-12 에이피시스템 주식회사 자기부상 회전 장치 및 자기부상 회전 방법
KR102424176B1 (ko) * 2021-12-17 2022-07-25 김상조 자기부상 회전 장치 및 이를 포함하는 진공 처리 장치

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JP2001524259A (ja) * 1995-07-10 2001-11-27 シーヴィシー、プラダクツ、インク マイクロエレクトロニクス製造装置用プログラマブル超クリーン電磁サブストレート回転装置及び方法
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JP3035577B2 (ja) * 1997-03-04 2000-04-24 オムロン株式会社 距離センサ装置
US6157106A (en) * 1997-05-16 2000-12-05 Applied Materials, Inc. Magnetically-levitated rotor system for an RTP chamber
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JP2001351874A (ja) * 2000-06-09 2001-12-21 Ebara Corp 基板回転装置
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JP4867074B2 (ja) * 2001-03-15 2012-02-01 東京エレクトロン株式会社 枚葉式の処理装置
JP2003322852A (ja) * 2002-05-07 2003-11-14 Nitto Denko Corp 反射型液晶表示装置及び光学フィルム
JP4575202B2 (ja) * 2005-03-24 2010-11-04 日本板硝子株式会社 透明板状体の欠点検査方法及び欠点検査装置
JP4979472B2 (ja) * 2007-06-05 2012-07-18 東京エレクトロン株式会社 処理装置
US8974632B2 (en) * 2011-11-30 2015-03-10 Lam Research Ag Device and method for treating wafer-shaped articles

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104425331A (zh) * 2013-09-09 2015-03-18 北京北方微电子基地设备工艺研究中心有限责任公司 转盘定位装置、装载传输系统及等离子体加工设备
TWI588077B (zh) * 2013-09-09 2017-06-21 北京北方微電子基地設備工藝研究中心有限責任公司 Turntable positioning device, loading and conveying system and plasma processing equipment

Also Published As

Publication number Publication date
WO2011010661A1 (ja) 2011-01-27
JP5533335B2 (ja) 2014-06-25
KR20120030564A (ko) 2012-03-28
CN102473670A (zh) 2012-05-23
JP2011139015A (ja) 2011-07-14
US20120118504A1 (en) 2012-05-17

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