KR20120030564A - 처리 장치 및 그 동작 방법 - Google Patents

처리 장치 및 그 동작 방법 Download PDF

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Publication number
KR20120030564A
KR20120030564A KR1020127001941A KR20127001941A KR20120030564A KR 20120030564 A KR20120030564 A KR 20120030564A KR 1020127001941 A KR1020127001941 A KR 1020127001941A KR 20127001941 A KR20127001941 A KR 20127001941A KR 20120030564 A KR20120030564 A KR 20120030564A
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KR
South Korea
Prior art keywords
rotating
floating
floating body
electromagnet
processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
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KR1020127001941A
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English (en)
Korean (ko)
Inventor
마사미치 노무라
겐지로 고이즈미
시게루 가사이
스미 다나카
Original Assignee
도쿄엘렉트론가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 도쿄엘렉트론가부시키가이샤 filed Critical 도쿄엘렉트론가부시키가이샤
Publication of KR20120030564A publication Critical patent/KR20120030564A/ko
Abandoned legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7626—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/24—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using chemical vapour deposition [CVD]

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
KR1020127001941A 2009-07-22 2010-07-21 처리 장치 및 그 동작 방법 Abandoned KR20120030564A (ko)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JPJP-P-2009-171558 2009-07-22
JP2009171558 2009-07-22
JPJP-P-2009-274987 2009-12-02
JP2009274987 2009-12-02
JPJP-P-2010-144572 2010-06-25
JP2010144572A JP5533335B2 (ja) 2009-07-22 2010-06-25 処理装置及びその動作方法

Publications (1)

Publication Number Publication Date
KR20120030564A true KR20120030564A (ko) 2012-03-28

Family

ID=43499133

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020127001941A Abandoned KR20120030564A (ko) 2009-07-22 2010-07-21 처리 장치 및 그 동작 방법

Country Status (6)

Country Link
US (1) US20120118504A1 (https=)
JP (1) JP5533335B2 (https=)
KR (1) KR20120030564A (https=)
CN (1) CN102473670A (https=)
TW (1) TW201120985A (https=)
WO (1) WO2011010661A1 (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170006274A (ko) * 2015-07-07 2017-01-17 에이에스엠 아이피 홀딩 비.브이. 자성 서셉터 대 베이스플레이트 시일
KR102424176B1 (ko) * 2021-12-17 2022-07-25 김상조 자기부상 회전 장치 및 이를 포함하는 진공 처리 장치
WO2023113262A1 (ko) * 2021-12-16 2023-06-22 에이피시스템 주식회사 자기부상 회전 장치 및 자기부상 회전 방법

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9548223B2 (en) * 2011-12-23 2017-01-17 Lam Research Ag Apparatus for treating surfaces of wafer-shaped articles
JP5937850B2 (ja) * 2012-02-29 2016-06-22 株式会社ブリヂストン 研削方法
KR101512560B1 (ko) 2012-08-31 2015-04-15 가부시키가이샤 스크린 홀딩스 기판처리장치
JP6010398B2 (ja) * 2012-08-31 2016-10-19 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP5973299B2 (ja) * 2012-09-25 2016-08-23 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP5936505B2 (ja) * 2012-09-25 2016-06-22 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP5973300B2 (ja) * 2012-09-25 2016-08-23 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
CN104425331B (zh) * 2013-09-09 2017-09-29 北京北方微电子基地设备工艺研究中心有限责任公司 转盘定位装置、装载传输系统及等离子体加工设备
CN107022754B (zh) * 2016-02-02 2020-06-02 东京毅力科创株式会社 基板处理装置
WO2017221631A1 (ja) * 2016-06-23 2017-12-28 株式会社アルバック 保持装置
CN106637141B (zh) * 2017-01-20 2019-08-27 广东爱康太阳能科技有限公司 一种太阳能电池镀膜石墨舟片及石墨舟
JP6763321B2 (ja) * 2017-03-01 2020-09-30 東京エレクトロン株式会社 自転検出用冶具、基板処理装置及び基板処理装置の運転方法
EP3413340B1 (en) 2017-06-08 2021-11-17 Brooks Automation (Germany) GmbH Method for inspecting a container and inspection system
KR102789159B1 (ko) * 2018-11-05 2025-03-28 어플라이드 머티어리얼스, 인코포레이티드 자기 하우징 시스템들
KR102721972B1 (ko) * 2019-07-08 2024-10-29 삼성전자주식회사 회전체 모듈 및 이를 구비하는 화학 기계적 연마 장치
KR102943116B1 (ko) * 2020-03-04 2026-03-23 에이에스엠 아이피 홀딩 비.브이. 반응기 시스템용 정렬 고정구
CN115679294A (zh) * 2021-07-23 2023-02-03 北京北方华创微电子装备有限公司 半导体工艺腔室及半导体工艺设备

Family Cites Families (19)

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Publication number Priority date Publication date Assignee Title
DE3930157A1 (de) * 1989-09-09 1991-03-21 Bosch Gmbh Robert Einrichtung zur verstellung der drehwinkelzuordnung einer nockenwelle zu ihrem antriebselement
JP2001524259A (ja) * 1995-07-10 2001-11-27 シーヴィシー、プラダクツ、インク マイクロエレクトロニクス製造装置用プログラマブル超クリーン電磁サブストレート回転装置及び方法
US5818137A (en) * 1995-10-26 1998-10-06 Satcon Technology, Inc. Integrated magnetic levitation and rotation system
JP3035577B2 (ja) * 1997-03-04 2000-04-24 オムロン株式会社 距離センサ装置
US6157106A (en) * 1997-05-16 2000-12-05 Applied Materials, Inc. Magnetically-levitated rotor system for an RTP chamber
JP3923696B2 (ja) * 1999-07-19 2007-06-06 株式会社荏原製作所 基板回転装置
JP2001090967A (ja) * 1999-09-27 2001-04-03 Matsushita Electric Works Ltd 床暖房パネル構造
KR100509085B1 (ko) * 2000-04-20 2005-08-18 동경 엘렉트론 주식회사 열 처리 시스템
JP2001351874A (ja) * 2000-06-09 2001-12-21 Ebara Corp 基板回転装置
JP2002016125A (ja) * 2000-06-29 2002-01-18 Ebara Corp 基板回転装置
US6437290B1 (en) * 2000-08-17 2002-08-20 Tokyo Electron Limited Heat treatment apparatus having a thin light-transmitting window
JP2002093724A (ja) * 2000-09-18 2002-03-29 Tokyo Electron Ltd 熱処理装置
EP1244152A3 (en) * 2001-01-26 2008-12-03 Toyoda Gosei Co., Ltd. Reflective light emitting diode, reflective optical device and its manufacturing method
US6770146B2 (en) * 2001-02-02 2004-08-03 Mattson Technology, Inc. Method and system for rotating a semiconductor wafer in processing chambers
JP4867074B2 (ja) * 2001-03-15 2012-02-01 東京エレクトロン株式会社 枚葉式の処理装置
JP2003322852A (ja) * 2002-05-07 2003-11-14 Nitto Denko Corp 反射型液晶表示装置及び光学フィルム
JP4575202B2 (ja) * 2005-03-24 2010-11-04 日本板硝子株式会社 透明板状体の欠点検査方法及び欠点検査装置
JP4979472B2 (ja) * 2007-06-05 2012-07-18 東京エレクトロン株式会社 処理装置
US8974632B2 (en) * 2011-11-30 2015-03-10 Lam Research Ag Device and method for treating wafer-shaped articles

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170006274A (ko) * 2015-07-07 2017-01-17 에이에스엠 아이피 홀딩 비.브이. 자성 서셉터 대 베이스플레이트 시일
WO2023113262A1 (ko) * 2021-12-16 2023-06-22 에이피시스템 주식회사 자기부상 회전 장치 및 자기부상 회전 방법
KR20230091507A (ko) * 2021-12-16 2023-06-23 에이피시스템 주식회사 자기부상 회전 장치 및 자기부상 회전 방법
KR102424176B1 (ko) * 2021-12-17 2022-07-25 김상조 자기부상 회전 장치 및 이를 포함하는 진공 처리 장치

Also Published As

Publication number Publication date
WO2011010661A1 (ja) 2011-01-27
JP5533335B2 (ja) 2014-06-25
CN102473670A (zh) 2012-05-23
TW201120985A (en) 2011-06-16
JP2011139015A (ja) 2011-07-14
US20120118504A1 (en) 2012-05-17

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