CN102473670A - 处理装置及其动作方法 - Google Patents

处理装置及其动作方法 Download PDF

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Publication number
CN102473670A
CN102473670A CN2010800331377A CN201080033137A CN102473670A CN 102473670 A CN102473670 A CN 102473670A CN 2010800331377 A CN2010800331377 A CN 2010800331377A CN 201080033137 A CN201080033137 A CN 201080033137A CN 102473670 A CN102473670 A CN 102473670A
Authority
CN
China
Prior art keywords
floating body
rotation
rotating
processing device
electromagnet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2010800331377A
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English (en)
Chinese (zh)
Inventor
野村正道
小泉建次郎
河西繁
田中澄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of CN102473670A publication Critical patent/CN102473670A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7626—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/24—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using chemical vapour deposition [CVD]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
CN2010800331377A 2009-07-22 2010-07-21 处理装置及其动作方法 Pending CN102473670A (zh)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP2009-171558 2009-07-22
JP2009171558 2009-07-22
JP2009-274987 2009-12-02
JP2009274987 2009-12-02
JP2010144572A JP5533335B2 (ja) 2009-07-22 2010-06-25 処理装置及びその動作方法
JP2010-144572 2010-06-25
PCT/JP2010/062243 WO2011010661A1 (ja) 2009-07-22 2010-07-21 処理装置及びその動作方法

Publications (1)

Publication Number Publication Date
CN102473670A true CN102473670A (zh) 2012-05-23

Family

ID=43499133

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2010800331377A Pending CN102473670A (zh) 2009-07-22 2010-07-21 处理装置及其动作方法

Country Status (6)

Country Link
US (1) US20120118504A1 (https=)
JP (1) JP5533335B2 (https=)
KR (1) KR20120030564A (https=)
CN (1) CN102473670A (https=)
TW (1) TW201120985A (https=)
WO (1) WO2011010661A1 (https=)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106637141A (zh) * 2017-01-20 2017-05-10 广东爱康太阳能科技有限公司 一种太阳能电池镀膜石墨舟片及石墨舟
CN107022754A (zh) * 2016-02-02 2017-08-08 东京毅力科创株式会社 基板处理装置
CN113363196A (zh) * 2020-03-04 2021-09-07 Asm Ip私人控股有限公司 用于反应器系统的对准夹具
CN115679294A (zh) * 2021-07-23 2023-02-03 北京北方华创微电子装备有限公司 半导体工艺腔室及半导体工艺设备

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US9548223B2 (en) * 2011-12-23 2017-01-17 Lam Research Ag Apparatus for treating surfaces of wafer-shaped articles
JP5937850B2 (ja) * 2012-02-29 2016-06-22 株式会社ブリヂストン 研削方法
KR101512560B1 (ko) 2012-08-31 2015-04-15 가부시키가이샤 스크린 홀딩스 기판처리장치
JP6010398B2 (ja) * 2012-08-31 2016-10-19 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP5973299B2 (ja) * 2012-09-25 2016-08-23 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP5936505B2 (ja) * 2012-09-25 2016-06-22 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP5973300B2 (ja) * 2012-09-25 2016-08-23 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
CN104425331B (zh) * 2013-09-09 2017-09-29 北京北方微电子基地设备工艺研究中心有限责任公司 转盘定位装置、装载传输系统及等离子体加工设备
US10600673B2 (en) * 2015-07-07 2020-03-24 Asm Ip Holding B.V. Magnetic susceptor to baseplate seal
WO2017221631A1 (ja) * 2016-06-23 2017-12-28 株式会社アルバック 保持装置
JP6763321B2 (ja) * 2017-03-01 2020-09-30 東京エレクトロン株式会社 自転検出用冶具、基板処理装置及び基板処理装置の運転方法
EP3413340B1 (en) 2017-06-08 2021-11-17 Brooks Automation (Germany) GmbH Method for inspecting a container and inspection system
KR102789159B1 (ko) * 2018-11-05 2025-03-28 어플라이드 머티어리얼스, 인코포레이티드 자기 하우징 시스템들
KR102721972B1 (ko) * 2019-07-08 2024-10-29 삼성전자주식회사 회전체 모듈 및 이를 구비하는 화학 기계적 연마 장치
KR102766145B1 (ko) * 2021-12-16 2025-02-12 에이피시스템 주식회사 자기부상 회전 장치 및 자기부상 회전 방법
KR102424176B1 (ko) * 2021-12-17 2022-07-25 김상조 자기부상 회전 장치 및 이를 포함하는 진공 처리 장치

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US6049148A (en) * 1995-10-26 2000-04-11 Satcon Technology Corporation Integrated magnetic levitation and rotation system
JP3035577B2 (ja) * 1997-03-04 2000-04-24 オムロン株式会社 距離センサ装置
JP2000515331A (ja) * 1997-05-16 2000-11-14 アプライド マテリアルズ インコーポレイテッド Ｒｔｐチャンバのための磁気的浮上型回転装置
JP2001093967A (ja) * 1999-07-19 2001-04-06 Ebara Corp 基板回転装置
JP2001524259A (ja) * 1995-07-10 2001-11-27 シーヴィシー、プラダクツ、インク マイクロエレクトロニクス製造装置用プログラマブル超クリーン電磁サブストレート回転装置及び方法
JP2001351874A (ja) * 2000-06-09 2001-12-21 Ebara Corp 基板回転装置
JP2002016125A (ja) * 2000-06-29 2002-01-18 Ebara Corp 基板回転装置
JP2002093724A (ja) * 2000-09-18 2002-03-29 Tokyo Electron Ltd 熱処理装置
JP2002280318A (ja) * 2001-03-15 2002-09-27 Tokyo Electron Ltd 枚葉式の処理装置及び処理方法
JP2006266933A (ja) * 2005-03-24 2006-10-05 Nippon Sheet Glass Co Ltd 透明板状体の欠点検査方法及び欠点検査装置
JP2008305863A (ja) * 2007-06-05 2008-12-18 Tokyo Electron Ltd 処理装置

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JP2001090967A (ja) * 1999-09-27 2001-04-03 Matsushita Electric Works Ltd 床暖房パネル構造
KR100509085B1 (ko) * 2000-04-20 2005-08-18 동경 엘렉트론 주식회사 열 처리 시스템
US6437290B1 (en) * 2000-08-17 2002-08-20 Tokyo Electron Limited Heat treatment apparatus having a thin light-transmitting window
EP1244152A3 (en) * 2001-01-26 2008-12-03 Toyoda Gosei Co., Ltd. Reflective light emitting diode, reflective optical device and its manufacturing method
US6770146B2 (en) * 2001-02-02 2004-08-03 Mattson Technology, Inc. Method and system for rotating a semiconductor wafer in processing chambers
JP2003322852A (ja) * 2002-05-07 2003-11-14 Nitto Denko Corp 反射型液晶表示装置及び光学フィルム
US8974632B2 (en) * 2011-11-30 2015-03-10 Lam Research Ag Device and method for treating wafer-shaped articles

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001524259A (ja) * 1995-07-10 2001-11-27 シーヴィシー、プラダクツ、インク マイクロエレクトロニクス製造装置用プログラマブル超クリーン電磁サブストレート回転装置及び方法
US6049148A (en) * 1995-10-26 2000-04-11 Satcon Technology Corporation Integrated magnetic levitation and rotation system
JP3035577B2 (ja) * 1997-03-04 2000-04-24 オムロン株式会社 距離センサ装置
JP2000515331A (ja) * 1997-05-16 2000-11-14 アプライド マテリアルズ インコーポレイテッド Ｒｔｐチャンバのための磁気的浮上型回転装置
JP2001093967A (ja) * 1999-07-19 2001-04-06 Ebara Corp 基板回転装置
JP2001351874A (ja) * 2000-06-09 2001-12-21 Ebara Corp 基板回転装置
JP2002016125A (ja) * 2000-06-29 2002-01-18 Ebara Corp 基板回転装置
JP2002093724A (ja) * 2000-09-18 2002-03-29 Tokyo Electron Ltd 熱処理装置
JP2002280318A (ja) * 2001-03-15 2002-09-27 Tokyo Electron Ltd 枚葉式の処理装置及び処理方法
JP2006266933A (ja) * 2005-03-24 2006-10-05 Nippon Sheet Glass Co Ltd 透明板状体の欠点検査方法及び欠点検査装置
JP2008305863A (ja) * 2007-06-05 2008-12-18 Tokyo Electron Ltd 処理装置

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107022754A (zh) * 2016-02-02 2017-08-08 东京毅力科创株式会社 基板处理装置
CN107022754B (zh) * 2016-02-02 2020-06-02 东京毅力科创株式会社 基板处理装置
CN106637141A (zh) * 2017-01-20 2017-05-10 广东爱康太阳能科技有限公司 一种太阳能电池镀膜石墨舟片及石墨舟
CN106637141B (zh) * 2017-01-20 2019-08-27 广东爱康太阳能科技有限公司 一种太阳能电池镀膜石墨舟片及石墨舟
CN113363196A (zh) * 2020-03-04 2021-09-07 Asm Ip私人控股有限公司 用于反应器系统的对准夹具
CN115679294A (zh) * 2021-07-23 2023-02-03 北京北方华创微电子装备有限公司 半导体工艺腔室及半导体工艺设备

Also Published As

Publication number Publication date
WO2011010661A1 (ja) 2011-01-27
JP5533335B2 (ja) 2014-06-25
KR20120030564A (ko) 2012-03-28
TW201120985A (en) 2011-06-16
JP2011139015A (ja) 2011-07-14
US20120118504A1 (en) 2012-05-17

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Application publication date: 20120523