TW201110221A - Wafer processing method - Google Patents

Wafer processing method Download PDF

Info

Publication number
TW201110221A
TW201110221A TW099121028A TW99121028A TW201110221A TW 201110221 A TW201110221 A TW 201110221A TW 099121028 A TW099121028 A TW 099121028A TW 99121028 A TW99121028 A TW 99121028A TW 201110221 A TW201110221 A TW 201110221A
Authority
TW
Taiwan
Prior art keywords
sapphire substrate
scribe line
along
wafer
layer
Prior art date
Application number
TW099121028A
Other languages
English (en)
Chinese (zh)
Inventor
Hitoshi Hoshino
Keiji Nomaru
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of TW201110221A publication Critical patent/TW201110221A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Dicing (AREA)
  • Laser Beam Processing (AREA)
  • Led Devices (AREA)
TW099121028A 2009-08-04 2010-06-28 Wafer processing method TW201110221A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009181505A JP2011035253A (ja) 2009-08-04 2009-08-04 ウエーハの加工方法

Publications (1)

Publication Number Publication Date
TW201110221A true TW201110221A (en) 2011-03-16

Family

ID=43746078

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099121028A TW201110221A (en) 2009-08-04 2010-06-28 Wafer processing method

Country Status (4)

Country Link
JP (1) JP2011035253A (ko)
KR (1) KR20110014102A (ko)
CN (1) CN101989640A (ko)
TW (1) TW201110221A (ko)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103311115A (zh) * 2012-03-16 2013-09-18 鑫晶钻科技股份有限公司 可辨识正反面的蓝宝石基板的制造方法
TWI618132B (zh) * 2011-11-11 2018-03-11 Disco Corp Optical component wafer processing method

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5833362B2 (ja) * 2011-07-05 2015-12-16 株式会社ディスコ サファイア基板の加工方法
JP2014079791A (ja) * 2012-10-17 2014-05-08 Disco Abrasive Syst Ltd レーザー加工方法
JP2017059685A (ja) * 2015-09-16 2017-03-23 株式会社ディスコ ウエーハの加工方法
JP6504977B2 (ja) * 2015-09-16 2019-04-24 株式会社ディスコ ウエーハの加工方法
JP2017059686A (ja) * 2015-09-16 2017-03-23 株式会社ディスコ ウエーハの加工方法
JP6521837B2 (ja) * 2015-11-05 2019-05-29 株式会社ディスコ ウエーハの加工方法
JP6576211B2 (ja) * 2015-11-05 2019-09-18 株式会社ディスコ ウエーハの加工方法
JP6576212B2 (ja) * 2015-11-05 2019-09-18 株式会社ディスコ ウエーハの加工方法
JP6721420B2 (ja) * 2016-06-02 2020-07-15 株式会社ディスコ 漏れ光検出方法
JP6745165B2 (ja) * 2016-08-09 2020-08-26 株式会社ディスコ ウェーハの加工方法
JP6821261B2 (ja) * 2017-04-21 2021-01-27 株式会社ディスコ 被加工物の加工方法
JP6837905B2 (ja) * 2017-04-25 2021-03-03 株式会社ディスコ ウエーハの加工方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004014938A (ja) * 2002-06-10 2004-01-15 Matsushita Electric Ind Co Ltd 半導体装置及びその製造方法
JP4767711B2 (ja) * 2006-02-16 2011-09-07 株式会社ディスコ ウエーハの分割方法
JP2008028347A (ja) * 2006-07-25 2008-02-07 Disco Abrasive Syst Ltd 脆化域形成方法
JP5225639B2 (ja) * 2007-09-06 2013-07-03 浜松ホトニクス株式会社 半導体レーザ素子の製造方法
JP5307384B2 (ja) * 2007-12-03 2013-10-02 株式会社ディスコ ウエーハの分割方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI618132B (zh) * 2011-11-11 2018-03-11 Disco Corp Optical component wafer processing method
CN103311115A (zh) * 2012-03-16 2013-09-18 鑫晶钻科技股份有限公司 可辨识正反面的蓝宝石基板的制造方法

Also Published As

Publication number Publication date
KR20110014102A (ko) 2011-02-10
CN101989640A (zh) 2011-03-23
JP2011035253A (ja) 2011-02-17

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