CN101989640A - 晶片加工方法 - Google Patents

晶片加工方法 Download PDF

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Publication number
CN101989640A
CN101989640A CN2010102463550A CN201010246355A CN101989640A CN 101989640 A CN101989640 A CN 101989640A CN 2010102463550 A CN2010102463550 A CN 2010102463550A CN 201010246355 A CN201010246355 A CN 201010246355A CN 101989640 A CN101989640 A CN 101989640A
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CN
China
Prior art keywords
sapphire substrate
wafer
spacing track
spacing
metamorphic layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2010102463550A
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English (en)
Chinese (zh)
Inventor
星野仁志
能丸圭司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of CN101989640A publication Critical patent/CN101989640A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Dicing (AREA)
  • Laser Beam Processing (AREA)
  • Led Devices (AREA)
CN2010102463550A 2009-08-04 2010-08-04 晶片加工方法 Pending CN101989640A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009181505A JP2011035253A (ja) 2009-08-04 2009-08-04 ウエーハの加工方法
JP2009-181505 2009-08-04

Publications (1)

Publication Number Publication Date
CN101989640A true CN101989640A (zh) 2011-03-23

Family

ID=43746078

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2010102463550A Pending CN101989640A (zh) 2009-08-04 2010-08-04 晶片加工方法

Country Status (4)

Country Link
JP (1) JP2011035253A (ko)
KR (1) KR20110014102A (ko)
CN (1) CN101989640A (ko)
TW (1) TW201110221A (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102861992A (zh) * 2011-07-05 2013-01-09 株式会社迪思科 蓝宝石基板的加工方法

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5886603B2 (ja) * 2011-11-11 2016-03-16 株式会社ディスコ 光デバイスウエーハの加工方法
CN103311115A (zh) * 2012-03-16 2013-09-18 鑫晶钻科技股份有限公司 可辨识正反面的蓝宝石基板的制造方法
JP2014079791A (ja) * 2012-10-17 2014-05-08 Disco Abrasive Syst Ltd レーザー加工方法
JP2017059685A (ja) * 2015-09-16 2017-03-23 株式会社ディスコ ウエーハの加工方法
JP6504977B2 (ja) * 2015-09-16 2019-04-24 株式会社ディスコ ウエーハの加工方法
JP2017059686A (ja) * 2015-09-16 2017-03-23 株式会社ディスコ ウエーハの加工方法
JP6521837B2 (ja) * 2015-11-05 2019-05-29 株式会社ディスコ ウエーハの加工方法
JP6576211B2 (ja) * 2015-11-05 2019-09-18 株式会社ディスコ ウエーハの加工方法
JP6576212B2 (ja) * 2015-11-05 2019-09-18 株式会社ディスコ ウエーハの加工方法
JP6721420B2 (ja) * 2016-06-02 2020-07-15 株式会社ディスコ 漏れ光検出方法
JP6745165B2 (ja) * 2016-08-09 2020-08-26 株式会社ディスコ ウェーハの加工方法
JP6821261B2 (ja) * 2017-04-21 2021-01-27 株式会社ディスコ 被加工物の加工方法
JP6837905B2 (ja) * 2017-04-25 2021-03-03 株式会社ディスコ ウエーハの加工方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1467863A (zh) * 2002-06-10 2004-01-14 松下电器产业株式会社 半导体晶片、半导体装置及其制造方法
US20080023456A1 (en) * 2006-07-25 2008-01-31 Yosuke Watanabe Method of forming embrittled areas inside wafer for division
CN101452828A (zh) * 2007-12-03 2009-06-10 株式会社迪思科 晶片的分割方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4767711B2 (ja) * 2006-02-16 2011-09-07 株式会社ディスコ ウエーハの分割方法
JP5225639B2 (ja) * 2007-09-06 2013-07-03 浜松ホトニクス株式会社 半導体レーザ素子の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1467863A (zh) * 2002-06-10 2004-01-14 松下电器产业株式会社 半导体晶片、半导体装置及其制造方法
US20080023456A1 (en) * 2006-07-25 2008-01-31 Yosuke Watanabe Method of forming embrittled areas inside wafer for division
CN101452828A (zh) * 2007-12-03 2009-06-10 株式会社迪思科 晶片的分割方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102861992A (zh) * 2011-07-05 2013-01-09 株式会社迪思科 蓝宝石基板的加工方法
CN102861992B (zh) * 2011-07-05 2016-03-23 株式会社迪思科 蓝宝石基板的加工方法

Also Published As

Publication number Publication date
TW201110221A (en) 2011-03-16
KR20110014102A (ko) 2011-02-10
JP2011035253A (ja) 2011-02-17

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WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20110323