TW201039062A - Photosensitive composition, photosensitive film, and method for forming permanent pattern - Google Patents

Photosensitive composition, photosensitive film, and method for forming permanent pattern Download PDF

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Publication number
TW201039062A
TW201039062A TW099107140A TW99107140A TW201039062A TW 201039062 A TW201039062 A TW 201039062A TW 099107140 A TW099107140 A TW 099107140A TW 99107140 A TW99107140 A TW 99107140A TW 201039062 A TW201039062 A TW 201039062A
Authority
TW
Taiwan
Prior art keywords
group
sensitizer
substituent
fluorenyl
photosensitive
Prior art date
Application number
TW099107140A
Other languages
English (en)
Chinese (zh)
Inventor
Kimi Ikeda
Hiroyuki Ishikawa
Daisuke Arioka
Original Assignee
Fujifilm Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujifilm Corp filed Critical Fujifilm Corp
Publication of TW201039062A publication Critical patent/TW201039062A/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/008—Azides
    • G03F7/012—Macromolecular azides; Macromolecular additives, e.g. binders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Materials For Photolithography (AREA)
  • Polymerisation Methods In General (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
TW099107140A 2009-03-25 2010-03-11 Photosensitive composition, photosensitive film, and method for forming permanent pattern TW201039062A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009075148A JP2010230721A (ja) 2009-03-25 2009-03-25 感光性組成物、感光性フィルム、及び、永久パターン形成方法

Publications (1)

Publication Number Publication Date
TW201039062A true TW201039062A (en) 2010-11-01

Family

ID=42771539

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099107140A TW201039062A (en) 2009-03-25 2010-03-11 Photosensitive composition, photosensitive film, and method for forming permanent pattern

Country Status (4)

Country Link
JP (1) JP2010230721A (ja)
KR (1) KR20100107397A (ja)
CN (1) CN101846883A (ja)
TW (1) TW201039062A (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI584083B (zh) * 2015-08-31 2017-05-21 台灣積體電路製造股份有限公司 用於微影製程之圖案化的方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102012206049A1 (de) * 2011-04-18 2012-10-18 GM Global Technology Operations LLC (n.d. Ges. d. Staates Delaware) Geschichtete strahlensensitive Materialien mit variierender Sensitivität
JP6359814B2 (ja) * 2013-09-17 2018-07-18 太陽インキ製造株式会社 感光性樹脂組成物、ドライフィルム、硬化物およびプリント配線板

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2658935A1 (de) * 1976-12-24 1978-07-06 Basf Ag Photopolymerisierbare masse und deren verwendung
JPS6093427A (ja) * 1983-10-28 1985-05-25 Nippon Kayaku Co Ltd 感光性樹脂の硬化方法
JPH01253731A (ja) * 1988-04-01 1989-10-11 Canon Inc 光重合性組成物および記録媒体
JP2004189695A (ja) * 2002-12-13 2004-07-08 National Institute Of Advanced Industrial & Technology クロマノン類またはチオクロマノン類の製造方法
JP4711886B2 (ja) * 2006-05-26 2011-06-29 富士フイルム株式会社 感光性組成物、感光性フィルム及びプリント基板
US7838197B2 (en) * 2006-11-15 2010-11-23 Taiyo Ink Mfg. Co., Ltd. Photosensitive composition
CN101183216B (zh) * 2006-11-15 2011-11-02 太阳控股株式会社 感光性组合物
TW200844652A (en) * 2006-11-15 2008-11-16 Taiyo Ink Mfg Co Ltd Process for forming solder resist film and photosensitive composition

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI584083B (zh) * 2015-08-31 2017-05-21 台灣積體電路製造股份有限公司 用於微影製程之圖案化的方法

Also Published As

Publication number Publication date
JP2010230721A (ja) 2010-10-14
CN101846883A (zh) 2010-09-29
KR20100107397A (ko) 2010-10-05

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