TW201235781A - Photosensitive composition, photosensitive solder resist composition, photosensitive solder resist film, permanent pattern, permanent pattern forming method and printed board - Google Patents

Abstract

A photosensitive composition contains a compound having a triazole ring and at least one of a group capable of reacting with free radicals and a group capable of reacting with a thermal cross-linking agent, a polymerizable compound, a photopolymerization initiator, and a thermal cross-linking agent. The better one further contains a polymer compound having a carboxyl group. The polymer compound having a carboxyl group is better a polyurethane resin acid which is an acid denaturation and contains an ethylene characteristic unsaturated group.

Description

201235781 41436pif VI. [Technical Field] The present invention relates to a photosensitive composition which can be suitably used in a solder resist or the like, a photosensitive solder resist composition using the same, and use thereof A photosensitive solder resist film of the photosensitive solder resist composition, and a high-definition permanent pattern (protective film, interlayer insulating film, solder resist, etc.), a method for forming the same, and a printed substrate. [Prior Art] In recent years, electronic devices, which are represented by mobile communication devices, require small, thin, lightweight, high-performance, high-performance, high-quality, high-reliability electronic component modules mounted in such electronic devices. It has also become small, Nanxiong, and gradual. In response to such a request, in recent years, a substrate for an electronic component module has gradually changed from a ceramic wiring substrate to a so-called printed substrate, and the ceramic wiring substrate is made of a ceramic such as an alumina sintered body. On the surface of the insulating substrate, copper or gold, which is a low-resistance metal, is used, and a wiring conductor layer is formed by a thin film forming method, and the insulating sheet includes glass fibers and helium oxygen which can further reduce weight and density. Resin. Further, the printed circuit board is gradually transitioning to a buildup wiring substrate which is more capable of achieving high-density wiring. Such a build-up wiring board can be produced, for example, by laminating a film containing a thermosetting resin on a substrate including glass fibers and epoxy, thermally hardening (iv) an insulating layer, and then performing carbon dioxide laser irradiation. An opening is formed thereon, and then the surface of the insulating layer is chemically roughened, and the coating is formed by using the electroless age and the electrolytic contact method, and the conductor layer is formed in the opening 4 201235781 41435pit and the (10) edge layer table_成崎料The layer is further formed by repeating the formation of the insulating layer and the wiring conductor layer. The thickness of the surface of the wiring substrate is 2G μηη~5() _ for the oxidation or corrosion of the wiring layer and the protection from the heat of the packaged electronic components on the wiring substrate. Solder resist = the solder resist layer - generally contains good susceptibility to the wiring conductor layer and the insulating layer (4), soluble light hybrid _, with a recyclable resin 'in order to make the "swelling coefficient slant layer plant layer The machine is filled with filler. However, as the solder resist layer 'in the general case, it is included in the test. The raw photocrosslinkable resin exhibits (4) miscellaneous and contains a recording or silk in order to form an opening in the solder resist layer by exposure and development. Therefore, there is a problem that the water absorption rate absorbs moisture in the air with high absorption, and the moisture causes the insulation layer f of the solder resist layer to be as low as _ below, and the wiring conductor layer is short-circuited, and the moisture causes corrosion to the wiring conductor layer. As a result, the electrical reliability of the wiring substrate is deteriorated. There is known a technique in which a solder resist layer contains a nitrogen-containing heterocyclic compound (imidazole compound-sit compound 4). According to this technique, although the heat resistance of the solder resist layer is changed, there is a problem that plating resistance is lowered. Further, when the smoothness of the side surface of the photoresist pattern is poor, a gap is formed between the solder and the side surface of the photoresist pattern during soldering, and the void expands due to heating, thereby causing an abnormality such as solder peeling, and light is present in the above technique. The problem that the resistance of the pattern (4) surface is not sufficient. Moreover, as a technique for using a triazole compound in a photosensitive composition, 2012 20128181 414J5pif, a sensory composition containing the following compounds is proposed: (Reporter) South molecular binder, which has a lighter weight than a double bond in a molecular towel ^ An average of at least one compound of the three-salt ring, a singularity of the monomer, and a photopolymerization initiator (4), as described in Japanese Patent Laid-Open No. Hei 6-43(10), the technique of the proposal, although the development residue is improved in adhesion. The composition, but there is a problem in the technique of the proposal: the insulation required for the solder resist and the smoothness of the side of the resist pattern are not obtained. Qiu Wang Wang Youyu

Therefore, the current state of the art is to provide a photosensitive composition excellent in smoothness on the side of the impurities, minerals, and photoresist. SUMMARY OF THE INVENTION An object of the present invention is to solve the problems described above and achieve the following objects. That is, an object of the present invention is to provide a photosensitive composition which is excellent in insulation, forge resistance, and smoothness of the side surface of a photoresist pattern. The method for solving the problem is as follows. That is, the photosensitive composition of the present invention contains a compound having at least one of a group reactive with a radical and a group reactive with a thermal crosslinking agent, and a triazole ring compound, a t-combination compound, Photopolymerization initiator, thermal crosslinking agent. [Effects of the Invention] According to the present invention, it is possible to solve the problems described above, and to achieve the above-mentioned photosensitive composition which can provide insulation, resistance (four), and smoothness of the surface of the yarn. [Embodiment] 6 201235781 41436pif (Photosensitive composition) The photosensitive composition of the present invention contains at least one of a group reactive with a radical and a group reactive with a thermal crosslinking agent, and a triazole ring. The compound, the polymerizable compound, the photopolymerization initiator, and the thermal crosslinking agent preferably contain a carboxyl group-containing polymer compound, and further contain other components as needed. <Compound having at least one of a group reactive with a radical and a group reactive with a thermal crosslinking agent and a triazole ring> as a base reactive with a radical and thermally crosslinkable At least one of the groups of the agent reaction and the compound of the triazole ring, if it is a compound having at least one of a group reactive with a radical and a group reactive with a thermal crosslinking agent, There is no special restriction, and it is suitable for selection as needed. Examples of the group reactive with a radical include an acryloxy group, a methacryloyloxy group, a vinyl phenyl group, an allyl group, and the like. The group reactive with the hot parent agent may, for example, be a thiol group, an amine group, a thiol group or the like. 1 The triazole ring may be any of a 1,2,3-triazole ring and a u,4_triazole ring. 1,2,3-triazole and ^4-triazole are compounds represented by the following structural formulas. 201235781 41436pif [Chemical 1] 12,3-tris- HI^N 1,2,4-triazole The at least one and the third having a radical reactive group and a reactive crosslinking agent The compound of the azole ring, in other words, a compound having at least one of a group reactive with a radical and a group reactive with a thermal crosslinking agent, is bonded to the dioxan ring. The bonding position of the organic group based on the tris-salt ring is not particularly limited, and may be appropriately selected as needed, and may be bonded to a nitrogen atom of the triazole ring or may be bonded to a carbon atom. The compound having at least one of a group reactive with a radical and a group reactive with a thermal crosslinking agent and a triazole ring is preferably a compound represented by the following formula (manufacture). [chemical 2] r

XfY L"η Formula (1) wherein, in the above formula (I), X represents a triazole ring. γ represents an organic group having at least one of a group reactive with a radical and a group reactive with a thermal crosslinking agent, which is a group of at least 8 201235781 4I4i〇pif. n represents an integer of 1 to 3. Further, when n is 2 to 3, Y may be the same or different. Further, in the above formula (I), the Y may be bonded to a nitrogen atom which is the triterpene ring of the X, or may be bonded to a broken atom. The η in the above formula (I) is preferably 1 to 2 Å and more preferably 2. If the η is 2, it is advantageous in terms of insulation. The oxime in the above formula (I) is preferably a group represented by the following formula (H). In the above formula (ID, Y1 represents an m+1 valent organic group having a carbon number of 2 to 25. & represents an anthracenyl group, an acryloxy group, and a mercapto propylene group. In the case of m, the A may be the same or different. The m+1 organic group having a carbon number of 2 to 25 is not particularly limited. It is preferable to select as needed, for example, the carbon number of at least any of the lining, the hetero bond, the vinegar bond, and the thiourea bond is 2 to 25 (4) and the carbon number of the organic group is preferably 2 ~2G, more preferably 2=5. The household has at least one of the radicals reactive with the radical and the base of the servant & responsive to, the reaction, the molecular weight of a compound There is no particular limitation 'visible 4 (four) should be selected, the face is 100~800. , Wen Jia's 9 201235781 41436pif as at least one of the bases capable of reacting with a radical and reacting with a thermal crosslinking agent Specific examples of the compound of the triazole ring include, for example, a compound represented by the following formula.

201235781 41430pit [Chemical 5]

a content of a compound having at least one of a group reactive with a radical and a group reactive with a thermal crosslinking agent and a triple π ring - the group reactive with a radical and thermally crosslinkable The content of at least one of the group of the agent reaction and the compound of the triazole ring in the photosensitive composition is not particularly limited, and may be appropriately selected as needed, with respect to the solid matter of the 11 201235781 41436pif photosensitive composition. And t, preferably 1·〇wt%~20 wt/〇' is more preferably 5 wt%~1〇 plus %. If the content is less than 1 〇 Wt/ο贝|J, there is a phenomenon that sufficient insulation cannot be exhibited; if it exceeds Wt. /: ‘There is a collar that is resistant to touch. If the content is in a better range, it is advantageous in terms of both heat resistance and insulation. <Polymerizable compound> The polymerizable compound is not particularly limited and may be appropriately selected as needed, and is preferably a compound having at least one filament-addable group in the molecular towel. More preferably, such a compound is at least one selected from the group consisting of a (fluorenyl)propenyl group. Further, the polymerizable compound is a compound different from the compound having at least one of a group reactive with a radical and a group reactive with a hot parent. The monomer having a (fluorenyl) acryl group is not particularly limited and may be appropriately selected as needed, and examples thereof include a polyethylene glycol mono group (IV) and a polypropanol mono(indenyl) acrylate. Monofunctional propylene or monofunctional methacrylic acid such as (meth)acrylic acid phenoxyacetic acid; polyethylene glycol di(meth) acrylate, polypropylene glycol di(meth) acrylate, trishydroxy Mercaptoethane tris(fluorenyl) acrylate vinegar, trimethyl methacrylic acid tris(methyl) acrylate acid, trimethylol propyl bis(meth) acrylate vinegar, neopentyl glycol (mercapto) acrylic acid vinegar, pentaerythritol tetrakis(meth)acrylic acid vinegar, pentaerythritol tris(mercapto)propyl vinegar vinegar, dipentaerythritol hexahydrate (methyl ketone, diquaternary pentoxide penta(methyl) propionate, Hexanediol di(meth)acrylic acid, 2, 3, pentyl dimethanol, di(indenyl) propylene, tris(tetra)propanyl tris(propylene oxypropyl)ether, tris (propylene 12 201235781) 41436pif oxiranyl ethyl) isocyanurate, tris(propylene methoxyethyl) cyanurate, glycerol tri(meth) acrylate, trimethylolpropane or propylene A polyfunctional alcohol such as an alcohol or a bisphenol is subjected to an addition reaction of ethylene oxide or propylene oxide, followed by (meth)acrylation, Japanese Patent Publication No. 48_417〇8, and Japanese Patent Publication No. 50- Japanese Patent Publication No. Sho. Polyester acrylates described in each of the publications of Japanese Patent Publication No. Sho 52_3〇49〇, and the like, and polyfunctional acrylates such as epoxy acrylates which are reaction products of epoxy resins and (meth)acrylic acid or More preferably, among these monomers, dicyclopentyl decyl diol di(mercapto) acrylate, trihydroxy hydrazine propane tri (meth) acrylate, pentaerythritol tetrakis (mercapto) propylene g Pent (pentaerythrit〇i tetra(meth) acrylate ), pentaerythritol hexa(meth) acrylate, dipentaerythritol penta (indenyl) acrylate. - content of polymerizable compound _ the polymerizable compound is sensitized Sexual composition There is no particular limitation on the content of the medium. (4) It is preferred to select the solid matter of the photosensitive composition, preferably 2 wt% to 5 wt%, more preferably 3 wt/o. 40 wt%, particularly preferably 4 wt% to 35 wt%. If the content of the polymerizable compound is from 2 wt% 'there is a phenomenon that cannot be deviated; when the right is more than 50 wt%, there is a poor resistance to cracking. On the other hand, when the content of the polymerizable compound to be returned is the above-mentioned hiding property, it is advantageous in terms of improvement in pattern formability and crack resistance. 13 201235781 41436pif <Photopolymerization initiator> The photopolymerization initiator is not particularly limited as long as it has the ability to start the polymerization of the polymerizable compound, and may be, for example, a toothed hydrocarbon derivative, a phosphine oxide or a hexaaryldiimidazole. , biological, organic peroxides, thio compounds, ketone compounds, f salt, ketones, etc. The hydrazine derivative may, for example, be a derivative having a triazine skeleton, a derivative having a oxadiazole skeleton, or the like. /,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, It is desirable to select 'for example, as quoted by Ruolin et al., and: Bulletin (Bull. Chem. Soc. Japan), 42, 2924 (1969), the compound contained in the British Patent 138. =, 曰 专利 专利 昭 53 53 53 53 53 53 53 53 53 53 53 53 53 53 53 53 53 53 53 53 53 53 53 53 53 53 53 53 53 53 53 53 53 53 53 53 53 53 53 53 53 53 53 53 53 53 53 53 53 53 53 53 53 53 53 53 53 53 53 53 53 53 53 53 53 53 The compound described in Japanese Patent Laid-Open No. Hei. No. 62-58241, the entire disclosure of which is incorporated herein by reference. No. **; such as: ΪΞίΓΐ (°xadiazc&gt;le) skeleton of hydrocarbon derivatives, etc. The compound described in the specification of the National Patent No. 4,212,976 is not particularly preferred as the oxime derivative. For example, the compound of the Japanese Patent Laid-Open No. 201235781 4J436pif 嶋 嶋 尹 尹 尹. For example: :=::=Restriction 'Selected as appropriate, as described in the paragraph::;, 2: The paragraph of the tactile bulletin ", the photopolymerization initiator other than the above may be exemplified by the Japanese side. Paragraph or photoreceptor: Exposure sensitizer for exposure of the photosensitive layer. Addition of sensitization or purple agent to the 4th ray _ _: According to the visible light line as a light irradiation method described later; It is suitable for selection by shooting, etc., and he becomes an excited state due to an active energy ray, and interacts with, for example, a radical generator, an acid generator, etc., to generate a free radical such as a radical. The sensitizer is not particularly limited, and may be appropriately selected as needed. For example, the compound contained in the paragraph "〇〇89" of the Japanese Patent Laid-Open Publication No. 7-2_ is exemplified. The combination of the photopolymerization initiator and the sensitizer is not particularly limited, and may be selected as appropriate. For example, the electron mobility type initiating system described in Japanese Patent Laid-Open No. 305734 Supplying initiator and sensitizing dye, (2) electron-withdrawing (four) initiator and sensitizing dye, (3) electron-donating initiator, sensitizing dye and electron-withdrawing initiator (Sancha starting system)] And so on. 15 201235781 41436pif The content of the sensitizer is not particularly limited, and it is preferable to select 'preferably 〇wt% to 30 wt%' relative to the solid matter of the photosensitive composition as needed. It is 0.1 wt% to 20 wt%, and particularly preferably 〇2 wt% to 10 wt%. If the content of the sensitizer is less than 5% by weight, the sensitivity to the active energy ray is lowered, the exposure process takes time, and the productivity is lowered; if it exceeds 30 wt%, it is present at the time of storage. The phenomenon that the sensitizer is extracted from the photosensitive light. The photopolymerization initiator may be used singly or in combination of two or more. Specific examples of the photopolymerization initiator include a composite photoinitiator, a hexaaryl-imidazole compound, a titanocene, etc., which are compatible with laser light having a wavelength of 405 nm in the exposure described later. The composite photoinitiator is a combination of a phosphine oxide, an α-aminoalkyl hydrazine, a halogenated hydrocarbon compound having a triazine skeleton, and an amine compound as a sensitizer. - the content of the photopolymerization initiator - the content of the photopolymerization initiator in the photosensitive composition and the limit is 'optional" as needed, relative to the solidity of the photosensitive group Preferably, 〇5~such as wt%, better

Wt / ° 15 Wt%, particularly good is 1 wt% ~ 10 wt ° /. . If the photopolymerization content is less than G, 5 wt%', the exposed portion is developed: = if it is more than 2% by weight, the heat resistance is lowered: the content of the initiator in the range is In the case of the above-mentioned special, it is advantageous for the bribe and the heat resistance. 1 16 201235781 414J0plt &lt;Hot crosslinking agent&gt; The thermal crosslinking agent is not particularly limited, and may be appropriately selected as needed, preferably. It is a compound having at least one functional group selected from the group consisting of a cyclic ether group, a blocked isocyanate group, an oxazolyl group, and an ethylene carbonate group. Examples of the thermal crosslinking agent include a compound having a cyclic ether group, a compound having a blocked isocyanate group, a compound having an oxazolyl group, a compound having an ethylene carbonate group, and the like. Examples of the compound having a cyclic ether group include a compound having an oxirane group, a compound having an oxypropylene group, and the like. The compound having an ethylene oxide group may, for example, be an epoxy compound having at least two oxirane groups in one molecule. The compound having an oxetane group may, for example, be an epoxy oxime compound having at least 2 propylene oxide filaments in one molecule (d). The epoxy compound is not particularly limited, and may be appropriately selected as needed, and examples thereof include a dinonylphenol type or a biphenyldiol type epoxy resin (YX4_; manufactured by Mitsubishi Chemical Corporation) or the like, or a mixture thereof. Heterocyclic epoxy resin having an isocyanurate skeleton or the like ("TEpic; 曰 3 3 i 公 gong! 1 manufactured", "Araldite PT810; Ciba refined chemical limited t 5 ^ 4", etc.), bisphenol Epoxy resin, novolac type epoxy resin: epoxy resin ("EP〇t〇hto YDF-m, neodymium iron chemistry; 2"), hydrogenated bisphenol A epoxy resin, Glycidylamine; Ethyl ureia type epoxy resin, alicyclic ring (10) grease, trihydroxy epoxy resin, (iv) s type epoxy resin, double A secret 4 wind resin, tetraphenyl phenyl bromide epoxy Resin, phthalic acid 17 201235781 41436pif glycidyl ester resin, tetraglycidyl dinonyl phenol ethane resin, epoxy resin containing naphthyl group ("ESN-190, ESN-360; manufactured by Nippon Steel Chemical Co., Ltd. "HP-4032, EXA-4750, EXA-4700; manufactured by DIC", etc.), epoxy resin with dicyclopentadiene skeleton ( rHp_72〇〇, ΗΡ-7200Η; manufactured by DIC, etc.), glycidyl methacrylate copolymer epoxy resin (“CP-50S, CP-50M; manufactured by Nippon Oil Co., Ltd.”, etc.), 裱己基马莱醯亚Copolymer epoxy resin of amine and glycidyl methacrylate. These epoxy compounds may be used singly or in combination of two or more. There is no particular limitation on the content of the sputum in the smearing, and it may be appropriately selected as needed. For example, the polyfunctional propylene oxide described in the paragraph "0096" of the Japanese Patent Publication No. 2〇〇7_2〇3〇 can be cited. Compounds, etc. The compound having a blocked isocyanate group is not particularly limited, and may be appropriately selected. For example, a bleck agent may be exemplified by a dimerization of a bbek agent. Further, the compound obtained can be, for example, a block polyisocyanate or the like described in "The lion's liver sputum" &amp; Suitable = with compound: the compound of the oxazolyl group is not particularly limited, and may be exemplified by the use of a non-saturated monomer having a base as needed.

Commercially available products can be used as the compound having a base. 00 = 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 The acrylic resin having an ethylene carbonate group, for example, a copolymer containing a carbonate group described in JP-A-1-146968. These compounds may be used alone or in combination of two or more. Among these compounds, the compound having an oxiranyl group is preferred in terms of smoothness and insulation of the side surface of the pattern. - the content of the thermal crosslinking agent - the content of the hot parenting agent in the photosensitive composition is not particularly limited, and it may be desirable to select (in relation to the solid matter of the sensing composition) Preferably, it is 1 wt% to 5 wt%, more preferably 2 wt〇/〇~40 wt%, and particularly preferably 3 wt% to 3 wt%. When the content of the thermal crosslinking agent is less than 1% by weight, the heat resistance is deteriorated. When the content is more than 5% by weight, the developability or the crack resistance is deteriorated. On the other hand, if the cerium is in the above-mentioned range, the cured film can be formed with good sensitivity, and the cured film is also advantageous in terms of heat resistance and crack resistance. &lt;Polymer compound containing a carboxyl group&gt; The polymer compound having a carboxyl group is not limited as long as it is a polymer compound having a slow group, and may be appropriately selected as needed. For example, the acid-modified shell contains an ethylenically unsaturated group. The polyamine-based lysine, the acid-modified epoxy resin containing a ethylenically unsaturated group, an acrylic resin containing a ethylenically unsaturated group and a carboxyl group, a polyimide precursor, and the like. Among these compounds, 19 201235781 41436pif acid-modified polyaminocarbamic acid-containing acid having a 4-fold fine group is preferred in terms of excellent crack resistance. - the acid is modified to contain a polyunsaturated group of a polyamino phthalic acid from the resin, and the acid is modified to contain an ethylenically unsaturated group of a polyurethane carboxylic acid resin, if it has an acid group The polyamino phthalate resin having a carboxyl group and an ethylenically unsaturated group is not particularly limited and may be appropriately selected as necessary, and examples thereof include (1) polyamino phthalate having an ethylenically unsaturated group in a side chain. The resin, (11) a carboxyl group-containing polyurethane, and a polyurethane resin obtained by reacting a compound having an epoxy group and an ethylenically unsaturated group in the molecule. (1) Polyamine phthalate resin having an ethylenically unsaturated group in a side chain - the polyamino phthalate resin having an ethylenically unsaturated group in a side chain is not particularly limited, and may be optionally required For example, a compound having at least one of the functional groups represented by the following general formulae (1) to (3) in the side chain is exemplified. Ο II—X—C, c=c / R1 R3 / , R2 General formula (1) The R1 to R3 sub-domains represent a hydrogen atom in the formula (〇, or a monovalent group. 20 201235781 ^ι^οριι j said R Asia has no special system, which can be selected according to needs, such as two calves and atoms, or a substituent. In the aspect of free radical reactivity, it is better. Further, R and R3 are not particularly limited, and may be appropriately selected as needed. 'Individually, for example, a hydrogen atom, a halogen atom, an amine group, a slow group, a burnt oxygen nucleus, or a m a base, a base group which may have a substituent, a green which may have a substituent, an alkoxy group which may have a silk taken off, an aryloxy group which may have a substituent, or a substituent-based amine group, The green amine group which may have a substituent, the pyridyl acid group which has a substituent in the village, and the aryl group scale which has a silk take-up. In terms of high radical reactivity, the base papers are preferably a hydrogen atom, a carboxyl group, an alkoxy group, an alkyl group which may have a substituent, or an aryl group which may have a substituent. In the formula (1), X represents an oxygen atom, a sulfur atom, or _N(R)-', and Ri2 represents a hydrogen atom or a valence organic group. The above is not particularly limited and may be appropriately selected as needed, for example, Examples of the alkyl group which may have a substituent include a hydrogen atom, a mercapto group, an ethyl group, and an isopropyl group in terms of high radical reactivity. Here, it may be introduced. The substituent is not particularly limited and may be appropriately selected as needed, and examples thereof include an alkyl group, an alkenyl group, an alkynyl group, an aryl group, an alkoxy group, an aryloxy group, an atom, an amine group, and an alkylamino group. Arylamino, carboxyl, alkoxycarbonyl, sulfo, nitro, cyano, decylamino, alkylsulfonyl, arylsulfonyl, etc. 21 201235781 41436pif [化η

R8icir7 II 6 CIR 4 - 5 CCIC3 - R Formula (2) In the above formula (2), R4 to R8 each independently represent a hydrogen atom or a monovalent group. R4 to R8 are not particularly limited and may be appropriately selected as needed, and examples thereof include a hydrogen atom, a halogen atom, an amine group, a dialkylamino group, a thiol group, a decyl group, a thio group, a nitro group, and a cyano group. And an alkyl group which may have a substituent, an aryl group which may have a substituent, an alkoxy group which may have a substituent, an aryloxy group which may have a substituent, and an alkylamino group which may have a substituent Further, it may have an arylamino group having a substituent, an alkylphosphonium group which may have a substituent, an arylsulfonyl group which may have a substituent, and the like. In terms of high radical reactivity, preferred among these groups are a hydrogen atom, a carboxyl group, an alkoxycarbonyl group, an alkyl group which may have a substituent, and an aryl group which may have a substituent. Examples of the substituent which can be introduced include the same as those of the above formula (丨). Further, Y represents an oxygen atom, a sulfur atom, or -N (R12) _. The R12 is synonymous with the case of R12 of the above formula (1), and the preferred examples are also the same. [化8], 11 _z_

I - c = c General formula (3) R9 R10 22 201235781 41436pif In the above formula (1) +, R9 to R11 each independently represent a hydrogen atom or a monovalent group. The R is not particularly limited and may be appropriately selected as needed. For example, it may be a hydrogen atom or a filament which may have a substituent. In terms of radical reactivity, among these groups, a ruthenium atom or a ruthenium group is preferred. The RQ and R11 are not particularly limited and may be appropriately selected as needed, and examples thereof include a hydrogen atom, a (tetra) atom, an amine group, a dialkylamino group, a carboxyl group, an alkoxy group, a thiol group, a Schottky group, and a cyanogen group. a base group, an alkyl group which may have a substituent, an aryl group which may have a substituent, a substituent group which may have a substituent, an aryloxy group which may have a substituent, a silk amine group which may have a substituent, An arylamine group which may have a substituent, an alkylsulfonyl group which may have a substituent, an arylsulfonyl group which may have a substituent, and the like. In the case of high radical reactivity, preferred among these groups are a hydrogen atom, a carboxyl group, an alkoxycarbonyl group, an alkyl group which may have a substituent, and an aryl group which may have a substituent. Here, the substituent which can be introduced can be exemplified as the same as the above formula (1). Further, in the above formula (3), z represents an oxygen atom, a sulfur atom, N(R)_, or a phenylene group which may have a substituent. The R13 is not particularly limited, and may be appropriately selected as needed. For example, an alkyl group having a substituent may be mentioned. Preferred among these groups are a mercapto group, an ethyl group, and an isopropyl group in terms of high radical reactivity. The polyamino phthalate resin having an ethylenically unsaturated group in the side chain is a polyamino phthalic acid which is a basic skeleton represented by a reaction product of the following compound: a resin: a general formula ( 4) At least one of the diisocyanate compound represented by the formula and at least one of the diol compound 23 201235781 41436pif represented by the following formula (5). OCN-X°-NCO Formula (4) HO-Y°-〇H. ·· (5) In the above formula (4) and the formula (5), X0, Υ0 The divalent organic residue is independently represented. At least one of the diisocyanate compound represented by the above formula (4) or the diol compound represented by the formula (5) has the formula (1) to the formula (3). In the case where at least one of the groups is formed, a polyamino phthalic acid resin in which a group represented by the above formula (1) to formula (3) is introduced as a side chain is formed as the diisocyanate compound and the diol compound. reaction product. By the method, the substitution of the desired side chain and the introduction of the desired side chain after the reaction of the polyurethane resin can be more easily produced in the side chain, and the general formula (1) is A polyamino phthalate resin represented by the formula (3). The method of the present invention is not particularly limited, as shown in the following. Selection, for example, can be listed as "Hungry", Japanese Patent Special Open 2GG5-25G438 No. 24 201235781 41436pif Paragraph "0034" ~ Paragraph "0035" Ten compounds and the like. The monofunctional alcohol or the monofunctional amine compound having an ethylenically unsaturated group is not particularly limited and may be appropriately selected as needed, and for example, the paragraph "〇〇37" of the Japanese Patent Laid-Open Publication No. 2005-250438 ~ The compound described in paragraph "0040". Here, the method of introducing the ethylenically unsaturated group into the side chain of the polyurethane resin is not particularly limited, and may be appropriately selected as needed, and it is preferably used in the side chain to contain an ethylenically unsaturated group. A diisocyanate compound is used as a raw material for producing a polyamino phthalate resin. The diisocyanate compound is not particularly limited and may be appropriately selected as needed, and may be an addition reaction of a triisocyanate compound and a fluorene-equivalent mono-g-alcohol or a mono-functional amine compound having an ethylenically unsaturated group. The obtained diisocyanate compound is, for example, a compound having an ethylenically unsaturated group in a side chain as described in paragraph "0042" to paragraph "〇〇49" of the Japanese Patent Publication No. 2-5_25. The polyamino phthalate resin having an ethylenically unsaturated group in the side chain may be copolymerized from the viewpoint of improving compatibility with other components in the photosensitive composition and improving storage stability. A diisocyanate compound other than the diisocyanate compound containing an ethylenically unsaturated group. The isocyanate compound is not particularly limited and may be appropriately selected, and examples thereof include a diisocyanate compound represented by the following formula. ~ OCN-L -NCO · '' General formula (6) 25 201235781 41435plf In the above formula (6), U represents that it may have a preferred group, an aromatic group, an aryl group, an alkoxy group. , the letter of the base - 0 grease: family or aromatic hydrocarbon group. Li may also have any other functional group which does not interfere with the reaction, such as an s group, an amino ruthenate group, an anthranyl group or a ureido group, as needed. The diisocyanate compound represented by the above formula (4) is not prepared, and may be appropriately selected as needed, and examples thereof include dimerization of 2, 4-methyl 2: acid ester and 2, 4-toluene diisocyanate. Body, 2,6-Bu U ky 夕 ^氘~vw, 卜, p-xylylene diisocyanate, m-di-di-f-diiso-acid S, 4,4, · diphenyl m The second is the same as the purpose], 5 _ which is a diisocyanate compound such as sulphuric acid vinegar, 3,3'-dimethylbiphenyl _4,4, _ diisocyanate vinegar; Diisocyanate, trimethylylidene diisocyanate, leucine diisocyanate, dimer acid diisocyanate : aliphatic diisocyanate compound; isophorone diisocyanate, 4 曰 methyl bis (cyclohexyliso) An alicyclic diiso-compound such as cyanide (tetra)), methylcyclohexan-2,4 (or 2,6)'-, cyanocyanate, 1,3·(isocyanatemethyl)cyclohexene; A diisocyanate force such as a reaction product of a diol and a diisocyanate, such as a molar 1,3·butanediol and a 2 mol of toluene diisocyanate. These compounds may be used alone or in combination of two or more kinds of σ. The diol compound represented by the above formula (5) is not particularly limited, and may be appropriately selected as necessary, and examples thereof include a polyether diol compound and a negative a high molecular weight diol compound such as a phenol compound or a polycarbonate diol compound, a low molecular diol compound such as a diol or a neopentyl glycol; a diol compound having an ethylenic unsaturated 26 201235781 group; a diol compound or the like. Here, 'the method of introducing an ethylenically unsaturated group to the side chain of the polyamino phthalate resin' is used for producing a urethane in addition to the above-mentioned method, using a diol compound having an ethylenically unsaturated group in a side chain. The method of the raw material of the resin is also preferred. The diol compound having an ethylenically unsaturated group in the side chain may be, for example, a commercially available compound L such as trimethylolpropane monoallyl ether, and may also be exemplified by a halogenated diol compound or a triol compound. A compound which can be easily produced by reacting a compound such as an amine or a monool compound with a compound containing an ethylenically unsaturated group such as a carboxylic acid, an oxime chloride, an isocyanate, an alcohol, an amine, a thiol or a halogenated alkyl compound. The diol compound having an ethylenically unsaturated group in the side chain is not particularly limited, and may be appropriately selected as needed. For example, the paragraph "〇〇57" of the Japanese Patent Laid-Open Publication No. 5-250438- The compound described in "〇〇6〇", the paragraph of the Japanese Patent Laid-Open Publication No. 2〇〇5_25〇438, the "_5" to the paragraph "1", the tetracarboxylic acid by the diol compound A compound obtained by ring-opening an anhydride, a compound represented by the following paragraph (6), and a compound described in the paragraph "display" to paragraph 66 of the Japanese Patent Laid-Open Publication No. 2.25G438. Preferred among these compounds are the compounds described in the paragraph "0064" to "0066" of the Japanese Patent Laid-Open Publication No. Hei 2-5_25 438, which is represented by the following formula (G). 27 201235781 41436plf [Chemistry 9]

In the above formula (G), R1 to R3 each independently represent a hydrogen atom or a monovalent group 'A represents a divalent organic residue, and X represents an oxygen atom, a sulfur atom, or -N(R12)- The Ri2 represents a hydrogen atom or a monovalent organic group. Further, R1 to R3 and X in the above formula (G) are synonymous with R1 to R3 and X in the above formula (1), and preferred embodiments are also the same. By using a polyurethane resin derived from the diol compound represented by the general formula (G), the excessive molecular motion of the polymer main chain is inhibited by the sterically hindered second-order alcohol. The effect is that the film strength of the layer can be improved. The polyamino formate resin having an ethylenically unsaturated group in the side chain may be copolymerized, for example, from the viewpoint of improving compatibility with other components in the photosensitive composition and improving storage stability. A diol compound other than a diol compound containing an ethylenically unsaturated group in a side chain. The diol compound other than the diol compound containing an ethylenically unsaturated group in the side chain is not specifically required. [IV] Yilin, for example, a polyether diol compound, a polyester diol compound, and a polycarbonate may be mentioned. Glycolation 28 201235781 Compound, etc. Select the system, and it is appropriate to fall as needed. "=;?"_"=== The H-alcohol compound in the paragraph is not special, « ^ 2〇〇5,5〇T3:;t:;: ^"〇化合物 77^ Paragraph "0079", paragraph "_3" - paragraph "〇〇85" (5) ~ ^ and 胤 13 ~ No. 18 compounds and the like. The "stea vinegar diol compound is not particularly limited and may be appropriately selected as needed", for example, paragraph "0080" to paragraph "〇081" and paragraph "〇" of Japanese Patent Laid-Open Publication No. 2_5_25〇438 The compound described in ^^^~Νο·12 in 〇84". Further, in the synthesis of the polyamino phthalate resin having an ethylenically unsaturated group in the side chain, in addition to the above diol compound, a diol compound having a substituent which does not react with an isocyanate group may be used in combination. . The diol compound having a substituent which does not react with an isocyanate group is not particularly limited and may be appropriately selected as needed, and for example, the paragraph "0087" to the paragraph "〇〇" of the Japanese Patent Laid-Open Publication No. 2005-250438 The compound described in 88". Further, in the synthesis of the polyamino phthalate resin having an ethylenically unsaturated group in the side chain, in addition to the above diol compound, a diol compound having a thiol group may be used in combination. The diol compound having a hydrazine group is not particularly limited, and may be appropriately selected as needed. For example, a compound represented by the following formula (8) to formula (10) may, for example, be mentioned. 29 , 15 201235781 41436pif [化 10] ho-l9-c-l10-oh General formula (8) L11

COOH

H〇-L9-Ar~L10-〇H General formula (9)

COOH

HO-L9-N-L10-〇H

COOH Formula (10) In the above formula (8) to formula (10), R15 represents a hydrogen atom, and may have a substituent (for example, including a cyano group, a nitro group, a halogen atom ( -F, -Cb-Br, -I), -CONH2, -COOR16, -OR16, -NHCONHR16, -NHCOOR16, -NHCOR16, -OCONHR16 (here, R16 represents an alkane having a carbon number of 1 to 10 Å) An alkyl group, an aralkyl group, an aryl group, an alkoxy group or an aryloxy group of each group such as a group or a aryl group having a carbon number of 7 to 15; Preferred among these groups are a hydrogen atom, an alkyl group having a carbon number of ～8, and an aryl group having 6 to 15 carbon atoms. In the above formula (8) to formula (1〇), B9, [10, l11 may be eight = mesh = may be different, and may represent a single bond, and may also have a substituent (for example, ^, ke, fang) The base of the base, the gas-burning base, the base of the base, the divalent month of the aliphatic or aromatic hydrocarbon group. The bases of the β-mountain, the 20th pick-up idyllic gansu car have a good carbon number of one ~ The stretching base is read as 6 to 15 aryl groups, and more preferably, the carbon 201235781 414i0plt number is 1 to 8 stretching bases. Moreover, in the L9 to L11, it is also possible to have Other functional groups which do not react with isocyanate groups, such as, for example, a sulfhydryl group, an amino decanoic acid group, an amidino group, a gland group, a fluorenyl group. Alternatively, the R15, L' may also be used. In the above formula (9), Ar is not particularly limited as long as it is a trivalent aromatic hydrocarbon group which may have a substituent, and may be optionally used. The diol compound having a carbon number of 6 to 15 is preferably selected. The diol compound having a slow group represented by the above formula (8) to formula (10) is not particularly limited and can be visualized. Need and appropriate choice, examples Examples thereof include 3,5-dihydroxybenzoic acid, 2,2-bis(hydroxyindenyl)propionic acid, 2,2-bis(2-hydroxyethyl)propionic acid, and 2,2-bis(3-hydroxyl). Propyl) propionic acid, bis(hydroxyindenyl)acetic acid, bis(4-hydroxyphenyl)acetic acid, 2,2-bis(hydroxymethyl)butyric acid, 4,4-bis(4-ylphenyl) Valeric acid, tartaric acid, hydrazine, hydrazine-dihydroxyethylglycine, transylethyl)-3-refenyl-propionamide, etc. Due to the existence of such a ruthenium, a polyamine phthalate resin can be imparted. The characteristics such as hydrogen bonding property and alkali solubility are preferable in this respect. More specifically, the polyamino phthalate resin having an ethylenically unsaturated group in a side chain further has a carboxyl group in a side chain. The resin, more specifically, the ethylenically unsaturated group of the side chain is preferably 〇. 5 mmol/g to 3.0 mmol/g, more preferably 〇5 mmol/g to 2.7 mmol/g, particularly preferred. It is 0.75 mm 〇l / g to 2.4 mmol / g, and preferably has a carboxyl group in the side chain, and the acid value is preferably 2 〇 mg KOH / g to 120 mg KOH / g ' More preferably 30 mg KOH / g ~ 110 mgKOH/g ' is particularly preferably 35 mgKOH/g to 1 〇〇mgKOH/g. Further, the acid value can be, for example, according to JIS K0070 Whereas, 31 201235781 41436pif When the sample is not dissolved, dioxane or tetrahydrofuran or the like is used as a solvent. The polyurethane resin having an ethylenically unsaturated group in the side chain can be as follows Synthetic method: The above-mentioned diisocyanate compound and the diol compound are heated by a known contact with an activity corresponding to the reactivity of each aprotic solvent. The molar ratio of the isocyanuric acid vinegar and the diol compound (Ma: Mb) of the synthetic towel is not controlled, and may be appropriately selected as needed, preferably! :Bu 12: By treating with an alcohol or an amine or the like, a product having a desired physical property such as molecular weight or viscosity is synthesized in such a manner that the heterogeneous group is not left at all. Further, the polyamino carboxylic acid resin having an ethylenically unsaturated group in the side chain may be suitably prepared from a polyamido lysate having a terminal unsaturated group and a B-unsaturated group in the main chain. By virtue of the polymer terminal and the primary bond ethylenically unsaturated group, the photosensitive composition can be further advanced between the polyamino phthalic acid oleic acid ester having a side bond and an ethylenically unsaturated group, or __ethylidene The polyamine group fs of the unsaturated group can be high in resin, and the intensity of the photocured material is increased. As a result, in the lithographic printing = pure for the side chain having an ethylenically unsaturated group (IV), it provides a material excellent in toughness. The method of introducing a saturated base at the end of the polymer is described. That is, the isocyanate of the polymer end of the synthetic step towel having the above-mentioned polyaminocarbamate having an ethyl group in the side chain is used, and is treated with an alcohol or an amine or the like. The alcohol or the amine of the ethylenically unsaturated group may be used. / 32 201235781 414i〇pit As the compound, specifically, the same compound as the exemplified compound exemplified as the monofunctional alcohol or the monofunctional amine compound having an ethylenically unsaturated group can be mentioned. Further, from the viewpoints of easy control of the amount of introduction, increase in the amount of introduction, and improvement in the efficiency of crosslinking reaction, it is preferred to introduce an ethylenically unsaturated group into the polymer side chain as compared with the polymer terminal. . The ethylenically unsaturated group to be introduced is not particularly limited, and may be appropriately selected as needed. From the viewpoint of the formability of the crosslinked cured film, a propyl group, a methacryl fluorenyl group, an acryl fluorenyl group, The vinyl phenyl group is more preferably a methacryl fluorenyl group or an acryl fluorenyl group, and a methacryl fluorenyl group is particularly preferable in terms of both the formability of the crosslinked cured film and the original preservability. Further, the amount of the methacrylonitrile group introduced is not particularly limited, and may be appropriately selected as needed, and is preferably in terms of ethylenically unsaturated group equivalent: 0.05 mm 〇 1 /g 〜3. 〇mm 〇 1 / g More preferably, 〇5 jobs 疋mm〇1/g ' Particularly good is 〇.75 mm〇1/g~2 4 . · A method of introducing an ethylenically unsaturated group into a main chain, and having a vinyl group and a base = a method of synthesizing in the synthesis of a main chain resin; a diol compound of a polyamino phthalic acid ketone group is not particularly limited , = = = Sexually unsaturated, cis-2-butane is selected from the diol, and may be selected as an alcohol. Butene-1,4-monool, polybutadiene di- and poly-amino-methyl-resin are contained with the specific polyaminocarbamate 33 201235781 41436 pif acid vinegar resin. For example, the side chain has an ethylenic acid-ester which may be conjugated and/or a chain containing an amine phthalate resin. As a specific example of the above-mentioned (1) polyamine having an ethylenically unsaturated group in the side chain, the formic acid resin is exemplified, for example, the paragraph "0293" of the Japanese Patent Laid-Open Publication No. Hei. A polymer such as ρ ι ρ 3 所示 shown in "0310". Preferred among these compounds are the polymers of P-27 and P-28 shown in the paragraph "〇3〇8" and paragraph "0309". -- (ii) a polyamino phthalic acid having a slow-setting group, and a polyamino carboxylic acid resin obtained by inversely reacting a compound having an epoxy group and an ethylenically unsaturated group in the molecule - the carboxyl group-containing poly The polyamino phthalate resin obtained by reacting an amino phthalic acid ester with a compound having an epoxy group and an ethylenically unsaturated group in the molecule is a carboxyl group containing a diisocyanate and a diol having a carboxylic acid group as an essential component. A polyurethane resin obtained by reacting a polyamino phthalate with a compound having an epoxy group and an ethylenically unsaturated group in the molecule. A low molecular weight diol having a weight average molecular weight of 3 Å or less or a low molecular weight diol having a weight average molecular weight of 500 or more as a diol component may be added as a copolymerization component. By using the polyamino phthalic acid vinegar resin, it is excellent in stable dispersibility, crack resistance or impact resistance with an inorganic filler, and thus heat resistance, moist heat resistance, adhesion, mechanical properties, and electrical properties are improved. .

Further, the polyurethane resin has a COOH group interposed between a divalent aliphatic group having a substituent and a diisocyanate of an aromatic hydrocarbon, and a C atom and any one of N 34 201235781 41436 pif atoms. And a reaction product of two 〇11-based carboxylic acid-containing diols, which may be a necessary component, and may also have an epoxy group and an ethylenically unsaturated group in the molecule by the resulting reactant 盥--COO-bond. ^ A compound obtained by reacting a compound. Further, the polyamino phthalate resin may be a diisocyanate represented by the following formula (u) and a carboxylic acid group selected from the group consisting of the following formula (12_n to formula (12-3)). At least one of the alcohols is a product of an essential component, and a compound obtained by reacting a compound having an epoxy group and an ethylenically unsaturated group in the molecule represented by the following formula (m) to formula (1). 11] OCN-Ri-NCO General formula (11) l2 HO— R3 — C—R 4 —OH ψ General formula (12-1) COOH HO—R 3 —Ar— R 4 —〇 h i5 COOH General formula (12-2 HO—R3—N—r4—〇H COOH A divalent aliphatic or aromatic compound of the formula (12-3) (for example, preferably a silk, a base, an aromatic R-based watch, ί 35 201235781 41436pif) The R1 may also have any other functional group which does not react with the isocyanate group, such as an ester group, a urethane group, a guanamine group or a ureido group, as needed. In the formula -1), R2 represents a hydrogen atom, and may have a substituent (for example, including a cyano group, a di-branched group, a halogen atom (-F '-Cl, -Br, -I), -CONH2, -COOR6, , 0R6 -NHCONHR6, -NHC00R6, -NHCOR6, -OCONHR6, -CONHR6 (wherein "R6 represents a carbon number of 丨~chuan alkyl group, and a carbon number of 7 to D of a square alkyl group") An alkyl group, an aralkyl group, an aryl alkoxy group or an aryloxy group. Preferred among these groups are a hydrogen atom, an alkyl group having a carbon number of ～3, and a carbon number of 6 to 15 In the above-mentioned (12-1), the general formula (12-2), and the general formula (12 3), ^, ^, and r are the same or different, and each represents a single bond, and may have a substituent ( The females are the aliphatic or aromatic hydrocarbons of the silk, the aryl group, the aryl group, the alkoxy group, and the i group. The base papers preferably have a carbon number of ~2〇. The alkyl group has a carbon number of 〜15 aryl groups, and more preferably θ 2 is an alkyl group. Moreover, (4) R3, H have "have not reacted with isocyanine-based other官尔 i == base, lysyl, amino carboxylic acid acetate, decylamino, ureido, and the other. Also 'from the R2, R3, of the 'hydrocarbon: preferably expressed or substituted The number of 疋 slaves of the trivalent fangs is 6 to 15 aromatic groups. 36 20123 5781 414i0plt [Chemical 12] CH2=CRi4-COO-QH2=CRi4COO— Ri5- CH2==CR^4COO~ Ό

O

O

0 General formula (13-1) General formula (13-2) General formula (13-3) General formula (13-4) General formula (13-5) General formula (13-6) General formula (13-7) General formula (13-8) 37 201235781 41436pif [Chem. 13]

Rl4 01^2== CR-|4 CON—R15 CH OH

O general formula (13-9)

Ch^^CRwCOORis HO

CH2〇CO t&gt;° General formula (13-10)

CH Yan CR14COOR15 HO

ο ^16 CH== CRtj- C〇Ris〇*')p —CON RlS -〇-0000^-〇.0 General formula (13-ΐυ General formula (13-12) General formula (13-13) General formula (13-14) o

R15-0-(-C0R150-&gt;p-CONR16 Formula (13-15) ^16 Formula (13-16)

CH2=CR1i, CCX5-R15-0(C0R150-)---€0N

P I R15 o:

R15-Of cor15〇^一^CONR16 P wherein, in the above formula (13-1) to formula (13-16), R14 represents a hydrogen atom or a fluorenyl group, and R15 represents a carbon number of 1 to 10 The alkyl group, r16 represents a hydrocarbon group having a carbon number of 1 to 10. P represents an integer of 0 or 1 to 10. 38 201235781 4i4j〇pir The polyurethane resin is particularly suitable for the diisocyanate represented by the formula (il) and the compound of the formula (12_丨) to (12_3) At least the diol containing a carboxylic acid group is indicated! The reactants of the species are further reacted with a compound having one epoxy group and at least one (meth)propene in the molecule, as represented by the formula (1)-υ~(1).16). The obtained acid value is from 20 mgKOH/g to 120 mgK〇H/g of the soluble photocrosslinkable polyurethane resin. These polymer compounds may be used singly or in combination of two or more. a method for synthesizing a polyurethane resin obtained by reacting a carboxyl group-containing polyurethane with a compound having an epoxy group and an ethylenically unsaturated group in the molecule... as the polyamino phthalate The method for synthesizing the resin can be carried out by heating the above-mentioned diisocyanate compound and diol compound by adding a known catalyst having an activity corresponding to each reactivity to an aprotic solvent. Preferably, the diisocyanate and the diol compound used are 0-8: 1 to 1_2: 1. When an isocyanate group remains at the polymer terminal, it is treated by an alcohol or an amine. (C is not synthesized in the form of an isocyanate group. - Diisocyanate---- The diisocyanate compound represented by the above formula (11) is not particularly limited, and may be appropriately selected as needed, and for example, Japan The compound described in the paragraph "〇〇21" of the Japanese Patent Publication No. 2007-2030, etc., contains a diol having a tickic acid group... Moreover, the above formula (12-1) to the formula (12-3) (a) The diol compound to be repelled is not particularly limited, and may be appropriately selected as needed. For example, the compound described in Japanese Patent Laid-Open No. 〇〇47 can be cited. Nuro-... Low molecular weight diol having no carboxylic acid group _· The low molecular weight diol having no lysine group is not particularly limited, and may be appropriately selected as needed. For example, Japanese Patent Laid-Open No. 2 (10) 7 As stated in the paragraph "0048" of the Gazette And the copolymerization amount of the diol containing the ketone is preferably 95 m〇l% or less in the low molecular weight diol, more preferably 8 〇m〇1% or less. 50 mol% or less. If the copolymerization amount exceeds % m〇i%, there is a phenomenon that a urethane resin having good developability cannot be obtained. As the (ii) carboxyl group-containing polyaminocarboxylic acid Specific examples of the polyurethane resin obtained by reacting an ester with a compound having an epoxy group and an ethylenically unsaturated group in the molecule include, for example, paragraph "0314" of JP-A-2007-2030. ～ ～ U U 」 」 U U U U U U U U U U U U U U U U U U U U U U U U U 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 It is glycidyl methacrylate, _3,4_epoxycyclohexylmethyl acrylate (trade name: Cycl〇mer A400 (manufactured by Daicel Chemical Industries, Ltd.)), methyl acetoacetate-3,4-epoxy a polymer obtained by using cyclohexylmethyl ester (trade name: Cyd〇mer M4 (manufactured by Daicel Chemical Industries, Ltd.)) • Acid-modified weight average molecular weight of a polyurethane resin containing an ethylenically unsaturated group - the acid modified polyurethane resin containing an ethylenically unsaturated group 201235781 4143 (&gt;pit * The average molecular weight of the heavy star is not particularly limited. It can be selected as needed. It is 2, 〇00~60, _, more preferably 3, _~5〇, _, especially 3,000~30,000. If the weight average molecular weight is less than 2, 〇〇〇, there is a phenomenon that a sufficient low modulus of elasticity of the cured film at a high temperature cannot be obtained; if it exceeds 60, 涂布, there is coating suitability and developability. The phenomenon of deterioration. On the other hand, when the weight average molecular weight is 2 and 〇〇〇6〇〇〇〇, when the photosensitive composition is used in a photosensitive solder resist, it is excellent in crack resistance and heat resistance. The non-image portion of the alkaline developer is excellent in developability. Further, the weight average molecular weight may be, for example, a high-speed GpC apparatus (HLC_8〇2A manufactured by Toyo Soda Industrial Co., Ltd.), a wt5 wt% tetrahydrofuran (THF) solution as a sample solution, and one TSKgel HZM column for the column. -M 'Injected into a 200 pL sample, dissolved by the THF solution '25. (: measured by a refractive index detector or a uv detector (detection wavelength of 254 nm). - Acid-modified acid value of a polyurethane resin containing an ethylenically unsaturated group. The acid modification contains The acid value of the ethylenically unsaturated group-containing polyamino phthalate resin is not particularly limited and may be appropriately selected as needed, and is preferably 2 〇 mgKOH/g to 120 mgKOH/g, more preferably 30 mgKOH/g. ～11〇mgKOH/g, particularly preferably 35 mgKOH/g to 1〇〇mgK〇H/g. If the acid value is less than 20 mgKOH/g, the developability may be insufficient. In the case of mgKOH/g', the development speed is too high and it becomes difficult to control development. 41 201235781 41436pif Further, the acid value can be measured, for example, in accordance with JIS K〇〇7〇, wherein the sample is not dissolved. In the case of using dioxane or tetracene as a solvent. - Acid-modified ethylenically unsaturated group equivalent of polyamino phthalate resin containing ethylenically unsaturated group - said acid modification contains ethylenically unsaturated group There is no restriction on the ethylenically unsaturated base equivalent of the polyamino phthalate resin. Preferably, it is preferably 0.05 mm 〇 l / g 〜 3 〇 mm 〇 1 / g, more preferably 〇 5 mmol / g ~ 2.7 mmol / g, particularly preferably 〇 75 mm 〇 1 / g ~ 2 * mmol/g. If the ethylenically unsaturated group equivalent is less than 〇〇5, the heat resistance of the cured film may be poor; if it exceeds 3 〇mm〇1/g, the brittleness of the cured film may be improved. The ethylenically unsaturated group equivalent can be determined, for example, by measuring the bromine number. The bromine number can be measured, for example, according to JIS K26〇5. - Acid-modified epoxy resin containing an ethylenically unsaturated group. The acid-modified epoxy resin containing an ethylenically unsaturated group is particularly limited, and may be appropriately selected as needed. For example, the reaction of the product (1) with the polyacid liver (4) described in Japanese Patent No. 28m59 can be cited. An acid-modified epoxy resin containing an ethylenically unsaturated group, the product (I) being an epoxy compound having at least two epoxy groups in one molecule (a) and having at least one molecule Two or more compounds (b) which contain one reactive group other than a hydroxyl group which reacts with an epoxy group and contain B The product of monounsole (e) of the unsaturated group; the acid modification of the product (^) and the polyacid needle (d) and the monoisocyanate containing the ethylenically unsaturated group (42) 42 201235781 41436pif product An epoxy resin containing an ethylenically unsaturated group, wherein the product (I) is an epoxy compound (a) having at least two epoxy groups in one molecule and at least two or more in one molecule. A product of a hydroxyl group and a compound (b) which reacts with an epoxy group and which has a reactive group other than a hydroxyl group, and a monocarboxylic acid (c) which contains an ethylenically unsaturated group. Commercially available products can be used as the epoxy resin containing an ethylenically unsaturated group. The commercial product of the acid-modified epoxy resin containing an ethylenically unsaturated group may, for example, be a ZFR series, a CCR series or a pCr series (manufactured by Sakamoto Chemical Co., Ltd.). _Acrylic acid resin containing an ethylenically unsaturated group and a thiol group _ The acrylic resin containing an ethylenically unsaturated group and a carboxyl group is not particularly limited, and may be appropriately selected as needed, for example, by (meth) a propionic acid obtained by adding a (meth)propionate having an epoxy group to a partial acid group of a copolymer obtained from an acrylate and a compound having an ethylenically unsaturated group and having at least an acid group Resin. Examples of such an acrylic resin include a copolymer obtained from a (fluorenyl) acrylate and a compound having an ethylenically unsaturated group and having at least one acid group, as described in JP-A-2009-86376. A modified copolymer obtained by adding glycidyl (meth)acrylate to a part of the acid group. A commercially available product can be used as the acrylic resin containing an ethylenically unsaturated group and a carboxyl group. The commercially available product of the acrylic resin containing an ethylenically unsaturated group and a carboxyl group is exemplified by Cyclomer P 200HM (manufactured by Daicel Chemical Industries, Ltd.). 43 201235781 41436pif - Polyimine precursor - The polyimine precursor is not particularly limited, and may be appropriately selected as needed. For example, the polyimine described in JP-A-2010-6946 can be cited. Precursors, etc. - content of a compound containing a thiol group - the content of the polymer compound containing a carboxyl group in the photosensitive composition is not particularly limited, and may be appropriately selected as needed, with respect to the photosensitive composition The solid content is preferably 5 wt% to 8 wt%, more preferably 20 wt ° / 〇 〜 75 wt ° / 〇, particularly preferably 3 〇 wt % 〜 7 〇 wt 〇 / 〇 . When the content is less than 5 wt%, the crack resistance may not be satisfactorily maintained; if it exceeds 80 wt%, the heat resistance may be lowered. On the other hand, if the content is the above-mentioned excellent method, it is advantageous in terms of both good crack resistance and heat resistance. &lt;Other components&gt; Examples of the other components include a thermoplastic elastomer, a thermosetting accelerator, an adhesion promoter, a thermal polymerization inhibitor, an inorganic filler, a colorant, an organic solvent, a thixotropic imparting agent, and an antifoaming agent. Homogenizer, etc. - A thermoplastic elastomer (elastomer) - By adding the thermoplastic elastomer to the photosensitive composition, it is possible to impart heat resistance, visibility and strength to the composition of the thief. The thermoplastic elastomer is not particularly limited, and may be, for example, a styrene-elastomer, an olefin-based elastomer, an amine-based elastomer, an elastomer-based elastomer, a polyamine-based elastomer, or a polyamine-based elastomer. A bismuth acrylate bismuth, a poly-wei elastomer, a resin modified epoxy resin, and the like. The 44 201235781 41436ριί dimorphizer may be used alone or in combination of two or more. The general situation: the heat contains hard = ingredients and soft segment components, - and _ sex; ^ heat resistance and Wei (four) help, the latter on the softness μ help. Moreover, the preparation of the elastomer is required to be "H", and the quality of the elastomer is not particularly limited. For example, in the production efficiency of the development step, she is machine-specific or The styrene-based elastomer, the olefin-based elastomer elastomer, the poly-branched elastomer, the tilting amine car 曰糸 、 、, transgenic body, acrylic acid elastic n_ body, rhyme For the epoxy, for example, the paragraph "_7" of the Patent Publication No. 45 of the Patent Publication No. 45 - "The one described in 〇〇歹f." UU95" - the content of the thermoplastic elastomer __ the thermoplastic elastomer The content in the photosensitive composition is not particularly limited. It is suitably selected as needed, and is preferably from 1 Wt% to 50 Wt%, more preferably relative to the solid content of the photosensitive composition. It is 2 wt/〇20 wt/o 'extra good is 3 wt%~1〇wt〇/. . If the content is less than 1 Wt/°, there is a phenomenon that the crack resistance is poor; if it exceeds 50 wt °/〇, there is a phenomenon that the unexposed # is not dissolved by the sputum sputum. On the other hand, it is advantageous in terms of improving developability or crack resistance in the case where the ruthenium containing the right side is within the above-mentioned range. - The thermosetting accelerator _ The thermosetting accelerator is not particularly limited, and may be appropriately selected as necessary, and examples thereof include a compound described in paragraph "0101" of JP-A-2007-2030. 45 201235781 41436pif - content of thermosetting accelerator __ The content of the thermosetting accelerator in the photosensitive composition is not particularly limited, and may be appropriately selected as needed, with respect to the photosensitive composition In the case of a solid, it is preferably wt1 wt% 〜2〇%, more preferably 〇·05 wt% 〜15 wt%, and particularly preferably 〇Λ wt% 〜1 〇 wt%. When the content of the thermosetting accelerator is less than 0.01% by weight, the phenomenon of strong sturdiness of the cured film may not be exhibited. When it exceeds 20% by weight, the storage stability of the photosensitive composition may be deteriorated. On the other hand, when the content of the thermosetting accelerator is within the above-described range, it is advantageous in terms of improving the storage stability of the photosensitive composition and the physical properties of the cured film. - the adhesion promoter - the adhesion promoter is not particularly limited, and may be appropriately selected as needed. For example, a compound described in paragraph "0108" of JP-A-2007-2030 may be mentioned. The content of the adhesion promoter - the content of the adhesion promoter in the photosensitive composition is not particularly limited, and may be appropriately selected as needed, and is preferably 'relative to the solid matter of the photosensitive composition. It is 0.01 Wt%~20 wt%, more preferably 0.05 wt%~15 wt% 'extra good is 〇.1 wt%~10 wt%. When the content of the adhesion promoter is less than 0.01% by weight, the film may not exhibit the fineness of the cured film. When it exceeds 20% by weight, the storage property of the photosensitive composition may deteriorate. On the other hand, when the content is within the above-described range, it is advantageous in terms of improving the storage stability of the photosensitive composition and the physical properties of the cured film. For example, the compound described in "0113" is preferably selected from Japan I. Paragraph 4 of the publication - Inorganic filler - The inorganic filler is not particularly preferred: _ preferably having an average particle diameter of (9) 5 = 3 and optionally emulsified hetero. When the inorganic filler contains a dioxygen group, the hardening resistance can be improved, and the dispersibility with the money-containing high-content compound becomes good, and the photosensitive composition nk can be better in the range. Good coating suitability. '','' The cerium oxide in the cerium oxide particles is not particularly limited and may be appropriately selected as needed, and examples thereof include gas phase cerium oxide, crystalline cerium oxide, and molten cerium oxide. The average particle diameter (d50) of the cerium oxide particles is not particularly limited, and may be appropriately selected as needed. Preferably, 0.05 μm to 3·0 μηι, more preferably 0.1 μπ1 to 2.5 ' is particularly preferable. 〇1 gm~2.〇μη. If the average particle diameter (d50) of the cerium oxide particles is less than 〇.5 μιη, the coating viscosity becomes south; if it exceeds 3.0 Μ·111, the smoothness cannot be maintained. On the other hand, if the average particle diameter (d50) of the oxidized particles is within the above-mentioned range, it is advantageous in terms of coating viscosity and flatness of the cured film or heat. Further, the average particle diameter (d50) of the 'one gasification second particle is defined by the particle size of 50% of the cumulative value expressed as a cumulative (accumulated) weight percentage, and is defined as 47 201235781 41436pif, which is d50 (D50), etc. For example, a dynamic light scattering photometer (trade name: DLS7000, manufactured by Otsuka Electronics Co., Ltd.) is used, and the measurement principle is a dynamic light scattering method, and the size distribution analysis method is performed by an accumulation method and/or a profile method. - the content of the inorganic filler - the content of the inorganic filler in the photosensitive composition is not particularly limited 'optional as needed, and is preferably relative to the solid matter of the photosensitive composition It is [wt%~6〇, more preferably 1〇

Wt%~60 Wt%, particularly preferably 15 wt%~60 wt%. If the content of the inorganic filler is less than 1 wt%, the heat resistance is poor, and if it exceeds 6 Å, the pattern formation property is poor. On the other hand, if the content is the above-mentioned excellent method, it is advantageous in terms of improving pattern formability and heat resistance. - Coloring agent - The coloring agent is not particularly _, and may be appropriately selected as needed, and may be selected from a user's color or a suitable dye from a known transfer. The coloring pigment is not particularly limited, and may be selected as appropriate in the paragraph of the Japanese Patent Laid-Open Publication No. 2-2_, the contents of the compound contained in the photosensitive composition. The organic solvent is not particularly limited, and may be appropriately selected as needed. For example, the Japanese Patent Application No. Hei 11-240930 may be cited as a paragraph 48 201235781 41430pit. The compound described in "〇〇43", the compound described in the paragraph "0121" of JP-A-2007-2030, and the like. - content of the organic solvent - the content of the organic solvent in the photosensitive composition is not particularly limited, and may be appropriately selected as needed, and is preferably relative to the solid matter of the photosensitive composition. 1 wt 〇 / 0 〜 8 〇 wt%, more preferably 2 wt% ~ 70 wt%, particularly preferably 3 wt% ~ 6 〇 wt%. When the content of the organic solvent is less than 1% by weight, the viscosity of the composition is high and the formation of the coating film becomes difficult. If it exceeds 80 wt〇/〇, the control of the desired film thickness becomes difficult. On the other hand, when the content of the organic solvent is within the above-described range, it is advantageous in terms of suitability for coating film production. (Photosensitive solder resist composition) The photosensitive solder resist composition of the present invention contains the photosensitive composition of the present invention. According to the sensitizing (four) composition of the present invention, it is possible to obtain a solder resist having excellent insulating properties, smoothness of the side of the pattern, and excellent mineral resistance. (Photosensitive solder resist film) The photosensitive solder resist composition of the present invention can be used as a liquid photoresist by being applied to a substrate on which a conductor wiring is formed and dried, and is particularly useful for producing a photosensitive resist film. The photosensitive solder resist film of the present invention includes at least another layer including a ruthenium (eush = layer oxygen barrier layer (hereinafter sometimes abbreviated as "pc layer") as needed. The form of the raw solder resist film is not particularly limited, and may be appropriately selected as needed in the case of 49 201235781 41436pif. For example, the photosensitive layer and the protective film 7 A may be sequentially provided on the support. Forming the form of the pC layer, the photosensitive layer, and the protective film in this order, and sequentially having the underlayer, the PC layer, the photosensitive layer, and the protective film on the support In addition, the photosensitive layer may be a single layer or a plurality of layers. <Support> The support is not particularly limited, and may be appropriately selected as needed, and it is preferred that the photosensitive layer be peeled off and The light transmittance is further improved, and the smoothness of the surface is further preferably further improved. The support is not particularly limited and may be appropriately selected as needed, and examples thereof include a transparent synthetic resin film. No special The restriction may be appropriately selected as needed, and examples thereof include poly-p-m, poly-naphthalene=diacetate, polypropylene, polyethylene, cellulose triacetate, cellulose diacetate, and =(meth)acrylic acid. Poly(meth)propene (tetra) copolymer polyvinyl chloride, polycarbonate, polystyrene, sirfan, polydimethylamine 2 quinone imine, ethylene-vinyl acetate copolymer, polytetra H female, polydifluoroacetic acid, cellulose film, nylon film plastic film, etc. These frequency can be used alone for more than ^. In these supports, the honest, ... people 丌 J and use 2 kinds It is a polyethylene terephthalate §. The synthesis of the phase is preferably the same as that of the film formation, and is not particularly limited, as described in Japanese Patent Laid-Open No. 4, No. 2, and No. 2, 8940, and Japan. Japanese Patent Laid-Open No. 50 201235781, No. 5_8〇5〇3, 'Japanese Patent Laid-Open (4), No. 5-72724, and the like, which support the thickness of the support and the secret system, can be seen as f ^ Suitable choice, preferably 4 μιη~300 _, more preferably 5 Qing ~ (7), ^ said the frequency of the shape of the money without special system, suitable for the needs Preferably, the strip-shaped support is limited, and may be appropriately selected as needed, preferably in the form of 1Gm~2G, _t. &lt;Photosensitive layer&gt; = The photosensitive layer can be used by the present invention The sensible sensitizer is 幵 成 成 县 县 县 县 县 县 县 县 县 县 县 县 县 县 县 县 县 县 县 县 县 县 县 县 县 县 县 县 县 县 县 县 县 县 县 县 县 县 县 县 县 县The thickness of the photosensitive layer is not limited, and may be selected as desired, preferably 3_~-more preferably 5 beer-7. The method for forming the photosensitive layer may be as follows: the composition of the present invention is made of a solder resist The solution is dissolved, emulsified or dispersed in water or a solvent, f flux composition solution, and the solution is directly applied onto the support, dried, and laminated. The solvent of the photosensitive anti-composition solution is not particularly limited, and the product may be selected and selected, for example, alcohols, terpenoids, vinegars, aromatic 2 hydrocarbons, kiyoshi, _, and Methyl ketone, dimethylacetic acid makeup, 曱 飒 飒 飒, ring stone wind and so on. Examples of the alcohols include methanol, ethanol, n-propanol, isopropanol, 51 201235781 41436pif n-butanol, and di-anthracene. Isobutyl ketone, diisobutyl ketone, and the like. Examples of the vinegar include ethyl acetate, butyl acetate, acetic acid, sulphuric acid vinegar, ethyl propionate, dinonyl phthalate, and decyl acetate. Examples of the aromatic hydrocarbons include anthracene, dimethyl, benzene, and acetaminophen. Examples of the hydrocarbons include four gasified carbons, three gas ethylene, gas imitation, , 1-chloroethane, a decocted sulphur, and a single benzene. Examples of the ethers include tetragas (10), trans, ethylene glycol monoethyl(tetra)tetramethoxy-2-propanol, and the like. B. I know that the early ones, the compounds can be used alone, or _ 2 or more. The photosensitive solder resist composition solution:: is suitably selected as needed, preferably == not more preferably 15 wt ° / 〇 50 50% by weight. The method of coating is not particularly limited. For example, a method of using a spin coater or a slit to suitably select the support of the dry-baked strip of rhododendron is used. Choice, although it is appropriate to choose according to the type of each component and solvent, it is usually the case that it is heard and the temperature is different.卜进仃30 seconds~15 minutes left &lt;protective film&gt; 52 201235781 41436pif The sensation: the layer has protection against the dirt or damage of the photosensitive layer to protect the photosensitive film. There is no light layer 2 in the position set in the crucible, and it is suitable to be selected as needed. 'In general, the protective film is provided in the support body, for example, the user can be listed in the support body. There are polyethylene, polypropylene paper, polyolefin sheet, polytetrafluoroethylene sheet and so on. The thickness of the protective film is not particularly limited, and may be selected from the range of 5 to 100 μm, and more preferably 8 μm to 30 μϊ. What to do? In the case of a film, it is preferable that the photosensitive layer and the bonding force of the photosensitive layer and the photosensitive layer of the photosensitive layer are in contact with each other. The combination of support and secrets (support/protective film): 歹 ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' , gas-gathered vinyl chestnut, polyimine, poly-, polyethylene terephthalate / polyethylene terephthalate. The treatment is carried out, and the relationship between the adhesion force and the surface of the support body and the protective film is performed. As the selective decent surface treatment, in order to improve the coating with the sensitization = which coating is applied, the corona discharge treatment = high; the wave irradiation treatment, the glow discharge treatment, the live electric water treatment , laser light treatment, etc. Moreover, the static friction coefficient of the support body and the protective film is preferably 53 201235781 41436pif 20 疋 G 5~1, 2. ^ The static friction coefficient is insufficient: when the slip is too slippery, the winding offset is generated in the case of the money-making shape = the image; if the right exceeds Μ ’, there is a phenomenon that it becomes difficult to turn into a good report. The method of storing the photosensitive solder resist film is not particularly limited, and may be appropriately selected depending on, for example, it is difficult to wind it in a long shape and roll it into a roll shape for storage. The length of the long-length photosensitive solder resist film can be suitably selected from the range of ig m, _ m, for example. m can be: easy to cut for the user's money, and the wire around the rail is fresh. Correction, Yusaki, better reading the body into the outermost way to wind. Further, the affinity photoreceptor film may be cut into a sheet shape. In the case of storage, it is preferable to combine the protection of the edge with the edge, and it is preferable to use the end face setting: the spacer of the vine, the spacer with the desiccant, and the 疋 package of the 疋 package is also low in moisture permeability. Raw materials. Quanjia Guangshengbao can also perform surface treatment in order to adjust the interface between the protective film and the reducing layer. The surface of the protective film is formed such that the surface of the protective film is coated with a polymer having a poly-oxygenated smog: polyethylene glycol. As = due to the coating of the coating of the compound _ ^ after the surface, at 3 〇. (: ~ i thief (especially 5 () ΐ ~ $ 1 minute ~ 30 minutes of drying to form. Perform and 'except the photosensitive layer, the support, the protective film with 54 201235781 41436pif, can also The layer includes a ruthenium layer, an oxygen barrier layer (pc layer), a release layer, an adhesive layer, a light absorbing layer, a surface protective layer, etc. ^ The underlayer is non-viscous at normal temperature, and is laminated under vacuum and heating conditions. In the case of a layer that melts and flows, the PC &gt;1 is usually a film of about μηη formed mainly of polyethylene glycol. The photosensitive solder resist film has a small surface stickiness and is laminated. It is excellent in properties and usability, and is excellent in insulation, plating resistance, and smoothness of the side of the pattern. It is a photosensitive layer of a photosensitive solder resist composition. Therefore, it can be widely used as a printed wiring board, a color light-emitting sheet or a column. , such as ribs, spacers, partitions and other components for display, such as full-image film, micro-machine, proofing machine, etc., and can be used to test the permanent method of the present invention. The photosensitive solder resist film of the present invention is thick due to the film Uniformly, therefore, when a permanent pattern is formed, it can be more finely laminated on the substrate. (Permanent Pattern and Permanent Pattern Forming Method) The permanent pattern of the present invention can be obtained by the permanent pattern shape of the present invention. Preferably, at least one of the protective film, the interlayer insulating film, and the four solder patterns. When the permanent pattern is a solder resist pattern, the dynamic elastic coefficient at 22 〇t is preferably 20 MPa to MPa. The face is 25 s ~ 8 MPa MPa, the special (four) is 3G MPa ~ 5Q hall. If the shaft coefficient is less than 20 MPa 'there is poor heat resistance; if the heat resistance is worse than the coffee shop, the turtle is produced on the hardened film. The phenomenon of cracking. 55 201235781 41436pif The photosensitive anti-composition of the permanent pattern forming method of the present invention is applied to the substrate table to reduce the photosensitive layer of the present invention, and then the heat is formed by the sputum (pour), _彡' It is added to the base: Ϊ Table 3, the light (exposure step invention 2 == the description of the pattern forming method also makes the &lt;substrate&gt; the substrate is not particularly limited, and may be appropriately selected as needed. For example, a copper clad product can be cited. a substrate for forming a printed wiring board such as a laminate, a glass plate such as a soda glass plate, a synthetic resin film, paper, a metal plate, etc. Among the substrates, a semiconductor can be equal to a multilayer wiring substrate or a build-up wiring substrate. In terms of high-density encapsulation, a substrate for forming a printed wiring board having wiring is preferably used. The substrate may be formed by forming a laminate as the i-th aspect to the base. A laminate in which a photosensitive layer of the photosensitive resist composition is formed on the material or a laminate in which the photosensitive layer in the photosensitive resist film is laminated as the second aspect. That is, the photosensitive layer in the laminate may be exposed to light as described later, whereby the exposed region is cured, and then a permanent pattern is formed by development as will be described later. &lt;Laminate&gt; The method for forming the laminate of the first aspect is not particularly limited, and may be appropriately selected as needed, and it is preferred to apply the coating on the substrate at the surface of the coating. 56 201235781 41436pit Photosensitive The solder composition is formed and dried to form a photosensitive layer. The method of coating and drying is not particularly limited, and may be appropriately selected as needed, and examples thereof include a spin coater, a slit spin coater, a roll coater, a die coater, a curtain coater, and the like. And a method of applying the photosensitive resist composition solution. The method for forming the laminate of the second aspect is not particularly limited, and may be appropriately selected as needed. Preferably, at least one of heating and pressurizing the photosensitive film is laminated on the photosensitive film. a method on the substrate. Further, in the case where the photosensitive resist film has the protective film, it is preferred that the protective film is peeled off and laminated so that the photosensitive layer is superposed on the substrate. The temperature of the heating is not particularly limited and may be appropriately selected as needed. Preferably, it is 70 〇C to 13 (TC, more preferably 8 〇〇c~u〇t: the pressure of the pressurization is not It is particularly limited, and may be appropriately selected as needed. Preferably, it is 0.01 MPa to 1.0 MPa, more preferably 0.05 MPa to 1.0 MPa. The apparatus for performing at least either of the heating and pressurization and the helmet = if necessary Suitable examples include, for example, a hot press, heat == eight (for example, VP-II manufactured by Taisei Laminator Co., Ltd.), and a vacuum paste machine (for example, MVLp5 manufactured by Nimko Seisakusho Co., Ltd. as a preferred device). &lt;Exposure Step&gt; The exposure step is a step of pattern exposure of the photosensitive layer. As the object of the exposure, as long as it is a material having a photosensitive layer, 57 201235781 41436pif is not particularly limited, and may be appropriately selected as needed Preferably, it is preferably carried out on the laminate in which the photosensitive anti-caries composition or the photosensitive resist film is formed on a substrate. The exposure to the laminate is not particularly limited, and is visible. Need and suitable For example, the photosensitive layer may be exposed by interposing the support, the underlayer and the PC layer; after the support is peeled off, the photosensitive layer may be interposed by interposing the underlayer and the pc layer. Exposing; after the support and the underlayer are peeled off, the photosensitive layer is exposed through the PC layer; after the support, the underlayer and the PC layer are peeled off, the photosensitive layer may be exposed The exposure is not particularly limited, and may be appropriately selected as needed, and may be, for example, digital exposure, analog exposure, etc. Among these, digital exposure is preferred. The digital exposure is not particularly limited and may be appropriately selected as needed. Selecting, = preferably, generating a control signal based on the formed image_information - using the light modulated by the sin control signal. The digital exposure mechanism is not particularly limited, and may be needed For example, the light-modulating mechanism «light-modulating mechanism" that changes the light irradiated from the light-irradiating mechanism based on the formed image is not included. η morphograms as the light modulation The mechanism is particularly limited as long as it can adjust the light, and may be appropriately selected as needed, and preferably has a light modulation mechanism of the portion. The light modulation mechanism having the n moiré portions is not particularly limited. 58 201235781 414JOplt It is preferable to select a space light modulation element as needed. The spatial light modulation element is not particularly limited and may be appropriately selected as needed. For example, a digital micro-mirror device may be cited. 'DMD), MEMS (Micr〇Electr〇Mechanical Systems, MEMS) spatial light modulation components (SLM; Spedal Light

Modulator), an optical element (PLZT element) that modulates transmitted light by an electro-optical effect, a liquid crystal shutter (FLc), and the like. The better digital micromirror is placed in 3 hai (〇丨妍31 Micr〇_mjrr〇r Device, DMD). Moreover, it is preferable that the optical modulation means has a pattern signal generating means for generating a control signal based on the formed pattern information. In this case, the light is modulated by the control signal generated by the fine-tuning mechanism root signal generating means. The control signal is not particularly limited and may be appropriately selected as needed, and for example, a digital signal may be cited. &lt;Developing Step&gt; The step of developing the W is performed by curing the region of the photosensitive layer exposed by the exposure step by the exposure step, and then developing by removing the uncured region to form The steps of the permanent pattern. The method of removing the hardened region of the Seto! is not particularly limited, and may be appropriately selected as needed, and examples thereof include a method of removing it by using a developing solution. If it is not particularly limited, it may be selected as appropriate, and an aqueous solution of a metal hydroxide or carbonate, a carbon-milk, a quaternary ammonium salt, or the like may be used. Preferred among these are sodium carbonate 59 201235781 41436 pif aqueous solution. An antifoaming agent, an organic base or an organic solvent which promotes the shirt with a surfactant can be used in combination. The organic base is not particularly limited, and may be exemplified by benzylamine and ethyl bromide. Examples include ethylenetriamine, dir-rhodium hydride, alkanolamine, tetradecylammonium hydroxide, and diolamine. Wait. - amine (tnethylene Pentamine), morpholine, triethyl, for example, a dihesive agent is not particularly limited, and may be appropriately selected as needed, and σσ 1 is an alcohol, a ketone, a g-type, a lysine, a shaft, an internal vinegar, and the like. The developer may be water or an aqueous solution and organic solvent. The water (4) Shadow Liquid can also be used separately. &lt;&lt;hardening treatment step&gt; The treatment is a permanent ride forming green step of the present invention. The hardening treatment step is performed after the development step, and the photosensitive layer in the permanent pattern is hardened. A step of. The hardening treatment is not particularly limited, and may be appropriately selected as necessary. Examples thereof include the entire surface exposure treatment and the entire surface heat treatment. The method for exposing the entire surface is not particularly limited, and may be appropriately selected by a coffee maker. For example, the method of exposing the entire surface on the laminated body forming the permanent pattern to be described after the development step may be mentioned. And the exposure of the entire surface promotes hardening of the resin in the photosensitive solder resist composition of the photosensitive layer, and the surface hardening of the permanent pattern is not particularly limited. It is suitable for the selection of 201235781 41436pit, and examples thereof include an ultrahigh pressure mercury lamp and the like; a 乂 exposure machine. The method of heat treatment of the entire surface is not particularly limited and may be appropriately selected. For example, a method of heating the entire surface of the laminate in which the permanent pattern is formed after the development step may be mentioned. By heating the entire surface, the film strength of the surface of the permanent pattern can be increased. The heating temperature of the whole surface heating is not particularly limited, and may be selected as appropriate: 12 〇t: 〜25 (rc, more preferably 12 20 generations. If the heating temperature is insufficient, the shoe exists. The phenomenon that the film strength is improved by the pure treatment cannot be obtained; if it exceeds 2, the resin in the photosensitive solder resist composition is decomposed, and the film quality is weakened and woven. The heating time is not particularly limited and is preferably selected, and is preferably from 1 minute to 12 minutes, more preferably from minute to 60 minutes. 疋) The apparatus for performing the entire surface heating is not particularly limited, and is visually selectable. For example, an oven, a hot plate, and an infrared ray (IR) may be used. When the substrate is in the form of a printed wiring board such as a multilayer wiring board, the permanent pattern step of the present invention may be formed on the printed wiring board in the following manner. Make a connection. That is, by the developing step, the hardened 曰' of the permanent pattern is formed to expose a metal layer on the surface of the printed wiring board. After the gold layer is exposed to the surface of the printed wiring board, the portion of the metal layer is subjected to soldering, and the conductor or the component is sealed. At this time, the department 61 201235781

Wbpif The permanent pattern of the hardened layer functions as a protective film or an insulating film (interlayer insulating film) to prevent external impact or conduction between adjacent electrodes. In the permanent pattern forming method of the present invention, it is preferred to form at least one of a protective film and an interlayer insulating film. If the permanent pattern formed by the permanent pattern forming method is the protective film or the interlayer insulating film, the wiring can be protected from external impact or bending, in particular, it is the interlayer insulating film. In this case, for example, it is possible to package the semiconductor or the component in a high-degree and high-degree manner on a multilayer wiring substrate, a build-up wiring substrate, or the like. The permanent pattern forming method of the present invention can form a pattern at a high speed, and thus can be widely used in the formation of various patterns, and particularly can be suitably used in the formation of a wiring pattern. Further, the permanent pattern formed by the permanent pattern forming method of the present invention has excellent insulating properties, plating resistance, smoothness of the side surface of the pattern, and the like, and can be suitably used as a protective film, an interlayer insulating film, and a solder resist pattern. (Printed substrate) The printed circuit board of the present invention comprises at least a base material, a permanent pattern formed by the permanent pattern forming method, and further includes other structures which are appropriately selected as needed. The other configuration is not particularly limited, and may be appropriately selected as needed. For example, a build-up substrate in which an insulating layer is further provided between the substrate and the permanent pattern may be mentioned. [Examples] Hereinafter, the present invention will be more specifically described by way of examples, but the present invention is not limited by these examples. (Synthesis Example 1) &lt;Synthesis of Compound T-1&gt; Into a 2,000-mL 3-necked flask equipped with a reflux tube and a thermometer, 150 g of tetrahydrofuran, 100 g of N-mercapto 0, and 100 g of lozendine were added. And 3-amino-1,2,4-triazole 84.1 g (manufactured by Merck & Co., Ltd.). Under stirring, tetrahydrofuran l〇〇g and ethyl 2-isocyanatoethyl methacrylate 155.2 g (manufactured by Karenz MOI, Showa Denko Co., Ltd.) were added dropwise. Thereafter, the mixture was stirred at 40 ° C for 1 hour, and then reacted at 70 ° C for 4 hours. After cooling to room temperature, the reaction liquid was poured into 2 L of ion-exchanged water under vigorous stirring to precipitate a target crystal. The precipitate was collected by washing with decyl alcohol, and dried to give the compound T-1 222 g of the following structure. [Chem. 14]

(Synthesis Example 2) &lt;Synthesis of Compound T-2&gt; In a 2,000 mL 3-necked flask equipped with a reflux tube and a thermometer, tetrahydrofuran 120 g, N-methyl 0-poicone 70 g, 3 were added. , 5-diamino-1,2,4·triazole 49.5§(〇6§1^&amp;Company) and 2,4-di-tert-butyl-4-nonylphenol 1.8g (PN- 01, manufactured by Ou Nei Emerging Chemical Industry Co., Ltd.). Under stirring, 80 g of tetrahydrofuran and 2-ethyl isocyanate 63 201235781 41436pif acetonitrile 141.1 g (manufactured by Karenz ΑΟΙ, Showa Denko Co., Ltd.) were added dropwise thereto over 2 hours. Thereafter, the reaction was allowed to proceed at 4 ° C for 20 hours. After cooling to room temperature, the reaction solution was poured into 2 L of ion-exchanged water which was strongly disturbed to precipitate a target crystal. The precipitate was collected by washing with methanol, and dried to give a compound T-2 165.1 g. [化15]

(Synthesis Example 3) &lt;Synthesis of Compound T-3&gt; The furnace was placed in a 2,000 mL 3-neck flask with a reflux tube and a thermometer, N-methylpyrrolidone 250 g, and 3,5-diamino-1 , 2,4-triazole 49' (manufactured by Degussa). Under stirring, N·* heart &gt; 卜. 咯 80 80 g, and tetrahydrophthalic acid g (丨〇 TH, manufactured by Nippon Chemical and Chemical Co., Ltd.). Thereafter, the mixture was stirred at 4 ° C for 1 hour, and the mixture was stirred and washed, and then allowed to react at 100 ° C for 2 hours. Cooling home The reaction solution is poured into the target crystals in ion-exchanged water L2 L under vigorous stirring. The precipitate was collected by isopropyl alcohol/hexane (2/8 (by weight)), and dried to obtain 121.1 g of the following structure. 64 201235781 41436pif [Chem. 16]

T-3 (Synthesis Example 4) &lt;Synthesis of Compound Τ-4&gt; In a 3-neck flask having a reflux tube and a thermometer of 1, 〇〇〇mL, a t-butyl decyl ketone 250 g, 1, 2 was added. , 4-triazole 34.5 g (manufactured by Junsei Chemical Industry Co., Ltd.), dicyclopentyl decyl diacrylate diacrylate 145.7 g (A-DCP, manufactured by Shin-Nakamura Chemical Co., Ltd.), and 2,4-di-third曱-4-mercaptophenol 1.9 g (PN-01, manufactured by Ouchi Shinko Chemical Industry Co., Ltd.). After stirring at 40 ° C for 1 hour, the mixture was reacted at 80 ° C for 52 hours. After cooling to room temperature, the organic solvent was removed by concentration under reduced pressure, whereby Compound T-4 178 g of the following structure was obtained. [Π化] Ο

(Synthesis Example 5) &lt;Synthesis of a polymer compound B-4 containing a carboxyl group (a polyamine phthalate resin having an acid-modified ethylenically unsaturated group)&gt; 65 201235781 41436pif 5 with a condenser and a stirrer In a three-neck round bottom flask, '2,41 g (〇莫耳), 2&gt; bis(pyridinyl)propionic acid (DMPA) 5.23 g (G·mole), and C3 Alcohol monomethyl acrylate vinegar 17.78 g (0.111 mol) was dissolved in cyclohexanone % mL. Adding 4,4-diphenyldecane diisocyanate (Mm) 3〇〇3 g (〇12 mol), hexamethylene diisocyanate (HMDI) 5 〇5 g (〇〇3 mol), 2 6_ di-t-butylhydroxymethyl alum 1 g, and the trade name of the catalyst: NEOSTANN U-_ (made by Nitto Chemical Co., Ltd.) for 5 hours of heating and stirring under hunger. Thereafter, by 曱The alcohol was diluted with 961 mL and mixed for 30 minutes to obtain 165 g of a polymer compound B-4 solution containing a slow base (solid content: 45 wt%). The solid form of the obtained polymer compound β·4 solution containing a ruthenium group was obtained. The acid value of the acid was 68 mgKOH/g. The weight average molecular weight (polystyrene standard) determined by gel permeation chromatography (Gpc) was 65 Å, and the ethylenically unsaturated group equivalent was 1.83 mmol/g. The acid value is determined in accordance with JiS K0070. In the case where the sample is not dissolved, dioxane or tetrahydrofuran or the like is used as a solvent. The weight average molecular weight is a high-speed GPC device (manufactured by Toyo Soda Industrial Co., Ltd.). HLC_8〇2A), with a solution of 55 wt% tetrahydrofuran (THF) For the solution, one HZM-M was used, and a 200 μί sample was injected, and the solution was dissolved by the THF solution, and the refractive index detector or the υν detector (detection wavelength: 254 nm) was measured at 25 ° C. The ethylenically unsaturated group equivalent can be determined by measuring the odor value of 66 201235781 41436pif according to JIS K2605. (Synthesis Example 6) &lt;Polymer-containing polymer compound B-5 (acid-modified contains ethylenic unsaturation) Synthesis of polyamino phthalate resin) &gt; 2,2-bis(hydroxymethyl)propionic acid (DMBA) 32.00 g in a 500 mL three-neck round bottom flask equipped with a condenser and a scrambler (0.216 mol), polypropylene glycol (molecular weight 1 000) (PPG1〇〇0) 9. 〇〇g (〇.〇〇9 Moer) dissolved in propylene glycol monoterpene ether monoacetate 118 mL. Add 4,4-diphenyldecane diisocyanate (MDI) 37.54 g (0.15 mol), 2,6-di-t-butylhydroxyindole 0.1 g, and NEOSTANN U-600 (manufactured by Mindong Chemical Co., Ltd.) 2 g, after stirring at 75 ° C for 5 hours, 9.61 g of decyl alcohol was added. Thereafter, further added as an epoxide containing an ethylenically unsaturated group Glycidyl methacrylate (GMA) 17.91 g (0.126) and 5,000 ppm of triphenylphosphine as a catalyst, stirred at 11 ° C for 5 hours, then cooled to room temperature to obtain 214 g of carboxyl group Molecular compound B-5 solution. The solid acid value of the obtained carboxyl group-containing polymer compound B-5 solution was 75 mgKOH/g. The weight average molecular weight (polystyrene standard) measured by gel permeation chromatography (GPC) was 12, 〇 The oxime has an ethylenically unsaturated group equivalent of 1.3 mmol/g. (Example 1) &lt;Preparation of photosensitive composition coating liquid 1&gt; Each of the following components was mixed to prepare a photosensitive composition coating liquid 1 (photosensitive solder composition coating liquid). 67 201235781 41436pif ZFR-1776 (65 wt% methoxypropyl acetate solution of epoxy resin modified with ethylenically unsaturated group, manufactured by Nippon Kagaku Co., Ltd.) (B -1 ) 32.3 parts by weight of compound T- 1 0.8 parts by weight of a coloring pigment: HELIOGEN BLUE D7086 (manufactured by BASF Corporation) 0.021 parts by weight of a coloring pigment: Pariotol Yellow D0960 (manufactured by BASF Corporation) 0.006 parts by weight of a dispersing agent: Solsperse 24000GR (manufactured by Lubrizol Corporation) 0.22 parts by weight of a polymerizable compound: DCP-A (manufactured by Kyoeisha Chemical Co., Ltd.) 5.3 parts by weight of initiator: Irgacure 9〇7 (manufactured by BASF Corporation) 0.6 parts by weight of sensitizer: DETX-S (manufactured by Sakamoto Chemical Co., Ltd.) 0.005 parts by weight of reaction Auxiliary: EAB-F (manufactured by Hodogaya Chemical Co., Ltd.) 0.019 parts by weight of hardener: melamine (manufactured by Wako Pure Chemical Industries, Ltd.) 0.16 parts by weight of thermal crosslinking agent: Epotohto YDF-170 2.9 parts by weight (manufactured by Nippon Steel Chemical Co., Ltd. Compound having an oxirane group (bisphenol F type epoxy resin)) 68 201235781 41436ριί Filler. SO-C2 (manufactured by Admatechs Co. Ltd.) 80 parts by weight ion trapping :IXE_6107 (manufactured by Toagosei Co., Ltd.) 0·82 parts by weight of coating aid: Megafac F-780F 0.2 parts by weight (manufactured by DIC Corporation, 30 wt% of methyl ethyl ketone solution) Elastomer: Espel 1612 2.7 parts by weight of cyclohexanone (solvent) 38.7 parts by weight &lt;Preparation of photosensitive solder resist film 1&gt; A polyethylene terephthalate film (pET) having a thickness of 25 μm was used as a support, and the body was treated with a bar coater. The composition coating liquid 1 is applied to the support body by the thickness of the photosensitive layer after drying, and is dried for 30 minutes in a thief and hot-grade annular napkin to prepare a photosensitive solder resist film. 1. &lt;Formation of permanent pattern&gt; - Modulation of laminated body - A copper-clad laminate (a printed wiring board having no through-hole or steel-thickness) on which a wiring has been subjected to chemical polishing treatment is used as a substrate. Using a vacuum laminator (manufactured by Nago Seisakusho Co., Ltd., MVLP500), the photosensitive layer of the photosensitive resist film 1 is laminated on the copper clad laminate so as to be in contact with the copper clad laminate. In the above, a laminate of the copper clad laminate, the photosensitive layer, and the polyethylene terephthalate film (support) is sequentially laminated. The crimping conditions are 疋 crimping temperature, crimping pressure is 0.4 MPa, 69 201235781 41436pif lamination speed is 1 m/min. With respect to the laminate obtained above, a photoresist pattern was formed by the evaluation method shown below. - Exposure step - for the photosensitive layer in the laminated body of the modulation, using a pattern forming device using a blue-violet laser exposure with a predetermined pattern, self-polymerizing on the side of the ethylene phthalate film (support) A predetermined pattern was obtained by irradiating 4 〇 5 nm of laser light with an amount of energy of 40 mJ/cm 2 to expose a partial region of the photosensitive layer. - development step - after standing at room temperature for 10 minutes, the polyethylene terephthalate film (support) was peeled off from the laminate, and a 1 wt% aqueous solution of sodium carbonate was used as an experimental developer. The entire surface of the photosensitive layer on the copper clad laminate was spray-developed at 30 ° C under a pressure of 0.18 MPa (1.8 kgf/cm 2 ) for 60 seconds to dissolve and remove the unexposed areas. Thereafter, it was washed with water and dried to form a permanent pattern. - Hardening treatment step - the entire face of the laminated body in which the permanent pattern is formed is at 150. The heat treatment was carried out for 1 hour, and the surface of the permanent pattern was hardened to increase the film strength to prepare a test plate. &lt;Evaluation Method&gt; The smoothness, insulation, thermal shock resistance (crack resistance), and scraping property of the side surface of the pattern were evaluated by the evaluation method described below. The results are shown in Table 1. 201235781 414Jbpif _ Smoothness of the side of the pattern - The side of the pattern was formed by scanning electron microscopy (SEM), and the smoothness of the side of the pattern in the shadowing step was evaluated. ~ Evaluation benchmark pair chart [Evaluation criteria] ο: The pattern side is smooth and the pattern shape is excellent. A slight unevenness was observed on the side of the pattern, but it was a good figure. 〇 △ Case shape △: There were irregularities on the side of the pattern. The pattern shape was slightly inferior. X. Cohesives were found on the side of the pattern, and the pattern shape was poor. Insulation - ^ = printed substrate with 12 thick copper on the oxygen glass substrate: copper; r etching 'obtained line width / gap width 50 _50 μιη, line phase = no contact between each other The comb electrode on the surface. The photosensitive solder resist film 1 is laminated on the comb-shaped electrode of the substrate in the same manner as the method described in the method for preparing the laminate, and the optimum exposure amount (3 〇〇 mJ/cm 1 J/cm) ) for exposure. Next, after standing at room temperature for an hour, a 6-second spray of 30 wt% sodium carbonate aqueous solution was developed, and further heating (drying) was carried out at 80 ° C for 1 minute. Then, the ultraviolet ray irradiation device manufactured by ORC MANUFACTURING c., LTD. was used to irradiate the photosensitive layer with ultraviolet light by an amount of energy of 1 J/cm 2 . Further, the photosensitive layer was subjected to heat treatment at 150 ° C for 6 minutes to obtain a substrate for evaluation in which a solder resist having a thickness of 25 μm was formed. In the case of applying a voltage between the comb-shaped electrodes of the laminated body for evaluation after heating, 2012 201281 81 41436pif 2 snow; and the shielding wire of polytetrafluoroethylene is connected to the test electrodes by Sn/Pb solder, and then evaluated. Use a laminate to print a voltage of 5V f •, Bottom: Use this laminate for 13 (TC, 85% RH super =

The still wet test (HAST) was allowed to stand for 200 hours. The degree of occurrence of the anti-reagent of the subsequent evaluation layer was observed by a metallographic microscope of 1〇::, and the evaluation was performed by the following evaluation criteria. L

[Evaluation Criteria] ◎ • The occurrence of migration was not confirmed. 'Insulation is excellent. 迁移: The migration was confirmed only on copper, and the insulation was good. △. A slight migration was observed in SR (solder resist), and the insulation was slightly better. It was confirmed that the migration occurred, and the insulation was slightly inferior x: short-circuit between the electrodes, and the insulation was poor. - Crack resistance - The photosensitive resist film 1 was laminated in the same manner as the method described in the method for preparing a laminate. On a printed circuit board with a thick copper layer 4 on the epoxy glass substrate, a 2 mm square mask was used, and a HMW_201GX type exposure machine manufactured by 〇RC MANUFACTURING CO., LTD. was used to form 2 mm. The exposure was performed by the optimum exposure amount of the square pattern (3 〇〇 mJ/cm 2 to 1 J/cm 2 ). Secondly, it is allowed to stand at room temperature, and then by 1 wt ° at 30 ° C. The sodium carbonate aqueous solution was subjected to jet development for 6 seconds, and further heated (dried) at 8 (TC for 1 minute). Then, an ultraviolet irradiation device manufactured by ORC MANUFACTURING CO., LTD. was used, and 1 J/cm 2 was used. The amount of energy was irradiated to the ultraviolet ray 72 201235781 41436pit of the photosensitive layer. The photosensitive layer was further heat-treated at 150 ° C for 60 minutes, thereby obtaining a rectangular thickness of 25 μm formed with a rectangular portion having a square of 2 mm square. Substrate for evaluation of flux. Repeatedly, the thermal cycle was as follows: the obtained substrate was exposed to the atmosphere at -65 ° C for 15 minutes, and then exposed to the atmosphere of i5 ° ° C for 15 minutes, then The film was again exposed to an atmosphere of -65 ° C. The degree of cracking and peeling on the solder resist of the substrate for evaluation by thermal cycling was observed by an optical microscope, and evaluated by the following evaluation criteria. [Evaluation Criteria] ◎ • No cracks, flaking, deformation and excellent sturdiness on the solder resist 〇: There is a slight deformation on the solder resist, but the toughness is good: there is a slight crack on the solder resist, but the toughness is slightly better. There are cracks and flaking on the solder resist, and the kinetic properties are slightly worse. X: There are obvious cracks and flaking on the solder resist, and the toughness is poor - the mineral-resistant property - the permanent pattern is degreased and the surface is rough. After the addition, the sulfuric acid was added to carry out the addition of the sulfuric acid. Secondly, the permanent pattern was immersed in the nickel sulfate/dilute sulfuric acid solution of the crucible for 40 minutes to carry out the plating 2 and the crimping standard of the cured film in the permanent pattern was observed. [Evaluation of plating resistance] [Evaluation criteria] ◎ • There is no curling or peeling in the hardening property, and it is extremely excellent in resistance to material color, but the problem on the object, 73 201235781 41436pif △. Shrinkage phenomenon, poor mineral resistance X: bulging (peeling) was observed in the cured film, and plating resistance was extremely poor (Example 2) In Example 1, 'ZFR-1176 (manufactured by Nippon Kayaku Co., Ltd., acid-modified) (Epoxy Unsaturated Epoxy Resin) (B-1) is replaced by Cyclomer P200HM (Acetone Chemical Industry Co., Ltd., Acrylic Resin Containing Ethylene Unsaturated Group and Carboxyl Group) (B-2) (Content in Solids) Same) 'Other than the same as Example 1 The photosensitive composition coating liquid and the photosensitive solder resist film were produced in the same manner as in Example 1. The obtained photosensitive composition coating liquid and photosensitive resist film were evaluated in the same manner as in Example 1. The results are shown in Table 1. (Example 3) In Example 1, ZFR-1176 (manufactured by Nippon Kagaku Co., Ltd., acid modified epoxy resin containing ethylenically unsaturated group) (B-1) was replaced with UXE-3024 (Japanese chemical) Photosensitive composition was carried out in the same manner as in Example 1 except that the polyamino phthalate resin (B-3) having an ethylenically unsaturated group was produced by acid reduction (the same content in the solid content). Coating solution and photosensitive solder resist film. The obtained photosensitive composition coating liquid and the photosensitive solder resist film were evaluated in the same manner as in Example 1. The results are shown in Table 1. (Example 4) In Example 1, ZFR-1176 (manufactured by Sakamoto Chemical Co., Ltd., acid modified to contain an ethylenically unsaturated group of bad oxygen resin) (B-1) was replaced with that synthesized in Synthesis Example 5. A polymer compound having a carboxyl group (acid modified with ethylene 201235781 41436 pit = saturated polyamino phthalate resin) (B_4) (the same content in the solid content) was carried out in the same manner as in Example 而A photosensitive composition coating liquid and a photosensitive solder resist film were produced. The photosensitive composition coating liquid and the photosensitive solder resist film obtained were evaluated in the same manner as in Example 1. The results are shown in Table 1. (Example 5) A photosensitive composition coating liquid and a photosensitive solder resist film were produced in the same manner as in Example 4 except that the compound T-1 was replaced with the compound T-2. The obtained photosensitive composition coating liquid and the photosensitive solder resist film were evaluated in the same manner as in Example 1. The results are shown in Table 1. (Example 6) A photosensitive composition coating liquid and a photosensitive solder resist film were produced in the same manner as in Example 4 except that the compound T-1 was replaced with the compound T-3. The obtained photosensitive composition coating liquid and the photosensitive solder resist film were evaluated in the same manner as in Example 1. The results are shown in Table 1. (Example 7) A photosensitive composition coating liquid and a photosensitive solder resist film were produced in the same manner as in Example 4 except that the compound T-1 was replaced with the compound T-4 in Example 4. The obtained photosensitive composition coating liquid and the photosensitive solder resist film were evaluated in the same manner as in Example 1. The results are shown in Table 1. (Example 8) 75 201235781 41436pif In Example 5, the compounding amount of the compound T_2 was changed from i 7 wt% to 3 〇 wt% with respect to the solid matter of the photosensitive composition coating liquid, and otherwise In the same manner as in Example 5, a photosensitive composition coating liquid and a photosensitive solder resist film were produced. The obtained photosensitive composition coating liquid and the photosensitive solder resist film were evaluated in the same manner as in Example 1. The results are shown in the table. (Example 9) Ep〇t〇hto YDF-170 (a compound of bismuth F-type epoxy resin manufactured by Xinyi Iron Chemical Co., Ltd.) which is a thermal crosslinking agent in Shell 5 A photosensitive composition coating liquid and a photosensitive solder resist film were produced in the same manner as in Example 5 except that it was replaced with ETERNACOLL OXBP (manufactured by Ube Industries, Ltd., having a propylene-based group). The obtained photosensitive composition coating liquid and the photosensitive solder resist film were evaluated in the same manner as in Example 1. The results are shown in Table 1. (Example 10) In Example 5, Epotohto YDF-170 (manufactured by Xinyi Iron Chemical Co., Ltd., having an oxirane group (bisphenol F type Wangyi oxygen tree) was replaced by a thermal crosslinking agent) A photosensitive composition coating liquid and a photosensitive solder resist film were produced in the same manner as in Example 5 except that Sumidur BL3175 (a compound having a blocked isocyanate group manufactured by Sumika Bayer Urethane Co., Ltd.) was used. The obtained photosensitive composition coating liquid and the photosensitive solder resist film were evaluated in the same manner as in Example 1. The results are shown in Table 1. (Example 11) 76 201235781 41436pif In Example 5, Epotohto YDF-170 (manufactured by Xinyi Iron Chemical Co., Ltd., compound having oxirane group (bisphenol F type epoxy resin)) was replaced as a thermal crosslinking agent. A photosensitive composition coating liquid and a photosensitive solder resist film were produced in the same manner as in Example 5 except that YSLV-120TE (manufactured by Nippon Steel Chemical Co., Ltd., having an oxirane group) was used. The obtained photosensitive composition coating liquid and the photosensitive solder resist film were evaluated in the same manner as in Example 1. The results are shown in Table 1. (Example 12) In Example 1, 'ZFR-1176 (epoxy resin modified by Nippon Kayaku Co., Ltd., acid-modified ethylenically unsaturated group) (B-丨) was replaced with the content synthesized in Synthesis Example 6. A polymer compound of a carboxyl group (a polyamine phthalate resin containing an ethylenically unsaturated group as an acid-modified) (B-5) (the same content in a solid content) was produced in the same manner as in Example 1. Photosensitive composition coating liquid and photosensitive solder resist film. The obtained photosensitive composition coating liquid and the photosensitive solder resist film were evaluated in the same manner as in Example 1. The results are shown in Table 1. (Comparative Example 1) A photosensitive composition coating liquid and a photosensitive solder resist film were produced in the same manner as in Example 1 except that the τ-1 compound and the thermal crosslinking agent were not prepared. The obtained photosensitive composition coating liquid and the photosensitive solder resist film were evaluated in the same manner as in Example 1. The results are shown in Table 1. (Comparative Example 2) The photosensitive composition coating liquid and the photosensitive solder resist were prepared in the same manner as in Example 77, except that the ruthenium-1 compound was not prepared in the same manner as in Example 77, 201235781 41436 pif film @#地• The photosensitive composition coating liquid and the photosensitive solder resist film were evaluated in the same manner as in Example 1. The results are shown in Table 1. (Comparative Example 3) A photosensitive composition coating liquid and a photosensitive material were produced in the same manner as in Example 1 except that the T-1 compound was replaced with IXE6107 (manufactured by Toagosei Co., Ltd., an inorganic ion exchanger). A solder mask film. The obtained photosensitive composition coating liquid and the photosensitive solder resist film were evaluated in the same manner as in Example 1. The results are shown in Table 1. (Comparative Example 4) A photosensitive composition was produced in the same manner as in Example 1 except that the T-1 compound was replaced with the compound T:Z (1,2,4-tris) of the following structure. Coating solution and photosensitive solder resist film. The obtained photosensitive composition coating liquid and the photosensitive solder resist film were evaluated in the same manner as in Example 1. The results are shown in Table 1. [化 18] Τ-Ζ

HN N N Κ = = (Comparative Example 5) In the same manner as in Example 1, except that the thermal crosslinking agent was not prepared, a photosensitive composition coating liquid and a photosensitive 'solder resistant agent' were prepared.

The obtained photosensitive composition coating liquid and the photosensitive solder resist film were evaluated in the same manner as in Example 1. The results are shown in Table 1. [Table 1]

The tri-salt compound contains the surface of the thermal crosslinking agent pattern of the molecular compound of the enemy group. The insulating insulating crack resistance plating resistance content (wt%). Example 1 Τ-1 1.7 Β·1 YDF-170 ο 〇 Δ 〇Δ ο Example 2 Τ-1 1.7 Β-2 YDF-170 ο ◎ 〇Δ ◎ Example 3 Τ-1 1.7 Β-3 YDF-170 ο ο ο ο Example 4 Τ-1 1.7 Β-4 YDF-170 0 ο ◎ ◎ Example 5 Τ-2 1.7 Β-4 YDF-170 ο ◎ ◎ ◎ Example 6 Τ-3 1.7 Β-4 YDF-170 0 ο ◎ ◎ . Example 7 Τ-4 1.7 Β-4 YDF-170 ο ο ο ◎ Example 8 Τ-2 3.0 Β-4 YDF-170 ο ◎ ◎ ◎ 实 叫?~1 Τ-2 1.7 Β-4 OXBP 〇Α ο 〇Δ ◎ Example 10 Τ-2 1.7 BA BL3175 〇Δ 〇△ ◎ ◎ _ Example 11 Τ-2 1.7 Β-4 YSLV-120TE 〇◎ ο ◎ Example 12 Τ-1 1.7 Β-5 YDF-170 ο ο 〇〇Comparative Example 1 - - Β-1 • Δ XXX Comparative Example 2 - - Β-1 YDF-170 Δ Δ Δ ο - Comparative Example - 3 - - Β-1 YDF-170 Δ 〇 Δ X 〇 This burial example 4 Τ-Ζ 1.7 Β-1 YDF-170 Δ 〇Δ ο Δ Example 5 1.7 Β-1 - 〇Δ Δ XX wherein, in Table 1, the content (wt%) of the triazole compound is relative to photosensitivity The content of the solid matter of the composition coating liquid. Examples 1 to 12 were excellent in insulation properties, plating resistance, pattern side properties, and crack resistance. When the compound τ_2 is used as the azole compound, it is a very excellent insulating property. Further, when yt-4, that is, an acid-modified polyamino phthalic acid-containing resin containing an ethylenically unsaturated group, is used as a polymer compound containing a Wei group, it is excellent in anti-79 201235781 41436pif cracking property. result. Moreover, in = is a thermal crosslinking agent. It is called a pattern::== In Comparative Example 1, compared with the example, the side of the figure, the a °, the a, the plating, the plating resistance, In Comparative Example 2 containing no triad, the insulation properties, the smoothness of the side of the pattern, and the crack resistance were inferior. In Comparative Example 3 of the σ-ion trapping agent, compared with the example, although the workability was the same, the pattern side crack resistance was very poor. In the comparative example 4 in which 1,2,4-triazole was used as the triterpene compound, the smoothness and plating resistance of the pattern side surface were inferior compared with the conventional example. In Comparative Example 5 containing no thermal crosslinking agent, it was found to be inferior in insulation, crack resistance, and plating resistance. The smoothness of the side surface of the pattern in Examples 1 to 12 was improved, which was an effect which could not be obtained in Comparative Examples 1 to 4, and was not known in the prior art in which a triazole compound was used in the photosensitive composition. Examples of the aspect of the invention include the following aspects. &lt;1&gt; A photosensitive composition comprising at least one of a group reactive with a radical and a group reactive with a thermal crosslinking agent, a compound of a triterpene ring, a polymerizable compound, and light Polymerization initiator, thermal crosslinking agent. The photosensitive composition according to the above <1>, which further contains a carboxyl group-containing polymer compound. The photosensitive composition of the above-mentioned <2>, wherein the polymer compound containing a carboxyl group is an acid-modified polyurethane resin containing an ethylenically unsaturated group. The photosensitive composition of any one of the above-mentioned <1> to <3> wherein the thermal crosslinking agent is selected from the group consisting of a cyclic ether group, a blocked isocyanate group, and an oxazolyl group. And a compound of at least one functional group of an ethylene carbonate group. The photosensitive composition 'in any one of the above-mentioned <1> to <4>, which has a group reactive with a radical and a group reactive with a thermal crosslinking agent, is at least any one of the above-mentioned <1> to &lt;4&gt; The compound of one and the triazole ring is a compound represented by the following formula (〖); [Chem. 19] r 1

X+YL"η Formula (1) wherein, in the above formula (I), X represents a three-oxime ring; Υ represents at least one of a group reactive with a radical and a group reactive with a thermal crosslinking agent. The organic group; η represents an integer of 1 to 3; and when η is 2 to 3, 'Υ may be the same or different. <6> The photosensitive composition according to the above <5>, wherein the formula (the oxime in the oxime is a group represented by the following formula (II); [Chem. 20] Y] f Ζ! mr, J Formula (II) 81 201235781 «mjopif where 'in the above formula (II), Yi represents an m+1 valent organic group having a carbon number of 2 to 25; 2! represents a carboxyl group, a propylene fluorenyl group, And any one of a mercapto acryloxy group; m represents an integer of 1 to 2; and when m is 2, Ζι may be the same or different. &lt;7&gt;&lt;1&gt; to &lt;6&gt; The photosensitive composition according to any one of the invention, wherein the thermal crosslinking agent is a compound having an oxirane group. &lt;8&gt; A photosensitive resist composition which is characterized by containing the above &lt;1&gt; The photosensitive composition according to any one of <7>. <9> A photosensitive solder resist film comprising: a support, a photosensitive layer, and a layer deposited on the support as described above &lt; The photosensitive resist composition of the above-mentioned <10>, which is characterized in that the photosensitive resist group according to the above &lt;8&gt; The object is applied onto the surface of the substrate, dried, and the photosensitive layer is laminated to form a layered body, and then exposed and developed. <11> A permanent pattern characterized by being as described above in &lt;10&gt; The printed circuit board is characterized in that a permanent pattern is formed by the permanent pattern forming method according to the above &lt;10&gt; [Industrial Applicability] The present invention is formed. The photosensitive composition can obtain a high-performance hard tilt which is excellent in insulation property, plating resistance, and smoothness of the side surface of the pattern, and can be suitably used in a solder resist. The photosensitive solder resist film of the present invention can be suitably used. Various patterns such as protective film and interlayer 82 201235781 414iOpii insulating film and permanent pattern such as solder resist pattern are used to form liquid crystal structural components such as color filters, pillars, ribs, spacers, and spacers. In the manufacture of micromachines, proofing machines, and the like, in particular, it is suitably used for permanent pattern forming applications of printed boards. The pattern forming method of the present invention uses the photosensitivity. Therefore, it can be suitably used for various pattern forming applications such as a protective film, an interlayer insulating film, and a permanent pattern such as a solder resist pattern, and a liquid crystal structural member such as a color filter, a pillar, a rib, a spacer, or a spacer. Manufacturing, hologram, micro-machine, proofing machine manufacturing, etc., in particular, is suitable for permanent pattern formation of printed substrates. [Simplified description of the drawing] Benefits. [Main component symbol description] Benefit.

Claims (1)

201235781 41436pif VII. Patent Application Range: 1. A photosensitive composition characterized by comprising: a compound having a group reactive with a radical and a group reactive with a thermal crosslinking agent and a triazole ring , a polymerizable compound, a photopolymerization initiator, and a thermal crosslinking agent. 2. The photosensitive composition as described in claim 1 of the patent application further contains a compound containing a rebel base. 3. The photosensitive composition according to claim 1, wherein the polymer compound containing a slow-radical group is a polyamine-based citric acid-containing resin having an acid-modified ethylenically unsaturated group. 4. The photosensitive composition according to claim 1, wherein the thermal crosslinking agent is at least one member selected from the group consisting of a cyclic ether group, a blocked isocyanate group, an oxazolyl group, and an ethylene carbonate group. Base compound. 5. The photosensitive composition according to claim 1, wherein the compound having at least one of a group reactive with a radical and a group reactive with a thermal crosslinking agent and a triazole ring is as follows a compound represented by the formula (I); [Chemical Formula 1] In the formula (I), X represents a triazole ring; and Y represents an organic group having at least one of a group reactive with a radical and a group reactive with a thermal crosslinking agent. η represents an integer of 1 to 3; in addition, when η is 2 to 3 84 201235781 4i4ibpif, y may be the same or different. 6. The photosensitive composition according to claim 5, wherein the oxime in the formula (I) is a group represented by the following formula (11); [Chemical Formula 2] Formula (II) Wherein, in the above formula (H), an m+1-valent organic group having a carbon number of 2 to 25; any of a carboxyl group, an acryloxy group, and a mercaptopropyloxy group; m represents An integer of 1 to 2; in addition, when m is 2, Zi may be the same or different. 7. The photosensitive composition of claim i, wherein the thermal crosslinking agent is a compound having an oxirane group. 8. A photosensitive solder resist composition characterized by comprising a photosensitive composition, wherein said photosensitive composition contains at least one of a group reactive with a radical and a group reactive with a hot parent. A compound having a tri-β ring, a polymerizable compound, a photopolymerization initiator, and a thermal crosslinking agent. A photosensitive solder resist film comprising: a support; a photosensitive layer 'separated on the support, comprising a photosensitive resist composition containing a photosensitive composition, wherein the photosensitive composition contains At least one of a group reactive with a radical and a group reactive with a thermal crosslinking agent, a compound of a triazole ring, a polymerizable compound, a photopolymerization initiator, and a thermal crosslinking agent. 85 201235781 41436pif 10. A permanent pattern forming method is characterized in that a photosensitive I composition containing a photosensitive composition is applied onto a surface of a substrate, dried, and a photosensitive layer is laminated to form a laminate. Development is carried out after exposure, and the photosensitive composition contains at least one of a group reactive with a radical and a group reactive with a hot parent agent, and a compound of a tri-β ring, a polymerizable compound, and photopolymerization. Starting agent, thermal crosslinking agent. 11. A permanent pattern characterized in that it is formed by a permanent patterning method according to the following method. The permanent pattern forming method is a method of applying a photosensitive solder resist composition containing a photosensitive composition to a substrate. On the surface, after drying and laminating a photosensitive layer to form a layered body, development is carried out after exposure, and the photosensitive composition contains at least a radical reactive with a radical and a base reactive with a thermal crosslinking agent. Any of the compounds with a tri-salt ring, a polymerizable compound, a photopolymerization initiator, and a thermal crosslinking agent. 12. A printed circuit board characterized by forming a permanent pattern by a permanent pattern forming method of applying a photosensitive solder resist composition containing a photosensitive composition to a substrate On the surface, after drying, a photosensitive layer is formed to form a laminate, and then developed, and the photosensitive composition contains at least one of a group reactive with a radical and a group reactive with a thermal crosslinking agent. The compound, the polymerizable compound, the photo-initiator, and the thermal cross-linking|| 86 201235781 414^6pit IV. Designated representative map: (1) The representative representative of the case is: None. (2) A brief description of the component symbols of this representative figure: None. 5. If there is a chemical formula in this case, please disclose the chemical formula that best shows the characteristics of the invention: No 0 201235781 -Γ X 1 is the 101104021 Chinese manual without a slash correction. Amendment date: May 10, 2011 PCT specification Do not fill in the mark) (The format and order of this manual, please do not change the classification: ' 1/ls ※Application number: Apply by ※曰: ρ (Ά H°^K (2〇〇-^ϊ) Title: (Chinese / English) „ ,.上,, C〇Sl Ί^/n, 91) Photosensitive composition, photosensitive solder resist composition and photosensitive solder resist film and permanent pattern, forming method and printing thereof Substrate 〇PHOTOSENSITIVE COMPOSITION, PHOTOSENSITIVE SOLDER RESIST COMPOSITION, PHOTOSENSITIVE SOLDER RESIST FILM, PERMANENT PATTERN, PERMANENT PATTERN FORMING METHOD AND PRINTED BOARD II. Abstract: A photosensitive composition 'containing: having a base reactive with free radicals and At least one of the groups reactive with the thermal crosslinking agent and the compound of the tri-wax ring, the polymerizable compound, the photopolymerization initiator, the thermal crosslinking agent It is preferable to further contain a polymer compound having a carboxyl group. Preferably, the polymer compound containing a carboxyl group is an acid-modified polyaminocarbamic acid resin containing an ethylenically unsaturated group. III. English Abstract: A photosensitive Composition contains a compound having a triazole ring and at least one of a group capable of 201235781 &quot;Ύ X χ Amendment date: May 1st, 1st, 10th, 10th, 11th (No. 621, Chinese manual, no slash correction, sixth, invention [Technical Field] The present invention relates to a photosensitive composition which can be suitably used in a solder resist or the like, a photosensitive solder resist composition using the photosensitive composition, and a photosensitive resist Photosensitive solder resist film of flux composition, and fine pattern (protective film, interlayer insulating film, solder resist, etc.), bean method, and printed substrate. ', y [Prior Art] In recent years, electronic machine n has acted Communication _ is representative of small, thin, lightweight and high performance, high functionality, high quality, high reliability, in such an electronic machine The electronic component model mounted on the device is high in density. In response to such a demand, the substrate used in recent years is gradually changing from a ceramic wiring substrate to a so-called printed substrate, which is made of oxygen weiwei m, which is on the surface of the insulating substrate. A wiring conductor layer is formed by using a copper or gold as a low-resistance metal, and the substrate includes a glass fiber Ά secret grease capable of achieving weight reduction and high brittleness. Further, the printed circuit board is gradually transitioning to a buildup wiring substrate which is more capable of achieving high-density wiring. Such a build-up wiring board can be produced, for example, by laminating a film comprising a ruthenium-curable resin layer on a board containing a glass fiber and a ring (tetra) grease, and thermally curing the film to form an insulating layer. The surface of the insulating layer is chemically roughened by the opening of the carbon dioxide carbon dioxide, and the surface of the insulating layer is formed by the electroless copper plating method and the electrolytic copper plating method, thereby correcting the opening date: May, 101 10th 201235781 τ 1 -ry is the Chinese manual No. 1011〇4621. The wiring layer is formed on the surface of the insulating layer without forming a scribe line, and the formation of the insulating layer and the wiring conductor layer is repeated. Moreover, in order to prevent the wiring conductor from being oxidized or rotted and protecting the insulating layer from the heat of the electronic components of the distribution board, the surface of the wiring substrate is formed to have a thickness of 2 μm to 5 〇 (4). Anti-flux 2 The solder-resistant riding-like-like town contains the conductor layer and the insulating layer, and has a good compatibility. The flexible tree 2 is used to match the thermal expansion coefficient of the thermal expansion to the insulating layer or the wiring conductor layer. It contains 5 wt% to 75 wt% of an inorganic filler. However, in the case of the solder resist layer, the soluble photocrosslinkable resin is generally contained in order to exhibit developability in forming an opening in the solder resist layer by exposure and development, and therefore contains a base or a county. There is a problem that the water absorption rate is high and the moisture in the air is gradually absorbed, and the moisture causes the insulation t resistance of the solder resist layer to be reduced to _ or less, and the wiring conductor layer is further connected to the wiring conductor layer. As a result, the electrical reliability of the wiring board is deteriorated. A technique in which a solder resist layer contains a nitrogen-containing heterocyclic compound (imidazole compound, tri-waxy compound, etc.) is known. When this technique is used, the heat resistance of the shaft welding resistance is changed, but there is a problem that the plating property is lowered. Further, when the smoothness of the side surface of the photoresist pattern is poor, a gap is formed between the solder and the side surface of the photoresist pattern when the splicing is performed, and the void expands due to heating, thereby causing an abnormality such as solder peeling, which is stored in the above technique. The smoothness of the side of the resist pattern is not sufficient. Moreover, as a technique for using a triazole compound in a photosensitive composition, the following description is given on the Japanese version of the Japanese Patent No. 101104621. Photosensitive composition: a polymer binder containing several groups, a compound having an average of at least one ethylenically unsaturated double bond in the molecule and an average of at least one triazole ring, a photopolymerizable monomer, and a photopolymerization initiation For example, refer to Japanese Laid-Open Patent Publication No. Hei 6-43638. According to the technique of the proposal, although the development residue is suppressed and a composition having good adhesion is obtained, the technique of the proposal has the following problems: the insulation required for the solder resist layer, the scratch resistance, and Smoothness of the side of the photoresist pattern. Therefore, the current state of the art is to provide a photosensitive composition excellent in insulation, mineralization resistance, and smoothness on the side of the photoresist pattern. SUMMARY OF THE INVENTION An object of the present invention is to solve the problems described above and achieve the following. That is, the purpose of the present invention is to provide a photosensitive composition excellent in insulation, mineralization resistance, and smoothness of the side surface of the photoresist pattern. The method for solving the problem is as follows. That is, the photosensitive group of the present invention is complicated by the fact that at least one of the groups which can react with the thermal crosslinking agent, the polymerizable compound, and the photopolymerization port [effect of the invention] Start-up, hot-crossing agent. The problems described above have achieved the excellent photosensitive composition of the above-mentioned purpose. And the smoothness of the side of the first-resistance pattern [Embodiment] 201235781 -τ ί -r^v/pj.il For the Chinese manual No. 101104621, there is no slash correction. This revision date: May 10, 101 (photosensitive composition) The photosensitive composition of the present invention contains at least one of a compound having a group reactive with a radical and a group reactive with a thermal crosslinking agent, a compound of a triterpene ring, a polymerizable compound, a photopolymerization initiator, and a heat. The crosslinking agent preferably contains a polymer compound containing a rebel group, and further contains other components as needed. &lt;Compound having at least one of a group reactive with a radical and a group capable of reacting with a thermal crosslinking agent with a triterpene ring&gt; as a group capable of reacting with a radical and capable of reacting with heat a compound of at least one of the group of the crosslinking reaction and a compound of the triazole ring, if it is a compound having at least one of a group reactive with a radical and a group reactive with a thermal crosslinking agent, and a two-degree ring, There is no particular restriction, and it is suitable to be selected as needed. Examples of the group reactive with a radical include a propylene methoxy group, a methacryl 〇 〇 oxy group, a vinyl phenyl group, an allyl group, and the like. Examples of the group reactive with the thermal crosslinking agent include a mercapto group, an amine group, a mercapto group and the like. The triazole ring may be any of a 1,2,3-triazole ring and a 1,2,4-triazole ring. 1,2,3-triazole and 1,2,4-triazole are compounds represented by the following structural formulas. 7 201235781 Τ 1 A is the Chinese manual No. 101104621. There is no slash correction. This revision date: May 1st, 101st, 2011 [Chem. 1] HIST, Μηντ^ν 132, 3-Three 嗤 1,234 • Three saliva a compound reactive with a radical and at least one of a group reactive with a thermal crosslinking agent and a compound of a triazole ring, in other words, a group reactive with a radical and reacting with a thermal crosslinking agent At least one of the organic groups is bonded to a compound on the triazole ring. The bonding position of the organic compound based on the triazole is not particularly limited, and may be appropriately selected as needed, and may be bonded to a nitrogen atom of the triazole ring or may be bonded to a carbon atom. The compound having at least one of a group reactive with a radical and a group reactive with a thermal crosslinking agent and a tris-cycline is preferably a compound represented by the following formula (manufacture). X 广, -Υ η General formula (I) wherein, in the general formula (U, χ represents a triazole ring. γ represents a group reactive with a radical and can react with a thermal crosslinking agent. At least 201235781 is the 101104621 Chinese manual without a slash correction. This correction date: 101 years sn fly 'April 10th's organic base. η represents an integer from 1 to 3. In addition, n is 2~ In the case of 3, Y may be the same or different. Further, in the above formula (Ϊ), the γ may be bonded to a nitrogen atom as the X-triazole ring or may be bonded to a carbon atom. The η in the above formula (1) is preferably from 1 to 2, more preferably 2. If η is 2, it is advantageous in terms of insulation. The oxime in the formula (I) is preferred. It is a group of the following formula (π), which is represented by the following formula (π): No (Chemical Formula 3) Formula (II) wherein, in the above formula (11), Y1 represents a carbon number of 2 to 25 m+ valence organic Base. 4 table slightly base, (d) decyloxy and thiol The foundation of the person - the person. m represents an integer of Bu 2 . In addition, ; can be the same or different. The scoop 2 day f, the number of the handles is 2 to 25, and the m+1 machine base is not particularly limited, and it is suitable to select 'for example, at least one having a gland bond, a brewing amine bond, and a thiourea bond. The carbon number is 2 to 25 m. Further, the carbon number of the organic group is preferably 2 to 20, more preferably 2 = / the group having a reactive group with a radical and a heat-reducible group The molecular weight of the compound with three (four) = m should be selected (four) should be selected, preferably 9 〇 ~ 丨 na, more (10) 201235781 ~ T AT ^ V ^ ll.1 for the 1011 〇 4621 Chinese manual without a slash correction Amendment date: May 10, 101, as a specific example of the compound having at least one of a group reactive with a radical and a group reactive with a thermal crosslinking agent, and a compound of a ternary ring, for example, The compound represented by the formula and the like. [Chemical 4] 201235781』 ϋ f〇1104621 Chinese manual without line correction This revision date: May 10, 101 [Chem. 5] - a content of a compound having a radical reactive group and a group reactive with a thermal crosslinking agent and a triazole ring - the radical reactive group and the thermally reactive crosslinking agent The ruthenium containing the compound of the triazole ring and the compound of the triazole ring in the photosensitive composition is not particularly limited, and may be appropriately selected as needed, and is in the Chinese specification No. 0046! Straight line correction This correction date: For the solid matter of the photosensitive composition on May 1st, 101, it is preferable that i 〇 wt% 〜 wt/^' is more 疋 1.5 wt% 〜 10 wt%. When the content is less than 1.0 wt%/〇, sufficient insulating properties may not be exhibited. When the content exceeds 2% by weight, the heat resistance may be lowered. If the content is in the above-described range, it is advantageous in terms of both heat resistance and insulation. &lt;Polymerizable compound&gt; The polymerizable compound is not particularly limited, and may be appropriately selected as needed. A compound having at least one addition polymerizable group in a molecule is preferable. More preferably, such a compound is at least one selected from the group consisting of monomers having a (meth)acryl group. Further, the polymerizable compound is a compound different from the compound having at least one of a group reactive with a radical reaction and a group reactive with a thermal crosslinking agent, and a triazole ring. The monomer having a (fluorenyl) propylene group is not particularly limited, and may be appropriately selected as needed, and examples thereof include polyethylene glycol mono(indenyl) acetoacetate and polypropylene glycol mono(decyl) acrylate. Monofunctional acrylate or monofunctional decyl acrylate such as (meth)acrylic acid stupidoxyethyl acrylate; polyethylene glycol bis(indenyl) acrylate, polypropylene glycol bis(indenyl) acrylate 'trihydroxy fluorenyl乙娱乐^ (曱基) 埽 埽 vinegar, 曱 曱 丙 丙 丙 ( ( ( ( ( ( 醋 醋 醋 醋 三 三 三 三 三 三 三 三 基 基 基 基 基 基 基 基 基 基 基 基 基 基 基 基 基 基Acetate vinegar, quaternary tetraol tetra(indenyl) acrylate vinegar, pentaerythritol tris(meth) acrylate vinegar, dipentaerythritol hexa(methyl) acrylate vinegar, diquaternary quinone tetraol quinone ) acrylate, hexanediol di(meth) acrylate, dicyclodecyl decyl alcohol bis(command) acryl vinegar, trimethyl methacrylate tris (propylene oxypropyl) ether, three (C) &quot;Rare 12 201235781 *τ Amendment date: May 10, 101 is the 1011〇4621 Chinese manual without a slash correction of the oxyethyl) isocyanuric acid , tris(acryloxyethyl) uric acid vinegar, glycerol tris(mercapto) acrylate, addition reaction of polyfunctional alcohol such as trimethylolpropane or glycerol, bisphenol, etc. In the case of the propylene oxide, the (meth) acrylated product is disclosed in the publications of the Japanese Patent Publication No. Sho 48-417-8, the Japanese Patent Publication No. Sho 50-6034, and the Japanese Patent Laid-Open No. 51-37-93. The exemplified in the publications of the Japanese Patent Publication No. 48-64183, the Japanese Patent Publication No. SHO-49-43191, and the Japanese Patent Publication No. Sho 52-30490 Polyester acrylates; polyfunctional acrylates such as epoxy acrylates which are reaction products of epoxy resins and (fluorenyl) acrylic acid, and mercapto acrylates. More preferred among these monomers are dicyclopentyl decyl bis(mercapto) acrylate vinegar, trimethylolpropane tri(meth) acrylate, pentaerythritol tetra (meth) acrylate (pentaerythrit 〇 1 tetra (meth) anal you), dipentaerythritol hexa(indenyl) acrylate, dipentaerythritol penta (meth) acrylate. - content of the polymerizable compound - the content of the polymerizable compound in the photosensitive composition is not particularly limited 'optional (four) is preferably selected, and is preferably relative to the solid matter of the photosensitive group & It is 2 wt% to 5 wt%, more preferably 3 wt% to 40 wt%, and particularly preferably 4 wt% to 35 wt%. When the content of the polymerizable compound is less than 2% by weight, the pattern may not be formed. If it exceeds 50% by weight, the crack resistance may be poor. On the other hand, when the content of the polymerizable compound is within the above-special range, it is advantageous in terms of improvement in pattern formability and crack resistance. 13 201235781 ^ΜΗ-^υριιι _ Date of revision: January 10, 2011 is No. 101104621 Chinese specification, no sizing correction &lt;photopolymerization initiator&gt; The ability to initiate polymerization of the polymerizable compound is particularly limited, and may be appropriately selected as needed, and examples thereof include a halogenated hydrocarbon derivative, a phosphine oxide, a hexaaryldiimidazole, an anthracene derivative, an organic peroxide, and sulfur. a compound, a ketone compound, an aromatic rust salt, a ketoxime or the like. Examples of the hydrocarbon derivative include a halogenated hydrocarbon derivative having a triazine skeleton, a toothed hydrocarbon derivative having a oxadiazole skeleton, and the like. The halogenated hydrocarbon derivative having a triazine skeleton is not particularly limited and may be appropriately selected as needed, and examples thereof include, for example, Lin Lin et al., Bulletin of the Chemical Society of Japan (Bull. Chem. Soc. Japan), 42, 2924 (1969) The compounds described in the 'British Patent No. 1,388,492, and the compounds described in the specification of the German Patent No. 53-133428, and the compounds described in the specification of German Patent No. 3337G24, ^C. Schaefer The organic chemical compound (J 〇rg❽); the compound described in μ, Chong Ba, Japanese Patent Laid-Open No. 62-58241 Ϊ = Japanese Patent Laid-Open No. 5- and No. 28, if there is oxadiazole. Examples of the halogenated hydrocarbon derivative of the skeleton 10, and the like, and the oxime (〇xime) derivative of the compound described in U.S. Patent No. 4, No. 6-# is not particularly limited and may be selected, for example, Open 2〇〇7卿201235781 For the 101104621 towel __ slash correction date of revision: May 1, 101, the compound described in "〇〇85". For example, it is a special limitation, and it can be selected as needed. The 2〇07·2030 special opening initiator can be exemplified by the patent. ~ The compound described in the report No. 0〇86" Ο degree or: Ϊ wave = = exposure sensitization of the light layer for exposure. </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> sensitization can be added. , ', Ο 詈 詈 pure base agent generator, etc.) interaction (example n electron movement, etc.) to generate free radicals or acids and other useful groups. The compound described in the product; 7-2°3 system, the combination of household and the sensitizer is not specifically limited to electronic type: and: ^, prime, (1) electron-donating initiator starter and sensitized color element starting system m combination . Sensitive pigments and electron-withdrawing initiators (3, 15, 2012, 357, 4, 4, 4, 4, 4, 4, 4, 4, 4, 4, 4, 4, 4, 4, 4, 4, 4, 4, 4, 4, 4, 4, 4, 4, 4, 4, 4 It is preferable to select 'with respect to the solid matter of the photosensitive composition, preferably 0.05 wt% to 30 wt%, more preferably 0.1 wt% to 20 wt%, and particularly preferably 0.2. If the content of the sensitizer is less than wt5 wt%, there is a decrease in the sensitivity of the active energy ray, and the exposure process takes time and the productivity is lowered; if it exceeds 30 wt%, There is a phenomenon in which the sensitizer is chromatographed from the photosensitive layer during storage. The photopolymerization initiator may be used singly or in combination of two or more kinds. The photopolymerization initiator may be specifically used as an example of a laser light having a wavelength of 405 nm in the exposure described later. a composite photoinitiator, a hexaaryldiimidazole compound, a titanocene, etc., wherein the composite photoinitiator is a halogenated hydrocarbon compound having a phosphine oxide, an α-amino group, and a triazine skeleton. The amine compound of the sensitizer is combined. - content of photopolymerization initiator The content of the photopolymerization initiator in the photosensitive composition is limited, and may be selected according to the need (4), and is preferably Q 5 wt% with respect to the solid matter of the photosensitive phase. 2Qwt%, better = 5 wt% ~ 15 wt% 'extra good is} wt% ~ Q wt%. If the photopolymerization agent contains 1 wt% of the material, the exposed portion tends to be in the development; if it exceeds 2 G wt%, the heat resistance is reduced and the photopolymerization is carried out. If the content of the initiator is within the special consumption, it is advantageous to avoid the shape of the good shape and the resistance. Knife 16 201235781 τ a -r^/v^LmLX Revision date: May 10, 2011 is No. 1011〇4621 Chinese manual No sizing correction &lt;Hot crosslinking agent&gt; The hot parent agent is not It is particularly limited, and may be appropriately selected as needed. Preferably, the hydrazine has a ring-shaped transalkyl group, a succulent iso-lactic acid acrylate group, and a noise. A compound having at least one functional group of a base group and an ethylene carbonate group. Examples of the thermal crosslinking agent include a compound having a cyclic ether group, a compound having a blocked isocyanate group, a compound having an oxazolyl group, a compound having an ethylene carbonate group, and the like. 〇 〇 The compound having a cyclic ether group may, for example, be a compound having an oxirane group or a compound having an oxypropylene group. The compound having an ethylene oxide group may, for example, be an epoxy compound having at least two oxirane groups in one molecule. The compound having an oxetane group may, for example, be a cow such as an epoxy oxime compound having at least two propylene propylene fibers in one molecule. The epoxy compound is not particularly limited, and may be optionally combined with a dimethyl phenol type or a biphenyl phenol type epoxy resin (YX4_, manufactured by Sanken Chemical Co., Ltd.) or the like, or a mixture thereof. Heterocyclic Epoxy Tree ("TEPIC; 曰 化 么 么 」 」 、 、 、 、 Ar Ar Ar Ar Ar Ar Ar Ar Ar Ar Ar Ar Ar Ar Ar Ar Ar Ar Ar Ar Ar Ar Ar Ar Ar Ar Ar Ar 、 、 、 、 、 、 、 、 、 、 Type a epoxy resin, phenolic fat, double bismuth type epoxy resin ("Ep〇t〇ht〇 epoxy f", money (four) 魏 type Wei resin, glycidylamine type dimethyldiene internal conversion epoxy resin, alicyclic Epoxy Resin ί Si ί Epoxy Resin, Double Hope S Type Epoxy Resin, Double Hope A _ 'Wei Resin, Tetraphenyl Ethylene Ethylene Epoxy Resin, Phthal Acid 17 201235781 Tl-Γ^ Wpn. χ For the Chinese version of No. 1011〇462l, the duck has no underline correction. The date of this amendment: May 10, 101, glycidyl vinegar resin, tetraglycidyl dinonyl phenol ethane resin, epoxy resin containing naphthyl ("ESN -190, ESN-360; manufactured by Nippon Steel Chemical Co., Ltd., "HP-4032, EXA-4750, EXA-4700; manufactured by DIC", etc.) Epoxy resin having a dicyclopentadiene skeleton ("HP-7200, HP-7^〇〇H" DIC company" #), methacrylic acid glycidyl brewing copolymer epoxy resin ("CP-5〇 s, CP-5〇M; manufactured by Nippon Oil Company, etc.), Cycloheximide (4)? Base __ water glycerin red copolymerized epoxy tree Fat and so on. These epoxy compounds may be used singly or in combination of two or more. The % oxypropyl ketone compound is not limited, and may be selected as appropriate. For example, a polyfunctional epoxy propylene compound described in Japanese Patent Laid-Open No. _, "," may be mentioned. , a compound having an embedded &amp; isocyanate § group is not particularly limited, and 1 1 is a selective choice, for example, a blocking agent (bl°ck agent) can be cited as a heterogeneous brewing reaction of the bamboo organism. And the pseudonym obtained For example, block polyisocyanide _ etc. described in Japanese Patent Laid-Open No. Hei. Suitable for selection; Example: The compound of the dibasic group is not particularly limited. It is desirable to have an unsaturated monomer of 24 groups based on the demand of other unsaturated monomers. Lin has the commercial product, for example, === using a commercial item. ΕΠ1005 and so on. EPOCRO 18 201235781 manufactured by a certain company is the 10th nickname Chinese manual without a slash correction. This correction is not limited to the compound having ethylene carbonate group as described on May 1st, 1st, 1st, and may be suitable as needed. The selection 'for example, an acrylic resin having an ethylene carbonate group or the like can be cited. The acrylic acid-containing copolymer described in Japanese Laid-Open Patent Publication No. Hei No. 1-146968, and the like. t曰 These compounds may be used alone or in combination of two or more. Among these compounds, the compound having an oxiranyl group is preferred in terms of smoothness and insulation of the pattern side 0. - the content of the thermal crosslinking agent - the content of the thermal crosslinking agent in the photosensitive composition is not particularly limited, and may be appropriately selected as needed, relative to the solid matter of the photosensitive composition. It is preferably 1 wt% to 5 〇 wt 〇 / 〇, more preferably 2 〜 40 wt% 'extra good is 3 wt% 〜 30 wt%. When the content of the thermal crosslinking agent is less than 1% by weight, the heat resistance is deteriorated, and when it exceeds 5 % by weight, the developability or the crack resistance is deteriorated. On the other hand, when the content is within the above-mentioned range, the cured film can be produced with good sensitivity, and the formed cured film is also advantageous in terms of both heat resistance and crack resistance. &lt;Polymer compound containing a carboxyl group&gt; The polymer compound having a carboxyl group is not particularly limited as long as it is a polymer compound having a carboxyl group, and may be appropriately selected if necessary. For example, an acid-modified ethylenically unsaturated group may be mentioned. The polyurethane resin, an acid-modified epoxy resin containing an ethylenically unsaturated group, an acrylic resin containing an ethylenically unsaturated group and a carboxyl group, a polyimide precursor, and the like. Among these compounds, 19 201235781 Τ XA Revision date: 1〇1月10月10曰第101104621号 Chinese manual No underline correction This acid modification contains polyunsaturated group of polymethylmethyx in anti-cracking It is preferable in terms of excellentness. Ester Resin, etc. - (i) Modification of Polyurethane Resin Containing Ethylene Unsaturated Groups as Acid Hydrogenated Ethyl Carbamate Containing Ethylene Unsaturated Groups The resin is not particularly limited as long as it is a polyaminocarbazide having a carboxyl group and an ethylidene group having an acid group, and may be appropriately selected as needed, and enumerated (1) having a vinyl group in the side chain. The saturated polyaminocarbamate, the polyamine-based acid group of the county contains a polyaminocarboxylic acid having a ring 5:5:5 olefinic acid in the molecule. The polyaminocarbamic acid having a polyunsaturated group having an ethylenically unsaturated group and having no chain group has the following oxime, and is suitably selected, and for example, it can be exemplified by one having less than one side. - in the functional group represented by the formula (3) to [Chem. 6] 0 - X ~ 〇 ^ V R3 5C 〆 R1, R2 Formula (1 or (1) in the formula "1" represents the hydrogen atom 20 201235781u Amendment date: May 1, 2011 is No. 1104621 Chinese manual without scribe correction. R is not particularly limited. It can be selected as needed. For example, hydrogen atoms can be transmitted. In the aspect of radical reactivity, a preferred one of the groups is a hydrogen atom or a mercapto group. Further, 'the R and R3 are not particularly limited, and may be appropriately selected as needed, and each of them may independently be, for example, a hydrogen atom, a halogen atom, an amine group, a carboxyl group, a calcined base, a hetero atom, a nitro group, a cyano group, or a filament having a substituent, a filament which may have a substituent, an alkoxy group which may have a substituent, a green group which may have a minus group, a sulfhydryl group which may have a substituent, or a substituent The silk amine group may also have a substituent base group, or may have a silk gamma group or the like. In terms of high radical reactivity, the base group is preferably a hydrogen atom, a silk, an alkoxy group, an alkyl group which may have a substituent, or an aryl group which may have a substituent. In the above formula (1), X represents an oxygen atom, a sulfur atom, or _N(R12)-', and Ri2 represents a hydrogen atom or an i-valent organic group. The rU is not particularly limited and may be appropriately selected as needed, and examples thereof include a calcining group which may have a substituent. Preferred among the radicals in terms of high radical reactivity are a hydrogen atom, a mercapto group, an ethyl group, and an isopropyl group. ^ The substituent which can be introduced here is not particularly limited, and may be appropriately selected as needed, and examples thereof include an alkyl group, a dilute group, a fast group, an aryl group, an alkoxy group, an aryloxy group, and a halogen atom. Amino, alkylamino, arylamino, carboxy, alkoxycarbonyl, sulfo, nitro, cyano, decylamino, alkylsulfonyl, arylsulfonyl and the like. 21 201235781 _ ▲ I w *w ·* Revision date: May 1st, 101st is the 101104621 Chinese manual without a slash correction [7] R4 R8 —Y''C—C=C Λδ 〇6 p7 HH Formula (2), wherein the formula (42) f ' R4 to R8 each independently represent a hydrogen atom or a 11⁄2 group. R to R are not particularly limited, and may be appropriately selected as needed. For example, a hydrogen atom, a hydroxyl atom, an amine group, a dialkylamino group, a carboxyl group, an alkoxy group, a county, a nitro group, an I group, and the like may be mentioned. An alkyl group which may have a substituent, a filament which may have a substituent, an alkoxy group which may have a substituent, an aryloxy group which may have a substituent, an alkyl group which may have a substituent, or may have The arylamino group of the substituent, the alkylsulfonyl group which may have a substituent, the arylsulfonyl group which may have a substituent, and the like. Preferred among these groups are a hydrogen atom, a carboxyl group, an alkoxycarbonyl group, an alkyl group which may have a substituent, and an aryl group which may have a substituent. Examples of the substituent which can be introduced include the same as those of the above formula (丨). Further, Y represents an oxygen atom, a sulfur atom, or (Rl2) _. The R1 is synonymous with the case of R12 of the above formula (1), and the preferred examples are also the same. [化8] General formula (3) 22 201235781^ Revision date: ι〇ι年五月 ίο日 is the first ΰηι〇462 中文 Chinese manual without a slash correction in the general formula (3) t, R9 ~ Ru independently represent hydrogen Atom or a monovalent group. The R is not particularly limited and may be appropriately selected as necessary, and examples thereof include a hydrogen atom or a burnt group which may have a substituent. In terms of high radical reactivity, a chlorine atom or a methyl group is preferred among the groups. R and R11 are not particularly limited and may be appropriately selected as necessary, and examples thereof include a hydrogen atom, a halogen atom, an amine group, a di-silyl group, a thiol group, a fluorenyl group, a hetero m group, and a substituent. An alkyl group which may have a substituent, an alkoxy group which may have a substituent, an aryloxy group which may have a substituent, an alkyl group which may have a substituent, or a substituent An arylamine group, an alkylsulfonyl group which may have a substituent, an arylsulfonyl group which may have a substituent, and the like. In the case of high radical reactivity, preferred among these groups are a hydrogen atom, a carboxyl group, an alkoxycarbonyl group, an alkyl group which may have a substituent, and an aryl group which may have a substituent. Here, the substituent which can be introduced can be exemplified as the same as the above formula (1). Further, in the above formula (3), z represents an oxygen atom, a sulfur atom, υ-n(r13)-, or a phenylene group which may have a substituent. The R is not particularly limited and may be appropriately selected as needed, and examples thereof include a base having a substituent and the like. Preferred among these groups are a mercapto group, an ethyl group, and an isopropyl group in terms of high radical reactivity. The polyaminocarbamic acid having an ethylenically unsaturated group in the side chain is a t-amino formic acid resin which is a structural unit represented by the reaction product of the following compound. (4) At least one of the diaryl acid ester compounds and the diol compound 23 represented by the following general formula (5): 201235781 is the third specification of the Chinese Patent Specification No. 1104621. At least one of the first one in May of the year. OCN-X°-NCO ··· (4) HO-Y°-〇H . · · (5) In the above formula (4) and the formula (5), X0, Y0 The divalent organic residue is independently represented. At least one of the diisocyanate compound represented by the formula (4) or the diol compound represented by the formula (5) has the formula (1) to the formula (3). A polyamino phthalate resin in which a group represented by the above formula (1) to the formula (3) is introduced as a side chain, and the diisocyanate compound and the diol compound are formed in at least one of the groups. reaction product. By the method, the substitution of the desired side chain after the formation of the reaction of the polyurethane resin can be more easily produced in the side chain and introduced into the side chain (1). a polyamino phthalate resin represented by the formula (3). The diisocyanate compound represented by the formula (4) is not particularly limited as it is, and may, for example, be a monofunctional alcohol having an ethylenic acid group and an equivalent amount of a monofunctional alcohol. The diisocyanate compound obtained by the addition reaction of the mono-complex is not particularly limited, and may be carried out as needed. For example, Japanese Patent Laid-Open No. 2005- Bulletin No. 250438 ^ 24 201235781 X Date of revision: May 10, 101 is the first 〇 1 Na 2 蚊 _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The monofunctional alcohol or the monofunctional amine compound having an ethylenically unsaturated group is not particularly limited, and may be appropriately selected as needed, and for example, it can be exemplified in the Japanese patent system "(25) "0040" The compound or the like described. Further, there is no particular limitation on the side chain of the polyamine-based resin to introduce the ethylidene and the base, and it may be appropriately selected as needed, preferably Ο for the side chain containing ethylenic unsaturation. The base diisocyanate compound is used as a method for producing a raw material of a polyurethane resin. The diisocyanuric acid compound is not limited by the definition, and may be appropriately selected, and examples thereof include a triisocyanate compound and one equivalent of a monofunctional alcohol or a monofunctional amine compound having an ethylenically unsaturated group. The diisomeric compound obtained by the addition reaction, for example, a compound having an ethylenically unsaturated group in a side chain, as described in JP-A-2005-250438, pp. The polyurethane sulfonate having an ethylenically unsaturated group in the side chain may be improved in compatibility with other components in the photosensitive composition, and the storage stability may be improved. A diisocyanate compound other than the diisocyanate compound containing an ethylenically unsaturated group is copolymerized. The copolymerized diisocyanate compound is not particularly limited and may be appropriately selected, and examples thereof include a diester compound represented by the following formula (4). OCN-L^NCO .·· (6) 25 201235781 is the 1011 (Μ621 Chinese manual without a slash correction) 乂 Revision date: May 10, 101 in the general formula (6), T1 main Preferably, the alkyl group, the aryl group, and the aryl group have a substituent (for example, any of a divalent aliphatic or aromatic fluorenyl group). There is no particular limitation on the compound of the amino group or the ureido group. The compound of the amino group, the urethane carboxylic acid group, and the diisoxamate compound are not particularly limited, and may be appropriately selected as needed, for example, 24_ Toluene gas vinegar, dimerization of 2,4-toluene diisocyanate vinegar; cyanide; f4: p-benzophenone sylvestre, m-xylylene methylene diisocyanic acid vinegar, factory one base Burning an aromatic diisocyanate compound such as isocyanuric acid, 1&gt;5_naphthalene diacetate, 3,3,-dimethyl, biphenyl_4,4'-diisocyanate, Anthraquinone diisocyanate, such as hexamethylene diisocyanate, trimethylhexadecyl diisoacetoic acid vinegar, anthraquinone &amp; monoisocyanate, monopoly diisocyanate, etc. Ketone diisocyanate , 4,4'-methylene double (cyclohexyl acetoacetate), mercaptocyclohexane-2,4 (or 2,6) diisocyanate, n (isocyanate decyl) cyclohexane and other fats a cycloisocyanate compound; a diisocyanate compound or the like which is a reaction product of a diol and a diisocyanate, etc., which are used as a reaction product of a diol and a diisocyanate. One type of the alcohol compound represented by the above formula (5) is not particularly limited, and may be appropriately selected as necessary, and examples thereof include a polyether diol compound, a polyglycol diol compound, and a poly High molecular weight diol compound such as carbonate diol compound; low molecular weight diol compound such as ethylene glycol or neopentyl glycol; having ethylenic unsaturation 26 201235781 -----Γ.η is No. 101104621 Line correction date of this revision: May 10, 101, a base alcohol compound; a diol compound having a tickic acid group. Here, as a method of introducing an ethylenically unsaturated group into a side chain of a polyurethane resin, in addition to the above method, a diol compound having an ethylenically unsaturated group in a side chain is used as a product for producing an amino decanoic acid. The method of the raw material of the ester resin is also preferred. The diol compound having an ethylenically unsaturated group in the side chain may be, for example, a commercially available compound such as trihydroxydecylpropane monoallyl ether, and may also be exemplified by a hydrazine diol compound or a triol. A compound which can be easily produced by reacting a compound such as a compound, an amine or a diol compound with a compound containing an ethylenically unsaturated group such as a carboxylic acid, an anthracene, an isocyanate, an alcohol, an amine, a thiol or an alkyl group compound. The diol compound containing an ethylenically unsaturated group in the side chain is particularly limited, and may be appropriately selected as needed. For example, the paragraph "〇〇57" to the paragraph "(8)6〇 of the Japanese Patent Laid-Open Publication No. 2005-250438 In the middle of the article, the compound of the Japanese Patent No. 3, the paragraph of the No. 38 publication, paragraph 95 = paragraph "", the compound which is obtained by ring-opening the tetra-dianhydride by the diol compound, The compound scales described in the paragraph "Lai" ~ 〇〇 66" in the paragraph of the Japanese Patent Laid-Open Publication No. 20-55-1( 438). Preferably, the compound towels are represented by the following G). The compound described in the paragraph "〇〇4"~g "嶋" of the patent opening 2〇〇5_25〇4 is a compound ant 27 27 201235781 i JL I JLi ·&amp; Revision period: May 1st, 1st, May 10th, No. 101104621 Chinese manual, no underline correction [Chemistry 9] OH R3 八 R2 Formula (G) In the above formula (6), r1 to r3 each independently represent a 2 valent organic residue, and x represents an oxygen atom, a sulfur atom, or _ ()-, and the R represents hydrogen. An atom, or an i-valent organic group. The same applies to the preferred aspects of R1 to R3 and X in the above formula (6) and the synonymous to R and X of the above formula (1). By (4) from the above formula (6):; =:=:=nr: the strength is increased. The effect of the knife movement can reach the layer of the film resin as ===4 B: The unsaturated amino group of the polyaminocarbamate is used to make the compatibility with other components in the sensitizing composition. == It is considered that the diol compound other than the side chain-containing alcohol compound can be copolymerized. - other than the diol compound containing an ethylenically unsaturated group in the side chain; it can be suitably selected as needed, for example, can be smothered, polyester diol compound, polycarbonate diol 28 201235781^ Revision date: May 10, 101, Chinese _ book without line to repair the compound and so on. Select two ===Do not limit, it may be suitable according to the needs. There is no special restriction on the second section of the mouth. It can be suitable according to the needs; ΟοΓΙ 2005-2^8 In the case of N 1 "N and N. 79", paragraph "〇〇83" - paragraph "〇〇85", ν〇1~^·8 and Νο·13~Ν〇 18 are listed as compounds. The benzene compound is not particularly limited, and may be appropriately selected according to the need, and for example, the paragraph "〇080" to the paragraph "〇〇81" and paragraphs of the Japanese Patent Laid-Open Publication No. 2〇〇5_25〇438 The compound described in Can 9 to No. 12 in "〇〇84". Further, in the synthesis of the polyamino phthalate resin having an ethylenically unsaturated group in the side chain, in addition to the above diol compound, a diol compound having a substituent which does not react with an isocyanate group may be used in combination. . The diol compound having a substituent which does not react with an isocyanate group is not particularly limited and may be appropriately selected as needed, and for example, the paragraph "0087" to the paragraph "〇〇" of the Japanese Patent Laid-Open Publication No. 2005-250438 The compound described in 88". Further, in the synthesis of the polyurethane resin having an ethylenically unsaturated group in the side chain, in addition to the above diol compound, a diol compound having a plurality of groups may be used in combination. The diol compound having a thiol group is not particularly limited, and may be appropriately selected as necessary, and examples thereof include a compound represented by the following formula (8) to formula (10). 29 201235781 —r jl ~τ-/vf !/*▲*· For the l〇ll〇4621 Chinese manual without underline repairΕ Revision date: May 10, 2011 [10] R15HO-L9-present -L10-〇H L11 Formula (8) COOH HO-L9-Ar-L10~OH L11 COOH HO-L9-N-L10-〇H L11 COOH General formula (9) Formula (10) (8) In the formula (10), R15 represents a hydrogen atom, and may have a substituent (for example, a cyano group, a nitro group, a halogen atom (-F, -a, -Br, -I), -CONH2, -COOR16, -OR16, -NHCONHR16, -NHCOOR16, -NHCOR16, -OCONHR16 (wherein R16 represents an alkyl group having a carbon number of 1 to 10 or a carbon number of 7 to 15) Dedicated to the base), aryl group, aryl group, alkoxy group, aromatic group. Preferred among these groups are a hydrogen atom, a condensed group having 1 to 8 carbon atoms, and an aryl group having 6 to 15 carbon atoms. In the above formula (8) to formula (10), l9, L10 and L11 may be the same or different, and each represents a single bond, and may have a substituent (for example, an alkyl group, an aralkyl group, preferably a divalent aliphatic or a hydrocarbon group of a aryl group, an alkoxy group, or a group of a group. Preferably, the base towels have a carbon number of i"2", and a carbon number of 6 to 15 exfoliation groups, and more preferably a broken 30 201235781 τ ι~τ«^ is the 101104621 Correction date in the number: May 10, 101, 10, and the instructions are not slashed to correct this ^ 1 to 8 alkyl groups. Moreover, it can also be seen in the L and LU: = Yes:: Other functional groups reactive with isocyanate groups, such as carbonyl can be described separately! ^Amino, ureido, shout. In addition, in the general formula (9), 〇 〇 彳 1 her base, the job is not controlled, and it may be appropriate to use &amp; preferably, preferably, the carbon number is 6 to 15 aromatic groups. The diol (s) to the diol having a carboxyl group represented by the formula (10) is particularly limited to be appropriately selected, and examples thereof include 3, 5: dibenzoic acid, 2, 2 _ Bis(transmethyl)propionic acid, 2,2-bis(2-transbasic = soil) propane k 2,2-bis(3-propylpropyl)propionic acid, bis(transmethyl)acetic acid, Phenylphenyl)acetic acid, 2,2-bis(ylmethyl)butyric acid, 4,4-bis(4-diphenyl)pentazone, tartaric acid, N,N-dihydroxyethylglycine , n, n_bis(2_ethylidene)-3-sulfanyl-propionamine, and the like. Due to the presence of such a group, characteristics such as hydrogen bonding property and solubility of the polyamino phthalic acid vinegar resin can be imparted, and it is preferable in this respect. More specifically, the polyamine group having an ethylenically unsaturated group in the side chain is a resin which is improved in the side chain, and more specifically, the ethylenically unsaturated group of the side chain is preferred. 〇.〇5 mm〇1/g~3 〇mm〇1/g, more preferably mmol5 mmol/g 2'7 mmol/g ' Particularly good is 〇75 mm〇i/g ～2.4 mmol/ g, and preferably having a carboxyl group in the side chain, and the acid value is preferably 2 〇 mgKOH/g to 120 mg K 〇 H/g ' More preferably 30 mg K0H/g to 11 〇 mgKOH/g 'excellent It is 35 mgK: 〇H/g~1〇〇mgKOH/g. Further, the acid value can be measured, for example, in accordance with JIS K〇〇7〇. Among them, 31 201235781 is the 1st HM621 Chinese manual without a slash correction. Amendment date: May 10, 101. When the sample is not dissolved, use dioxane or tetrahydrofuran as the solvent. The polyamino phthalate resin having an ethylenically unsaturated group in the side chain can be synthesized by adding the above-mentioned diisocyanate compound and diol compound to an aprotic solvent and reacting with each other. Heating is carried out in accordance with a known catalyst of activity. The molar ratio (Ma: Mb) of the diisocyanate and the diol compound used in the synthesis is not particularly limited, and may be appropriately selected as needed. Preferably, it is 1: 1 to 1.2: 1 ' by alcohol or ^ The class or the like is treated to form a product having a desired physical property such as molecular weight or viscosity, in which a bear which does not have an isocyanate group remains. Further, the polyamino phthalic acid vinegar resin having an ethylenically unsaturated group in the side chain may be suitably used in a polyamino phthalate resin having a terminal of a polymer and a ethylenically unsaturated group in the main chain. By the end of the polymer, the main chain has an ethylenically unsaturated group, the photosensitive composition can be further mixed with the polyethyl phthalate resin of the pendant ethylenically unsaturated group or the side chain. The polyamine-based oxime having an ethylenically unsaturated group has a cross-linking reactivity to increase the strength of the photocured material. As a result, a material excellent in toughness is provided in a lithographic printing plate or the like which is used for a side chain having a polystyrene and a base. Introduction of an ethylenically unsaturated group at the end of the polymer: the method shown. That is, using the above-mentioned polymer terminal in the synthesis step of the sub-seven, carboxylic acid-lipid: , "I base" is not used by the lysate or the amine to carry the cleavage with the axis of the engraving and the base Or amines can be. 々, 32 201235781 I Λ. I is No. 101104621 Chinese manual without scribe correction. Amendment date: May 10, 101 as a compound of this kind 'specifically § first can be cited as a monofunctional with ethylenically unsaturated group The compound of the exemplified compound is exemplified by an alcohol or a monofunctional amine compound. In addition, from the viewpoints of easy control of the introduction, increase of the amount of introduction, and improvement of the efficiency of crosslinking reaction, it is preferred to introduce ethyl hydrazine into the polymer side chain more than the polymer terminal. base. The ethylenically unsaturated group to be introduced is not particularly limited, and may be appropriately selected as needed. In terms of crosslinkable cured film formability, allyl group, mercaptopropenyl group, acrylonitrile group, The vinylphenyl group is more preferably a mercaptopropenyl group or a propylene-based group, and a mercaptopropenyl group is particularly preferable in terms of both the formability of the crosslinked cured film and the original preservability. Further, the amount of the mercaptopropenyl group to be introduced is not particularly limited and may be appropriately selected as needed, and it is preferably 〇.5 mmol/g to 3.0 mmol/g, more preferably in terms of ethylene and base equivalent. Preferably, 〇5 mm〇1/g~27 mmol/g, particularly preferably 0.75 mmol/g to 2.4 mmol/g. A method of introducing an ethylenically unsaturated group into a main chain, and a method of using a diol compound having an ethylenically unsaturated group in the main chain direction for the synthesis of a polyurethane resin. The diol compound having an ethylenically unsaturated group in the main chain direction is not particularly limited, and may be appropriately selected as needed, and examples thereof include cis-2-butene-1,4-diol and trans-_2-butylene] , 4_diol, polybutadiene glycol, and the like. The polyamino phthalate resin having an ethylenically unsaturated group in the side chain may also be used in combination with an alkali-soluble polymer as described above. The alkali-soluble polymer contains a structure different from the specific polyaminocarboxylic acid styrene resin. Polyamine A 33 201335781 « Λ- IA is the 101104621 Chinese manual without a slash correction. This amendment date: May 10, 101 acid ester resin. For example, the polyamino phthalate resin having an ethylenically unsaturated group in the side chain can be used in combination with a polyamine phthalic acid resin having an aromatic group in a main chain and/or a side chain. Specific examples of the (i) polyamino phthalate resin having an ethylenically unsaturated group in the side bond include, for example, paragraph "0293" of the Japanese Patent Publication No. 2〇〇5_25〇438. The polymer of pq to p_31 shown in the paragraph "0310". Preferred among these compounds are the polymers of p_27 and P-28 shown in the paragraph "〇3〇8" and paragraph "0309". - (ii) a polyamino phthalate resin obtained by reacting a fluorenyl-containing polyamino phthalic acid vinegar with a compound having an epoxy group and an ethylenically unsaturated group in the molecule - _ containing an enemy group The polyamino phthalate resin obtained by reacting a polyurethane with a compound having an epoxy group and an ethylenically unsaturated group in the molecule is a component containing a diisocyanate and a diol containing a tickic acid group as an essential component. A polyurethane resin obtained by reacting a polyamino phthalic acid ester of a carboxyl group with a compound having an epoxy group and an ethylenically unsaturated group in the molecule. A low molecular weight diol having a weight average molecular weight of 3 Å or less or a low molecular weight diol having a weight average molecular weight of 500 or more as a diol component may be added as a copolymerization component. By using the polyglycolic acid g-based resin, the inorganic filler is excellent in dispersibility, crack resistance, or impact resistance, and thus heat resistance, moist heat resistance, adhesion, mechanical properties, and electrical properties are improved. . Further, the polyurethane resin is a divalent isocyanate which may have a substituent and a diisocyanate of an aromatic hydrocarbon, and a c atom and N 34 201235781 - TlT^VFjJlxT. Straight line correction This correction date: a reaction product in which any one of the atoms is separated on May 10, 101, and the carboxylic acid-containing diol having a COOH group and two 〇H groups is an essential component, and may also be obtained. A compound obtained by reacting a reactant with a compound having an epoxy group and an ethylenically unsaturated group in the molecule and a -COO-bond. Further, the polyaminocarbamic acid-based resin may be a diisocyanate represented by the following formula (11) and a carboxylic acid selected from the group consisting of the following formulas (12-1) to (12-3). At least one of the diols of the diol is an essential component product, Ο and the following formula (丨3.1) to (13-16) have an epoxy group and an ethylenic unsaturated group in the molecule. The resulting compound is obtained by reacting a compound. . [化11] OCN-R^NCO HO— R3 —C~R4 —OH COOH HO—R3—Ar— R4—〇H COOH HO—R3—N— R4 〇H COOH General formula (11) General formula (12-2) (12-3) wherein, in the above formula (11), Ri represents a group which may have a substituent (for example, an alkyl group, an aralkyl group, an aryl group, an alkoxy group, or a halogen group is preferred) 35 201235781 For the Chinese manual No. 101104621, there is no slash correction of the aliphatic or aromatic hydrocarbons of the divalent price of this revision date: one on May 10, 2011. The R! may optionally have any other functional group which does not react with the isocyanate group, such as an ester group, an amino group of the amino group, a Sa group, an amine group, or a gland group. In the general formula (12-1), 'R2 represents a halogen atom, and may have a substituent (for example, including a cyano group, a nitro group, a halogen atom (-F, -CU, -Br, -I), -CONH2, -COOR6, -〇R6, _NHCONHR6, -NHCO〇R6, _NHCOR6, -〇CONHR6, -CONHR "here, r6 represents any of the aromatic groups having a carbon number of argon and a carbon number of 7 to 15. Or an alkyl group, an arylalkyl group, an aryl group, an alkoxy group, or an aryloxy group. Among these groups, preferred are a hydrogen atom, a carbon number of 1 to 3, and a carbon group. The number is 6 to 15 aryl groups. In the above formula (m), formula (12-2) and formula (12-3), R3, R4 and R5 = respectively the same or different 'representation' a single bond, or an aliphatic or aromatic hydrocarbon having a substituent (for example, each of a t-alkyl group, an arylalkyl group, an aryl group, an alkoxy group, or a halogen group). It is preferred that the carbon number is one: 20 alkyl groups, carbon number ό 〜 15 aryl groups, more preferably: number, 1 ~ 8 of the extension base. R3, R4, and R5 are also observed, and have other functional groups that do not react with isocyanate groups. , an ester group, a urethane group, a guanamine group, a urea group, an ether soil. In addition, it is also possible to make a hydrocarbon by the &amp; or 3, preferably ^ir The number of the trivalent aromatic dinuclear having a substituent is 6 to 15 aromatic groups. 36 201235781 -*TI ~r^J wpxfl is the 101104621 Chinese manual without a slash correction. Amendment date: 1 〇1年10月10日[12] CH2=CRi4-CO〇-QJ-J2=CR*|4OO〇— R-(5_ oo ❹ CH2=CRi4COO- ^ o 〇 :0 QHj=CR-f 4ΌΟ N—Rj §—0~ RigTM \ General formula (13-1) General formula (13_2) General formula (13-3) General formula (13-4) General formula (13-5 ) General formula (13-6) General formula (13-7) General formula (13-8) 37 201235781 nuujjiii No. 101104621 Chinese manual no straight line correction This revision date: 1〇1年May 10曰[化13 ] R14 CH2=CR14C〇N-Ri5 -...CH- OH CHjssCR^COORts_—τ'&quot;* HO.''~〆-〇General formula (13-9) ^ CH^OCO :0 General formula (13-10 CRi4〇OORi5'w— HO C〇〇CH〇:0 Formula C13-M) CH2^CR14€〇a r15 o- /— \ General formula (13-12) OH CH2— CR-ί 4COO —( O General formula [13-13) CH2=CRi4COO- General formula (13-14) HO R 16 ^ CORtsO - COH ^15 General formula (13-15) R, s~ 〇10~ COR&quot;. COM R buckle CH2=CR14COO-R1§ 〇( COR1sO-- )s·CON PI ~CC^isO^·—COHR^g CX II ^ General formula (13-16) wherein, in the general formula (13-1) In the formula (13-16), R14 represents a hydrogen atom or a fluorenyl group, R15 represents an alkylene group having a carbon number of 1 to 10, and r16 represents a hydrocarbon group having a carbon number of 1 to 10. P represents an integer of 0 or 1 to 10. 38 20123578丄ϋ Γ〇11〇4621 Chinese manual without scribe correction This revision date: May 1st, 101. The polyamino phthalate resin is particularly suitable for the expression of the formula (u) One of the heterogeneous acids S is a reaction product selected from at least one selected from the group consisting of the carboxylic acid group-containing diols represented by the above formulas (12-1) to (12-3). An acid value of 20 obtained by reacting a compound having one epoxy group and at least one (fluorenyl) propenyl group in the molecule represented by any one of the general formulae (13-1) to (13-16) The soluble photocrosslinkable polyamine phthalate resin was tested at mgKOH/g~120 mgKOH/g. 〇 These polymer compounds may be used singly or in combination of two or more. -3 a method for synthesizing a polyamino phthalate resin obtained by reacting a polyamino decanoic acid g with a compound having an epoxy group and an ethylenically unsaturated group in the molecule... as the polyamino group The method for synthesizing the phthalate resin can be synthesized by adding the above-mentioned diisocyanate compound and diol compound to a non-protic solvent by adding a known catalyst having an activity corresponding to each reactivity. The diisocyanate to be used and the diol compound are preferably G.8: 1 to 1.2:1. When an isophthalate group remains at the terminal of the polymer, it is carried out by an alcohol or an amine. The treatment is carried out in such a manner that the isocyanate group does not remain at all. The isocyanic acid S is not particularly limited, and may be appropriately selected as needed, and for example, it may be exemplified in the section of the Japanese Patent Publication No. 2007-2030. Compounds and the like described in 21". a diol containing a carboxylic acid group. _ Moreover, the compound represented by the above formula (12-1) to the formula (12-3) is 39 201235781 IXIX is the first 〇n. Date: The diol compound having a carboxyl group on May 1st, 101, is not particularly limited, and may be appropriately selected as needed. For example, it can be exemplified in the paragraph "〇〇47" of the Japanese Patent Laid-Open Publication No. 2〇〇7_2_. Compounds and the like. - The low molecular weight diol having no carboxylic acid group... The low molecular weight diol having no carboxylic acid group is not particularly limited, and may be appropriately selected as needed. For example, it may be exemplified by the patent opening 2〇〇7_2 Compounds and the like described in paragraph "0048" of the Gazette. The copolymerization amount of the carboxylic acid group-free diol is preferably 95 or less, more preferably (10)% or less, and most preferably 50% by mole or less. When the amount of copolymerization exceeds 1% of guar, there is a phenomenon that a urethane resin having good developability cannot be obtained. Specific examples of the polyurethane resin obtained by reacting the (i) carboxyl group-containing polyurethane with a compound having an epoxy group and an ethylenically unsaturated group in the molecule include, for example, The paragraphs shown in paragraphs "0314" to "0315" of the Japanese Patent Laid-Open Publication No. 2007_2030! In the polymer of U13 U1 to U4 and U6 to U11, glycidyl acrylate as a compound containing an epoxy group and an ethylenically unsaturated group, replaced by y-acrylic acid glycidol, acrylic acid _ 3,4 _ epoxy Cyclohexyl f-based vinegar (trade name: Cyd〇mer A400 (manufactured by Daicel Chemical Industries, Ltd.)), methacrylic acid, 3,4_epoxycyclohexyl ketone (trade name: cyci〇mer M400 (two celluloid chemical industry company) The polymer obtained by manufacturing)). - Acid-modified weight average molecular weight of a polyurethane resin containing an ethylenically unsaturated group - The acid modified polyurethane resin containing an ethylenically unsaturated group 40 201235781^ is the first _ 中文 Chinese manual without sizing correction The date of weight change on May 10th of this revision date is not particularly limited, and may be appropriately selected as needed. Preferably, 疋 2,000 to 60,000, more preferably 3, 〇〇〇 ~50 000, especially good is 3,000~30,000. If the weight average molecular weight is less than 2 Å, there is a case where a sufficiently low modulus of elasticity of the cured film at a high temperature cannot be obtained, and if the right side exceeds 60,000, coating suitability and developability are deteriorated. On the other hand, when the weight average molecular weight is 2 〇〇〇 to 6 〇〇〇〇, when the photosensitive composition is used in a photosensitive solder resist, the anti-turtle and the hybrid are excellent. The non-prefecture department has excellent developability. Further, the weight average molecular weight can be, for example, a high-speed Gpc apparatus (HLC_8〇2A manufactured by Toyo Soda Industrial Co., Ltd.), a wt5 wt% tetrahydrofuran (THF) solution as a sample solution, and a column using TSKgei HZM_M. 'Injection of the sample of the 2 , team, by the rain solution to dissolve the dissolution ' at 25. (: measured by a refractive index detector or a uv detector (detection wavelength of 254 nm). - Acid-modified U-acid value of a polyamino phthalate resin containing an ethylenically unsaturated group - the acid The acid value of the polyamino phthalate resin containing an ethylenically unsaturated group is not particularly limited, and may be appropriately selected as needed, preferably 2 〇 mgKOH/g to 12 〇 mgK 〇 H/g 'better. It is 3 〇 mg K 〇 H / g ~ 110 mg KOH / g ' Particularly preferred is 35 mg KOH / g ~ 1 〇〇 mg K 〇 H / g. If the acid value is less than 20 mg KOH / g, the developability becomes Insufficient phenomenon 'If it exceeds 120 mg KOH/g', the development speed is too high and it becomes difficult to control development. 41 201235781 TX Vj_»Al. A Revision date: May 1st, May 1st is 101st UM621 In addition, the acid value can be measured, for example, according to Jis K0070. In the case where 'the sample is not dissolved, 'use two. Ecstasy or tetradoxime 0 as a solvent. Ethylene unsaturated group equivalent of a polyamino phthalate resin containing an ethylenically unsaturated group - the acid The ethylenically unsaturated group equivalent of the polyurethane resin containing an ethylenically unsaturated group is not particularly limited and may be appropriately selected as needed, and is preferably 0.05 mmol/g to 3.0 mm〇i/g. Preferably, 〇5 mmol/g to 2.7 mmol/g, particularly preferably 〇75 mm〇1/g ～2 4 mmol/g. If the ethylenically unsaturated group equivalent is less than 〇5 mm〇i/g In addition, the heat resistance of the cured film is poor; when it exceeds 3 〇mm〇1/g, the brittleness of the cured film is improved. The ethylenically unsaturated group equivalent can be determined, for example, by measuring the bromine number. In addition, the bromine number can be determined, for example, according to JIS K26 〇 5. - Acid-modified epoxy resin containing ethylenically unsaturated group - The acid modification contains an epoxy resin and a base epoxy resin There is no particular limitation. For example, it can be exemplified by the Japanese Patent No. (4), which is described as a product (1) Fresh sorrel, which is an epoxy resin containing an ethylene-based compound. The iL(1) has an epoxidation of at least 2 or more epoxy groups in one molecule: = a) and at least 2 in 1 molecule In addition to the secret material, and the hydroxyl group reactive with an epoxy! a product of the anti-county compound (8) a product of the mono-supplemented acid (e); as a product;;) with a polyfluorene-phthalic anhydride (d) and a mono-isocyanate containing an ethylenically unsaturated group (4) 42 201235781 • a · 1 士 1 is the 1st OUO462! Chinese said the whistle line correction this revision date: UH, May 10, the acid modification of the product contains an ethylenically unsaturated group of epoxy resin, etc. I) is an epoxy compound (a) having at least two or more epoxy groups in one molecule, and one reactive group other than a hydroxyl group having at least two or more Wei groups in one molecule and reacting with an epoxy group. The compound (b) is a product of the monocarboxylic acid (c) of the bismuth unsaturation. Commercially available products can be used as the epoxy resin containing an ethylenically unsaturated group. The commercially available product of the acid-modified epoxy resin containing an ethylenically unsaturated group may, for example, be a ZFR series, a CCR series, or a PCR series (manufactured by PharmaTech Co., Ltd.). —Acrylic resin containing an ethylenically unsaturated group and a carboxyl group— The acrylic resin containing an ethylenically unsaturated group and a carboxyl group is not particularly limited, and may be appropriately selected as necessary, and examples thereof include (meth) acrylate and the like. An acrylic resin obtained by adding a (meth) acrylate having an epoxy group to a partial acid group of a copolymer having at least an acid group and having at least an acid group. η η such an acrylic resin is obtained by, for example, a (meth) acrylate and a compound having an ethylenically unsaturated group and having at least one acid group described in JP-A-2009-86376. A modified copolymer obtained by adding glycidyl (meth)acrylate to a part of the acid group of the copolymer. A commercially available product can be used as the acrylic resin containing an ethylenically unsaturated group and a carboxyl group. A commercially available product of the acrylic resin containing an ethylenically unsaturated group and a carboxyl group is exemplified by Cyclomer P 200HM (manufactured by Daicel Chemical Industries, Ltd.). 43 201235781 Chinese manual without sizing correction This meal date: 1 5 1 May 10 曰 - Polyimine precursor _ The polyimide precursor is not particularly limited, and can be selected as needed, for example The polyimine precursor described in Japanese Laid-Open Patent Publication No. Hei. No. Hei. The content of the macromolecular compound containing a carboxyl group __ The content of the polymer compound having a carboxyl group in the photosensitive composition is not particularly limited, and may be appropriately selected as needed, with respect to the photosensitive composition. The solid content is preferably from 5 wt% to 8 wt%, more preferably from 20 wt% to 75 wt%, particularly preferably from 3 wt% to 7 wt%. If the content is from 5 Wt%, the domain cannot maintain good resistance to cracking; if more than 80 wt%, the bribe is in a heat-resistant state. On the other hand, when the content is within the above-mentioned range, it is advantageous in terms of both good crack resistance and heat resistance. &lt;Other components&gt; Examples of the other components include a thermoplastic elastomer, a cerium hardening accelerator, an adhesion promoter, a thermal polymerization inhibitor, an inorganic filler, a colorant, an organic solvent, a thixotropic imparting agent, and an antifoaming agent. Homogenizer, etc. - a thermoplastic elastomer (elastomer) - The thermoplastic elastomer is added to the photosensitive composition, and the photosensitive composition can be imparted with heat resistance and flexibility. The thermoplastic elastomer is not particularly limited. For example, a styrene-based elastomer olefin-based elastomer, an amine-based elastomer, a polyester-based elastomer, a polyamine-based elastomer, an acrylic acid-translating body, and a poly-integrated property can be mentioned. Epoxy modified by body and gum 44 201235781 ~r 1 u ν,ρ,Π mm 101104621 Revision date: May, 2011. Some compounds may be used alone or in combination of two or more. The general body includes a hard segment component and a soft segment component, and the ΐ2 is selected, for example, in the production efficiency of the development step, and S is purely nuclear or swellable. 〇 : J ethylene _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ (4) Those recorded in paragraph 2 (4) of 2G09_() 14745. The content of the core-thermoplastic elastomer __ the content of the thermoplastic elastomer in the photosensitive composition is advantageously selected as appropriate, relative to the solid content of the photosensitive composition. It is preferable that 1 Wt% to 5G wt%, more preferably 2 wt/〇20 wt/i) 'excellent is 3 wt% to 1 wt%. If the content is less than 1 Wt%', the crack resistance is poor. When it exceeds 50% by weight, f is not eluted by the developer in the unexposed portion. On the other hand, the inclusion of the right side in the above-mentioned range is advantageous in terms of improving developability or crack resistance. _Thermal hardening accelerator _ The thermosetting accelerator is not particularly limited, and may be appropriately selected as necessary, and examples thereof include a compound described in paragraph "0101" of JP-A-2-27-2〇3〇. Wait. 45 201235781 is the Chinese manual No. 101104621. There is no slash correction. The date of this revision: May 1st, 1st, 1st - the content of the thermal hardening accelerator - the content of the thermosetting accelerator in the photosensitive composition It is not particularly limited to being appropriately selected as needed, and is preferably 0.01 wt% to 2 wt%, more preferably 0.05 wt% to 15 wt%, relative to the solid content of the photosensitive composition. Particularly good is 〇·ΐ wt%~10 wt%. When the content of the thermosetting accelerator is less than 〇1〇%, there is a phenomenon that the toughness of the hardened enamel cannot be expressed. When it exceeds 20% by weight, the storage stability of the photosensitive composition is deteriorated. On the other hand, when the content of the thermosetting accelerator is within the above-described range, it is advantageous in terms of improving the storage stability of the photosensitive composition and the physical properties of the cured film. - The adhesion promoter - The adhesion promoter is not particularly limited, and may be appropriately selected as necessary, and examples thereof include a compound described in paragraph "0108" of JP-A-2007-2030. —The content of the adhesion promoter—the content of the adhesion promoter in the photosensitive composition is not particularly limited to be appropriately selected as needed. Relative to the solid matter of the level composition, preferably Yes 〇·() i Wt%~2G g, more preferably 〇〇5 jobs~Μ Μ% 'extra good (Q4~μ(4). If the content of the adhesion promoter is less than G'〇l wt%' then There is a phenomenon that the hardened film cannot exhibit a roundness; if it exceeds 2 G wt%, the domain is deteriorated in the retention of the photosensitive composition, and if the content is within the above-mentioned range, the feeling is improved. It is advantageous in terms of storage stability and physical properties of the cured film. 46 201235781 For the 1011G4621 book book fine line repair _ Revision date: May 1st, 1st, 1st - Thermal polymerization inhibitor _ Selective inhibitor It is particularly limited and can be selected as needed. For example, it can be cited in this patent, and it is described in the "Simplified". 2 paragraphs of the coffee - inorganic filler - Ο suitable for the selection of two preferred 疋 containing average particles The diameter (d5〇) is (four) handsome ~ ^: emulsified miscellaneous. By making Wei no Filling purely with dioxin, the hardened material is high, and it is combined with the recorded polymer: Good _, from the coating suitability of 峨得健. The cerium dioxide is not particularly necessary and is suitable for selection, and examples thereof include gas phase dioxotomy, bismuth oxide oxidized cerium oxide, molten cerium oxide, etc., daily, raw Ο, the second, the average particle size The diameter () is not particularly limited, and is appropriately selected as needed, preferably 11 to 3 . _ = 疋 0.1 μιη 2 2" 5^n, particularly good is 〇"μπι~2 〇 从. If the average particle diameter (d5〇) of the oxidized stone particles is insufficient, the coating viscosity becomes high; if more than 3 〇 存 ^ 维持 维持 维持 维持 维持 维持 维持 维持 维持 维持 , , , When the diameter (d50) is within the above-mentioned range, the smoothness of the I film is corrected. The hardening is further represented by the average particle diameter (calculated by the coffee). The cumulative value of the time is 5 ()% of the granularity and is defined 47 201235781 Revision date: May, 2011, the 0th is the first 丨01 HM621 In the specification, the definition is d50 (D50), and the dynamic light scattering photometer (trade name: DLS7_, manufactured by Otsuka Electronics Co., Ltd.) is used, and the measurement principle is defined as a dynamic light scattering method to analyze the size distribution. The method is performed by the accumulation method and/or the profile method. - The content of the inorganic filler - the content of the filler in the photosensitive composition is not particularly 'relative to the photosensitive composition叨 wt 乂 wt wt wt wt wt wt wt wt wt wt wt wt wt wt wt wt wt wt wt wt 无机 无机 无机 无机 无机 无机 无机 无机 无机 无机 无机 无机 无机 无机 无机 无机 无机 无机 无机 无机 无机 无机 无机 无机 无机 无机 无机 无机The inclusion of the surface = the inner portion is to improve the pattern formability and the heat resistance. The colorant is not particularly limited. The color pigment or the known dye is suitably selected, and the coloring pigment is not particularly _ timber. : For example, the compounds described in the "Special Selections", and the compounds described in the article can be cited. In the paragraph "0106", the coloring agent is appropriately selected depending on the needs of the photosensitive film. The content is not particularly limited - organic solvent _ Example = The organic solvent is not particularly limited, and may be selected as a Japanese patent, and may be selected as a Japanese Patent Application No. 48 201235781 is the Chinese manual No. 1011〇4621 There is no slash correction. The date of this revision: May 1, 1st, May, 43" = the compound described, and the compound described in paragraph "0121" of the essay of this patent. - the content of the organic solvent 〇 the content of the organic solvent in the photosensitive composition and the special P ' 'optional selection is appropriate, relative to the solids of the sensory group' is preferred丨wt%~8G Fu, more preferably 2 senses 曰0 wt%, especially good 3 wt%~6〇_/〇. If 3 篁 of the organic solvent is less than i Wt% ', the viscosity of the composition is high and the formation of the coating film becomes difficult. If it exceeds 8 G W t %, the control of the desired film thickness becomes difficult. On the other hand, when the content of the above-mentioned organ is within the above-mentioned range, it is advantageous in terms of suitability for coating film production. (Photosensitive solder resist composition) The photosensitive anti-caries composition of the present invention contains the above-described light-reducing composition of the present invention. ～ By the photosensitive solder resist composition of the present invention, it is possible to obtain a solder resist having excellent insulating properties, smoothness of the side surface of the ruthenium pattern, and excellent plating resistance. (Photosensitive solder resist film) The photosensitive solder resist composition of the present invention can be used as a liquid photoresist by being applied to a substrate on which a conductor wiring is formed and dried, and is particularly useful for producing a photosensitive resist film. The photosensitive resist film of the present invention preferably contains at least a support film, and contains a protective film, and further includes ruthenium ((3)-η), an oxygen barrier layer (hereinafter sometimes abbreviated as rpc layer), etc. Other layers. The shape of the photosensitive solder resist film is not particularly limited to i, and may be selected as required by the method of 2012 201281 HlHJUpill No. 101104621, which has no underline correction date: 1〇1 May 5). In the form of the photosensitive layer and the protective film in the form of the protective layer, the PC layer, the photosensitive layer, and the protective film are sequentially provided on the support. The support body sequentially has the pad layer, the pc layer, the photosensitive layer, the shape of the protective film, and the like. Further, the photosensitive layer may be a single layer or a plurality of layers. &lt;Support; It is preferable to select it as appropriate, and it is more preferable that the support is not particularly limited, and the photosensitive layer can be peeled off, and the smoothness of the light transmissive surface is further improved. . = There is no __ in the cut, and it is visible. (4) It is advisable to exemplify a transparent synthetic resin film. The transparent synthetic resin film is not particularly suitable for selection, for example, polyethylene terephthalate, ethylene diacetate, polypropylene, polyethylene, cellulose triacetate, and ethylene; )Acrylic acid _, poly (fluorenyl) propylene 豨 ' acetyl alcohol, polycarbonate, polystyrene ... ethylene copolymer, polyamine, polyimine, gas, uranium, poly Tetrafluoroethylene, decene-vinyl acetate copolymer umbrella tetrafluoroethylene, t two mouse, women, fiber plastic film. These support bodies can be used alone or in combination with each other. For the support tissues, the transparent ones may be used in combination with two kinds of polyethylene terephthalate. The support body which is preferably formed by forming a resin into a resin is not particularly limited, and may be exemplified by the Japanese name Kaiping (4) (4) ^ "suitable selection" example 'U 4 newspaper, 曰本专利特开50 201235781 is the 101KM621# Chinese In the specification, there is no slash correction. The date of the correction is as follows: 支撑 公报 5 可视 可视 可视 可视 可视 可视 可视 可视 可视 可视 可视 可视 可视 可视 可视 可视 可视 可视 可视 可视 可视 可视 可视 可视 可视 可视 可视 可视 可视 可视 可视 可视 可视 可视 可视 可视 可视 可视 可视 可视 可视 可视More suitable is needed, preferably 5_~17&gt; There is no special restriction on Sit, and it can be selected as needed, which is longer than L. The length of the long support is limited and can be selected as needed. Preferably, X,,,, temple, &lt;photosensitive layer&gt; is earlier than 20, _m. The photosensitive layer can be formed by the photosensitive layer of the photosensitive resist composition of the present invention. The size of the solder resist film is limited to 'optional and can be selected as appropriate. Generally, the thickness of the photosensitive layer of the support is not particularly limited. It is preferably 3 _~100 handsome, and J is suitable for the south. The method for forming the photosensitive layer can be selected The photosensitive solder resist composition of the following method dissolves the support on the support, so that the solvent of the dry solution is directly applied to the visible solution, and the amine, dimethyl sub: : bis-mercaptoamine, dimethyl ethyl alcohol, such as alcohol, ethanol, n-propanol, isopropanol, 51 201235781 Revision date: May 10, 2011 ϊ^υ/ίΰΐ〇4621 The Chinese manual has no underline to correct the n-butanol, the second butanol, the n-hexanol, etc. Examples of the ketone include acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, and diisobutyl ketone. Examples of the vinegar include ethyl acetate, butyl acetate, n-pentyl acetate, sulfuric acid, sodium propionate, phthalic acid, ethyl benzoate, methoxypropyl acetate, and the like. ^ The aromatic hydrocarbons include, for example, anthracene, quinone, benzene, ethylbenzene, etc. The corpse of the dynasty, such as the genus of the genus, can be listed as a ash, only 1J 夕J, four recordings of ethylene, chloroform, M, l-dioxaethane, dichlorodecane, monochlorobenzene, etc. The _, for example, tetrachloroscale, ethylene glycol single Ethyl sulphate, L-methoxy-2-propanol, etc. Ethyl alcohol may be used alone or in combination of two or more. It is not particularly preferable to limit the concentration of the recorded target to be Hwt%~5GwtG. /f. Preferably, 疋1G(四)-德, the coating method is not particularly limited, and for example, it can be exemplified by using a smear coating, and a cloth sorting machine, a curtain coating method, etc. The sewing machine, the light coating machine, the mold coating method for the drying conditions and the method of the helmet body. Selecting 'Although it is suitable for each component, ζϋΓΙ, and f, it is usually 6 (rc~ 吏) The proportions vary and 'but pass right. /30 degrees to 15 minutes left &lt;protective film&gt; 52 201235781 For the __21 Chinese _ book _ line correction this revision date: (8) May 10 曰, the protective film has the prevention of the photosensitive layer The function of the photosensitive layer is protected by dirt or damage. The position of the edge-preserving film in the photosensitive solder resist film is set at the position of the photosensitive resist film, and the riding is performed as needed. The riding condition is set in the film, for example, The user of the cut body, the polyvinyl fluoride sheet, the polyethylene sheet, the polypropylene sheet, the polyolefin sheet, and the polytetrazed, the thickness is not particularly limited, and may be appropriately selected as needed. The best is - ~ 30 divisions. The support 'preferably, the photosensitive layer and the contact resistance ^ ^ 椒 敝 敝 敝 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 组合 组合 组合 组合 组合 组合 组合 组合 组合 组合 ο ο ο Amine/poly(tetra), poly(p-phenylene) treatment, and at least any of the support and the protective film are surface-treated. The support body is: if the coating force of the undercoat layer is applied, the irradiation treatment, the high-frequency wave irradiation treatment, the purple electric equipment irradiation treatment, the irradiation of the first light, the discharge treatment, the operation, and the support. The static friction coefficient with the protective film is preferably 53 201235781 is the 101104621 Chinese manual without a slash correction. The correction earns a simple year on May 10 is 0.3=4 'better 〇5~12. If the static friction is in the case of a two-shape, the phenomenon of offset is produced. Mussels,] There is no particular limitation on the method that becomes difficult to roll into a good car shape. 'It can be wound into a cylindrical core by a long strip, and the length of the anti-flux film is not __, for the convenience of the user can also ==;:::;:r row winding, and the second point to prevent edge fusion, consider the protection, other moisture-proof spacers, spacers (especially packaging) Also, a transparent layer is used: and a preferred light layer =::: a surface protective film and a surface of the sensory protective film are formed to have a coating comprising a polyorganic (tetra) = surface under the polymer. As the coating liquid (4) (4) of the lower 4: polymer, the surface is formed after 3 (rc~(10).c (_ is 5 generations) minutes to 30 minutes. 2〇c) is carried out and 'except the The photosensitive layer, the cut body, and the protection are as described in the Chinese language specification of No. 101104621, which is not marked by the slash correction period: May 1st, 1st, 1st, and may also include a cushion layer and an oxygen barrier layer. (pC layer), layer of peeling layer, adhesive layer, light absorbing layer, surface protective layer, etc. The underlayer is a layer which melts and flows when laminated under vacuum and heating conditions without stickiness at normal temperature. The PC layer is usually a film having a composition of about 1.5 μm which is formed mainly of polyvinyl alcohol. The photosensitive solder resist film has a small surface tackiness, good lamination property and good usability, and insulation property. The laminate having excellent plating resistance and smoothness on the side of the pattern has a photosensitive layer of a photosensitive solder resist composition. Therefore, it can be widely used as a printed wiring board, a color filter or a column, a rib, a spacer, and a spacer. Such as display components, full-image, micro-machine, proofing machine, etc. The pattern forming use 'is suitable for use in the permanent pattern of the present invention and the method of forming the same. In particular, the photosensitive solder resist film of the present invention has a uniform thickness of the film, and thus can be finer when forming a permanent pattern Lamination on a substrate. (Permanent Pattern and Permanent Pattern Forming Method) The permanent pattern of the present invention can be obtained by the permanent pattern forming method U of the present invention. As the permanent pattern, a protective film, an interlayer insulating film, and At least one of the solder resist patterns. When the permanent pattern is a solder resist pattern, the dynamic elastic coefficient at 22 〇 ° c is preferably 20 MPa to 100 MPa, more preferably 25 MPa to 80 MPa ' Particularly preferred is 3 〇 MPa to 50 MPa. If the dynamic elastic modulus is less than 20 MPa ', there is a phenomenon of poor heat resistance; if it exceeds 1 〇〇 Mpa, the thermal shock resistance is poor, and cracking occurs on the cured film. 55 201235781 414^〇pm For the fourth (G), the Chinese manual, no slash correction, the date of revision, the date of the first year of the invention, the first method of permanent pattern formation invented in Japan! The solder resist composition is applied onto the surface of the substrate, dried to form a photosensitive layer, and then exposed (exposure step) and developed (developing step). Further, the second aspect of the permanent pattern forming method of the present invention is heating. And at least any of the pressure-sensitive solder resist films of the present invention are laminated on the surface of the substrate to perform exposure (exposure step) and development (development step). Hereinafter, the permanent pattern forming method of the present invention is used. In addition, the details of the permanent pattern of the present invention are also clarified. The substrate is not particularly limited, and may be appropriately selected as necessary, and examples thereof include a substrate for forming a printed wiring board such as a copper-clad laminate. A glass plate such as a nano glass plate, a synthetic resin film, paper, a metal plate, or the like. Among these substrates, a substrate for forming a printed wiring board on which a wiring has been formed is preferable in terms of achieving high-density encapsulation of a semiconductor equal to a multilayer wiring board or a multilayer wiring board. The substrate may be formed as a laminate or (4) as a laminate of the photosensitive layer 0 on which the photosensitive resist composition is formed on the substrate as the first aspect, or as the second state A layered body in which a photosensitive resist is welded and a photosensitive layer in the film is laminated. Namely, the photosensitive layer in the laminate may be subjected to exposure described later, whereby the exposed region is hardened, and then a permanent pattern is formed by development as will be described later. &lt;Laminated body&gt; The method for forming the laminated body of the first aspect is not particularly limited, and may be appropriately selected as needed, and it is preferable to laminate the coating on the substrate. 56 201235781 Revision date: 1 〇1年1月1〇曰 is the Chinese version of No. 01104621. The photosensitive layer formed by modifying the photosensitive resist composition and drying it without a scribe line. = There is no restriction on the method of coating and drying, and it can be selected as needed, for example, by applying a coating machine, a slit coater, a light coater, a == curtain coater, etc. The method for forming the photosensitive resist composition is not particularly limited, and it is preferable that the photosensitive film is added to the photosensitive film to the surface of the film. When the layer is laminated on the substrate, it is preferable to peel the film and laminate the film on the substrate. Recalling that the temperature of the heating is not __, as needed, preferably m: ~ 13 (rc, more preferably 叱 8 叱 ~ (10). c. ^ The pressure of the pressure is not particularly limited Alternatively, it is preferably 0.01 MPa to 1.0 MPa 1.0 MPa. 旯隹 0.05 MPa to 旯隹 进行 进行 进行 进行 至少 至少 至少 至少 至少 至少 至少 至少 至少 加热 ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' List hot presses, and stick to people 11 Tmsei Laminator Co., Ltd.tit^ VP_„) . ^ : Manufactured by the name Machine Manufacturing Co., Ltd. &Lt; Exposure Step &gt; = is a step of exposing the photosensitive layer of the pattern exposure step. As the object of exposure, as long as it is a material with a photosensitive layer, and 57 201235781 HIHJOpm is the Chinese manual of No. 1011046U. There is no slash correction. This revision date: May 10, 1 year, there is no special restriction, and it is suitable for selection as needed. Preferably, the laminated body in which the photosensitive solder resist composition or the photosensitive resist film is formed on a substrate is performed. The exposure to the laminated body is not particularly limited, and may be appropriately selected as needed. For example, the photosensitive layer may be exposed by interposing the support, the underlayer and the PC layer; or the support may be peeled off. Exposing the photosensitive layer through the underlayer and the PC layer; after the support and the underlayer are peeled off, the photosensitive layer may be exposed through the PC layer; After the support, the underlayer, and the PC layer are peeled off, the exposure by the sensitization is not particularly limited, and may be appropriately selected as needed, and examples thereof include digital exposure, simulated exposure, and the like. Preferred among these are digital exposures. The digital exposure is not particularly limited and may be appropriately selected as needed. For example, it is preferable to generate a control based on the formed pattern formation information, and perform light modulation in accordance with the control signal. The mechanism for the digital exposure is not particularly limited, and may be selected as needed, and for example, a light irradiation mechanism that irradiates light, and a light that is modulated by light irradiated by the light irradiation mechanism based on the information to be reported may be changed: Special 0 «Light Modulation Mechanism" 'There is no n characterization as the light modulation mechanism, as long as the light can be modulated, it is particularly limited, and it can be selected as needed. It is better to have 2 parts of light. Variable mechanism. There is no particular limitation on the optical modulation mechanism having the n moiré sections. The method of the Japanese version of the specification is no change, and the correction date is as follows: May 10, 101, if necessary, it is preferable to select, preferably. It is a spatial light modulation component. The spatial light modulation element is not particularly limited and may be appropriately selected as needed, and examples thereof include a space micro-mirror device (DMD) and a micro electro mechanical system (MEMS) spatial light. A variable element (SLM; Spatial Light Modulator), an optical element (PLZT element) that modulates transmitted light by an electrooptic effect, a liquid crystal shutter (FLC), or the like. The Digital Micro-mirror Device (DMD) is a good medium-sized micro-mirror device (DMD). Moreover, it is preferable that the optical modulation means has a pattern signal generating means for generating a control signal based on the formed pattern information. In this case, the optical modulator unit modulates the light according to the control signal generated by the pattern signal generating unit. The control number is not particularly limited and may be appropriately selected as needed, and for example, a digital signal may be cited. &lt;Developing Step&gt; The developing step is performed by exposing the photosensitive layer by the exposure step, curing the exposed region of the smoothing layer, and developing by removing the uncured region to form The steps of the permanent pattern. Further, the method of removing the hardening region is not controlled, and the method of selecting and using the developing solution can be exemplified. The liquid is not particularly limited and may be appropriately selected as needed. Examples of the salt: ammonia water, hydroxide or carbonate of an alkaline earth metal, hydrogen carbonate, and an aqueous solution of 'salt salt. The preferred ones are sodium carbonate. 59 201235781 is the 101st brain 21 material _ Wei Wei revised this revision date: May 1, 101 aqueous solution. The developing solution may also be used to promote the development of the organic solvent foaming agent, organic testing or use, and the like: and: special:: limited, may be selected as needed, such as ethylene triamine, triethyl (tetra) sterol amine, four Methyl hydroxide, glycolamine, and the like. * tnethylene pentamine), morphine, and triethyl, for example, the solvent is not particularly limited, and may be appropriately selected according to needs, and examples thereof include alcohols, ketones, and choices, and cheeks, _, aramids, and internal vinegars. Classes, etc. Combination: water = liquid mixed with organic solvent &lt; hardening treatment step &gt; treatment ^ is her permanent map __ - step contains hardening, the hardening treatment step is after the development step, in the water pattern The step of performing a hardening treatment on the photosensitive layer. J The hardening treatment is not particularly limited, and may be, for example, the entire surface exposure treatment, the entire surface heat treatment, or the like. The method for exposing the entire surface of the surface to the shackle is suitably selected, for example, after the developing step, the entire surface of the laminated body of the permanent pattern is exposed. The whole (four) exposure 'facilitates the hardening of the resin in the composition of the photosensitive layer 2 which forms the photosensitive layer, and the surface of the permanent pattern is hardened. There is no particular limitation on the apparatus for performing the entire surface exposure. It is not necessary to use 60 201235781 for the Chinese manual No. 101104621. There is no scribe line correction. This correction date is suitable for May 10, 1G1. For example, an ultra-high pressure mercury lamp or the like can be cited. Exposure machine, etc. The method of heat treatment of the entire surface is not particularly limited, and may be appropriately selected as needed. For example, after the development step, the entire surface of the laminate on which the permanent pattern is formed may be heated. . By heating the entire surface, it is possible to enhance the permanent sound of the surface along with the surface.加热 The heating temperature for heating the entire surface is not particularly limited, and is visually and suitably selected, preferably 12 Å. (:~250. (:, more preferably 12 (Π: ~ 200 ° C. If the heating temperature is less than 12 (rc, there is a phenomenon that the helmet = the degree of increase caused by the treatment; if more than 2 chat The feeling of the anti-welding of the towel is decomposed and becomes brittle. The heating time in the heating of the whole surface is not particularly limited, and may be appropriately selected, preferably 1 ( ) Minutes ~ m minutes minutes ~ 60 minutes. People's jade is the most suitable for heating the entire surface. It is suitable for the choice of ', for example, oven, hot plate, infrared (IR) heater In the case where the substrate is a printed wiring board such as a multilayer wiring board, the soldering of the present invention can be performed on the printed circuit board in the following manner: # ^ That is, by In the developing step, the hardened layer of the permanent pattern is formed, and the surface of the circuit board is exposed to expose a metal layer, and the portion of the metal layer on the surface of the printed circuit board is subjected to money and gold. , riding the welding part of the field half (four) or parts, etc. This = pick-up 201235781 HlHJUpill is the Chinese manual of the table 101104621. There is no slash correction. This revision period: 1) May 10th, the permanent pattern of the hardened layer is used as a protective film or a film to prevent the impact from the outside. The interlayer, the '', the edge of the balance or the electrodes adjacent to each other and the film 0, preferably forming a protective layer. The pattern formed by the permanent pattern forming method is the film or the The interlayer insulating film protects the impact or the rotation of the outside of the wiring shirt, and is made of the interlayer insulating film. For example, (4) the rotating body or the component is highly encapsulated in the multilayer wiring substrate or the build-up wiring. The permanent-forming method of the present invention can form a pattern at a high speed, and thus can be widely used in the formation of various types, and can be suitably used in the formation of a wiring pattern. Method * The permanent pattern formed has excellent insulation property, recording resistance, smoothness of the side surface of the pattern, etc., and can be suitably used for film, layer, (printing substrate), printing of the present invention. The substrate includes at least a base material and a permanent pattern formed by the permanent pattern forming method, and further includes other structures that are appropriately selected as needed. The other configuration is not particularly limited, and may be appropriately selected as needed, and may be, for example, a substrate. In addition to the permanent® case, a layered substrate or the like of the lining layer is provided. [Examples] The present invention will be more specifically described below by way of examples, but the present invention 62 201235781fl is the first Chinese version of No. 11104621. Line Correction This revision period: May 10, 101 is not subject to any limitations of these examples. (Synthesis Example 1) &lt;Synthesis of Compound T-1&gt; 3 2,000 mL with reflux tube and thermometer To the flask were placed 150 g of tetrahydrofuran, N-methylpyrrolidone 1 () g, and 3-amino-m, 2,4-triazole 84.1 g (manufactured by Merck & Co., Inc.). Tetrahydrofuran l〇〇g, and 2-isocyanatoethyl methacrylate 155 155_2g (Karenz MOI, manufactured by Showa Denko Co., Ltd.) were added dropwise thereto at a temperature of 3 Torr. Thereafter, the mixture was stirred at 4 ° C for 1 hour and then reacted at 70 ° C for 4 hours. After cooling to room temperature, the reaction liquid was poured into 2 L of ion-exchanged water under vigorous stirring to precipitate a target crystal. The precipitate was washed with methanol, and the precipitate was taken and dried to obtain the compound T-1 222 g of the following structure. [Chem. 14] T-1 (Synthesis Example 2) &lt;Synthesis of Compound T-2&gt; In a 2,000 mL 3-neck flask equipped with a reflux tube and a thermometer, tetrahydrofuran 120 g, N-fluorenyl group 0, and slightly ketone were added. 70 g, 3,5-diamino-i, 2,4-triazole 49.5 g (manufactured by Degussa) and 2,4-di-tert-butyl-4-nonylphenol 1.8 g (PN-01, Manufactured by Ouchi New Chemical Industry Co., Ltd.). Under stirring, add 80g of tetrahydrofuran, and 2-isocyanato acid 63 in 2 hours. 201235781 Revision date: May 10, 101, No. 101104621 Chinese manual No underline correction of ethyl ester 141.1 g (Karenz AOI, manufactured by Showa Denko). Thereafter, at 40. (: The reaction was allowed to proceed for 20 hours. After cooling to room temperature, the reaction liquid was poured into 2 L of ion-exchanged water under vigorous stirring to precipitate a target crystal. The precipitate was collected by washing with decyl alcohol to cause the precipitate to be filtered. Drying gave the compound T-2 165.1 g of the following structure. (Synthesis Example 3) &lt;Synthesis of Compound T-3&gt; In a 2,000 mL 3-necked flask equipped with a reflux tube and a thermometer, N-fluorenylpyrrolidone 250 g and 3,5-diamino group were added. Triazole 49.5 g (manufactured by Degenssa Co., Ltd.). Under stirring, 80 g of N-ethylpyrrolidone and 152 2 g of tetrahydrophthalic anhydride (RIKACIDTH, manufactured by Shin Sakamoto Chemical Co., Ltd.) were added dropwise thereto over 2 hours. Thereafter, the mixture was stirred at 4 (rc) for 12 hours, and then reacted at 100 C for 12 hours. After cooling to room temperature, the reaction liquid was poured into 12 L of ion-exchanged water under vigorous stirring to precipitate a target crystal. By washing with a different amount of _/hexane (2/8 (weight ratio)), the precipitate was taken and dried to obtain a compound τ_3 i2i ig of the following structure. [Chem. 16] 64 201235781 ~r χ —r ^j vuaIX Revision date: May 1st, 1st, May 10th, No. 101104621 Chinese manual, no underline correction, this HOOC 〇 〇 COOH Τ-3 (Synthesis Example 4) &lt;Synthesis of Compound Τ-4&gt; 第三Into a 3-neck flask having a reflux tube and a thermometer, a third butyl fluorenyl ketone 250 g, 1, 2 was added. , 4-triazole 34.5 g (manufactured by Junsei Chemical Industry Co., Ltd.), dicyclopentyl decyl diacrylate diacrylate 145.7 g (A-DCP, manufactured by Shin-Nakamura Chemical Co., Ltd.) and 2,4-di-third Benzyl-4-methylphenol 1.9 g (PN-01, manufactured by Ouchi Shinko Chemical Industry Co., Ltd.). At 4〇. After stirring for 1 hour under 〇, the reaction was carried out at 80 ° C for 52 hours. After cooling to room temperature, the organic solvent was removed by concentration under reduced pressure, whereby Compound T-4 178 g of the following structure was obtained. [Π化] 〇 T-4 (Synthesis Example 5) &lt;Synthesis of a polymer compound B-4 containing a carboxyl group (a polyamine phthalate resin having an acid-modified ethylenically unsaturated group) &gt; 500 with a condenser and a stirrer Three-neck round bottom flask of mL 65 201235781 is the Chinese manual of No. 101HM621 without a slash correction. Amendment date: May 10, 101, make malic acid 2.41 g (0.018 mol), 2,2-bis (radiomethyl) Propionic acid (DMPA) 5.23 g (0.039 mol), and C3 drunk monomethyl acetoacetate 17.78 g (0.111 mol) were dissolved in 74 mL of cyclohexanone. 4,4-diphenylmethane diisocyanate (MDI) 30.03 g (0.12 mol), hexamethylene diisocyanate (HMDI) 5.05 g (〇.〇3 mol), 2,6-di- Third butyl hydroxyphthalide · 1 g, and a commercial name of a catalyst: NEOSTANN U-600 (manufactured by Nitto Chemical Co., Ltd.) 〇 2 g, heated and stirred at 75 ° C for 5 hours. Thereafter, the mixture was stirred for 30 minutes by diluting with 9.61 mL of methanol to obtain 165 g of a polymer compound B-4 solution containing a carboxyl group (solid content: 45 wt%). The obtained carboxyl group-containing polymer compound B-4 solution had a solid acid value of 68 mgKOH/g. The weight average molecular weight (polystyrene standard) determined by gel permeation chromatography (GPC) was 6,500, ethylene. The unsaturation equivalent weight was 1.83 mmol/g. The acid value is measured in accordance with JIS K0070. Here, in the case where the sample is not dissolved, "diwei or tetrahydrothymolfane or the like is used as a solvent. The weight average molecular weight is a high-speed GPC apparatus (HLC-802A manufactured by Toyo Soda Industrial Co., Ltd.), a wt 5 wt% tetrahydrofuran (THF) solution, and a TSKgel HZM-M column. A sample injected into the 2 〇〇 team was subjected to dissolution by the THF solution, and was measured at 25 C using a refractive index detector or a uv detector (detected as 254 nm). The ethylenically unsaturated group equivalent can be determined by measuring the bromine value according to JIS K2605. ' 66 201235781n -τ Λ. -Γ-/ν/1^ΐΠ is the 101104621 Chinese manual without a slash correction. Amendment date: May 10, 101 (synthesis example 6) &lt;carboxyl-containing polymer compound B -5 (Synthesis of Acid Modified Polyethylureate Containing Ethylene Unsaturated Group) - In a 500 mL three-neck round bottom flask equipped with a condenser and a mixer, '2'2-bis(hydroxyindole) Propionate (DMBA) 32.00 g (0.216 mol), polypropylene glycol (molecular weight 1, 〇〇〇) (PPGl〇〇〇) 9.00 g (0.009 mol) dissolved in propylene glycol monoterpene ether monoacetate 118 In mL. Among them, 4,4-diphenyldecane diisocyanate (MDI) 37.54 g (0.15 mol), 2,6-di-t-butylhydroxytoluene jg, and NEOSTANN U-600 (曰东化成) Made by the company) 〇·2 g, at 75. (: After stirring for 5 hours, 9.61 g of methanol was added. Thereafter, methyl acrylate glycerol (GMA) 17.91 g (0.126 mol) as an epoxy compound containing an ethylenically unsaturated group was further added and The catalyst triphenylphosphine 5 〇〇〇 ppm was stirred at 11 Torr for 5 hours, and then cooled to room temperature to obtain 214 g of a carboxyl group-containing polymer compound B-5 solution. q The obtained carboxyl group was obtained. The polymer compound B-5 solution has a solid acid value of 75 mgKOH/g. The weight average molecular weight (polystyrene standard) determined by gel permeation chromatography (GPC) is 12, oxime, ethylene. (Example 1) &lt;Preparation of photosensitive composition coating liquid 1&gt; The following components were mixed to prepare a photosensitive composition coating liquid 1 (photosensitive resistance) Flux composition coating solution) 67 201235781 is the 1011 (M621 Chinese manual without a slash correction. This revision date: May 10, 101, ZFR-1776 (manufactured by Nippon Kayaku Co., Ltd., acid-modified contains ethylenic unsaturation) 65 wt% methoxypropyl acetate solution of epoxy resin) (Β-1 32.3 parts by weight of compound T-1 0.8 parts by weight of coloring pigment: HELIOGEN BLUE D7086 (manufactured by BASF Corporation) 0.021 parts by weight of coloring pigment·· Pariotol Yellow D0960 (manufactured by BASF Corporation) 0.006 parts by weight of dispersing agent: Solsperse 24000GR (Lubrizol Corporation) Manufactured) 0.22 parts by weight of a polymerizable compound: DCP-A (manufactured by Kyoeisha Chemical Co., Ltd.) 5.3 parts by weight of initiator: Irgacure 907 (manufactured by BASF Corporation) 0.6 parts by weight of sensitizer: DETX-S (Sakamoto Chemical Co., Ltd.) Ltd.) 〇.〇05 parts by weight of reaction aid: EAB-F (manufactured by Hodogaya Chemical Co., Ltd.) 〇.〇19 parts by weight of hardener: melamine (manufactured by Wako Pure Chemical Industries, Ltd.) 〇j6 parts by weight of thermal crosslinking agent: Epotohto YDF-170 2.9 parts by weight (a compound of ethylene oxide oxime (bisphenol F type epoxy resin) manufactured by Nippon Steel Chemical Co., Ltd.) Filler: SO-C2 (manufactured by Admatechs Co. Ltd.) 68 201235781 Revision date: May 10, 101 is the 1011〇46:21 Chinese manual without a slash correction δ. 〇 by weight ion trapping agent. ΙΧΕ-6107 (manufactured by Toagosei Co., Ltd.) 0. 82 parts by weight of coating aid: Megafac F-780F 〇 2 parts by weight (manufactured by DIC Corporation, 30 wt% butanone solution) Elastomer: Espel 1612 2 7 parts by weight of hexanone (solvent) 38.7 parts by weight 〇 &lt;photosensitive Preparation of the solder resist film 1 &gt; Using a polyethylene terephthalate film (PET) having a thickness of 25 μm as a support, the photosensitive composition coating liquid was applied by a bar coater. (1) The photosensitive layer was dried and applied to the support so as to have a thickness of about 30 μm, and dried in a hot air circulation dryer for 3 minutes to prepare a photosensitive solder resist film 1. &lt;Formation of permanent pattern&gt; - Modulation of laminated body _ Q A copper-clad laminate (a printed wiring board having no via hole and a copper thickness of 12 μm) having a surface formed by chemical polishing treatment is used as a base. material. Using a vacuum laminating machine (manufactured by Nago Seisakusho Co., Ltd., MVLP5〇G), the photosensitive layer of the inductive solder resist surface 1 is laminated to the copper clad and the lamination. On the copper laminate board, a laminate in which the copper clad laminate, the photosensitive layer, and the poly(p-bismuth diacid) film (support) are laminated is sequentially laminated. The crimping condition is a crimping temperature of 90. (:, the crimping pressure is 0.4 MPa, and the laminating speed is 1 m/min. 69 201235781 Revision date: 1 5 1 May] 〇曰 is the ioii 〇 462i Chinese manual without a g-line correction. The laminate body is formed by the steps shown below. - Exposure step - For the photosensitive layer in the modulated laminate, a pattern forming device using a blue-violet laser exposure with a predetermined pattern is used. a polyethylene terephthalate film (support) (4), irradiating 4 〇 5 nm of laser light with an amount of energy of 4 〇 mJ/cm 2 to obtain a predetermined pattern, and exposing one part of the photosensitive layer Area hardening. - Development step - Stripping the poly-pair on the dimethyl layer, and removing it in the layer. The solution is dissolved and removed. Then it is washed with water to dry it. = The whole surface, and the film strength is made H, and the surface is hardened from the European surface. The evaluation method is as follows. By the evaluation method shown below, the edge of the surface is controlled, and the thermal shock resistance (crack resistance) ), and the complexity, the knot It is shown in Table 1. ° 仏 仏. Smoothness of the side of the pattern _ 70 201235781 Revision date: May 1st, 101st is the first l 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 (The side of the permanent pattern is evaluated for the smoothness of the side surface in the development step. The following evaluation criteria are given to the figure [Evaluation Criteria]. ο: The pattern side is smooth and the pattern shape is excellent. Case 2: On the side of the pattern A slight unevenness was observed, but it was a good figure 〇 △: There were irregularities on the side of the pattern, and the shape of the pattern was slightly poor. x: Condensate was found on the side of the pattern, and the shape of the pattern was poor. - Insulation - Buckle on the glass substrate The copper-coated side of the 12-thick printed substrate is laminated to obtain a comb-shaped electrode having a line width/gap width of 50 μΙη/50 μm, which is not in contact with each other on the same side. In the same manner as the method described in the preparation method, a photosensitive y film is laminated on the comb-shaped electrode of the substrate, and exposure is performed by an optimum exposure amount (_ 〇 = ^ 〜 1 J/cm 2 ). Second, at room temperature After standing for 1 hour, 3 (6 sec. 1 wt% sodium carbonate aqueous solution was subjected to 6 sec 3 shadows, and further heated at 80 〇 C for 10 minutes (dry 颂 〇 Rc MANUFACTURING ca, LTD manufactured by UV = f set by 1 The amount of energy of W is subjected to the ultraviolet C ^ of the photosensitive layer. Further, at 15 (the heating layer of the photosensitive layer is heated for 60 minutes, '=', and, thereby, the evaluation of the formation of a solder resist having a thickness of 25 μm is obtained. Use the meaning ^ to apply the two-layer method between the comb-shaped electrodes for the evaluation of the laminated body after heating, and connect the PTFE shielding line with the Sn/Pb solder to 201235781. This revision date: After applying a voltage of 5 V to the laminated body for evaluation after the comb-shaped electrode on May 10, 1st, the laminated body for evaluation was super accelerated at 13 (TC, 85% RH). The high humidity life test (HAST) tank was allowed to stand for 200 hours. The degree of occurrence of the solder resist of the laminated body for evaluation after the subsequent one-times metallographic microscope was observed and evaluated by the following evaluation criteria. [Evaluation Criteria] ◎: The migration was not confirmed, and the insulation was excellent. 〇: The migration was confirmed only on copper, and the insulation was good. △. A slight migration was observed in SR (anti-fcp agent), and insulation was still observed. Good ', △: The occurrence of migration was confirmed, and the insulation was slightly inferior x: short circuit between electrodes, poor insulation, and crack resistance - Photosensitive solder resist was used in the same manner as the method described in the method for preparing a laminate. The film 1 was laminated on a printed circuit board having 12 thick copper foil laminated on a glass substrate, and a mask of 2 mm square was used, and JJMW-201GX type manufactured by 〇RC I^ANUFACTURING CO., LTD. was used. The exposure machine was exposed by an optimum exposure amount (3 〇〇 J/cm 2 ) which can form a pattern of 2 mm square. Next, after standing at room temperature, i small 4 was spray-developed by a 30 C 1 wt% aqueous sodium carbonate solution, and further heated (dried) at 80X: for 10 minutes. Then, the ultraviolet ray of the photosensitive layer was irradiated with an amount of energy of 1 J/cm 2 using an ultraviolet ray irradiation apparatus manufactured by ORC MANUFACTURING CO., LTD. Further, at 15 (TC), the photosensitive layer is heated for 6 minutes. 72 201235781 -ri-rjwpifl is the (9) surface nickname Chinese manual without a slash correction. Amendment date: May 1, 2011 And the ancient ry is 25 solder resist: with:: the rectangular opening is formed with a thermal cycle of 65 ° C: the resulting substrate is after f 8 / 5 minutes, followed by b (the atmosphere of TC i Road 15 / knife clock, and then again exposed to - large milk in the micro-mirror observation through the _ ring ^ towel 1 by optical display degree, by the following evaluation = = agent on the crack and peeling [evaluation benchmark J f. ::Several f agent has no cracks, peeling, deformation, excellent toughness; slight deformation on several &amp; agents, but good toughness 〇 △• There is a slight crack on the solder resist, but the strongness is slightly better △: There is a slight crack and peeling on the solder resist, and the _ property is slightly worse than the anti-fcf agent. There are obvious cracks and flaking on the fcf agent, and the strong boring property is poor - the mirror-resistant property - after the permanent pattern is degreased and the surface is roughened, Catalyst addition is carried out with sulphur and sulphur. Secondly, the permanent pattern is recorded at 7G °C. The forging treatment was carried out by immersing in a sulfuric acid solution for 4 minutes, and then the crimping and peeling of the cured film in the permanent pattern were observed by visual observation, and the plating resistance was evaluated based on the following criteria. [Evaluation Criteria] ◎ • It is not crimped or peeled off in the cured film, and it is extremely excellent in bondability. 之一: One part of the cured film is discolored, but it is not a practical problem. It is excellent in plating resistance. △: There is curling in the cured film. , plating resistance is poor 73 201235781 HlHJUpUX is the 101104621 Chinese manual without scribe correction This revision date: 1 5 1 May 10 X: bulging (flaking) observed in the cured film, plating resistance is extremely poor ( Example 2) In Example 1, ZFR-1176 (manufactured by Nippon Kagaku Co., Ltd., acid modified epoxy resin containing ethylenic unsaturated group) (B-1) was replaced with Cyclomer P 200HM (manufactured by Daicel Chemical Industries, Ltd.) In the same manner as in Example 1, except that the acrylic resin containing an ethylenically unsaturated group and a carboxyl group (B-2) was used in the same manner as in Example 1, a photosensitive composition coating liquid and a photosensitive anti-resistance were produced. Solder film. The obtained photosensitive composition coating liquid and photosensitive resist film were evaluated in the same manner as in Example 1. The results are shown in Table 1. (Example 3) In Example 1, ZFR-1176 (Japanese chemical) was used. The company manufactures, acid-modified epoxy resin containing ethylenic unsaturated group) (B-1) is replaced by UXE-3024 (manufactured by Nippon Kagaku Co., Ltd., acid modified polyamine phthalic acid containing ethylenically unsaturated group) The photosensitive resin coating liquid and the photosensitive solder resist film were produced in the same manner as in Example 1 except that the ester resin (B-3) was used in the same manner as in the solid content. The obtained photosensitive composition coating liquid and the photosensitive solder resist film were evaluated in the same manner as in Example 1. The results are shown in Table 1. (Example 4) In Example 1, ZFR-1176 (manufactured by Nippon Kagaku Co., Ltd., acid modified epoxy resin containing ethylenically unsaturated group) (B-1) was replaced with carboxyl group synthesized in Synthesis Example 5. Polymer compound (acid modified polyaluminum phthalate resin containing ethylenically unsaturated group) (B-4) (in solid form 74 201235781 *. No. 101104621 The date of the correction was the same as in Example 1 except that the photosensitive composition coating liquid and the photosensitive resist film were produced in the same manner as in Example 1. The obtained photosensitive composition coating liquid and the photosensitive solder resist film were evaluated in the same manner as in Example 1. The results are shown in Table 1. (Example 5) A photosensitive composition coating liquid and a photosensitive photoresist film were produced in the same manner as in Example 4 except that the compound T-1 was replaced with the compound T-2. The obtained photosensitive composition coating liquid and the photosensitive solder resist film were evaluated in the same manner as in Example 1. The results are shown in Table 1. (Example 6) A photosensitive composition coating liquid and a photosensitive solder resist film were produced in the same manner as in Example 4 except that the compound τ_ι was replaced with the compound τ_3 in Example 4. The obtained photosensitive composition coating liquid and the photosensitive solder resist film were evaluated in the same manner as in Example 1. The results are shown in Table 1. (Example 7) A photosensitive composition coating liquid and a photosensitive anti-caries film were produced in the same manner as in Example 4 except that the compound Τ-1 was replaced with the compound Τ-4. The obtained photosensitive composition coating liquid and the photosensitive solder resist film were evaluated in the same manner as in Example 1. The results are shown in the table. (Example 8) In Example 5, the compound Τ-2 was formulated in an amount of from 75 to 35,357,811, HiHOUpiii, No. 101,104,621, which is not underlined. Revision date: May 10, 101 曰 Composition coating liquid A photosensitive composition coating liquid and a photosensitive solder resist film were produced in the same manner as in Example 5 except that the solid content was changed from 1.7 wt% to 3.0 wt%. The obtained photosensitive composition coating liquid and the photosensitive solder resist film were evaluated in the same manner as in Example 1. The results are shown in Table 1. (Example 9) In Example 5, Epotohto YDF-170 (manufactured by Xinyi Iron Chemical Co., Ltd., having an oxirane group (bisphenol F type epoxy resin)) as a thermal crosslinking agent was replaced with ETERNACOLLOXBP ( A photosensitive composition coating liquid and a photosensitive solder resist film were produced in the same manner as in Example 5 except that the epoxidized group-containing compound was produced by the Ube Industries Co., Ltd. The obtained photosensitive composition coating liquid and the photosensitive solder resist film were evaluated in the same manner as in Example 1. The results are shown in Table 1. (Example 10) In Example 5, 'Epotohto YDF-170, which is a thermal crosslinking agent (New II, a compound having an oxirane group manufactured by Chemical Co., Ltd. (bisphenol F type % oxygen resin was replaced with Sumidur BL3175 (Sumika) In the same manner as in Example 5, a photosensitive composition coating liquid and a photosensitive solder resist were prepared in the same manner as in Example 5. The plaque was coated with the obtained photosensitive composition. The cloth liquid and the photosensitive solder resist film were evaluated in the same manner as in Example 1. The results are shown in Table 1. (Example 11); In Example 5 alone, Epotohto YDF-170 (New 76) was used as a thermal crosslinking agent. 201235781 • * jj[ is the first Chinese version of No. 11〇4621 without a slash correction. The revised period: May 10, 101, chemical compound, epoxide-based compound (bisphenol F-type epoxy) A photosensitive composition coating liquid and a photosensitive resist film were produced in the same manner as in Example 5 except that YSLV_120TE (a compound of oxyethylene group produced by Nippon Steel Chemical Co., Ltd.) was used. About the obtained photosensitive composition The coating liquid and the photosensitive solder resist film were evaluated in the same manner as in Example 1. The results are shown in Table 1. (Example 12) In the example 1, the ZFR-1176 (manufactured by Nippon Kayaku Co., Ltd., acid modified) An epoxy resin containing an ethylenically unsaturated group) (replaced as a polymer compound containing a few groups synthesized in the synthesis example (acid-modified polyamino phthalate resin containing an ethylene saturated group) (B_5) ( In the same manner as in Example i, the photosensitive composition coating liquid and the photosensitive resist film were produced in the same manner as in Example i. The obtained photosensitive composition coating liquid and photosensitive solder resist film were obtained. The evaluation was carried out in the same manner as in Example 1. The results are shown in Table 1. In the same manner as in Example 1, except that the Ti compound and the thermal crosslinking agent were not prepared in Example 1 and Example 1 were used. The photosensitive composition coating liquid and the photosensitive solder resist film were produced. The obtained photosensitive composition coating liquid and the photosensitive solder resist film were evaluated in the same manner as in Example 1. The results are shown in the table. (Comparative Example 2) In Example 1, A photosensitive composition coating liquid and a photosensitive anti-solder 77 were produced in the same manner as in the example except that the Τ·4 compound was not prepared. The method of the present invention is not limited to the correction of the correction. 77 201235781 ΗΐΗουμαι is the first 〇11〇462丨Date: The film of the photosensitive composition coating liquid and the photosensitive solder resist film obtained was evaluated in the same manner as in Example 1. The results are shown in Table 1. (Comparative Example 3) In the same manner as in Example 1, except that the ruthenium-1 compound was replaced by ΙΧΕ61〇7 (manufactured by Toagosei Co., Ltd., an inorganic ion exchanger), a photosensitive composition coating liquid and a photosensitive resist film were produced. . The obtained photosensitive composition coating liquid and photosensitive resist film ' were evaluated in the same manner as in Example 1. The results are shown in Table 1. (Comparative Example 4) A photosensitive composition was produced in the same manner as in Example 1 except that the compound of the following structure was replaced with the compound T-Z (1,2,4-triazole) of the following structure. Coating solution and photosensitive solder resist film. The obtained photosensitive composition coating liquid and photosensitive resist film ' were evaluated in the same manner as in Example 1. The results are shown in Table 1. In the same manner as in Example 1, except that the thermal cross-linking agent was not prepared, the photosensitive composition coating liquid and the photosensitive anti-resistance were produced in the same manner as in Example 1. Flux is booming. 78 201235781 -ΓΧ-T^VFpJlfl No. 101HM621 Chinese manual without scribe correction This revision date: May 10, 1st, about the photosensitive composition coating liquid and photosensitive solder resist film, and examples 1 Evaluation was performed in the same manner. The results are shown in Table 1. [Table 1] 3SH. Example 2 III. Sitting on the side of the compound with a carboxyl group-containing polymer compound, the thermal cross-linking agent has a smooth insulating, crack-resistant, rhodium-resistant type (wt%) Tl Tl 1.7 1.7 Β-1 Β-2 YDF-170 YDF-1 70 〇〇△ 〇Δ - -· ο Example 3 _Example 4 Τ-1 1.7 Β·3 YDF-170 ο ◎ 〇ο 〇Δ ο (S) ◎ 〇(Ο) ~~ Τ-1 1.7 Β-4 YDF- 170 ο Reward Example 5 Example 9 25Πο~ 3grr 351Γ Ratio like 1 Τ-2 1.7 Β-4 YDF-170 ο ◎ ◎ ◎ Τ-3 1.7 Β-4 YDF-170 ο 〇◎ ◎~ Τ-4 1.7 Β- 4 YDF-170 ο ο ο ◎ Τ-2 JT-2 3.0 Β-4 YDF-170 〇◎ ◎ 1.7 Β-4 OXBP 〇△ ο 〇Δ Τ-2 1.7 Β-4 BL3175 〇Δ 〇Δ ◎ _Τ-2 1.7 Β-4 YSLV-120TE ο ο Τ-1 1.7 Β·5 YDF-170 ο ο ο ---—. 〇人|yij ι - Β-1 - Δ XXX Β-1 Β-1 YDF-170 vnc i Ϊγϊ Δ Δ Δ ο Τ-Ζ 1·7 Β-1 YDF-170 Δ Δ 〇Δ 〇Δ X 〇ο Δ~~~ _Τ-1 1.7 Β-1 - °Δ Δ X —— χ / /, in In Table 1, the content (wt%) of the triazole compound is relative; the content of the solid matter of the photosensitive composition coating liquid. X only Example 1 to Example 丨 2 were excellent in insulation, plating resistance, pattern side, and crack resistance. When the compound τ_2 was used as the ^^ compound, it was a very excellent insulating property. Further, in the case where the acid-modified polyaminomethyl group containing an ethylenically unsaturated group is used as a polymer compound having a hydroxyl group, it is excellent as a result of resistance to growth. Moreover, in the case of using a compound having an oxirane group, the amount of the oxirane group is the same as that of the case where the substance is used as the thermal crosslinking agent in the case of the first day of May 1st, when the object is used as the thermal crosslinking agent. result. In the comparative example, the smoothness of the side of the pattern was excellent, and the smoothness of the side of the pattern and the crack resistance were all in comparison with Comparative Example 2 containing no trisal compound as compared with the examples. The disc is actually the same as the &lt;, the insulating property, the smoothness of the side of the pattern, and the crack resistance are inferior to those of the comparative example 3 using the inorganic ion scavenger, and the secret is the same (four) degree. (4) Mosquito is poor, and the crack resistance is very poor. In Comparative Example 4 in which 1,2,4-disal was used as the three-n-seat compound, the pattern side surface was inferior in flatness and plating resistance as compared with the example. In Comparative Example 5 containing no thermal crosslinking agent, it was found to be inferior in insulation, crack resistance, and plating resistance. The smoothness of the side surface of the pattern in Examples 1 to 12 was improved, which was an effect which could not be obtained in Comparative Examples 1 to 4, and was not known in the prior art in which a triazole compound was used in the photosensitive composition. Examples of the aspect of the invention include the following aspects. A photosensitive composition comprising: a compound capable of reacting with a radical and a compound capable of reacting with a thermal crosslinking agent, a compound of a diazole ring, a polymerizable compound, and a photopolymerization initiation Agent, thermal crosslinking agent. &lt;2&gt; The photosensitive composition according to the above &lt;1&gt;, which further comprises a south molecular compound containing a group. &lt;3&gt; The photosensitive composition according to the above &lt;2&gt;, which contains carboxy 80 201235781 tl is the 101st HM621 Chinese specification without a slash correction. Amendment date: May 1, 2011 The compound is an acid modified polyurethane resin containing an ethylenically unsaturated group. The photosensitive composition according to any one of the above-mentioned <1>, wherein the thermal crosslinking agent has a cyclic ether group, a blocked isocyanate group, and an oxazolyl group. And a compound of at least one functional group of an ethylene carbonate group. The photosensitive composition according to any one of the above-mentioned <1> to <4>, wherein at least a group reactive with a radical and a group reactive with a thermal crosslinking agent are reacted at least The compound of any one of the triazole rings is a compound represented by the following formula (I); [Chem. 19] r λ Χ-Υ L"n Formula (1) wherein, in the above formula (I), X Represents a triazole ring; the oxime is an organic group having at least one of a group reactive with a radical and a group reactive with a thermal crosslinking agent; η represents an integer of 1 to 3; When ~3, 'Υ can be the same or different. The photosensitive composition of the above-mentioned <5>, wherein γ in the formula (1) is a group represented by the following formula (II); [Chem. 20] In the above formula (η), Υι denotes a carbon number of 2 to 25 81 201235781 HlHJOpm is the 101104621 Chinese manual without a sizing correction This repair does not have a correction date: 101 years 5 m+ valence organic group on the 10th of the month; 21 represents any one of a carboxyl group, an acryloxy group, and a methacryloxy group; m represents an integer of 1 to 2; in addition, when 111 is 2, the same may be the same. It can also be different. The photosensitive composition according to any one of the above-mentioned items, wherein the thermal crosslinking agent is a compound having an oxirane group. The photosensitive composition of any one of the above-mentioned <1> to <7>, which is a photosensitive composition. &lt;9&gt; A photosensitive resist film comprising: a support; a photosensitive layer on which a layer of the photosensitive agent composition according to the above &lt;8&gt; is formed &lt;1〇 &gt; - A permanent pattern forming method in which a photosensitive solder resist as described above is applied onto the surface of a substrate, dried (four) layer (4), and subjected to development after exposure. . &lt;11&gt; A permanent pattern which is formed by the permanent pattern forming method as described in &lt;1〇&gt; above. The twelve types of printed boards are characterized in that a permanent pattern is formed by the permanent pattern forming method as described in the above &lt;1〇&gt;. [Industrial Applicability] The photosensitive composition of the present invention can obtain a high-performance cured film having excellent insulating properties, mineralization resistance, and smoothness on the side surface of Fig. 2, and is used for a solder resist. The inductive solder resist of the present invention can be suitably used for various patterns such as a protective film, an interlayer, a permanent pattern such as a film J dry pattern, and the like, and the color 遽82 201235781t1 is the 101104621 Chinese manual without a slash correction. :In the manufacture of liquid crystal structural components such as solar wafers, pillars, ribs, spacers, separators, etc., in the manufacture of full-image sheets, micro-machines, proofing machines, etc., especially suitable for use in Permanent pattern formation for printed substrates. The pattern forming method of the present invention uses the photosensitive composition', and thus can be suitably used for various pattern forming applications such as a protective film, an interlayer insulating film, a permanent pattern such as a solder resist pattern, and the like, a color filter, a pillar, and a rib. In the manufacture of liquid crystal structural members such as materials, spacers, and separators, in the manufacture of a full-image sheet, a micromachine, a smashing machine, and the like, it is particularly suitable for use in permanent pattern formation of a printed substrate. [Simple description of the diagram] None. [Main component symbol description] None. 83 201235781 -Γ X 1 is the 101104021 Chinese manual without a slash correction. Amendment date: May 10, 101 PCT patent specification ※ Do not fill in the symbol part) (The format and order of this manual, please do not arbitrarily change the classification: '1/ls ※Application number: Apply by ※曰: ρ (Ά H°^K (2〇〇-^ϊ) I. Name of the invention: (Chinese/English) „ ,.,,, C〇Sl Ί^ /n,91) Photosensitive composition, photosensitive solder resist composition and photosensitive solder resist film, and permanent pattern, method of forming the same, and printed substrate 〇PHOTOSENSITIVE COMPOSITION, PHOTOSENSITIVE SOLDER RESIST COMPOSITION, PHOTOSENSITIVE SOLDER RESIST FILM, PERMANENT PATTERN, PERMANENT PATTERN FORMING METHOD AND PRINTED BOARD 2. Abstract: A photosensitive composition containing: at least one of a group reactive with a radical and a group reactive with a thermal crosslinking agent and a compound of a tri-wax ring a polymerizable compound, a photopolymerization initiator, a thermal crosslinking agent, preferably further containing a carboxyl group-containing polymer compound, preferably containing a carboxyl group. The polymer compound is an acid modified polyaluminum carboxylic acid resin containing an ethylenically unsaturated group. III. English Abstract: A photosensitive composition contains a compound having a triazole ring and at least one of a group capable of 201235781 I Μ X_/^/ X Λ- Λ. For the Chinese manual No. 101104621, there is no slash correction. This revision date: May 10, 1st, 10th, reacting with free radicals and a group capable of reacting with a thermal cross-linking agent, a polymerizable compound, a photopolymerization initiator, and a thermal cross-linking agent. The better one further contains a polymer compound having a carboxyl group. The polymer compound having a carboxyl group is better a polyurethane resin acid which is an acid denaturation and contains an 201235781 HiHOOpUi is the 101104621 Chinese manual without a slash correction. Amendment date: May 10, 101. VII. Patent application scope: 1. A photosensitive composition characterized by: possession and freedom base At least one of a reaction group and a group reactive with a thermal crosslinking agent, a compound having a triazine, a polymerizable compound, a photopolymerization initiator, and a thermal crosslinking agent. 2. The photosensitive composition according to item 1 of the patent application, further comprising a polymer compound having a carboxyl group. 3. The photosensitive composition according to claim 1, wherein the polymer compound having a carboxyl group is an acid modified polyamine phthalic acid resin containing an ethylenically unsaturated group. 4. The photosensitive composition according to claim 1, wherein the thermal crosslinking agent is at least one member selected from the group consisting of a cyclic ether group, a blocked isocyanate group, an oxazolyl group, and an ethylene carbonate group. Base compound. 5. The photosensitive composition according to claim 1, wherein the compound having at least one of a group reactive with a radical and a group reactive with a thermal crosslinking agent and a di-sigma ring is the following a compound represented by the formula (I); [Chemical Formula 1] x-fvl n Formula (1) wherein 'in the above formula (I), X represents a triazole ring; γ represents a group reactive with a radical and An organic group of at least one of the groups reactive with the thermal crosslinking agent; η represents an integer of 1 to 3; in addition, η is 2 to 3 84 201235781 TX-r-^ is No. 101104621 Amend this revision date: May 10, 101, γ can be the same or different. 6. The photosensitive composition according to claim 5, wherein Y in the general formula (I) is a group represented by the following formula (Π); [Chemical Formula 2] Formula (II) — Ylf Zi]m Wherein, in the above formula (II), Yi represents an m+l-valent organic group having a carbon number of 2 to 25; and B represents any one of a carboxyl group, an acryloxy group, and a methacryloxy group. m represents an integer from 1 to 2; in addition, when m is 2, Ζι may be the same or different. 7. The photosensitive composition according to claim 1, wherein the 'thermal crosslinking agent is a compound having an oxirane group. 8. A photosensitive solder resist composition characterized by comprising a photosensitive composition, wherein the photosensitive composition contains at least one of a group reactive with a radical and a group reactive with a thermal crosslinking agent A compound with a triazole ring, a polymerizable compound, a photopolymerization initiator, and a thermal crosslinking agent. A photosensitive resist film comprising: a support; and a photosensitive layer comprising a photosensitive resist composition containing a photosensitive composition, wherein the photosensitive composition contains A compound having at least one of a group reactive with a radical and a group reactive with a thermal crosslinking agent, and a cyclized compound, a polymerizable compound, a photopolymerization initiator, and a thermal crosslinking agent. 85 201235781 HlHOOpm is the Chinese manual of No. 101104621. There is no slash correction. This revision date: May 1st, 101, i. A permanent pattern forming method, which is characterized in that a photosensitive anti-roding agent containing the following photosensitive composition is used. The composition is applied onto the surface of the substrate, dried, and a photosensitive layer is laminated to form a layered body, and then developed and exposed, and the photosensitive composition contains a base which can be reversibly reacted with a radical and can be thermally crosslinked. At least any of the groups of the agent reaction and the triazole ring compound, a polymerizable compound, a photopolymerization initiator, and a thermal crosslinking agent. u. A permanent pattern characterized in that it is formed by a permanent pattern forming method in which a photosensitive resist composition containing a photosensitive composition is applied to a surface of a substrate At least 'drying and laminating a photosensitive layer to form a laminated body, and then performing development after exposure.' The photosensitive composition has at least one of a group reactive with a radical and a retardation i with a thermal crosslinking agent. A compound of a triazole ring, a polymerizable compound, a photopolymerization initiator, and a thermal crosslinking agent. 12. A printed circuit board characterized in that a permanent pattern is formed by a permanent pattern forming method in which a photosensitive resist composition containing a photosensitive composition is applied to a substrate On the surface, after drying, a photosensitive layer is formed to form a layered body, and then developed, and the photosensitive composition contains at least a group having a group reactive with a radical and reacting with a thermal crosslinking agent. One and three „ ring-ring compounds, polymerizable compounds, photopolymerization initiators, thermal cross-linking agents. 86 201235781 ~Γ 丄一Γ_&gt; For the 101104621 Chinese manual without a slash correction, this revision date: 1〇1 May 10th, 2010. The designated representative map: (1) The representative representative of the case is: No. (2) The symbol of the symbol of the representative figure is simple: No. 5. If there is a chemical formula in this case, please reveal the best display invention. Characteristic chemical formula: 〇 no 0