TW201024012A - Laser processing apparatus - Google Patents

Laser processing apparatus Download PDF

Info

Publication number
TW201024012A
TW201024012A TW098135555A TW98135555A TW201024012A TW 201024012 A TW201024012 A TW 201024012A TW 098135555 A TW098135555 A TW 098135555A TW 98135555 A TW98135555 A TW 98135555A TW 201024012 A TW201024012 A TW 201024012A
Authority
TW
Taiwan
Prior art keywords
laser processing
positional deviation
correction
machining
workpiece
Prior art date
Application number
TW098135555A
Other languages
English (en)
Chinese (zh)
Other versions
TWI367799B (ja
Inventor
Masahiro Takeuchi
Atsuhiro Kaneda
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of TW201024012A publication Critical patent/TW201024012A/zh
Application granted granted Critical
Publication of TWI367799B publication Critical patent/TWI367799B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B1/00—Comparing elements, i.e. elements for effecting comparison directly or indirectly between a desired value and existing or anticipated values
    • G05B1/01—Comparing elements, i.e. elements for effecting comparison directly or indirectly between a desired value and existing or anticipated values electric
    • G05B1/04—Comparing elements, i.e. elements for effecting comparison directly or indirectly between a desired value and existing or anticipated values electric with sensing of the position of the pointer of a measuring instrument
    • G05B1/08—Comparing elements, i.e. elements for effecting comparison directly or indirectly between a desired value and existing or anticipated values electric with sensing of the position of the pointer of a measuring instrument stepwise sensing

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Laser Beam Processing (AREA)
  • Numerical Control (AREA)
TW098135555A 2008-10-21 2009-10-21 Laser processing apparatus TW201024012A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008271364A JP5288987B2 (ja) 2008-10-21 2008-10-21 レーザ加工装置

Publications (2)

Publication Number Publication Date
TW201024012A true TW201024012A (en) 2010-07-01
TWI367799B TWI367799B (ja) 2012-07-11

Family

ID=42218986

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098135555A TW201024012A (en) 2008-10-21 2009-10-21 Laser processing apparatus

Country Status (4)

Country Link
JP (1) JP5288987B2 (ja)
KR (1) KR101103926B1 (ja)
CN (1) CN101722363B (ja)
TW (1) TW201024012A (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI787595B (zh) * 2019-04-01 2022-12-21 日商三菱電機股份有限公司 雷射加工裝置、雷射加工方法及誤差調整方法

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5221734B2 (ja) * 2011-10-21 2013-06-26 株式会社片岡製作所 加工機
JP5385356B2 (ja) * 2011-10-21 2014-01-08 株式会社片岡製作所 レーザ加工機
KR101298706B1 (ko) * 2011-11-04 2013-08-26 주식회사 케이랩 레이저 마킹 시스템의 마킹 보정 방법
KR101501900B1 (ko) * 2013-07-04 2015-03-12 주식회사 케이랩 레이저 마킹 시스템의 마킹 보정 방법 및 장치
WO2015198398A1 (ja) * 2014-06-24 2015-12-30 三菱電機株式会社 レーザ加工装置、加工制御装置およびレーザ加工方法
JP5952875B2 (ja) * 2014-09-30 2016-07-13 株式会社片岡製作所 レーザ加工機、レーザ加工機のワーク歪補正方法
CN104439726B (zh) * 2014-11-19 2017-01-25 苏州德龙激光股份有限公司 激光实时纠偏装置及其纠偏方法
JP2017100168A (ja) * 2015-12-03 2017-06-08 キヤノン株式会社 レーザ加工装置、部品の製造方法、プログラム及び記録媒体
CN106881525B (zh) * 2015-12-15 2019-06-18 新代科技股份有限公司 激光加工控制系统及其控制方法
JP6601285B2 (ja) * 2016-03-15 2019-11-06 オムロン株式会社 レーザ加工システムおよび加工制御方法
CN106181024A (zh) * 2016-08-25 2016-12-07 关键应用科技股份有限公司 镭射校正方法
WO2018096669A1 (ja) * 2016-11-28 2018-05-31 三菱電機株式会社 レーザ加工装置、レーザ加工方法、及びレーザ加工プログラム
JP6559377B2 (ja) * 2017-03-02 2019-08-14 三菱電機株式会社 重畳位置補正装置及び重畳位置補正方法
WO2018216281A1 (ja) * 2017-05-25 2018-11-29 三菱電機株式会社 レーザ加工装置
DE102017213001A1 (de) 2017-07-27 2019-01-31 Bayerische Motoren Werke Aktiengesellschaft Verfahren und Steuereinheit zur Ansteuerung einer Fügestation
JP7066368B2 (ja) * 2017-10-24 2022-05-13 住友重機械工業株式会社 レーザ加工機の制御装置、レーザ加工方法、及びレーザ加工機
CN109967893B (zh) * 2017-12-27 2021-02-19 大族激光科技产业集团股份有限公司 一种激光切割补偿方法及激光切割系统
CN108247200A (zh) * 2018-02-01 2018-07-06 西安中科微精光子制造科技有限公司 用于激光微孔加工的光束扫描系统和光束扫描方法
JP7237432B2 (ja) * 2019-07-26 2023-03-13 株式会社ディスコ 比較方法及びレーザー加工装置
KR102324548B1 (ko) * 2019-12-31 2021-11-10 (주)미래컴퍼니 레이저 가공 시스템 및 레이저 가공 방법
CN115087512A (zh) * 2020-02-10 2022-09-20 三菱电机株式会社 激光加工方法及激光加工装置
JP7307024B2 (ja) * 2020-03-31 2023-07-11 東レエンジニアリング株式会社 転写装置および転写装置の位置補正方法
CN117716316A (zh) * 2021-12-01 2024-03-15 株式会社片冈制作所 光学仪器用载物台装置
CN114515795B (zh) * 2022-01-28 2024-01-23 香港生产力促进局 一种基于视觉误差补偿的激光辅助校正方法及装置

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR0158728B1 (ko) * 1993-12-27 1999-01-15 마사카주 카키모토 천공장치
US5847960A (en) * 1995-03-20 1998-12-08 Electro Scientific Industries, Inc. Multi-tool positioning system
EP1852209B1 (en) * 1996-11-20 2013-08-14 Ibiden Co., Ltd. Laser machining apparatus for manufacturing a multilayered printed wiring board
JPH10301052A (ja) * 1997-05-02 1998-11-13 Sumitomo Heavy Ind Ltd レーザ加工装置の加工位置ずれ補正方式
JP3233080B2 (ja) * 1997-10-01 2001-11-26 松下電器産業株式会社 レーザ加工における補正情報の取得方法およびレーザ照射位置の補正方法
JP3614680B2 (ja) 1998-09-01 2005-01-26 松下電器産業株式会社 レーザ加工方法及び装置
JP3420956B2 (ja) * 1998-12-18 2003-06-30 松下電器産業株式会社 光走査装置及びこれを用いた画像読取装置と画像形成装置
JP3855684B2 (ja) * 2001-06-05 2006-12-13 松下電器産業株式会社 レーザ加工装置およびレーザ加工方法
JP3666434B2 (ja) * 2001-09-28 2005-06-29 松下電器産業株式会社 レーザ加工装置とその加工方法
JP2003245785A (ja) * 2002-02-22 2003-09-02 Sumitomo Heavy Ind Ltd ビーム加工方法及び装置
JP2004322149A (ja) * 2003-04-24 2004-11-18 Matsushita Electric Ind Co Ltd レーザ加工装置およびその制御方法と生産設備
JP2004358550A (ja) * 2003-06-09 2004-12-24 Sumitomo Heavy Ind Ltd レーザ加工方法およびレーザ加工装置
JP2008010620A (ja) * 2006-06-29 2008-01-17 Hitachi High-Tech Instruments Co Ltd Ｘｙ方向移動装置及びｘｙ方向移動方法
WO2008038385A1 (fr) * 2006-09-28 2008-04-03 Mitsubishi Electric Corporation Appareil d'usinage laser
KR100846259B1 (ko) * 2007-06-04 2008-07-18 미쓰비시덴키 가부시키가이샤 레이저 가공 장치

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI787595B (zh) * 2019-04-01 2022-12-21 日商三菱電機股份有限公司 雷射加工裝置、雷射加工方法及誤差調整方法

Also Published As

Publication number Publication date
JP5288987B2 (ja) 2013-09-11
CN101722363A (zh) 2010-06-09
TWI367799B (ja) 2012-07-11
KR20100044133A (ko) 2010-04-29
KR101103926B1 (ko) 2012-01-12
CN101722363B (zh) 2013-08-14
JP2010099674A (ja) 2010-05-06

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