TWI367799B - - Google Patents
Info
- Publication number
- TWI367799B TWI367799B TW098135555A TW98135555A TWI367799B TW I367799 B TWI367799 B TW I367799B TW 098135555 A TW098135555 A TW 098135555A TW 98135555 A TW98135555 A TW 98135555A TW I367799 B TWI367799 B TW I367799B
- Authority
- TW
- Taiwan
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B1/00—Comparing elements, i.e. elements for effecting comparison directly or indirectly between a desired value and existing or anticipated values
- G05B1/01—Comparing elements, i.e. elements for effecting comparison directly or indirectly between a desired value and existing or anticipated values electric
- G05B1/04—Comparing elements, i.e. elements for effecting comparison directly or indirectly between a desired value and existing or anticipated values electric with sensing of the position of the pointer of a measuring instrument
- G05B1/08—Comparing elements, i.e. elements for effecting comparison directly or indirectly between a desired value and existing or anticipated values electric with sensing of the position of the pointer of a measuring instrument stepwise sensing
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008271364A JP5288987B2 (ja) | 2008-10-21 | 2008-10-21 | レーザ加工装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201024012A TW201024012A (en) | 2010-07-01 |
TWI367799B true TWI367799B (ja) | 2012-07-11 |
Family
ID=42218986
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW098135555A TW201024012A (en) | 2008-10-21 | 2009-10-21 | Laser processing apparatus |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5288987B2 (ja) |
KR (1) | KR101103926B1 (ja) |
CN (1) | CN101722363B (ja) |
TW (1) | TW201024012A (ja) |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5221734B2 (ja) * | 2011-10-21 | 2013-06-26 | 株式会社片岡製作所 | 加工機 |
JP5385356B2 (ja) | 2011-10-21 | 2014-01-08 | 株式会社片岡製作所 | レーザ加工機 |
KR101298706B1 (ko) * | 2011-11-04 | 2013-08-26 | 주식회사 케이랩 | 레이저 마킹 시스템의 마킹 보정 방법 |
KR101501900B1 (ko) * | 2013-07-04 | 2015-03-12 | 주식회사 케이랩 | 레이저 마킹 시스템의 마킹 보정 방법 및 장치 |
WO2015198398A1 (ja) * | 2014-06-24 | 2015-12-30 | 三菱電機株式会社 | レーザ加工装置、加工制御装置およびレーザ加工方法 |
JP5952875B2 (ja) * | 2014-09-30 | 2016-07-13 | 株式会社片岡製作所 | レーザ加工機、レーザ加工機のワーク歪補正方法 |
CN104439726B (zh) * | 2014-11-19 | 2017-01-25 | 苏州德龙激光股份有限公司 | 激光实时纠偏装置及其纠偏方法 |
JP2017100168A (ja) * | 2015-12-03 | 2017-06-08 | キヤノン株式会社 | レーザ加工装置、部品の製造方法、プログラム及び記録媒体 |
CN106881525B (zh) * | 2015-12-15 | 2019-06-18 | 新代科技股份有限公司 | 激光加工控制系统及其控制方法 |
JP6601285B2 (ja) * | 2016-03-15 | 2019-11-06 | オムロン株式会社 | レーザ加工システムおよび加工制御方法 |
CN106181024A (zh) * | 2016-08-25 | 2016-12-07 | 关键应用科技股份有限公司 | 镭射校正方法 |
WO2018096669A1 (ja) * | 2016-11-28 | 2018-05-31 | 三菱電機株式会社 | レーザ加工装置、レーザ加工方法、及びレーザ加工プログラム |
CN110325318B (zh) * | 2017-03-02 | 2021-03-02 | 三菱电机株式会社 | 重叠位置校正装置及重叠位置校正方法 |
KR102230321B1 (ko) * | 2017-05-25 | 2021-03-19 | 미쓰비시덴키 가부시키가이샤 | 레이저 가공 장치 |
DE102017213001A1 (de) | 2017-07-27 | 2019-01-31 | Bayerische Motoren Werke Aktiengesellschaft | Verfahren und Steuereinheit zur Ansteuerung einer Fügestation |
JP7066368B2 (ja) * | 2017-10-24 | 2022-05-13 | 住友重機械工業株式会社 | レーザ加工機の制御装置、レーザ加工方法、及びレーザ加工機 |
CN109967893B (zh) * | 2017-12-27 | 2021-02-19 | 大族激光科技产业集团股份有限公司 | 一种激光切割补偿方法及激光切割系统 |
CN108247200A (zh) * | 2018-02-01 | 2018-07-06 | 西安中科微精光子制造科技有限公司 | 用于激光微孔加工的光束扫描系统和光束扫描方法 |
JP6632781B1 (ja) * | 2019-04-01 | 2020-01-22 | 三菱電機株式会社 | レーザ加工装置、レーザ加工方法、および誤差調整方法 |
JP7237432B2 (ja) * | 2019-07-26 | 2023-03-13 | 株式会社ディスコ | 比較方法及びレーザー加工装置 |
KR102324548B1 (ko) * | 2019-12-31 | 2021-11-10 | (주)미래컴퍼니 | 레이저 가공 시스템 및 레이저 가공 방법 |
JP6793892B1 (ja) * | 2020-02-10 | 2020-12-02 | 三菱電機株式会社 | レーザ加工方法およびレーザ加工装置 |
JP7307024B2 (ja) * | 2020-03-31 | 2023-07-11 | 東レエンジニアリング株式会社 | 転写装置および転写装置の位置補正方法 |
WO2023100395A1 (ja) * | 2021-12-01 | 2023-06-08 | 株式会社片岡製作所 | 光学機器用ステージ装置 |
CN114515795B (zh) * | 2022-01-28 | 2024-01-23 | 香港生产力促进局 | 一种基于视觉误差补偿的激光辅助校正方法及装置 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR0158728B1 (ko) * | 1993-12-27 | 1999-01-15 | 마사카주 카키모토 | 천공장치 |
US5847960A (en) * | 1995-03-20 | 1998-12-08 | Electro Scientific Industries, Inc. | Multi-tool positioning system |
US7462801B1 (en) * | 1996-11-20 | 2008-12-09 | Ibiden Co., Ltd. | Laser machining apparatus, and apparatus and method for manufacturing a multilayered printed wiring board |
JPH10301052A (ja) * | 1997-05-02 | 1998-11-13 | Sumitomo Heavy Ind Ltd | レーザ加工装置の加工位置ずれ補正方式 |
JP3233080B2 (ja) * | 1997-10-01 | 2001-11-26 | 松下電器産業株式会社 | レーザ加工における補正情報の取得方法およびレーザ照射位置の補正方法 |
JP3614680B2 (ja) | 1998-09-01 | 2005-01-26 | 松下電器産業株式会社 | レーザ加工方法及び装置 |
JP3420956B2 (ja) * | 1998-12-18 | 2003-06-30 | 松下電器産業株式会社 | 光走査装置及びこれを用いた画像読取装置と画像形成装置 |
JP3855684B2 (ja) * | 2001-06-05 | 2006-12-13 | 松下電器産業株式会社 | レーザ加工装置およびレーザ加工方法 |
JP3666434B2 (ja) * | 2001-09-28 | 2005-06-29 | 松下電器産業株式会社 | レーザ加工装置とその加工方法 |
JP2003245785A (ja) * | 2002-02-22 | 2003-09-02 | Sumitomo Heavy Ind Ltd | ビーム加工方法及び装置 |
JP2004322149A (ja) * | 2003-04-24 | 2004-11-18 | Matsushita Electric Ind Co Ltd | レーザ加工装置およびその制御方法と生産設備 |
JP2004358550A (ja) * | 2003-06-09 | 2004-12-24 | Sumitomo Heavy Ind Ltd | レーザ加工方法およびレーザ加工装置 |
JP2008010620A (ja) * | 2006-06-29 | 2008-01-17 | Hitachi High-Tech Instruments Co Ltd | Xy方向移動装置及びxy方向移動方法 |
JP4933424B2 (ja) * | 2006-09-28 | 2012-05-16 | 三菱電機株式会社 | レーザ加工装置 |
KR100846259B1 (ko) * | 2007-06-04 | 2008-07-18 | 미쓰비시덴키 가부시키가이샤 | 레이저 가공 장치 |
-
2008
- 2008-10-21 JP JP2008271364A patent/JP5288987B2/ja active Active
-
2009
- 2009-10-21 TW TW098135555A patent/TW201024012A/zh not_active IP Right Cessation
- 2009-10-21 CN CN2009102071015A patent/CN101722363B/zh not_active Expired - Fee Related
- 2009-10-21 KR KR1020090100176A patent/KR101103926B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR101103926B1 (ko) | 2012-01-12 |
JP5288987B2 (ja) | 2013-09-11 |
TW201024012A (en) | 2010-07-01 |
JP2010099674A (ja) | 2010-05-06 |
CN101722363B (zh) | 2013-08-14 |
KR20100044133A (ko) | 2010-04-29 |
CN101722363A (zh) | 2010-06-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |