TW200945508A - Luminous body with LED dies and production thereof - Google Patents

Luminous body with LED dies and production thereof Download PDF

Info

Publication number
TW200945508A
TW200945508A TW097149311A TW97149311A TW200945508A TW 200945508 A TW200945508 A TW 200945508A TW 097149311 A TW097149311 A TW 097149311A TW 97149311 A TW97149311 A TW 97149311A TW 200945508 A TW200945508 A TW 200945508A
Authority
TW
Taiwan
Prior art keywords
plastic
manufacturing
light
laying
illuminant
Prior art date
Application number
TW097149311A
Other languages
English (en)
Chinese (zh)
Inventor
Andrea Maier-Richter
Eckard Foltin
Michael Roppel
Peter Schibli
Original Assignee
Bayer Materialscience Ag
Fox Technology Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bayer Materialscience Ag, Fox Technology Gmbh filed Critical Bayer Materialscience Ag
Publication of TW200945508A publication Critical patent/TW200945508A/zh

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K2/00—Non-electric light sources using luminescence; Light sources using electrochemiluminescence
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Electromagnetism (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Illuminated Signs And Luminous Advertising (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
TW097149311A 2007-12-19 2008-12-18 Luminous body with LED dies and production thereof TW200945508A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102007061261A DE102007061261A1 (de) 2007-12-19 2007-12-19 Leuchtkörper mit LED-DIEs und deren Herstellung

Publications (1)

Publication Number Publication Date
TW200945508A true TW200945508A (en) 2009-11-01

Family

ID=40351577

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097149311A TW200945508A (en) 2007-12-19 2008-12-18 Luminous body with LED dies and production thereof

Country Status (8)

Country Link
US (2) US8487322B2 (https=)
EP (1) EP2235429A1 (https=)
JP (1) JP2011507291A (https=)
KR (1) KR101556807B1 (https=)
CN (1) CN102016387B (https=)
DE (1) DE102007061261A1 (https=)
TW (1) TW200945508A (https=)
WO (1) WO2009077105A1 (https=)

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* Cited by examiner, † Cited by third party
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CA2675390A1 (en) * 2009-08-13 2011-02-13 Norik Bonyadi Moulding with embedded lighting
DE102009060896A1 (de) * 2009-12-30 2011-07-07 ERCO GmbH, 58507 Lichtquellenmodul u. a.
DE102014110470A1 (de) * 2014-07-24 2016-01-28 Osram Opto Semiconductors Gmbh Beleuchtungsmodul
KR101847100B1 (ko) * 2017-01-02 2018-04-09 박승환 Uv 임프린팅 기술을 이용한 투명 발광장치 제조 방법 및 그에 따라 제조되는 투명 발광장치
DE102019106546A1 (de) * 2019-03-14 2020-09-17 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zur herstellung von optoelektronischen halbleiterbauteilen und optoelektronisches halbleiterbauteil
CN112936734A (zh) * 2021-03-08 2021-06-11 东莞广华汽车饰件科技有限公司 一种灯板定位式胶膜汽车装饰件的注塑制造方法
DE102023107545A1 (de) 2023-03-24 2024-09-26 Marelli Automotive Lighting Reutlingen (Germany) GmbH Vorrichtung zum Ausleuchten eines Emblems oder eines Schriftzugs eines Kraftfahrzeugs, ausgeleuchtetes Emblem oder ausgeleuchteter Schriftzug und Anordnung umfassend ein Frontpanel eines Kraftfahrzeugs mit mehreren ausleuchtbaren Emblemen oder Schriftzügen und Vorrichtungen zum Ausleuchten der Embleme oder Schriftzüge

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Also Published As

Publication number Publication date
CN102016387A (zh) 2011-04-13
CN102016387B (zh) 2014-12-03
WO2009077105A1 (de) 2009-06-25
EP2235429A1 (de) 2010-10-06
JP2011507291A (ja) 2011-03-03
US20090242903A1 (en) 2009-10-01
KR20100115343A (ko) 2010-10-27
DE102007061261A1 (de) 2009-07-02
US8487322B2 (en) 2013-07-16
KR101556807B1 (ko) 2015-10-01
US20130277695A1 (en) 2013-10-24

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