DE102007061261A1 - Leuchtkörper mit LED-DIEs und deren Herstellung - Google Patents
Leuchtkörper mit LED-DIEs und deren Herstellung Download PDFInfo
- Publication number
- DE102007061261A1 DE102007061261A1 DE102007061261A DE102007061261A DE102007061261A1 DE 102007061261 A1 DE102007061261 A1 DE 102007061261A1 DE 102007061261 A DE102007061261 A DE 102007061261A DE 102007061261 A DE102007061261 A DE 102007061261A DE 102007061261 A1 DE102007061261 A1 DE 102007061261A1
- Authority
- DE
- Germany
- Prior art keywords
- molding
- led
- wells
- open side
- dies
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K2/00—Non-electric light sources using luminescence; Light sources using electrochemiluminescence
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/551—Materials of bond wires
- H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/551—Materials of bond wires
- H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
- H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/551—Materials of bond wires
- H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
- H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Electromagnetism (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Led Device Packages (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Illuminated Signs And Luminous Advertising (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Priority Applications (9)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102007061261A DE102007061261A1 (de) | 2007-12-19 | 2007-12-19 | Leuchtkörper mit LED-DIEs und deren Herstellung |
| JP2010538409A JP2011507291A (ja) | 2007-12-19 | 2008-12-09 | Leddieを有する発光体およびその製造方法 |
| EP08862318A EP2235429A1 (de) | 2007-12-19 | 2008-12-09 | Leuchtkörper mit led-dies und deren herstellung |
| PCT/EP2008/010414 WO2009077105A1 (de) | 2007-12-19 | 2008-12-09 | Leuchtkörper mit led-dies und deren herstellung |
| KR1020107013521A KR101556807B1 (ko) | 2007-12-19 | 2008-12-09 | Led 다이를 가지는 발광체 및 그의 제조 |
| CN200880121777.6A CN102016387B (zh) | 2007-12-19 | 2008-12-09 | 具有led管芯的发光体及其制造 |
| US12/337,884 US8487322B2 (en) | 2007-12-19 | 2008-12-18 | Luminous body with LED dies and production thereof |
| TW097149311A TW200945508A (en) | 2007-12-19 | 2008-12-18 | Luminous body with LED dies and production thereof |
| US13/919,311 US20130277695A1 (en) | 2007-12-19 | 2013-06-17 | LUMINOUS BODY WITH LED DIEs AND PRODUCTION THEREOF |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102007061261A DE102007061261A1 (de) | 2007-12-19 | 2007-12-19 | Leuchtkörper mit LED-DIEs und deren Herstellung |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE102007061261A1 true DE102007061261A1 (de) | 2009-07-02 |
Family
ID=40351577
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE102007061261A Ceased DE102007061261A1 (de) | 2007-12-19 | 2007-12-19 | Leuchtkörper mit LED-DIEs und deren Herstellung |
Country Status (8)
| Country | Link |
|---|---|
| US (2) | US8487322B2 (https=) |
| EP (1) | EP2235429A1 (https=) |
| JP (1) | JP2011507291A (https=) |
| KR (1) | KR101556807B1 (https=) |
| CN (1) | CN102016387B (https=) |
| DE (1) | DE102007061261A1 (https=) |
| TW (1) | TW200945508A (https=) |
| WO (1) | WO2009077105A1 (https=) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102009060896A1 (de) * | 2009-12-30 | 2011-07-07 | ERCO GmbH, 58507 | Lichtquellenmodul u. a. |
| DE102014110470A1 (de) * | 2014-07-24 | 2016-01-28 | Osram Opto Semiconductors Gmbh | Beleuchtungsmodul |
| DE102023107545A1 (de) | 2023-03-24 | 2024-09-26 | Marelli Automotive Lighting Reutlingen (Germany) GmbH | Vorrichtung zum Ausleuchten eines Emblems oder eines Schriftzugs eines Kraftfahrzeugs, ausgeleuchtetes Emblem oder ausgeleuchteter Schriftzug und Anordnung umfassend ein Frontpanel eines Kraftfahrzeugs mit mehreren ausleuchtbaren Emblemen oder Schriftzügen und Vorrichtungen zum Ausleuchten der Embleme oder Schriftzüge |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA2675390A1 (en) * | 2009-08-13 | 2011-02-13 | Norik Bonyadi | Moulding with embedded lighting |
| KR101847100B1 (ko) * | 2017-01-02 | 2018-04-09 | 박승환 | Uv 임프린팅 기술을 이용한 투명 발광장치 제조 방법 및 그에 따라 제조되는 투명 발광장치 |
| DE102019106546A1 (de) * | 2019-03-14 | 2020-09-17 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Verfahren zur herstellung von optoelektronischen halbleiterbauteilen und optoelektronisches halbleiterbauteil |
| CN112936734A (zh) * | 2021-03-08 | 2021-06-11 | 东莞广华汽车饰件科技有限公司 | 一种灯板定位式胶膜汽车装饰件的注塑制造方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE202004005799U1 (de) * | 2003-04-29 | 2004-06-24 | Potthoff, Marc | Leuchtkörper |
| DE102004054822A1 (de) * | 2004-11-13 | 2006-05-18 | Schefenacker Vision Systems Germany Gmbh | Leuchte für Fahrzeuge, vorzugsweise für Kraftfahrzeuge |
Family Cites Families (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0553511A (ja) * | 1991-08-28 | 1993-03-05 | Toyoda Gosei Co Ltd | カラーデイスプレイ装置 |
| JPH10150227A (ja) * | 1996-11-15 | 1998-06-02 | Rohm Co Ltd | チップ型発光素子 |
| JPH10308535A (ja) * | 1997-05-02 | 1998-11-17 | Citizen Electron Co Ltd | 表面実装型発光ダイオード及びその製造方法 |
| JP3116085B2 (ja) * | 1997-09-16 | 2000-12-11 | 東京農工大学長 | 半導体素子形成法 |
| JP3746173B2 (ja) * | 1999-03-12 | 2006-02-15 | 松下電器産業株式会社 | 面照明装置及びそれを用いた携帯端末装置 |
| JP3774616B2 (ja) * | 2000-06-29 | 2006-05-17 | 株式会社日立製作所 | 照明装置及び導光板の製造方法 |
| US6614103B1 (en) * | 2000-09-01 | 2003-09-02 | General Electric Company | Plastic packaging of LED arrays |
| JP4431925B2 (ja) * | 2000-11-30 | 2010-03-17 | 信越半導体株式会社 | 発光素子の製造方法 |
| JP2003011416A (ja) * | 2001-06-28 | 2003-01-15 | Kyocera Corp | 光プリンタヘッド |
| JP2003023183A (ja) * | 2001-07-06 | 2003-01-24 | Stanley Electric Co Ltd | 面実装型ledランプ |
| JP4067802B2 (ja) * | 2001-09-18 | 2008-03-26 | 松下電器産業株式会社 | 照明装置 |
| JPWO2003030274A1 (ja) * | 2001-09-27 | 2005-01-20 | 日亜化学工業株式会社 | 発光装置およびその製造方法 |
| JP4108318B2 (ja) * | 2001-11-13 | 2008-06-25 | シチズン電子株式会社 | 発光装置 |
| JP2003158301A (ja) * | 2001-11-22 | 2003-05-30 | Citizen Electronics Co Ltd | 発光ダイオード |
| JP3875914B2 (ja) | 2002-05-14 | 2007-01-31 | 株式会社ケンウッド | 電子機器および書き込み動作制御方法 |
| WO2004017407A1 (de) * | 2002-07-31 | 2004-02-26 | Osram Opto Semiconductors Gmbh | Oberflächenmontierbares halbleiterbauelement und verfahren zu dessen herstellung |
| US20040048033A1 (en) * | 2002-09-11 | 2004-03-11 | Osram Opto Semiconductors (Malaysia) Sdn. Bhd. | Oled devices with improved encapsulation |
| BE1015302A3 (fr) * | 2003-01-10 | 2005-01-11 | Glaverbel | Vitrage comportant des composants electroniques. |
| KR20050092300A (ko) * | 2004-03-15 | 2005-09-21 | 삼성전기주식회사 | 고출력 발광 다이오드 패키지 |
| US7055969B2 (en) * | 2004-04-29 | 2006-06-06 | Hewlett-Packard Development Company, L.P. | Reflective optical assembly |
| KR101085144B1 (ko) * | 2004-04-29 | 2011-11-21 | 엘지디스플레이 주식회사 | Led 램프 유닛 |
| US7997771B2 (en) * | 2004-06-01 | 2011-08-16 | 3M Innovative Properties Company | LED array systems |
| JP4395104B2 (ja) * | 2004-11-08 | 2010-01-06 | アルプス電気株式会社 | 照明装置 |
| JP2006179572A (ja) * | 2004-12-21 | 2006-07-06 | Sharp Corp | 発光ダイオード、バックライト装置および発光ダイオードの製造方法 |
| JP5209177B2 (ja) * | 2005-11-14 | 2013-06-12 | 新光電気工業株式会社 | 半導体装置および半導体装置の製造方法 |
| KR100828891B1 (ko) * | 2006-02-23 | 2008-05-09 | 엘지이노텍 주식회사 | Led 패키지 |
| TWM302039U (en) * | 2006-03-13 | 2006-12-01 | Belletech Technology Co Ltd | LED backlight module of display |
| US20070263408A1 (en) * | 2006-05-09 | 2007-11-15 | Chua Janet Bee Y | Backlight module and method of making the module |
| JP5028562B2 (ja) * | 2006-12-11 | 2012-09-19 | 株式会社ジャパンディスプレイイースト | 照明装置及びこの照明装置を用いた表示装置 |
| US9024349B2 (en) * | 2007-01-22 | 2015-05-05 | Cree, Inc. | Wafer level phosphor coating method and devices fabricated utilizing method |
-
2007
- 2007-12-19 DE DE102007061261A patent/DE102007061261A1/de not_active Ceased
-
2008
- 2008-12-09 JP JP2010538409A patent/JP2011507291A/ja active Pending
- 2008-12-09 KR KR1020107013521A patent/KR101556807B1/ko not_active Expired - Fee Related
- 2008-12-09 WO PCT/EP2008/010414 patent/WO2009077105A1/de not_active Ceased
- 2008-12-09 EP EP08862318A patent/EP2235429A1/de not_active Withdrawn
- 2008-12-09 CN CN200880121777.6A patent/CN102016387B/zh not_active Expired - Fee Related
- 2008-12-18 TW TW097149311A patent/TW200945508A/zh unknown
- 2008-12-18 US US12/337,884 patent/US8487322B2/en not_active Expired - Fee Related
-
2013
- 2013-06-17 US US13/919,311 patent/US20130277695A1/en not_active Abandoned
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE202004005799U1 (de) * | 2003-04-29 | 2004-06-24 | Potthoff, Marc | Leuchtkörper |
| DE102004054822A1 (de) * | 2004-11-13 | 2006-05-18 | Schefenacker Vision Systems Germany Gmbh | Leuchte für Fahrzeuge, vorzugsweise für Kraftfahrzeuge |
Non-Patent Citations (1)
| Title |
|---|
| ISO 13468-2 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102009060896A1 (de) * | 2009-12-30 | 2011-07-07 | ERCO GmbH, 58507 | Lichtquellenmodul u. a. |
| DE102014110470A1 (de) * | 2014-07-24 | 2016-01-28 | Osram Opto Semiconductors Gmbh | Beleuchtungsmodul |
| DE102023107545A1 (de) | 2023-03-24 | 2024-09-26 | Marelli Automotive Lighting Reutlingen (Germany) GmbH | Vorrichtung zum Ausleuchten eines Emblems oder eines Schriftzugs eines Kraftfahrzeugs, ausgeleuchtetes Emblem oder ausgeleuchteter Schriftzug und Anordnung umfassend ein Frontpanel eines Kraftfahrzeugs mit mehreren ausleuchtbaren Emblemen oder Schriftzügen und Vorrichtungen zum Ausleuchten der Embleme oder Schriftzüge |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102016387A (zh) | 2011-04-13 |
| CN102016387B (zh) | 2014-12-03 |
| WO2009077105A1 (de) | 2009-06-25 |
| EP2235429A1 (de) | 2010-10-06 |
| TW200945508A (en) | 2009-11-01 |
| JP2011507291A (ja) | 2011-03-03 |
| US20090242903A1 (en) | 2009-10-01 |
| KR20100115343A (ko) | 2010-10-27 |
| US8487322B2 (en) | 2013-07-16 |
| KR101556807B1 (ko) | 2015-10-01 |
| US20130277695A1 (en) | 2013-10-24 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| OP8 | Request for examination as to paragraph 44 patent law | ||
| 8131 | Rejection | ||
| 8127 | New person/name/address of the applicant |
Owner name: BAYER MATERIALSCIENCE AG, 51373 LEVERKUSEN, DE |