DE102007061261A1 - Leuchtkörper mit LED-DIEs und deren Herstellung - Google Patents

Leuchtkörper mit LED-DIEs und deren Herstellung Download PDF

Info

Publication number
DE102007061261A1
DE102007061261A1 DE102007061261A DE102007061261A DE102007061261A1 DE 102007061261 A1 DE102007061261 A1 DE 102007061261A1 DE 102007061261 A DE102007061261 A DE 102007061261A DE 102007061261 A DE102007061261 A DE 102007061261A DE 102007061261 A1 DE102007061261 A1 DE 102007061261A1
Authority
DE
Germany
Prior art keywords
molding
led
wells
open side
dies
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE102007061261A
Other languages
German (de)
English (en)
Inventor
Andrea Dr. Maier-Richter
Eckard Foltin
Michael Roppel
Peter Schibli
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Covestro Deutschland AG
Original Assignee
FOX TECHNOLOGY GmbH
Bayer MaterialScience AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by FOX TECHNOLOGY GmbH, Bayer MaterialScience AG filed Critical FOX TECHNOLOGY GmbH
Priority to DE102007061261A priority Critical patent/DE102007061261A1/de
Priority to JP2010538409A priority patent/JP2011507291A/ja
Priority to EP08862318A priority patent/EP2235429A1/de
Priority to PCT/EP2008/010414 priority patent/WO2009077105A1/de
Priority to KR1020107013521A priority patent/KR101556807B1/ko
Priority to CN200880121777.6A priority patent/CN102016387B/zh
Priority to US12/337,884 priority patent/US8487322B2/en
Priority to TW097149311A priority patent/TW200945508A/zh
Publication of DE102007061261A1 publication Critical patent/DE102007061261A1/de
Priority to US13/919,311 priority patent/US20130277695A1/en
Ceased legal-status Critical Current

Links

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K2/00Non-electric light sources using luminescence; Light sources using electrochemiluminescence
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/50Bond wires
    • H10W72/551Materials of bond wires
    • H10W72/552Materials of bond wires comprising metals or metalloids, e.g. silver
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/50Bond wires
    • H10W72/551Materials of bond wires
    • H10W72/552Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/50Bond wires
    • H10W72/551Materials of bond wires
    • H10W72/552Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Electromagnetism (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Illuminated Signs And Luminous Advertising (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
DE102007061261A 2007-12-19 2007-12-19 Leuchtkörper mit LED-DIEs und deren Herstellung Ceased DE102007061261A1 (de)

Priority Applications (9)

Application Number Priority Date Filing Date Title
DE102007061261A DE102007061261A1 (de) 2007-12-19 2007-12-19 Leuchtkörper mit LED-DIEs und deren Herstellung
JP2010538409A JP2011507291A (ja) 2007-12-19 2008-12-09 Leddieを有する発光体およびその製造方法
EP08862318A EP2235429A1 (de) 2007-12-19 2008-12-09 Leuchtkörper mit led-dies und deren herstellung
PCT/EP2008/010414 WO2009077105A1 (de) 2007-12-19 2008-12-09 Leuchtkörper mit led-dies und deren herstellung
KR1020107013521A KR101556807B1 (ko) 2007-12-19 2008-12-09 Led 다이를 가지는 발광체 및 그의 제조
CN200880121777.6A CN102016387B (zh) 2007-12-19 2008-12-09 具有led管芯的发光体及其制造
US12/337,884 US8487322B2 (en) 2007-12-19 2008-12-18 Luminous body with LED dies and production thereof
TW097149311A TW200945508A (en) 2007-12-19 2008-12-18 Luminous body with LED dies and production thereof
US13/919,311 US20130277695A1 (en) 2007-12-19 2013-06-17 LUMINOUS BODY WITH LED DIEs AND PRODUCTION THEREOF

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102007061261A DE102007061261A1 (de) 2007-12-19 2007-12-19 Leuchtkörper mit LED-DIEs und deren Herstellung

Publications (1)

Publication Number Publication Date
DE102007061261A1 true DE102007061261A1 (de) 2009-07-02

Family

ID=40351577

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102007061261A Ceased DE102007061261A1 (de) 2007-12-19 2007-12-19 Leuchtkörper mit LED-DIEs und deren Herstellung

Country Status (8)

Country Link
US (2) US8487322B2 (https=)
EP (1) EP2235429A1 (https=)
JP (1) JP2011507291A (https=)
KR (1) KR101556807B1 (https=)
CN (1) CN102016387B (https=)
DE (1) DE102007061261A1 (https=)
TW (1) TW200945508A (https=)
WO (1) WO2009077105A1 (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009060896A1 (de) * 2009-12-30 2011-07-07 ERCO GmbH, 58507 Lichtquellenmodul u. a.
DE102014110470A1 (de) * 2014-07-24 2016-01-28 Osram Opto Semiconductors Gmbh Beleuchtungsmodul
DE102023107545A1 (de) 2023-03-24 2024-09-26 Marelli Automotive Lighting Reutlingen (Germany) GmbH Vorrichtung zum Ausleuchten eines Emblems oder eines Schriftzugs eines Kraftfahrzeugs, ausgeleuchtetes Emblem oder ausgeleuchteter Schriftzug und Anordnung umfassend ein Frontpanel eines Kraftfahrzeugs mit mehreren ausleuchtbaren Emblemen oder Schriftzügen und Vorrichtungen zum Ausleuchten der Embleme oder Schriftzüge

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2675390A1 (en) * 2009-08-13 2011-02-13 Norik Bonyadi Moulding with embedded lighting
KR101847100B1 (ko) * 2017-01-02 2018-04-09 박승환 Uv 임프린팅 기술을 이용한 투명 발광장치 제조 방법 및 그에 따라 제조되는 투명 발광장치
DE102019106546A1 (de) * 2019-03-14 2020-09-17 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zur herstellung von optoelektronischen halbleiterbauteilen und optoelektronisches halbleiterbauteil
CN112936734A (zh) * 2021-03-08 2021-06-11 东莞广华汽车饰件科技有限公司 一种灯板定位式胶膜汽车装饰件的注塑制造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202004005799U1 (de) * 2003-04-29 2004-06-24 Potthoff, Marc Leuchtkörper
DE102004054822A1 (de) * 2004-11-13 2006-05-18 Schefenacker Vision Systems Germany Gmbh Leuchte für Fahrzeuge, vorzugsweise für Kraftfahrzeuge

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0553511A (ja) * 1991-08-28 1993-03-05 Toyoda Gosei Co Ltd カラーデイスプレイ装置
JPH10150227A (ja) * 1996-11-15 1998-06-02 Rohm Co Ltd チップ型発光素子
JPH10308535A (ja) * 1997-05-02 1998-11-17 Citizen Electron Co Ltd 表面実装型発光ダイオード及びその製造方法
JP3116085B2 (ja) * 1997-09-16 2000-12-11 東京農工大学長 半導体素子形成法
JP3746173B2 (ja) * 1999-03-12 2006-02-15 松下電器産業株式会社 面照明装置及びそれを用いた携帯端末装置
JP3774616B2 (ja) * 2000-06-29 2006-05-17 株式会社日立製作所 照明装置及び導光板の製造方法
US6614103B1 (en) * 2000-09-01 2003-09-02 General Electric Company Plastic packaging of LED arrays
JP4431925B2 (ja) * 2000-11-30 2010-03-17 信越半導体株式会社 発光素子の製造方法
JP2003011416A (ja) * 2001-06-28 2003-01-15 Kyocera Corp 光プリンタヘッド
JP2003023183A (ja) * 2001-07-06 2003-01-24 Stanley Electric Co Ltd 面実装型ledランプ
JP4067802B2 (ja) * 2001-09-18 2008-03-26 松下電器産業株式会社 照明装置
JPWO2003030274A1 (ja) * 2001-09-27 2005-01-20 日亜化学工業株式会社 発光装置およびその製造方法
JP4108318B2 (ja) * 2001-11-13 2008-06-25 シチズン電子株式会社 発光装置
JP2003158301A (ja) * 2001-11-22 2003-05-30 Citizen Electronics Co Ltd 発光ダイオード
JP3875914B2 (ja) 2002-05-14 2007-01-31 株式会社ケンウッド 電子機器および書き込み動作制御方法
WO2004017407A1 (de) * 2002-07-31 2004-02-26 Osram Opto Semiconductors Gmbh Oberflächenmontierbares halbleiterbauelement und verfahren zu dessen herstellung
US20040048033A1 (en) * 2002-09-11 2004-03-11 Osram Opto Semiconductors (Malaysia) Sdn. Bhd. Oled devices with improved encapsulation
BE1015302A3 (fr) * 2003-01-10 2005-01-11 Glaverbel Vitrage comportant des composants electroniques.
KR20050092300A (ko) * 2004-03-15 2005-09-21 삼성전기주식회사 고출력 발광 다이오드 패키지
US7055969B2 (en) * 2004-04-29 2006-06-06 Hewlett-Packard Development Company, L.P. Reflective optical assembly
KR101085144B1 (ko) * 2004-04-29 2011-11-21 엘지디스플레이 주식회사 Led 램프 유닛
US7997771B2 (en) * 2004-06-01 2011-08-16 3M Innovative Properties Company LED array systems
JP4395104B2 (ja) * 2004-11-08 2010-01-06 アルプス電気株式会社 照明装置
JP2006179572A (ja) * 2004-12-21 2006-07-06 Sharp Corp 発光ダイオード、バックライト装置および発光ダイオードの製造方法
JP5209177B2 (ja) * 2005-11-14 2013-06-12 新光電気工業株式会社 半導体装置および半導体装置の製造方法
KR100828891B1 (ko) * 2006-02-23 2008-05-09 엘지이노텍 주식회사 Led 패키지
TWM302039U (en) * 2006-03-13 2006-12-01 Belletech Technology Co Ltd LED backlight module of display
US20070263408A1 (en) * 2006-05-09 2007-11-15 Chua Janet Bee Y Backlight module and method of making the module
JP5028562B2 (ja) * 2006-12-11 2012-09-19 株式会社ジャパンディスプレイイースト 照明装置及びこの照明装置を用いた表示装置
US9024349B2 (en) * 2007-01-22 2015-05-05 Cree, Inc. Wafer level phosphor coating method and devices fabricated utilizing method

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202004005799U1 (de) * 2003-04-29 2004-06-24 Potthoff, Marc Leuchtkörper
DE102004054822A1 (de) * 2004-11-13 2006-05-18 Schefenacker Vision Systems Germany Gmbh Leuchte für Fahrzeuge, vorzugsweise für Kraftfahrzeuge

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
ISO 13468-2

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009060896A1 (de) * 2009-12-30 2011-07-07 ERCO GmbH, 58507 Lichtquellenmodul u. a.
DE102014110470A1 (de) * 2014-07-24 2016-01-28 Osram Opto Semiconductors Gmbh Beleuchtungsmodul
DE102023107545A1 (de) 2023-03-24 2024-09-26 Marelli Automotive Lighting Reutlingen (Germany) GmbH Vorrichtung zum Ausleuchten eines Emblems oder eines Schriftzugs eines Kraftfahrzeugs, ausgeleuchtetes Emblem oder ausgeleuchteter Schriftzug und Anordnung umfassend ein Frontpanel eines Kraftfahrzeugs mit mehreren ausleuchtbaren Emblemen oder Schriftzügen und Vorrichtungen zum Ausleuchten der Embleme oder Schriftzüge

Also Published As

Publication number Publication date
CN102016387A (zh) 2011-04-13
CN102016387B (zh) 2014-12-03
WO2009077105A1 (de) 2009-06-25
EP2235429A1 (de) 2010-10-06
TW200945508A (en) 2009-11-01
JP2011507291A (ja) 2011-03-03
US20090242903A1 (en) 2009-10-01
KR20100115343A (ko) 2010-10-27
US8487322B2 (en) 2013-07-16
KR101556807B1 (ko) 2015-10-01
US20130277695A1 (en) 2013-10-24

Similar Documents

Publication Publication Date Title
EP3140097B1 (de) Mehrschichtkörper und verfahren zu dessen herstellung
DE112006001634B4 (de) Verfahren zum Herstellen einer oberflächenmontierbaren elektrischen Lichtemissionsvorrichtung mit einem Kühlkörper
EP2317213B1 (de) Leuchtdiodenmodul einer Kraftfahrzeugbeleuchtungseinrichtung und Kraftfahrzeugbeleuchtungseinrichtung
EP2532034B1 (de) Optoelektronisches bauelement und verfahren zum herstellen eines optoelektronischen bauelements
DE102005033709B4 (de) Lichtemittierendes Modul
DE102007061261A1 (de) Leuchtkörper mit LED-DIEs und deren Herstellung
DE102007044684B4 (de) Kompakte Hochintensitäts LED basierte Lichtquelle und Verfahren zum Herstellen derselben
DE112014004347B4 (de) Optoelektronisches Bauelement und Verfahren zu seiner Herstellung
DE3835942A1 (de) Flaechenhafter strahler
DE102008016487A1 (de) Optoelektronisches Halbleiterbauteil und Verfahren zur Herstellung eines optoelektronischen Halbleiterbauteils
DE102015109876A1 (de) Verfahren zum Herstellen eines optoelektronischen Bauelements und optoelektronisches Bauelement
DE102008059468A1 (de) Optoelektronische Lampe
DE112017002890T5 (de) Leuchtenaufbau, umfassend ein Wärme-Energiemanagement
EP2887778B1 (de) Flexible Leiterplatte mit Kühlkörper und Verfahren zu deren Herstellung
DE102013207111A1 (de) Optoelektronisches Bauelement
EP2357395B1 (de) Leuchteinheit mit Lichtleiter
DE102024108642A1 (de) Beleuchtungseinrichtung und verfahren
DE102023105944A1 (de) Beleuchtungseinrichtung mit eingebetteter elektronik
DE10357818B4 (de) Verfahren zur Herstellung lichtemittierender Halbleiterdioden auf einer Platine
WO2015000814A1 (de) Optoelektronisches halbleiterbauteil
DE102018210546A1 (de) Leuchtvorrichtung, scheinwerfer und verfahren
EP3309854A1 (de) Oled umfassendes leuchtmittel für fahrzeugleuchte
EP3312881B1 (de) Csp led-modul mit reflexionsmittel
DE102008019612A1 (de) Optoelektronisches Bauteil
DE102008013028A1 (de) Optoelektronisches Halbleiterbauteil, Gerät zur Aufzeichnung von Bildinformation und Verfahren zur Herstellung eines optoelektronischen Halbleiterbauteils

Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
8131 Rejection
8127 New person/name/address of the applicant

Owner name: BAYER MATERIALSCIENCE AG, 51373 LEVERKUSEN, DE