KR101556807B1 - Ｌｅｄ 다이를 가지는 발광체 및 그의 제조 - Google Patents

Ｌｅｄ 다이를 가지는 발광체 및 그의 제조 Download PDF

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Publication number
KR101556807B1
KR101556807B1 KR1020107013521A KR20107013521A KR101556807B1 KR 101556807 B1 KR101556807 B1 KR 101556807B1 KR 1020107013521 A KR1020107013521 A KR 1020107013521A KR 20107013521 A KR20107013521 A KR 20107013521A KR 101556807 B1 KR101556807 B1 KR 101556807B1
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KR
South Korea
Prior art keywords
molding
led die
indentation
transparent plastic
open side
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020107013521A
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English (en)
Korean (ko)
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KR20100115343A (ko
Inventor
안드레아 마이어-리히터
에카르트 폴틴
미하엘 로펠
페터 쉬블리
Original Assignee
바이엘 머티리얼사이언스 아게
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 바이엘 머티리얼사이언스 아게 filed Critical 바이엘 머티리얼사이언스 아게
Publication of KR20100115343A publication Critical patent/KR20100115343A/ko
Application granted granted Critical
Publication of KR101556807B1 publication Critical patent/KR101556807B1/ko
Expired - Fee Related legal-status Critical Current
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K2/00—Non-electric light sources using luminescence; Light sources using electrochemiluminescence
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Electromagnetism (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Illuminated Signs And Luminous Advertising (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
KR1020107013521A 2007-12-19 2008-12-09 Ｌｅｄ 다이를 가지는 발광체 및 그의 제조 Expired - Fee Related KR101556807B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102007061261.5 2007-12-19
DE102007061261A DE102007061261A1 (de) 2007-12-19 2007-12-19 Leuchtkörper mit LED-DIEs und deren Herstellung

Publications (2)

Publication Number Publication Date
KR20100115343A KR20100115343A (ko) 2010-10-27
KR101556807B1 true KR101556807B1 (ko) 2015-10-01

Family

ID=40351577

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020107013521A Expired - Fee Related KR101556807B1 (ko) 2007-12-19 2008-12-09 Ｌｅｄ 다이를 가지는 발광체 및 그의 제조

Country Status (8)

Country Link
US (2) US8487322B2 (https=)
EP (1) EP2235429A1 (https=)
JP (1) JP2011507291A (https=)
KR (1) KR101556807B1 (https=)
CN (1) CN102016387B (https=)
DE (1) DE102007061261A1 (https=)
TW (1) TW200945508A (https=)
WO (1) WO2009077105A1 (https=)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2675390A1 (en) * 2009-08-13 2011-02-13 Norik Bonyadi Moulding with embedded lighting
DE102009060896A1 (de) * 2009-12-30 2011-07-07 ERCO GmbH, 58507 Lichtquellenmodul u. a.
DE102014110470A1 (de) * 2014-07-24 2016-01-28 Osram Opto Semiconductors Gmbh Beleuchtungsmodul
KR101847100B1 (ko) * 2017-01-02 2018-04-09 박승환 Uv 임프린팅 기술을 이용한 투명 발광장치 제조 방법 및 그에 따라 제조되는 투명 발광장치
DE102019106546A1 (de) * 2019-03-14 2020-09-17 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zur herstellung von optoelektronischen halbleiterbauteilen und optoelektronisches halbleiterbauteil
CN112936734A (zh) * 2021-03-08 2021-06-11 东莞广华汽车饰件科技有限公司 一种灯板定位式胶膜汽车装饰件的注塑制造方法
DE102023107545A1 (de) 2023-03-24 2024-09-26 Marelli Automotive Lighting Reutlingen (Germany) GmbH Vorrichtung zum Ausleuchten eines Emblems oder eines Schriftzugs eines Kraftfahrzeugs, ausgeleuchtetes Emblem oder ausgeleuchteter Schriftzug und Anordnung umfassend ein Frontpanel eines Kraftfahrzeugs mit mehreren ausleuchtbaren Emblemen oder Schriftzügen und Vorrichtungen zum Ausleuchten der Embleme oder Schriftzüge

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JP2003011416A (ja) 2001-06-28 2003-01-15 Kyocera Corp 光プリンタヘッド
JP2003158301A (ja) 2001-11-22 2003-05-30 Citizen Electronics Co Ltd 発光ダイオード
JP2003331523A (ja) 2002-05-14 2003-11-21 Kenwood Corp 電子機器および書き込み動作制御方法
JP2006151357A (ja) * 2004-11-08 2006-06-15 Alps Electric Co Ltd 照明装置及びその製造方法

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JPH10150227A (ja) * 1996-11-15 1998-06-02 Rohm Co Ltd チップ型発光素子
JPH10308535A (ja) * 1997-05-02 1998-11-17 Citizen Electron Co Ltd 表面実装型発光ダイオード及びその製造方法
JP3116085B2 (ja) * 1997-09-16 2000-12-11 東京農工大学長 半導体素子形成法
JP3746173B2 (ja) * 1999-03-12 2006-02-15 松下電器産業株式会社 面照明装置及びそれを用いた携帯端末装置
JP3774616B2 (ja) * 2000-06-29 2006-05-17 株式会社日立製作所 照明装置及び導光板の製造方法
US6614103B1 (en) * 2000-09-01 2003-09-02 General Electric Company Plastic packaging of LED arrays
JP4431925B2 (ja) * 2000-11-30 2010-03-17 信越半導体株式会社 発光素子の製造方法
JP2003023183A (ja) * 2001-07-06 2003-01-24 Stanley Electric Co Ltd 面実装型ｌｅｄランプ
JP4067802B2 (ja) * 2001-09-18 2008-03-26 松下電器産業株式会社 照明装置
JPWO2003030274A1 (ja) * 2001-09-27 2005-01-20 日亜化学工業株式会社 発光装置およびその製造方法
JP4108318B2 (ja) * 2001-11-13 2008-06-25 シチズン電子株式会社 発光装置
WO2004017407A1 (de) * 2002-07-31 2004-02-26 Osram Opto Semiconductors Gmbh Oberflächenmontierbares halbleiterbauelement und verfahren zu dessen herstellung
US20040048033A1 (en) * 2002-09-11 2004-03-11 Osram Opto Semiconductors (Malaysia) Sdn. Bhd. Oled devices with improved encapsulation
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JP5209177B2 (ja) * 2005-11-14 2013-06-12 新光電気工業株式会社 半導体装置および半導体装置の製造方法
KR100828891B1 (ko) * 2006-02-23 2008-05-09 엘지이노텍 주식회사 Ｌｅｄ 패키지
TWM302039U (en) * 2006-03-13 2006-12-01 Belletech Technology Co Ltd LED backlight module of display
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JP2003011416A (ja) 2001-06-28 2003-01-15 Kyocera Corp 光プリンタヘッド
JP2003158301A (ja) 2001-11-22 2003-05-30 Citizen Electronics Co Ltd 発光ダイオード
JP2003331523A (ja) 2002-05-14 2003-11-21 Kenwood Corp 電子機器および書き込み動作制御方法
JP2006151357A (ja) * 2004-11-08 2006-06-15 Alps Electric Co Ltd 照明装置及びその製造方法

Also Published As

Publication number Publication date
CN102016387A (zh) 2011-04-13
CN102016387B (zh) 2014-12-03
WO2009077105A1 (de) 2009-06-25
EP2235429A1 (de) 2010-10-06
TW200945508A (en) 2009-11-01
JP2011507291A (ja) 2011-03-03
US20090242903A1 (en) 2009-10-01
KR20100115343A (ko) 2010-10-27
DE102007061261A1 (de) 2009-07-02
US8487322B2 (en) 2013-07-16
US20130277695A1 (en) 2013-10-24

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