TW200927309A - High-pressure water cleaning system - Google Patents
High-pressure water cleaning system Download PDFInfo
- Publication number
- TW200927309A TW200927309A TW097132341A TW97132341A TW200927309A TW 200927309 A TW200927309 A TW 200927309A TW 097132341 A TW097132341 A TW 097132341A TW 97132341 A TW97132341 A TW 97132341A TW 200927309 A TW200927309 A TW 200927309A
- Authority
- TW
- Taiwan
- Prior art keywords
- pressure water
- eccentric
- water jet
- cleaning device
- opening
- Prior art date
Links
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 title claims abstract description 162
- 238000004140 cleaning Methods 0.000 title claims abstract description 153
- 238000005406 washing Methods 0.000 claims description 68
- 238000003780 insertion Methods 0.000 claims description 66
- 230000037431 insertion Effects 0.000 claims description 66
- 238000007789 sealing Methods 0.000 claims description 56
- 239000007921 spray Substances 0.000 claims description 18
- 239000002184 metal Substances 0.000 claims description 10
- 230000002093 peripheral effect Effects 0.000 claims description 8
- 239000000428 dust Substances 0.000 claims description 5
- 241000238366 Cephalopoda Species 0.000 claims 1
- 230000007246 mechanism Effects 0.000 description 13
- 239000011521 glass Substances 0.000 description 10
- 239000007788 liquid Substances 0.000 description 8
- 238000004804 winding Methods 0.000 description 7
- 230000003749 cleanliness Effects 0.000 description 6
- 239000000758 substrate Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 235000012431 wafers Nutrition 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000003670 easy-to-clean Effects 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000001360 synchronised effect Effects 0.000 description 2
- 241000237858 Gastropoda Species 0.000 description 1
- 240000006394 Sorghum bicolor Species 0.000 description 1
- 235000011684 Sorghum saccharatum Nutrition 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 238000005189 flocculation Methods 0.000 description 1
- 230000016615 flocculation Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000008400 supply water Substances 0.000 description 1
- 229910021642 ultra pure water Inorganic materials 0.000 description 1
- 239000012498 ultrapure water Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
- B08B3/022—Cleaning travelling work
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Nonlinear Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Mathematical Physics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Optics & Photonics (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Nozzles (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007281322A JP5025422B2 (ja) | 2007-10-30 | 2007-10-30 | 高圧水噴射洗浄装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200927309A true TW200927309A (en) | 2009-07-01 |
| TWI351992B TWI351992B (enExample) | 2011-11-11 |
Family
ID=40581280
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW097132341A TW200927309A (en) | 2007-10-30 | 2008-08-25 | High-pressure water cleaning system |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US8042558B2 (enExample) |
| JP (1) | JP5025422B2 (enExample) |
| KR (2) | KR101039692B1 (enExample) |
| CN (1) | CN101422781B (enExample) |
| TW (1) | TW200927309A (enExample) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5058100B2 (ja) | 2008-08-22 | 2012-10-24 | 川崎重工業株式会社 | 高圧洗浄液噴射式洗浄装置 |
| CN101797565B (zh) * | 2009-11-26 | 2011-11-23 | 浙江工业大学 | 单转子双作用微型清洗机 |
| US20110155182A1 (en) * | 2009-12-29 | 2011-06-30 | First Solar, Inc. | High pressure cleaner |
| CN101947533A (zh) * | 2010-09-29 | 2011-01-19 | 张家港市超声电气有限公司 | 清洗机上的喷淋装置 |
| JP5360726B2 (ja) * | 2010-11-26 | 2013-12-04 | 株式会社サンシン | 板状部材研磨装置 |
| CN102069040A (zh) * | 2010-11-29 | 2011-05-25 | 北京七星华创电子股份有限公司 | 一种高速射流喷头 |
| CN103327868A (zh) * | 2010-12-08 | 2013-09-25 | 耶尔·史密斯 | 表面处理设备 |
| JP5474858B2 (ja) * | 2011-03-24 | 2014-04-16 | 東京エレクトロン株式会社 | 液処理装置及び液処理方法 |
| CN102430543B (zh) * | 2011-12-30 | 2016-06-01 | 上海集成电路研发中心有限公司 | 晶圆的清洗装置及清洗方法 |
| CN103658204B (zh) * | 2012-09-25 | 2016-06-22 | 宝山钢铁股份有限公司 | 一种射流清洗喷嘴的布置方法 |
| NL2014618B1 (en) * | 2015-04-10 | 2017-01-20 | Laura Metaal Holding B V | Device and method for transforming a metal slab from coil configuration into sheet configuration. |
| KR20180068367A (ko) * | 2016-12-13 | 2018-06-22 | 삼성디스플레이 주식회사 | 마스크 세정 방법 및 이를 수행하는 마스크 세정 장치 |
| CN107626640A (zh) * | 2017-09-20 | 2018-01-26 | 镇江颀龙科技有限公司 | 一种用于机电设备生产的清洗装置 |
| CN108436487A (zh) * | 2018-03-02 | 2018-08-24 | 江苏保捷精锻有限公司 | 一种具有自动清洗装置的轴承圈生产线及其工作方法 |
| JP2020082074A (ja) * | 2018-11-21 | 2020-06-04 | 株式会社ワールドエンジニアリング | 加圧水洗浄装置 |
| CN109433706B (zh) * | 2018-12-21 | 2023-09-08 | 核动力运行研究所 | 一种用于带中心隔板的蒸汽发生器管板泥渣冲洗的枪体 |
| CN114713545B (zh) * | 2022-03-16 | 2023-04-28 | 南京芯视元电子有限公司 | 一种硅基液晶清洗装置及清洗方法 |
| CN119289381A (zh) * | 2024-09-14 | 2025-01-10 | 青岛正大正电力环保设备有限公司 | 一种刮板捞渣机尾部积渣处理装置 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2622428A (en) * | 1949-04-06 | 1952-12-23 | United Shoe Machinery Corp | Machine for treating hides by application of pressure from diverse directions |
| JP2705719B2 (ja) | 1995-03-14 | 1998-01-28 | 川崎重工業株式会社 | 高圧水噴射洗浄装置 |
| JP3059934B2 (ja) * | 1996-07-29 | 2000-07-04 | 株式会社ワールド機工 | 超高圧水加工装置及び超高圧水加工システム |
| JP3851462B2 (ja) * | 1999-01-29 | 2006-11-29 | 大日本スクリーン製造株式会社 | 基板処理装置 |
| JP3579347B2 (ja) | 2000-12-01 | 2004-10-20 | アルインコ株式会社 | 洗浄装置 |
| CN1913982B (zh) | 2004-02-18 | 2012-06-13 | 川崎重工业株式会社 | 板材的洗涤设备 |
| JP2006297207A (ja) * | 2005-04-18 | 2006-11-02 | Sharp Corp | 基板の洗浄装置 |
-
2007
- 2007-10-30 JP JP2007281322A patent/JP5025422B2/ja not_active Expired - Fee Related
-
2008
- 2008-08-25 TW TW097132341A patent/TW200927309A/zh not_active IP Right Cessation
- 2008-10-22 KR KR1020080103493A patent/KR101039692B1/ko not_active Expired - Fee Related
- 2008-10-28 CN CN2008101751977A patent/CN101422781B/zh not_active Expired - Fee Related
- 2008-10-30 US US12/262,095 patent/US8042558B2/en active Active
-
2011
- 2011-02-10 KR KR1020110011942A patent/KR20110028484A/ko not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| CN101422781B (zh) | 2011-09-07 |
| KR101039692B1 (ko) | 2011-06-09 |
| TWI351992B (enExample) | 2011-11-11 |
| JP5025422B2 (ja) | 2012-09-12 |
| KR20110028484A (ko) | 2011-03-18 |
| CN101422781A (zh) | 2009-05-06 |
| KR20090045013A (ko) | 2009-05-07 |
| JP2009106845A (ja) | 2009-05-21 |
| US8042558B2 (en) | 2011-10-25 |
| US20090107531A1 (en) | 2009-04-30 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |