JP5025422B2 - 高圧水噴射洗浄装置 - Google Patents

高圧水噴射洗浄装置 Download PDF

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Publication number
JP5025422B2
JP5025422B2 JP2007281322A JP2007281322A JP5025422B2 JP 5025422 B2 JP5025422 B2 JP 5025422B2 JP 2007281322 A JP2007281322 A JP 2007281322A JP 2007281322 A JP2007281322 A JP 2007281322A JP 5025422 B2 JP5025422 B2 JP 5025422B2
Authority
JP
Japan
Prior art keywords
pressure water
cleaning
eccentric
support frame
cleaning device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2007281322A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009106845A (ja
Inventor
守正 久下
京史 辻田
英二 納富
秀幸 田中
充 野村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kawasaki Motors Ltd
Original Assignee
Kawasaki Jukogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kawasaki Jukogyo KK filed Critical Kawasaki Jukogyo KK
Priority to JP2007281322A priority Critical patent/JP5025422B2/ja
Priority to TW097132341A priority patent/TW200927309A/zh
Priority to KR1020080103493A priority patent/KR101039692B1/ko
Priority to CN2008101751977A priority patent/CN101422781B/zh
Priority to US12/262,095 priority patent/US8042558B2/en
Publication of JP2009106845A publication Critical patent/JP2009106845A/ja
Priority to KR1020110011942A priority patent/KR20110028484A/ko
Application granted granted Critical
Publication of JP5025422B2 publication Critical patent/JP5025422B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B08B3/022—Cleaning travelling work
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Nonlinear Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Mathematical Physics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Optics & Photonics (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Nozzles (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP2007281322A 2007-10-30 2007-10-30 高圧水噴射洗浄装置 Expired - Fee Related JP5025422B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2007281322A JP5025422B2 (ja) 2007-10-30 2007-10-30 高圧水噴射洗浄装置
TW097132341A TW200927309A (en) 2007-10-30 2008-08-25 High-pressure water cleaning system
KR1020080103493A KR101039692B1 (ko) 2007-10-30 2008-10-22 고압수 분사 세정장치
CN2008101751977A CN101422781B (zh) 2007-10-30 2008-10-28 高压水喷射清洗装置
US12/262,095 US8042558B2 (en) 2007-10-30 2008-10-30 High-pressure water cleaning system
KR1020110011942A KR20110028484A (ko) 2007-10-30 2011-02-10 고압수 분사 세정장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007281322A JP5025422B2 (ja) 2007-10-30 2007-10-30 高圧水噴射洗浄装置

Publications (2)

Publication Number Publication Date
JP2009106845A JP2009106845A (ja) 2009-05-21
JP5025422B2 true JP5025422B2 (ja) 2012-09-12

Family

ID=40581280

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007281322A Expired - Fee Related JP5025422B2 (ja) 2007-10-30 2007-10-30 高圧水噴射洗浄装置

Country Status (5)

Country Link
US (1) US8042558B2 (enExample)
JP (1) JP5025422B2 (enExample)
KR (2) KR101039692B1 (enExample)
CN (1) CN101422781B (enExample)
TW (1) TW200927309A (enExample)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5058100B2 (ja) 2008-08-22 2012-10-24 川崎重工業株式会社 高圧洗浄液噴射式洗浄装置
CN101797565B (zh) * 2009-11-26 2011-11-23 浙江工业大学 单转子双作用微型清洗机
US20110155182A1 (en) * 2009-12-29 2011-06-30 First Solar, Inc. High pressure cleaner
CN101947533A (zh) * 2010-09-29 2011-01-19 张家港市超声电气有限公司 清洗机上的喷淋装置
JP5360726B2 (ja) * 2010-11-26 2013-12-04 株式会社サンシン 板状部材研磨装置
CN102069040A (zh) * 2010-11-29 2011-05-25 北京七星华创电子股份有限公司 一种高速射流喷头
CN103327868A (zh) * 2010-12-08 2013-09-25 耶尔·史密斯 表面处理设备
JP5474858B2 (ja) * 2011-03-24 2014-04-16 東京エレクトロン株式会社 液処理装置及び液処理方法
CN102430543B (zh) * 2011-12-30 2016-06-01 上海集成电路研发中心有限公司 晶圆的清洗装置及清洗方法
CN103658204B (zh) * 2012-09-25 2016-06-22 宝山钢铁股份有限公司 一种射流清洗喷嘴的布置方法
NL2014618B1 (en) * 2015-04-10 2017-01-20 Laura Metaal Holding B V Device and method for transforming a metal slab from coil configuration into sheet configuration.
KR20180068367A (ko) * 2016-12-13 2018-06-22 삼성디스플레이 주식회사 마스크 세정 방법 및 이를 수행하는 마스크 세정 장치
CN107626640A (zh) * 2017-09-20 2018-01-26 镇江颀龙科技有限公司 一种用于机电设备生产的清洗装置
CN108436487A (zh) * 2018-03-02 2018-08-24 江苏保捷精锻有限公司 一种具有自动清洗装置的轴承圈生产线及其工作方法
JP2020082074A (ja) * 2018-11-21 2020-06-04 株式会社ワールドエンジニアリング 加圧水洗浄装置
CN109433706B (zh) * 2018-12-21 2023-09-08 核动力运行研究所 一种用于带中心隔板的蒸汽发生器管板泥渣冲洗的枪体
CN114713545B (zh) * 2022-03-16 2023-04-28 南京芯视元电子有限公司 一种硅基液晶清洗装置及清洗方法
CN119289381A (zh) * 2024-09-14 2025-01-10 青岛正大正电力环保设备有限公司 一种刮板捞渣机尾部积渣处理装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2622428A (en) * 1949-04-06 1952-12-23 United Shoe Machinery Corp Machine for treating hides by application of pressure from diverse directions
JP2705719B2 (ja) 1995-03-14 1998-01-28 川崎重工業株式会社 高圧水噴射洗浄装置
JP3059934B2 (ja) * 1996-07-29 2000-07-04 株式会社ワールド機工 超高圧水加工装置及び超高圧水加工システム
JP3851462B2 (ja) * 1999-01-29 2006-11-29 大日本スクリーン製造株式会社 基板処理装置
JP3579347B2 (ja) 2000-12-01 2004-10-20 アルインコ株式会社 洗浄装置
CN1913982B (zh) 2004-02-18 2012-06-13 川崎重工业株式会社 板材的洗涤设备
JP2006297207A (ja) * 2005-04-18 2006-11-02 Sharp Corp 基板の洗浄装置

Also Published As

Publication number Publication date
CN101422781B (zh) 2011-09-07
KR101039692B1 (ko) 2011-06-09
TWI351992B (enExample) 2011-11-11
TW200927309A (en) 2009-07-01
KR20110028484A (ko) 2011-03-18
CN101422781A (zh) 2009-05-06
KR20090045013A (ko) 2009-05-07
JP2009106845A (ja) 2009-05-21
US8042558B2 (en) 2011-10-25
US20090107531A1 (en) 2009-04-30

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