CN101422781B - 高压水喷射清洗装置 - Google Patents
高压水喷射清洗装置 Download PDFInfo
- Publication number
- CN101422781B CN101422781B CN2008101751977A CN200810175197A CN101422781B CN 101422781 B CN101422781 B CN 101422781B CN 2008101751977 A CN2008101751977 A CN 2008101751977A CN 200810175197 A CN200810175197 A CN 200810175197A CN 101422781 B CN101422781 B CN 101422781B
- Authority
- CN
- China
- Prior art keywords
- pressure water
- cleaning
- eccentric
- rotating shaft
- supporting frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
- B08B3/022—Cleaning travelling work
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Abstract
Description
Claims (19)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007281322A JP5025422B2 (ja) | 2007-10-30 | 2007-10-30 | 高圧水噴射洗浄装置 |
JP2007281322 | 2007-10-30 | ||
JP2007-281322 | 2007-10-30 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101422781A CN101422781A (zh) | 2009-05-06 |
CN101422781B true CN101422781B (zh) | 2011-09-07 |
Family
ID=40581280
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2008101751977A Active CN101422781B (zh) | 2007-10-30 | 2008-10-28 | 高压水喷射清洗装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US8042558B2 (zh) |
JP (1) | JP5025422B2 (zh) |
KR (2) | KR101039692B1 (zh) |
CN (1) | CN101422781B (zh) |
TW (1) | TW200927309A (zh) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5058100B2 (ja) | 2008-08-22 | 2012-10-24 | 川崎重工業株式会社 | 高圧洗浄液噴射式洗浄装置 |
CN101797565B (zh) * | 2009-11-26 | 2011-11-23 | 浙江工业大学 | 单转子双作用微型清洗机 |
US20110155182A1 (en) * | 2009-12-29 | 2011-06-30 | First Solar, Inc. | High pressure cleaner |
CN101947533A (zh) * | 2010-09-29 | 2011-01-19 | 张家港市超声电气有限公司 | 清洗机上的喷淋装置 |
JP5360726B2 (ja) * | 2010-11-26 | 2013-12-04 | 株式会社サンシン | 板状部材研磨装置 |
CN102069040A (zh) * | 2010-11-29 | 2011-05-25 | 北京七星华创电子股份有限公司 | 一种高速射流喷头 |
CN103327868A (zh) * | 2010-12-08 | 2013-09-25 | 耶尔·史密斯 | 表面处理设备 |
JP5474858B2 (ja) * | 2011-03-24 | 2014-04-16 | 東京エレクトロン株式会社 | 液処理装置及び液処理方法 |
CN102430543B (zh) * | 2011-12-30 | 2016-06-01 | 上海集成电路研发中心有限公司 | 晶圆的清洗装置及清洗方法 |
CN103658204B (zh) * | 2012-09-25 | 2016-06-22 | 宝山钢铁股份有限公司 | 一种射流清洗喷嘴的布置方法 |
NL2014618B1 (en) * | 2015-04-10 | 2017-01-20 | Laura Metaal Holding B V | Device and method for transforming a metal slab from coil configuration into sheet configuration. |
KR20180068367A (ko) * | 2016-12-13 | 2018-06-22 | 삼성디스플레이 주식회사 | 마스크 세정 방법 및 이를 수행하는 마스크 세정 장치 |
CN107626640A (zh) * | 2017-09-20 | 2018-01-26 | 镇江颀龙科技有限公司 | 一种用于机电设备生产的清洗装置 |
CN108436487A (zh) * | 2018-03-02 | 2018-08-24 | 江苏保捷精锻有限公司 | 一种具有自动清洗装置的轴承圈生产线及其工作方法 |
CN109433706B (zh) * | 2018-12-21 | 2023-09-08 | 核动力运行研究所 | 一种用于带中心隔板的蒸汽发生器管板泥渣冲洗的枪体 |
CN114713545B (zh) * | 2022-03-16 | 2023-04-28 | 南京芯视元电子有限公司 | 一种硅基液晶清洗装置及清洗方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2622428A (en) * | 1949-04-06 | 1952-12-23 | United Shoe Machinery Corp | Machine for treating hides by application of pressure from diverse directions |
JP2705719B2 (ja) | 1995-03-14 | 1998-01-28 | 川崎重工業株式会社 | 高圧水噴射洗浄装置 |
JP3059934B2 (ja) * | 1996-07-29 | 2000-07-04 | 株式会社ワールド機工 | 超高圧水加工装置及び超高圧水加工システム |
JP3851462B2 (ja) * | 1999-01-29 | 2006-11-29 | 大日本スクリーン製造株式会社 | 基板処理装置 |
JP3579347B2 (ja) | 2000-12-01 | 2004-10-20 | アルインコ株式会社 | 洗浄装置 |
WO2005077553A1 (ja) * | 2004-02-18 | 2005-08-25 | Kawasaki Plant Systems Kabushiki Kaisha | 板材の洗浄設備 |
JP2006297207A (ja) * | 2005-04-18 | 2006-11-02 | Sharp Corp | 基板の洗浄装置 |
-
2007
- 2007-10-30 JP JP2007281322A patent/JP5025422B2/ja not_active Expired - Fee Related
-
2008
- 2008-08-25 TW TW097132341A patent/TW200927309A/zh unknown
- 2008-10-22 KR KR1020080103493A patent/KR101039692B1/ko active IP Right Grant
- 2008-10-28 CN CN2008101751977A patent/CN101422781B/zh active Active
- 2008-10-30 US US12/262,095 patent/US8042558B2/en active Active
-
2011
- 2011-02-10 KR KR1020110011942A patent/KR20110028484A/ko not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
KR20110028484A (ko) | 2011-03-18 |
US20090107531A1 (en) | 2009-04-30 |
JP2009106845A (ja) | 2009-05-21 |
TW200927309A (en) | 2009-07-01 |
KR20090045013A (ko) | 2009-05-07 |
US8042558B2 (en) | 2011-10-25 |
CN101422781A (zh) | 2009-05-06 |
KR101039692B1 (ko) | 2011-06-09 |
JP5025422B2 (ja) | 2012-09-12 |
TWI351992B (zh) | 2011-11-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN101422781B (zh) | 高压水喷射清洗装置 | |
EP2322291B1 (en) | System comprising a cleaning device adapted to eject high-pressure cleaning liquid and an object to be cleaned | |
CN100440446C (zh) | 基板处理装置 | |
CN102057468B (zh) | 基板清洗方法及基板清洗装置 | |
CN1913982B (zh) | 板材的洗涤设备 | |
CN1917983B (zh) | 板材的立式加工生产线 | |
KR20010070234A (ko) | 판상부재의 반송 및 세정장치 | |
TWI344398B (zh) | ||
CN103370146A (zh) | 喷嘴模块和具有喷嘴模块的清洁设备 | |
JP2011240263A (ja) | 回転型高圧水噴射式洗浄方法と同装置 | |
JP5191273B2 (ja) | 高圧水噴射洗浄装置 | |
CN104952772A (zh) | 基板处理装置及基板处理方法 | |
JP5879119B2 (ja) | スクリーン洗浄装置 | |
KR20120003627U (ko) | 부상 장치 및 부상 반송 장치 | |
JP5261375B2 (ja) | 洗浄工程を実行する方法及びその方法を実行する装置 | |
CN102915940A (zh) | 具有紧凑结构的基板表面处理系统及基板表面处理方法 | |
KR102419631B1 (ko) | 분사 유닛 및 이를 포함하는 세정 장치 | |
KR102181280B1 (ko) | 브리징 방지 집진 장치 | |
KR20090129420A (ko) | 노즐, 드라이 클리너 및 드라이 클리너 시스템 | |
KR102278073B1 (ko) | 기판 처리 장치 | |
KR20150055655A (ko) | 기판 세정 장치 | |
JP2015202439A (ja) | 超音波洗浄装置 | |
KR101388505B1 (ko) | 대면적 기판용 세정장치 | |
KR101629471B1 (ko) | 기판세정장치 | |
KR20040090213A (ko) | 필터탱크의 필터 부착 스와프 제거장치 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
ASS | Succession or assignment of patent right |
Owner name: KAWASAKI JUKGYO K. K. Free format text: FORMER OWNER: KAWAJYU PLANT KABUSHIKI KAISHA Effective date: 20110426 |
|
C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: NO. 3-1-1, KANO-CHO, CHUO-KU, KOBE CITY, HYOGO PREFECTURE, JAPAN TO: 6508670 NO. 3-1-1, KANO-CHO, CHUO-KU, KOBE CITY, HYOGO PREFECTURE, JAPAN |
|
TA01 | Transfer of patent application right |
Effective date of registration: 20110426 Address after: Six million five hundred and eight thousand six hundred and seventy Kobe City, Japan Hyogo central Higashikawa Sakimachimi chome 1 times 1 Applicant after: Kawasaki Jukgyo K. K. Address before: Kobe City, Hyogo Prefecture, Japan Central Dongchuan Misaki Cho 3 chome 1 No. 1 Applicant before: Kawajyu Plant Kabushiki Kaisha |
|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant |