CN101422781B - 高压水喷射清洗装置 - Google Patents

高压水喷射清洗装置 Download PDF

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Publication number
CN101422781B
CN101422781B CN2008101751977A CN200810175197A CN101422781B CN 101422781 B CN101422781 B CN 101422781B CN 2008101751977 A CN2008101751977 A CN 2008101751977A CN 200810175197 A CN200810175197 A CN 200810175197A CN 101422781 B CN101422781 B CN 101422781B
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CN
China
Prior art keywords
pressure water
cleaning
eccentric
rotating shaft
supporting frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2008101751977A
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English (en)
Chinese (zh)
Other versions
CN101422781A (zh
Inventor
久下守正
辻田京史
纳富英二
田中秀幸
野村充
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kawasaki Motors Ltd
Original Assignee
Kawasaki Jukogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kawasaki Jukogyo KK filed Critical Kawasaki Jukogyo KK
Publication of CN101422781A publication Critical patent/CN101422781A/zh
Application granted granted Critical
Publication of CN101422781B publication Critical patent/CN101422781B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B08B3/022—Cleaning travelling work
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Nonlinear Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Optics & Photonics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Mathematical Physics (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Nozzles (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
CN2008101751977A 2007-10-30 2008-10-28 高压水喷射清洗装置 Expired - Fee Related CN101422781B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007281322A JP5025422B2 (ja) 2007-10-30 2007-10-30 高圧水噴射洗浄装置
JP2007281322 2007-10-30
JP2007-281322 2007-10-30

Publications (2)

Publication Number Publication Date
CN101422781A CN101422781A (zh) 2009-05-06
CN101422781B true CN101422781B (zh) 2011-09-07

Family

ID=40581280

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2008101751977A Expired - Fee Related CN101422781B (zh) 2007-10-30 2008-10-28 高压水喷射清洗装置

Country Status (5)

Country Link
US (1) US8042558B2 (enExample)
JP (1) JP5025422B2 (enExample)
KR (2) KR101039692B1 (enExample)
CN (1) CN101422781B (enExample)
TW (1) TW200927309A (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5058100B2 (ja) 2008-08-22 2012-10-24 川崎重工業株式会社 高圧洗浄液噴射式洗浄装置
CN101797565B (zh) * 2009-11-26 2011-11-23 浙江工业大学 单转子双作用微型清洗机
US20110155182A1 (en) * 2009-12-29 2011-06-30 First Solar, Inc. High pressure cleaner
CN101947533A (zh) * 2010-09-29 2011-01-19 张家港市超声电气有限公司 清洗机上的喷淋装置
JP5360726B2 (ja) * 2010-11-26 2013-12-04 株式会社サンシン 板状部材研磨装置
CN102069040A (zh) * 2010-11-29 2011-05-25 北京七星华创电子股份有限公司 一种高速射流喷头
WO2012078145A1 (en) * 2010-12-08 2012-06-14 Yale Smith Surface treating machine
JP5474858B2 (ja) * 2011-03-24 2014-04-16 東京エレクトロン株式会社 液処理装置及び液処理方法
CN102430543B (zh) * 2011-12-30 2016-06-01 上海集成电路研发中心有限公司 晶圆的清洗装置及清洗方法
CN103658204B (zh) * 2012-09-25 2016-06-22 宝山钢铁股份有限公司 一种射流清洗喷嘴的布置方法
NL2014618B1 (en) * 2015-04-10 2017-01-20 Laura Metaal Holding B V Device and method for transforming a metal slab from coil configuration into sheet configuration.
KR20180068367A (ko) * 2016-12-13 2018-06-22 삼성디스플레이 주식회사 마스크 세정 방법 및 이를 수행하는 마스크 세정 장치
CN107626640A (zh) * 2017-09-20 2018-01-26 镇江颀龙科技有限公司 一种用于机电设备生产的清洗装置
CN108436487A (zh) * 2018-03-02 2018-08-24 江苏保捷精锻有限公司 一种具有自动清洗装置的轴承圈生产线及其工作方法
JP2020082074A (ja) * 2018-11-21 2020-06-04 株式会社ワールドエンジニアリング 加圧水洗浄装置
CN109433706B (zh) * 2018-12-21 2023-09-08 核动力运行研究所 一种用于带中心隔板的蒸汽发生器管板泥渣冲洗的枪体
CN114713545B (zh) * 2022-03-16 2023-04-28 南京芯视元电子有限公司 一种硅基液晶清洗装置及清洗方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2622428A (en) * 1949-04-06 1952-12-23 United Shoe Machinery Corp Machine for treating hides by application of pressure from diverse directions
JP2705719B2 (ja) 1995-03-14 1998-01-28 川崎重工業株式会社 高圧水噴射洗浄装置
JP3059934B2 (ja) * 1996-07-29 2000-07-04 株式会社ワールド機工 超高圧水加工装置及び超高圧水加工システム
JP3851462B2 (ja) * 1999-01-29 2006-11-29 大日本スクリーン製造株式会社 基板処理装置
JP3579347B2 (ja) 2000-12-01 2004-10-20 アルインコ株式会社 洗浄装置
CN1913982B (zh) 2004-02-18 2012-06-13 川崎重工业株式会社 板材的洗涤设备
JP2006297207A (ja) * 2005-04-18 2006-11-02 Sharp Corp 基板の洗浄装置

Also Published As

Publication number Publication date
US8042558B2 (en) 2011-10-25
KR20110028484A (ko) 2011-03-18
TW200927309A (en) 2009-07-01
JP2009106845A (ja) 2009-05-21
JP5025422B2 (ja) 2012-09-12
KR101039692B1 (ko) 2011-06-09
US20090107531A1 (en) 2009-04-30
TWI351992B (enExample) 2011-11-11
KR20090045013A (ko) 2009-05-07
CN101422781A (zh) 2009-05-06

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Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
ASS Succession or assignment of patent right

Owner name: KAWASAKI JUKGYO K. K.

Free format text: FORMER OWNER: KAWAJYU PLANT KABUSHIKI KAISHA

Effective date: 20110426

C41 Transfer of patent application or patent right or utility model
COR Change of bibliographic data

Free format text: CORRECT: ADDRESS; FROM: NO. 3-1-1, KANO-CHO, CHUO-KU, KOBE CITY, HYOGO PREFECTURE, JAPAN TO: 6508670 NO. 3-1-1, KANO-CHO, CHUO-KU, KOBE CITY, HYOGO PREFECTURE, JAPAN

TA01 Transfer of patent application right

Effective date of registration: 20110426

Address after: Six million five hundred and eight thousand six hundred and seventy Kobe City, Japan Hyogo central Higashikawa Sakimachimi chome 1 times 1

Applicant after: KAWASAKI JUKOGYO Kabushiki Kaisha

Address before: Kobe City, Hyogo Prefecture, Japan Central Dongchuan Misaki Cho 3 chome 1 No. 1

Applicant before: Kawasaki Plant Systems Kabushiki Kaisha

C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20110907