KR101039692B1 - 고압수 분사 세정장치 - Google Patents

고압수 분사 세정장치 Download PDF

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Publication number
KR101039692B1
KR101039692B1 KR1020080103493A KR20080103493A KR101039692B1 KR 101039692 B1 KR101039692 B1 KR 101039692B1 KR 1020080103493 A KR1020080103493 A KR 1020080103493A KR 20080103493 A KR20080103493 A KR 20080103493A KR 101039692 B1 KR101039692 B1 KR 101039692B1
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KR
South Korea
Prior art keywords
pressure water
cleaning
high pressure
eccentric
water jet
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Expired - Fee Related
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KR1020080103493A
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English (en)
Korean (ko)
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KR20090045013A (ko
Inventor
모리마사 쿠게
케이지 츠지타
에이지 노우토미
히데유키 다나카
미츠루 노무라
Original Assignee
카와사키 주코교 카부시키 카이샤
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Publication of KR20090045013A publication Critical patent/KR20090045013A/ko
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Publication of KR101039692B1 publication Critical patent/KR101039692B1/ko
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B08B3/022—Cleaning travelling work
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Nonlinear Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Mathematical Physics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Optics & Photonics (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Nozzles (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
KR1020080103493A 2007-10-30 2008-10-22 고압수 분사 세정장치 Expired - Fee Related KR101039692B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007281322A JP5025422B2 (ja) 2007-10-30 2007-10-30 高圧水噴射洗浄装置
JPJP-P-2007-281322 2007-10-30

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020110011942A Division KR20110028484A (ko) 2007-10-30 2011-02-10 고압수 분사 세정장치

Publications (2)

Publication Number Publication Date
KR20090045013A KR20090045013A (ko) 2009-05-07
KR101039692B1 true KR101039692B1 (ko) 2011-06-09

Family

ID=40581280

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020080103493A Expired - Fee Related KR101039692B1 (ko) 2007-10-30 2008-10-22 고압수 분사 세정장치
KR1020110011942A Ceased KR20110028484A (ko) 2007-10-30 2011-02-10 고압수 분사 세정장치

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020110011942A Ceased KR20110028484A (ko) 2007-10-30 2011-02-10 고압수 분사 세정장치

Country Status (5)

Country Link
US (1) US8042558B2 (enExample)
JP (1) JP5025422B2 (enExample)
KR (2) KR101039692B1 (enExample)
CN (1) CN101422781B (enExample)
TW (1) TW200927309A (enExample)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5058100B2 (ja) 2008-08-22 2012-10-24 川崎重工業株式会社 高圧洗浄液噴射式洗浄装置
CN101797565B (zh) * 2009-11-26 2011-11-23 浙江工业大学 单转子双作用微型清洗机
US20110155182A1 (en) * 2009-12-29 2011-06-30 First Solar, Inc. High pressure cleaner
CN101947533A (zh) * 2010-09-29 2011-01-19 张家港市超声电气有限公司 清洗机上的喷淋装置
JP5360726B2 (ja) * 2010-11-26 2013-12-04 株式会社サンシン 板状部材研磨装置
CN102069040A (zh) * 2010-11-29 2011-05-25 北京七星华创电子股份有限公司 一种高速射流喷头
CN103327868A (zh) * 2010-12-08 2013-09-25 耶尔·史密斯 表面处理设备
JP5474858B2 (ja) * 2011-03-24 2014-04-16 東京エレクトロン株式会社 液処理装置及び液処理方法
CN102430543B (zh) * 2011-12-30 2016-06-01 上海集成电路研发中心有限公司 晶圆的清洗装置及清洗方法
CN103658204B (zh) * 2012-09-25 2016-06-22 宝山钢铁股份有限公司 一种射流清洗喷嘴的布置方法
NL2014618B1 (en) * 2015-04-10 2017-01-20 Laura Metaal Holding B V Device and method for transforming a metal slab from coil configuration into sheet configuration.
KR20180068367A (ko) * 2016-12-13 2018-06-22 삼성디스플레이 주식회사 마스크 세정 방법 및 이를 수행하는 마스크 세정 장치
CN107626640A (zh) * 2017-09-20 2018-01-26 镇江颀龙科技有限公司 一种用于机电设备生产的清洗装置
CN108436487A (zh) * 2018-03-02 2018-08-24 江苏保捷精锻有限公司 一种具有自动清洗装置的轴承圈生产线及其工作方法
JP2020082074A (ja) * 2018-11-21 2020-06-04 株式会社ワールドエンジニアリング 加圧水洗浄装置
CN109433706B (zh) * 2018-12-21 2023-09-08 核动力运行研究所 一种用于带中心隔板的蒸汽发生器管板泥渣冲洗的枪体
CN114713545B (zh) * 2022-03-16 2023-04-28 南京芯视元电子有限公司 一种硅基液晶清洗装置及清洗方法
CN119289381A (zh) * 2024-09-14 2025-01-10 青岛正大正电力环保设备有限公司 一种刮板捞渣机尾部积渣处理装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000223458A (ja) * 1999-01-29 2000-08-11 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2006297207A (ja) * 2005-04-18 2006-11-02 Sharp Corp 基板の洗浄装置
KR20060134974A (ko) * 2004-02-18 2006-12-28 가와사키 플랜트 시스템즈 가부시키 가이샤 판재의 세정설비

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2622428A (en) * 1949-04-06 1952-12-23 United Shoe Machinery Corp Machine for treating hides by application of pressure from diverse directions
JP2705719B2 (ja) 1995-03-14 1998-01-28 川崎重工業株式会社 高圧水噴射洗浄装置
JP3059934B2 (ja) * 1996-07-29 2000-07-04 株式会社ワールド機工 超高圧水加工装置及び超高圧水加工システム
JP3579347B2 (ja) 2000-12-01 2004-10-20 アルインコ株式会社 洗浄装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000223458A (ja) * 1999-01-29 2000-08-11 Dainippon Screen Mfg Co Ltd 基板処理装置
KR20060134974A (ko) * 2004-02-18 2006-12-28 가와사키 플랜트 시스템즈 가부시키 가이샤 판재의 세정설비
JP2006297207A (ja) * 2005-04-18 2006-11-02 Sharp Corp 基板の洗浄装置

Also Published As

Publication number Publication date
CN101422781B (zh) 2011-09-07
TWI351992B (enExample) 2011-11-11
JP5025422B2 (ja) 2012-09-12
TW200927309A (en) 2009-07-01
KR20110028484A (ko) 2011-03-18
CN101422781A (zh) 2009-05-06
KR20090045013A (ko) 2009-05-07
JP2009106845A (ja) 2009-05-21
US8042558B2 (en) 2011-10-25
US20090107531A1 (en) 2009-04-30

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