JP7160872B2 - 基板処理装置およびその駆動方法 - Google Patents
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B13/00—Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
- B05B13/02—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work
- B05B13/04—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work the spray heads being moved during spraying operation
- B05B13/0405—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work the spray heads being moved during spraying operation with reciprocating or oscillating spray heads
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
- B05B1/34—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to influence the nature of flow of the liquid or other fluent material, e.g. to produce swirl
- B05B1/3402—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to influence the nature of flow of the liquid or other fluent material, e.g. to produce swirl to avoid or to reduce turbulencies, e.g. comprising fluid flow straightening means
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
- B05B12/08—Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
- B05B12/08—Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means
- B05B12/12—Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means responsive to conditions of ambient medium or target, e.g. humidity, temperature position or movement of the target relative to the spray apparatus
- B05B12/124—Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means responsive to conditions of ambient medium or target, e.g. humidity, temperature position or movement of the target relative to the spray apparatus responsive to distance between spray apparatus and target
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B13/00—Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
- B05B13/02—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work
- B05B13/04—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work the spray heads being moved during spraying operation
- B05B13/0442—Installation or apparatus for applying liquid or other fluent material to separate articles rotated during spraying operation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B3/00—Spraying or sprinkling apparatus with moving outlet elements or moving deflecting elements
- B05B3/003—Spraying or sprinkling apparatus with moving outlet elements or moving deflecting elements with braking means, e.g. friction rings designed to provide a substantially constant revolution speed
- B05B3/006—Spraying or sprinkling apparatus with moving outlet elements or moving deflecting elements with braking means, e.g. friction rings designed to provide a substantially constant revolution speed using induced currents; using magnetic means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B14/00—Arrangements for collecting, re-using or eliminating excess spraying material
- B05B14/40—Arrangements for collecting, re-using or eliminating excess spraying material for use in spray booths
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B16/00—Spray booths
- B05B16/60—Ventilation arrangements specially adapted therefor
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Fluid Mechanics (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Description
910 電磁石
912 第1ばね
920 マグネット
922 第2ばね
950 センサ
1000 コントローラ
1010 薬液供給部
1020 駆動部
1030 電源供給部
Claims (17)
- 基板を支持し、基板を一方向に回転させ得る支持モジュールと、
前記支持モジュールの一側に配置され、スウィング方式で移動して前記基板に薬液を噴射するスウィングノズルと、
前記スウィングノズルの一側に配置され、前記スウィングノズルの動きをセンシングするセンサと、
前記スウィングノズルの他側に、互いに相対的な間隔調整が可能なように設置される電磁石およびマグネットと、
前記センサのセンシング結果の提供を受け、前記電磁石に電源を提供して前記電磁石と前記マグネットとの間に引力または斥力を発生させて前記スウィングノズルに対するダンピング動作を行うコントローラと、を含む、基板処理装置。 - 前記電磁石は前記スウィングノズルの他側と第1ばねを介して連結され、
前記マグネットは前記スウィングノズルの他側と第2ばねを介して連結される、請求項1に記載の基板処理装置。 - 前記電磁石と前記マグネットとの間に引力が発生する場合、前記第1ばねまたは前記第2ばねが曲がることにより前記電磁石と前記マグネットとの間の距離が近くなり、
前記電磁石と前記マグネットとの間に斥力が発生する場合、前記第1ばねまたは前記第2ばねが曲がることにより前記電磁石と前記マグネットとの間の距離が遠くなる、請求項2に記載の基板処理装置。 - 前記センサは加速度センサであり、
前記コントローラは前記加速度センサによってセンシングされた加速度に基づいて、前記電磁石に提供する電流の周波数と振幅のうち少なくとも一つを制御する、請求項1に記載の基板処理装置。 - 前記加速度センサによってセンシングされた加速度の絶対値が大きくなることによって、前記電磁石と前記マグネットとの間の斥力を大きくする、請求項4に記載の基板処理装置。
- 前記スウィングノズルが等速度運動するとき、前記スウィングノズルには第1大きさの振動が発生し、
前記スウィングノズルが停止するとき、前記スウィングノズルには前記第1大きさより大きい第2大きさの振動が発生する、請求項1に記載の基板処理装置。 - 前記スウィングノズルは、薬液を前記基板に噴射しながら第1位置から第2位置まで移動し、前記第1位置は前記基板のエッジに対応し、前記第2位置は前記基板のセンターに対応し、前記スウィングノズルは、前記第1位置と前記第2位置との間で少なくとも2回止まる、請求項6に記載の基板処理装置。
- 前記スウィングノズルの前記一側にはノズルチップが配置され、
前記スウィングノズルの前記他側はノズルシャフトと連結され、
前記ノズルシャフトは第1プーリに連結され、モータは第2プーリに連結され、前記第1プーリと前記第2プーリはタイミングベルトによって連結される、請求項6に記載の基板処理装置。 - 前記電磁石は、ボイスコイルモータを含む、請求項1に記載の基板処理装置。
- 基板に薬液を噴射するためのスウィングノズルと、
前記スウィングノズルの一側に配置された加速度センサと、
前記スウィングノズルの他側に配置され、前記加速度センサによってセンシングされた加速度によりダンピング動作を行うダンパとを含み、
前記ダンパは、
前記スウィングノズルの他側と第1ばねを介して連結された電磁石と、
前記スウィングノズルの他側と第2ばねを介して連結され、前記電磁石と対向するように配置されたマグネットとを含む、基板処理装置。 - 前記電磁石と前記マグネットとの間に引力が発生する場合、前記第1ばねまたは前記第2ばねが曲がることにより前記電磁石と前記マグネットとの間の距離が近くなり、前記ダンパのダンピング量が小さくなる、請求項10に記載の基板処理装置。
- 前記電磁石と前記マグネットとの間に斥力が発生する場合、前記第1ばねまたは前記第2ばねが曲がることにより前記電磁石と前記マグネットとの間の距離が遠くなり、前記ダンパのダンピング量が大きくなる、請求項10に記載の基板処理装置。
- 前記スウィングノズルが等速度運動するとき、前記スウィングノズルには第1大きさの振動が発生し、
前記スウィングノズルが停止するとき、前記スウィングノズルには前記第1大きさより大きい第2大きさの振動が発生する、請求項10に記載の基板処理装置。 - 前記スウィングノズルは、前記薬液を前記基板に噴射しながら第1位置から第2位置まで移動し、前記第1位置は前記基板のエッジに対応し、前記第2位置は前記基板のセンターに対応し、前記スウィングノズルは、前記第1位置と前記第2位置との間で少なくとも2回止まる、請求項13に記載の基板処理装置。
- スウィングノズルと、前記スウィングノズルの一側に配置されて前記スウィングノズルの動きをセンシングする加速度センサと、前記スウィングノズルの他側と第1ばねを介して連結された電磁石と、前記スウィングノズルの他側と第2ばねを介して連結されて、前記電磁石と対向するように配置されたマグネットと、を含む基板処理装置が提供され、
前記加速度センサを介して前記スウィングノズルの振動をセンシングし、
前記加速度センサのセンシング結果により、前記電磁石と前記マグネットとの間に斥力を発生させて前記電磁石と前記マグネットとの間の距離が遠くなるようにすることを含む、基板処理装置の駆動方法。 - 前記スウィングノズルが等速度運動するとき、前記スウィングノズルには第1大きさの振動が発生し、
前記スウィングノズルが停止するとき、前記スウィングノズルには前記第1大きさより大きい第2大きさの振動が発生する、請求項15に記載の基板処理装置の駆動方法。 - 前記スウィングノズルは、薬液を前記基板に噴射しながら第1位置から第2位置まで移動し、前記第1位置は前記基板のエッジに対応し、前記第2位置は前記基板のセンターに対応し、前記スウィングノズルは、前記第1位置と前記第2位置との間で少なくとも2回止まる、請求項16に記載の基板処理装置の駆動方法。
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KR1020190095884A KR102300359B1 (ko) | 2019-08-07 | 2019-08-07 | 기판 처리 장치 및 그 구동 방법 |
KR10-2019-0095884 | 2019-08-07 |
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Citations (2)
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JP2014099598A (ja) | 2012-10-18 | 2014-05-29 | Applied Materials Inc | 研磨パッドコンディショナ用ダンパ |
JP2018056206A (ja) | 2016-09-26 | 2018-04-05 | 東京エレクトロン株式会社 | 基板処理装置および基板処理方法 |
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JP3992601B2 (ja) * | 2002-01-31 | 2007-10-17 | 大日本スクリーン製造株式会社 | 薬液処理装置 |
KR100949502B1 (ko) * | 2005-06-20 | 2010-03-24 | 엘지디스플레이 주식회사 | 액정표시장치 제조 공정용 기판 반송장치 |
KR100734278B1 (ko) | 2005-10-12 | 2007-07-02 | 삼성전자주식회사 | 액츄에이터 및 이를 구비한 하드 디스크 드라이브 |
KR20080082152A (ko) * | 2007-03-07 | 2008-09-11 | 세메스 주식회사 | 기판 처리 장치 |
JP5277060B2 (ja) | 2009-04-16 | 2013-08-28 | 株式会社日立ハイテクノロジーズ | 真空蒸着装置 |
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US8598538B2 (en) | 2010-09-07 | 2013-12-03 | Nikon Corporation | Movable body apparatus, object processing device, exposure apparatus, flat-panel display manufacturing method, and device manufacturing method |
US10133186B2 (en) * | 2016-10-20 | 2018-11-20 | Mapper Lithography Ip B.V. | Method and apparatus for aligning substrates on a substrate support unit |
JP6847770B2 (ja) * | 2017-05-31 | 2021-03-24 | 株式会社Screenホールディングス | 基板処理装置および基板処理方法 |
CN111212930A (zh) * | 2018-07-26 | 2020-05-29 | 应用材料公司 | 用以支撑真空腔室中载体或部件的支撑装置、用以支撑真空腔室中载体或部件的支撑装置的使用、用以处理真空腔室中载体的设备、及真空沉积系统 |
US11009798B2 (en) * | 2018-09-05 | 2021-05-18 | Micron Technology, Inc. | Wafer alignment markers, systems, and related methods |
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JP2014099598A (ja) | 2012-10-18 | 2014-05-29 | Applied Materials Inc | 研磨パッドコンディショナ用ダンパ |
JP2018056206A (ja) | 2016-09-26 | 2018-04-05 | 東京エレクトロン株式会社 | 基板処理装置および基板処理方法 |
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US20210039119A1 (en) | 2021-02-11 |
JP2021027362A (ja) | 2021-02-22 |
KR20210017131A (ko) | 2021-02-17 |
US11938493B2 (en) | 2024-03-26 |
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