TW200922701A - Substrate cleaning apparatus - Google Patents

Abstract

A substrate cleaning apparatus is used to clean a substrate with a cleaning liquid. The substrate cleaning apparatus includes a substrate holding mechanism configured to hold a substrate horizontally, a rotating mechanism configured to rotate the substrate held by the substrate holding mechanism, a liquid supply nozzle for supplying a cleaning solution to the substrate, and a spin cover provided around the substrate and rotatable at substantially the same speed as the subs0trate. The spin cover has an inner circumferential surface shaped so as to surround the substrate. The inner circumferential surface is, from a lower end to an upper end thereof, inclined radially inwardly.

Description

200922701 VI. Description of the Invention: [Technical Field] The present invention relates to a substrate cleaning (four), which: = cleaning solution of the solution to the base to clean the substrate, and second [prior art] port: manufacturing a semiconductor device In the process of manufacturing, cleaning the substrate is an important procedure for increasing the yield. This substrate cleaning process is applied, for example, after the substrate polishing process to remove unwanted debris from the substrate. An example of a substrate cleaning apparatus is shown in Fig. 28 and the drawings. As shown in the second δ and 29 _, the substrate|cleaning device has a substrate holding mechanism _, the system is configured to hold the base inverse W, and the motor 1 is configured to rotate the substrate holding mechanism (10); 102' is disposed around the substrate W; and a nozzle 1〇3 for supplying pure water as a cleaning liquid to the surface of the substrate W to clean the substrate w. During the cleaning of the substrate W, the substrate is rotated at a low speed. And the pure water system is supplied to the surface of the substrate W. During the drying of the substrate w, the substrate w is rotated, for example, at a high speed of about 1500 rpm/knife 4 (min) to separate the pure water from the surface of the substrate W. The pure water is captured and recovered by the fixed cover (10). When pure water hits the fixed cover 1〇2, the pure water may bounce back into small water droplets and adhere to the surface of the substrate W. In addition, the substrate w rotates at a high speed. A swirling airflow is generated in the solid cover 102. This swirling airflow carries fine water droplets of pure water (i.e., 'mist of pure water), and the mist also adheres to the surface of the substrate W. Attached to the substrate The water droplets on the surface of W will form a watermark on the substrate (water mar k). These water marks may 3 320660 200922701 unfavorably slamming the device formed on the substrate w, and causing the product yield to be extinguished 'When using chemical liquid instead of pure water as the cleaning liquid, it may also be due to the same original It causes back contamination of the substrate W. Therefore, it is important to prevent water marks and back contamination on the substrate. Most L has been built using Rotagoni drying as a dry coat. Privately to prevent water marks on the substrate. According to the Notagoni drying method 'IPA treatment steam (mixture of isopropanol and nitrogen) and pure water from two parallel sprays, supply to the surface of the & transferred substrate, while Each nozzle is moved toward the base in the k-direction to dry the surface of the substrate. The Notagoni drying method is capable of sufficiently drying the substrate 'even when the substrate is rotated at a low speed range, for example, 150 to 3 GG rpm. Even if the board is even so that the turning / knife knows or lower % turn, when the pure water is charmed on the fixed cover, the pure water may still be converted into a water mist. These water droplets and mist may adhere to the surface of the substrate. content】

The object of the invention is to provide a substrate cleaning device capable of preventing water stains on the surface of the soil, and preventing backside contamination of the substrate. In order to achieve the above object, according to one aspect of the present invention, a device is provided, comprising: a substrate holding mechanism, and the group is configured to form a group of water-shoes, such as a #2 rotating mechanism, such that the substrate 111 is held by the substrate 111. Mounted with i rotation! The 'fourth supply nozzle' is used to supply cleaning liquid to the substrate; the cover ' is disposed around the substrate and is capable of substantially rotating with the substrate. The rotating cover has a shape that is shaped to surround the substrate, and the inner peripheral surface is inclined from the bottom end to the top end thereof toward the inner side 320660 4 200922701 k. In the case of the present invention, the substrate cleaning apparatus further comprises a fixed 盍' which is shaped to cover the entire outer periphery of the rotary cover. In a preferred aspect of the invention, the substrate cleaning apparatus further includes: relative movement between the substrate and the rotating cover to provide a slave axis along the substrate. Mechanism Γ = Preferred Aspect The rotating cover is mounted on the substrate holding ratchet holding mechanism having a discharge opening having an opening above the end and the discharge opening is inclined downwardly outward. In a preferred aspect of the invention, + comprises a vertical section of the arc, and now the inner peripheral surface has an angle of the inner circumference surface with respect to the horizontal plane =: the minimum value of the ί end gradually increases to the maximum value of the lower end. The substrate cleaning device comprises: the substrate cleaning device is disposed to rotate with the rotating cover in a side of the side of the side of the turn.疋 turntable. The inner rotating cover can be connected to the preferred aspect of the present invention, the outer peripheral surface having an arc-shaped vertical direction... the flip cover has an outer peripheral surface, and the peripheral surface has the outer surface of the inner rotating cover held by the substrate The substrate having the same height or the lower end of the substrate is adhered to the preferred embodiment of the present invention, and the arm is configured to include the internal rotary cleaning device: the branch arm is disposed The inner rotating cover year-old rotating cover is coupled to each other. In the gap between the cover and the cover, 320660 5 200922701 is shaped to generate a downward airflow in the gap when the inner rotary cover and the rotary cover rotate. According to the present invention, since the rotary cover rotates substantially at the same speed as the substrate, the relative speed between the substrate and the rotary cover is substantially zero. Therefore, when the cleaning liquid collides with the rotary cover, the cleaning liquid hardly generates water droplets and mist. In this way, it is possible to prevent water marks and back contamination of the substrate from being generated. The cleaning liquid removed from the substrate to the rotating cover is quickly discharged downward along the inner peripheral surface of the rotary cover under the action of centrifugal force. Therefore, the cleaning liquid does not remain on the inner peripheral surface of the rotary cover, and thus water droplets and mist are hardly generated. When the relative speed between the substrate and the rotary cover is substantially zero, a swirling air flow is hardly formed inside the rotary cover. Therefore, it is possible to prevent the mist of the cleaning liquid from being carried by the swirling airflow and adhering to the substrate. The above and other aspects, features, and other advantages of the present invention will become more apparent from the aspects of the invention. [Embodiment] A substrate cleaning apparatus according to an embodiment of the present invention will now be described with reference to the drawings. The same or corresponding parts will be marked with the same or corresponding reference signs. Fig. 1 is a schematic vertical sectional view of a substrate cleaning apparatus according to a first embodiment of the present invention, and Fig. 2 is a plan view of the substrate cleaning apparatus shown in Fig. 1. As shown in FIG. 1, the substrate cleaning apparatus includes a substrate holding mechanism 1 configured to horizontally hold the substrate W, and a motor (rotating mechanism) 2, and the system is configured to hold the substrate W via the substrate holding mechanism 1. With its own 6 320660 200922701 ~ axis rotation; rotating cover 3, # used to supply pure water as clear: around the liquid;, front nozzle 4, to not use & λ ~ soil plate w surface (front surface ). Can not = use, 4 water mosquitoes b material materials clear. ^ i board holding mechanism 1 sentence W FI »4^ "" several jaws 10, the group constitutes the surrounding edge of 3Mi Tuo W; round number ~ X people live on it; branch building the first _ D, the jaw 10 is installed with a recess to accommodate: two hollow first she 12A; U valley set the first workbench and cut the U to work in the second work 11A, 铱-丄 and glaze 1Z13. Brother, work, 厶

ilA brother a workbench 11B, the first support shaft 12 eight, D = heart mode configuration. The rotary cover 3 is fixed to the circular second operation: 11B: The table 11B and the rotary cover 3 are arranged in a care mode. The substrate w and _ cover 3 cents held by the nine claws 10 are concentric

The first support shaft 12A and the second support shaft 12B are coupled to each other by a linear motion guide structure 15. The linear motion guiding mechanism 15 is configured to transmit torque between the seven support shaft 12A and the second support shaft 12B while allowing the 'the support shaft 12A and the second support shaft 12B to face each other with respect to each other (ie, , moves along its axis of rotation). The body example of the linear motion guiding mechanism 15 includes a ball spline bearing. The Tida 2 is connected to the outer peripheral surface of the support shaft 12B via the gear shank. The torque of the motor 2 is transmitted to the first support shaft 19a' via the linear motion guiding mechanism 15 to thereby rotate the substrate w held by the jaws 10. The rotation of the first table 11A and the rotation of the second table 11B are simultaneous with each other at all times due to the linear motion guiding mechanism 15 7 320660 200922701. In detail, the substrate W and the rotary cover 3 are integrally rotated with each other, and the relative speed of each other is zero. There may be a slight speed difference between the substrate W and the rotary cover 3. The substrate w and the rotary cover 3 can be rotated by different rotating mechanisms. In this specification, rotating the substrate W and the rotary cover 3 at substantially the same speed means rotating the substrate W and the rotary cover 3 in the same direction at substantially the same angular velocity, instead of rotating the substrate ¥ and the rotary cover 3 Opposite Direction. The brake 23, which is a vertical moving mechanism, is coupled to the first floor shaft 12A via a coupling mechanism 24. This face joining mechanism 24 constitutes a driving force for transmitting the brake member 23 (which acts in the direction of the rotating shaft) to the first support shaft 12A while allowing the first support shaft 12A to rotate on its own axis. As shown in Fig. 3, the brake 23 vertically moves the first work unit Y 12A and the jaws 10 (i.e., the substrate W) via the face joining mechanism 24. System _ for the substrate ^ rotating cover The first axis 12A in j: Zhongrong Department of the ancient. ^ + 17, its system _ to the cleaning set. After (four) (back ^ _

To the dry gas supply source == 庑 and the gas nozzle 18, the handle is connected to the cleaning liquid, and the pure water is stored therein as a surface via the rear nozzle. The dry gas is supplied as a dry gas to the surface of the substrate W, and is passed through the gas or dry air as a rear surface. The dry gas is supplied from the one-body nozzle 18 to the substrate W. The front nozzle 4 is directed to the pure water supply source (that is, the center of the substrate w. The front nozzle 4 is lightly connected to the non-monthly liquid supply source in the figure), and The pure water 320660 8 200922701 supply source of pure water to the substrate w before the two parallel nozzles of the Viskini drying method 20 ^; ^ execution on the tower. The nozzle 20 is used to supply the surface to the front surface of the substrate W. The nozzle 21 is used to supply the surface of the substrate W to prevent the substrate w, ... from moving to the radial direction of the substrate W before the substrate W. The nozzles 20 and 21 can be shown in Fig. 4 as the substrate holding mechanism κ + , and the second table 1 and 6 are as shown in Figs. The discharge hole 25 has a plurality of discharge holes located therein for rotation, and an opening above the lower surface of the table UB and an elliptical hole at the second portion 25, which extends in rotation 3 = as shown in the figure, the discharge hole faces The field is tilted towards its lower opening. The surrounding direction of a 7' is radial, and the monthly washing liquid (for example, pure water) and the gas from the nozzle, the nozzle 18 supplied, and the circumference a = 彳, the pure water, and the gas discharge hole 25 are discharged. Qian Che (which is expected to be air) is discharged through the row, 26's body (cleaning liquid, pure water). The liquid to lean drain hole 26 between the 4L auxiliary stage 11β has an upper opening positioned in a gap between the first stage 11Α and the second stage i1Dη, and is located at the second stage (10) Open under the lower surface. The auxiliary discharge hole (4) is inclined toward the lower opening thereof as the discharge hole 25' (4) toward the outside. The liquid outlet passage 3 and the gas outlet passage 31 are provided below the discharge hole 25 and the auxiliary discharge hole 26. The liquid outlet passage 30 and the gas outlet passage 31 are annular. , right μ, the night body exit channel 3 is located radially outward of the gas outlet 320660 9 200922701 port channel 31. In this arrangement, the liquid and gas discharged from the discharge hole 25 and the auxiliary discharge hole 26 are separated from each other by centrifugal force, so that the liquid flows into the liquid outlet passage 3, and the gas flows into the gas: port passage 31. Figure 5 shows the path of the liquid and Figure 6 shows the path of the gas. The gas outlet passage 31 is connected to a suction source 32 (e.g., a vacuum pump). As shown in Fig. 6, the operation of the attraction source 32 is generated from the surface before the substrate w passes through the discharge (the downward flow of the gas flowing through the discharge hole 25 and the gas outlet passage 31. The soil-shaped fixing plate 35 is disposed in the second m1B Below, and with a small clearance between the lower surface of the second UB. The annular plate 35 is used to prevent the gas surrounding f from being actuated by the rotation of the second table 11β. : 28 is fixed to the periphery of the second table 11β. The skirt 28 H = 2 the discharge of the liquid discharged from the hole 25 and the auxiliary discharge hole 26 is also used to enable the liquid to be released away from the substrate. κ 钟? The flip cover 3 has a shape of a (four) surface so as to be surrounded by the substrate; the inner peripheral surface has a width of 2 to the inner peripheral surface of the inner surface: a radially inwardly inclined toward the upper end thereof, two: The angle between the faces (see ^) is less than 9 degrees. And the undercuts indicate that the vertical profile of the inner peripheral surface of the rotating cover 3 is limited to the first] The vertical section is not rich in this shape. The inner peripheral surface as shown in Fig. 7 may have a line including _ Vertical section, also; Turn:: 320660 10 200922701 vertical section. In Figure 7, the angle between the inner circumferential surface and the horizontal plane gradually increases from the minimum value of the upper end of the rotating cover 3 to the maximum value of the lower end (0 1 < 0 2) The inner peripheral surface of the rotary cover 3 shown in Fig. 7 can reduce the impact of liquid collision on the rotary cover 3, and the liquid can be rapidly flowed down along the inner peripheral surface due to the centrifugal force. The angle of the surface to the upper end with respect to the horizontal plane is preferably substantially 0. As shown in Fig. 2, the upper end of the rotary cover 3 has a plurality of recesses 3a each having a shape corresponding to the shape of each of the jaws 10. The diameter of the upper end of the rotary cover 3 is slightly larger than the diameter of the substrate W. As shown in Fig. 1, the lower end of the rotary cover 3 is positioned above the upper opening of the discharge hole 25 so that the rotary cover 3 is provided along the rotary cover 3 The liquid flowing downward from the inner peripheral surface can be smoothly introduced into the discharge hole 25. If the opening above the discharge hole 25 is located away from the lower end of the rotary cover 3, it flows downward along the inner peripheral surface of the rotary cover 3. The liquid will hit the second table 11B on the table The surface will not smoothly flow into the discharge hole 25. According to the above configuration of the embodiment, the liquid does not collide with the upper surface of the second stage 11B. Therefore, the liquid system smoothly flows into the discharge hole 25. The operation of the substrate cleaning apparatus according to the first embodiment will be explained. The motor 2 is supplied with energy to rotate the substrate W and the rotary cover 3. In this state, the front nozzle 4 and the rear nozzle 17 supply pure water to the front surface (upper surface) of the substrate W. And a rear surface (lower surface) to rinse the entirety of the substrate W with pure water. The pure water supplied to the substrate W is dispersed on the front surface and the rear surface by centrifugal force, thereby rinsing all surfaces of the substrate W. The pure water removed by the rotating substrate W is captured by the rotary cover 3 and flows into the discharge hole 25. When the substrate W is washed 11 320660 200922701, the two nozzles 20, 21 are in standby position. The line is positioned away from the substrate W and then 'stops supplying pure water from the front nozzle 4, + > and moves the nozzle 4 to a given standby position away from the substrate w. Move the two nozzles 2, 21 to the operating position above the US W. While the substrate W is rotated in the range of (10) to 3GG, the nozzle 20 supplies IPA vapor, and the nozzle supplies pure water to the surface before the substrate w. During operation, the rear nozzle tethers supply pure water to the surface behind the substrate W. The two nozzles 2, 21 are simultaneously moved in the radial direction of the substrate W, thereby drying the substrate. The front surface (upper surface + thereafter, the two nozzles 2G, 21 are moved to their standby positions, and: pure water is supplied from the rear nozzle 17. Then, the substrate w is 1 〇〇〇 to 〇〇 5 rpm The high speed range _, and pure water is removed from the surface after the substrate W. During the operation, the gas nozzle 18 supplies dry gas to the surface after the substrate w. In this manner, the surface of the substrate W is dried.

When the front surface (upper surface) of the substrate W is dried, as described above, pure water is supplied to the front surface and the rear surface of the substrate W. This pure water is removed from the substrate w by the force and moved to the rotary cover 3. Since the rotary cover 3 and the substrate w are rotated at the same speed, when pure water collides with the inner peripheral surface of the rotary cover 3, it hardly scatters. Further, the space between the rotary cover 3 and the substrate W which is rotated at the same speed produces only a slight swirling air current. Therefore, the mist of pure water is not carried to the substrate w by the swirling gas flow. In this way, water marks on the substrate w can be prevented from occurring. Furthermore, since the inner peripheral surface of the rotary cover 3 is inclined radially inward, the centrifugal force generated by the rotation of the rotary cover 3 causes the pure water to rapidly flow downward along the inner peripheral surface of the rotary cover 3 320660 12 200922701 & to the discharge hole 25. body. After the drying of I is terminated, the supply of dry gas from the gas nozzle 18 is stopped.

The brake 23 raises the substrate w up to the top of the substrate W L 3 . The substrate w of the domain is removed from the substrate holding mechanism by the hand of the transfer robot (not shown). Substrate = ^ ' when the front surface of the substrate W and when dry, when the substrate Sw ’ The system is positioned at different heights. For example, the normal substrate level shown in Fig. 1 is the w-plane shown in Fig. 1. Although the surface of the substrate w is dried, the substrate w is raised to the upper end of the rotary cover 3. Detailing the board W to lift until the rotation 3 is to position the base front and rear surface ends on the substrate? In this position, the distance between the substrate w and the rotary cover 3 = in the figure. Therefore, it is possible to prevent water droplets and mist from flowing from the surface after the substrate W to the front = small. Figure 9 is a substrate according to a second embodiment of the present invention: ...the 19th straight section. The portion of the substrate cleaning apparatus according to the second embodiment of the substrate cleaning apparatus according to the second embodiment is denoted by the same element t and will not be described below. The detailed operation of the apparatus according to the second section of the horn is the same: the base of the first embodiment is described below. The substrate holding mechanism 1 according to the second embodiment, the substrate holding mechanism 1 includes 11, a hollow support 12 for supporting the table U, and a plurality of jaws 1 on the upper surface of the table 11. Rotating cover 3 is solid: around::. The relative position between the rotating cover 3 and the substrate w is fixed at any time to set the stage 32〇6 (5〇13 200922701 in the work, move the rod 4〇^^^^捍4() and use it for the vertical hole m, which is located at ^* 2 and has a plurality of positions at the position where the work a η is similar to the push and unload 40. The configuration is shown as follows, and the position is also (4) the tender (four) hole 11 (the display 11 does not have an auxiliary discharge hole. ^ a The position of the position. After the table is dried in the same operation sequence as the first embodiment, the brake 23 lifts the push rod 40, as shown in the first figure, the push cup 40 moves upward through the pass. The hole 11& is used to lift the substrate boundary. Thereafter, the dried substrate W is moved by the hand of the transfer robot (not shown). FIG. 11 is a substrate cleaning device according to the second embodiment. An enlarged sectional view of a modified example of the rotary skein. As shown in Fig. u, the rotary cover 3 is fixed to the inner peripheral surface of the rotary cover 3, and the auxiliary rotary cover constituting the combination = 3 and the auxiliary rotary cover 42 rotates with each other. The cover member has a surface that is inclined toward the inner end toward the upper end thereof. The auxiliary rotary cover 42' end is located substantially the same as the substrate w Height. The upper end of the rotating cover and the auxiliary rotating cover 42 and the upper surface of the auxiliary rotating cover 42 have the same diameter on the shell. The upper end of the auxiliary 盍 2 has a plurality of recesses (not shown), the concave The shape of the recess % shown in Fig. 2. The auxiliary rotary cover 42 has a plurality of discharge holes 44 defined at the lower end thereof. /, the space above the surface before the substrate W and the space behind the substrate w It is separated from each other by the auxiliary rotating cover 42. Therefore, the process of the surface before the dry = lower plate W and the substrate of the surface after the drying of the substrate w affect each other. In detail, the auxiliary rotating cover 42 prevents the mist of the liquid: 14 32 〇66〇200922701 The space above the surface before the substrate w and the space below the surface after the substrate w. Further, the order of the drying process for the surface before the substrate W and the drying process for the surface after the substrate W can be changed. In detail, The surface of the substrate W is first dried and then the surface before the substrate W is dried. The specific details of the drying process are the same as those of the first embodiment. Fig. 12 is a substrate cleaning according to a third embodiment of the present invention. A schematic vertical cross-sectional view of the device. The components of the substrate cleaning device according to the third embodiment are the same as those of the substrate cleaning device according to the first embodiment, and will not be described in detail hereinafter. The operation details of the substrate cleaning apparatus according to the third embodiment are the same as those of the substrate cleaning apparatus according to the first embodiment, and will not be described in detail hereinafter. The substrate according to the third embodiment. The cleaning device is different from the substrate cleaning device according to the first embodiment in that a fixing cover 45 is provided around the rotary cover 3. The fixed cover 45 is non-rotatable and shaped to cover the entire periphery of the rotary cover 3. A small gap is formed between the outer peripheral surface of the rotary cover 3 and the inner peripheral surface of the fixed cover 45. The fixed cover 45 has a discharge port 46. The fixing cover 45 has an upper end whose diameter is substantially the same or slightly larger than the diameter of the upper end of the rotary cover 3. The fixed cover 45 has a lower end that is positioned below the lower end of the skirt 28. Therefore, the fixing cover 45 is shaped to cover the entire outer peripheral surface of the rotary cover 3 and the skirt 28. The reason why the fixing cover 45 is provided is as follows. When the rotary cover 3 is rotated together with the substrate W, the rotary cover 3 may disturb the gas in the vicinity of its outer peripheral surface to generate a slightly rotating air flow. This swirling airflow may carry the liquid mist back to the surface of the 15 320660 200922701 substrate w. The swirling gas stream may also carry liquid to the wall of the cleaning chamber (i.e., the cleaning space) and may carry the atmosphere in the cleaning chamber to the surface of the substrate w. The fixing cover 45 can prevent such a swirling airflow, and thus prevent water marks on the substrate W and contamination on the back surface of the substrate W. The gap between the fixed cover 45 and the rotary cover 3 is preferably as small as possible to prevent the gas in the gap from being disturbed by the rotating rotary cover 3 and flowing back toward the substrate W. The discharge port 46 is preferably coupled to a suction source (not shown) for forcibly extracting gas from the gap between the fixed cover 45 and the rotary cover 3 when the substrate W is dried. When the suction source is operated, an air flow is generated in a small gap between the rotary cover 3 and the fixed cover 45 as shown in Fig. 13. As a result, the gas that once flowed into the gap does not flow back toward the substrate W during the rotation of the rotary cover 3. Fig. 14 is a schematic vertical sectional view showing a modification of the substrate cleaning apparatus according to the third embodiment of the present invention. As shown in Fig. 14, a plurality of fins 50 are fixed to the outer peripheral surface of the rotary cover 3. The fin 50 can prevent the gas that has flowed into the gap between the fixed cover 45 and the rotary cover 3 from flowing back due to the rotation of the rotary cover 3. The outer peripheral surface of the rotary cover 3 may have a spiral groove instead of the fin 50 for causing the gas in the gap to flow downward due to the rotation of the rotary cover 3. The fixing cover 45 according to the third embodiment can be applied to the substrate cleaning apparatus according to the first and second embodiments. Fig. 15 is a schematic vertical sectional view showing a substrate cleaning apparatus in accordance with a fourth embodiment of the present invention. The substrate cleaning apparatus according to the fourth embodiment is the same as that of the substrate cleaning apparatus according to the first embodiment, and is denoted by the same reference numerals and will not be described in detail below. The details of the operation of the substrate cleaning apparatus according to the fourth embodiment, which is hereinafter described, are the same as those of the substrate cleaning apparatus according to the first embodiment. As shown in Fig. 15, the liquid absorber 53 is fixed to the inner peripheral surface of the rotary cover 3. The liquid absorber 53 substantially covers the entire inner peripheral surface of the rotary cover 3. The liquid absorber 53 may be made of PVA (polyethylene ethanol) sponge, porous material, or a master cloth. In order to easily replenish the liquid from the substrate W, the liquid absorber 53 is preferably hydrophilic. Preferably, the liquid absorber 53 should also have continuous pores therein to direct the trapped liquid downwardly through the liquid absorber 53 to the discharge orifice 25. In the fourth embodiment having the above structure, the liquid absorber 53 can also absorb the impact of the liquid colliding on the rotary cover 3. The liquid absorber 53 can also be applied to the substrate cleaning apparatus according to the first to third embodiments. Fig. 16 is a schematic vertical sectional view showing a substrate cleaning apparatus in accordance with a fifth embodiment of the present invention. The components of the substrate cleaning apparatus according to the fifth embodiment which are the same as those of the substrate cleaning apparatus according to the third embodiment are denoted by the same reference numerals and will not be described in detail hereinafter. The details of the operation of the substrate cleaning apparatus according to the fifth embodiment, which will not be described in detail hereinafter, are the same as those of the substrate cleaning apparatus according to the first embodiment. As shown in Fig. 16, the cleaning chamber 51 is disposed around the fixed cover 45, and the discharge port 47 is provided at the lower portion of the cleaning chamber 51. The discharge port 47 and the discharge port 46 of the fixed cover 45 are coupled to a suction source (not shown). According to this embodiment, the operation of the suction source not shown and the suction source 32 coupled to the gas outlet passage 31 integrally forms a downward flowing gas in the cleaning chamber 51. 17 320660 200922701 In particular, when the flow in the cleaning chamber 51 is prevented, there is a surface (4). This is down. The water droplets and the circumference between the inner surfaces; the surface of the circumference and the cleaning chamber are also prevented from being attached to the substrate π in the cleaning chamber 5i. The present invention relates to a substrate cleaning apparatus according to a reference example of the present invention. The substrate holding mechanism is configured to hold a machine lion through the substrate, and the mandrel is rotated; the fixed cover 70 is disposed on the earthen plate and its own Medium 4, for supplying pure water as a cleaning liquid: mouth _, and a plurality of jaws 1 on the surface of the hollow support support shaft 62 of the table 61 mounted on the work r6? The washing liquid supply source; and the gas "Hezui 17" is connected to the cleaning liquid for fine supply · = 3 gas in it as a dry gas, and after the body spray _ 18 supply surface gas to the substrate w surface. The field front nozzle 4 is directed to the center of the substrate W. The front nozzle 4 is lightly connected to the pure water supply source (that is, the supply of pure water to the substrate w is not supplied from the source B; and the center of the pure water is used to perform the Nota. Coney's technology - a parallel 対 2 (Μσ 21 is equipped with 320660 18 200922701. Nozzle 20 is used to supply IPA steam (mixture of isopropanol and nitrogen gas) to the surface before the substrate W. Nozzle 21 is used to supply pure Water is applied to the front surface of the substrate W to prevent the front surface of the substrate W from drying out. The nozzles 20 and 21 are movable in the radial direction of the substrate W. The fixed cover 70 has an inner peripheral surface that is inclined radially inward. The liquid absorber 53 is fixed to the inner peripheral surface of the fixed cover 70. The liquid absorber 53 substantially covers the entire inner peripheral surface of the fixed cover 70. The liquid absorber 53 may be made of PVA (polyethylene glycol). Made of sponge, porous material, or mesh cloth. In order to easily replenish liquid from the substrate W, the liquid absorber 53 should preferably be hydrophilic. The liquid absorber 53 should preferably have continuous pores therein so that Guide the captured liquid down through the liquid Absorber 53. A liquid reservoir 63 for recovering liquid (for example, pure water supplied from the front nozzle 4 and the rear nozzle 17 as a cleaning liquid, and pure water supplied from the nozzle 21) is disposed on the table 61 and below the fixed cover 70. The liquid reservoir 63 has a water outlet 64 at its bottom. The water outlet 64 is coupled to a suction source (not shown) such that the liquid recovered by the liquid reservoir 63 is passed along with the ambient gas. The substrate cleaning device in this example is operable to perform a drying process on the substrate W in accordance with the same processing procedure as the first embodiment. In detail, the motor 2 is supplied with energy to rotate the substrate W. Then, the front nozzle 4 and the rear nozzle 17 respectively supply pure water to the front surface and the rear surface of the substrate W to wash the entirety of the substrate W with pure water. Pure water is removed from the rotating substrate W, and the purified pure water is fixed by The cover 70 is captured and returned by the liquid reservoir 63 19 320660 200922701 - a nozzle 20, 21 is positioned away from the base. When the substrate w is thus flushed, the given position of the plate w is set. Then, the supply is stopped. Pure water, and The front nozzle 4 is moved to a given standby position away from the substrate w. The two nozzles 2G, 21 are moved to the substrate W above the substrate to rotate at a low speed range of 15 G to _ 7 minutes: steaming; Supply pure water to the surface of the surface. Two nozzles 2〇 and f nozzles 17 supply pure water to the substrate W, thereby drying the substrate W before the I guide skin simultaneously moves in the radial direction of the substrate boundary, the surface of the 々 j j (upper surface) After the device, the nozzles of the two nozzles are supplied with pure water. (4), 21 is moved to its standby position, and the rotation from the high-speed range of the clock is stopped, and the operation of the substrate after 1 and 1 is performed at 1000 to 150 rpm. The gas nozzle = the surface of the substrate W after the pure water is removed. In this manner, the surface of the red substrate w is dried. In this case, the liquid absorber 53 can absorb the impact of the liquid ★ 疋 and wind 3 . The image of the younger brother 18 is the schematic vertical section of the Zhaoshishi; the other is the substrate cleaning device shown in Fig. 18 which will not be described in the substrate cleaning device of the reference example. The details of the operation are as shown in Fig. 17. ',, structure and operation details are the same, and will not be repeated as shown in Fig. 18, the w cover 65, the shield core cleaning device comprises a hollow cylindrical shielding cover 65 having the shape of the upper Shanghai Around the table 61 and the support shaft 62. The screen is located at substantially the same height as the table 61; 320660 20 200922701 and the lower end are fixed to the liquid reservoir 63. In this case, the above liquid absorber 53 is not provided. Since the table 61 and the support shaft 62 are covered by the shield cover 65, the rotational flow of the ambient gas can be prevented from being formed when the table 61 and the support shaft 62 rotate. The result 'also prevents the mist of the liquid from reattaching to the surface of the substrate W, otherwise the mist will be carried by the rotational flow of such ambient gas. The rotating cover 3 according to the first embodiment can be attached to the figures shown in Figures 17 and 18. The substrate cleaning device. 19 and 20 are schematic vertical sectional views of a substrate cleaning apparatus according to still another reference example of the present invention. The structural and operational details of the substrate cleaning apparatus shown in Figures 19 and 20, which will not be described hereinafter, are the same as those of the substrate cleaning apparatus shown in Fig. 17, but will not Repeat the explanation. In this example, the fixed cover 70 is vertically movable. As described above, when the surface of the substrate W is dried and when the surface of the substrate W is dried, the substrate W is rotated at different speeds. Therefore, it is preferable to change the position of the fixing cover 70 depending on which side of the substrate W is to be dried. In detail, when the front surface of the substrate W is dried, the fixing cover 70 is in the normal position as shown in Fig. 19. As described above, the substrate W is rotated at a low speed when the front surface of the substrate W is dried. Therefore, the water droplets removed from the rotating substrate W are free to fall and then collide with the inner peripheral surface of the fixed cover 70. Since the distance between the fixing cover 70 and the periphery of the substrate W is large, water droplets that collide with the inner circumferential surface of the fixing cover 70 hardly bounce back to the substrate W. When the surface behind the substrate W is dried, the substrate W is rotated at a high speed. Since 21 320660 200922701, the water droplets removed from the rotating substrate w travel substantially in a straight line and collide with the inner peripheral surface of the fixed cover 70 at a high speed as shown in Fig. 20. Further, when the jaw 10 and the table 61 are rotated at a high speed, the gas surrounding the substrate W is disturbed to form a swirling air current. This swirling airflow is undesirable because the swirling airflow may carry water droplets and mist to the surface of the substrate W. According to this example, the surface of the substrate W is dried while the fixing cover 70 is at a lower position. In detail, the fixing cover 70 is lowered to a position where the upper end of the fixing cover 70 is substantially the same height as the substrate W. In this position, the distance between the periphery of the substrate W and the fixed cover 70 is small. Therefore, water droplets and mist are prevented from flowing from the rear surface of the substrate W to the front surface. Figure 21 is a schematic vertical sectional view showing a substrate cleaning apparatus in accordance with a sixth embodiment of the present invention. The parts of the substrate cleaning apparatus according to the sixth embodiment which are the same as those of the substrate cleaning apparatus according to the first embodiment are denoted by the same reference numerals and will not be described in detail below. The operation details of the substrate cleaning apparatus according to the sixth embodiment are the same as those of the substrate cleaning apparatus according to the first embodiment, and will not be described below. As shown in Fig. 21, the inner rotary cover 75 is provided on the radially inner side of the rotary cover 3. This inner rotary cover 75 is fixed to the second stage 11B of the table 11. The rotary cover (first rotary cover) 3 and the inner rotary cover (second rotary cover) 75 are coupled to each other by a plurality of support arms 80. Therefore, the inner rotary cover 75 and the rotary cover 3 are rotatably coupled together. A gap is formed between the inner rotary cover 75 and the rotary cover 3. Fig. 22A is an enlarged vertical sectional view of the inner rotary cover 75 and the rotary cover 3, and Fig. 22B is a plan view of the inner rotary cover 75 and the jaws 10. Inner 22 320660 200922701 = The running cover 75 has a peripheral surface with a smooth arched vertical section. The angle of the outer peripheral surface of the inner turntable 75 with respect to the horizontal plane gradually increases from the minimum value of the upper end of the (four) p to the maximum value of the lower end. In detail, 槪 = the angle of the outer peripheral surface of the turn cover 75 with respect to the horizontal plane is (4) upper =, ', the spoon is 0 degrees, and the lower end is about 9 degrees. , ^ The upper end of the inner rotating cover 75 is located below the substrate w by the jaws μ. In other words, the outer peripheral surface of the inner rotating cover 75 is positioned below the upper surface of the substrate W, while the inner rotating cover 75 2 = the upper end of the peripheral surface is positioned above the lower surface of the substrate w: internal two shy 75 The upper end is located near the periphery of the substrate W. The direct control of the inner rotary cover 75疋 is slightly larger than the diameter of the substrate W. The surface of the inner rotary cover 75 preferably also has a smooth arched profile like its outer peripheral surface. The upper end of the inner rotary cover 75 has a plurality of recesses as shown in the figure. The recess 75a has a shape corresponding to the shape of the jaws 1'. The outer peripheral surface of the inner rotary cover 75 includes the slave substrate? The smooth parabola of the week. Therefore, when the substrate W is rotated, it is smoothly guided along the inner two == downward direction under the surface tension of the liquid. Therefore, the flowing liquid is water droplets or mist. Because the inner rotating cover 75 曰 & substrate W of the # ^ surface upper end light and the inner (four), is lower, so the liquid is trapped inside the substrate. In the gap between the turns cover 75. If the upper end of the inner surface of the inner surface ti 疋锝盍 75 is higher than the upper end of the substrate two substrates, the liquid flow from the substrate W/the inner rotating cover 75 is broken and converted into + #. Therefore, the inner (four) m LL water droplets or Fog. The outer peripheral surface of the 盍75 is located below the substrate 320660 23 200922701 - the inner peripheral surface of the micro-rotary cover 3 is substantially the same shape as the inner surface. In detail, the outer peripheral surface of the spin 5 has a vertical cross section. The inner peripheral surface of the rotary cover has the same height as the flat upper surface, or preferably is located below the substrate. The surface of the slightly rotating inner cover of the cover 3 | ^ . 砰 吕之, rotating cover 3 is called the rising shoulder sliding arch vertical section. The inner surface of the rotary cover 3 ^ has an angular value of the degree of the gradient from the minimum of the upper end of the rotary cover 3. More specifically, the innermost surface of the rotary cover 3 is at most 0 degrees from the upper end to the lower end, and is at the lower end: the angle of the surface, but the upper end of the rotary cover 3 also has a shape. Although there are a plurality of recesses in the shape of the unfinished figure. Therefore, the inner rotating cover 7 is not fixed to the inner peripheral surface of the inner rotation 3. In detail, the support arm 8 〇 = surface and the outer peripheral surface of the rotary cover and the rotary cover 3: the inner rotary cover 75 is fixed to the support arm 8 〇 = _ of the inner rotary cover. Figure 2u, and the first coffee chart is the illustration of the plane when the arm is viewed from above. Branch (4) SO has the opening of the leaf month ^ will = brother and does not show the rotating cover 3. When each cover 3 rotates, the branch arm will generate a downward flow in the gap between the cover 75 and the rotation, and the inner rotating cover 75 and _ between the rotary cover 75 and the rotary cover 3 can be liquid to the upper surface of the substrate. 3 rotates together with the substrate. Supply W Move to the inner swivel cover? 5 hearts such as 'pure water' flow down from the substrate by centrifugal force. During the condensing, the work is performed such that the outer peripheral surface of the rotary cover 75 forms a downward gas flow in the gap between the rotary cover 75 and the fulcrum arm 80 of the yoke. Therefore, the liquid 320660 24 200922701 - the mist and the water droplets are forcibly moved downward by the downward gas flow, and are prevented from coming on the surface of the substrate W. The gap between the inner rotary cover 75 and the square turn 3 can be appropriately adjusted so that the liquid can smoothly flow downward and prevent the mist from entering the space above the substrate w. (4) The surface of the rotary cover 75 and the rotary cover 3 is preferably a hydrophilic surface, and the release water droplets do not easily rotate when attached to the inner rotary cover 75 and the rotary cover 3. The father is ideally, the outer peripheral surface of the inner rotary cover 75 and/or The inner peripheral surface of the r portion has a spiral groove for guiding toward the inside. The liquid on the yoke 75 and on the rotating cover 3 is turned. The crucible (four) cover 75, the rotary cover 3, and the substrate w are located in the cleaning chamber. SC: The bottom has a gas outlet... and a liquid outlet training. Supply and release, a system of pure water such as pure water is discharged through the liquid outlet 51b by the branch arm 8 of the outlet outlet L, and the gas system of the downward flow is discharged through the gas a to be secreted to the gas. σ 51a causes the milk to break _ discharged from the cleaning chamber 51. ^置之二二: The substrate cleaning cover 85 of the sixth embodiment is shown. As shown in Figure 24: Middle. In this modification, the fixing cover 3 is attached. The fixed cover δ5 is disposed such that the fixed cover 85 is non-rotatable around the π mountain below the rotary end, and has the entire outer circumference of the rotating cover 3 =. Thus, the cover 85 is formed so as to cover the outer peripheral surface between the surfaces of the rotary cover 3 and the upper end of the inner circumference 85 of the fixed cover 85 and is not shown in the figure, but the shape of the shape of the fixed cover = ? The 85 recesses each have a diameter corresponding to the upper end of each of the clips --85, which is substantially the same as or slightly larger than the diameter of the upper end of the rotary cover 3 320660 25 200922701. The reason why the fixing cover 85 is provided is the same as the reason why the above-described fixing cover 45 is provided. Next, an example of a polishing apparatus having a substrate cleaning apparatus according to the above embodiment of the present invention will now be described. Fig. 25 is a plan view showing a polishing apparatus having a substrate cleaning apparatus according to any one of the first to sixth embodiments of the present invention. Fig. 26 is a schematic perspective view of the polishing apparatus shown in Fig. 25. As shown in Fig. 25, the polishing apparatus has a rectangular outer casing 100. The inner space of the outer casing 100 is partitioned into a loading and unloading portion 102, a polishing portion 130 (130a, 130b), and a cleaning portion 140 by partition walls 101a, 101b, 101c'. The loading and unloading section 102 has two or more front loading units 120 (three in Fig. 25) on which the cassettes each storing a plurality of substrates are placed. The front loading unit 120 is configured to abut each other along the width direction of the polishing apparatus (perpendicular to the longitudinal direction of the polishing apparatus). Each of the front loading units 120 can receive an open cassette, i: Standard Manufacturing Interface Pod (SMIF pod), or Front Opening Unif ied (FOUP pod) thereon. SMIF and FOUP are tightly sealed containers that house a wafer cassette and are covered with a dividing wall to provide an internal environment that is isolated from the outside space. Further, the loading and unloading portion 102 has a moving mechanism ι21 which extends in the direction in which the uranium planting unit 120 is disposed. The first transfer robot I" is disposed on the moving mechanism 121 and is movable along the configuration direction of the front loading unit 12. The first transfer robot 122 is operable to move in the mobile mechanism 121 320660 26 200922701 The wafer cassette is mounted on the front loading unit 120. The first transfer robot 122 has two hands that are vertically disposed and can be used independently. For example, 'the upper hand can be used to send the polished substrate back to the wafer. The lower hand can be used to transfer the unpolished substrate. The loading and unloading unit 102 is required to be the cleanest area. Therefore, the internal pressure of the loading and unloading unit 102 is maintained at any time outside the device. The pressure of the space, the polishing portion 130 and the cleaning portion 140 is high. Further, the filter fan unit having a clean air filter (such as a HEPA filter or a ULPA filter) (not shown) It is disposed above the moving mechanism 121 of the first transfer robot 12 2. The filter fan unit removes particles, toxic vapors, and toxic gases from the air to generate clean air, and constantly forms a downward flow. clear The polishing portion 130 is a region for polishing the substrate. The polishing portion 130 includes a first polishing portion 130a and a second polishing portion 130b, and has a first polishing unit 131A and a second polishing unit 131B in the first polishing portion i30a, In the second (two glazing portion 130b), there are a third polishing unit 131C and a fourth polishing unit 131D. As shown in Fig. 25, the first light-removing unit 131A, the second light-removing unit 131B, and the third polishing unit 131C And the fourth polishing unit 131D is disposed along the longitudinal direction of the polishing apparatus. The first light unit 131A includes: a polishing table 132A for holding the polishing pad; and a top ring 133A configured to hold the substrate and press the substrate against the substrate Polishing the polishing surface of the polishing pad on the stage 132A to polish the substrate; the polishing liquid supply nozzle 134A' is used to supply a polishing liquid (for example, a slurry) or a conditioning liquid (for example, pure water) to the polishing surface of the polishing pad; Dresser 27 320660 200922701 135A for trimming a polishing pad; and a sprayer (at〇mizer) 136A having a squirting/liquid for atomizing (eg, pure water) and a gas (eg, nitrogen) The mixture is sprayed onto the polishing surface. Similarly, the second polishing unit 131B includes a polishing table 132β, a top ring 133B, a polishing liquid supply nozzle 134B, a trimmer 135β, and a sprayer ΐ 36β. The third polishing unit 131C includes a polishing table 132c. The top ring 133C, the drag liquid supply nozzle 134C, the trimmer 135C, and the sprayer 136C. The fourth polishing unit 131D includes a polishing table 132D, a top ring_, a polishing liquid supply nozzle 134D, a trimmer 135D, and a sprayer 136D. The first linear transport 15 is disposed in the first light-removing portion 13A. The first linear handling H 15G system is configured to transfer the substrate between four transfer positions located along the longitudinal direction of the device (hereinafter, the four transfer positions are sequentially called from loading and unloading _ 1G2) It is the first transfer position TP2, the second 哉仏 哉仏 — - placement ΤΡ 3, and the fourth transfer position Τ ρ4). use

1 Above the reversing machine of the substrate transferred by the robot 122: vertical: a linearly movable lifter 152 above the first transfer position TP1 of the linear carrier 150 is disposed below the first set τρ1 . The vertically movable pusher 153 is moved below the TP2, and the pusher 154 that is vertically movable below the traverse position TP3 is disposed vertically at the third transfer four transfer position TP4. The pusher 155 is disposed in the second = second light holding portion 13Gb, and the second linear first linear transporter 150m is placed in a tight a position along the polishing device (10). The transfer substrate between the two transfer positions is 320660 28 200922701 (hereinafter, the three transfer positions are sequentially referred to as the fifth transfer position TP5 and the sixth transfer position TP6 from the loading and unloading portion 102, And the seventh transfer position TP7). The vertically movable lifter 166 is disposed below the fifth transfer position TP5, the vertically movable pusher 167 is disposed below the sixth transfer position TP6, and the vertically movable pusher 168 is disposed in the The seventh transfer position is below the TP7. As shown in Fig. 26, the first linear carrier 150 has four transfer stages: a first stage, a second stage, a third stage, and a fourth stage. These transfer stations have a two-wire structure with upper and lower lines. In detail, the first transfer workbench, the second transfer workbench, and the third transfer workbench are disposed on the lower line, and the fourth transfer work stage is disposed on the upper line. The transfer table below and the transfer table above can move freely without interfering with each other because they are located at different heights. The first transfer station transfers the substrate between the first transfer position TP1· and the second transfer position (i.e., substrate receiving/transfer position) TP2. The second transfer stage transfers the substrate between the second transfer position TP2 and the third transfer position (i.e., substrate receiving/transfer position) TP3. The third transfer stage transfers the substrate between the third transfer position TP3 and the fourth transfer position TP4. The fourth transfer stage transfers the substrate between the first transfer position TP1 and the fourth transfer position TP4. The second linear carrier 160 has substantially the same structure as the first linear carrier 150. In detail, the fifth transfer station and the sixth transfer station are disposed on the upper line, and the seventh transfer stage is disposed on the lower line. The fifth transfer stage transfers the substrate between the fifth transfer position TP5 and the sixth transfer position (i.e., the substrate receiving/transfer position) TP6. The sixth transfer stage transfers the substrate between 29 320660 200922701 /, and the load position TP6 and the seventh transfer position (i.e., substrate receiving/transfer position) TP7. The seventh transfer stage transfers the substrate between the fifth transfer position TP5 and the seventh transfer position TP TP7. For example, if the slurry is used during polishing, it can be known that the polishing is 130. Therefore, it is possible to prevent the particles from being scattered outside the polishing crucible 13 to discharge the gas from the circumferential space of the individual polishing table. Further, the pressure inside the light is set to be lower than the pressure outside the apparatus, the cleaning unit 140, and the loading and unloading unit 102, thereby preventing the gas flow of the particles. In general, the discharge pipes (not shown in the drawings) are respectively disposed below the polishing σ, and the filter (not shown) is disposed above the polishing table to form a filter from the filter to the discharge pipe. Clean air flowing under. The #β wash unit 140 is an area for cleaning the polished substrate. The cleaning unit 140 includes a first-transfer robot 124, a reversing machine 14 for reversing the substrate received from the second transfer robot 124, and four cleaning units 142 for cleaning the polished substrate. Up to 145, and a transfer unit 146 for transferring the substrate between the reversing machine 1C and the cleaning units 142 to 145. The second transfer robot 124, the reversing machine 141, and the cleaning units 142 to 145 are sequentially disposed along the longitudinal direction of the polishing apparatus. A filter fan unit (not shown) having a clean air filter is disposed above the cleaning units 142 to 145. This filter and cleaner fan unit group constitutes the removal of particulates from the air to produce clean air' and constantly forms a clean air flowing downward. The pressure in the cleaning unit 14 is maintained at a higher pressure than the polishing portion 13〇, and the particles of the drag unit 130 are prevented from flowing into the cleaning unit mo. The private unit 146 has a plurality of arms configured to hold the base 320660 30 200922701 board' such that a plurality of substrates can be mutually coupled between the reversing machine 141 and the > month washing units 142 to 145 by the arms Moved horizontally together. The cleaning unit 142 and the cleaning unit 143 may include, for example, a roll type cleaning unit having upper and lower roll-shaped sponges that rotate and press against the front surface and the rear surface of the substrate, thereby Clean the front and back surfaces of the substrate. The cleaning unit 144 may include, for example, a pen-type cleaning unit having a hemispherical sponge that rotates and presses against the substrate to clean the substrate. The cleaning unit 145 includes the substrate cleaning apparatus described above in accordance with any one of the embodiments. In the cleaning units 142 to 144, in addition to the above-described pattern cleaning unit or pen type cleaning unit, an ultra-high-sonic cleaning unit for applying ultrasonic waves to the cleaning liquid to clean the substrate may be additionally provided. . . The shutter (s h u 11 e r) 11G is installed between the reversing machine i 5} and the first shifting robot 122. When the substrate is transferred, the shutter ii is opened, and the substrate is transferred between the first transfer robot 122 and the reversing robot ΐ5. The buckers η, m, 113, and 114 are also respectively disposed between the reversing machine i4i (four): between the transfer robots 124 and the reversing machine 141, the polishing unit 13Ga, and the second transfer robot m And the second (four) 4130b and the second transfer robot 12 some of the shutters, 112, 113, and 114: open the "tear ^ ^ ^ ^ display" installation of the sewing station. The polishing table 132 is below the center Motor (not shown), and can be its own car display 'top ring 13 _, the raft is coupled to the motor and lift cylinder (not shown) c 320660 31 200922701 so the top ring 133A can move vertically and with the top ring The shaft 137A is rotated centrally. The substrate to be polished is attracted and held by the vacuum suction or the like on the lower surface of the top ring 133A. The upper surface of the polishing pad constitutes a polishing surface for sliding contact with the substrate w. The substrate on the lower surface of the top ring 133A is rotated and polished by the top 133A on the polishing table 132A in rotation. The polishing liquid is supplied from the polishing liquid supply nozzle 134A to the polishing surface of the polishing crucible (upper surface) In the case where there is a polishing liquid on the substrate w and the throwing surface (5) Polishing the substrate. The polishing table 132A and the top ring 133A constitute a mechanism for providing relative motion between the substrate w and the polishing surface. The second polishing material ΐ3ΐβ, the first polishing unit 131C, and the fourth polishing unit mD have the first The polishing unit 131A has the same structure, and thus its detailed description is omitted. When the light-removing parallel processing is performed in the sequence of the field row, the substrate is transferred by the crystal of the download unit 12G! ^Box^ route 1 ~ Lifting the piano 1R9 Feng private桟 122 122 122 122 122 线性 线性 线性 线性 线性 线性 线性 线性 线性 线性 线性 线性 153 153 153 153 153 153 153 153 153 153 Α Α Α Α 抛光 抛光 抛光 抛光 抛光 抛光 抛光 抛光 抛光 抛光 抛光 抛光 抛光 抛光 抛光 抛光 抛光 抛光 抛光 抛光 抛光 抛光1 1 133B—Polishing ancillary seven-push dynamic 154~top: (iv): 2 “pusher 15” first-linear carrier 150 sets, liter... second transfer robot core two linear carrier 16. fifth shift Load table ~ push top % 133C - polishing table 13 heart pusher (8) - second line 320660 32 200922701 sixth transfer table of carrier 160 - pusher 168 - top ring 133D - polishing table 132D - pusher 168 - The seventh transfer table of the second linear carrier 160 - the lift 1 66 - second transfer robot 124 - reversing machine 141 - transfer unit 146 - cleaning unit 142 - transfer unit 146 - > cleaning unit 143 - ^ transfer unit 146 - cleaning unit 144 - transfer sheep 146 - The cleaning unit 145 - the first transfer robot 122 - the wafer cassette of the front loading unit 120. When the parallel type is executed, the substrate is transferred in the following route: the wafer cassette of the front loading unit 120 - the first transfer Robot 122 - reversing machine 151 - lift 152 - first transfer station of first linear carrier 150 - pusher 153 - top ring 133A - polishing table 132A - > pusher 153 - first linear The second transfer table of the carrier 150 - the pusher 154 - the top ring 133B - the polishing table 132B - the pusher 154 - the third transfer station of the first linear carrier 150 - the lifter 155 - the second shift Loading robot 124 - reversing machine 141 - transfer unit 146 - cleaning unit 142 - transfer unit 146 - cleaning unit 143 - transfer unit 146 - cleaning unit 144 - transfer unit 146 - cleaning unit 145 - first transfer robot 122—The wafer cassette of the front loading unit 120. The other substrate is transferred in the following manner: the wafer cassette of the front loading unit 120 - the first transfer robot 122 - the reversing machine 151 - the lift 152 - the fourth transfer operation of the first linear carrier 150 Stage - lift 155 - second transfer robot 124 - lift 166 - fifth transfer station of second linear carrier 160 - pusher 16 7 - top ring 13 3C - polishing table 13 2C - push 167 - sixth transfer station of second linear carrier 160 - push 33 320660 200922701 actuator 168 - top ring 133D - polishing table 132D - pusher 168 - seventh transfer table of second linear carrier 160 - Lifter 166 - Second Transfer Robot 124 - > Reversing Machine 141 - Transfer Unit 146 - Cleaning Unit 142 - Transfer Unit 146 - Cleaning Unit 143 - Transfer Unit 146 - Cleaning Unit 144 - Transfer Unit 146 - Cleaning Unit 145 - First Transfer Robot 122 - Wafer cassette of front loading unit 120. Another polishing apparatus provided with the substrate cleaning apparatus according to any of the first to sixth embodiments will be described below. Figure 27 is a plan view showing another polishing apparatus having a substrate cleaning apparatus according to any of the first to sixth embodiments of the present invention. As shown in Fig. 27, the polishing apparatus includes a loading and unloading portion 201 for accommodating a plurality of wafer cassettes 204 in which a plurality of substrates are stored. A transfer robot 202 having two hands is mounted on the moving mechanism 200 for accessing the wafer cassette 204 in the loading and unloading portion 201. The moving mechanism 200 uses a linear motor mechanism that allows the transfer robot 202 to stably carry large diameter and heavy substrates at high speed. The polishing apparatus also includes two cleaning units 212 disposed on opposite sides of the wafer cassette 204 relative to the moving mechanism 200 of the transfer robot 202. Each cleaning unit 212 is a substrate cleaning apparatus according to any one of the first to sixth embodiments of the present invention. The cleaning unit 212 is disposed at an individual position that can be reached by the hand of the transfer robot 202. A wafer station 206 having four substrate placement stages is disposed between the two cleaning units 212. This wafer station 206 is located at a position that can be reached by the hand of the transfer robot 202. The two transfer robots 208 are configured to be able to reach individual positions of the respective cleaning sheets 34 320660 200922701 and 212 and the wafer station 206. The two cleaning units 21* are respectively disposed adjacent to the cleaning unit 212. These cleaning units 214 are located at positions where the hand of the transfer robot 208 can reach the cleaning unit 214, respectively. The rotary carrier 210 is disposed at a position that can be reached by the hand of the transfer robot Mg. A polishing unit 250 is disposed at a position where the polishing unit mo can transfer the substrate to the rotary carrier 210 and transfer the substrate from the rotary carrier 2 . A single transfer robot 208 can be provided to replace the two transfer robots 208.

(The polishing device has an in-line thickness monitor (In-line ThiekneSS

Monitor; ITM) 224 is used as a measuring unit for measuring the surface shape (e.g., film thickness) of the substrate which has been washed and dried. This ITM 224 can be configured to perform measurements after or after polishing the substrate. As shown in Figure 27, the ITM 224 is positioned at the extension of the mobile mechanism 200, or in other words, at the end of the mobile device 200. After the transfer robot 202 transfers the polished substrate back to one of the wafer cassettes 204, or after the transfer robot 2 〇 2 / one of the wafer cassettes 204 moves out of the substrate to be polished, the itm 224 is based on The optical state of the copper film or the barrier film on the surface of the substrate (eg, 'semiconductor wafer) is measured using an optical signal applied to the substrate by the optical mechanism and reflected on the substrate. Each polishing unit 250 includes a polishing table 230, a top ring 231, a polishing liquid supply nozzle 232 for supplying polishing liquid to a polishing pad (not shown) on the polishing table 230, a dresser 218 for conditioning the polishing pad, and a storage water The sink 222 of the dresser 218 is washed. The operation of the polishing apparatus shown in Fig. 27 will be explained below. 320660 35 200922701 A wafer cassette 204 storing a plurality of substrates each having a conductive film (such as a steel film) formed on the surface thereof is placed in the loading and unloading portion 2〇1. The transfer robot 202 removes the substrate from one of the wafer cassettes 204 and places the removed substrate at the wafer station 206. One of the transfer robots 208 receives the substrate from the wafer station 206, reverses it upside down if necessary, and transfers the substrate to the rotary carrier 210. The rotary carrier 21 is rotated in a horizontal plane, and the substrate on the rotary carrier 210 is held by the top ring 231 of the polishing unit 250. 1 The substrate held by the top ring 231 is moved to a polishing position above the polishing table 23A. While the top ring 231 and the polishing table 230 are being rotated, the substrate is lowered and pressed against the polishing surface of the polishing pad. When the polishing liquid is supplied from the polishing liquid supply nozzle 232 to the polishing surface, the substrate is polished. The polished substrate is transferred to the transfer robot 208 via the rotary carrier 21, and if necessary, the transfer robot 2〇8 reverses the substrate upside down and transfers the substrate to one of the cleaning units 214. In the polishing process in which the polishing process has been performed, the polishing surface of the polishing pad is trimmed by the trimmer 218 so as to be ready for polishing the next substrate. The / month wash unit 214 removes and rinses the surface of the substrate, and then dries. The substrate is then transferred by the transfer robot 2〇8 and placed at the wafer station 206. The transfer robot 202 removes the dried substrate from the wafer station 2〇6 and the substrate The substrate is transferred to one of the cleaning units 212, and the substrate is cleaned and dried by the cleaning sheet π 212. The cleaned and dried substrate is returned by the transfer robot 202 to the original wafer cassette 2〇4. The polishing unit 25〇, the cleaning unit 320660 36 200922701 212, and the cleaning unit 214, so that the polishing apparatus can simultaneously perform a series of processes on the two substrates, including polishing, cleaning, and drying. The single substrate can be polished by two polishing units 250. Polishing. While certain preferred embodiments of the present invention have been shown and described, it should be understood that the scope of the claims, the description, and the drawings Various changes and modifications can be made within the scope of the technical concept. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic vertical sectional view of a substrate cleaning apparatus according to a first embodiment of the present invention; FIG. 2 is a first diagram FIG. 3 is a schematic vertical cross-sectional view of the substrate cleaning apparatus shown in FIG. 1 when the substrate is raised; FIG. 4 is a substrate cleaning shown in FIG. A plan view of the substrate holding mechanism of the device; FIG. 5 is a view showing a path through which the liquid flows through the substrate cleaning device shown in FIG. 1; FIG. 6 is a view showing that the gas flows through the substrate shown in FIG. FIG. 7 is an enlarged vertical sectional view showing a modification of the inner circumferential surface of the rotary cover of the substrate cleaning apparatus according to the first embodiment; FIG. 8 is a substrate according to the first embodiment. FIG. 9 is a schematic vertical cross-sectional view of the substrate cleaning apparatus according to the second embodiment of the present invention; FIG. 9 is a schematic vertical sectional view of the substrate cleaning apparatus according to the second embodiment of the present invention; 37 320660 200922701 The substrate cleaning device shown in Figure 9 FIG. 11 is a schematic enlarged cross-sectional view showing a modification of the rotating cover of the substrate cleaning device according to the second embodiment; FIG. 12 is a third sectional view showing a modification of the rotary cover of the substrate cleaning device according to the second embodiment; A schematic vertical cross-sectional view of the substrate cleaning apparatus of the embodiment; FIG. 13 is a view showing a path of the gas flowing through the substrate cleaning apparatus shown in FIG. 12; and FIG. 14 is a substrate washing according to the third embodiment. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 15 is a schematic vertical sectional view of a substrate cleaning apparatus according to a fourth embodiment of the present invention; and FIG. 16 is a substrate cleaning apparatus according to a fifth embodiment of the present invention. Figure 17 is a schematic vertical sectional view of a substrate cleaning apparatus according to a reference example of the present invention; and Figure 18 is a schematic vertical sectional view of a substrate cleaning apparatus according to another reference example of the present invention; Figure 19 is a schematic vertical sectional view of a substrate cleaning apparatus according to still another reference example of the present invention; and Figure 20 is a schematic vertical sectional view of a substrate cleaning apparatus according to still another reference example of the present invention; An unintentional vertical sectional view of a substrate cleaning apparatus according to a sixth embodiment of the present invention; 38 320660 200922701 Fig. 22A is an enlarged vertical sectional view of the inner rotary cover and the outer rotary cover; and Fig. 22B is an inner rotary cover and a jaw Fig. 23A is a plan view of the support arm fixed to the inner rotary cover when viewed from above; Fig. 23B is a view of the support arm shown in Fig. 23A when viewed from the radially outer side; Fig. 24 is a view A schematic vertical sectional view showing a modification of an additional fixing cover according to a substrate cleaning apparatus according to a sixth embodiment of the present invention; and FIG. 25 is a view showing any one of the first to sixth embodiments according to the present invention. A plan view of a polishing apparatus for a substrate cleaning apparatus; 26 is a schematic perspective view of the polishing apparatus shown in Fig. 25; and Fig. 27 is a substrate having any one of the first to sixth embodiments according to the present invention. A plan view of another polishing apparatus of the cleaning apparatus. Fig. 28 is a schematic perspective view of a conventional substrate cleaning apparatus, and Fig. 29 is a plan view of the substrate cleaning apparatus shown in Fig. 28. [Main component symbol description] Substrate holding mechanism 2 Motor rotating cover 3a Recessed front nozzle 10 Clamping table 11A First working table through hole 11B Second working table First branch 'Axis 12B Younger one axis-selective motion guidance Mechanism 17 Rear nozzle 1 3 4 11 11a 12A 15 320660 39 200922701 18 Gas nozzle 20, 21 Nozzle 23 Brake 24 Momming mechanism 25 Discharge hole 26 Auxiliary discharge hole 28 Skirt 30 Liquid outlet passage 31 Gas outlet passage 32 Suction source 35 Fixed Plate 40 push rod 42 auxiliary rotary cover 44 discharge hole 45 fixed cover 46, 47 discharge port 50 fin 51 cleaning chamber 51a gas outlet 51b liquid outlet 53 liquid absorber 60 substrate holding mechanism 61 table 62 Slot 64 water outlet 65, shield cover 70 fixed cover 75 inner rotary cover 75a recess 80 support arm 85 fixed cover 100 outer casing 101a, 101b, 101c partition wall 102 loading and unloading portions 110, 111 > 112 '113' 114 shutter 120 Front loading unit 121 moving mechanism 122 first transfer robot 124 second transfer robot 130 polishing portion 130a A light transfer portion 131A First light transfer unit 130b Second polishing portion 131B Second light holding unit 131C Third polishing unit 40 320660 200922701 131D Fourth polishing unit 132A, 132B, 132C, 132D Polishing table 133A, 133B, 133C, 133D Top ring 134A, 134B, 134C, 134D polishing liquid supply nozzles 135A, 135B, 135C, 135D dresser 136A, 136B, 136C, 136D sprayer 137A, 137B, 137C, 137D top ring shaft 140 cleaning portion 14 151 reverse Machines 142 to 145 cleaning unit 146 transfer early 150 first linear carrier 152, 166 lift 153, 154, 155, 167, 168 pusher 160 second linear carrier 200 moving mechanism 201 loading and unloading portion 202 Transfer robot 204 wafer cassette 206 wafer station 208 transfer robot 210 rotary carrier 212 cleaning unit 214 cleaning unit 218 dresser 222 water tank 224 line thickness monitor (ITM) 230 polishing table 231 top ring 232 polishing liquid supply nozzle 250 Polishing unit TP1 First transfer position TP2 Second transfer position TP3 Second transfer position TP4 Fourth transfer position TP5 Fifth transfer position TP6 Sixth transfer Position TP7 seventh transfer position W substrate 320660 41

Claims (1)

200922701 VII 1. Patent application scope: - a substrate cleaning device, comprising: a substrate holding mechanism, a 纟 rotation mechanism, a substrate holding substrate; a substrate rotation; a liquid supply nozzle held by the substrate holding mechanism, a rotating cover , setting the money & cleaning solution to the recording board; and rotating around the same speed ' and can form a shape around the substrate with the substrate inner circumference of the substrate. ^ < The lower end to the upper end are inclined radially inward. The solid-mould substrate cleaning device includes: ^, is formed into a shape covering the entire periphery of the rotating cover. 3. The substrate cleaning device of the first working voice of the patented scope, the complex includes: a relative spear mechanism, * and only cover 4 i 佴And, and constituting a relative movement of the rotating shaft of the substrate provided between the substrate and the rotating cover. The substrate cleaning device of the first aspect of the invention, wherein: the rotating cover is mounted on the substrate holding mechanism; the substrate holding mechanism has a discharge hole, and the discharge hole has a lower end of the rotary cover Opening; and 5 the discharge hole is inclined downward toward the outside. The substrate cleaning device of claim 1, wherein the inner peripheral surface of the rotation has a vertical section including an arc, and the inner circumference of the surface of the surface of the 320660 42 200922701 relative to the horizontal plane is from the inner circumferential surface The minimum value of the upper end gradually increases to the maximum value of the lower end. 6. The substrate cleaning apparatus of claim 1, further comprising: a liquid absorber disposed on the inner circumferential surface of the rotary cover. 7. The substrate cleaning apparatus of claim 1, further comprising: an inner rotating cover disposed radially inward of the rotary cover, the inner rotary cover being rotatable together with the rotary cover. 8. The substrate cleaning apparatus of claim 7, wherein: the inner rotating cover has an outer peripheral surface having a curved vertical cross section, and the outer peripheral surface of the inner rotating cover has and is located The upper surface of the substrate held by the substrate holding mechanism is the same height or slightly lower. 9. The substrate cleaning device of claim 7, further comprising: a support arm configured to couple the inner rotary cover and the rotary cover to each other, the support arm being disposed on the inner rotary cover and the rotary cover And a gap formed between the inner rotating cover and the rotating cover to generate a downward airflow in the gap. 43 320660