TWI623359B - Substrate cleaning method and cleaning device - Google Patents

Abstract

A cleaning device includes a first chamber, a moving element, a roller group, a receiving element, and a nozzle element. The moving element is located in the first chamber. The roller assembly is accommodated in the first cavity, and the receiving element is located in the first cavity. The receiving element is used for receiving the substrate transferred by the moving element. The nozzle element is located in the first chamber, and the nozzle element is located under the receiving element. The nozzle element is used to spray liquid onto the lower surface of the substrate in the basket of the receiving element. In addition, a substrate cleaning method is also proposed.

Description

Substrate cleaning method and cleaning equipment

The invention relates to a manufacturing method and manufacturing equipment, and more particularly to a substrate cleaning method and washing equipment.

In the manufacturing process of the modern high-tech industry, the substrate is manufactured through multiple processes such as cleaning, etching, coating, development, and drying. Each of the manufacturing processes is provided with a conveying device, so that the conveying device can be used. The substrate is transported to the position of each manufacturing process, and related process processing is performed.

Before manufacturing the substrate, you need to clean the substrate first. In order to meet the needs of the process, you must prevent one side of the substrate (the process side used for the process) from being cleaned. Therefore, you can only clean the other side (the non-process side) of the substrate. However, in the existing mechanism, two opposite sides of the substrate are cleaned.

Therefore, how to achieve the single surface cleaning of the substrate is an important issue in the industry.

It is an object of the present invention to enable a single surface of a substrate to be cleaned.

An embodiment of the present invention provides a substrate cleaning method. The substrate cleaning method is suitable. For a cleaning device, the cleaning device includes a roller set, at least one nozzle element, at least one moving element, and a receiving element. The roller set conveys a substrate at a conveying position, and the conveying position is a movement of the roller set at the moving element. In a first position of the stroke, the moving position is the roller group leaving the moving stroke. The moving element moves the substrate between the first position, a second position, and a third position along the moving stroke, and the second position is higher than the first position. The third position is lower than the first position, the receiving element is disposed in the third position, and the receiving element has a basket portion. The substrate cleaning method includes the following steps. The substrate is moved from the first position to the second position along the moving stroke by the moving element. The roller group is moved from the conveying position to the removing position. The moving element moves the substrate along the moving stroke from the second position to the receiving element in the third position. The nozzle element sprays liquid on the lower surface of the substrate in the basket receiving part.

An embodiment of the present invention provides a cleaning device. The cleaning device includes a first chamber, a moving element, a roller set, a receiving element, and at least one nozzle element. The moving element is located in the first cavity, and the moving element moves the substrate between a first position, a second position, and a third position along a moving stroke, wherein the second position is higher than the first position and the third position is low In the first position. The roller group is accommodated in the first chamber. The roller group has a conveying position and a moving position. The conveying position is that the roller group is located at the first position of the moving stroke, and the moving position is that the roller group leaves the moving stroke. The receiving element is located in the first cavity, and the receiving element is disposed in the third position. The receiving element has a basket, and the receiving element is used for receiving the substrate transferred by the moving element. The nozzle element is located in the first chamber, and the nozzle element is located under the receiving element. The nozzle element is used to spray liquid onto the lower surface of the substrate in the basket of the receiving element.

Based on the above, in the substrate cleaning method and cleaning equipment of the present invention, the substrate is moved from the roller set to the receiving element by the moving element, so that the lower surface of the substrate is exposed to the receiving element. Empty parts of the pieces. With this configuration, the liquid sprayed by the nozzle element is sprayed to the lower surface of the substrate after passing through the empty part of the receiving element, so as to achieve the purpose of cleaning a single surface of the substrate.

50‧‧‧ substrate

52‧‧‧ Top surface

54‧‧‧ lower surface

100‧‧‧cleaning equipment

110‧‧‧First Chamber

120‧‧‧roller set

122‧‧‧ Transmission element

124‧‧‧roller

130‧‧‧ transfer components

132‧‧‧Connector

134‧‧‧slide

136‧‧‧Slide

140‧‧‧mobile components

142‧‧‧ Top pin

144‧‧‧Gear

146‧‧‧Gear

150‧‧‧Accepting components

152‧‧‧ Basket empty department

154‧‧‧bearing department

160‧‧‧ Nozzle element

162‧‧‧Nozzle

170‧‧‧Cleaning elements

172‧‧‧Nozzle

180‧‧‧ Cover

182‧‧‧moving parts

190‧‧‧Airflow element

192‧‧‧Nozzle

112‧‧‧Second Chamber

112A‧‧‧roller set

114‧‧‧ Third Chamber

114A‧‧‧roller set

G1‧‧‧Cleaning liquid

G2‧‧‧Liquid

G3‧‧‧Airflow

L1‧‧‧moving stroke

P1‧‧‧Conveying position

P2‧‧‧moved out

P3‧‧‧First position

P4‧‧‧Second position

P5‧‧‧Third position

S10‧‧‧Substrate cleaning method

S110 ~ S220‧‧‧step

FIG. 1 is a schematic diagram of a cleaning device of the present invention.

FIG. 2 is a flowchart of a substrate cleaning method according to the present invention.

FIG. 3 to FIG. 11 are schematic flowcharts of the cleaning device corresponding to FIG. 2 according to the present invention.

FIG. 12 is a flowchart of an embodiment of the substrate cleaning method of FIG. 2.

FIG. 13 is a flowchart of an embodiment of the substrate cleaning method of FIG. 2.

The specific embodiments of the present invention will be further described below with reference to the accompanying drawings and embodiments. The following embodiments are only used to more clearly illustrate the technical solution of the present invention, but cannot limit the protection scope of the present invention.

FIG. 1 is a schematic diagram of a cleaning device of the present invention. Referring to FIG. 1, the cleaning device 100 of this embodiment includes a first chamber 110, a roller set 120, a transfer element 130, a moving element 140, a receiving element 150, and at least one nozzle element 160 (FIG. 1 A nozzle element 160), a cleaning element 170, a cover 180, and at least one airflow element 190 are shown (FIG. 1 shows an airflow element 190).

The roller set 120 is accommodated in the first chamber 110. Specifically, the roller set 120 includes a transmission element 122 and a plurality of rollers 124. The plurality of rollers 124 are connected to the transmission element 122, and the transmission The element 122 is used to drive the roller 124 to rotate, and the roller 124 is rotated to achieve the purpose of transferring the substrate. In this embodiment, the transmission element 122 is, for example, a combination of a gear and a motor, but the present invention is not limited thereto.

The transfer element 130 is located in the first chamber 110, and the transfer element 130 is located on the outer side of the roller set 120. Specifically, the transfer element 130 includes a connecting piece 132, a slide base 134, and a slide rail 136. The connecting piece 132 is connected to the roller set 120, the connecting piece 132 is connected to the slide base 134, and the slide base 134 is slidably connected.于 滑杆 136. In this embodiment, the transfer element 130 is coupled to a power element (not shown). The power element is, for example, a cylinder, so that the slide 134 can be moved on the slide rail 136 by using the cylinder as power.

The moving element 140 is located in the first chamber 110, and the moving element 140 is located below the roller set 120. The moving element 140 has a moving stroke L1. Specifically, the moving element 140 includes a pin 142, a gear row 144, and a plurality of gears 146. The plurality of gears 146 is connected to the gear row 144, and the pin 142 is coupled to the plurality of gears 146. In this way, by The gear 146 and the gear row 144 interact with each other to drive the ejector pin 142 to move along the moving stroke L1.

The receiving element 150 is located in the first chamber 110, and the receiving element 150 is located below the roller set 120. In this embodiment, the receiving element 150 is, for example, a receiving groove body. The receiving element 150 has a basket 152, and the basket 152 is a hole. In this embodiment, a hole is formed in the bottom of the receiving element 150 to form the basket 152. A supporting portion 154 is provided on both sides of the top surface of the receiving element 150. The supporting portion 154 of the receiving element 150 is used to receive the substrate conveyed by the moving element 140.

The nozzle element 160 is located in the first chamber 110, and the nozzle element 160 is located below the receiving element 150, that is, the receiving element 150 is located between the roller group 120 and the nozzle element 160. The nozzle element 160 is provided with a nozzle 162 for spraying a liquid into the basket 152 of the receiving element 150 body. It should be noted that, in order to prevent the liquid sprayed by the nozzle element 160 from flowing into the moving element 140, the nozzle element 160 and the moving element 140 may be respectively disposed in different regions (not shown) in the first chamber to isolate the spray. The tube element 160 and the moving element 140 achieve the purpose of dry and wet separation. The cleaning element 170 is located in the first chamber 110, and the cleaning element 170 is located below the transfer element 130. The nozzle 172 of the cleaning element 170 is used to provide a cleaning liquid to clean the roller set 120.

The cover 180 is located in the first chamber 110, and the cover 180 is located above the roller group 120. The cover 180 includes a moving member 182, and the moving member 182 is disposed in the first chamber 110. When the substrate is transported by the moving element 140 to the receiving element 150, the moving member 182 is used to move the cover 180 along the moving stroke L1, so as to achieve the purpose that the cover 180 covers the upper surface of the substrate. The airflow element 190 is located in the cover 180. When the cover 180 covers the upper surface of the substrate, the nozzle 192 of the airflow element 190 is used to provide an airflow to the upper surface of the substrate.

FIG. 2 is a flowchart of a substrate cleaning method according to the present invention. FIG. 3 to FIG. 11 are schematic flowcharts of the cleaning device corresponding to FIG. 2 according to the present invention. It should be noted that FIG. 3 to FIG. 10 are similar to FIG. 1, in which the same elements are denoted by the same reference numerals and have the same effects, and will not be described repeatedly. FIG. 11 schematically illustrates other chambers in the cleaning apparatus 100. Please refer to Figure 2 first. The substrate cleaning method S10 of this embodiment is applicable to the cleaning apparatus 100 shown in FIG. 1. The substrate cleaning method S10 includes the following steps S110 to S220.

Step S110 is performed to move the substrate 50 to the first position P3 by the roller group 120. As shown in FIG. 3, the roller set 120 conveys the substrate 50 at a conveying position P1, and the substrate 50 is conveyed to the first position P3 by a plurality of rollers 124, wherein the conveying position P1 is the moving stroke of the roller set 120 at the moving element 140 L1 is at the first position P3, and the receiving element 150 is disposed at the third position P5, and the third position P5 is lower than the first position P3.

Referring to FIG. 2 again, step S120 is performed, and the substrate 50 is moved from the first position P3 to the second position P4 along the moving stroke L1 by the moving element 140. As shown in FIG. 4, by the mutual action of the gear 146 and the gear row 144, the driving pin 142 can contact the substrate 50 along the moving stroke L1, and then the driving pin 142 continues upward to move the substrate 50 from the first position P3. To the second position P4, where the second position P4 is higher than the first position P3.

Referring to FIG. 2 again, step S130 is performed, and the roller group 120 is moved from the conveying position P1 to the removing position P2, where the removing position P2 is the moving distance L1 of the roller group 120. As shown in FIG. 5, the slide base 134 in the transfer element 130 moves on the slide rail 136, and the connecting piece 132 drives the rollers 124 connected by the connecting piece 132 to the left and right sides of the moving stroke L1 to separate the roller group. 120. It should be noted that when this part is separated by the roller 124 connected by the connecting member 132, the transmission element 122 (such as a gear and a motor) connected to the roller 124 is also separated.

Please refer to FIG. 12, which is a flowchart of an embodiment of the substrate cleaning method of FIG. 2. After step S130 of moving the roller group 120 from the conveying position P1 to the removing position P2 is performed, then step S132 is performed to clean the roller group 120. As shown in FIG. 6, the nozzle 172 of the cleaning element 170 sprays a cleaning liquid G1 toward the rollers 124 in the roller group 120 to clean the rollers 124. In this way, since the contaminated substrate 50 will also contaminate the roller 124 on the roller group 120 during the transportation process, the roller group 120 is cleaned in step S132. Therefore, when the substrate 50 is cleaned and then moved back to the roller group 120 The substrate 50 after cleaning will not be contaminated again by the roller set 120, so this can ensure the effect of cleaning the substrate.

Referring to FIG. 2 again, step S140 is performed. The moving element 140 moves the substrate 50 along the moving stroke L1 from the second position P4 to the receiving element 150 in the third position P5. In other words, the moving element 140 in this embodiment can The substrate 50 is moved between the first position P3, the second position P4, and the third position P5 along the moving stroke L1. As shown in FIG. 7, the substrate is driven by the moving element 140 50 is moved down from the second position P4 to the third position P5, so that the supporting portion 154 of the receiving element 150 receives the substrate 50 transferred by the moving element 140. When the substrate 50 is located on the receiving element 150, both sides of the lower surface 54 of the substrate 50 abut against the abutting portion 154, and the lower surface 54 of the substrate is exposed to the basket portion 152. It should be noted that the upper surface 52 of the substrate 50 is a process surface for manufacturing, and the lower surface of the substrate 50 is a non-process surface.

Referring to FIG. 2 again, step S150 is performed. A cover 180 covers the upper surface 52 of the substrate 50. As shown in FIG. 8, the moving member 182 moves the cover 180 along the moving stroke L1 so that the cover 180 covers the upper surface 52 of the substrate 50.

Referring to FIG. 2 again, step S160 is performed. The nozzle element 160 sprays the liquid G2 toward the lower surface 54 of the substrate 50 in the empty portion 152 of the receiving element 150. As shown in FIG. 9, the nozzle element 160 faces the receiving element 150. The liquid G2 is sprayed into the basket 152, so that the liquid G2 can be sprayed onto the lower surface 54 of the substrate 50 through the basket 152 of the receiving member 150, where the liquid G2 is, for example, a cleaning liquid. Through the above steps (S110-S160), the purpose of cleaning the lower surface 54 of the substrate 50 (not used as the process surface of the substrate manufacturing process) can be achieved.

It should be noted that, in an embodiment, after the substrate S50 is moved to the receiving element 150 in the foregoing step S140, step S160 is performed. In other words, the foregoing step S150 may be selectively performed as appropriate, and the substrate cleaning may also be achieved. The purpose of the lower surface 54 of 50. Of course, if step S150 is selected to be performed, in addition to the effect of cleaning the lower surface 54 of the substrate 50 described above, as shown in FIG. 13, FIG. 13 is a flowchart of an embodiment of the substrate cleaning method of FIG. 2. After step S150 is performed, this embodiment includes the following step S152. Step S152 is performed. As shown in FIG. 10, an airflow G3 is provided in the cover 180 toward the upper surface 52 of the substrate 50, and the airflow G3 is blown to the upper surface 52 of the substrate 50. The effect of step S152 is that the airflow G3 is blown to the substrate. 50 the upper surface 52, thereby avoiding the nozzle element The liquid G2 sprayed from the member 160 is sprayed onto the upper surface 52 of the substrate 50, and the upper surface 52 of the substrate 50 is wetted.

Referring to FIG. 2 again, step S170 is performed, and the cover 180 is separated from the upper surface 52 of the substrate 50. In other words, the moving member 182 moves the cover body 180 away from the receiving element 150 along the moving stroke L1, and then resets the cover body 180 (as shown in the process of FIGS. 8 to 7). Step S180 is performed to move the substrate 50 from the third position P5 to the second position P4 along the moving stroke L1 by the moving element 140. The ejector pin 142 is driven by the gear 146, so that the ejector pin 142 can continue upward along the moving stroke L1 to move the substrate 50 from the third position P5 to the second position P4 (as shown in FIG. 5 or FIG. 6).示). Step S190 is performed. As shown in the process of FIGS. 5 to 4, the roller group 120 is moved from the removal position P2 to the conveyance position P1. The slide base 134 in the transfer element 130 moves on the slide rail 136, and the connecting piece 132 drives a part of the roller 124 connected by the connecting piece 132 to move to reset the roller group 120. Step S210 is performed, and the substrate 50 is moved from the second position P4 to the first position P3 along the moving stroke L1 by the moving element 140, so that the substrate 50 is located on the roller 124 of the roller group 120. In this embodiment, under the mutual action of the gear 146 and the gear row 144, the ejector pin 142 is driven so that the ejector pin 142 can continue downward along the moving stroke L1 to move the substrate 50 from the second position P4 as shown in FIG. 4 Move down to the first position P3 as shown in FIG. 3.

Step S220 is performed, and the substrate 50 is conveyed downstream of the first position P3 by the roller group 120. In an embodiment, the second chamber 112 (as shown in FIG. 11) is downstream of the first position P3, that is, the substrate 50 is transferred from the first chamber 110 to the second chamber 112. In another embodiment, the downstream of the first position P3 is that the substrate 50 is conveyed from a certain stage of the roller set 120 to the next stage of the roller, which is not limited in the present invention, and can be designed depending on the actual equipment.

As shown in FIG. 11, the cleaning device 100 of this embodiment includes a second chamber 112 and a third chamber 114. The roller set 112A in the second chamber 112 receives and cleans the rollers from the first chamber. The substrate 50 is transported by the chamber 110. In addition, the second chamber 112 also has the same configuration and method as the first chamber 110. The only difference is that the second chamber 112 uses water to clean the substrate. Next, the roller set 114A in the third chamber 114 receives the substrate conveyed from the roller set 112A in the second chamber 112, and the third chamber 114 is used to provide an airflow to dry the substrate 50.

Of course, the content of the above FIG. 11 is merely an example, and is not intended to limit the present invention. The chambers and functions configured in the cleaning device 100 can be changed according to actual needs, and the present invention is not limited thereto.

In summary, in the substrate cleaning method and cleaning equipment of the present invention, the substrate is moved from the roller set to the receiving element by the moving element, so that the lower surface of the substrate is exposed to the empty part of the receiving element. With this configuration, the liquid sprayed by the nozzle element is sprayed onto the lower surface of the substrate (not used as the process surface of the substrate process) after passing through the empty part of the receiving element, without cleaning the upper surface of the substrate (using As the process surface of the substrate process) to achieve the purpose of cleaning a single surface of the substrate.

Furthermore, when the substrate is moved to the receiving element, the cover plate covers the upper surface of the substrate from above the substrate, so that the receiving element and the cover constitute a cleaning space, and the liquid passes through the empty portion of the receiving element without overflowing the cleaning space. In order to avoid affecting the external mechanism (such as the roller set), the purpose of separation between transportation and cleaning can be achieved.

Further, when the cover covers the upper surface of the substrate, the airflow is provided to the upper surface of the substrate so that the airflow is blown to the upper surface of the substrate, thereby preventing the liquid sprayed by the nozzle element from being sprayed onto the upper surface of the substrate. This can not only avoid wetting the upper surface of the substrate, but also ensure that the liquid can be cleaned on the lower surface of the substrate by the above-mentioned airflow guidance, so as to achieve the purpose of cleaning the single surface of the substrate.

In addition, the roller set will be cleaned when moving out of the position. Therefore, when the lower surface of the substrate (the surface contacting the roller set) is cleaned and moved back to the roller set, the lower surface of the substrate will not be contaminated by the roller set again. Ensure the effect of cleaning the lower surface of the substrate.

The above description only describes the preferred embodiments or examples of the technical means adopted by the present invention to solve the problem, and is not intended to limit the scope of patent implementation of the present invention. That is, all changes and modifications that are consistent with the meaning of the scope of patent application of the present invention, or made according to the scope of patent of the present invention, are covered by the scope of patent of the present invention.

Claims (12)

A substrate cleaning method. The substrate cleaning method is suitable for a cleaning device. The cleaning device includes a roller set, at least one nozzle element, at least one moving element, and a receiving element. The roller set conveys a substrate at a conveying position. The conveying position is a first position where the roller group is located on a moving stroke of the moving element, the moving position is when the roller group leaves the moving stroke, the moving element holds the substrate at the first position along the moving stroke, Moving between a second position and a third position, the second position is higher than the first position, the third position is lower than the first position, the receiving element is disposed in the third position, and the receiving element has A basket, the substrate cleaning method includes the following steps: moving the substrate from the first position to the second position along the moving stroke by the moving element; moving the roller set from the conveying position to the moving out Position; moving the substrate along the moving stroke from the second position to the receiving element in the third position; and the nozzle element toward the receiving Spraying the liquid at the surface of the substrate within the empty basket member. The substrate cleaning method according to item 1 of the scope of patent application, wherein the step of spraying the nozzle element with the liquid on the lower surface of the substrate in the basket of the receiving element includes the following steps: by moving the element Moving the substrate from the third position to the second position along the moving stroke; moving the roller set from the moving position to the conveying position; and moving the substrate from the second position along the moving stroke by the moving element The position is moved down to the first position, so that the substrate is located on the roller set. The substrate cleaning method according to item 1 of the scope of patent application, wherein the step of moving the roller set from the conveying position to the moving position includes the following steps: cleaning the roller set. The substrate cleaning method according to item 1 of the scope of patent application, wherein before the step of spraying the nozzle element toward the lower surface of the substrate in the basket of the receiving element, the method includes the following steps: a cover covers An upper surface of the substrate. The substrate cleaning method according to item 4 of the scope of patent application, wherein the step of spraying the nozzle element with the liquid on the lower surface of the substrate in the basket of the receiving element includes the following steps: the cover is detached The upper surface of the substrate. The substrate cleaning method according to item 4 of the scope of patent application, wherein after the step of covering the upper surface of the substrate by the cover body, the method includes the following steps: providing an air flow to the upper surface of the substrate in the cover body. The substrate cleaning method according to item 1 of the scope of patent application, wherein before moving the substrate from the first position to the second position along the moving stroke by the moving element, the method includes the following steps: The roller set moves the substrate to the first position. A cleaning device includes: a first chamber; a moving element located in the first chamber; the moving element moves the substrate between a first position, a second position, and a third position along a moving stroke; Moving, wherein the second position is higher than the first position and the third position is lower than the first position; a roller set is accommodated in the first chamber, and the roller set has a conveying position and a moving position, The conveying position is that the roller group is located at the first position of the moving stroke, and the moving position is that the roller group leaves the moving stroke; a receiving element is located in the first chamber, and the receiving element is provided in the third Position, the receiving element has a basket, the receiving element is used to receive the substrate transferred by the moving element; and at least one nozzle element is located in the first chamber, and the at least one nozzle element is located in the receiving Below the element, the nozzle element is used to spray liquid onto the lower surface of the substrate in the basket portion of the receiving element. The cleaning device according to item 8 of the scope of patent application, includes: a cleaning element is located in the first chamber, and the cleaning element is used to clean the roller set. The cleaning device according to item 8 of the scope of patent application, comprising: a cover body located in the first chamber, the cover body being used to cover an upper surface of the substrate; The cleaning device according to item 10 of the scope of patent application, includes: an airflow element located in the cover, and the airflow element provides an airflow to the upper surface of the substrate in the cover. The cleaning device according to item 8 of the scope of patent application, comprising: a second chamber to receive and clean the substrate transported from the first chamber; and a third chamber to receive the second chamber When the substrate is transported, the third chamber is used to provide an airflow to dry the substrate.