TW201820404A - Substrate processing apparatus and substrate processing method enabling the recovery of processing liquid from the substrate according to the liquid type even if the substrate is rotated at a low speed with the first or second processing liquid being supplied to the rotatably supported substrate - Google Patents

Abstract

To enable the recovery of processing liquid from the substrate according to the liquid type even if the substrate is rotated at a low speed with the first or second processing liquid being supplied to the rotatably supported substrate in a substrate processing method for processing the substrate. In a development processing apparatus, at the time of positive development processing, the dispensing section (152a) is raised, and the positive developer from the wafer (W) is guided from the position between the dispensing section (152a) and a fixed cup (154) to the positive recovery port, whereas at the time of negative development processing, the dispensing section (152a) is descended, and the negative developer from the wafer (W) is guided from the position between the dispensing section ( 152a) and the outer peripheral wall (153a) to the negative recovery port. When the dispensing section (152a) descends, a step (154d) lowering from the inner peripheral side end of the dispensing section (152a) is formed at the outer peripheral end of the fixed cup (154b) so that at the time of negative development processing, the negative developer is not guided to the positive recovery port, and the angle [alpha] of the upper surface of the dispensing section (152a) is formed to be larger than the angle [beta] of the upper inclined surface forming the step (154d).

Description

Substrate processing device and substrate processing method

[0001] The present invention relates to a substrate processing apparatus and a substrate processing method for processing a substrate by supplying a processing liquid such as a developing solution to a substrate that is rotatably supported.

[0002] In a photolithography process such as a manufacturing process of a semiconductor element, a predetermined photoresist pattern is formed on a wafer by sequentially performing processes such as the following: photoresist coating process, and photoresist liquid coating A photoresist film is formed on a semiconductor wafer (hereinafter referred to as a “wafer”) as a substrate; an exposure process, which exposes a predetermined pattern to the photoresist film; and a heat treatment (post exposure baking) ), After exposure, to promote the chemical reaction in the photoresist film; development processing, using a developer to develop the exposed photoresist film. [0003] As the photoresist liquid, there are: a positive photoresist liquid that removes an exposed portion during development processing; and a negative photoresist liquid that removes an unexposed portion during development processing. In addition, as the developing solution, a positive type developing solution and a negative type developing solution corresponding to the positive type resist and the negative type resist are stored. [0004] Patent Document 1 discloses a development processing device that performs development processing by a positive-type developing solution and development processing by a negative-type developing solution in the same module. As shown in FIGS. 15 and 16, this development processing apparatus is provided with a recovery cup 501 that recovers the development liquid that scatters as the wafer W rotates. The recovery cup 501 includes a cup main body 502 and a movable cup 503 that can move the cup main body 502, that is, the wafer W in the vertical direction. In the development processing apparatus of Patent Document 1, as shown in FIG. 15, during the positive type development processing, the movable cup 503 is raised to thereby disperse the positive type development liquid scattered from the rotating wafer W. It passes through the lower side of the movable cup 503 and is introduced into the inner flow path 504 of the cup body 502. As shown in FIG. 16, during the negative development processing, the movable cup 503 is lowered, and the negative developing liquid scattered from the rotating wafer W is passed through the upper side of the movable cup 503 and introduced. The outer flow path 505 of the cup body 502. Thereby, the discharged liquid of the positive-type developing liquid and the discharged liquid of the negative-type developing liquid are not mixed and recovered separately. Examples of the purpose of recycling are recycling. [0005] As a method of developing processing, a developing method is proposed, which includes a process of horizontally holding the exposed substrate on a substrate holding portion, and supplying the developing liquid from a developing liquid nozzle to the substrate. Part of the process of forming liquid accumulation; the process of rotating the substrate; moving the supply position of the developing liquid in the rotating substrate along the radial direction of the substrate, moving the developing liquid nozzle, thereby making the liquid accumulation The process of expanding on the entire surface of the substrate; and the process of expanding the fluid on the entire surface of the substrate in parallel with the process of moving with the imaging liquid nozzle to bring the contact portion into contact with the fluid, the contact portion is related to the substrate The facing surface is smaller than the surface of the substrate (Patent Document 2). In this developing method, in the process of expanding the accumulated liquid of the developing solution over the entire surface of the substrate, the rotation speed of the substrate is 100 rpm or less. [Prior Art Document] [Patent Document] [0006] [Patent Document 1] Japanese Patent Laid-Open No. 2014-75575 [Patent Document 2] Japanese Patent Laid-Open No. 2015-53467

[Problems to be Solved by the Present Invention] [0007] However, in the case where the development processing caused by the positive developing solution and the development processing caused by the negative developing solution are performed in the same module, we consider using The configuration disclosed in Patent Document 2 is a configuration of a development processing method. However, in this configuration, when a conventional method such as the method disclosed in Patent Document 1 is adopted as a method for separately recovering the drainage of the positive-type developing solution and the drainage of the negative-type developing solution, there are the following The problem. [0008] That is, as described above, in the development processing method disclosed in Patent Document 2, there is a process in which the rotation speed of the wafer coated with the development liquid is slow to 100 rpm or less. In the case of this slow process, as shown in FIG. 16, there are cases in which even if the movable cup 503 is lowered, a negative-type developing liquid cannot be introduced into the outer flow path 505 and a positive-type developing system is used. The inner flow path 504 causes the discharge of the positive-type developing liquid and the discharge of the negative-type developing liquid to be mixed. [0009] As a mechanism for the above-mentioned mixing to occur, for example, the following are considered. In my opinion, as shown in FIG. 17, when the rotation speed of the wafer W is relatively slow, the negative developing solution D on the wafer W will not be thrown off and fall onto the cup body 502. Between the movable cups 503, an inner flow path 504 for a positive development system is introduced. By the way, in my opinion, as shown in FIG. 18, when the rotation speed of the wafer W is relatively slow, the negative-type developing solution D will rewind to the back of the wafer W. In such a state, when the negative-type developing solution D is thrown away, the track of the dropped-out developing solution becomes lower than in the general case. Therefore, as a result of the dropped developing liquid colliding with the inner peripheral end of the movable cup 503 or the cup body 502, an inner flow path 504 for a positive-type development system is introduced from between the cup body 502 and the movable cup 503. [0010] I believe that the same problem exists even in other substrate processing apparatuses that process two substrates with two types of processing liquids and the same module, and collect the processing liquids separately. [0011] The present invention has been made in view of this point, and has as its object the purpose of processing a substrate by supplying a first processing liquid or a second processing liquid to a substrate that is rotatably supported, and recovering the substrate according to the type. In a substrate processing apparatus for processing liquid from a substrate, even when the substrate processing includes a process of rotating the substrate at a low speed, the processing liquid from the substrate can be recovered by type. [Means to Solve the Problem] [0012] In order to achieve the foregoing object, the present invention provides a substrate processing apparatus that supplies a first processing liquid or a second processing liquid to a substrate that is rotatably supported about a vertical axis and processes the substrate. The substrate is processed by a recovery cup, and the processing liquid from the substrate is recovered. The substrate processing apparatus is characterized in that the recovery cup is provided with a cup body having a ring-shaped outer peripheral wall larger than the substrate; The internal structure has an upper peripheral surface formed from a first inclined surface that gradually decreases toward the outer peripheral side; and a bottom wall, the recovery port of the first treatment liquid is provided on the inner peripheral side, and the recovery of the second treatment liquid is provided. The mouth is provided on the outer peripheral side; and the movable cup has a distribution portion at an upper end, and is provided to be movable up and down between the outer peripheral wall of the cup body and the internal structure, and the distribution portion is gradually moved toward the outer peripheral side. The lowered second inclined surface is formed with an upper surface to guide the first treatment liquid from between the distribution portion and the internal structure so that the movable cup is raised. The recovery port of the first treatment liquid, and guide the second treatment liquid from between the distribution portion and the outer peripheral wall to the recovery port of the second treatment liquid, the cup body, so that the movable cup is lowered, There is a step at the outer peripheral end of the first inclined surface. When the movable cup is lowered, the inner peripheral end of the distribution portion is lowered to the step, and the upper surface of the distribution portion becomes higher than the upper side of the step. The angle of the surface is low, and the angle of the second inclined surface of the distribution portion is greater than the angle of the first inclined surface. [0013] It is preferable that the inclination angle of the second inclined surface of the distribution portion is larger on the outer peripheral side than on the inner peripheral side. [0014] It is preferable that the inner peripheral side end of the distribution portion is formed to be gradually thinner toward the inner peripheral side. [0015] It is preferable that the cup body has a recess formed at an inner peripheral side than the step of the first inclined surface, and a communication path that communicates the recess with the drainage path. [0016] An elastic member is provided on the inner peripheral side than the step of the first inclined surface. The elastic member has an upper surface continuous with the first inclined surface and extends toward the outer peripheral side to cover the movable cup when descending. The above-mentioned inner peripheral side end of the distribution portion is preferably above. [0017] According to another aspect of the present invention, a substrate processing method is provided in which a first processing liquid or a second processing liquid is supplied to a substrate rotatably supported about a vertical axis to process the substrate, and the substrate is recovered from a recovery cup. The substrate processing liquid and the substrate processing method are characterized in that the recovery cup is provided with a cup body having a ring-shaped outer peripheral wall larger than the substrate and a ring-shaped inner structure body directed toward the outer peripheral side. The first inclined surface that gradually becomes lower has an outer peripheral surface at the upper end; and a bottom wall, the recovery port of the first treatment liquid is provided on the inner peripheral side, and the recovery port of the second treatment liquid is provided on the outer peripheral side; and movable The cup has a distribution portion at an upper end, and is provided to be movable up and down between the outer peripheral wall of the cup body and the internal structure. The distribution portion is formed by a second inclined surface that gradually decreases toward the outer peripheral side. In the above, the cup body has a step at the outer peripheral end of the first inclined surface, and the angle of the second inclined surface of the distribution portion is greater than the angle of the first inclined surface. The substrate processing method includes a process of raising the movable cup and placing an inner peripheral side end of the distribution portion above the substrate when the substrate is processed with the first processing liquid. A process of supplying the first processing liquid to the substrate; and rotating the substrate to guide the first processing liquid on the substrate from between the distribution section and the internal structure to a recovery port of the first processing liquid In the process of processing the substrate with the second processing liquid, the process includes lowering the movable cup and lowering an inner peripheral side end of the distribution portion to the level difference, and the upper surface of the distribution portion becomes larger than that in which the foregoing is formed. A process in which the surface above the step is low; a process in which the second processing liquid is supplied to the substrate; and a process in which the substrate is rotated to guide the second processing liquid on the substrate from between the distribution portion and the outer peripheral wall The process up to the recovery port of the second treatment liquid. [Effects of the Invention] According to the present invention, in a substrate processing apparatus that supplies a first processing liquid or a second processing liquid to a substrate rotatably supported to process the substrate, and recovers the processing liquid from the substrate according to the type, Even when the substrate processing includes a process of rotating the substrate at a low speed, the processing liquid from the substrate can be recovered by type.

[0020] Hereinafter, embodiments of the present invention will be described. In this specification and the drawings, elements having substantially the same functional configuration are denoted by the same reference numerals, and redundant descriptions are omitted. [0021] FIG. 1 is a schematic plan view schematically showing the configuration of a substrate processing system 1 provided with a development processing apparatus according to this embodiment. 2 and 3 are respectively a front view and a rear view schematically showing the outline of the internal configuration of the substrate processing system 1. [0022] As shown in FIG. 1, the substrate processing system 1 has a structure in which the following are integrally connected: a cassette station 10 for loading and unloading a cassette C containing a plurality of wafers W; and a processing station 11 including: There are a plurality of various processing apparatuses that perform predetermined processing on the wafer W; and the interface station 13 receives and receives the wafer W between the exposure apparatus 12 and the exposure apparatus 12 adjacent to the processing station 11. [0023] The cassette station 10 is provided with a cassette mounting table 20. The cassette mounting table 20 is provided with a plurality of cassette mounting plates 21, and the cassette C is mounted when the cassette C is carried in and out of the substrate processing system 1. [0024] As shown in FIG. 1, the cassette station 10 is provided with a wafer transfer device 23 that can move freely on a transfer path 22 extending in the X direction. The wafer transfer device 23 also moves freely in the vertical direction and around the vertical axis (θ direction), and can be mounted on the cassette C on each cassette mounting plate 21 and the third block G3 of the processing station 11 described later. The wafer W is transferred between the receiving and receiving devices. [0025] The processing station 11 is provided with a plurality of, for example, four blocks, that is, the first block G1 to the fourth block G4 provided with various devices. For example, on the front side of the processing station 11 (the negative direction side in the X direction in FIG. 1), a first block G1 is provided, and on the back side of the processing station 11 (the positive direction side in the X direction in FIG. 1 and the upper side of the figure) ), The second block G2 is set. Further, the third block G3 described above is provided on the cassette station 10 side of the processing station 11 (the negative direction side in the Y direction in FIG. 1), and on the interface station 13 side of the processing station 11 (the Y direction in FIG. 1) Positive direction side), the fourth block G4 is provided. [0026] For example, in the first block G1, as shown in FIG. 2, a plurality of liquid processing apparatuses are arranged in the following order from the bottom, for example: the development processing apparatus 30 performs development processing on the wafer W; the lower part The anti-reflection film forming device 31 forms an anti-reflection film (hereinafter referred to as "lower anti-reflection film") on the lower layer of the photoresist film of the wafer W; and the photoresist coating device 32 applies a photoresist liquid to the wafer W A photoresist film is formed; and an upper antireflection film forming device 33 forms an antireflection film (hereinafter referred to as an "upper antireflection film") on the upper layer of the photoresist film of the wafer W. [0027] For example, three imaging processing devices 30, a lower reflection preventing film forming device 31, a photoresist coating device 32, and an upper reflection preventing film forming device 33 are arranged in a horizontal direction. In addition, the number or arrangement of the development processing device 30, the lower reflection preventing film forming device 31, the photoresist coating device 32, and the upper reflection preventing film forming device 33 can be arbitrarily selected. [0028] In the lower reflection preventing film forming device 31, the photoresist coating device 32, and the upper reflection preventing film forming device 33, for example, spin coating is performed to apply a predetermined coating liquid on the wafer W. . In spin coating, for example, a coating liquid is ejected onto a wafer W from a coating nozzle, and the wafer W is rotated to spread the coating liquid on the surface of the wafer W. The configuration of the development processing device 30 will be described later. [0029] For example, in the second block G2, as shown in FIG. 3, a plurality of heat treatment devices 40 to 43 are provided to perform heat treatment such as heating and cooling of the wafer W. [0030] For example, in the third block G3, as shown in FIG. 2 and FIG. 3, a plurality of receiving devices 50, 51, 52, 53, 54, 55, and 56 are sequentially arranged from below. Further, in the fourth block G4, as shown in FIG. 3, a plurality of receiving devices 60, 61, and 62 are sequentially provided from below. [0031] As shown in FIG. 1, in a region surrounded by the first block G1 to the fourth block G4, a wafer transfer region D is formed. In the wafer transfer area D, a plurality of wafer transfer devices 70 are disposed, and the transfer arms 70 have transfer arms that can move freely in, for example, the Y direction, the X direction, the θ direction, and the vertical direction. The wafer transfer device 70 is moved in the wafer transfer area D, and can be scheduled to be located in the surrounding first block G1, second block G2, third block G3, and fourth block G4. The wafer W is transferred between the devices. [0032] In the wafer transfer area D, as shown in FIG. 3, a shuttle transfer device 80 is provided: the wafer W is linearly transferred between the third block G3 and the fourth block G4. [0033] The shuttle conveying device 80 can move linearly along the Y direction in FIG. 3, for example. The shuttle transfer device 80 can move in the Y direction while supporting the wafer W, and transfer the wafer between the receiving device 52 in the third block G3 and the receiving device 62 in the fourth block G4. W. [0034] As shown in FIG. 1, a wafer transfer device 100 is provided beside the X-direction positive side of the third block G3. The wafer transfer apparatus 100 includes a transfer arm that can move freely in, for example, the X direction, the θ direction, and the vertical direction. The wafer transfer device 100 is capable of moving up and down while supporting the wafer W, and transfers the wafer W to each receiving device in the third block G3. [0035] The interface station 13 is provided with a wafer transfer device 110 and a receiving device 111. The wafer transfer device 110 includes a transfer arm that can move freely in, for example, the Y direction, the θ direction, and the vertical direction. The wafer transfer device 110 supports, for example, a wafer W on a transfer arm, and transfers the wafer W between each receiving device, the receiving device 111 and the exposure device 12 in the fourth block G4. [0036] In the above substrate processing system 1, as shown in FIG. 1, a control unit 300 is provided. The control unit 300 is, for example, a computer, and includes a program storage unit (not shown). The program storage section stores a program for controlling the processing of the wafer W in the substrate processing system 1. In the program storage section, the operation of the drive system for controlling the various processing devices or conveying devices described above is also stored, and the nozzle driving sections 166, 169, 172, 175, and the lifting section 156, which are described later, are also realized. A development processing program described later in the substrate processing system 1. In addition, the aforementioned programs can also be read by a computer that is recorded on a computer-readable hard disk (HD), floppy disk (FD), optical disk (CD), magneto-optical disk (MO), memory card, etc. The storage medium, and the control unit 300 is installed from the storage medium. [0037] Next, an outline of wafer processing using the substrate processing system 1 configured as described above will be described. First, the cassette C containing the plurality of wafers W is carried into a cassette station 10 of the substrate processing system 1, and the wafers W in the cassette C are sequentially transferred to the processing station by the wafer transfer device 23. 11 的 给 给 装置 53。 11 of the receiving device 53. [0038] Next, the wafer W is transferred to the heat treatment device 40 in the second block G2 by the wafer transfer device 70 to perform temperature adjustment processing. Thereafter, the wafer W is transferred to, for example, the lower reflection preventing film forming device 31 in the first block G1 by the wafer transfer device 70 to form a lower reflection preventing film on the wafer W. Thereafter, the wafer W is transferred to the heat treatment apparatus 41 in the second block G2 and is subjected to heat treatment. [0039] Thereafter, the wafer W is transferred to the heat treatment device 42 of the second block G2 by the wafer transfer device 70, and is subjected to temperature adjustment processing. Thereafter, the wafer W is transferred to the photoresist coating device 32 of the first block G1 by the wafer transfer device 70 to form a photoresist film on the wafer W. Thereafter, the wafer W is transferred to the heat treatment apparatus 43 and is subjected to a pre-baking process. [0040] Next, the wafer W is transferred to the upper anti-reflection film forming device 33 of the first block G1, and an upper anti-reflection film is formed on the wafer W. Thereafter, the wafer W is transferred to the heat treatment apparatus 43 in the second block G2 and is subjected to heat treatment. Thereafter, the wafer W is transferred to the receiving and receiving device 56 in the third block G3 by the wafer transfer device 70. [0041] Next, the wafer W is transferred to the receiving device 52 by the wafer transfer device 100, and is transferred to the receiving device 62 of the fourth block G4 by the shuttle transfer device 80. Thereafter, the wafer W is transferred to the exposure device 12 by the wafer transfer device 110 of the interface station 13 and is subjected to exposure processing in a predetermined pattern. [0042] Next, the wafer W is transferred to the heat treatment device 40 by the wafer transfer device 70, and is subjected to a post-exposure bake process. Thereby, a deprotection reaction proceeds by an acid generated in the exposed portion of the photoresist film. Then, the wafer W is transferred to the development processing device 30 by the wafer transfer device 70 to perform development processing. [0043] (First Embodiment) Next, the configuration of the development processing device 30 according to the first embodiment of the present invention will be described with reference to FIGS. 4 and 5. The development processing device 30 includes a processing container 130 that can be sealed inside as shown in FIG. 4. A carry-in / out port (not shown) for the wafer W is formed on the side of the processing container 130. [0044] A spin chuck 140 that holds the wafer W and rotates it about the vertical axis O is provided in the processing container 130. The rotary chuck 140 can be rotated to a predetermined speed by a chuck driving section 141 such as a motor. In addition, the chuck driving section 141 is provided with a lifting drive mechanism 142 such as an air cylinder, and the chuck 140 is rotatable. [0045] The cup 150 is provided so as to surround the periphery of the wafer W held by the spin chuck 140. The cup 150 is used to collect and recover the liquid scattered or dropped from the wafer W. The details of the cup 150 will be described later. [0046] As shown in FIG. 5, rails 160A to 160D extending along the Y direction (left-right direction in FIG. 5) are formed on the negative direction (lower direction in FIG. 5) side of the cup 150 in the X direction. The guide rails 160A to 160D are formed, for example, from the outer side in the negative Y-direction (left direction in FIG. 5) side of the cup 150 to the outer side in the positive Y-direction (right direction in FIG. 5) side. Arms 161, 162, 163, and 164 are mounted on the guide rails 160A, 160B, 160C, and 160D, respectively. [0047] In the first arm portion 161, a positive-type developing solution supply nozzle 165 that supplies a positive-type developing solution, which is an example of the "first processing solution", is supported. The first arm portion 161 is free to move on the guide rail 160A by the nozzle driving portion 166. Thereby, the positive-type developing liquid supply nozzle 165 can move from the standby portion 167 provided on the outer side of the negative side in the Y direction of the cup 150 to the center portion of the wafer W in the cup 150. In addition, the nozzle driving section 166 and the first arm section 161 can be raised and lowered freely, and the height of the positive-type developing liquid supply nozzle 165 is adjusted. As the positive developing solution, for example, tetramethylammonium hydroxide (TMAH) is used. [0048] The positive-type developing liquid supply nozzle 165 has a cylindrical shape as a whole, and as shown in FIG. 6 described later, the lower end surface 165a thereof is formed as a flat surface parallel to the wafer W, for example. The lower end surface 165a has a function of a liquid-contacting surface in contact with the positive-type developing solution. A supply hole for supplying a developing solution is formed in the lower end surface 165a. The number of supply holes can be arbitrarily selected, and it can be one or plural. [0049] The diameter of the positive-type developing solution supply nozzle 165 is smaller than the diameter of the wafer W. When the diameter of the wafer W is 300 mm, the diameter of the nozzle 165 is, for example, 40 mm. . The positive-type developing solution supply nozzle 165 is made of a material having chemical resistance such as PTFE or quartz. [0050] The second arm portion 162 supports a negative-type developing solution supply nozzle 168 that supplies a negative-type developing solution, which is an example of a "second processing solution." The negative-type developing solution supply nozzle 168 may be, for example, one having the same shape, the same size, and the same structure as the positive-type developing solution supply nozzle 165. The second arm portion 162 is free to move on the guide rail 160D by the nozzle driving portion 169. Thereby, the negative-type developing liquid supply nozzle 168 can move from the standby portion 170 provided on the outer side of the positive direction side in the Y direction of the cup 150 to the center portion of the wafer W in the cup 150. In addition, the nozzle driving section 169 and the second arm section 162 can be raised and lowered freely, and the height of the negative-type developing liquid supply nozzle 168 can be adjusted. As the negative-type developing solution, a developing solution containing an organic solvent is used, and for example, a developing solution having butyl acetate, which is an ester-based solvent, is used. [0051] The third arm portion 163 supports a positive-type flushing liquid supply nozzle 171 for supplying a positive-type flushing liquid. The third arm portion 163 is free to move on the guide rail 160B by the nozzle driving portion 172. As a result, the positive-type flushing liquid supply nozzle 171 can be moved to the wafer in the cup 150 from the standby portion 173 which is provided on the negative side in the Y direction of the cup 150 and between the standby portion 167 and the cup 150. Above the center of W. In addition, the nozzle driving section 172 and the third arm section 163 can be raised and lowered freely, and the height of the positive-type flushing liquid supply nozzle 171 is adjusted. As the positive type washing liquid, pure water is used. [0052] The fourth arm portion 164 supports a negative-type flushing liquid supply nozzle 174 that supplies a negative-type flushing liquid. The fourth arm portion 164 is movable on the guide rail 160C by the nozzle driving portion 175. As a result, the negative-type flushing liquid supply nozzle 174 can be moved to the wafer in the cup 150 from the standby portion 176 provided on the positive side in the Y direction of the cup 150 and between the standby portion 170 and the cup 150. Above the center of W. In addition, the nozzle driving portion 175 and the fourth arm portion 164 can be raised and lowered freely, and the height of the negative-type flushing liquid supply nozzle 174 is adjusted. As the negative type washing liquid, for example, 4-methyl-2-pentanol (MIBC) is used. [0053] Here, an example of the positive-type development processing in the development processing device 30 will be described with reference to FIGS. 6 to 8. In the following description, a positive type photoresist film is formed on the surface of the wafer W, and the photoresist film is exposed. (1) In the case of the positive-type development processing of the wafer W held on the spin chuck 140, first, the positive-type developing liquid supply nozzle 165 is moved from the standby portion 167 to the central portion of the wafer W. As shown in FIG. 6, the nozzle 165 is lowered so that the lower end surface 165 a of the positive-type developing solution supply nozzle 165 approaches and faces the wafer W. Next, while the wafer W is stopped or the wafer W is rotated at a rotation speed of 10 rpm or less, the developing liquid is supplied from the positive-type developing liquid supply nozzle 165 to the wafer W. Thereby, a liquid accumulation L is formed between the lower end surface 165a of the positive-type developing liquid supply nozzle 165 and the wafer W so as to be in contact with the lower end surface 165a. The discharge flow rate of the imaging solution at this time is, for example, 60 to 600 ml / min. [0054] Next, the rotation speed of the wafer W is increased to 30 to 100 rpm while the supply of the developing solution is continued. As shown in FIG. 7, the positive developing solution supply nozzle 165 is directed from the center of the wafer W The peripheral edge portion moves, so that the accumulated liquid L spreads on the surface of the wafer W. Then, until the end of the lower end surface 165a reaches the periphery of the wafer W, it takes, for example, 2 to 15 seconds to move the positive-type developing liquid supply nozzle 165 to form a liquid accumulation L covering the entire surface of the wafer W. [0055] After the accumulation of liquid L on the entire surface of the wafer W, the supply of the developing liquid from the positive-type developing liquid supply nozzle 165 and the rotation of the wafer W are stopped, as shown in FIG. The image liquid supply nozzle 165 retracts to the standby section 167. Then, in a state in which the wafer W is stopped, a still image caused by the accumulated liquid L formed on the wafer W is performed. [0056] After developing, the positive-type flushing liquid supply nozzle 171 is moved from the standby portion 173 to the central portion of the wafer W. Then, pure water is supplied from the nozzle 171 to the wafer W, and the wafer W is cleaned. The rotation speed of the wafer W at this time is, for example, 100 to 1200 rpm. [0057] When the cleaning of the wafer W by pure water is completed, the positive-type flushing liquid supply nozzle 171 is retracted, and the wafer W is rotated at a high speed of 2000 rpm for spin drying. Thereby, the positive-type development processing is ended. [0058] The above-mentioned positive-type development processing is an example, and the positive-type development processing of this embodiment may be applied, and other processes may be included instead of or in addition to the above-mentioned processes. For example, the operation of forming the effusion L to expand the effusion L can also use a scan input method instead of a scan output method. The scan input method is such that the upper position of the peripheral edge portion side of the wafer W is in a positive type. After the developing solution supply nozzle 165 starts to eject the positive developing solution, the positive developing solution supply nozzle 165 is moved to the center of the wafer W. This scanning output method uses a positive developing solution supply nozzle 165 moves from the center portion of the wafer W to the peripheral portion side. It is also possible to use the scan output method and the scan input method at the same time. [0059] The negative-type development processing is the same as the positive-type development processing, and therefore description thereof is omitted. [0060] Return to the description of FIG. 4. The cup 150 includes a cup body 151 and a movable cup 152 that can be moved to the cup body 151. The cup main body 151 includes a cup base 153 and a fixed cup 154 fixed to the cup base 153. [0061] The cup base 153 has an annular outer peripheral wall 153a and the same annular inner peripheral wall 153b, an outer peripheral wall 153a, and an inner peripheral wall 153b are formed so as to extend in the vertical direction (vertical direction). The inner diameter of the outer peripheral wall 153a is formed larger than the diameter of the wafer W, the outer diameter of the inner peripheral wall 153b is formed smaller than the diameter of the wafer W, and the height of the inner peripheral wall 153b is formed higher than the outer peripheral wall. The height of 153a is small. The cup base 153 includes a bottom wall 153c, which connects the lower end of the outer peripheral wall 153a and the lower end of the inner peripheral wall 153b, and an upper wall 153d, which extends from the upper end of the outer peripheral wall 153a in the inner peripheral direction, and the upper side of the inner peripheral wall 153b is opened. . The upper end of the inner peripheral wall 153b is provided with a protrusion 153e extending in the inner circumferential direction, and the cup base 153 can be fixed by sandwiching the protrusion 153e by fixing the cup 154 and the holding plate 155. [0062] The fixed cup 154 constitutes a ring-shaped internal structure located between the outer peripheral wall 153a and the inner peripheral wall 153b. The fixed cup 154 has a ring-shaped peripheral wall 154a between the outer peripheral wall 153a and the inner peripheral wall 153b. In addition, the fixed cup 154 is an outer peripheral surface with an upper end formed by an inclined surface (corresponding to the "first inclined surface") 154b that gradually decreases toward the outer peripheral side. Hereinafter, this inclined surface 154b is referred to as an outer inclined surface 154b. As described later, a step is formed on the outer inclined surface 154b. The lower end of the outer inclined surface 154b is continuous to the outer peripheral surface of the peripheral wall 154a. Further, the fixed cup 154 is located on the inner peripheral side than the outer inclined surface 154b, and has an inner inclined surface 154c that gradually decreases toward the inner peripheral side. [0063] The movable cup 152 is a ring-shaped member provided to move up and down between the outer peripheral wall 153a of the cup base 153 and the fixed cup 154. The movable cup 152 has a distribution portion 152a at an upper end and a distribution portion 152a at a lower side. Perimeter wall 152b. The distribution portion 152a is for separating and discharging a positive-type developing solution and a negative-type developing solution, and an upper surface thereof is formed by an inclined surface (corresponding to a "second inclined surface") 152c that gradually decreases toward the outer peripheral side. The perimeter wall 152b is formed in a ring shape, and its inner diameter is larger than the diameter of the outer periphery of the peripheral wall 154a of the fixed cup 154, and its outer diameter is smaller than the diameter of the inner periphery of the outer peripheral wall 153a of the cup base 153. Moreover, the outer peripheral end of the inclined surface 152c of the distribution part 152a is continued on the outer peripheral surface of the peripheral wall 152b. [0064] Above the movable cup 152, a lifting portion 156 is provided for raising or lowering the movable cup 152. [0065] Return to the description of the cup base 153. The bottom wall 153c of the cup base 153 is formed with two partition walls 153f and 153g, and is formed in a ring shape between the outer peripheral wall 153a and the inner peripheral wall 153b. Further, the bottom wall 153c is formed with a negative type recovery port 153h, and a negative type developing solution is recovered between the outer peripheral wall 153a and the outer peripheral side partition wall 153f. The bottom wall 153c is connected between the partition walls 153f and 153g, and a positive recovery port 153i for recovering the positive-type developing solution is formed. A recovery wall is formed between the partition wall 153g on the inner peripheral side and the inner peripheral wall 153b. The mist recovery port 153j for the misted developing solution. [0066] A pump (not shown) and the like are connected to the negative type recovery port 153h, the positive type recovery port 153i, and the mist recovery port 153j. [0067] Next, the discharge of the developing solution during the developing process in the developing processing device 30 will be described with reference to FIGS. 9 to 11. In addition, the description of the discharge of the mist-developed developing solution is omitted. [0068] In the case of positive-type development processing, as shown in FIG. 9, in the development processing device 30, the movable cup 152 is raised and driven by a pump connected to the positive-type recovery port 153i. With this, in the development processing device 30, the positive-type developing solution that is scattered by the rotation of the wafer W or the positive-type developing solution that is wound down to the lower side of the wafer W can be removed from the movable cup 152. The distribution portion 152a and the fixed cup 154 are guided to the positive collection port 153i, and are collected through the collection port 153i. [0069] On the other hand, in the case of negative-type development processing, in the development processing device 30, as shown in FIG. 10, the movable cup 152 is lowered and the negative-type recovery port 153h is connected. Pump driven. As a result, in the development processing device 30, a negative-type development liquid that is scattered substantially horizontally due to the rotation of the wafer W can be guided between the distribution portion 152a of the movable cup 152 and the outer peripheral wall 153a of the cup base 153. It reaches 153h for negative type collection ports, and collects through this collection port 153h. [0070] As shown in FIG. 11, a step 154d is formed on the outer peripheral end of the inclined surface 154b on the outer side of the fixed cup 154. When the movable cup 152 is lowered, (1) the distribution portion of the movable cup 152 The inner peripheral side end of 152a drops to the level difference 154d. At this time, the upper surface of the distribution portion 152a, that is, the inclined surface 152c becomes lower than the surface forming the level difference 154d. (2) The angle α of the inclined surface 152c of the distribution portion 152a becomes larger than the angle β of the angle forming the upper surface of the fixed cup 154. With the above-mentioned configuration (1), even when the negative-type developing liquid does not scatter substantially horizontally and scatters at an angle with respect to the level during the rotation of the wafer W, the scattered developing solution does not collide with the distribution portion. The inner peripheral side end of 152a. Further, with the configuration of (2) above, even if the scattered developing liquid collides with the outer inclined surface 154b of the fixed cup 154, the developing liquid after the collision does not accumulate between the distribution portion 152a and the fixed cup 154. And it flows along the inclined surface 152c of the distribution part 152a. [0071] Therefore, in the development processing apparatus 30, the negative-type developing solution scattered or dropped from the wafer W can be more surely guided to the negative-type recovery port 153h. Therefore, even in the case where the low-speed rotation process is included in the negative-type development processing in the development processing device 30, the positive-type development liquid and the negative-type development liquid can be collected separately without being mixed. [0072] In addition, the negative-type developing solution is designed so as not to flow into the gap between the inner peripheral side end of the dispensing portion 152a of the movable cup 152 that has fallen and the lower surface that forms the step 154d of the fixed cup 154. , That is, the gap becomes narrower. [0073] The inclined surface 152c of the distribution portion 152a of the movable cup 152 is preferably such that the inclination angle γ of the outer peripheral side is larger than the inclination angle α of the inner peripheral side. This makes it possible for the negative-type developing liquid to flow more smoothly along the inclined surface 152c while suppressing the vertical direction throughout the entire surface of the inclined surface 152c as compared with the case where the inclined angle is large. size of. [0074] It is preferable that the inner peripheral side end portion of the distribution portion 152a of the movable cup 152 is formed to be gradually thinner toward the inner peripheral side. This is because it becomes difficult for the negative-type developing solution to accumulate between the inner peripheral side end of the dispensing portion 152 a of the movable cup 152 that has fallen and the fixed cup 154. [0075] After actually manufacturing the movable cup 152 having the above shape, and separating the drainage of the positive developing liquid and the negative developing liquid caused by moving the movable cup 152 up and down, it was actually confirmed that In the case of a process in which the rotation speed of the wafer W is 100 rpm or less, drainage and separation can be performed well. [0076] (Second Embodiment) Next, the configuration of a development processing device 30 according to a second embodiment of the present invention will be described with reference to FIG. 12. As shown in FIG. 12, the fixed cup 200 of the development processing device 30 of the second embodiment is located on the inner peripheral side than the step 154d of the outer inclined surface 201, and includes: a circular recess 202; and a communication path 203 The recess 202 is communicated with a drainage path (not shown), and is different from the fixed cup 154 of the first embodiment in this point. The liquid discharge path is provided, for example, on a holding plate 155 (see FIG. 4), and a pump is connected to the liquid discharge path. [0077] Since the fixed cup 200 is configured as described above, when the negative-type developing liquid from the wafer W collides with the inner peripheral surface side than the recess 202 of the outer inclined surface 201, the collision occurs along the edge. The negative-type developing liquid moving toward the outer inclined surface 201 is discharged through the recess 202, the communication path 203, and the like. Therefore, since the negative-type developing solution that moves along the outer inclined surface 201 of the fixed cup 200 and reaches between the distribution portion 152a and the fixed cup 154 can be reduced, the negative-type developing solution and the positive-type developing solution can be more surely prevented. The case where the liquid is mixed and recovered. [0078] (Third Embodiment) Next, the configuration of a development processing device 30 according to a third embodiment of the present invention will be described with reference to FIG. 13. As shown in FIG. 13, the fixed cup 210 of the development processing device 30 according to the third embodiment is located on the inner peripheral side of the step 154d of the outer inclined surface 211 and has a ring-shaped elastic member 212. The elastic member 212 is formed to have an upper surface continuous with the inclined surface 211 on the outer side of the fixed cup 210 and extends toward the outer peripheral side to cover the upper end of the inner peripheral side of the distribution portion 152a when the movable cup 152 descends, This is different from the fixed cup 154 of the first embodiment. [0079] The development processing device 30 according to this embodiment includes the above-mentioned elastic member 212, whereby the negative-type development liquid does not flow from between the inner peripheral side end of the distribution portion 152a and the fixed cup 210. Therefore, in the present development processing apparatus 30, it is possible to more reliably prevent a situation where the negative-type developing solution and the positive-type developing solution are mixed and recovered. [0080] (Reference Example) The configuration of a development processing device according to a reference example will be described with reference to FIG. 14. As shown in FIG. 14, the development processing device of this example has the same shape as the fixed cup 601, and differs from the development processing device 30 of the first embodiment in this point. In addition, the movable cup 602 of the development processing device 600 is configured such that the front end of the inner peripheral side of the distribution portion 603 can be extended in the inner peripheral direction, and is different from the development processing device 30 of the first embodiment in this point.工程 The process of discharging the positive-type developing solution during the positive-type developing process in the developing-type processing apparatus of this example is the same as the developing-process device 30 of the first embodiment. [0081] In the development processing apparatus of this example, as described above, the inner peripheral side tip of the distribution portion 603 of the movable cup 602 can be extended in the inner peripheral direction. Therefore, during the negative development processing, After the movable cup 602 is lowered, the front end of the inner peripheral side of the distribution portion 603 may be positioned on the inner peripheral side than the outer peripheral end of the wafer W. Accordingly, the negative-type developing liquid does not flow between the distribution portion 603 of the movable cup 602 and the fixed cup 601. Therefore, in the development processing apparatus of this example, it is possible to more surely prevent the case where the negative-type developing solution and the positive-type developing solution are mixed and recovered. [0082] In the above, the example has been described with an example in which the present invention is applied to a development processing apparatus. However, as long as two types of processing liquids and the same module are used for each substrate processing, the substrate processing is performed separately. Those who collect each processing liquid can also apply the present invention to a substrate processing apparatus other than a development processing apparatus. In the above example, although the recovery path of the positive-type developing solution is set to the inner peripheral side and the recovery path of the negative-type developing solution is set to the outer peripheral side, the positive-type developing solution may be set to the outer periphery. The path is set to the outer peripheral side and the collection path of the negative-type developing solution is set to the inner peripheral side. [0083] Although the preferred embodiments of the present invention have been described with reference to the accompanying drawings, the present invention is not limited to this example. As long as it is a person with ordinary knowledge in the technical field to which the present invention pertains, it is obvious that various modifications or amendments can be considered within the scope of the ideas described in the scope of the patent application, and it is understood that these naturally belong to the technical scope of the present invention. The present invention is not limited to this example, and various aspects can be adopted. The present invention can also be applied to a case where the substrate is a FPD (Flat Panel Display) other than a wafer, a mask reticle, and other substrates. [Industrial Applicability] 008 [0084] The present invention is useful when a substrate is processed according to the type by using a plurality of types of processing liquids (for example, a developing liquid).

[0085]

1‧‧‧ substrate processing system

30‧‧‧Development processing device

140‧‧‧Rotary chuck

142‧‧‧Lifting drive mechanism

150‧‧‧cup

151‧‧‧cup body

152‧‧‧movable cup

152a‧‧‧ Distribution Department

153‧‧‧ cup base

153a‧‧‧outer wall

153c‧‧‧ bottom wall

153h‧‧‧Recycling port for negative type

154, 200, 210‧‧‧ fixed cup

154b, 201, 211‧‧‧ outside slope

154d‧‧‧step

165‧‧‧Positive developer supply nozzle

168‧‧‧ Negative developer supply nozzle

171‧‧‧Positive type flushing liquid supply nozzle

174‧‧‧Flushing nozzle for negative type

202‧‧‧Concave

203‧‧‧connection path

212‧‧‧Elastic member

300‧‧‧ Control Department

[0019] [FIG. 1] A schematic plan view showing a configuration of a substrate processing system equipped with a development processing apparatus according to this embodiment. [Fig. 2] A schematic front view schematically showing the configuration of the substrate processing system of Fig. 1. [Fig. 3] A schematic rear view schematically showing the configuration of the substrate processing system of Fig. 1. [FIG. 4] A schematic longitudinal cross-sectional view schematically showing the configuration of a development processing apparatus according to a first embodiment of the present invention. [FIG. 5] A schematic cross-sectional view schematically showing the configuration of a development processing apparatus according to a first embodiment of the present invention. [Fig. 6] An explanatory view showing a state where a liquid accumulation of a developing solution is formed on a wafer, as viewed from the side. [Fig. 7] An explanatory view showing a side view of a state in which a liquid accumulated in a developing solution is diffused in a peripheral direction on a wafer. [Fig. 8] An explanatory view showing a side view of a state in which a liquid accumulated in a developing solution is diffused in a peripheral direction on a wafer. [Fig. 9] An explanatory cross-sectional view schematically showing a state of a recovery cup at the time of positive-type development processing. [Fig. 10] An explanatory cross-sectional view schematically showing a state of a recovery cup during a negative development process. [Fig. 11] An explanatory sectional view showing a state of a boundary portion between a fixed cup and a movable cup in a recovery cup at the time of negative-type development processing. [FIG. 12] An explanatory sectional view of a developing processing apparatus according to a second embodiment of the present invention. [FIG. 13] An explanatory sectional view of a developing processing apparatus according to a third embodiment of the present invention. [Fig. 14] An explanatory diagram of a development processing device of a reference example. [Fig. 15] An explanatory cross-sectional view showing a state of a recovery cup during a positive development process in a conventional development processing apparatus. [Fig. 16] An explanatory cross-sectional view showing a state of a recovery cup during negative development processing in a conventional development processing apparatus. [Fig. 17] An explanatory diagram of a problem in a conventional development processing device. [Fig. 18] Other explanatory diagrams of the problems in the conventional development processing apparatus.

Claims (6)

A substrate processing apparatus is configured to supply a first processing liquid or a second processing liquid to a substrate rotatably supported around a vertical axis to process the substrate, and to recover the processing liquid from the substrate in a recovery cup. The substrate processing device includes: The feature is that the recovery cup is provided with: a cup main body having a ring-shaped outer peripheral wall that is larger than the substrate; a ring-shaped inner structure having an upper end formed by a first inclined surface that gradually decreases toward the outer peripheral side. An outer peripheral surface; and a bottom wall, the recovery port of the first treatment liquid is provided on the inner peripheral side, and the recovery port of the second treatment liquid is provided on the outer peripheral side; and the movable cup has a distribution portion at an upper end and is provided as The upper portion of the cup body is movable up and down between the outer peripheral wall and the inner structure. The distribution portion has an upper surface formed by a second inclined surface that gradually becomes lower toward the outer peripheral side. The first treatment liquid is guided from between the distribution portion and the internal structure to the recovery port of the first treatment liquid so that the movable cup In a descending manner, the second treatment liquid is guided from between the distribution portion and the outer peripheral wall to the recovery port of the second treatment liquid. The cup body has a step at the outer peripheral end of the first inclined surface. When the movable cup is lowered, the inner peripheral side end of the distribution portion is lowered to the step, the upper surface of the distribution portion becomes lower than the surface forming the upper side of the step, and the angle of the second inclined surface of the distribution portion Is greater than the angle of the first inclined surface. For example, the substrate processing apparatus according to item 1 of the patent application range, wherein the second inclined surface of the distribution section is inclined at an angle greater on the outer peripheral side than on the inner peripheral side. For example, the substrate processing apparatus according to item 1 or 2 of the patent application scope, wherein the inner peripheral side end of the distribution portion is formed to be gradually thinner toward the inner peripheral side. For example, the substrate processing apparatus according to item 1 or 2 of the patent application scope, wherein: the cup body has a recess formed on an inner peripheral side than the step of the first inclined surface; and a communication path communicating the Dimples and drain paths. For example, the substrate processing apparatus of claim 1 or 2, wherein has an elastic member on the inner peripheral side than the step of the first inclined surface, the elastic member has an upper surface continuous with the first inclined surface And extends toward the outer peripheral side to cover the upper side of the inner peripheral side end of the distribution portion when the movable cup is lowered. A substrate processing method for supplying a first processing liquid or a second processing liquid to a substrate supported rotatably about a vertical axis to process the substrate, and recovering the processing liquid from the substrate with a recovery cup. The substrate processing method includes: The feature is that the recovery cup is provided with: a cup main body having a ring-shaped outer peripheral wall that is larger than the substrate; a ring-shaped inner structure having an upper end formed by a first inclined surface that gradually decreases toward the outer peripheral side. An outer peripheral surface; and a bottom wall, the recovery port of the first treatment liquid is provided on the inner peripheral side, and the recovery port of the second treatment liquid is provided on the outer peripheral side; and the movable cup has a distribution portion at an upper end and is provided as The cup body can move up and down between the outer peripheral wall of the cup body and the inner structure. The distribution portion is formed by a second inclined surface that gradually becomes lower toward the outer peripheral side. The cup body is attached to the first inclination. The outer peripheral side of the surface has a step difference. 面 The angle of the second inclined surface of the distribution portion is larger than the angle of the first inclined surface. The substrate processing method, when the substrate is processed with the first processing liquid, includes: (i) raising the movable cup and placing an inner peripheral side end of the distribution portion above the substrate; (ii) processing the first The process of supplying the liquid to the substrate; and the process of rotating the substrate to guide the first processing liquid on the substrate from the distribution portion and the internal structure to the recovery port of the first processing liquid. When the second processing liquid processes the substrate, the method includes: lowering the movable cup and lowering an inner peripheral side end of the distribution portion to the level difference, and an upper surface of the distribution portion becomes higher than a level above the level difference. A process with a low surface; a process of supplying the second processing liquid to the substrate; and rotating the substrate to guide the second processing liquid on the substrate from the distribution portion and the outer peripheral wall to the second Process for the recovery of processing liquid.