TWI799290B - Substrate processing apparatus and substrate processing method - Google Patents

Abstract

Even when supplying the rotatably supported substrate with the first or In the substrate processing method in which the substrate is treated with the second processing liquid, when the process of rotating the substrate at a low speed is included, the processing liquid from the substrate is also recovered by type.

In the image processing device, it is in the positive type image processing On the occasion, the distributing part (152a) is raised, and the positive developer from the wafer (W) is guided from between the distributing part (152a) and the fixed cup (154) to the recovery port for the positive type. During the developing process, the distributing part (152a) is lowered, and the negative-type developing liquid from the wafer (W) is guided to the negative-type recovery port from between the distributing part (152a) and the peripheral wall (153a). When the distributing part (152a) descends, the step (154d) where the inner peripheral side end of the distributing part (152a) descends is formed on the outer peripheral end of the fixed cup (154b), so that during the negative image development process, the negative The type developer is not guided to the recovery port for positive type, and the angle α of the upper surface of the distributing portion (152a) is formed larger than the angle β of the inclined surface forming the upper portion of the step (154d).

Description

Substrate processing apparatus and substrate processing method

The present invention relates to a substrate processing apparatus and a substrate processing method for supplying a processing liquid such as a developing liquid to a rotatably supported substrate to process the substrate.

For example, in the photolithography engineering of the manufacturing process of semiconductor elements, for example, the following processes are carried out in sequence to form a predetermined photoresist pattern on the wafer: photoresist coating process, coating photoresist liquid on the substrate as A photoresist film is formed on a semiconductor wafer (hereinafter referred to as "wafer"); exposure treatment, exposing a predetermined pattern to the photoresist film; heat treatment (post exposure baking (post exposure baking)), in After the exposure, the chemical reaction in the photoresist film is promoted; the development process uses the developer solution to develop the exposed photoresist film.

As the photoresist liquid, there are: a positive type photoresist liquid, which removes the exposed part during the development process; and a negative type photoresist liquid, which removes the unexposed part during the development process. In addition, as the developer, there are a positive-type developer and a negative-type developer corresponding to the positive-type resist and the negative-type resist, respectively.

In Patent Document 1, it is disclosed that there is a development process caused by a positive developing solution and a developing process caused by a negative developing solution using the same module. Reasonable image processing device. As shown in FIGS. 15 and 16 , this image development processing apparatus includes a collection cup 501 for collecting the developer solution scattered as the wafer W is rotated. The recovery cup 501 has: a cup body 502; and a movable cup 503, which can move up and down the cup body 502, that is, the wafer W. In the development processing apparatus of Patent Document 1, as shown in FIG. 15 , during the positive-type development processing, the movable cup 503 is raised, whereby the positive-type developing liquid scattered from the rotating wafer W is released. It passes through the lower side of the movable cup 503 and is introduced into the inner flow path 504 of the cup body 502 . Also, as shown in FIG. 16, during the negative tone developing process, the movable cup 503 is lowered, whereby the negative tone developing liquid scattered from the rotating wafer W passes through the upper side of the movable cup 503 and is introduced into the upper side of the movable cup 503. The outer flow path 505 of the cup body 502 . Thereby, the drainage of the positive-type developer and the drainage of the negative-type developer are collected separately without being mixed. Recycling is mentioned as a purpose of collecting separately.

Also, as a method of developing processing, a developing method is proposed, which includes: a process of holding the exposed substrate horizontally on the substrate holding portion; supplying the developing solution to a part of the substrate from the developing solution nozzle to The process of forming the liquid accumulation; the process of rotating the substrate; moving the developer nozzle in such a manner that the supply position of the developing liquid in the rotating substrate is moved along the radial direction of the substrate, so that the liquid accumulation is formed between the substrates The process of expanding the entire surface; and the process of expanding the liquid accumulation on the entire surface of the substrate in parallel, and moving together with the developer nozzle to make the contact portion contact the liquid accumulation. The contact portion is opposite to the substrate. The surface is smaller than the surface of the substrate (Patent Document 2). In this developing method, in the process of spreading the accumulated liquid of the developer over the entire surface of the substrate, the rotational speed of the substrate is set to be 100 rpm or less.

[Prior Art Literature]

[Patent Document]

[Patent Document 1] Japanese Unexamined Patent Publication No. 2014-75575

[Patent Document 2] Japanese Unexamined Patent Publication No. 2015-53467

However, in the case where the same module is used to perform the development process by the positive-type developer and the development process by the negative-type developer, we consider adopting the method disclosed in Patent Document 2 as the development process. The composition of the method. However, in this configuration, when a conventional method such as the method disclosed in Patent Document 1 is used as a method of recovering the drainage of the positive-type developer and the drainage of the negative-type developer separately, there are the following The problem.

That is, as described above, in the development process method disclosed in Patent Document 2, there is a process in which the rotation speed of the wafer coated with the developer solution is slowed down to 100 rpm or less. In the case of this slow process, as shown in FIG. 16, there is a situation as follows: Even if the movable cup 503 is lowered, it is impossible to introduce the negative-type developing solution into the outer flow path 505 and introduce it into the positive-type developing system. The inner flow path 504 causes the discharge of the positive-type developer and the discharge of the negative-type developer to be mixed.

As a mechanism by which the above-mentioned mixing occurs, the following are considered, for example.

We believe that, as shown in Figure 17, when the rotation speed of the wafer W is relatively slow At this time, the negative-type developing liquid D on the wafer W will not be thrown off and fall onto the cup body 502, and be introduced into the inner flow path 504 for the positive-type developing system from between the cup body 502 and the movable cup 503 .

Also, we believe that, as shown in FIG. 18 , when the rotation speed of the wafer W is slow, the negative-tone developer D will wrap around to the back of the wafer W. In such a state, when the negative-type developer D is discarded, the trajectory of the discarded developer becomes lower than in the general case. Therefore, the discarded developer collides with the inner peripheral end of the movable cup 503 or the cup body 502, and is introduced into the inner flow path 504 for the positive imaging system from between the cup body 502 and the movable cup 503.

We think that even other substrate processing apparatuses that use two types of processing liquids to process individual substrates in the same module and recover each processing liquid separately have the same problem.

The present invention is conducted in view of this point, and aims at the following: to process the substrate by supplying the first processing liquid or the second processing liquid to the rotatably supported substrate, and recover the waste from the substrate according to the type. In the processing liquid substrate processing apparatus, even when the substrate processing includes the process of rotating the substrate at a low speed, the processing liquid from the substrate can be collected by type.

In order to achieve the aforementioned object, the present invention provides a substrate processing apparatus that supplies a first processing liquid or a second processing liquid to a substrate supported rotatably around a vertical axis to process the substrate, and returns the substrate with a recovery cup. The processing liquid from the above-mentioned substrate is collected, and the substrate processing device is characterized in that the above-mentioned recovery cup is equipped with: a cup body, which has: an annular outer peripheral wall, which is larger than the aforementioned substrate; The first inclined surface that gradually becomes lower on the outer peripheral side forms an outer peripheral surface at the upper end; and a bottom wall, the recovery port of the first treatment liquid is arranged on the inner peripheral side, and the recovery port of the second processing liquid is arranged on the outer peripheral side; And the movable cup has a distributing part at the upper end, and is arranged to move up and down between the aforementioned outer peripheral wall of the aforementioned cup body and the aforementioned internal structure, and the distributing part is a second inclined surface that gradually becomes lower toward the outer peripheral side The upper surface is formed so that the movable cup is raised, the first treatment liquid is guided from between the distribution part and the internal structure to the recovery port of the first treatment liquid, and the movable cup is lowered. , leading the second treatment liquid from between the distribution part and the outer peripheral wall to the recovery port of the second treatment liquid. When the cup is lowered, the inner peripheral end of the distribution part falls to the aforementioned step, and the top surface of the distribution part becomes lower than the surface above the step. The angle of the second inclined surface of the distribution part is equal to The angle of the first inclined surface is large.

It is preferable that the second inclined surface of the distribution portion has a larger inclination angle on the outer peripheral side than on the inner peripheral side.

It is preferable that the inner peripheral end of the distribution portion is formed so as to gradually become thinner toward the inner peripheral side.

It is preferable that the aforementioned cup body has the following: the recess is formed on the inner peripheral side of the aforementioned step of the aforementioned first inclined surface; and A communication path communicates the recess with the liquid discharge path.

There is an elastic member on the inner peripheral side of the step difference of the first inclined surface. The elastic member has an upper surface continuous with the first inclined surface and extends toward the outer peripheral side to cover the distribution when the movable cup is lowered. It is better to be above the inner peripheral side end of the part.

According to another aspect of the present invention, there is provided a substrate processing method in which a substrate supported rotatably around a vertical axis is supplied with a first processing liquid or a second processing liquid to process the substrate, and recovery cups from the substrate are recovered. The treatment liquid, the substrate processing method, is characterized in that the aforementioned recovery cup is equipped with: the cup body has: an annular outer peripheral wall, which is larger than the aforementioned substrate; an annular inner structure gradually becomes lower toward the outer peripheral side The first inclined surface is formed with the outer peripheral surface of the upper end; and the bottom wall, the recovery port of the aforementioned first treatment liquid is arranged on the inner peripheral side, and the recovery port of the aforementioned second processing liquid is arranged on the outer peripheral side; and the movable cup is in the The upper end has a distributing part, and is arranged to be able to move up and down between the aforementioned outer peripheral wall of the aforementioned cup body and the aforementioned internal structure. The cup body has a step difference at the outer peripheral end of the first inclined surface, and the angle of the second inclined surface of the distribution part is larger than the angle of the first inclined surface. The substrate processing method is based on the aforementioned When the first processing liquid processes the substrate, it includes: a process of raising the movable cup so that the inner peripheral end of the distribution part is positioned above the substrate; a process of supplying the first processing liquid to the substrate; and rotating the substrate to guide the first processing liquid on the substrate from between the distribution unit and the internal structure to the first processing liquid The process of the recovery port, when treating the aforementioned substrate with the aforementioned second processing liquid, includes: lowering the aforementioned movable cup, and lowering the inner peripheral side end of the aforementioned distribution part to the aforementioned step, and the upper surface of the aforementioned distribution part becomes A process of obtaining a lower surface than the upper surface on which the step is formed; a process of supplying the second processing liquid to the substrate; and rotating the substrate to transfer the second processing liquid on the substrate from the distribution part to the outer periphery The process of guiding the recovery port of the aforementioned second treatment liquid between the walls.

According to the present invention, in the substrate processing apparatus that supplies the first processing liquid or the second processing liquid to the rotatably supported substrate to process the substrate, and recovers the processing liquid from the substrate according to the type, even if the substrate processing includes using In the case of the process where the substrate rotates at a low speed, the processing liquid from the substrate can also be recovered by type.

1: Substrate processing system

30: Imaging processing device

140: Rotary Chuck

142: Lifting drive mechanism

150: Cup

151: cup body

152: movable cup

152a: Distribution Department

153: cup matrix

153a: peripheral wall

153c: bottom wall

153h: Recovery port for negative type

154, 200, 210: fixed cup

154b, 201, 211: outer inclined surface

154d: Step difference

165: Positive type developer supply nozzle

168: Negative developer supply nozzle

171: Rinsing liquid supply nozzle for positive type

174: Negative rinse liquid supply nozzle

202: Recess

203: Connected path

212: Elastic member

300: control department

[FIG. 1] It is a plan view which shows the outline of the structure of the substrate processing system equipped with the image development processing apparatus of this embodiment.

[ Fig. 2] Fig. 2 is a front view schematically showing the outline of the configuration of the substrate processing system of Fig. 1 .

[ Fig. 3] Fig. 3 is a rear view schematically showing the outline of the configuration of the substrate processing system of Fig. 1 .

[ Fig. 4 ] Schematically showing the development process of the first embodiment of the present invention A schematic longitudinal sectional view of the structure of the device.

[ Fig. 5] Fig. 5 is a cross-sectional view schematically showing the outline of the configuration of the image processing apparatus according to the first embodiment of the present invention.

[ Fig. 6] Fig. 6 is an explanatory diagram showing a state in which a developer solution accumulation is formed on a wafer, viewed from the side.

[ Fig. 7] Fig. 7 is an explanatory diagram showing a state in which a developer solution is spread in the outer peripheral direction on a wafer, viewed from the side.

[ Fig. 8] Fig. 8 is an explanatory diagram showing a state in which a developer solution is diffused in the outer peripheral direction on a wafer, viewed from the side.

[ Fig. 9 ] An explanatory cross-sectional view schematically showing the state of recovering cups at the time of positive-type development processing.

[ Fig. 10 ] An explanatory cross-sectional view schematically showing a state of recovering cups during negative tone development.

[ Fig. 11] Fig. 11 is an explanatory cross-sectional view showing the state of the boundary portion between the fixed cup and the movable cup among the recovered cups during the negative tone development process.

[ Fig. 12 ] An explanatory cross-sectional view of a development processing device according to a second embodiment of the present invention.

[ Fig. 13 ] An explanatory sectional view of a development processing device according to a third embodiment of the present invention.

[ Fig. 14 ] An explanatory diagram of a development processing device of a reference example.

[ Fig. 15] Fig. 15 is an explanatory cross-sectional view showing a state of recovering cups during positive-type developing processing in a conventional developing processing apparatus.

[ Fig. 16] Fig. 16 is an explanatory cross-sectional view showing a state of recovering cups during negative tone developing processing in a conventional developing processing apparatus.

[ Fig. 17 ] An explanatory diagram of problems in a conventional image processing device.

[FIG. 18] Another explanatory drawing of the problem in the conventional image processing apparatus.

Embodiments of the present invention will be described below. In addition, in this specification and drawings, the same code|symbol is attached|subjected to the element which has substantially the same functional structure, and repeated description is abbreviate|omitted.

FIG. 1 is an explanatory plan view schematically showing the outline of the configuration of a substrate processing system 1 including an image development processing apparatus according to the present embodiment. 2 and 3 are respectively front views and rear views schematically showing the outline of the internal configuration of the substrate processing system 1 .

The substrate processing system 1, as shown in FIG. 1 , has a configuration in which the following are integrally connected: a cassette station 10 for loading and unloading a cassette C accommodating a plurality of wafers W; A plurality of various processing apparatuses that perform predetermined processing on the circle W; and an interface station 13 that transfers wafers W to and from the exposure apparatus 12 adjacent to the processing station 11 .

In the cassette station 10, a cassette mounting table 20 is provided. The cassette mounting table 20 is provided with a plurality of cassette mounting plates 21 on which the cassettes C are loaded when loading and unloading the cassettes C to the outside of the substrate processing system 1 .

In the cassette station 10 , as shown in FIG. 1 , a wafer transfer device 23 movably provided on a transfer path 22 extending in the X direction is provided. The wafer transfer device 23 can also move freely in the vertical direction and around the vertical axis (theta direction), and can move between the cassettes C on each cassette loading plate 21 and the processing station described later. 11. The wafer W is transferred between receiving and receiving devices in the third block G3.

In the processing station 11, a plurality of, for example, four blocks equipped with various devices, that is, the first block G1 to the fourth block G4 are installed. For example, on the front side of the processing station 11 (in the negative direction of the X direction in FIG. 1 ), a first block G1 is provided, and on the back side of the processing station 11 (in the positive direction of the X direction in FIG. 1 , on the upper side of the drawing). ), is provided with the second block G2. Also, on the cassette station 10 side of the processing station 11 (the negative direction side of the Y direction in FIG. 1 ), the third block G3 already described is set, positive direction side), the fourth block G4 is provided.

For example, in the first block G1, as shown in FIG. 2, a plurality of liquid processing devices are arranged in the following order from below, such as: a development processing device 30, which performs development processing on the wafer W; Forming device 31 forms an anti-reflection film (hereinafter referred to as "bottom anti-reflection film") on the lower layer of the photoresist film of wafer W; photoresist coating device 32 applies photoresist liquid to wafer W to form photoresist a resist film; and an upper anti-reflection film forming device 33 for forming an anti-reflection film (hereinafter referred to as "upper anti-reflection film") on the upper layer of the photoresist film of the wafer W.

For example, three development processing devices 30 , lower anti-reflection film forming devices 31 , photoresist coating devices 32 , and upper anti-reflection film forming devices 33 are arranged horizontally. In addition, the number and arrangement of the development processing devices 30, lower anti-reflection film forming devices 31, photoresist coating devices 32, and upper anti-reflection film forming devices 33 can be selected arbitrarily.

In the lower anti-reflection film forming device 31, the photoresist coating device 32, and the upper anti-reflection film forming device 33, for example: Spin coating is used to apply a predetermined coating liquid on the wafer W. In spin coating, for example, a coating liquid is discharged onto the wafer W from a coating nozzle, and the wafer W is rotated to spread the coating liquid on the surface of the wafer W. In addition, the configuration of the image processing device 30 will be described later.

For example, in the second block G2, as shown in FIG. 3 , a plurality of heat treatment apparatuses 40 to 43 are installed, and heat treatment such as heating and cooling of the wafer W is performed.

For example, in the third block G3, as shown in FIG. 2 and FIG. 3 , a plurality of transmitting and receiving devices 50, 51, 52, 53, 54, 55, and 56 are sequentially installed from below. In addition, in the fourth block G4, as shown in FIG. 3 , a plurality of transmitting and receiving devices 60, 61, and 62 are sequentially installed from below.

As shown in FIG. 1 , a wafer transfer area D is formed in the area surrounded by the first block G1 to the fourth block G4 . In the wafer transfer area D, a plurality of wafer transfer devices 70 are arranged, and have transfer arms that are movable in, for example, the Y direction, the X direction, the θ direction, and the vertical direction. The wafer transfer device 70 is moved in the wafer transfer area D, and can be arranged in the first block G1, the second block G2, the third block G3 and the fourth block G4 located in the surrounding area. The wafer W is transferred between devices.

In addition, in the wafer transfer area D, as shown in FIG. 3 , there is provided a shuttle transfer device 80 that transfers the wafer W linearly between the third block G3 and the fourth block G4.

The shuttle conveyance device 80 is, for example, movable linearly in the Y direction in FIG. 3 . The shuttle transfer device 80 can move along the Y direction under the state of supporting the wafer W, and is connected between the receiving and receiving device 52 of the third block G3 and the fourth block G3. The wafer W is transferred between the receivers 62 of the block G4.

As shown in FIG. 1 , a wafer transfer device 100 is provided on the side of the third block G3 in the positive direction in the X direction. The wafer transfer apparatus 100 includes a transfer arm that is movable in, for example, the X direction, the θ direction, and the vertical direction. The wafer transfer device 100 is capable of moving up and down while supporting the wafer W, and transfers the wafer W to each transfer device in the third block G3.

In the interface station 13, a wafer transfer device 110 and a receiver device 111 are provided. The wafer transfer device 110 has a transfer arm that is movable in, for example, the Y direction, the θ direction, and the vertical direction. The wafer transfer device 110 can, for example, support the wafer W on a transfer arm, and transfer the wafer W between the receiving and receiving devices, the receiving and receiving device 111 and the exposure device 12 in the fourth block G4.

In the substrate processing system 1 described above, as shown in FIG. 1 , a control unit 300 is provided. The control unit 300 is, for example, a computer, and has a program storage unit (not shown). A program for controlling the processing of the wafer W in the substrate processing system 1 is stored in the program storage unit. Moreover, in the program storage part, there are also stored the actions of the driving systems for controlling the above-mentioned various processing devices or conveying devices, and even control the nozzle driving parts 166, 169, 172, 175 or the lifting part 156, etc. described later. In the substrate processing system 1, the program of the development process which will be described later. In addition, the aforementioned program can also be recorded on a computer-readable hard disk (HD), floppy disk (FD), compact disk (CD), magneto-optical disk (MO), memory card, etc. storage medium, and the storage medium is installed in the control unit 300 .

Next, an overview of wafer processing performed using the substrate processing system 1 configured as described above will be described. First, plurals are included The cassette C containing wafers W is carried into the cassette station 10 of the substrate processing system 1, and each wafer W in the cassette C is sequentially transported to the receiving and receiving device of the processing station 11 by the wafer transfer device 23 53.

Next, the wafer W is transferred to the heat treatment device 40 of the second block G2 by the wafer transfer device 70, and subjected to temperature adjustment treatment. Thereafter, the wafer W is transferred to, for example, the lower antireflection film forming device 31 of the first block G1 by the wafer transfer device 70 , and the lower antireflection film is formed on the wafer W. Thereafter, the wafer W is transported to the heat treatment apparatus 41 of the second block G2, and subjected to heat treatment.

Thereafter, the wafer W is transferred to the heat treatment device 42 of the second block G2 by the wafer transfer device 70, and subjected to temperature adjustment treatment. Thereafter, the wafer W is transferred to the photoresist coating device 32 of the first block G1 by the wafer transfer device 70 , and a photoresist film is formed on the wafer W. Thereafter, the wafer W is transported to the heat treatment device 43 and subjected to pre-baking treatment.

Next, the wafer W is transported to the upper anti-reflection film forming device 33 in the first block G1, and an upper anti-reflection film is formed on the wafer W. Thereafter, the wafer W is transferred to the heat treatment apparatus 43 in the second block G2, and heat-treated. Thereafter, the wafer W is transferred to the receiver 56 of the third block G3 by the wafer transfer device 70 .

Next, the wafer W is transferred to the receiver 52 by the wafer transfer device 100 , and is transferred to the receiver 62 of the fourth block G4 by the shuttle transfer device 80 . Thereafter, the wafer W is transferred to the exposure device 12 by the wafer transfer device 110 of the interface station 13, and is subjected to exposure processing with a predetermined pattern.

Next, the wafer W is transferred to the heat treatment device 40 by the wafer transfer device 70, and is subjected to post-exposure baking treatment. Thereby, the deprotection reaction proceeds by the acid generated in the exposed portion of the photoresist film. Then, the wafer W is transferred to the development processing device 30 by the wafer transfer device 70, and the development processing is performed.

(first embodiment)

Next, the configuration of the image processing device 30 according to the first embodiment of the present invention will be described using FIG. 4 and FIG. 5 . The image development processing device 30, as shown in FIG. 4, has a processing container 130 whose interior can be sealed. A loading and unloading port (not shown) for the wafer W is formed on a side surface of the processing container 130 .

Inside the processing container 130, a spin chuck 140 for holding the wafer W and rotating it about the vertical axis O is provided. The rotary chuck 140 can be rotated to a predetermined speed by a chuck driving part 141 such as a motor. In addition, the chuck drive unit 141 is provided with an elevating drive mechanism 142 such as an air cylinder, and the rotary chuck 140 can be moved up and down freely.

The cup 150 is provided so as to surround the wafer W held by the spin chuck 140 . The cup 150 catches and recovers the liquid scattered or dropped from the wafer W. The details of the cup 150 will be described later.

As shown in FIG. 5 , guide rails 160A to 160D extending along the Y direction (left and right directions in FIG. 5 ) are formed on the negative X direction (downward direction in FIG. 5 ) side of the cup 150 . The guide rails 160A~160D are, for example, formed from the outside of the cup 150 in the negative direction of the Y direction (the left direction in FIG. 5 ) to the Y direction. To the outside of the positive direction (right direction in Fig. 5). Support arms 161 , 162 , 163 , 164 are mounted on the guide rails 160A, 160B, 160C, and 160D, respectively.

The first arm portion 161 supports a positive-type developer supply nozzle 165 for supplying a positive-type developer as an example of the “first processing liquid”. The first arm portion 161 is freely movable on the guide rail 160A by the nozzle driving portion 166 . Accordingly, the positive-type developer supply nozzle 165 can be moved from the standby portion 167 provided outside the cup 150 on the negative side in the Y direction to above the center of the wafer W in the cup 150 . Moreover, the first arm part 161 can be moved up and down freely by the nozzle driving part 166, and the height of the positive-type developer supply nozzle 165 can be adjusted. As a positive-tone developer, for example, tetramethylammonium hydroxide (TMAH) is used.

The positive-type developer supply nozzle 165 has a cylindrical shape as a whole, and its lower end surface 165a is formed as a flat surface parallel to the wafer W, for example, as shown in FIG. 6 described later. The lower end surface 165a functions as a liquid-contacting surface in contact with the positive-type developer. Also, a supply hole for supplying the developer is formed on the lower end surface 165a. The number of supply holes may be selected arbitrarily, and may be one or plural.

Furthermore, the diameter of the positive-type developer supply nozzle 165 is configured to be smaller than the diameter of the wafer W. When the diameter of the wafer W is 300 mm, the diameter of the nozzle 165 is, for example, 40 mm. Moreover, the positive-type developer supply nozzle 165 is made of a chemical-resistant material such as PTFE or quartz.

In the second arm part 162, it is supported to supply the "second processing liquid" One example is a negative-type developer supply nozzle 168 for a negative-type developer. For the negative-type developer supply nozzle 168, for example, one having the same shape, size, and structure as the positive-type developer supply nozzle 165 can be used.

The second arm part 162 is freely movable on the guide rail 160D by the nozzle driving part 169 . Thereby, the negative-tone developer supply nozzle 168 can be moved from the standby portion 170 provided outside the cup 150 on the positive side in the Y direction to above the center of the wafer W in the cup 150 . In addition, the second arm portion 162 can be moved up and down freely by the nozzle driving portion 169, and the height of the negative-tone developer supply nozzle 168 can be adjusted. As a negative-tone developer, a developer containing an organic solvent, for example, a developer containing butyl acetate as an ester solvent is used.

On the third arm portion 163, a positive type rinsing liquid supply nozzle 171 for supplying positive type rinsing liquid is supported. The third arm portion 163 is freely movable on the guide rail 160B by the nozzle driving portion 172 . Thereby, the rinse liquid supply nozzle 171 for the positive type can be moved to the wafer in the cup 150 from the standby part 173 provided on the negative side of the cup 150 in the Y direction and between the standby part 167 and the cup 150 Above the center of the W. Furthermore, the third arm portion 163 can be moved up and down freely by the nozzle driving portion 172, and the height of the rinse liquid supply nozzle 171 for positive type can be adjusted. Pure water was used as the rinse solution for the positive type.

The fourth arm portion 164 supports a negative type rinsing liquid supply nozzle 174 for supplying negative type rinsing liquid. The fourth arm portion 164 is freely movable on the guide rail 160C via the nozzle driving portion 175 . Thereby, the negative type rinsing liquid supply nozzle 174 can be set in the positive direction in the Y direction of the cup 150. The standby unit 176 on the side and between the standby unit 170 and the cup 150 moves above the central portion of the wafer W in the cup 150 . Furthermore, the fourth arm portion 164 can be moved up and down freely by the nozzle driving portion 175, and the height of the rinse liquid supply nozzle 174 for negative type can be adjusted. As a rinse solution for negative type, for example, 4-methyl-2-pentanol (MIBC) is used.

Here, an example of positive-type development processing in the development processing device 30 will be described using FIGS. 6 to 8 . In addition, in the following description, a positive photoresist film is formed on the surface of the wafer W, and the photoresist film is exposed.

When positive-type development is performed on wafer W held on spin chuck 140 , first, positive-type developer supply nozzle 165 is moved from standby portion 167 to the center of wafer W. As shown in FIG. Then, as shown in FIG. 6 , the positive-type developer supply nozzle 165 is lowered so that the lower end surface 165 a of the positive-type developer supply nozzle 165 approaches and faces the wafer W. As shown in FIG. Next, the developer is supplied to the wafer W from the positive-type developer supply nozzle 165 while the wafer W is stopped, or while the wafer W is rotated at a rotation speed of 10 rpm or less. Thereby, between the lower end surface 165a of the positive-type developer supply nozzle 165 and the wafer W, a pooled liquid L is formed so as to be in contact with the lower end surface 165a. The discharge flow rate of the developer at this time is, for example, 60 to 600 ml/min.

Next, increase the rotational speed of the wafer W to 30 to 100 rpm, and continue the supply of the developing solution. As shown in FIG. move, so that the effusion L expands on the surface of the wafer W. And, until the end of the lower end surface 165a reaches the periphery of the wafer W, it takes, for example, 2 to 15 seconds, so that The positive-type developer supply nozzle 165 moves to form a pool of liquid L covering the entire surface of the wafer W.

After the liquid accumulation L is formed on the entire surface of the wafer W, the supply of the developer from the positive-type developer supply nozzle 165 and the rotation of the wafer W are stopped, and as shown in FIG. 8 , the positive-type developer is supplied. The nozzle 165 retreats to the standby unit 167 . Then, in a state where the wafer W is stopped, still image development by the liquid accumulation L formed on the wafer W is performed.

After stationary development, the positive type rinse liquid supply nozzle 171 is moved from the standby section 173 to the center of the wafer W. As shown in FIG. Then, pure water is supplied to the wafer W from the nozzle 171 to clean the wafer W. The rotation speed of the wafer W at this time is, for example, 100-1200 rpm.

Then, when the cleaning of the wafer W with pure water is completed, the positive type rinse liquid supply nozzle 171 is retracted, and the wafer W is spin-dried at a high speed of, for example, 2000 rpm. With this, the positive-type developing process ends.

The above-mentioned positive-type development processing is an example, and the positive-type development processing of this embodiment can be applied, and other processes may be included instead of or in addition to the above-mentioned processes. For example, the operation of forming the effusion L to expand the effusion L can also be performed by using a scan-in method instead of a scan-out method. After the developer supply nozzle 165 starts to spit out the positive-type developer, the positive-type developer supply nozzle 165 is moved to the center of the wafer W. In this scanning output mode, the positive-type developer supply nozzle 165 moves from the central portion of the wafer W to the peripheral portion side. Also, scan output and scan input can be used at the same time Way.

The negative tone development process is the same as the positive tone development process, and therefore, its description is omitted.

Return to the description of FIG. 4 .

The cup 150 is equipped with: a cup body 151 ; and a movable cup 152 that can move to the cup body 151 .

The cup body 151 has: a cup base 153 ; and a fixed cup 154 fixed to the cup base 153 .

The cup base 153 has an annular outer peripheral wall 153a and the same annular inner peripheral wall 153b, and the outer peripheral wall 153a and the inner peripheral wall 153b are formed to extend in the vertical direction (vertical direction). The inner diameter of the outer peripheral wall 153a is formed to be larger than the diameter of the wafer W, the outer diameter of the inner peripheral wall 153b is formed to be smaller than the diameter of the wafer W, and the height of the inner peripheral wall 153b is formed to be higher than that of the outer peripheral wall. 153a has a small height.

Also, the cup base 153 has: a bottom wall 153c connecting the lower end of the outer peripheral wall 153a and the lower end of the inner peripheral wall 153b; . The upper end of the inner peripheral wall 153b is provided with a protrusion 153e extending along the inner peripheral direction, and the cup base 153 can be fixed by clamping the protrusion 153e with the fixed cup 154 and the holding plate 155 .

The fixed cup 154 constitutes an annular internal structure located between the outer peripheral wall 153a and the inner peripheral wall 153b. The fixed cup 154 has an annular peripheral wall 154a located between the outer peripheral wall 153a and the inner peripheral wall 153b. Also, the fixed cup 154 is gradually lowered towards the outer peripheral side. The surface (corresponding to the "first inclined surface") 154b is formed with an outer peripheral surface at its upper end. Hereinafter, this inclined surface 154b is referred to as an outer inclined surface 154b. As will be described later, a step is formed on the outer inclined surface 154b. In addition, the lower end of the outer inclined surface 154b is continuous with the outer peripheral surface of the peripheral wall 154a. Furthermore, the fixed cup 154 has an inner inclined surface 154c that gradually becomes lower toward the inner peripheral side on the inner peripheral side than the outer inclined surface 154b.

The movable cup 152 is an annular member that can move up and down between the outer peripheral wall 153a of the cup base 153 and the fixed cup 154, has a distributing portion 152a at the upper end, and has a peripheral wall 152b below the distributing portion 152a. The distributing portion 152a is used to separate and discharge the positive-type developer and the negative-type developer, and its upper surface is formed by an inclined surface (corresponding to a "second inclined surface") 152c that gradually becomes lower toward the outer peripheral side.

The peripheral wall 152b is formed in an annular shape, and its inner diameter is larger than the outer diameter of the peripheral wall 154a of the fixed cup 154, and its outer diameter is smaller than the inner diameter of the outer peripheral wall 153a of the cup base 153. Moreover, the outer peripheral edge of the inclined surface 152c of the distribution part 152a continues to the outer peripheral surface of the peripheral wall 152b.

On the top of the movable cup 152, a lifting part 156 is provided to make the movable cup 152 rise or fall.

Returning to the description of the cup base 153 . On the bottom wall 153c of the cup base 153, two partition walls 153f, 153g are formed in a ring shape between the outer peripheral wall 153a and the inner peripheral wall 153b.

In addition, the bottom wall 153c is formed with a recovery port 153h for negative type, and the negative type developing liquid is recovered between the outer peripheral wall 153a and the partition wall 153f on the outer peripheral side. Moreover, the bottom wall 153c is formed between the partition walls 153f, 153g to form a recycling Positive-type recovery port 153i for positive-type developer; mist recovery port 153j for recovering mistized developer is formed between the partition wall 153g on the inner peripheral side and the inner peripheral wall 153b.

A pump (not shown) and the like are connected to the recovery port 153h for the negative type, the recovery port 153i for the positive type, and the recovery port 153j for the mist.

Next, discharge of the developing liquid during the developing process in the developing processing device 30 will be described using FIGS. 9 to 11 . In addition, the description of the discharge of the mistized developer is omitted.

In the case of positive type development processing, in the development processing device 30, as shown in FIG. 9, the movable cup 152 is raised, and the pump connected to the positive type recovery port 153i is driven.

Thereby, in the development processing device 30, the positive-type developing liquid scattered due to the rotation of the wafer W or the positive-type developing liquid falling back to the lower side of the wafer W can be discharged from the movable cup 152. Between the distributing part 152a and the fixed cup 154, it is guided to the recovery port 153i for positive shape, and is recovered through the recovery port 153i.

On the other hand, in the case of negative tone development processing, in the development processing device 30, as shown in FIG. 10, the movable cup 152 is lowered, and the pump connected to the negative tone recovery port 153h is driven.

Thereby, in the development processing device 30, the negative-type developing liquid scattered substantially horizontally due to the rotation of the wafer W can be guided from between the dispensing portion 152a of the movable cup 152 and the outer peripheral wall 153a of the cup base 153. to the recovery port 153h for the negative type, and is recovered through the recovery port 153h.

Also, as shown in Figure 11, the outer side of the fixed cup 154 is inclined The outer peripheral end of the surface 154b is formed with a step difference 154d. When the movable cup 152 descends, (1) the inner peripheral side end of the distribution portion 152a of the movable cup 152 descends to the step difference 154d. At this time, the distribution portion 152a The upper surface, that is, the inclined surface 152c is lower than the upper surface on which the level difference 154d is formed. Furthermore, (2) the angle α of the inclined surface 152c of the distribution portion 152a is larger than the angle β of the surface forming the upper side of the fixed cup 154 .

With the configuration of (1) above, when the wafer W is rotated, even if the negative-tone developer does not scatter approximately horizontally but scatteres at an angle with respect to the horizontal, the scattered developer does not collide with the dispensing portion. The inner peripheral side end of 152a. Also, with the configuration of (2) above, even if the above-mentioned scattered developer collides with the outer inclined surface 154b of the fixed cup 154, the developer after the collision will not accumulate between the distribution part 152a and the fixed cup 154. And it flows along the inclined surface 152c of the distribution part 152a.

Therefore, in the image development processing apparatus 30 , the negative-type developing liquid scattered or dropped from the wafer W can be more reliably guided to the negative-type recovery port 153h.

Therefore, in the development processing device 30 , even when the low-speed spin process is included in the negative-tone development process, the positive-tone developer and the negative-tone developer can be recovered separately without being mixed.

In addition, it is designed so that the negative-type developer will not flow into the gap between the inner peripheral end of the distributing portion 152a of the movable cup 152 and the lower surface forming the step 154d of the fixed cup 154, that is, The gap narrows.

Also, the inclined surface of the distributing portion 152a of the movable cup 152 152c, it is preferable that the inclination angle γ of the outer peripheral side is larger than the inclination angle α of the inner peripheral side. Thereby, when the negative-tone developer flows along the inclined surface 152c, it can be made to flow more smoothly, and compared with the case where the inclined angle is large, the vertical direction can be suppressed over the entire surface of the inclined surface 152c. size of.

Furthermore, it is preferable that the inner peripheral end of the distribution part 152a of the movable cup 152 is formed to gradually become thinner toward the inner peripheral side. This is because it becomes difficult for the negative-tone developer to accumulate between the inner peripheral end of the distributing portion 152 a of the lowered movable cup 152 and the fixed cup 154 .

After actually manufacturing the movable cup 152 having the above shape, and performing the drainage and separation of the positive developer and the negative developer by moving the movable cup 152 up and down, it can be actually confirmed that even when the wafer W is included, In the case of a process where the rotation speed is 100rpm or less, drainage separation can be performed well.

(Second Embodiment)

Next, using FIG. 12, the structure of the image development processing apparatus 30 concerning the 2nd Embodiment of this invention is demonstrated.

As shown in Figure 12, the fixed cup 200 of the image processing device 30 of the second embodiment is located on the inner peripheral side of the step 154d of the outer inclined surface 201, and has: an annular recess 202; and a communication path 203 It is different from the fixed cup 154 of the first embodiment in that the recess 202 is communicated with a liquid discharge path not shown. The liquid discharge path is provided on, for example, the holding plate 155 (see FIG. 4 ), and a pump is connected to the liquid discharge path.

Since the fixed cup 200 is constituted as above, therefore, in When the negative-type developer from the wafer W collides with the inner peripheral surface side of the recess 202 of the outer inclined surface 201, the negative-type developer that moves along the outer inclined surface 201 after the collision passes through the recess. 202, communication path 203, etc. are discharged. Therefore, since the negative-type developer that moves along the outer inclined surface 201 of the fixed cup 200 and reaches between the distribution portion 152a and the fixed cup 154 can be reduced, it is possible to more reliably prevent the negative-type developer from colliding with the positive-type developer. The case where liquids are mixed and collected.

(third embodiment)

Next, using FIG. 13, the structure of the image development processing apparatus 30 concerning the 3rd Embodiment of this invention is demonstrated.

As shown in FIG. 13 , the fixed cup 210 of the image processing device 30 according to the third embodiment has an annular elastic member 212 on the inner peripheral side of the step 154d of the outer inclined surface 211 . The elastic member 212 is formed to have an upper surface continuous with the outer inclined surface 211 of the fixed cup 210, and extends toward the outer peripheral side to cover the top of the inner peripheral side end of the distribution part 152a when the movable cup 152 is lowered. Above, it is different from the fixed cup 154 of the first embodiment.

In the development processing device 30 of this embodiment, the above-mentioned elastic member 212 is provided so that the negative-tone developer does not flow from between the inner peripheral end of the distribution portion 152a and the fixed cup 210 . Therefore, in the image development processing device 30 , it is possible to more reliably prevent the negative-type developing liquid and the positive-type developing liquid from being mixed and recovered.

(reference example)

Using FIG. 14, the structure of the image processing apparatus concerning a reference example is demonstrated.

As shown in FIG. 14, the image development processing device of this example is different from the image development processing device 30 of the first embodiment in that the shape of the fixed cup 601 is the same as conventional ones. Furthermore, the movable cup 602 of the image processing device 600 is different from the image processing device 30 of the first embodiment in that the front end on the inner peripheral side of the distribution part 603 can extend toward the inner peripheral direction.

The process of discharging the positive-type developing solution during the positive-type developing process in the developing processing device of this example is the same as that of the developing processing device 30 of the first embodiment.

In the image processing device of this example, as mentioned above, since the front end of the inner peripheral side of the distribution part 603 of the movable cup 602 can extend toward the inner peripheral direction, during the negative image image processing, it can be moved After the cup 602 is lowered, the front end on the inner peripheral side of the distributing part 603 is positioned on the inner peripheral side than the outer peripheral end of the wafer W. Thereby, the negative-tone developing liquid does not flow into between the distributing portion 603 of the movable cup 602 and the fixed cup 601 . Therefore, in the image development processing apparatus of this example, it is possible to more reliably prevent the negative-type developing solution and the positive-type developing solution from being mixed and recovered.

In the above, although the example of applying the present invention to the image processing device has been described, as long as two types of processing liquids are used to perform separate substrate processing in the same module, and each processing liquid is recovered separately If liquid is used, the present invention can also be applied to substrate processing apparatuses other than image development processing apparatuses. Also, in the above example, although the collection path of the positive-type developer is set as the inner peripheral side, the recovery path of the negative-type developer is set as the outer periphery. However, it is also possible to set the outer peripheral path of the positive-type developer as the outer peripheral side and the recovery path of the negative-type developer as the inner peripheral side.

As mentioned above, although the suitable embodiment of this invention was demonstrated referring an attached drawing, this invention is not limited to this example. As long as one has ordinary knowledge in the technical field to which the present invention belongs, it is obvious that various changes or amendments can be conceived within the scope of thought described in the scope of the patent application, and it is understood that these also belong to the technical scope of the present invention. The present invention is not limited to this example, and various aspects can be employed. The present invention can also be applied to other substrates such as FPD (Flat Panel Display) and mask reticle for photomasks other than wafers.

[Industrial availability]

The present invention is useful when processing substrates according to types using a plurality of types of processing liquids (for example, developing liquids).

152: movable cup

152a: Distribution Department

152c: inclined surface

154: fixed cup

154b: outside inclined surface

154d: Step difference

W: Wafer

Claims (5)

A substrate processing apparatus, which supplies a first processing liquid or a second processing liquid to a substrate supported rotatably around a vertical axis to process the substrate, and recovers the processing liquid from the substrate with a recovery cup, the substrate processing apparatus, The feature is that the above-mentioned recovery cup is equipped with: a cup body, which has: an annular outer peripheral wall, which is larger than the aforementioned substrate; step; and the bottom wall, the recovery port of the first processing liquid is arranged on the inner peripheral side, and the recovery port of the second processing liquid is arranged on the outer peripheral side; and the movable cup has a distribution part at the upper end, and is arranged as It can move up and down between the aforementioned outer peripheral wall of the aforementioned cup body and the aforementioned internal structure, and the distribution part is formed by a second inclined surface that gradually becomes lower toward the outer peripheral side, so that the movable cup can be raised. The first treatment liquid is guided from between the distribution part and the internal structure to the recovery port of the first treatment liquid, and the second treatment liquid is introduced from the distribution part and the outer periphery in such a manner that the movable cup is lowered. The recovery port leading to the second treatment liquid between the walls, when the movable cup is lowered, the inner peripheral side end of the distribution part is lowered to the step, and the top surface of the distribution part becomes higher than the upper side of the step. The surface is low, and the angle of the aforementioned second inclined surface of the aforementioned distributing part is that the outer peripheral side is larger than the The inside and outside of the surface are large. In the substrate processing apparatus according to claim 1 of the patent claims, the inner peripheral end of the distribution part is formed to gradually become thinner toward the inner peripheral side. The substrate processing apparatus according to claim 1 or 2 of the scope of the patent application, wherein the cup body has: a recess formed on the inner peripheral side of the step difference of the first inclined surface; and a communication path communicating with the first inclined surface. Recesses and drainage paths. The substrate processing apparatus according to claim 1 or 2 of the patent application, wherein an elastic member is provided on the inner peripheral side of the step of the first inclined surface, and the elastic member has an upper surface continuous with the first inclined surface , and extend toward the outer peripheral side to cover the top of the inner peripheral side end of the aforementioned distribution part when the aforementioned movable cup is lowered. A substrate processing method, which is to supply a first processing liquid or a second processing liquid to a substrate supported rotatably around a vertical axis to process the substrate, and recover the processing liquid from the substrate with a recovery cup, the substrate processing method, The feature is that the above-mentioned recovery cup is equipped with: a cup body, which has: an annular outer peripheral wall, which is larger than the aforementioned base plate; an annular internal structure, on the first inclined surface that gradually becomes lower toward the outer peripheral side The outer peripheral end has a step difference; and the bottom wall, the recovery port of the first processing liquid is arranged on the inner peripheral side, and the recovery port of the second processing liquid is arranged on the outer peripheral side; and the movable cup has a distribution part at the upper end, and It is arranged to be able to move up and down between the aforementioned outer peripheral wall of the aforementioned cup body and the aforementioned internal structure, and the upper surface of the distribution portion is formed by a second inclined surface that gradually becomes lower toward the outer peripheral side. The aforementioned second inclined surface of the aforementioned distribution portion The angle of the inclined surface is larger on the outer peripheral side than on the inner peripheral side of the surface. The substrate processing method includes: raising the movable cup and moving the distributing part The process of positioning the inner peripheral side end above the substrate; the process of supplying the first processing liquid to the substrate; and rotating the substrate to transfer the first processing liquid on the substrate from the distribution part and the internal structure The process of guiding the body to the recovery port of the first processing liquid includes: lowering the movable cup and lowering the inner peripheral end of the distribution part to The process of making the upper surface of the distribution part lower than the upper surface of the level difference; the process of supplying the second processing liquid to the substrate; and rotating the substrate to turn the second treatment liquid on the substrate 2. The treatment liquid is guided from between the distribution part and the outer peripheral wall to the recovery of the second treatment liquid Mouth engineering.

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