JP3138897B2 - Rotary substrate processing equipment - Google Patents
Rotary substrate processing equipmentInfo
- Publication number
- JP3138897B2 JP3138897B2 JP25158093A JP25158093A JP3138897B2 JP 3138897 B2 JP3138897 B2 JP 3138897B2 JP 25158093 A JP25158093 A JP 25158093A JP 25158093 A JP25158093 A JP 25158093A JP 3138897 B2 JP3138897 B2 JP 3138897B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- rectifying
- cleaning
- rotary
- square
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
- B05C11/08—Spreading liquid or other fluent material by manipulating the work, e.g. tilting
Landscapes
- Coating Apparatus (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
【産業上の利用分野】本発明は、基板洗浄装置、特に、
角型基板を回転させながらその表面を洗浄液で洗浄する
回転式基板洗浄装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate cleaning apparatus,
The present invention relates to a rotary substrate cleaning apparatus for cleaning a surface of a rectangular substrate with a cleaning liquid while rotating the substrate.
【従来の技術】半導体製造工程や液晶表示装置の製造工
程において、フォトプロセスでパターンを形成する際に
は、基板を洗浄液で洗浄する工程が不可欠である。この
種の基板洗浄工程に用いられる回転式基板洗浄装置は、
基板を真空吸着または機械的に保持する基板保持部と、
基板保持部に保持された基板に対して洗浄液を供給する
洗浄液供給部と、基板保持部を回転させる回転部とを備
えている。この種の回転式基板洗浄装置では、基板保持
部を回転させながら基板に対して洗浄液を供給する。そ
して、洗浄後に液切り乾燥のために基板を高速回転させ
る。2. Description of the Related Art In a semiconductor manufacturing process or a liquid crystal display device manufacturing process, when a pattern is formed by a photo process, a process of cleaning a substrate with a cleaning liquid is indispensable. The rotary type substrate cleaning apparatus used in this type of substrate cleaning process includes:
A substrate holding unit that holds the substrate by vacuum suction or mechanically,
A cleaning liquid supply unit that supplies a cleaning liquid to the substrate held by the substrate holding unit, and a rotating unit that rotates the substrate holding unit are provided. In this type of rotary substrate cleaning apparatus, a cleaning liquid is supplied to a substrate while rotating a substrate holding unit. After washing, the substrate is rotated at a high speed for draining and drying.
【発明が解決しようとする課題】前記従来の構成で基板
を高速回転させると、角型基板であればその側辺部分と
角部分との間で回転半径が異なることから、飛散中の液
滴を角部分が弾いてしまう。その結果、浮遊ミストが大
量に発生し、その浮遊ミストが基板に再付着してしま
う。本発明の目的は、浮遊ミストの発生を抑え、洗浄液
が基板に再付着しにくくすることにある。When the substrate is rotated at a high speed in the above-described conventional configuration, the droplets being scattered are different from each other in the case of a rectangular substrate because the rotation radius differs between the side portion and the corner portion. Corners will play. As a result, a large amount of floating mist is generated, and the floating mist adheres to the substrate again. An object of the present invention is to suppress generation of floating mist and make it difficult for a cleaning liquid to adhere to a substrate again.
【課題を解決するための手段】第１の発明に係る回転式
基板洗浄装置は、角型基板を回転させながら、角型基板
の上下面を洗浄液で洗浄する回転式基板洗浄装置であ
り、下面支持部材と、整流部材と、回転手段と、上面用
供給手段と、下面用供給手段とを備えている。下 面支持
部材は、角型基板の下面を支持する。整流部材は、角型
基板を下面支持部材に支持させた状態で角型基板の周辺
側方に位置し、角型基板とともに円形の平面形状を形成
する。回転手段は、角型基板及び整流部材により形成さ
れる円形の中心の回りに、下面支持部材及び整流部材を
回転させる。上面用供給手段は、角型基板の上面に対し
て洗浄液を供給する。下面用供給手段は、角型基板の下
面中央付近に向けて洗浄液を供給する。この回転式基板
洗浄装置では、下面用供給手段によって角型基板の下面
に供給された洗浄液を整流部材の外周側に排出するため
に、整流部材には、内周側から外周側に通じる排出通路
が形成されている。第２の発明に係る回転式基板洗浄装
置は、第１の発明に記載の装置であって、整流部材は、
複数のピンと複数のピンによって下面支持部材上に固定
された整流板とから構成され、複数のピンの間隙によっ
て排出通路を形成している。第３の発明に係る回転式基
板洗浄装置は、第２の発明に記載の装置であって、整流
板が円周方向に分割されている。第４の発明に係る回転
式基板洗浄装置は、第１から第３のいずれかに記載の装
置であって、下面支持部材によって支持された角型基板
を平面的に位置決めする複数の位置決めピンが、下面支
持部材に設けられている。第５の発明に係る回転式基板
洗浄装置は、第４の発明に記載の装置であって、整流部
材の内側面と下面支持部材によって支持された角型基板
の各辺との間隔が０．５mmから３．０mmの範囲内の値と
なるように、複数の位置決めピンが設けられている。 SUMMARY OF THE INVENTION The rotary substrate cleaning apparatus according to the first invention, while rotating the square substrate, and the upper and lower surfaces of the rectangular substrate is rotary substrate cleaning apparatus for cleaning with a washing liquid, the lower surface The apparatus includes a support member, a rectifying member, a rotation unit, an upper surface supply unit, and a lower surface supply unit. The lower surface support
The member supports the lower surface of the rectangular substrate. Rectifying member is square
Around the square substrate with the substrate supported by the lower surface support member
Located on the side, forms a circular planar shape with the square substrate
I do. The rotating means is formed by the rectangular substrate and the rectifying member.
The lower surface supporting member and the rectifying member are rotated around the center of the circle to be formed. The upper surface supply means supplies the cleaning liquid to the upper surface of the rectangular substrate. The lower surface supply means supplies the cleaning liquid toward the vicinity of the center of the lower surface of the rectangular substrate. In this rotary substrate cleaning apparatus, the cleaning liquid supplied to the lower surface of the rectangular substrate by the lower surface supply means is discharged to the outer peripheral side of the rectifying member.
In addition, the rectifying member has a discharge passage extending from the inner peripheral side to the outer peripheral side.
Are formed. A rotary substrate cleaning apparatus according to a second aspect is the apparatus according to the first aspect, wherein the rectifying member includes:
Fixed on bottom support by multiple pins and multiple pins
Rectifier plate and the gap between the pins
To form a discharge passage. A rotary substrate cleaning apparatus according to a third invention is the apparatus according to the second invention, wherein
The plate is divided circumferentially. According to a fourth aspect of the present invention, there is provided a rotary substrate cleaning apparatus according to any one of the first to third aspects.
And a square substrate supported by a lower surface support member
A plurality of positioning pins for positioning the
It is provided on the holding member. A rotary substrate cleaning apparatus according to a fifth aspect is the apparatus according to the fourth aspect, wherein the rectifying section is provided.
Substrate supported by the inner surface of the material and the lower surface support member
The distance between each side of is within the range of 0.5mm to 3.0mm and
Thus, a plurality of positioning pins are provided.
【作用】第１の発明に係る回転式基板洗浄装置では、角
型基板が下面支持部材により支持された状態で回転手段
が下面支持部材及び整流部材を回転させるとともに、基
板に対して上面用供給手段及び下面用供給手段が洗浄液
を供給する。角型基板の上面に付着した洗浄液は、角型
基板からさらに整流部材に広がり、角型基板及び整流部
材により形成される円形状の外周縁から平均的に飛散す
る。そのため、浮遊ミストが発生しにくくなる。また、
角型基板の下面側の洗浄液は、概ね排出通路を通って外
周方向に排出される。第２の発明に係る回転式基板洗浄
装置では、角型基板の下面側の洗浄液は、ピン間の間隙
（排出通路）を通って外周方向に排出される。In the rotary substrate cleaning apparatus according to the first invention, the rotating means rotates the lower surface support member and the rectifying member while the square substrate is supported by the lower surface support member, and supplies the upper surface to the substrate. The means and the supply means for the lower surface supply the cleaning liquid. The cleaning liquid adhering to the upper surface of the rectangular substrate spreads further from the rectangular substrate to the rectifying member , and the rectangular substrate and the rectifying section
It scatters on average from the outer peripheral edge of the circular shape formed by the material . Therefore, floating mist is less likely to occur. Also,
The cleaning liquid on the lower surface side of the rectangular substrate is generally discharged in the outer peripheral direction through a discharge passage . In the rotary substrate cleaning apparatus according to the second invention, the cleaning liquid on the lower surface side of the rectangular substrate is discharged in the outer peripheral direction through the gap between the pins ( discharge passage ).
（ａ） 前記実施例では角型基板Ｗの上面は第１整流板
及び第２整流板の上面と同じ高さとなるように配置した
が、両者の高さは正確に一致していなくてもよい。図６
に示す実施例では、第１整流板５１の上面に高さは、角
型基板Ｗの上面の高さよりも僅かに低くなっている。 （ｂ） 整流板４１，４２の直線辺４１ａ，４２ａが充
分に基板Ｗの側辺に近接する場合には、位置決めピン５
を省略してもよい。 （ｃ） 第１整流板及び第２整流板の内部に直線辺側と
円弧辺側とを連通する孔を設けてもよい。図７に示す実
施例では、第１整流板６１に複数の連通孔６２が形成さ
れている。これにより、角型基板Ｗの下面に供給された
洗浄液が連通孔６２を通って外周方向に排出され易くな
る。 （ｄ） 角型基板Ｗと略同等の厚さを有する整流板を用
いてもよい。図８に示す実施例では、第１整流板７１
は、複数のピン７２によって基板保持板４上に固定され
ている。この実施例でも前記実施例と同様に、角型基板
Ｗの下面側の洗浄液がピン７２間を通って外周部に排出
される。 （ｅ） 図９に示す実施例では、基板保持板４の外周縁
と第１整流板４１及び第２整流板４２のそれぞれの円弧
辺４１ｂ，４２ｂが一致している。この構成によっても
本発明を実施できる。また、基板保持板４の径の大きさ
を第１整流板４１及び第２整流板４２が形成する円形状
の径より小さくしてもよい。その場合にも、同様の効果
が得られる。 （ｆ） 図１０に示す実施例では、第１整流板８１及び
第２整流板８２は、直線辺側に半円形状の窪み８１ａ，
８２ａをそれぞれ有している。これらの窪み８１ａ，８
２ａには、角型基板Ｗを凹部Ａ内に搬送するための搬送
ハンド（図示せず）の一部が挿入される。 （ｇ） 図１１に示す実施例では、基板保持板４上に固
定された整流板９１は一体の円板である。この整流板９
１は、内側に長方形の孔９１ａを有している。この孔９
１ａによって形成される凹部Ａ内に、角型基板が載置さ
れる。この実施例では、前記実施例に用いられていた位
置決めピンは省略されている。 （ｈ） 本実施例においてはブラシ３０の内部に超音波
ノズル３２が配置されているが、ブラシ３０と超音波ノ
ズル３２とを別々のアームに固定して、それぞれ別々に
基板に作用するような構成にしてもよい。この場合、ブ
ラシ３０によって基板を洗浄するときには、低圧ノズル
２９から洗浄液を供給すればよい。 （ｉ） オリエンテーションフラットを有する半導体ウ
エハを処理する回転式基板処理装置にも、本発明を採用
できる。図１２に示す基板洗浄装置１は、前記実施例の
図１に示された基板洗浄装置１と類似の構造を有してい
る。円形の基板保持面４の上面には、オリエンテーショ
ンフラットｆを有する円型基板Ｃの周囲を位置決めする
ための複数の位置決めピン５が設けられ、さらに整流板
６１が固定されている。整流板６１は、オリエンテーシ
ョンフラットｆと同じ長さの直線辺６１ａと円弧状に延
びる円弧辺６１ｂとを有している。円型基板Ｃが基板保
持面４の上面に支持された状態で、整流板６１は、直線
辺６１ａがオリエンテーションフラットｆとわずかな隙
間を空けて対向するように、さらに円弧辺６１ｂが円型
基板６１の外周とともに円形状になるようになってい
る。また、基板支持状態で、円型基板Ｃの上面の高さと
整流板６１の上面の高さとは、図１３に示すようにほぼ
同一である。すなわち、円型基板Ｃと整流板６１との組
み合わせにより１つの平面円が構成されている。洗浄処
理とリンス処理を行った後、図示しないモータにより基
板保持面４を高速回転させて円型基板Ｃの液切り乾燥処
理を行うときには、円型基板Ｃに付着した洗浄液は遠心
力により外周部に移動し、さらに整流板６１にも移行す
る。そして、円型基板Ｃの外周縁及び整流板６１の円弧
辺６１ｂから外周に飛散する。ここでは、飛散する辺が
円形状になっているため、洗浄液は外周縁から平均して
飛散しミストが発生しにくい。(A) In the above embodiment, the upper surface of the rectangular substrate W is arranged so as to be at the same height as the upper surfaces of the first rectifying plate and the second rectifying plate, but the heights of both may not be exactly the same. . FIG.
In the embodiment shown in (1), the height of the upper surface of the first rectifying plate 51 is slightly lower than the height of the upper surface of the rectangular substrate W. (B) If the straight sides 41a, 42a of the current plates 41, 42 are sufficiently close to the side of the substrate W, the positioning pins 5
May be omitted. (C) A hole may be provided inside the first rectifying plate and the second rectifying plate to connect the straight side and the arc side. In the embodiment shown in FIG. 7, a plurality of communication holes 62 are formed in the first current plate 61. This makes it easier for the cleaning liquid supplied to the lower surface of the rectangular substrate W to be discharged in the outer peripheral direction through the communication hole 62. (D) A rectifying plate having substantially the same thickness as the rectangular substrate W may be used. In the embodiment shown in FIG.
Are fixed on the substrate holding plate 4 by a plurality of pins 72. Also in this embodiment, the cleaning liquid on the lower surface side of the rectangular substrate W is discharged to the outer peripheral portion through the space between the pins 72, as in the above-described embodiment. (E) In the embodiment shown in FIG. 9, the outer peripheral edge of the substrate holding plate 4 and the respective arc sides 41 b and 42 b of the first rectifying plate 41 and the second rectifying plate 42 match. The present invention can also be implemented by this configuration. Further, the diameter of the substrate holding plate 4 may be smaller than the circular diameter formed by the first rectifying plate 41 and the second rectifying plate 42. In that case, the same effect can be obtained. (F) In the embodiment shown in FIG. 10, the first rectifying plate 81 and the second rectifying plate 82 have semicircular recesses 81a on the straight side.
82a. These depressions 81a, 8
A part of a transfer hand (not shown) for transferring the rectangular substrate W into the recess A is inserted into 2a. (G) In the embodiment shown in FIG. 11, the rectifying plate 91 fixed on the substrate holding plate 4 is an integral disk. This current plate 9
1 has a rectangular hole 91a inside. This hole 9
The rectangular substrate is placed in the recess A formed by 1a. In this embodiment, the positioning pins used in the above embodiment are omitted. (H) In the present embodiment, the ultrasonic nozzle 32 is disposed inside the brush 30. However, the brush 30 and the ultrasonic nozzle 32 are fixed to separate arms and act on the substrate separately. It may be configured. In this case, when cleaning the substrate with the brush 30, the cleaning liquid may be supplied from the low-pressure nozzle 29. (I) The present invention can also be applied to a rotary substrate processing apparatus that processes a semiconductor wafer having an orientation flat. The substrate cleaning apparatus 1 shown in FIG. 12 has a structure similar to that of the substrate cleaning apparatus 1 shown in FIG. A plurality of positioning pins 5 for positioning the periphery of the circular substrate C having the orientation flat f are provided on the upper surface of the circular substrate holding surface 4, and a rectifying plate 61 is fixed. The current plate 61 has a straight side 61a having the same length as the orientation flat f and an arc side 61b extending in an arc shape. In a state where the circular substrate C is supported on the upper surface of the substrate holding surface 4, the rectifying plate 61 further has an arc side 61 b so that the straight side 61 a faces the orientation flat f with a slight gap therebetween. 61 has a circular shape along with the outer circumference. Further, in the substrate supporting state, the height of the upper surface of the circular substrate C and the height of the upper surface of the current plate 61 are substantially the same as shown in FIG. That is, one plane circle is configured by the combination of the circular substrate C and the rectifying plate 61. After performing the cleaning process and the rinsing process, when the substrate holding surface 4 is rotated at a high speed by a motor (not shown) to perform the draining and drying process of the circular substrate C, the cleaning liquid adhered to the circular substrate C is removed from the outer peripheral portion by centrifugal force. , And then to the current plate 61. Then, it scatters to the outer periphery from the outer peripheral edge of the circular substrate C and the arc side 61b of the current plate 61. Here, since the scattered sides have a circular shape, the cleaning liquid is scattered on average from the outer peripheral edge, and mist is hardly generated.
【発明の効果】本発明に係る回転式基板処理装置では、
角型基板が用いられても、処理液は角型基板及び整流部
材より形成される円形状の外周縁から平均的に飛散す
る。その結果、浮遊ミストが発生しにくくなり、処理液
が基板に再付着しにくくなる。また、整流部材に排出通
路が形成されているため、角型基板の下面側の洗浄液
は、概ね排出経路を通って外周方向に排出される。According to the rotary substrate processing apparatus of the present invention,
Be rectangular substrate is used, the processing liquid is square substrate and the rectifying section
It scatters on average from the outer peripheral edge of the circular shape formed of the material . As a result, floating mist is less likely to be generated, and the treatment liquid is less likely to adhere to the substrate. In addition, the discharge
Since the path is formed, the cleaning liquid on the lower surface side of the rectangular substrate is generally discharged in the outer peripheral direction through the discharge path .
【図１】本発明の一実施例としての基板洗浄装置の一部
切欠き斜視部分図。FIG. 1 is a partially cutaway perspective view of a substrate cleaning apparatus as one embodiment of the present invention.
【図２】その縦断面部分図。FIG. 2 is a partial longitudinal sectional view thereof.
【図３】その基板保持板の平面図。FIG. 3 is a plan view of the substrate holding plate.
【図４】図３のIV−IV断面図。FIG. 4 is a sectional view taken along line IV-IV of FIG. 3;
【図５】図２の拡大部分図。FIG. 5 is an enlarged partial view of FIG. 2;
【図６】他の実施例の図４に相当する図。FIG. 6 is a diagram corresponding to FIG. 4 of another embodiment.
【図７】さらに他の実施例の図４に相当する図。FIG. 7 is a diagram corresponding to FIG. 4 of still another embodiment.
【図８】さらに他の実施例の図４に相当する図。FIG. 8 is a diagram corresponding to FIG. 4 of still another embodiment.
【図９】さらに他の実施例の図３に相当する図。FIG. 9 is a view corresponding to FIG. 3 of still another embodiment.
【図１０】さらに他の実施例の図３に相当する図。FIG. 10 is a view corresponding to FIG. 3 of still another embodiment.
【図１１】さらに他の実施例の図３に相当する図。FIG. 11 is a diagram corresponding to FIG. 3 of still another embodiment.
【図１２】さらに他の実施例の図１に相当する図。FIG. 12 is a view corresponding to FIG. 1 of still another embodiment.
【図１３】図１２の実施例の図４に相当する図。FIG. 13 is a view corresponding to FIG. 4 of the embodiment in FIG. 12;
１ 基板洗浄装置 ２ 基板保持部 ３ ブラシ洗浄機構 ４ 基板保持板 ７ 回転軸 １３ モータ ４１，５１，６１，７１，８１ 第１整流板 ４２，８２ 第２整流板 ６１ 整流板 ９１ 整流板 Ａ 凹部 Ｗ 角型基板 Ｃ 円型基板 REFERENCE SIGNS LIST 1 substrate cleaning device 2 substrate holding unit 3 brush cleaning mechanism 4 substrate holding plate 7 rotating shaft 13 motor 41, 51, 61, 71, 81 first rectifying plate 42, 82 second rectifying plate 61 rectifying plate 91 rectifying plate A recess W Square substrate C Circle substrate
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 ＦＩ Ｈ０１Ｌ 21/68 Ｈ０１Ｌ 21/68 Ｎ (56)参考文献 特開 平５−114554（ＪＰ，Ａ) 特開 平４−151667（ＪＰ，Ａ) 特開 昭56−56629（ＪＰ，Ａ) 特開 平６−333813（ＪＰ，Ａ) 特開 平６−267836（ＪＰ，Ａ) 特開 平５−283326（ＪＰ，Ａ) 実開 平２−4674（ＪＰ，Ｕ) 実開 平２−125326（ＪＰ，Ｕ) 実開 平２−65333（ＪＰ，Ｕ) (58)調査した分野(Int.Cl.7，ＤＢ名) H01L 21/027 B05C 1/02 101 B05C 5/00 101 B05C 11/08 G03F 7/16 502 H01L 21/68 ────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 7 Identification symbol FI H01L 21/68 H01L 21/68 N (56) References JP-A-5-114554 (JP, A) JP-A-4-151667 ( JP, A) JP-A-56-56629 (JP, A) JP-A-6-333813 (JP, A) JP-A-6-267836 (JP, A) JP-A-5-283326 (JP, A) Hei 2-4674 (JP, U) JP-A 2-125326 (JP, U) JP-A 2-65333 (JP, U) (58) Fields studied (Int. Cl. 7 , DB name) H01L 21 / 027 B05C 1/02 101 B05C 5/00 101 B05C 11/08 G03F 7/16 502 H01L 21/68
Claims (5)
の上下面を洗浄液で洗浄する回転式基板洗浄装置であっ
て、前記角型基板の下面を支持する下面支持部材と、 前記角型基板を前記下面支持部材に支持させた状態で前
記角型基板の周辺側方に位置し、前記角型基板とともに
円形の平面形状を形成する整流部材と、 前記角型基板及び前記整流部材により形成される円形 の
中心の回りに、前記下面支持部材及び前記整流部材を回
転させる回転手段と、 前記角型基板の上面に対して前記洗浄液を供給する上面
用供給手段と、 前記角型基板の下面中央付近に向けて前記洗浄液を供給
する下面用供給手段と、 を備え、 前記下面用供給手段によって前記角型基板の下面に供給
された洗浄液を前記整流部材の外周側に排出するため
に、前記整流部材には、内周側から外周側に通じる排出
通路が形成されている、回転式基板洗浄装置。1. A while a square substrate is rotated, the upper and lower surfaces of the square-type substrate a rotary substrate cleaning apparatus for cleaning with a cleaning liquid, and a lower surface support member for supporting a lower surface of the squared substrate, the angle With the mold substrate supported by the lower surface support member,
It is located on the peripheral side of the square substrate, and together with the square substrate
A rectifying member that forms a circular planar shape, rotating means for rotating the lower surface support member and the rectifying member around a center of a circle formed by the square substrate and the rectifying member; An upper surface supply means for supplying the cleaning liquid to the upper surface; and a lower surface supply means for supplying the cleaning liquid toward near the center of the lower surface of the square substrate. To discharge the cleaning liquid supplied to the lower surface of the
In addition, the rectifying member has a discharge passage from the inner peripheral side to the outer peripheral side.
A rotary substrate cleaning device having a passage formed therein .
ピンによって前記下面支持部材上に固定された整流板と
から構成され、前記複数のピンの間隙によって前記排出
通路を形成していることを特徴とする、請求項１に記載
の回転式基板洗浄装置。2. The rectifying member includes a plurality of pins and a plurality of pins.
A flow straightening plate fixed on the lower support member by a pin;
The discharge by the gap between the plurality of pins.
The rotary substrate cleaning apparatus according to claim 1, wherein a passage is formed.
とを特徴とする、請求項２に記載の回転式基板洗浄装3. The rotary substrate cleaning apparatus according to claim 2, wherein:
置。Place.
角型基板を平面的に位置決めする複数の位置決めピンがMultiple positioning pins for positioning the rectangular substrate
前記下面支持部材に設けられていることを特徴とする、It is provided on the lower surface support member,
請求項１から請求項３のいずれかに記載の回転式基板洗4. The rotary substrate cleaning according to claim 1.
浄装置。Purification equipment.
によって支持された前記角型基板の各辺との間隔が０．The distance between each side of the rectangular substrate supported by に よ っ て is 0.
５mmから３．０mmの範囲内の値となるように前記複数のThe plurality of the plurality of pieces are set so as to have a value within a range of 5 mm to 3.0 mm.
位置決めピンが設けられていることを特徴とする、請求Claims characterized in that a positioning pin is provided.
項４に記載の回転式基板洗浄装置。Item 5. A rotary substrate cleaning apparatus according to Item 4.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25158093A JP3138897B2 (en) | 1993-10-07 | 1993-10-07 | Rotary substrate processing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25158093A JP3138897B2 (en) | 1993-10-07 | 1993-10-07 | Rotary substrate processing equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH07106233A JPH07106233A (en) | 1995-04-21 |
| JP3138897B2 true JP3138897B2 (en) | 2001-02-26 |
Family
ID=17224934
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25158093A Expired - Lifetime JP3138897B2 (en) | 1993-10-07 | 1993-10-07 | Rotary substrate processing equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3138897B2 (en) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4482188B2 (en) * | 1999-12-24 | 2010-06-16 | 芝浦メカトロニクス株式会社 | Rectangular substrate processing equipment |
| JP4519992B2 (en) * | 2000-05-24 | 2010-08-04 | 芝浦メカトロニクス株式会社 | Spin processing equipment |
| JP3740377B2 (en) * | 2001-03-05 | 2006-02-01 | 東京エレクトロン株式会社 | Liquid supply device |
| JP4530592B2 (en) * | 2001-09-10 | 2010-08-25 | 三益半導体工業株式会社 | Wafer surface treatment equipment |
| KR100695229B1 (en) * | 2005-10-26 | 2007-03-14 | 세메스 주식회사 | Spin chuck |
| EP1848024B1 (en) | 2006-04-18 | 2009-10-07 | Tokyo Electron Limited | Liquid processing apparatus |
| TW200802579A (en) | 2006-04-18 | 2008-01-01 | Tokyo Electron Ltd | Liquid processing apparatus |
| JP4825177B2 (en) * | 2007-07-31 | 2011-11-30 | 東京エレクトロン株式会社 | Substrate processing equipment |
| JP5242242B2 (en) * | 2007-10-17 | 2013-07-24 | 株式会社荏原製作所 | Substrate cleaning device |
| JP4816747B2 (en) | 2009-03-04 | 2011-11-16 | 東京エレクトロン株式会社 | Liquid processing apparatus and liquid processing method |
| JP4853536B2 (en) | 2009-03-13 | 2012-01-11 | 東京エレクトロン株式会社 | Coating, developing device, coating, developing method and storage medium |
| JP5335578B2 (en) * | 2009-06-30 | 2013-11-06 | アルバック成膜株式会社 | Coating device and airflow control plate |
| JP5006464B1 (en) * | 2011-10-25 | 2012-08-22 | ミクロ技研株式会社 | Substrate processing apparatus and substrate processing method |
| CN103157578B (en) * | 2011-12-12 | 2016-04-20 | 赛恩倍吉科技顾问（深圳）有限公司 | Application device |
| JP6420181B2 (en) * | 2015-02-27 | 2018-11-07 | 株式会社東京精密 | Cleaning device |
| JP2017013183A (en) * | 2015-07-01 | 2017-01-19 | 不二越機械工業株式会社 | Polishing device |
| CN112108310A (en) * | 2020-09-01 | 2020-12-22 | 兰淑月 | Auxiliary device is paintd with inboard tire mucilage of tire bead to tire processing |
| CN113117985B (en) * | 2021-03-04 | 2022-07-08 | 南京辉普环境工程有限公司 | Anticorrosive pipeline glass inside lining ground coat processing apparatus |
-
1993
- 1993-10-07 JP JP25158093A patent/JP3138897B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH07106233A (en) | 1995-04-21 |
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