JP5335578B2 - Coating device and airflow control plate - Google Patents

Description

  The present invention relates to a coating apparatus that applies a coating solution such as a photoresist to a plate to be processed by centrifugal force while rotating a substrate.

  As an apparatus for applying a photoresist to a substrate by centrifugal force while rotating the substrate, for example, Patent Document 1 discloses a disc (rectifier plate) composed of four divided plates arranged around a rectangular glass substrate. ) Is disclosed.

  In Patent Document 1, a frame-like suction slit is provided between the disc and the edge of the substrate, and the exhaust state is adjusted by adjusting the width of the suction slit. . Centrifugal blades are provided between each divided plate and a support plate that is disposed below the divided plate and supports the substrate. The vicinity of the suction slit is decompressed by the rotation of the centrifugal blade accompanying the rotation of the substrate, and the air sucked from the suction slit is discharged to the outer peripheral side of each divided plate. As a result, the photoresist film that remains thick at the corners of the substrate is discharged from the outer periphery of each divided plate with the flow of air, and the film thickness on the substrate becomes uniform.

  On the other hand, Patent Document 2 discloses a method for removing an unnecessary coating film on the edge of a glass substrate. The coating film removing apparatus disclosed in Patent Document 2 includes a coating film removing unit and a solvent drawing member. The coating film removing means includes a solvent discharge port that supplies a solvent toward the edge of the side of the substrate, and a suction port that sucks and removes the supplied solvent and dissolved matter. The solvent drawing member is provided near the side of the substrate to which the solvent is supplied and along the side, and once draws the solvent and the dissolved material by the surface tension of the solvent.

JP 2009-99910 A JP 2007-157925 A

  In Patent Document 1, since the air sucked from the suction slit flows to near the lower side of the substrate and flows between the dividing plate and the support plate, the coating liquid is not only on the side surface of the substrate but also on the back surface of the substrate. There is a risk of sticking around. In this case, after the coating process, the coating solution attached to the back surface of the substrate is peeled off by a mechanism that mechanically holds the substrate in the substrate transport process, exposure process, etc., and this becomes dust and adheres to the substrate surface. There are things to do. This causes exposure errors and etching defects, and decreases the yield and quality of the product.

  The coating film removing apparatus of Patent Document 2 is configured to discharge a solvent to remove the coating film adhering to the edge of the substrate and to forcibly suck the solvent and dissolved matter. Therefore, a means for discharging the solvent and a means for forced suction are required, the structure is complicated, and the cost is increased.

  The objective of this invention is providing the coating device and airflow control board which can suppress that a coating liquid wraps around and adheres to the back surface side of a board | substrate, without using a complicated structure.

In order to achieve the above object, a coating apparatus according to an aspect of the present invention includes a holding unit, a supply mechanism, a rotation driving unit, and an airflow control unit.
The holding unit holds a processed plate.
The supply mechanism supplies a coating liquid onto the processing target plate held by the holding unit.
The airflow control unit includes an upper wall plate, an introduction port, an outer peripheral surface, a discharge port, and an internal flow path, and is disposed so as to be rotatable integrally with the holding unit on the outer peripheral side of the processing target plate. Is done. The upper wall plate is disposed with a gap from a peripheral edge portion of the processing target plate held by the holding portion. The discharge port is provided on the outer peripheral surface. The internal flow path communicates the introduction port and the discharge port and includes the lower surface of the upper wall plate as a flow path surface.

It is sectional drawing which shows the structure of the schematic coating device which concerns on one Embodiment of this invention. It is a top view which shows a holding | maintenance head and an airflow control unit. It is the perspective view which represented the one end part in the rotation direction of an airflow control board to this side. It is the perspective view which represented the other end part on the opposite side to one end part of an airflow control board to this side. It is a top view which shows an airflow control board. It is the perspective view which decomposed | disassembled the airflow control board. It is the sectional view on the AA line in FIG. In FIG. 7, it is sectional drawing which expands and shows the communication part of a side direction flow path and a radial flow path. It is sectional drawing which shows other embodiment of an airflow control board. It is sectional drawing which shows another embodiment of an airflow control board. It is a top view which shows the airflow control board which concerns on embodiment with which the airflow control board was applied to the rectangular board | substrate.

The coating apparatus which concerns on one form of this invention comprises a holding | maintenance part, a supply mechanism, a rotation drive part, and an airflow control part.
The holding unit holds a processed plate.
The supply mechanism supplies a coating liquid onto the processing target plate held by the holding unit.
The airflow control unit includes an upper wall plate, an introduction port, an outer peripheral surface, a discharge port, and an internal flow path, and is disposed so as to be rotatable integrally with the holding unit on the outer peripheral side of the processing target plate. Is done. The upper wall plate is disposed with a gap from a peripheral edge portion of the processing target plate held by the holding portion. The discharge port is provided on the outer peripheral surface. The internal flow path communicates the introduction port and the discharge port and includes the lower surface of the upper wall plate as a flow path surface.

  When the plate to be processed is rotated by the rotation drive unit, the coating liquid diffused on the plate to be processed reaches the peripheral edge of the plate to be processed. In addition, gas is introduced from the introduction port facing in the rotation direction by rotation of the airflow control unit due to rotation of the holding unit, and the introduced gas passes through the internal flow path and is exhausted on the outer peripheral surface of the airflow control unit. It is discharged to the outer peripheral side of the airflow control unit through the outlet. The coating liquid that has reached the peripheral edge of the plate to be processed passes through the gap due to centrifugal force and surface tension, and flows to the outer peripheral side on the upper surface of the upper wall plate of the airflow control unit. In addition, the coating liquid passes through the gap to the flow path surface, which is the lower surface of the upper wall plate, and adheres to the flow path surface by the surface tension, and is discharged together with the air flow by the centrifugal force and the air flow controlled by the air flow control unit. It is discharged from the exit.

  In this way, since the coating liquid is discharged to the outer peripheral side of the airflow control unit by the airflow mainly introduced from the introduction port and the path is controlled, the coating liquid is processed without using a complicated configuration as in the past. It is possible to suppress wrapping around and adhering to the back side of the plate.

  The air flow control unit has the introduction port having a first opening area, and has a second opening area smaller than the first opening area, and is arranged to face the introduction port in the rotation direction. You may have a discharge hole. In that case, the internal flow path communicates the introduction port, the discharge hole, and the discharge port.

  Since the second opening area of the discharge hole is smaller than the first opening area of the introduction port, the pressure loss of the gas in the flow path communicating with the introduction port and the discharge hole can be reduced in the internal flow path. Part of the gas introduced from the mouth can be discharged from the discharge hole, and the remainder of the gas can be discharged from the discharge port on the outer peripheral surface. That is, it becomes possible to adjust the air flow rate discharged from the discharge port.

  The internal flow path may include a first flow path that communicates the introduction port and the discharge hole, and a second flow path that communicates the first flow path and the discharge port. As a result, the first flow path can be formed mainly in the rotational direction, and the second flow path can be formed in the rotational radial direction. In this case, gas mainly flows through the first flow path, and gas and coating liquid flow through the second flow path.

  The internal flow path may have a plurality of the second flow paths. In that case, the airflow control unit has a plurality of guide blades extending toward the outer peripheral side of the airflow control unit for forming the plurality of second flow paths. By providing a plurality of guide blades, the gas and the coating liquid can be discharged uniformly from the discharge port on the outer peripheral surface.

  The second flow path may be formed such that the flow path cross-sectional area of the second flow path increases toward the outer peripheral side of the airflow control unit. Thereby, the pressure loss of gas acts on a 2nd flow path effectively, and it can make it easy to discharge | emit gas and a coating liquid from a discharge port.

  The height of the lower side of the inlet facing the first channel of the second channel is higher than the height of the lower side of the outlet facing the second channel of the first channel. It has been. Thereby, the fall of the pressure loss of the gas in a 1st flow path can be suppressed, and airflow can be mainly distribute | circulated in a 1st flow path.

  The material of at least the surface of the upper plate is made of resin. Compared with the case where the upper plate is made of metal, the coating solution can flow more cleanly on the upper surface and the lower surface of the upper plate, and can be efficiently discharged to the outer peripheral side.

The airflow control plate according to the present invention includes an upper wall plate, an end portion, an outer peripheral surface, and an internal flow path.
The upper wall plate is disposed with a gap from the peripheral edge of the processing target plate held by the rotatable holding portion.
The said edge part is an edge part of a rotation direction, and has an inlet. The introduction port opens toward the rotation direction of the plate to be processed, and the holding unit is configured to diffuse the coating liquid supplied on the plate to be processed on the plate to be processed using centrifugal force. Introduce introducing gas when rotating.
The outer peripheral surface has a discharge port for discharging the gas introduced from the introduction port and the coating liquid diffused from the processing target plate.
The internal flow path communicates the introduction port and the discharge port, and includes the lower surface of the upper wall plate as a flow path surface.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[Configuration of coating equipment]
FIG. 1 is a cross-sectional view showing a schematic configuration of a coating apparatus according to an embodiment of the present invention.

  The coating apparatus 100 is a coating apparatus that applies a coating solution such as a photoresist to the substrate W by centrifugal force while rotating the substrate W as a processing target plate.

  The coating apparatus 100 includes, for example, a holding head 1 that holds the substrate W, an airflow control unit 5 that is provided around the substrate W held by the holding head 1, and a dispenser 6 that supplies a resist solution onto the substrate W. And. The holding head 1 holds the substrate W mechanically or by vacuum suction, and can be rotated by a motor as a rotation driving unit (not shown). Further, in order to transfer the substrate W when the substrate W is carried into and out of the coating apparatus 100, the holding head 1 can be moved up and down by a lifting mechanism (not shown). . The dispenser 6 has a pipe 2 connected to a resist liquid tank (not shown) and a pump for pumping the resist liquid, and a nozzle 4 attached to the tip of the pipe 2.

  The substrate W is typically a mask substrate for photolithography for forming a fine circuit pattern, and for example, a square glass substrate is used.

  FIG. 2 is a plan view showing the holding head 1 and the airflow control unit 5.

  The airflow control unit 5 includes, for example, an airflow control plate 10 divided into four parts, and the four airflow control boards 10 have substantially the same configuration. The four air flow control plates 10 are respectively arranged corresponding to the four sides of the square substrate W and are fixed on the holding head 1. Thereby, the substrate W and the airflow control unit 5 are integrally rotated by the rotation of the holding head 1. The shape of the peripheral portion of each airflow control plate 10 viewed in a plane is a partial shape of a circle having the same curvature, and the outer shape of the four airflow control plates 10 is substantially circular. .

  3 and 4 are perspective views showing one airflow control plate 10. FIG. 3 is a view showing one end portion of the airflow control plate 10 in the rotational direction, and FIG. 4 is a view showing the other end portion on the opposite side to the one end portion. FIG. 5 is a plan view showing the airflow control plate 10.

  As shown in these drawings, an air inlet 13 that opens in the rotational direction of the substrate W is provided at one end of the airflow control plate 10 in the rotational direction R (see FIG. 5). Also, the other end of the airflow control plate 10 is opposed to the introduction port 13 in the rotation direction, and has a function of discharging air introduced into the airflow control plate 10 mainly from the introduction port 13. 14 is provided. On the outer peripheral surface 19 of the airflow control plate 10, a plurality of discharge ports 15 for discharging air and resist solution are provided in the rotation direction.

  Inside the airflow control plate 10, an internal flow path 20 that connects the introduction port 13, the discharge port 15, and the discharge hole 14 is formed. The internal flow path 20 includes a side flow path 16 and a plurality of radial flow paths 17. The side direction flow path 16 is provided so as to be substantially parallel along one side of the substrate W held by the holding head 1. On the other hand, the radial flow path 17 communicates with the side direction flow path 16 and extends from the side direction flow path 16 toward the outer peripheral side. For example, the radial flow path 17 extends in the radial direction from the center of the substrate W held by the holding head 1, that is, from the rotation center.

  As shown in FIGS. 3 to 5, the opening area of the discharge port 15 is smaller than the opening area of the introduction port 13. As a result, when the substrate W and the airflow control unit 5 are rotated, when air is introduced into the internal flow path 20 via the introduction port 13, the pressure loss of air mainly in the side direction flow path 16 is reduced. be able to. As a result, a part of the air introduced from the introduction port 13 can be discharged from the discharge hole 14 and the remaining air can be discharged from each discharge port 15 of the outer peripheral surface 19. That is, the air flow rate discharged from the discharge port 15 can be adjusted.

  FIG. 6 is an exploded perspective view of the airflow control plate 10. The airflow control plate 10 includes an upper plate 11 that constitutes an upper wall of the airflow control plate 10 and a lower plate 12 that constitutes a lower wall. The upper plate 11 has a flat plate shape. The outer shapes of the upper plate 11 and the lower plate 12 are substantially the same. The lower plate 12 is provided with guide blades 18 for forming the radial flow path 17 so as to protrude toward the upper plate 11.

  7 is a cross-sectional view taken along line AA in FIG. As shown in FIG. 7, the airflow control plate 10 has substantially the same thickness as the thickness of the substrate W. The upper plate 11 is disposed with a gap 33 from the peripheral edge of the substrate W held by the holding head 1, and the upper surface 11 a of the upper plate 11 is horizontal at substantially the same height as the upper surface of the substrate W. Is provided. The height of each guide blade 18 provided on the lower plate 12 is formed to be substantially the same, and the lower surface 11b of the upper plate 11 abuts on the upper surface of each guide blade 18 so that the upper plate 11 and the lower plate 11 are in contact with each other. 12 is fixed integrally, and the airflow control board 10 is comprised by this. Although the outer peripheral surface 19 of the airflow control plate 10 constituted by the outer peripheral surfaces of the upper plate 11 and the lower plate 12 is, for example, the same position in the horizontal direction as the outer peripheral surface 1a of the holding head 1, they are not necessarily limited. It does not have to be the same position.

  The fixing method of the upper plate 11 and the upper plate 11 may be anything such as screwing, adhesive, ultrasonic bonding, or the like. By fixing the upper plate 11 and the lower plate 12, the internal flow path 20 is formed. At a position where the radial flow path 17 of the internal flow path 20 is provided, the lower surface 11b of the upper plate 11 is configured as a flow path surface through which a resist solution mainly flows.

  The lower plate 12 may come into contact with the side surface Ws of the substrate W, or a predetermined gap may be provided between the lower plate 12 and the side surface Ws of the substrate W.

  Both the upper plate 11 and the lower plate 12 are typically made of resin. As the resin material, PEEK, PP, PVDF or the like is used. The lower plate 12 may be a metal. Aluminum, stainless steel or the like is used as the metal material. When a resin is used rather than a metal as the material of the upper plate 11, the resist solution 31 flows more cleanly on the upper surface 11a and the lower surface 11b of the upper plate 11 and flows efficiently to the outer peripheral side. The liquid can be discharged.

  The upper plate 11 may not necessarily be a resin. For example, a metal material may be used, and the metal surface may be subjected to resin processing such as fluorine.

  The distance a of the gap 33 between the upper plate 11 and the peripheral edge of the substrate W is, for example, 0.3 mm or less. The thickness of the substrate W is, for example, 5 mm or more, and the thickness of the upper plate 11 is set to be larger than 1 mm. As will be described later, when the substrate W is rotated, the resist solution 31 supplied onto the substrate W is diffused by the centrifugal force from the peripheral portion of the substrate W, and the upper surface 11a of the upper plate 11 passes through the gap 33 toward the outer peripheral side. And flows through the gap 33 toward the outer peripheral side of the lower surface 11 b of the upper plate 11.

  The distance a of the gap 33 is 0.3 mm or less as described above, but is set to 0.2 mm, for example, because the tolerance of the processing accuracy of the substrate W is taken into consideration. However, even if the gap 33 is very narrow, the resist solution can enter the lower surface 11b of the upper plate 11 by capillary action, so the distance a of the gap 33 may be smaller than 0.2 mm. If the distance a of the gap 33 is larger than 0.3 mm, the resist solution 31 extended from the peripheral edge of the substrate W may not reach the upper surface 11a of the upper plate 11. On the other hand, if the thickness of the upper plate 11 is less than 1 mm, the rigidity of the upper plate 11 is lowered, and the upper plate 11 may cause unnecessary vibration during rotation.

  As shown in FIG. 7, the bottom surface 17a of the radial flow path 17 is an inclined surface which inclines toward the outer peripheral side. Thereby, the radial flow path 17 is formed so that the cross-sectional area of the radial flow path 17 increases as it goes to the outer peripheral side of the airflow control plate 10. Thus, for example, the bottom surface 17a is not inclined but horizontal, and as shown in FIG. The rate of increase of the channel cross-sectional area of the channel 17 toward the outer peripheral side can be increased. Thereby, when the substrate W and the airflow control unit 5 are rotated, the pressure loss of the gas effectively acts on the radial flow path 17, and the air and the resist solution 31 can be easily discharged from the discharge port 15.

Further, as shown in FIG. 8, the height c of the lower side 171 a of the inlet 171 facing the side flow path 16 of the radial flow path 17 is the outlet 161 of the side flow path 16 facing the radial flow path 17. It is provided higher than the height d of the lower side 161a. Note that the heights of the upper surfaces of the radial flow channel 17 and the side flow channel 16 coincide with each other and correspond to the lower surface 11 b of the upper plate 11. For convenience of description, the height reference position is the lower surface of the lower plate 12 of the airflow control plate 10.
With such a structure, it is possible to suppress a decrease in air pressure loss in the side direction flow path 16, and it is possible to circulate the airflow mainly in the side direction flow path 16. As described above, the flow passage cross-sectional area of the radial flow passage 17 gradually increases toward the outer peripheral side, so that once air flows from the side flow passage 16 into the radial flow passage 17, it is smoothly discharged. It is discharged from the exit.

[Applicator operation]
Next, the operation of the coating apparatus 100 configured as described above will be described.

  A resist solution 31 is supplied from the dispenser 6 onto the substrate W held by the holding head 1. While the holding head 1 rotates the substrate W, the dispenser 6 may discharge the resist solution 31 onto the substrate W. After the dispenser 6 finishes discharging the resist solution 31 onto the substrate W, the substrate W rotates. May start.

  The rotation speed of the substrate W is 1000 to 3000 rpm, typically 1500 rpm. As the holding head 1 rotates the substrate W, the resist solution diffuses on the substrate W due to centrifugal force. The resist solution diffuses along the upper surface 11a and the lower surface 11b of the upper plate 11 of each airflow control plate 10 from the peripheral portion of the substrate W through the gap 33 by the centrifugal force and the surface tension, and moves toward the outer peripheral side.

  On the other hand, in the airflow control plate 10 of the rotating airflow control unit 5, air is introduced from the introduction port 13, and the introduced air mainly flows through the side flow path 16 and is discharged from the discharge hole 14. Since the opening area of the discharge hole 14 is smaller than that of the inlet 13, the pressure of air introduced from the inlet 13 is suppressed in the side flow path 16. Thereby, air also flows from the side direction flow path 16 to the radial flow path 17. As shown in FIG. 7, in particular, the resist solution 31 that has entered the lower surface 11b of the upper plate 11 through the gap 33 sticks to the channel surface that is the lower surface 11b due to surface tension, and the centrifugal force and the radial channel 17 It is discharged from the discharge port 15 by the air flowing through.

  As described above, the resist solution 31 is discharged to the outer peripheral side by the airflow that is mainly introduced from the introduction port 13 and whose path is controlled by the internal flow path 20. As a result, the resist solution 31 can be prevented from wrapping around and adhering to the back side of the substrate W without using a complicated structure such as a conventional solvent discharge mechanism or vacuum suction mechanism. In the present embodiment, it is possible to suppress the resist solution 31 from adhering to the side surface Ws of the substrate W.

  In the present embodiment, since a plurality of guide blades 18 are provided to form a plurality of radial flow paths 17, air is evenly distributed in the rotational direction from the discharge port 15 of the outer peripheral surface 19 of the airflow control plate 10. In addition, the resist solution 31 can be discharged.

  In the present embodiment, as described above, the flow passage cross-sectional area of the radial flow passage 17 is formed so as to increase toward the outer peripheral side of the airflow control plate 10. Thereby, the pressure loss in the radial flow path 17 can be promoted, and the air and the resist solution 31 can be easily discharged from the discharge port 15.

  The embodiment according to the present invention is not limited to the above-described embodiment, and various other embodiments are conceivable.

  For example, in the airflow control plate 10, the bottom surface 17a of the radial flow path 17 does not necessarily have to be a slope. As shown in FIG. 9, the bottom surface 27a of the radial flow path 17 may be a horizontal plane. Alternatively, in order to increase the cross-sectional area of the radial flow path 17 toward the outer peripheral side, as shown in FIG. 10, the lower surface 21b of the upper plate 21 has a slope (a slope that rises toward the outer peripheral side). It may be.

  There is not necessarily a step from the side flow path 16 to the radial flow path 17.

  The width b of the radial channel 17 shown in FIG. 5 may be constant.

  In the airflow control plate 10, each radial flow path 17 is provided so as to extend in the radial direction. However, instead of each of these radial flow paths 17, a flow path may be provided that extends in a direction shifted by a predetermined angle from the radial direction when viewed in plan. The side direction flow path 16 is not limited to the above embodiment, and may be formed in a curved shape along a circular shape in the rotation direction, for example.

  In the above-described embodiment, a rectangular glass substrate is used as the plate to be processed, but a substrate having a nearly circular shape such as a semiconductor wafer may be used. In that case, the inner peripheral side of the airflow control plate 10 has a shape close to a circle along the shape of the substrate W. In that case, at least two, typically three or more air flow control plates of one air flow control unit may be provided. Alternatively, the substrate W is not limited to the mask substrate. For example, as shown in FIG. 11, the airflow control unit 35 may be provided in the coating apparatus 100 that processes the rectangular glass substrate Wg mounted on the display device. . However, when the overall outer shape of the airflow control unit 35 is formed in a circular shape, the sizes of the airflow control plates 30a and 30b corresponding to the long side and the short side of the substrate Wg are different.

  In the above-described embodiment, the shape of the edge on the outer peripheral side of each airflow control plate 10 viewed in a plane is a part of a circular shape with the same curvature, but it does not necessarily have to be a circular shape.

  The coating solution is not limited to a resist solution, for example, and a developing solution or other chemical solution may be used. That is, the present invention can be applied to all apparatuses capable of diffusing a coating solution on a plate to be processed by a rotating centrifugal force.

  The gas to be controlled by the airflow control plate 10 is not limited to air, and may be an inert gas such as nitrogen or argon, or may be a mixed gas of air and this inert gas. Or another gas may be sufficient.

W ... Substrate R ... Direction of rotation 1 ... Holding head 5, 35 ... Airflow control unit 6 ... Dispenser 10, 30a, 30b ... Airflow control plate 11, 21 ... Upper plate 11a ... Upper surface 11b, 21b ... Lower surface 13 ... Inlet port 14 ... Discharge hole 15 ... Discharge port 16 ... Side direction flow path 17, 27 ... Radial flow path 18 ... Guide vane 19 ... Outer peripheral surface 20 ... Internal flow path 31 ... Resist liquid 33 ... Gap 100 ... Coating device

Claims (7)

A holding unit for holding the plate to be processed;
A supply mechanism for supplying a coating liquid onto the processing target plate held by the holding unit;
A rotation drive unit that rotates the holding unit so as to diffuse the coating solution supplied by the supply mechanism on the plate to be processed using centrifugal force;
An upper wall plate disposed with a gap from a peripheral portion of the processed plate held by the holding unit, a gas inlet opening in the rotation direction of the processed plate, an outer peripheral surface, and the A discharge port provided on an outer peripheral surface; and an internal flow path that communicates the introduction port and the discharge port and includes a lower surface of the upper wall plate as a flow channel surface. And an airflow control unit arranged so as to be rotatable integrally therewith ,
The airflow control unit
The inlet having a first opening area;
A second opening area that is smaller than the first opening area, and a discharge hole that is arranged to face the introduction port in the rotational direction;
The internal flow path is a coating apparatus that communicates the introduction port, the discharge hole, and the discharge port . The coating apparatus according to claim 1 ,
The internal flow path is
A first flow path communicating with the introduction port and the discharge hole;
A coating apparatus comprising: the first flow path and a second flow path communicating with the discharge port. The coating apparatus according to claim 2 ,
The internal flow path has a plurality of the second flow paths,
The airflow control unit includes a plurality of guide blades extending toward an outer peripheral side of the airflow control unit for forming the plurality of second flow paths. The coating apparatus according to claim 2 or 3 ,
The coating apparatus in which the second flow path is formed such that the flow path cross-sectional area of the second flow path increases toward the outer peripheral side of the airflow control unit. The coating apparatus according to any one of claims 2 to 4 ,
The height of the lower side of the inlet facing the first channel of the second channel is higher than the height of the lower side of the outlet facing the second channel of the first channel. Application equipment. The coating apparatus according to any one of claims 1 to 5 ,
A coating device in which at least the surface material of the upper plate is made of resin. An upper wall plate that can be arranged with a gap from the peripheral edge of the plate to be processed held by the rotatable holding unit;
When the holding portion rotates so as to diffuse the coating liquid that opens toward the rotation direction of the plate to be processed and that is supplied on the plate to be processed using centrifugal force. An end of the rotational direction having an inlet of a first opening area for introducing gas;
An outer peripheral surface having a discharge port for discharging the gas introduced from the introduction port and the coating liquid diffused from the plate to be processed;
A discharge hole having a second opening area smaller than the first opening area and arranged to face the introduction port in the rotation direction;
An airflow control plate comprising: an internal flow path that communicates the introduction port , the discharge hole, and the discharge port and includes the lower surface of the upper wall plate as a flow path surface.

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