CN102989705A - Cleaning device capable of preventing liquid from splashing and cleaning system with same - Google Patents
Cleaning device capable of preventing liquid from splashing and cleaning system with same Download PDFInfo
- Publication number
- CN102989705A CN102989705A CN2012104946189A CN201210494618A CN102989705A CN 102989705 A CN102989705 A CN 102989705A CN 2012104946189 A CN2012104946189 A CN 2012104946189A CN 201210494618 A CN201210494618 A CN 201210494618A CN 102989705 A CN102989705 A CN 102989705A
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- Prior art keywords
- upper casing
- cleaning device
- cleaning
- liquid splash
- wall
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B17/00—Methods preventing fouling
- B08B17/02—Preventing deposition of fouling or of dust
- B08B17/025—Prevention of fouling with liquids by means of devices for containing or collecting said liquids
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention relates to the technical field of a semiconductor cleaning technology, and particularly relates to a cleaning device capable of preventing liquid from splashing and a cleaning system with the cleaning device. The cleaning device comprises an upper shell and a lower shell; the upper shell can move up and down relative to the lower shell; the upper shell comprises an inner wall of the upper shell and an outer wall of the upper shell; a hollow cavity is formed between the inner wall of the upper shell and the outer wall of the upper shell; a plurality of liquid inlet holes are formed in the inner wall of the upper shell; and the liquid inlet holes are communicated with the hollow cavity. By adopting the cleaning device capable of preventing the liquid from splashing and the cleaning system with the cleaning device provided by the invention, chemical reagents and/or cleaned particles can enter the hollow cavity through the liquid inlet holes, and are discharged through a drainage hole in a high-speed rotating process of cleaned object by virtue of the liquid inlet holes and the hollow cavity in the upper shell, so as to obtain the optimal cleaning effect for the cleaned object; the cleaning device and the cleaning system are simple in structure, easy to clean, the technology is easy to implement, and liquid waste can be collected easily.
Description
Technical field
The present invention relates to semiconductor cleaning technical field, be specifically related to a kind of purging system that prevents the cleaning device of liquid splash and have this device.
Background technology
Along with the increase of silicon chip diameter wafer and reducing of characteristic size, also more and more higher to the requirement of the cleanliness factor of silicon chip surface.Present cleaning equipment mainly reaches the purpose of cleaning by jet cleaning liquid on the wafer surface of High Rotation Speed.But in the process of High Rotation Speed, cleaning fluid can be thrown out of under the effect of centrifugal force and beat on the cleaning chambers sidewall, and it can be splashed to wafer surface after being cleaned chamber sidewall bounce-back again, and wafer is polluted, if can not in time prevent this pollution, can have a strong impact on the effect of cleaning.At present, generally be by in cleaning chambers, adding extra parts so that the cleaning chambers complex structure prevents this pollution, but like this meeting so that follow-up cleaning to cleaning chambers be difficult for carrying out.
Summary of the invention
The technical problem that (one) will solve
The technical problem to be solved in the present invention provides a kind of purging system that prevents the cleaning device of liquid splash and have this device, can not prevent effectively in wafer High Rotation Speed process that to overcome existing wafer cleaner and purging system chemical reagent and the particle that washes down throw away to beat in upper case side wall and be splashed to again wafer surface and to wafer pollutes and the wafer cleaner complex structure should not clean defective.
(2) technical scheme
In order to solve the problems of the technologies described above, the invention provides a kind of cleaning device of liquid splash that prevents and comprise upper casing and lower casing, described upper casing relatively lower casing moves up and down, described upper casing comprises upper casing inwall and upper casing outer wall, form cavity between described upper casing inwall and the described upper casing outer wall, described upper casing inwall is provided with a plurality of inlet openings, and described inlet opening all communicates with described cavity.
Further, described upper casing connects drive post, and it is used for driving upper casing and moves up and down with respect to lower casing.
Further, when described upper casing was in the high position, the top of its bottom and lower casing had at least a part to overlap.
Further, the thickness of described cavity is 0.3-0.8cm.
Further, the thickness of described upper casing inwall is not more than the thickness of upper casing outer wall.
Further, described inlet opening is circular, and its diameter is 0.5-1.5cm.
Further, described inlet opening circumferentially evenly distributes along the upper casing inwall.
Further, described lower casing is provided with outage, and described outage communicates with the bottom of described cavity.
The present invention also provides a kind of purging system, comprises the cleaning device that this prevents liquid splash.
Further, described cleaning device also comprises clamping device, and described clamping device is arranged at the described inside that prevents the cleaning device of liquid splash, and described clamping device comprises chuck, and it is used for supporting, tightens wafer and drives the wafer rotation.
(3) beneficial effect
The purging system that prevents the cleaning device of liquid splash and have this device provided by the invention, by add inlet opening and cavity at upper casing, can be implemented in the High Rotation Speed process of cleaned material, chemical reagent and/or the particle that washes down enter in the cavity and by outage by inlet opening discharges, and obtains the cleaning effect of the best of cleaned material; And the easy cleaning simple in structure of cleaning device and purging system, technique realize that easily waste liquid also is convenient to collect.
Description of drawings
Fig. 1 is the structural representation that the embodiment of the invention one prevents the cleaning device of liquid splash;
Fig. 2 is the longitudinal sectional view that the embodiment of the invention two has the purging system of the cleaning device that prevents liquid splash among Fig. 1;
Fig. 3 is the profile of upper casing among Fig. 1;
Fig. 4 is the upward view of upper casing among Fig. 1.
Wherein, 1: upper casing; 2: lower casing; 3: inlet opening; 4: cavity; 5: drive post; 6: wafer; 7: chuck; 8: chuck chucking unit.
The specific embodiment
Below in conjunction with drawings and Examples, the specific embodiment of the present invention is described in further detail.Following examples are used for explanation the present invention, but are not used for limiting the scope of the invention.
In description of the invention, need to prove, term " " center "; " vertically "; " laterally "; " on "; D score; " front ", " afterwards ", " left side ", " right side ", " vertically ", " level ", " top ", " end " " interior ", orientation or the position relationship of indications such as " outward " are based on orientation shown in the drawings or position relationship, only be for convenience of description the present invention and simplified characterization, rather than device or the element of indication or hint indication must have specific orientation, with specific orientation structure and operation, therefore can not be interpreted as limitation of the present invention.In addition, term " first ", " second ", " the 3rd " etc. only are used for describing purpose, and can not be interpreted as indication or hint relative importance.
In description of the invention, need to prove that unless clear and definite regulation and restriction are arranged in addition, term " installation ", " linking to each other ", " connection " should be done broad understanding, for example, can be to be fixedly connected with, also can be to removably connect, or connect integratedly; Can be mechanical connection, also can be to be electrically connected; Can be directly to link to each other, also can indirectly link to each other by intermediary, can be the connection of two element internals.For the ordinary skill in the art, can concrete condition understand above-mentioned term concrete meaning in the present invention.
Wafer described in the present invention can be the silicon chip of pure silicon substrate or with the silicon chip of copper interconnection structure.High position described in the present embodiment refers to the rear residing position of upper casing 1 rising, and lower position refers to the rear residing position of upper casing 1 decline.When upper casing 1 was in the high position, the top of the top of upper casing 1 and lower casing 2 had at least a part to overlap; When upper casing 2 was in lower position, upper casing 1 and lower casing 2 overlapped substantially.
Embodiment one
Such as Fig. 1-shown in Figure 4, be the cleaning device that prevents liquid splash provided by the invention, this device comprises: upper casing 1 and lower casing 2; Lower casing 2 is positioned at the bottom of this cleaning device, and upper casing 1 relatively lower casing 2 moves up and down, before cleaning process begins, upper casing 1 moves upward with respect to lower casing 2, upper casing 1 is risen, shield with the wafer 6 to inside, and the liquid of avoiding sputtering in the cleaning process splashes the outside of this cleaning device; After cleaning process was finished, upper casing 1 moved downward with respect to lower casing 2, upper casing 1 was fallen the wafer 6 that takes out wherein with convenient.Concrete, upper casing 1 is non-entity structure, it comprises upper casing inwall and upper casing outer wall, form cavity between upper casing inwall and the upper casing outer wall, the upper casing inwall is provided with a plurality of inlet openings 3, and each inlet opening 3 all communicates with cavity 4, under the prerequisite that guarantees upper casing 1 intensity, the quantity of inlet opening 3 is The more the better, so that the liquid that sputters all enters in the cavity by inlet opening 3.Like this, the liquid that sputters in the High Rotation Speed process just can enter into cavity 4 by inlet opening 3, upper casing 1 is connected with drive post 5, it is used for driving upper casing 1 moving up and down with respect to lower casing 2, its edge with upper casing 1 is connected, the quantity of drive post 5 can be a plurality of, and evenly distributes along the edge of upper casing 1, is preferably three (as shown in Figure 1); Drive post 5 adopts the cylinder (not shown) to drive.
Concrete, upper casing inwall and upper casing outer wall all can be cylindrical structural or loop configuration, and the wall thickness sum of upper casing inwall and upper casing outer wall can be 1.2-2cm, also can increase according to the actual requirements or reduce wall thickness; The inlet opening 3 that is arranged on the upper casing inwall evenly distributes according to certain rules, such as circumferentially evenly distributing along the upper casing inwall, inlet opening 3 is preferably circle, and its diameter is 0.5-1.5cm, and the shape of inlet opening 3 also can be triangle, square, pentalpha or other shapes certainly; The upper casing inwall is thinner, and be beneficial to liquid and enter into cavity 4 from inlet opening 3, the visual concrete condition setting of upper casing outer wall thickness, but to guarantee the intensity of upper casing 1 integral body, the wall thickness that can be arranged to the upper casing inwall is less than or equal to the wall thickness of upper casing outer wall; The thickness of cavity 4 is 0.3-0.8cm; The thickness of cavity 4 also can arrange according to the concrete wall thickness of upper casing inwall and upper casing outer wall, and under the prerequisite that guarantees upper casing 1 bulk strength, the liquid that is beneficial to sputter is smooth and easy flowing for good in cavity 4.
Further, lower casing 2 is provided with the outage (not shown), and outage communicates with the bottom of cavity 4.Outage is used for discharging the liquid that flow into from cavity 4 bottoms wherein.This cleaning device focuses on the waste liquid that produces in the cleaning process in the cavity 4 and by outage and discharges so that the collection of waste liquid is simple to operation.
This prevents that the device of liquid splash can be used in the cleaning of wafer 6, and its technical process is as follows:
Before step S1, technique began, cylinder drove upper casing 1 by drive post 5 and rises, but will guarantee that the bottom of upper casing 1 and the top of lower casing 2 have at least a part to overlap; Wafer 6 is put on the chuck 7, and chuck 7 is provided with chuck chucking unit 8, chuck chucking unit 8 chucking wafers 6.
After step S2, technique begin, the liquid that is thrown away by the wafer 6 of High Rotation Speed enters into cavity 4 by inlet opening 3, breakup after the liquid of cavity 4 reflections is run into inlet opening 3, stop it again to be splashed to wafer 6 surfaces, the outage that the liquid of cavity 4 flows on the lower casing 2 from upper casing 1 lower hollow chamber 4.And discharge by outage.In whole step, chuck 7 is at High Rotation Speed, and the upper casing 1 of cleaning operation unit and lower casing 2 remain static.
When step S3, technique end, cylinder drives lower casings 2 by drive post 5 and descends, and chuck 7 is in loosening state, decontrols wafer 6.
Need to prove: in step S1, after rising, upper casing 1 is in the high position, this moment, upper casing 1 bottom and lower casing 2 tops had at least a part to overlap, with after guaranteeing to flow out from cavity 4 bottoms by the liquid that inlet opening 3 enters into cavity 4, can flow into the outage on the lower casing 2 and discharge by outage; In step S3, after descending, upper casing 1 is in lower position, and this moment, upper casing 1 and lower casing 2 overlapped substantially.
The cleaning device that prevents liquid splash provided by the invention, by add inlet opening and cavity at upper casing, can be implemented in the wafer High Rotation Speed process, chemical reagent and/or the particle that washes down enter in the cavity and by outage by inlet opening discharges, further breakup after a small amount of liquid through the cavity reflection is run into inlet opening, the wafer surface of also can't splashing back, thereby avoided common cleaning device in cleaning process, the liquid that sputters beat behind the cleaning chambers sidewall again bounce-back to wafer surface and pollution that wafer is caused, and cleaning device easy cleaning simple in structure, technique easily realizes, the waste liquid easily collecting has guaranteed to maximum journey the cleaning degree of wafer.
Embodiment two
As shown in Figure 2, a kind of purging system comprises the above-described cleaning device that prevents liquid splash, this purging system also comprises clamping device, it is used for the clamping cleaned material, and this clamping device is arranged at the inside of the cleaning device that prevents liquid splash, and cleaned material describes as an example of wafer 6 example.Concrete, this clamping device comprises chuck 7, it is used for supporting, tightens wafer 6 and drives wafer 6 rotations.Chuck 7 is provided with chuck chucking unit 8, and it is used for tightening and relieving wafer 6.When beginning technique, upper casing 1 is in the high position, and wafer 6 is at High Rotation Speed, and chuck 7 is in gripping orientation; And when stop process, upper casing 1 is in lower position, and wafer 6 stops the rotation, and chuck 7 is in loosening state and is beneficial to decontrol wafer.
This purging system can effectively prevent in wafer High Rotation Speed process, and chemical reagent and the particle that washes down throw away the effect that is splashed to again wafer surface, recontamination wafer surface after on the upper case side wall of beating.The speed that throws away enters into cavity along the liquid of rotation wafer tangential direction by the inlet opening on the upper casing, and discharge by outage in the inflow lower casing, further breakup after a small amount of liquid through the cavity reflection is run into inlet opening, the wafer surface of can't splashing back, thus realized stoping liquid again to be splashed to wafer surface and purpose that wafer is polluted.In addition, this purging system easy cleaning simple in structure, technique easily realize, the waste liquid easily collecting has guaranteed to maximum journey the cleaning degree of wafer.
Need to prove: the purging system that prevents the cleaning device of liquid splash and have this device provided by the invention not only can be used for the cleaning of the pans such as wafer, also can be used for any cleaning that in cleaning process, can produce the object of liquid splash phenomenon, operating process is identical with operating process and the method for wafer with method, and all can reach identical effect.
The above only is preferred embodiment of the present invention; should be pointed out that for those skilled in the art, under the prerequisite that does not break away from the technology of the present invention principle; can also make some improvement and replacement, these improvement and replacement also should be considered as protection scope of the present invention.
Claims (10)
1. cleaning device that prevents liquid splash, it is characterized in that, comprise upper casing and lower casing, described upper casing relatively lower casing moves up and down, described upper casing comprises upper casing inwall and upper casing outer wall, form cavity between described upper casing inwall and the described upper casing outer wall, described upper casing inwall is provided with a plurality of inlet openings, and described inlet opening all communicates with described cavity.
2. the cleaning device that prevents liquid splash as claimed in claim 1 is characterized in that, described upper casing connects drive post, and it is used for driving upper casing and moves up and down with respect to lower casing.
3. the cleaning device that prevents liquid splash as claimed in claim 1 is characterized in that, when described upper casing was in the high position, the top of its bottom and lower casing had at least a part to overlap.
4. the cleaning device that prevents liquid splash as claimed in claim 1 is characterized in that, the thickness of described cavity is 0.3-0.8cm.
5. the cleaning device that prevents liquid splash as claimed in claim 1 is characterized in that, the thickness of described upper casing inwall is not more than the thickness of upper casing outer wall.
6. the cleaning device that prevents liquid splash as claimed in claim 1 is characterized in that, described inlet opening is circular, and its diameter is 0.5-1.5cm.
7. the cleaning device that prevents liquid splash as claimed in claim 1 is characterized in that, described inlet opening circumferentially evenly distributes along the upper casing inwall.
8. the cleaning device that prevents liquid splash as claimed in claim 1 is characterized in that, described lower casing is provided with outage, and described outage communicates with the bottom of described cavity.
9. a purging system is characterized in that, comprises each described cleaning device that prevents liquid splash of claim 1-8.
10. purging system as claimed in claim 9, it is characterized in that, also comprise clamping device, described clamping device is arranged at the described inside that prevents the cleaning device of liquid splash, described clamping device comprises chuck, and it is used for supporting, tightens wafer and drives the wafer rotation.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012104946189A CN102989705A (en) | 2012-11-28 | 2012-11-28 | Cleaning device capable of preventing liquid from splashing and cleaning system with same |
| PCT/CN2013/073572 WO2014082402A1 (en) | 2012-11-28 | 2013-04-01 | Cleaning device for preventing liquid from splashing and cleaning system having same |
| US14/127,972 US9266151B2 (en) | 2012-11-28 | 2013-04-01 | Cleaning device resistant to liquid backsplash and cleaning system therewith |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012104946189A CN102989705A (en) | 2012-11-28 | 2012-11-28 | Cleaning device capable of preventing liquid from splashing and cleaning system with same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102989705A true CN102989705A (en) | 2013-03-27 |
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ID=47919110
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012104946189A Pending CN102989705A (en) | 2012-11-28 | 2012-11-28 | Cleaning device capable of preventing liquid from splashing and cleaning system with same |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN102989705A (en) |
| WO (1) | WO2014082402A1 (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014082402A1 (en) * | 2012-11-28 | 2014-06-05 | 北京七星华创电子股份有限公司 | Cleaning device for preventing liquid from splashing and cleaning system having same |
| CN104841679A (en) * | 2015-05-21 | 2015-08-19 | 北京七星华创电子股份有限公司 | Cleaning medium collecting device |
| CN107199200A (en) * | 2017-07-18 | 2017-09-26 | 无锡市白马机械设备有限公司 | The special dash cover plate of bearing cleaning machine |
| CN107214132A (en) * | 2017-07-18 | 2017-09-29 | 无锡市白马机械设备有限公司 | Possesses the bearing cleaning machine that cleaning fluid spills defencive function |
| CN107634004A (en) * | 2016-07-19 | 2018-01-26 | 沈阳芯源微电子设备有限公司 | It is a kind of to prevent liquid from splashing the dash mechanism to haze |
| CN109570126A (en) * | 2018-12-27 | 2019-04-05 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | The monolithic cleaning device of multistage drug recycling |
| CN110698348A (en) * | 2019-10-29 | 2020-01-17 | 浙江汇翔化学工业有限公司 | Preparation method of 6-chloro-2, 4-dinitroaniline |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109488753A (en) * | 2017-09-09 | 2019-03-19 | 宜发传动轴（上海）有限公司 | A kind of protective device for preventing greasy dirt from splashing |
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| US5975098A (en) * | 1995-12-21 | 1999-11-02 | Dainippon Screen Mfg. Co., Ltd. | Apparatus for and method of cleaning substrate |
| CN101414549A (en) * | 2007-10-17 | 2009-04-22 | 株式会社荏原制作所 | Substrate cleaning apparatus |
| CN203002672U (en) * | 2012-11-28 | 2013-06-19 | 北京七星华创电子股份有限公司 | Cleaning device for preventing liquid from splashing and cleaning system with cleaning device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101459047B (en) * | 2007-12-13 | 2010-11-10 | 中芯国际集成电路制造(上海)有限公司 | Method for cleaning semiconductor wafer surface |
| CN102416391A (en) * | 2011-11-17 | 2012-04-18 | 北京七星华创电子股份有限公司 | Device and method for cleaning surface of wafer |
| CN102989705A (en) * | 2012-11-28 | 2013-03-27 | 北京七星华创电子股份有限公司 | Cleaning device capable of preventing liquid from splashing and cleaning system with same |
-
2012
- 2012-11-28 CN CN2012104946189A patent/CN102989705A/en active Pending
-
2013
- 2013-04-01 WO PCT/CN2013/073572 patent/WO2014082402A1/en active Application Filing
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5975098A (en) * | 1995-12-21 | 1999-11-02 | Dainippon Screen Mfg. Co., Ltd. | Apparatus for and method of cleaning substrate |
| CN101414549A (en) * | 2007-10-17 | 2009-04-22 | 株式会社荏原制作所 | Substrate cleaning apparatus |
| CN203002672U (en) * | 2012-11-28 | 2013-06-19 | 北京七星华创电子股份有限公司 | Cleaning device for preventing liquid from splashing and cleaning system with cleaning device |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014082402A1 (en) * | 2012-11-28 | 2014-06-05 | 北京七星华创电子股份有限公司 | Cleaning device for preventing liquid from splashing and cleaning system having same |
| CN104841679A (en) * | 2015-05-21 | 2015-08-19 | 北京七星华创电子股份有限公司 | Cleaning medium collecting device |
| CN107634004A (en) * | 2016-07-19 | 2018-01-26 | 沈阳芯源微电子设备有限公司 | It is a kind of to prevent liquid from splashing the dash mechanism to haze |
| CN107199200A (en) * | 2017-07-18 | 2017-09-26 | 无锡市白马机械设备有限公司 | The special dash cover plate of bearing cleaning machine |
| CN107214132A (en) * | 2017-07-18 | 2017-09-29 | 无锡市白马机械设备有限公司 | Possesses the bearing cleaning machine that cleaning fluid spills defencive function |
| CN109570126A (en) * | 2018-12-27 | 2019-04-05 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | The monolithic cleaning device of multistage drug recycling |
| CN110698348A (en) * | 2019-10-29 | 2020-01-17 | 浙江汇翔化学工业有限公司 | Preparation method of 6-chloro-2, 4-dinitroaniline |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2014082402A1 (en) | 2014-06-05 |
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Application publication date: 20130327 |