CN104841679A - Cleaning medium collecting device - Google Patents
Cleaning medium collecting device Download PDFInfo
- Publication number
- CN104841679A CN104841679A CN201510260578.5A CN201510260578A CN104841679A CN 104841679 A CN104841679 A CN 104841679A CN 201510260578 A CN201510260578 A CN 201510260578A CN 104841679 A CN104841679 A CN 104841679A
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- China
- Prior art keywords
- cleansing medium
- annular housing
- cleaning
- rotary body
- piezoelectric ceramic
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
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- Cleaning Or Drying Semiconductors (AREA)
- Cleaning By Liquid Or Steam (AREA)
Abstract
The invention provides a cleaning medium collecting device and relates to the technical field of semiconductor wafer processes. The cleaning medium collecting device is used for collecting cleaning media after cleaning during the cleaning process of wafers borne on a rotary body and comprises a cleaning medium collecting structure, an annular cavity, a piezoelectric ceramic ultrasonic atomizing device, an exhaust component, a liquid discharge component and a condensation recovery device. The annular cavity is arranged at the peripheral edge of the rotary body. The high-frequency vibration performance of the piezoelectric ceramic ultrasonic atomizing device is utilized to atomize the liquid cleaning media tossed out during the cleaning process, liquid cleaning medium back splashing is prevented, secondary pollution is avoided, and wafer quality is further increased. Meanwhile, the atomized cleaning media are recycled through the exhaust component and the condensation recovery device, the cleaning media not atomized are recycled through the liquid discharge component, the recycling efficiency of the cleaning media is increased greatly, and cost is saved.
Description
Technical field
The invention belongs to semiconductor wafer process technical field, be specially a kind of cleansing medium gathering-device, when wafer carries out cleaning, the cleansing medium after cleaning is collected.
Background technology
The deep-submicron stage is being entered into along with integrated circuit feature size, the cleanliness factor of crystal column surface required in IC wafers manufacturing process is more and more harsher, in order to ensure the cleanliness factor on wafer material surface, there is hundreds of roads matting in the manufacturing process of integrated circuit, matting account for 30% of whole manufacture process.
In cleaning, along with the raising of cleaning, cleaning equipment has also developed into more complicated from the cleaning of initial slot type, and the monolithic that precision is also higher simultaneously cleans.In the process of wafer monolithic cleaning, utilize rotary body to drive wafer to rotate, the cleansing mediums such as the liquid of crystal column surface or ultra-pure water can be thrown away, carry out recycling or discharging.Generally speaking, liquid collection structure can be provided with around the rotary body of cleaning equipment, when cleansing medium throws away from crystal column surface, when touching the sidewall of liquid collection structure, can flow down along sidewall, be gathered together, be discharged by liquids recovery pipeline or discharge line.
But, in this course, because the liquid particles thrown away at a high speed is with very high kinetic energy, when clashing into the sidewall of liquid collection structure, likely can rebound, causing chemical reagent and wash products splash to the edge of wafer, or even wafer rear, and pollute.If this pollution can not be removed in time, wafer rear and edge can be made to cause defect, especially in follow-up high-temperature processing technology process, the Pollutants Diffusion at the back side and edge can be made to front, have a strong impact on the quality of wafer.In addition, the splash of liquid rinse medium also can cause the waste of liquid, increases production cost.Therefore, those skilled in the art need badly provides a kind of cleansing medium gathering-device, effectively can prevent liquid rinse medium splash, the quality of wafer is improved further, improves the organic efficiency of cleansing medium simultaneously.
Summary of the invention
For the deficiencies in the prior art part, the object of this invention is to provide a kind of cleansing medium gathering-device, effectively can prevent liquid rinse medium splash, the quality of wafer is improved further, improves the organic efficiency of cleansing medium simultaneously.
The object of the invention is realized by following technical proposals: the invention provides a kind of cleansing medium gathering-device, when being carried on the wafer on rotary body and carrying out cleaning, collects, comprising the cleansing medium after cleaning:
Cleansing medium collection structure, comprises annular housing, piezoelectric ceramic ultrasonic atomising device, gas deflation assembly, discharge opeing assembly and condensate recycling device; Wherein, described annular housing is at least one deck, is located at the periphery of described rotary body; Described piezoelectric ceramic ultrasonic atomising device is located on the sidewall of described annular housing, and is connected with external circuit, to be atomized the liquid phase cleansing medium in described annular housing; Described gas deflation assembly is located at one end of described annular housing, for the cleansing medium after atomization is detached described annular housing; The other end of described annular housing is located at by described discharge opeing assembly, for the cleansing medium be not atomized is discharged described annular housing; Described condensate recycling device is communicated with described gas deflation assembly, discharges after the cleansing medium after atomization is condensed to liquid phase;
Process cavity base ring, be located at the below of described annular housing, the liquid that the edge of described rotary body is provided with to lower process drips along structure, described liquid drips along structure for changing the flow direction on described rotary body, fluid drips on described rotary body is dropped down onto in described process cavity base ring, and is discharged by the discharging tube of described process cavity base ring.
Preferably, described gas deflation assembly comprises steam vent array, exhaust outlet and gas exhaust piping; Described steam vent array is located on the sidewall of described annular housing, and is communicated with described exhaust outlet and gas exhaust piping successively.
Preferably, described gas exhaust piping is provided with exhaust apparatus, discharges described annular housing with the cleansing medium after making described annular housing atomization.
Preferably, described discharge opeing assembly comprises outage array, leakage fluid dram and drain line; Described outage array is located at the lowest part of described annular housing sidewall, and is communicated with described leakage fluid dram and drain line successively.
Preferably, described annular housing is two-layer, the periphery being arranged on described rotary body of stacked on top of one another.
Preferably, described condensate recycling device also comprises gas vent and liquid outlet, and described liquid outlet is for discharging condensed liquid phase cleansing medium, and described gas vent is for discharging remaining gas.
Preferably, the surface of described piezoelectric ceramic ultrasonic atomising device is coated with corrosion-resistant finishes, to prevent cleansing medium to the corrosion of piezoelectric ceramic ultrasonic atomising device.
Preferably, the thickness of described corrosion-resistant finishes is between 1 μm ~ 100 μm.
Preferably, described piezoelectric ceramic ultrasonic atomising device is connected with external circuit by the binding post be located on the sidewall of described annular housing.
The invention provides a kind of cleansing medium gathering-device, first annular housing is set at the periphery of rotary body, utilize the dither performance of piezoelectric ceramic ultrasonic atomising device, in cleaning process, the liquid phase cleansing medium thrown away is atomized, prevent liquid phase cleansing medium from producing splash, avoid the generation of secondary pollution, the quality of wafer is improved further; Meanwhile, the cleansing medium after atomization is reclaimed by gas deflation assembly and condensate recycling device, the cleansing medium be not atomized is reclaimed by discharge opeing assembly, substantially increases the organic efficiency of cleansing medium, cost-saving.
Accompanying drawing explanation
In order to be illustrated more clearly in the technical scheme in the embodiment of the present invention, be briefly described to the accompanying drawing used required in embodiment below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the structural perspective of the preferred embodiment of cleansing medium gathering-device in the present invention;
Fig. 2 is the section of structure of the preferred embodiment of cleansing medium gathering-device in the present invention;
Fig. 3 is that in the present invention, liquid drips the structure enlarged diagram along structure;
Fig. 4 is the structure enlarged diagram of piezoelectric ceramic ultrasonic atomising device in the present invention;
Fig. 5 is the structure enlarged diagram of a-quadrant in Fig. 4;
Fig. 6 is the structure enlarged diagram in B region in Fig. 4.
Number in the figure is described as follows:
1-wafer, 2-annular housing, 3-piezoelectric ceramic ultrasonic atomising device, 4-condensate recycling device, 5-rotary body, 6-process cavity base ring, 7-liquid drips along structure, the discharging tube of 8-process cavity base ring, 9-steam vent array, 10-exhaust outlet, 11-gas exhaust piping, 12-outage array, 13-leakage fluid dram, 14-drain line, 15-gas vent, 16-liquid outlet, 17-corrosion-resistant finishes, 18-binding post, 19-holder, 20-motor.
Detailed description of the invention
For making content of the present invention clearly understandable, below in conjunction with Figure of description, content of the present invention is described further.Certain the present invention is not limited to this specific embodiment, and the general replacement known by those skilled in the art is also encompassed in protection scope of the present invention.Secondly, the present invention's detailed statement that utilized schematic diagram to carry out, when describing example of the present invention in detail, for convenience of explanation, schematic diagram, should in this, as limitation of the invention not according to general ratio partial enlargement.
It should be noted that, in following embodiment, utilize the structural representation of Fig. 1 ~ 6 to carry out detailed statement to by the cleansing medium gathering-device in the present invention.Describe in detail embodiments of the present invention time, for convenience of explanation, each schematic diagram not according to general scale and carried out partial enlargement and omit process, therefore, should avoid in this, as limitation of the invention.
As shown in Figure 2, wafer is when carrying out cleaning, and wafer 1 is fixed on rotary body 5 by holder 19 usually, rotates under the drive of motor 20, and the rotating speed of wafer 1 can be programmed according to concrete cleaning demand, is issued to motor 20 by computer.
As shown in Figure 1, 2, the invention provides a kind of cleansing medium gathering-device, when the wafer 1 be carried on rotary body 5 carries out cleaning, cleansing medium after cleaning is collected, comprise: cleansing medium collection structure, comprise annular housing 2, piezoelectric ceramic ultrasonic atomising device 3, gas deflation assembly, discharge opeing assembly and condensate recycling device 4.Wherein, annular housing 2 is at least one deck, is located at the periphery of rotary body 5; Piezoelectric ceramic ultrasonic atomising device 3 is located on the sidewall of described annular housing 2, and is connected with external circuit, to be atomized the liquid phase cleansing medium in annular housing 2; Gas deflation assembly is located at one end of annular housing 2, for the cleansing medium after atomization is discharged annular housing 2; The other end of annular housing 2 is located at by discharge opeing assembly, for the cleansing medium be not atomized is detached annular housing 2; Condensate recycling device 4 is communicated with gas deflation assembly, discharges after the cleansing medium after atomization is condensed to liquid phase.
In the present invention, the quantity of cleansing medium collection structure can be determined according to actual conditions, one deck can be stackedly set, two-layer or two-layer more than, present embodiments provide the cleansing medium collection structure with two-layer annular housing 2, the periphery being arranged on rotary body 5 of two-layer annular housing 2 stacked on top of one another, following content will be described in detail to cleansing medium gathering-device.
Be introduced for wherein one deck cleansing medium collection structure, the sidewall of annular housing 2 is provided with piezoelectric ceramic ultrasonic atomising device 3, fixed form is preferably pasted or bolt is fixedly connected with, and piezoelectric ceramic ultrasonic atomising device 3 is connected with external circuit by the binding post 18 be located on the sidewall of annular housing 2.When the external world applies to preset the signal of telecommunication, piezoelectric ceramic ultrasonic atomising device 3 produces sonic oscillation, and liquid phase cleansing medium is converted into the cleansing medium after atomization.Wherein, binding post 18 is connected with the lateral wall of piezoelectric ceramic ultrasonic atomising device 3 by the mode of welding, and reaches the outside of annular housing 2 by the preformed hole on the sidewall of annular housing 2.
Refer to Fig. 4, the surface of piezoelectric ceramic ultrasonic atomising device 3 is coated with corrosion-resistant finishes 17, to prevent cleansing medium to the corrosion of piezoelectric ceramic ultrasonic atomising device 3; The thickness of corrosion-resistant finishes 17 is preferably between 1 μm ~ 100 μm.
Refer to Fig. 5, in the present embodiment, discharge opeing assembly comprises outage array 12, leakage fluid dram 13 and drain line 14; Outage array 12 is located at the lowest part of described annular housing 2 sidewall, and is communicated with leakage fluid dram 13 and drain line 14 successively.Wherein, the diameter of outage is preferably between 1mm ~ 5mm, one end of leakage fluid dram 13 is fixedly connected with annular housing 2 by the mode of welding, the other end is fixedly connected with drain line 14, liquid phase cleansing medium enters leakage fluid dram 13 by outage array 12, then is flow to outside annular housing 2 by drain line 14.
Refer to Fig. 6, in the present embodiment, gas deflation assembly comprises steam vent array 9, exhaust outlet 10 and gas exhaust piping 11; Steam vent array 9 is located on the sidewall of annular housing 2, and is communicated with exhaust outlet 10 and gas exhaust piping 11 successively.Gas exhaust piping 11 is provided with exhaust apparatus (not shown), detaches annular housing 2, for detaching of gas provides kinetic energy with the cleansing medium after making annular housing 2 atomization.Wherein, the diameter of steam vent is preferably between 1mm ~ 3mm, one end of exhaust outlet 10 is fixedly connected with annular housing 2 by the mode of welding, the other end is fixedly connected with gas exhaust piping 11, cleansing medium after atomization enters exhaust outlet 10 by steam vent array 9, then is pumped to condensate recycling device 4 by gas exhaust piping 11.
After gas after detaching enters condensate recycling device 4, in the inside of this device, the cleansing medium after atomization is condensed into liquid and discharges; Concrete, condensate recycling device 4 also comprises gas vent 15 and liquid outlet 16, and liquid outlet 16 is for discharging condensed liquid phase cleansing medium, and gas vent 15 is for discharging remaining gas.
What deserves to be explained is, when adopting multi-layer annular cavity, a condensate recycling device 4 can be shared, also can connect different condensate recycling devices 4, specifically consider according to factors such as cleaning requirement and equipment costs.
As shown in Figure 3, in order to avoid the liquid runs down rotary body 5 trickled on rotary body 5 trickles to the motor 20 under rotary body 5, process cavity base ring 6 is also provided with in the below of annular housing 2, simultaneously, the liquid that the edge of rotary body 5 is provided with to lower process drips along structure 7, liquid drippage for changing the flow direction on rotary body 5 along structure 7, is made the fluid drips on rotary body 5 drop down onto in described process cavity base ring 6, and is discharged by the discharging tube 8 of process cavity base ring.
The method of work of cleansing medium gathering-device provided by the invention is as follows:
Equally for a wherein cleansing medium collection structure, piezoelectric ceramic ultrasonic atomising device 3 is connected with external circuit, according to the difference of cleansing medium, the parameter such as rotating speed, cleansing medium flow of rotary body 5, the relevant parameters such as the operating frequency of setting piezoelectric ceramic ultrasonic atomising device 3 and power.In cleaning process, according to process requirements, rotary body 5 can be adopted to be elevated or cleansing medium collection structure lifting mode make the height of wafer and cleansing medium collection structure consistent.
After cleaning starts, liquid phase cleansing medium is thrown off wafer rotate the effect of the centrifugal force produced at wafer 1 under, enter in annular housing 2, liquid phase cleansing medium contacts with the piezoelectric ceramic ultrasonic atomising device 3 in annular housing 2, liquid phase cleansing medium is made to be converted into spray pattern, cleansing medium subsequently after atomization and the environmental gas in annular housing 2 together detach annular housing 2 by gas deflation assembly, and enter condensate recycling device 4, cleansing medium after atomization is condensed into liquid by condensate recycling device 4 again, and discharged by the liquid outlet 16 of condensate recycling device 4, remaining gas is then discharged by gas vent 15, by valve transfer cleansing medium reclaimed or discharge, and for the cleansing medium be not atomized, then undertaken reclaiming or discharging by discharge opeing assembly.
In sum, the invention provides a kind of cleansing medium gathering-device, first annular housing 2 is set at the periphery of rotary body 5, utilize the dither performance of piezoelectric ceramic ultrasonic atomising device 3, in cleaning process, the liquid phase cleansing medium thrown away is atomized, prevents liquid phase cleansing medium from producing splash, avoid the generation of secondary pollution, the quality of wafer is improved further; Meanwhile, the cleansing medium after atomization is reclaimed by gas deflation assembly and condensate recycling device 4, the cleansing medium be not atomized is reclaimed by discharge opeing assembly, substantially increases the organic efficiency of cleansing medium, cost-saving.
Above-mentioned explanation illustrate and describes some preferred embodiments of the present invention, but as previously mentioned, be to be understood that the present invention is not limited to the form disclosed by this paper, should not regard the eliminating to other embodiments as, and can be used for other combinations various, amendment and environment, and can in invention contemplated scope described herein, changed by the technology of above-mentioned instruction or association area or knowledge.And the change that those skilled in the art carry out and change do not depart from the spirit and scope of the present invention, then all should in the protection domain of claims of the present invention.
Claims (9)
1. a cleansing medium gathering-device, when being carried on the wafer on rotary body and carrying out cleaning, the cleansing medium after cleaning is collected, it is characterized in that, comprising:
Cleansing medium collection structure, comprises annular housing, piezoelectric ceramic ultrasonic atomising device, gas deflation assembly, discharge opeing assembly and condensate recycling device; Wherein, described annular housing is at least one deck, is located at the periphery of described rotary body; Described piezoelectric ceramic ultrasonic atomising device is located on the sidewall of described annular housing, and is connected with external circuit, to be atomized the liquid phase cleansing medium in described annular housing; Described gas deflation assembly is located at one end of described annular housing, for the cleansing medium after atomization is detached described annular housing; The other end of described annular housing is located at by described discharge opeing assembly, for the cleansing medium be not atomized is discharged described annular housing; Described condensate recycling device is communicated with described gas deflation assembly, discharges after the cleansing medium after atomization is condensed to liquid phase;
Process cavity base ring, be located at the below of described annular housing, the liquid that the edge of described rotary body is provided with to lower process drips along structure, described liquid drips along structure for changing the flow direction on described rotary body, fluid drips on described rotary body is dropped down onto in described process cavity base ring, and is discharged by the discharging tube of described process cavity base ring.
2. cleansing medium gathering-device according to claim 1, is characterized in that, described gas deflation assembly comprises steam vent array, exhaust outlet and gas exhaust piping; Described steam vent array is located on the sidewall of described annular housing, and is communicated with described exhaust outlet and gas exhaust piping successively.
3. cleansing medium gathering-device according to claim 1, is characterized in that, described gas exhaust piping is provided with exhaust apparatus, discharges described annular housing with the cleansing medium after making described annular housing atomization.
4. cleansing medium gathering-device according to claim 1, is characterized in that, described discharge opeing assembly comprises outage array, leakage fluid dram and drain line; Described outage array is located at the lowest part of described annular housing sidewall, and is communicated with described leakage fluid dram and drain line successively.
5. cleansing medium gathering-device according to claim 1, is characterized in that, described annular housing is two-layer, the periphery being arranged on described rotary body of stacked on top of one another.
6. cleansing medium gathering-device according to claim 1, it is characterized in that, described condensate recycling device also comprises gas vent and liquid outlet, and described liquid outlet is for discharging condensed liquid phase cleansing medium, and described gas vent is for discharging remaining gas.
7. cleansing medium gathering-device according to claim 1, is characterized in that, the surface of described piezoelectric ceramic ultrasonic atomising device is coated with corrosion-resistant finishes, to prevent cleansing medium to the corrosion of piezoelectric ceramic ultrasonic atomising device.
8. cleansing medium gathering-device according to claim 7, is characterized in that, the thickness of described corrosion-resistant finishes is between 1 μm ~ 100 μm.
9. cleansing medium gathering-device according to claim 1, is characterized in that, described piezoelectric ceramic ultrasonic atomising device is connected with external circuit by the binding post be located on the sidewall of described annular housing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510260578.5A CN104841679B (en) | 2015-05-21 | 2015-05-21 | Cleaning medium collecting device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510260578.5A CN104841679B (en) | 2015-05-21 | 2015-05-21 | Cleaning medium collecting device |
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| CN104841679A true CN104841679A (en) | 2015-08-19 |
| CN104841679B CN104841679B (en) | 2017-02-22 |
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| CN201510260578.5A Active CN104841679B (en) | 2015-05-21 | 2015-05-21 | Cleaning medium collecting device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112201593A (en) * | 2020-09-23 | 2021-01-08 | 北京北方华创微电子装备有限公司 | Wafer cleaning equipment |
| CN112676226A (en) * | 2019-10-17 | 2021-04-20 | 夏泰鑫半导体(青岛)有限公司 | Wafer cleaning device |
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| CN103357637A (en) * | 2012-03-31 | 2013-10-23 | 弘塑科技股份有限公司 | Air exhausting device of mobile drainage tanks of cleaning etching machine platform |
| CN103489814A (en) * | 2013-09-24 | 2014-01-01 | 深圳市凯尔迪光电科技有限公司 | Full-automation mega sound wave semiconductor wafer cleaning device |
| CN204747028U (en) * | 2015-05-21 | 2015-11-11 | 北京七星华创电子股份有限公司 | Cleansing medium collection device |
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2015
- 2015-05-21 CN CN201510260578.5A patent/CN104841679B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2000183012A (en) * | 1998-12-21 | 2000-06-30 | Sony Corp | Method and device for cleaning substrate |
| CN103357637A (en) * | 2012-03-31 | 2013-10-23 | 弘塑科技股份有限公司 | Air exhausting device of mobile drainage tanks of cleaning etching machine platform |
| CN102989705A (en) * | 2012-11-28 | 2013-03-27 | 北京七星华创电子股份有限公司 | Cleaning device capable of preventing liquid from splashing and cleaning system with same |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112676226A (en) * | 2019-10-17 | 2021-04-20 | 夏泰鑫半导体(青岛)有限公司 | Wafer cleaning device |
| CN112201593A (en) * | 2020-09-23 | 2021-01-08 | 北京北方华创微电子装备有限公司 | Wafer cleaning equipment |
| CN112201593B (en) * | 2020-09-23 | 2024-06-21 | 北京北方华创微电子装备有限公司 | Wafer cleaning equipment |
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| CN104841679B (en) | 2017-02-22 |
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Address after: 100015 No. 1 East Jiuxianqiao Road, Beijing, Chaoyang District Patentee after: North China Science and technology group Limited by Share Ltd. Address before: 100016 Jiuxianqiao East Road, Beijing, No. 1, No. Patentee before: BEIJING SEVENSTAR ELECTRONIC Co.,Ltd. |
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Effective date of registration: 20180403 Address after: 100176 No. 8, Wenchang Avenue, Beijing economic and Technological Development Zone Patentee after: BEIJING NAURA MICROELECTRONICS EQUIPMENT Co.,Ltd. Address before: 100015 No. 1 East Jiuxianqiao Road, Beijing, Chaoyang District Patentee before: North China Science and technology group Limited by Share Ltd. |