TW200919622A - Carrying bench and plasma treatment apparatus using the same - Google Patents

Carrying bench and plasma treatment apparatus using the same Download PDF

Info

Publication number
TW200919622A
TW200919622A TW097121736A TW97121736A TW200919622A TW 200919622 A TW200919622 A TW 200919622A TW 097121736 A TW097121736 A TW 097121736A TW 97121736 A TW97121736 A TW 97121736A TW 200919622 A TW200919622 A TW 200919622A
Authority
TW
Taiwan
Prior art keywords
substrate
divided
stage according
stage
plasma
Prior art date
Application number
TW097121736A
Other languages
English (en)
Chinese (zh)
Inventor
Yoshihiko Sasaki
Masato Minami
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200919622A publication Critical patent/TW200919622A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Plasma & Fusion (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
TW097121736A 2007-06-12 2008-06-11 Carrying bench and plasma treatment apparatus using the same TW200919622A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007155444A JP4782733B2 (ja) 2007-06-12 2007-06-12 載置台およびそれを用いたプラズマ処理装置

Publications (1)

Publication Number Publication Date
TW200919622A true TW200919622A (en) 2009-05-01

Family

ID=40188624

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097121736A TW200919622A (en) 2007-06-12 2008-06-11 Carrying bench and plasma treatment apparatus using the same

Country Status (4)

Country Link
JP (1) JP4782733B2 (ja)
KR (1) KR101019880B1 (ja)
CN (1) CN101325169B (ja)
TW (1) TW200919622A (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI831806B (zh) * 2018-07-17 2024-02-11 美商應用材料股份有限公司 陶瓷混合絕緣板

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5586878B2 (ja) 2009-06-08 2014-09-10 キヤノン株式会社 Ｘ線画像撮影装置
KR101582474B1 (ko) * 2009-12-21 2016-01-05 주식회사 원익아이피에스 기판처리장치 및 그에 사용되는 복개부재
CN102918180B (zh) * 2010-05-21 2014-12-17 应用材料公司 大面积电极上的紧密安装的陶瓷绝缘体
JP5885939B2 (ja) * 2010-07-20 2016-03-16 東京エレクトロン株式会社 シールド部材及びシールド部材を備えた基板載置台
CN102337511B (zh) * 2010-07-20 2014-02-26 东京毅力科创株式会社 屏蔽部件、其构成零件以及具有屏蔽部件的基板载置台
CN103081088B (zh) * 2010-08-06 2016-04-06 应用材料公司 静电夹盘和使用静电夹盘的方法
JP2012109446A (ja) * 2010-11-18 2012-06-07 Tokyo Electron Ltd 絶縁部材及び絶縁部材を備えた基板処理装置
KR101796475B1 (ko) * 2011-07-15 2017-11-14 (주)코미코 기판 적재용 트레이
JP5667012B2 (ja) * 2011-08-26 2015-02-12 東京エレクトロン株式会社 リング状シールド部材、その構成部品及びリング状シールド部材を備えた基板載置台
JP5893516B2 (ja) * 2012-06-22 2016-03-23 東京エレクトロン株式会社 被処理体の処理装置及び被処理体の載置台
JP5992288B2 (ja) * 2012-10-15 2016-09-14 東京エレクトロン株式会社 ガス導入装置及び誘導結合プラズマ処理装置
CN103887136B (zh) * 2012-12-20 2016-03-09 上海华虹宏力半导体制造有限公司 一种适用于金属干法刻蚀半导体设备的刻蚀腔室
JP5941971B2 (ja) * 2014-12-10 2016-06-29 東京エレクトロン株式会社 リング状シールド部材及びリング状シールド部材を備えた基板載置台
JP6380094B2 (ja) * 2014-12-26 2018-08-29 東京エレクトロン株式会社 載置台及びプラズマ処理装置
CN105789094B (zh) * 2016-03-30 2018-08-14 武汉华星光电技术有限公司 干蚀刻装置及降低其内屏蔽环与吸附平台间缝隙的方法
CN106206385A (zh) * 2016-09-27 2016-12-07 上海华力微电子有限公司 一种降低腔体内金属污染含量的多晶硅刻蚀腔及方法
KR102006435B1 (ko) * 2017-09-01 2019-08-01 주식회사 한화 보트 장치
CN112117209A (zh) * 2019-06-21 2020-12-22 上海微电子装备（集团）股份有限公司 硅片吸附装置及激光退火设备
KR102633111B1 (ko) * 2019-11-07 2024-02-02 주식회사 원익아이피에스 기판지지대, 기판처리장치, 및 기판처리시스템

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0880534A (ja) * 1994-09-13 1996-03-26 Yokohama Rubber Co Ltd:The 無端ベルト用加硫プレス装置
JP3424903B2 (ja) * 1997-01-23 2003-07-07 東京エレクトロン株式会社 プラズマ処理装置
JP3294175B2 (ja) * 1997-11-05 2002-06-24 東京エレクトロン株式会社 信頼性試験用ウエハ収納室
JP3924721B2 (ja) * 1999-12-22 2007-06-06 東京エレクトロン株式会社 シールドリングの分割部材、シールドリング及びプラズマ処理装置
JP2003324053A (ja) * 2002-04-30 2003-11-14 Nikon Corp ステージ装置および露光装置
WO2005074015A1 (ja) * 2004-01-29 2005-08-11 Nikon Corporation 板部材の支持方法、板部材支持装置、ステージ装置、露光装置、及びデバイスの製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI831806B (zh) * 2018-07-17 2024-02-11 美商應用材料股份有限公司 陶瓷混合絕緣板

Also Published As

Publication number Publication date
JP2008311298A (ja) 2008-12-25
JP4782733B2 (ja) 2011-09-28
KR101019880B1 (ko) 2011-03-04
KR20080109646A (ko) 2008-12-17
CN101325169B (zh) 2010-09-22
CN101325169A (zh) 2008-12-17

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