CN101325169B - 载置台和使用该载置台的等离子体处理装置 - Google Patents

载置台和使用该载置台的等离子体处理装置 Download PDF

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Publication number
CN101325169B
CN101325169B CN2008101256363A CN200810125636A CN101325169B CN 101325169 B CN101325169 B CN 101325169B CN 2008101256363 A CN2008101256363 A CN 2008101256363A CN 200810125636 A CN200810125636 A CN 200810125636A CN 101325169 B CN101325169 B CN 101325169B
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China
Prior art keywords
cutting plate
base material
force application
mounting table
substrate
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Expired - Fee Related
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CN2008101256363A
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English (en)
Chinese (zh)
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CN101325169A (zh
Inventor
佐佐木芳彦
南雅人
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Plasma & Fusion (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
CN2008101256363A 2007-06-12 2008-06-12 载置台和使用该载置台的等离子体处理装置 Expired - Fee Related CN101325169B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007-155444 2007-06-12
JP2007155444A JP4782733B2 (ja) 2007-06-12 2007-06-12 載置台およびそれを用いたプラズマ処理装置
JP2007155444 2007-06-12

Publications (2)

Publication Number Publication Date
CN101325169A CN101325169A (zh) 2008-12-17
CN101325169B true CN101325169B (zh) 2010-09-22

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CN2008101256363A Expired - Fee Related CN101325169B (zh) 2007-06-12 2008-06-12 载置台和使用该载置台的等离子体处理装置

Country Status (4)

Country Link
JP (1) JP4782733B2 (ja)
KR (1) KR101019880B1 (ja)
CN (1) CN101325169B (ja)
TW (1) TW200919622A (ja)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5586878B2 (ja) * 2009-06-08 2014-09-10 キヤノン株式会社 Ｘ線画像撮影装置
KR101582474B1 (ko) * 2009-12-21 2016-01-05 주식회사 원익아이피에스 기판처리장치 및 그에 사용되는 복개부재
JP6104157B2 (ja) * 2010-05-21 2017-03-29 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 大面積電極にぴったりと嵌合されたセラミックス絶縁体
CN102337511B (zh) * 2010-07-20 2014-02-26 东京毅力科创株式会社 屏蔽部件、其构成零件以及具有屏蔽部件的基板载置台
JP5885939B2 (ja) * 2010-07-20 2016-03-16 東京エレクトロン株式会社 シールド部材及びシールド部材を備えた基板載置台
KR101892911B1 (ko) * 2010-08-06 2018-08-29 어플라이드 머티어리얼스, 인코포레이티드 정전 척 및 정전 척의 사용 방법들
JP2012109446A (ja) * 2010-11-18 2012-06-07 Tokyo Electron Ltd 絶縁部材及び絶縁部材を備えた基板処理装置
KR101796475B1 (ko) * 2011-07-15 2017-11-14 (주)코미코 기판 적재용 트레이
JP5667012B2 (ja) * 2011-08-26 2015-02-12 東京エレクトロン株式会社 リング状シールド部材、その構成部品及びリング状シールド部材を備えた基板載置台
JP5893516B2 (ja) * 2012-06-22 2016-03-23 東京エレクトロン株式会社 被処理体の処理装置及び被処理体の載置台
JP5992288B2 (ja) * 2012-10-15 2016-09-14 東京エレクトロン株式会社 ガス導入装置及び誘導結合プラズマ処理装置
CN103887136B (zh) * 2012-12-20 2016-03-09 上海华虹宏力半导体制造有限公司 一种适用于金属干法刻蚀半导体设备的刻蚀腔室
JP5941971B2 (ja) * 2014-12-10 2016-06-29 東京エレクトロン株式会社 リング状シールド部材及びリング状シールド部材を備えた基板載置台
JP6380094B2 (ja) * 2014-12-26 2018-08-29 東京エレクトロン株式会社 載置台及びプラズマ処理装置
CN105789094B (zh) * 2016-03-30 2018-08-14 武汉华星光电技术有限公司 干蚀刻装置及降低其内屏蔽环与吸附平台间缝隙的方法
CN106206385A (zh) * 2016-09-27 2016-12-07 上海华力微电子有限公司 一种降低腔体内金属污染含量的多晶硅刻蚀腔及方法
KR102006435B1 (ko) * 2017-09-01 2019-08-01 주식회사 한화 보트 장치
US10867829B2 (en) * 2018-07-17 2020-12-15 Applied Materials, Inc. Ceramic hybrid insulator plate
CN112117209A (zh) * 2019-06-21 2020-12-22 上海微电子装备（集团）股份有限公司 硅片吸附装置及激光退火设备
KR102633111B1 (ko) * 2019-11-07 2024-02-02 주식회사 원익아이피에스 기판지지대, 기판처리장치, 및 기판처리시스템

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0880534A (ja) * 1994-09-13 1996-03-26 Yokohama Rubber Co Ltd:The 無端ベルト用加硫プレス装置
JP3424903B2 (ja) * 1997-01-23 2003-07-07 東京エレクトロン株式会社 プラズマ処理装置
JP3294175B2 (ja) * 1997-11-05 2002-06-24 東京エレクトロン株式会社 信頼性試験用ウエハ収納室
JP3924721B2 (ja) * 1999-12-22 2007-06-06 東京エレクトロン株式会社 シールドリングの分割部材、シールドリング及びプラズマ処理装置
JP2003324053A (ja) * 2002-04-30 2003-11-14 Nikon Corp ステージ装置および露光装置
JPWO2005074015A1 (ja) * 2004-01-29 2007-09-13 株式会社ニコン 板部材の支持方法、板部材支持装置、ステージ装置、露光装置、及びデバイスの製造方法

Also Published As

Publication number Publication date
JP4782733B2 (ja) 2011-09-28
JP2008311298A (ja) 2008-12-25
CN101325169A (zh) 2008-12-17
KR20080109646A (ko) 2008-12-17
TW200919622A (en) 2009-05-01
KR101019880B1 (ko) 2011-03-04

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Termination date: 20160612