TW200912375A - Laser irradiation apparatus and laser processing system using same apparatus - Google Patents

Laser irradiation apparatus and laser processing system using same apparatus Download PDF

Info

Publication number
TW200912375A
TW200912375A TW097127768A TW97127768A TW200912375A TW 200912375 A TW200912375 A TW 200912375A TW 097127768 A TW097127768 A TW 097127768A TW 97127768 A TW97127768 A TW 97127768A TW 200912375 A TW200912375 A TW 200912375A
Authority
TW
Taiwan
Prior art keywords
light
laser
deflecting
moving mechanism
mirror
Prior art date
Application number
TW097127768A
Other languages
English (en)
Chinese (zh)
Inventor
Junko Aruga
Tatsuya Nakamura
Koichi Takahashi
Original Assignee
Olympus Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olympus Corp filed Critical Olympus Corp
Publication of TW200912375A publication Critical patent/TW200912375A/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0869—Devices involving movement of the laser head in at least one axial direction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Mechanical Light Control Or Optical Switches (AREA)
TW097127768A 2007-07-25 2008-07-22 Laser irradiation apparatus and laser processing system using same apparatus TW200912375A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007193549A JP5137488B2 (ja) 2007-07-25 2007-07-25 レーザ照射装置およびそれを用いたレーザ加工システム

Publications (1)

Publication Number Publication Date
TW200912375A true TW200912375A (en) 2009-03-16

Family

ID=40307363

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097127768A TW200912375A (en) 2007-07-25 2008-07-22 Laser irradiation apparatus and laser processing system using same apparatus

Country Status (4)

Country Link
JP (1) JP5137488B2 (enExample)
KR (1) KR20090012106A (enExample)
CN (1) CN101354481B (enExample)
TW (1) TW200912375A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102481664A (zh) * 2009-05-28 2012-05-30 伊雷克托科学工业股份有限公司 应用于介电质或其它材料的激光处理中的声光偏转器

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5346690B2 (ja) * 2009-05-26 2013-11-20 オリンパス株式会社 レーザ照射装置
JP5393406B2 (ja) * 2009-11-06 2014-01-22 オリンパス株式会社 パターン投影装置、走査型共焦点顕微鏡、及びパターン照射方法
DE102010020183B4 (de) * 2010-05-11 2013-07-11 Precitec Kg Laserschneidkopf und Verfahren zum Schneiden eines Werkstücks mittels eines Laserschneidkopfes
KR101114738B1 (ko) * 2010-09-27 2012-02-29 주식회사 피케이엘 가변형 어퍼쳐 및 이를 포함하는 스퍼터 장치
JP5644481B2 (ja) * 2010-12-24 2014-12-24 コニカミノルタ株式会社 画像投影装置
JP5678693B2 (ja) * 2011-01-31 2015-03-04 コニカミノルタ株式会社 画像投影装置
US10688527B2 (en) 2011-09-22 2020-06-23 Delta Electronics, Inc. Phosphor device comprising plural phosphor agents for converting waveband light into plural color lights with different wavelength peaks
TWI669833B (zh) * 2016-04-19 2019-08-21 台達電子工業股份有限公司 螢光劑裝置
JP6049391B2 (ja) 2011-10-17 2016-12-21 株式会社東芝 レーザ照射装置及びレーザ照射ヘッドの健全性診断方法
KR101299234B1 (ko) * 2011-11-01 2013-08-22 주식회사 이오테크닉스 2빔 가공이 가능한 레이저 가공 장치 및 방법
CN102489876B (zh) * 2011-11-11 2014-06-25 北京中科思远光电科技有限公司 一种采用激光辅助加热的激光退火方法及装置
JP5720586B2 (ja) * 2012-01-19 2015-05-20 コニカミノルタ株式会社 画像投映装置
JP6321932B2 (ja) * 2013-09-24 2018-05-09 株式会社小糸製作所 車両用前照灯
JP6868766B2 (ja) * 2017-03-15 2021-05-12 パナソニックＩｐマネジメント株式会社 レーザ加工システム
WO2019244339A1 (ja) * 2018-06-22 2019-12-26 オリンパス株式会社 照明装置および内視鏡システム
CN111940892B (zh) * 2019-05-14 2023-06-02 雷科股份有限公司 用于切割低介电值材料晶圆的快速切换光路架构
CN113634877A (zh) * 2020-04-27 2021-11-12 大族激光科技产业集团股份有限公司 一种激光加工装置及方法
CN111751806A (zh) * 2020-07-29 2020-10-09 深圳元戎启行科技有限公司 准直装置、激光雷达发射系统和激光雷达收发系统
US12403548B2 (en) * 2020-08-19 2025-09-02 Panasonic Intellectual Property Management Co., Ltd. Laser processing apparatus and laser processing method
JP7730643B2 (ja) * 2020-08-21 2025-08-28 浜松ホトニクス株式会社 レーザ加工装置及びレーザ加工方法
JP7609624B2 (ja) * 2020-12-16 2025-01-07 株式会社ダイヘン レーザヘッド
KR102674642B1 (ko) * 2023-08-31 2024-06-12 주식회사 에이비파트너스 용접 품질 검사장치

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6171194A (ja) * 1984-09-14 1986-04-12 Mitsubishi Electric Corp レ−ザ加工装置
JPH0483488A (ja) * 1990-07-26 1992-03-17 Toshiba Corp 映像信号伝送システムと映像信号送信装置及び映像信号受信装置
JPH0483488U (enExample) * 1990-11-28 1992-07-21
JPH1158052A (ja) * 1997-08-26 1999-03-02 Nippon Steel Corp レーザ加工装置
JP5048899B2 (ja) * 2001-09-28 2012-10-17 オリンパス株式会社 顕微鏡
JP2005203697A (ja) * 2004-01-19 2005-07-28 Fuji Photo Film Co Ltd マルチビーム露光装置
JP4184288B2 (ja) * 2004-01-20 2008-11-19 日立ビアメカニクス株式会社 レーザ加工機
WO2006100780A1 (ja) * 2005-03-24 2006-09-28 Olympus Corporation リペア方法及びその装置
JP4429974B2 (ja) * 2005-06-17 2010-03-10 オリンパス株式会社 レーザ加工方法および装置
JP5036144B2 (ja) * 2005-06-28 2012-09-26 オリンパス株式会社 レーザ加工装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102481664A (zh) * 2009-05-28 2012-05-30 伊雷克托科学工业股份有限公司 应用于介电质或其它材料的激光处理中的声光偏转器
CN102481664B (zh) * 2009-05-28 2014-11-05 伊雷克托科学工业股份有限公司 应用于介电质或其它材料的激光处理中的声光偏转器

Also Published As

Publication number Publication date
KR20090012106A (ko) 2009-02-02
JP2009028742A (ja) 2009-02-12
CN101354481A (zh) 2009-01-28
CN101354481B (zh) 2012-11-28
JP5137488B2 (ja) 2013-02-06

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