TW200912375A - Laser irradiation apparatus and laser processing system using same apparatus - Google Patents

Abstract

A laser irradiation apparatus and a laser processing system of the present invention are provided with a light source of a laser beam; a reflecting mirror which has a movably supported deflecting plane for deflecting the laser beam output from the light source; a mirror driving mechanism for arranging the deflecting plane by tilting the deflecting plane about an optic axis of the laser beam and by moving the deflecting plane along the optic axis of the laser beam; a spatial modulation element for modulating the laser beam deflected by the reflecting mirror and forming an ON-light which is targeted to a surface of a work piece, and a projection optical system for projecting the ON-light formed by the spatial modulation element on the surface of the work piece.

Description

200912375 IX. DESCRIPTION OF THE INVENTION: FIELD OF THE INVENTION The present invention relates to a laser irradiation apparatus and a laser processing system using the same. Background Art In the past, there has been known a laser processing apparatus (laser irradiation apparatus) which performs processing by irradiating laser light to a desired area of a workpiece. For example, a laser repairing device that can correct a defective portion such as a wiring pattern existing on a glass substrate or an unnecessary residue on an exposure mask in the manufacture of a liquid crystal display or the like is known. For example, Patent Document No. 8-174242 discloses a field source, a processing table on which a workpiece is placed, a micro mirror array (micromirror array), and a plurality of lens angles by a micro mirror array. Perform (10) (10) control to switch 'and can read and read the laser processing device to form an arbitrary pattern shape. In addition, as described in the patent document 2 (Japanese Patent Publication No. Hei 6-35-123), the seeding and gamma irradiation device has a laser beam that has a reduced lightning rate with respect to the micro-mirror array. The use of the mirror array: shadow === ΓΓ device 'by the microscopic _ heart to break plus read. Due to the structure of the inter-mirror mirror, the reflected laser light is scattered into most of the diffracted light of 200912375. However, since the numerical aperture of the rear side of the general microscope is small, it is impossible to completely inject the diffracted light which is dispersed in a large amount. For example, Fig. 8 is a diagram showing the angle distribution of the diffracted light of the laser processing device 5 of the second harmonic (wavelength λ 2 = 532 nm) and the third harmonic (wavelength λ 3 = 354.7 nm) of the switchable YAG laser. example. That is, the angular distribution (α, /3) of the diffracted light reflected by the micromirror array is indicated on the angle plane 501 centered on the incident microscope optical axis 502. As shown by the X mark, the wavelength 13 has one diffraction order 504 near the optical axis 502. The small mirror surface corresponding to the field of laser light irradiation is inclined so as to reflect the laser light in the direction of the optical axis 502, so that the diffraction order 504 close to the optical axis 502 becomes the only diffracted light having a large intensity. The diffraction order 5〇4 is located within the range of the rear side angular aperture 503 of the microscope, so that the intensity of the laser light is sufficient to efficiently illuminate the workpiece. On the other hand, as shown by the symbol ', once the wavelength is switched to 2, 15, there will be no diffraction order near the optical axis 502, and there are 4 diffraction orders 505 at positions away from the same angle. . Therefore, the intensity of the laser is dispersed by the above-described majority of the diffraction orders 505, and does not enter the side corner aperture 503 of the microscope. Although it is possible to change the incident angle with respect to the microscope so that one diffraction order is incident, even this does not improve the efficiency of use of the laser light. In Patent Document 2, a laser processing apparatus (laser irradiation apparatus) is constructed in which the optical axis of the modulated light projection optical system and the diffracted light of a plurality of wavelengths of light are configured. The general direction is roughly the same. Specifically, the tilt angle of the micromirror array is adjusted according to the majority wavelength of the laser light and the arrangement interval of the micromirrors, thereby setting the direction of the reflection of the specular reflected light to the direction common to the respective diffracted lights, and then shifting the modulated light. The optical axis of the optical system coincides with its direction of reflection. However, the aforementioned conventional laser irradiation apparatus has the following problems. In the technique described in Patent Document 2, since the tilt angle of the micromirror is adjusted, the wavelength of light is large, and there is a problem that a micromirror array having versatility cannot be used, and a high-priced micromirror array is required. SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and an object thereof is to provide a laser irradiation apparatus capable of obtaining good light use efficiency even when the wavelength of laser light or the tilt angle of a micro mirror array is changed. A laser processing system using the device. In order to solve the above problems, the laser irradiation apparatus of the present invention includes: a laser light source; and an optical path deflecting portion that deflects the laser light emitted from the 15 laser light sources by a supported and movable deflecting surface; And a deflecting surface moving mechanism that can move the deflecting surface of the optical path deflecting portion obliquely with respect to the optical axis of the laser light, and can move in the optical axis direction; and spatially modulate the laser light deflected by the optical path deflecting portion And a spatial modulation element having a plurality of minute mirror surfaces that form ON light toward the illuminated surface; and a structure of a projection optical system that projects the ΟN light formed by the spatial modulation element of the previous 20 onto the illuminated surface. According to the invention, the inclination of the deflecting optical axis of the optical path deflecting portion and the position of the optical axis direction can be changed by the deflecting surface moving mechanism. Therefore, the laser beam can be emitted from the laser light source and deflected by the deflecting surface. 7 200912375 The light is changed with respect to the incident angle and the incident position of the spatial modulation element. As a result, for example, in the case where the wavelength of the laser light source is switched, or in the case where the tilt angle of the micro mirror surface in which the ON state is changed due to the change of the spatial modulation element, depending on the wavelength or the tilt angle, Set the incident angle and incident position for each situation. The laser processing system of the present invention comprises: the laser irradiation device of the present invention; and the projection optics of the laser irradiation device in order to capture a workpiece disposed on the illuminated surface of the laser irradiation device a photographing optical system that is disposed coaxially with the system; an imaging unit that is disposed at 10 imaging positions of the imaging optical system; and an image processing unit that performs image processing on the image captured by the imaging unit to extract a defect of the workpiece, and The laser processing system modulates the spatial modulation element of the laser irradiation device by a shape of a defect extracted by the image processing unit, and irradiates the spatially modulated laser light to the workpiece. The structure in which the above-mentioned 15 workpieces are processed is performed. According to the invention, since the laser irradiation apparatus of the present invention is used, the same effects as those of the laser irradiation apparatus of the present invention are obtained. Advantageous Effects of Invention According to the laser irradiation apparatus of the present invention and the laser processing 20 system using the same, the incident angle and the incident position of the laser light with respect to the spatial modulation element and the micromirror surface can be changed by the deflection surface moving mechanism. Therefore, even if the wavelength of the laser light or the tilt angle of the micro mirror array is changed, good light use efficiency can be obtained. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic cross-sectional view showing an optical axis including a laser irradiation apparatus according to an embodiment of the present invention and a schematic configuration of a laser processing system using the apparatus. 2A, 2B, and 2C are schematic cross-sectional views illustrating a diffraction phenomenon of a spatial modulation element of the 5 laser irradiation apparatus according to an embodiment of the present invention. Fig. 3 is a functional block diagram showing a schematic configuration of a control unit of a laser processing system according to an embodiment of the present invention. Fig. 4 is a schematic explanatory view showing the action of the deflecting surface moving mechanism of the laser irradiation apparatus according to the embodiment of the present invention. Fig. 5 is a schematic explanatory view showing the structure of a deflection surface moving mechanism of the laser irradiation device according to the first modification of the embodiment of the present invention. Fig. 6 is a schematic perspective view showing the structure of the optical path deflecting portion and the deflecting surface moving mechanism of the laser irradiating device according to the second modification of the embodiment of the present invention. Fig. 7 is a schematic view showing the structure of the optical path deflecting portion and the deflecting surface moving mechanism of the laser irradiating device according to the third modified example of the embodiment of the present invention. Fig. 8 is an angular distribution diagram for explaining an example of the diffracted light angle distribution of the laser processing device capable of switching wavelengths. [Embodiment] BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. In all the drawings, even if the embodiments are different, the same reference numerals are attached to the same or corresponding components, and the description of the common points is omitted. 9 200912375 [First Embodiment] A laser irradiation apparatus according to a first embodiment of the present invention and a laser processing system using the same will be described. Fig. 1 is a schematic cross-sectional view showing a laser irradiation apparatus according to an embodiment of the present invention and an optical axis including a schematic structure of a laser processing system using the apparatus. Fig. 2A, Fig. 2B, and Fig. 2C are schematic cross-sectional views showing the diffraction phenomenon of the spatial modulation element of the laser irradiation apparatus according to the embodiment of the present invention. Fig. 3 is a functional block diagram showing a schematic configuration of a control unit of a laser processing system according to an embodiment of the present invention. 10 The XYZ coordinate line in the figure is set to the common positional relationship of each figure for the convenience of the reference direction, the vertical direction is the Z axis, and the horizontal plane is the XY plane, and the direction from the negative direction of the Y axis to the positive direction of the Y axis and the front view The directions are the same (the other figures are the same below). The line showing the beam of light schematically depicts the situation in which a laser beam is incident on a point of the sample. The laser processing system 10 of the present embodiment is a device for irradiating a workpiece with a laser beam for repair processing. For example, in a glass substrate or a semiconductor wafer substrate of an LCD (Liquid Crystal Display), a workpiece such as a circuit pattern is formed on a substrate by a photolithography process, and defects such as a short wiring portion and a photoresist are detected, for example. In the case of the portion, the laser processing system 100 of the present embodiment can be applied to repair processing such as removal of defective portions. The schematic structure of the laser processing system 100 is shown in FIG. 1 by the laser light source 50, the processing head 20, the processing head moving mechanism 31, the mounting table 21, the control unit 22, the display unit 30, and the user interface 32. Composition. As the processed 10 200912375, the substrate 11 placed under the processing head 20 is horizontally loaded during processing.

It is placed on the mounting table 21 and will be missing the positive side of the 4-axis). The σ working surface Ua (irradiated surface) faces the upper side (Z; ·, the light source 50 is the source for 4+ AA ^ for repair processing. In the present embodiment, the structure of the laser light source is controlled by the lightning oscillation state 1 The projection lens 4 of the present embodiment is disposed inside the processing head 20, and the coupling lens 2, the fiber 3, and the armor lens 4 are arranged. The laser (four) device 1 is long and output. The laser light has been set so that σ* goes to the axis on the substrate 11. For example, a laser or the like can be used as the laser oscillator 1. The laser vibrator i is a structure that can switch a majority of the vibrating wavelength depending on the object to be repaired. The device is electrically connected to the control unit and controls the oscillation in accordance with a control signal from the control unit 22. The light-fitting lens 2 is an optical element for bonding the laser beam surface 15 from the laser to the fiber 3. The fiber 3 internally transmits the laser light that is optically coupled to the fiber end face 3a by the coupling lens 2, and is introduced into the processing head 20, and then emitted as laser light 6 从 from the fiber end face 3b. Since the laser light 60 is emitted after being transmitted inside the fiber 3, even if the laser light of the laser oscillator has a Gaussian distribution, it will become a diffused light in which the light amount distribution is uniform. The projection lens 4 sets the projection magnification so that the image of the fiber end surface 3b is irradiated to a lens or a lens group in the modulation domain of the spatial modulation element 6 to be described later. The projection lens 4 is fixed to the outer casing 2A of the processing head 20. In this embodiment, is the projection lens 4 arranged such that its optical axis? 1 is substantially parallel to the 2 axes. The 200912375 example is described as an example, but the arrangement position is not limited thereto. Due to the schematic view of Fig. 1A, only the beam on the edge axis is drawn in the projection optical system. Although the laser oscillator 1 is disposed along the Z-axis direction, the arrangement position, posture, and the like of the laser oscillator 1 are not limited thereto, and can be appropriately arranged by appropriately arranging the fibers 53 and 5 ,posture. Further, a modal discriminator (m〇de scrambier) for stabilizing the fiber and the mode can be installed. The laser light homogenizing apparatus may also use other optical components instead of the aforementioned fibers 3. For example, it is also possible to use a homogenizer (H〇m〇genizer) or the like and the homogenizer includes a Dy eye lens, a diffraction element 10, an aspheric lens, or a kaleidoscope type rod. And other structures. The processing head 20 is a mirror surface 33 (optical path deflecting portion), a mirror moving mechanism 34 (biasing surface moving mechanism), a spatial modulation element 6, a projection optical system 8, an observation light source 16, an observation imaging lens 12, and an imaging element. The optical element, the device, and the like are held in the outer casing 20a, and the outer casing 20a is held by the machining head moving mechanism 31 having a suitable driving device, and is relatively movable in the XYZ-axis direction with respect to the planting table 21. In the present embodiment, the relative movement is performed by moving the machining head 20 in the X-axis direction parallel to the workpiece surface 11a and the direction perpendicular to the workpiece surface 11a (Z-axis direction) by the machining head moving mechanism 31. The example in which the substrate 11 is moved in the Y-axis direction by the mounting table 21 20 will be described. However, the relative movement is not limited thereto, and for example, the processing head 20 may be moved in the Z-axis direction, and the planting table 21 may be moved in the XY-axis direction, or the mounting table 21 may be fixed and the processing head 2 may be moved in the XYZ-axis direction. The relative movement of the appropriate match. It is preferable to use, for example, a ball screw, a linear horse 12 200912375, etc. in the machining head moving mechanism 31. In addition, a piezoelectric element or the like can be used for a small amount of movement such as focusing. The mirror surface 33 is reflected by the deflecting surface 33a from the optical axis P of the laser light 6 emitted from the projection lens 4 of the laser light source 50 toward the optical axis P2 of the spatial modulation element 6, and the laser light 6 is used as the laser beam 6 The laser light 61 is deflected by 5 to extend the optical axis P2, and the mirror surface 33 is movable by the mirror moving mechanism 34. The mirror moving mechanism 34 is composed of a mirror tilt moving portion 34a that tilts the mirror surface 33 with respect to the optical axis, and a mirror translation moving portion 34b that shifts the mirror surface 33 in the direction of the optical axis Pi. The mirror tilt movement 434a and the mirror translation moving portion 34b are each electrically connected to the control unit 22'. The tilt movement direction, the tilt movement angle, and the translation movement amount of the mirror (4) can be controlled by a control signal from the control unit 22. Thereby, the direction of the optical axis p2 and the position of the upper axis of the spatial modulation element 6 can be changed. The 5*$ intermodulation element 6 is a laser light 61 that is biased backward by the deflecting surface 33a: and is a mirror-like (four-dimensional) DMD (digital micromirror assembly: a spatial modulation component) 6, as shown in Fig. 2A, is centered on the second surface of the quasi-surface M, and can be tilted only _ most ^ mirror surface (10), for example, in the rectangular modulation field of both sides XH, the extension of the side The direction is arranged two-dimensionally as the arrangement direction. The size of the slanting center of the micro-mirror surface 6a varies depending on the structure of the device, etc., but it can be selected from the range of angles of, for example, about 1 G to about 16. In the present embodiment, an example in which the micro-a is oriented in the opposite direction to the x-axis direction and arranged in parallel on the plane is described as an example. The micro-mirrors 6a of the spatial modulation element 6 are described as an example. Rotating by an electrostatic electric field generated according to a control signal from the control unit 22, for example, in the on state, from the reference plane + rotation + the fire icon is rotated counterclockwise), and in the 〇FF state 5, from the reference plane Μ Rotate - the bat icon rotates in a ton hour hand). Hereinafter, the light reflected by the minute mirror surface 6a in the ON state is referred to as a neon light, and the light reflected by the minute mirror surface 6a in the 0FF state is referred to as a neon light. In the present embodiment, the optical axis p3 of the ON light 62 (see Fig. 1) is set to be substantially parallel to the z-axis direction. 10 The position of each of the minute mirrors 6a can be represented by (m, n) by the column number m of the side of the length W and the row number n (m, η 〇 or more) of the side of the length ,, and can be from a micro mirror surface The arrangement interval of 6a is converted into a position coordinate on the reference plane M. The projection optical system 8 constitutes an imaging optical system that can spatially adjust the image of the ON light 62 reflected by the spatial modulation element 6 and is reflected in the fixed direction at a magnification of /5 on the processed surface Ua of the substrate 11. Group of optical components. The imaging lens 8A is disposed on the side of the spatial modulation element 6 of the projection optical system 8, and the objective lens 8B is disposed on the substrate U side. In the present embodiment, a plurality of objective lenses 8B having different magnifications are held by the rotary unit 2 to be switchable. Therefore, the magnification of the projection optical system 8 can be changed by switching the objective lens 8B' by rotating the turning mechanism. Hereinafter, unless otherwise specified, the objective lens 8B refers to a lens selected to constitute the projection optical system 8. In the present embodiment, the optical axis P4 of the imaging lens 8A is placed in parallel in the x-axis direction of 200912375, and the optical axis p5 of the objective lens 8B is placed in parallel in the two-axis direction. Therefore, between the space modulating element 6 and the imaging lens 8A, there is provided a mirror surface 7 which reflects the ON light 62 and projects it through the optical axis 匕. Then, between the imaging lens 8A and the objective lens 8B, a half lens 9 which can reflect the light penetrating the imaging lens 8A and which is incident on the optical axis P1 2 3 4 is provided. The projection magnification of the projection optical system 8 is not appropriately set in accordance with the required machining accuracy on the processed surface ila. For example, it is set such that the image having the size WxH of the entire modulation area can be changed to the magnification of w, χΗ' on the processed surface 11a. Further, the numerical aperture (ΝΑ) of the imaging lens 8 is a size that does not cause light to enter, and the light is referred to as a light 63. The observation light source 16 is capable of generating a light source for illuminating the observation light 80 in the processable region on the processed surface 11a, and is disposed in the optical path side direction between the half mirror 9 and the objective lens 8B. 15 1 In the optical path between the half mirror 5 and the objective lens 8B, a half mirror 14 is provided with respect to the position of the observation light source 216, and the half lens 14 is permeable to the ON light 62 which is reflected by the half mirror 9. The object 83 is reflected toward the objective lens 83. Then, between the observation light source 16 and the half mirror 14, a condensing lens 15 that condenses the observation light 80 into an illumination beam of an appropriate diameter is provided. The observation light source 16 can employ, for example, a suitable light source such as a xenon arc lamp or an LED that generates visible light. 5 The observation imaging lens 12 (photographing optical system) is disposed on the upper side of the half mirror 9 coaxially with the light vehicle I of the objective lens 8B. The observation imaging lens 12 is for reflecting the surface to be processed 11a illuminated by the observation light 8 ,, and the light collected by the objective lens 8B of 200912375 is imaged on the imaging surface optical element of the imaging element 13 (imaging portion). The imaging element 13 is a photoelectric conversion device that converts an image formed on the imaging surface, for example, by a CCD or the like. The image signal subjected to photoelectric conversion 5 by the imaging element 13 is sent to the control element 22 electrically connected to the imaging element 13. The control unit 22 is used to control the laser processing system 1 as shown in FIG. 3, and is composed of an image capturing unit 4, a data storage unit 43, a spatially modulated 7G device driving unit 41, and a device control unit. 42. The moving mechanism control unit 35 and the 10 image processing unit 44 are configured. In the present embodiment, the device configuration of the control unit 22 is constituted by a combination of a computer including a CPU, a memory, an output input unit, an external memory device, and the like, and an appropriate hardware. The data storage unit 43 is realized by using a memory of the computer or an external memory device. Further, other structures are realized by the CPU executing a program corresponding to each control function and processing function by the CPU. The image capturing unit 40 captures a two-dimensional image of the processed surface 11a by capturing a video signal obtained by the imaging element 13. The captured two-dimensional image is sent out and displayed on the display unit 30 constituted by a monitor or the like, and simultaneously sent as a video data 150 and memorized in the data storage unit 43 composed of the image memory. The spatial modulation element drive unit 41 controls the ΟΝ/OFF state of each of the micro mirror surfaces of the spatial modulation element 6 based on the processing data generated by the image processing unit 44. 16 200912375 Controls the operation input of the face 32 of the laser processing system 71 from the input device having, for example, "keyboard, 1 field", and is connected to the image capturing unit 40 and the space device control unit 42 electrically connected. The movement of the machine and the laser «machine head can control the action or action day of each component ^. 6. The moving mechanism control unit 35, the moving mechanism control unit 35 is based on the control signal of the device control unit 42 or the operation of the interface 32 to tilt the mobile phone (10). The image processing unit 44 calls the recorder 15. An appropriate image processor is also applied: the material defect extracting unit 45 and the processed material generating unit %. The package 3 has the defect extraction and the system relative to the μ_ι5(), and the processing impurity: the button is used as the "access data generation unit 46. ^^^(5)' is sent to the processing - the defect extraction processing can also use the well-known so-called defect (4): Method. For example, after obtaining the image (4) and the brightness of the pattern image data of the processed surface Ua that is memorized in advance, the data may be binarized from the difference data by a certain value. The processing data generating unit 46 generates processing data 152 (modulation data) for controlling the (10) chat of each of the micro mirror oils of the spatial modulation element 6, so that the (10) light 62 can be based on the secret extraction unit 45. The processing information is irradiated to the surface to be processed 1 la. In addition to the laser light source 50, the laser processing system 1 described above, 17 200912375 mirror surface 33, the pound surface 统 统 8 η moving mechanism 34, spatial modulation element 6, the projection optical system 8, and the image processing department " Jiu Yuzhuang, also constitutes the composition of the Qingyuan 22 consists of the directional device 2, and the lightning will be spatially modulated by the spatial modulation component 6 After the change m # set 200 series lla go up The light from the rear field is irradiated onto the surface to be processed. The laser irradiation device 2〇〇 is also independently installed in the field, and the image data of the laser processing system is used to receive the laser processing method corresponding to the processing of each type of Pelican. Can be used, clothing, other use. For example, an image projection device such as a sinusoidal projection projection 10 10 20 Next, the operation of the laser processing system 100 will be described. Fig. 4 is a schematic explanatory view showing the action of the face-to-face moving mechanism of the laser irradiation device according to the embodiment of the present invention. The laser processing system 100 performs laser processing, and as shown in the first item, first, the substrate u as a workpiece is placed on the planting table. Next, the machining head 2 is moved by the machining head moving mechanism 31, and after the first machining position is set, the image of the defendable field of the surface to be protected 11a is obtained. That is, the observation light source 16 is turned on, and the observation light 8 is generated. After the observation light 8 is partially reflected by the half mirror 14, the reflected light is concentrated by the objective lens 83 to illuminate the processable region on the processed surface 11a. The reflected light reflected by the processed surface 11a is collected by the objective lens 且 and partially reflected light penetrates the half mirror 14. Then, after the partially reflected light is further penetrated via the half mirror 9, it is guided to the observation imaging lens 12. The light incident on the observation imaging lens 12 is imaged on the photographing surface of the imaging element 13. 18 200912375 The imaging element 13 photoelectrically converts the image of the imaged surface 1 la that has been imaged and sends it to the image capturing unit 4〇. The video signal is applied to the video display unit 30. Further, the image signal to be converted is converted into the image signal capturing unit 40, and the image capturing unit 40 performs processing such as sending out information and brightness correction according to necessity, and displays the control signal on the display device control unit 42 to display an appropriate timing image. Information 150, and is stored in the data memory department. The image of the processable area of the processed surface 11 a is paid. Next, in the image processing unit 44, Jiang Yu & τ reads the image data 150 of the data storage unit 43 to the defect extracting unit 45 and performs defect extraction. Then, when it is judged that the defect is a defect requiring repair processing after determining the type or size of the extracted defect, etc., it is sent to the processing data generating unit 46 as the defective image data. The processable area of the machined surface 11a and the spatial modulation component (10) are in a common vehicle relationship by the xw light source system 8, and since the magnification of the projection optical system 8 is stone, it will be processed in the field. The position coordinate is set to ^ times, so that it corresponds to the position on the modulation domain of the spatial modulation element 6. In this way, the processed material generating unit 46 determines the minute mirror surface 6a to be controlled in the state of (10) in order to irradiate the ON light 62 to each position on the processed surface 11a indicated by the defective image data 151 from the defective image data 151. 20 can generate the processing material 152 in which the driving space modulation element 6 is in the ON state of the micro mirror surface 6a and the other micro mirror surface 6a is in the 〇 ff state. For example, the processing data 丨 52 is generated as the table data corresponding to the position (m, n) of each of the minute mirror faces 6a as a value corresponding to the 〇N state being 丨 and the OFF state being 0. The generated processing data 152 is sent to the spatial modulation element driving unit 19 200912375 41 〇 The component driving material is controlled according to the inclination angle of the device (4) and the processed processing data 152 The respective micro 5 10 15 20 sides of the spatial modulation element 6 = 'the device control unit 42 sends the laser oscillator 2 a signal for making the laser light 2' and the wavelength of the irradiation condition previously selected according to the substrate 11 Shoot = 1 vibration light. The oscillation condition of the laser light can be, for example, an output, an oscillation pulse width, and the like. The end face = the slanted laser light is fused to the fiber a of the _3, and is incident as the laser light 60 from the end face of the fiber and the light intensity distribution of the light 60 is substantially uniform. The laser light 6 is guided along the optical path by the projection lens 4 and is reflected by the deflecting surface 33a of the reflecting mirror 33. Then, it is bound as the laser light axis p2, and is projected onto the spatial modulation element 6, and then reflected by the respective minute mirrors 6a on the spatial modulation element 6. Therefore, the mirror moving mechanism 34 is driven in advance so that the inclination of the deflecting surface 33a with respect to the optical axis P1 (hereinafter, simply referred to as the inclination of the deflecting surface 33a) and the position of the optical axis P in the direction (hereinafter, only The position in the optical axis direction of the deflecting surface Ma) 'the laser light that can be used as the reflected light of the mirror surface 33 is effectively incident on the projection optics when reflected by the tiny mirror surface of the ON state of the spatial modulation element 6 System 8. The inclination of the deflecting surface 33a and the position of the optical axis direction are based on the operation input of the user interface 32 and the wavelength information of the laser oscillator 1 collected by the device control unit 42, etc., by the moving mechanism of the control unit 22. The control unit 35 calculates the OFF light 63 reflected by the micro mirror surface 6a whose OFF angle is in an OFF state, and is reflected outside the NA range of the imaging lens 8A. The minute mirror surface 6a whose angle of inclination is ON is reflected on the on mirror. The light 62, which will travel along the optical axis P3, and after being reflected by the mirror 7, will travel along the optical axis P4, and after entering the imaging lens 8A and concentrating, will reach the half-lens 9, and then be half The lens 9 is reflected. The ON light 62 reflected by the lens 9 travels along the optical axis P5 and is imaged on the processed surface 1 la by the objective lens 8B. 10 Thus, the modulation caused by the on-light 62 based on the processed material 152 The field image is projected onto the surface 11a to be processed. As a result, the 〇N light 62 is irradiated onto the surface of the processed surface 11& and the defect can be removed. The laser processing is completed once. The element 13 again acquires the image 15 of the surface to be processed Ua, repeats the above steps as necessary, and performs laser processing again on the unremoved portion or laser processing the other portions in the movable processable area. In the embodiment, the condition for causing the ON light 62 to be efficiently incident on the projection optical system 8 and projected to the inclination of the deflecting surface 33a of the processed surface 1 la. 20 In the spatial modulation element 6, due to the minute mirror surface 6a The light intensity distribution of the ON light 62 is determined by a microscopic mirror such as the resulting diffraction phenomenon. For example, as shown in FIG. 2A, the laser light 61 is relative to the spatial modulation element 6. The reference plane 射 is shot at an incident angle θ()=2ίζ) After the entry, the ON light 62 that is rotated counterclockwise with respect to the reference plane M to the display 21 200912375 to the majority of the minute mirrors 6a in the ON state with only a large inclination angle generates Fraunhof diffraction. 70 and diffraction 71. The light intensity distribution of the ON light 62 can be obtained by convolving the diffracted light. 5 The Fraunhofer diffraction 70 depends on the aperture of the minute mirror 6a and the regular reflection at the minute mirror 6a The direction (in this example, the Z-axis negative direction) has a bell-type light intensity distribution with a peak. On the other hand, the diffraction 71 is a dispersion distribution which is determined by the arrangement interval of the minute mirror faces 6a and the wavelength of the laser light 61. That is, the regular reflection light of the laser light 61 with respect to the 10 reference plane ( (in this example, the direction of the clockwise rotation angle θ 相对 with respect to the z-axis negative direction) generates 0-order refracted light d〇, and The N-order diffracted light dN is generated by a different diffraction angle direction depending on the arrangement interval of the minute mirrors 6a and the wavelength of the laser light 61 (however, N = 1, 2, . . . ). At this time, in the state where the direction of the diffracted light of any order of the diffraction 71 is substantially coincident with the direction of the peak intensity of the diffraction of the Fran and the fifteenth, the projection optical system 8 is decomposed as long as it can be incident on the projection optical system 8. The light intensity distribution becomes large, so the diffraction efficiency can be improved. Therefore, the light use efficiency can be improved. For example, in the case of FIG. 2A, the peak intensity directions of the 'Fran and Fiji diffractions 70 are uniform with respect to the optical axis direction of the projection optical system 8, and the 20 3rd-order diffracted light d3 and the fourth-order diffracted light d4 of the diffraction 71 are When only the angles θ3 and θ4 (but θ4 $θ3) are respectively inclined, at least either of the diffracted lights can be included in the aperture angle range of the projection optical system 8, so that the diffraction efficiency can be improved and good light use efficiency can be achieved. The peak intensity direction of the Fraun and Fiji diffractions 70 is determined by the angle of incidence and the tilt angle 0 of the micro-mirror 6a' and the diffraction angle of the diffraction 71 is arranged by the arrangement of the micromirrors 22, 200912375 faces 6a and the laser light 61. The wavelength is determined, so that the moving mechanism control unit 35 can determine whether the peak intensity direction of the Fraunhofer diffraction 70 and the direction of the diffracted light of the Fraunhofer are entered into the projection optical system 8 by taking the information from the device control σΜ2. The range of aperture angles. 5 When either of the diffracted light directions does not enter the aperture angle range of the projection optical system 8, the moving mechanism control unit 35 causes the deflecting surface to tilt obliquely, so that the peak intensity direction of the Fraun and Fiji diffraction 70 is either The direction of the diffracted light is at least within the aperture of the projection line 8 and may coincide with the optical axis of the projection optical system 8. 10 For example, as indicated by the broken line in Fig. 2, by the mirror moving mechanism 34 The inclination of the deflecting surface 33a is changed so that the laser beam 61 is incident on the reference plane Μ at an incident angle (θ〇+ΔΘ). The diffraction direction of each of the diffracted lights changes depending on the change in the incident angle. By appropriately setting Δθ, for example, 'the direction in which the diffraction direction of the fourth-order diffracted light ο# coincides with the direction of the light 15 axis of the projection optical system 8 can be achieved. At this time, 'the direction of the regular reflection with respect to the minute mirror surface There is also a change, so the peak intensity direction of the Fulang and Fiji diffractions 70 also changes. Therefore, the value of ΔΘ can be set so that each diffraction direction can enter the aperture angle range of the projection optical system 8. 20 Change laser When the oscillation wavelength of the singer 1 is appropriate, the movement of the deflection surface 333 is preferably performed according to the wavelength thereof. For example, as shown in FIG. 2C, the spatial modulation element 6 is incident on the short-wavelength laser light 61, and then 'Fran and Although the Fission diffraction 70 is the same as the case of the second diagram, the diffraction 71 will generate the 绕-order diffracted light e〇 in the normal reflection side 23 200912375 of the reference plane according to the change of the wavelength, and is in the higher order than the 2A diagram. The diffracted direction of the diffracted light produces N-order diffracted light (but, N = 1, 2,. ··). Then, the diffracted light having the diffraction direction closest to the optical axis direction of the optical system 8 becomes, for example, 6th-order diffracted light having an angular center with respect to the optical axis of the projection optical system 8, 5 2A is different. Therefore, by moving the deflecting surface 33a in accordance with the angle Θ6, good diffraction efficiency can be obtained even if the oscillation wavelength of the laser oscillator 1 is changed. Next, a numerical example will be described to explain the tilt of the deflecting surface 33a. The angle setting of the degree is 0. Numerical example 1 is shown in Table 1. The numerical example 1 is arranged at an interval of 19 in the micro mirror surface 6a. 05 μ m, and the tilt angle 〇 of the 〇N state of the minute mirror 6a is ^15. In the case of 3 deg, the setting of the wavelength of the laser light 61 is 266 nm, 355 nm, and 532 nm. Here, each wavelength corresponds to the second harmonic, the third harmonic, and the fourth harmonic of the YAG laser. 5 Table 1 shows the diffraction angle (deg) of the first-order diffracted light with respect to each wavelength, the diffraction order of the diffracted light closest to the optical axis p3 of the projection optical system 8, and the relative of the spatial modulation element 6 The set value of the incident angle θ 于 at the reference plane 5^, the diffraction efficiency (%) calculated from the dispersion of the intensity distribution of the Fraun and Fiji diffraction and the diffracted light, and the optical axis of the projection optical system 8 The angle of ρ3 (deg). 20 Table 1 Wavelength (nm) Diffraction angle (deg) The angle of incidence of the diffraction order to the spatial modulation element (deg) Diffraction efficiency ^ (%) Angle of the projection optical system relative to the optical axis (deg) Numerical example 1-a 266 0. 80 卜 261 30. 8 65 0. 08 Numerical Example 1-b 355 1. 07 ~~19 30. 9 57 0. 70 Numerical Example 1-c 532 1. 60 13 — 30. 7 85 0. 17 It can be seen from Table 1 that the angle of incidence of the spatial modulation component 6 is set to 30 according to each wavelength. 8deg, 30. 9deg, 30. 7deg, the diffraction efficiency can be more than 57%. At this time, the diffraction order of the diffracted light closest to the optical axis P3 is 26, 19, and 13, respectively, and the angle with respect to the optical axis P3 is 〇. 〇8deg, 〇. 7〇deg, 0. 17deg' is based on the maximum value of 0. 7 deg, so that the projection optical system 8 is 50. 012 or more, the diffracted light of each wavelength can be incident on the aperture angle range of the projection optical system 8. Next, Numerical Example 2 is shown in Table 2. In Numerical Example 2, the arrangement interval of the micro mirror surface 6a is 24 // m, and the inclination angle 0 of the ON state of the micro mirror surface 6a is _14. In the case of 0 deg, a setting example in which the wavelength of the laser light 61 is 330 nm, 440 nm, or 10 660 nm is set. Here, each wavelength corresponds to the second harmonic, the third harmonic, and the fourth harmonic of the YAG laser. Table 2 shows the diffraction angle (deg), the diffraction order, the set value of the incident angle θ 、, the diffraction efficiency (%), and the angle (deg) with respect to the optical axis p3, respectively, as in Table 1. 15 Table 2 Wavelength (nm) Diffraction angle (deg) Angle of incidence of the diffraction order to the spatial modulation element (deg) Diffraction efficiency (%) Angle of the projection optical system relative to the optical axis (deg) Numerical example 2 -a 330 0. 798 24 28. 0 83 0. 15 Numerical Example 2 -b 440 1. 05 18 27. 9 87 0. 07 Numerical Example 2-c 660 1. 58 12 27. 8 91 0. 017 It can be seen from Table 2 that the incident angle of the spatial modulation element 6 is set to 28. 0deg, 27_9deg, 27. 8deg, the diffraction efficiency can be more than 83%. At this time, the diffraction order of the diffracted light closest to the optical axis p3 is 24, 18, 12, respectively, and the angle with respect to the optical axis P3 is 〇. 15deg, 0. 07deg, 20 〇. 〇17deg, so according to the maximum value of 0. At 15 deg, the 光学 of the projection optical system 8 is 0·003 or more, and the diffracted light of each wavelength can be incident on the 25 200912375 aperture angle range of the projection optical system 8. The tilting movement of the deflecting surface 33a can also be applied to, for example, the adjustment of the tilt angle of the ON state of the micro mirror surface 6a due to the manufacturing difference of the spatial modulation element 6 when the spatial modulation element 6 is exchanged. . The adjustment of this case is made in the numerical example 3 shown in Table 5.3. In Numerical Example 3, in the case where the arrangement interval of the micro mirror surface 6a is 17 9 / / m, and the wavelength of the laser light 61 is 355 nm, the inclination angle of the micro mirror surface such as 〇 ^ ^ state changes to Lu = 15. 〇deg, i4. An example of 97nm. The inclination angle of the minute mirror surface 6a can be experimentally obtained by injecting the reference light at a predetermined angle and measuring the arrival position of the reflected light. Table 3 together with the small mirror 63 of the ON state has a large inclination angle, and shows the same diffraction angle (deg) as that of Table 1. 'Diffraction order, set value of incident angle 0〇, diffraction efficiency (%), relative to The angle (deg) of the optical axis P3. Table 3 Wavelength (nm) Diffraction angle (deg) The angle of incidence of the diffraction order to the spatial modulation element (deg) The diffraction efficiency (%) The tilt angle of the tiny mirror of the ON state (deg) The relative angle of the projection optical system Angle of the optical axis (deg) Numerical example 3-a 355 1. 14 18 30. 0 80 15. 00 0. 28 Numerical Example 3 -b 355 1. 14 18 30. 0 73 14. 97 0. 28 Numerical Example 3-c 355 1. 14 18 29. 5 80 H 14. 97 0. 71 15 The numerical examples in Table 3, 3-a and 3-b, show that even if the angle of inclination 〇〇 = 3 〇 deg, the inclination angle ^ changes only 〇. 〇3deg also changes the diffraction efficiency by 7%. Numerical example 3-c shows that the deflecting surface 33a is tilted and moved. 5deg' can restore the diffraction efficiency even if ^=14. The spatially modulating element 6 of 97 deg can also achieve an 80% diffraction efficiency similarly to the spatially modulating element 6 of 15 deg. Further, when the inclination of the deflecting surface 33a is changed only by the inclination of the mirror surface 33, the incident position of the laser light 61 with respect to the space element 6 is deviated. In the present embodiment, the mirror moving mechanism 34 includes the mirror tilting movement portion 34a and the mirror translation moving portion 34b, so that the translational movement of the mirror surface 33 is matched, so that the laser light 61 can be correctly incident on the optical axis of the projection optical system 8. . For example, as shown in Fig. 4, when the deflecting surface 33a is held by the mirror tilting moving portion 34a so that the intersection point Q with the optical axis 成为 becomes the center of the tilting movement, the incident angle from the spatially modulating element 6 is obtained. When the state of the mirror surface 33 呈 at an angle θ 仅 is only a rotation angle (ΔΘ/2)′ and is tilted to the position of the mirror surface 33 ,, the laser light from the laser light source 5 调 is modulated with respect to the space 10 . The incident angle of the reference plane of the element 6 becomes an angle (Θ+ΔΘ), but depending on the distance to the spatial modulation element 6, the reflected light sometimes deviates from the spatial modulation element 6, or is effective from the projection optical system 8. range. At this time, by the mirror translation moving portion 34b, the mirror surface 33 is shifted by only the distance L in the direction of the optical axis P1, and moved to the position of the mirror surface 33 (: 15), so that the reflected light of the mirror surface 33C is correct. The ground is incident on the same position as the reflected light of the mirror surface 33A. According to the laser processing system 1 〇〇, the mirror movement mechanism 34 can be obliquely moved with respect to the optical axis PJS, and can be moved in the direction of the optical axis 匕The deflecting surface 33a is deflected toward the laser light 61 from the laser light source 5 to change the incident angle with respect to the reference surface 调 of the spatially modulating element 6 and the minute mirror surface of the ON state, so that the spatial modulating element 6 can be illuminated. The laser light 61 at the incident position is changed. Therefore, the Fraunhofer and the Fidelity diffraction generated by the aperture of the micromirror 6a can be made without changing the tilt angle of the 01^ state of the micro mirror surface. The diffraction direction of the diffraction 71 generated by the arrangement interval of 6a is the same as the aperture angle range of the projection optical system 8 of the 200912375. The system of the surname system 8' and the optical axis of the image are as follows. Therefore, according to the laser oscillator i The vibration surface is changed long (4) Irradiation. For the person of the _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The inclination of the state _ can also be described as follows: ============================================================================================ The first aspect of the invention is a schematic illustration of the structure of the deflecting surface moving mechanism of the laser irradiation device according to the modification. The example of the present invention includes the mirror moving mechanism 36 (biasing surface moving mechanism) shown in FIG. The mirror-moving mechanism material of the above-described embodiment will be described with a focus on the difference from the above-described embodiment. The mirror-moving mechanism 36 is the same mirror-side tilting portion 34a and mirror surface as the mirror-moving mechanism 34. The translational movement portion 34b is constructed, and the mirror surface 33 is tilted and moved about the point g of the end portion thereof. Further, the mirror movement mechanism 36 is electrically connected to the movement mechanism control portion 35 of the control unit 22. At this time, the reflection of the optical axis on the deflecting surface 33a is considered. In the case where the distance between the point g and the point g is set, the amount of translational movement in the Z-axis direction can be determined to be the same as that of the above-described embodiment, and the deflecting surface 33a can be tilted and translated in the same manner as in the above-described embodiment. The second modification of the embodiment of the present invention is shown in the following. 28 200912375 FIG. 6 is a view showing the structure of the optical path deflecting portion and the deflecting surface moving mechanism of the laser irradiation device according to the second modified example of the embodiment of the present invention. The present modification includes a mirror block 37 (optical path deflecting portion 5) and a mirror moving mechanism 38 (biasing surface moving mechanism) shown in FIG. 6 instead of the mirror surface 33' mirror moving mechanism of the above-described embodiment. 34. Hereinafter, the description will be focused on differences from the above-described embodiments. As shown in Fig. 6, the mirror block 37 is arranged side by side in the x-axis direction on the surface opposite to the mounting surface 37a parallel to the χγ plane, and has a tilt in the /χ plane and a uniformity in the z-axis direction. Different deflection faces 37, 37B, 37C. The mirror moving mechanism 38 is attached to a slider guide 38b that is attached to a casing (not shown) in the direction of the drawing, and is attached to the mounting surface 37a' of the mirror block 37 and is provided on the slider guide 38b. The single-axis moving mechanism constituted by the slider 38a that moves in the γ-axis direction is shown. The mirror moving mechanism 38 is electrically connected to the moving mechanism control unit 35 of the control unit 22, and can be moved stepwise in the γ-axis direction by the control signal of the moving mechanism control unit 35. In the present modification, the inclination of the deflection surfaces 37A, 37B, and 37C with respect to the Z-axis and the position of the 20-axis direction are set in accordance with, for example, three wavelengths a of the laser light source 5A, and B and Ac'. The most appropriate value. Then, each time the device control unit 42 switches the oscillation wavelength of the laser oscillator ,, for example, when switching from the wavelength person a to the wavelength Ac, the mirror block 37 moves in the γ-axis direction, and the deflection surface 37C is substituted for the deflection surface. 37A to reflect the laser light 61. In this way, according to the present modification, when the tilt amount 29 200912375 of the deflecting surface is limited to a large number in advance, it is not necessary to perform the human calculation every time the switching is performed, and the setting of the partial "4" can be quickly performed. Relative = The tilting movement is performed on the deflecting surface. Therefore, the structure of the deflecting surface moving mechanism can be made simple, and the surface of the deflecting surface can be parallel to the one axis of the y-axis. However, the deflecting surfaces can be appropriately adjusted. A shape in which the shape of the inclination angle is changed in each of the deflection centers, and a shape in which the ground is moved in the Z-axis direction. Next, a third modification of the embodiment will be described. Fig. 7 is a view showing a third modification of the embodiment of the present invention. The laser irradiation example of the wire deflection portion and the deflection surface moving mechanism includes a mirror block 39 (optical path deflecting portion) shown in Fig. 7, and a mirror moving mechanism 48 (biasing surface movement) The mirror surface 33 and the mirror surface movement 34 in place of the above-described embodiment are described below. The following description will focus on differences from the above-described embodiment. The mirror block 39 is as shown in Fig. 7, Χγ plane parallel mounting surface On the opposite side, the inclination in the plane of the yaw axis and the height in the y-axis direction are arranged in parallel with each other in the direction of the yaw axis. (4) Deflection planes 39Α, 39Β, 39C. A movement mechanism 48 is extended from the X-axis direction of the figure. The q-shaped guide 48b which is attached to the unillustrated body and the fixed side of the inner side of each of the deflecting faces of the opposite side of the yoke are provided with a fixed surface rice, and is set to be A single-axis moving mechanism constituted by a slider 48a that moves in the X-axis direction on the sliding guide 48b. The brother moving mechanism 48 is electrically connected to the moving mechanism 30 of the control unit 22 200912375 Control unit 35, b - r - 丄 can be hunted by the control signal of the moving mechanism control unit 35, and moves in a stepwise direction in the γ pumping direction. > 轴 显 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 The movement value formed by increasing the stepwise direction in the positive direction may be a shape in which the arrangement height of each of the deflection surfaces is appropriately oriented in the z-axis direction, and for example, may be formed in a shape having a large tooth shape in the cross-section of the crucible. With respect to the second modification, the movement of the surface of the deflection surface is shifted. In the same manner as the second modification described above, the direction of the movement of the tilting movement and the translational movement by the movement mechanism control unit is controlled by the movement mechanism control unit, but the deflection movement mechanism is used. It can also be constructed by a mechanical table or the like, and can be manually moved by tilting and translational movement.

In other cases, the tilt movement angle or the translation movement amount may be calculated in advance based on conditions such as the wavelength or the inclination angle of the micro mirror surface, and may be referred to as a reference when moving 15. Alternatively, it is possible to monitor the amount of light on the surface to be processed, and to set the amount of light on the surface to be processed when the momentum is changed. In particular, in the structures of the second and third modifications described above, the deflecting surface moving mechanism moves in a stepwise direction in the uniaxial direction to selectively switch the deflecting surface, so that high precision movement accuracy is not required, and it is suitable for manual operation. In the description of 2〇月1J, the oblique movement of the laser light incident on the spatial modulation element 6 with the tilting direction of the tilting surface and the translational movement of the optical axis direction are performed, so that even if the incident angle is changed, the incident position is not The example of the change is explained, but the incident position can also be changed according to the necessity to move the machining head to offset the amount of movement on the machined surface resulting from the change in the incident position. 31 200912375 In this case, it is possible to perform laser irradiation while moving relative to the irradiation position of the spatial modulation element, so that the irradiation load of the laser light with respect to the micro mirror surface can be dispersed, and the life of the spatial modulation element can be extended. In the above description, the example in which a plurality of wavelengths of light are generated by one laser oscillator is described. However, the laser light source may have a configuration in which a plurality of laser oscillators having different oscillation wavelengths are used. In the above description, the laser processing is applied to a semiconductor wafer substrate or the like. However, the workpiece is not limited thereto, and may be used for, for example, a multilayer film or a coating film. Laser processing of various metal objects such as thin metal objects or organic 10 objects and semiconductors. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic cross-sectional view showing an optical axis including a laser irradiation apparatus according to an embodiment of the present invention and a schematic configuration of a laser processing system using the apparatus. 15A, 2B, and 2C are schematic cross-sectional views illustrating a diffraction phenomenon of a spatial modulation element of a laser irradiation apparatus according to an embodiment of the present invention. Fig. 3 is a functional block diagram showing a schematic configuration of a control unit of a laser processing system according to an embodiment of the present invention. Fig. 4 is a schematic explanatory view showing the action of the partial-direction moving mechanism of the laser irradiation apparatus according to the embodiment of the present invention. Fig. 5 is a schematic explanatory view showing the structure of a deflection surface moving mechanism of the laser irradiation device according to the first modification of the embodiment of the present invention. Fig. 6 is a schematic view showing the structure of the optical path deflecting portion and the deflecting surface moving mechanism of the laser irradiating device according to the second modified example of the embodiment of the present invention. Fig. 7 is a schematic view showing the structure of the optical path deflecting portion and the deflecting surface moving mechanism of the laser irradiating device according to the third modified example of the embodiment of the present invention. 5 Fig. 8 is an angular distribution diagram showing an example of an angular distribution of diffracted light of a laser processing device capable of switching wavelengths. [Main component symbol description] 1 Laser oscillator 14 Half lens 2 Coupling lens 15 Condenser lens 3 Fiber 16 Observation light source 3a Fiber end face 20 Processing head 3b Fiber end face 20a Housing 4 Projection lens 21 Mounting table 6 Space modulation element 22 Control unit 6a micro mirror 30 display portion 7 mirror surface 31 processing head moving mechanism 8 projection optical system 32 user interface 8A imaging lens 33 mirror surface 8B objective lens 33a deflection surface 9 half lens 33A mirror surface 11 33B mirror surface 11a processed surface 33C Mirror surface 12 observation imaging lens 34 mirror movement mechanism 13 imaging element 34a mirror tilting movement 33 200912375 34b mirror translation moving portion 48a slider 35 movement mechanism control portion 48b slider guide 36 mirror moving mechanism 48c fixing surface 37 mirror block 50 Laser light source 37a Mounting surface 60 Laser light 37A Deflection surface 61 Laser light 37B Deflection surface 61A Laser light 37C Deflection surface 61B Laser light 38 Mirror surface movement 62 ON light 38a Slide 63 OFF light 38b Slide guide 70 Long and Fiji Diffraction 39 Mirror Block 71 Diffraction 39a Ann Face 80 viewing light 39A deflecting surface 100 laser processing system 39B deflecting surface 150 image material 39C deflecting surface 151 defect image data 40 image capturing unit 152 processing data 41 spatial modulation element driving unit 200 laser irradiation device 42 device control Part 501 Angle plane 43 Data storage unit 502 Microscope optical axis 44 Image processing unit 503 Rear side angular aperture 45 Defect extraction unit 504 Diffraction order 46 Processing tributary generation unit 505 Diffraction order 48 Mirror moving mechanism λ 波长 Wavelength 34 200912375 λβ Wavelength L Distance Ac Wavelength R Spinning axis 2 Wavelength θο Incident angle 3 Wavelength θ〇+ΔΘ Incident angle Pi Optical axis ΔΘ/2 Angle p2 Optical axis 3rd order diffracted light p3 Optical axis 4th order diffracted light p4 Optical axis d4 4 Order diffracted light p5 Light car by e〇〇 order diffracted light p6 Optical axis θ3 Angle Q Intersection point θ4 Angle g Point Φ Tilt angle M Base plane β Magnification 35

Claims (1)

200912375 X. Patent application scope: 1. A laser irradiation device comprising: a laser light source; a light path deflection portion biasing the laser light emitted from the laser light source by a supported and movable deflecting surface The deflecting surface moving mechanism is configured such that the deflecting surface of the optical path deflecting portion is inclined to move relative to the optical axis of the laser light, and is movable in the optical axis direction; the spatial modulation component is to be light a portion of the light that is deflected by the deflection portion 10 and has a plurality of minute mirrors that form ON light toward the illuminated surface; and the projection optical system projects the ON light formed by the spatial modulation element to the aforementioned Irradiated on the surface. 2. The laser irradiation apparatus according to claim 1, comprising a deflecting surface 15 moving mechanism control unit, wherein the deflecting surface moving mechanism control unit controls the amount of movement of the deflecting surface generated by the deflecting surface moving mechanism. 3. The laser irradiation apparatus of claim 2, wherein the deflecting surface moving mechanism control unit controls the amount of movement of the deflecting surface to generate an interval of the plurality of minute mirror surfaces of the spatial modulation element. The diffracted light of any order and the direction of emission of the specular reflected light forming the minute mirror surface of the ON light enter the range of the aperture angle of the projection optical system. 4. The laser irradiation apparatus of claim 3, wherein the deflecting surface moving mechanism control unit controls the amount of movement of the deflecting surface so as to enter the aforementioned range of the aperture angle of the optical system of the forklift prior to 36 200912375 — The direction of the diffracted light and the direction of the above-mentioned specular reflected light is roughly _#/(4) The laser irradiation device of the second scope of the patent scope is called, and the light source selectively emits laser light of most wavelengths, and cuts 曰?,,- Further, 'the deflecting surface movement mechanism control unit changes the amount of movement of the deflecting surface based on the wavelength of the thunder. [6] The laser irradiation device of claim 1, wherein the deflecting portion is arranged in a fixed direction with a mutually different inclination of the king, and the deflecting surface moving mechanism causes the aforesaid deflecting surface moving mechanism The optical path deflecting portion moves forward and in the solid-solid direction and selectively arranges the plurality of deflecting surfaces in the above-mentioned plurality of deflecting surfaces to thereby perform the tilting movement (4) and the movement of the light. A laser processing system comprising: a laser irradiation device, which is the patent application scope of the first to the sixth item; the official item of the item is optically secret, which is arranged for the arrangement on the illuminated surface of the aforementioned laser illumination device. The workpiece is disposed coaxially with the laser irradiation 'the projection optical system; the imaging unit is provided in the imaging position of the imaging optical system; and the image processing unit is photographed by the imaging unit After the image is processed, the defect of the workpiece is extracted, yv, and the laser plus king (10) modulates the laser irradiation according to the shape of the defect of the 2009 2009375 extracted by the image processing unit. The spatial modulation element of the apparatus irradiates the workpiece with the laser light modulated by the spatial modulation to perform processing of the workpiece.