TWI527651B - Laser irradiation apparatus - Google Patents

Description

Laser irradiation device Field of invention

The present invention relates to a laser irradiation apparatus having a spatial modulation element.

Background of the invention

Conventionally, a laser processing apparatus that performs processing of a workpiece by irradiating laser light to a desired region of a workpiece is known. For example, in the manufacture of a liquid crystal display or the like, a laser repairing device that corrects a wiring pattern on a glass substrate and a defect portion or the like which is present in the photomask for exposure, and the like, is used as the laser processing apparatus. known.

A laser irradiation apparatus for such a laser processing apparatus defines a size of an irradiation area of laser light by a variable rectangular opening, but in recent years, a laser irradiation apparatus using a spatial modulation element such as a micro mirror array is also known.

When the active optical elements of a plurality of active optical elements are regularly arranged for laser irradiation, such as a micro-mirror array, the laser light reflected by the micro-mirror array is divided into a plurality of diffracted lights. However, since the number of openings in the rear side of the microscope is generally small, it is impossible to inject all of the diffracted light into a large number. Therefore, simply by setting the optical axis of the microscope to the direction of normal reflection of the micromirror, the utilization efficiency of the laser light is lowered.

Therefore, in the patent literature, it is proposed that the tilting mechanism changes the inclination of the modulated light to at least one of the laser light source and the spatial modulation element of the illumination optical system, so that the modulated light of the spatial modulation component is diffracted. A laser processing device in which the direction is the same as that of the modulated light to the illumination optical system.

Prior technical literature Patent literature

[Patent Document 1] Japanese Patent Publication No. 2007-7660

However, when the inclination of the laser light source and the spatial modulation element is adjusted as in the laser processing apparatus described in Patent Document 1, the diffracted light having the desired intensity is selected and the selected diffracted light and the modulated light are irradiated to the optical It is very difficult to agree on the optical axis of the system, and it takes a lot of time to adjust.

An object of the present invention is to provide a laser irradiation apparatus which can easily improve the utilization efficiency of laser light in view of the above-described conventional circumstances.

In order to solve the above problems, the laser irradiation apparatus of the present invention is configured such that a laser irradiation device that irradiates laser light emitted from a laser light source to a workpiece includes a spatial modulation element disposed on the aforementioned The laser light is guided to a position at which the optical axis of the projection optical system of the workpiece intersects, and the plurality of deflecting elements that are biased toward the laser light are two-dimensionally arranged; and the laser illuminating unit illuminates the spatial modulating element with the laser light. The first rotation mechanism is such that the intersection of the optical axis of the projection optical system and the reference plane of the spatial modulation element is a rotation center (swing axis A), and the spatial modulation element and the laser irradiation are performed. And a second rotation mechanism, wherein the intersection of the optical axis of the projection optical system and the reference surface of the spatial modulation element is a rotation center, and the spatial modulation component and the Both of the laser irradiation portions are integrally rotated.

According to the present invention, the utilization efficiency of laser light can be easily improved.

Simple illustration

Fig. 1 is a perspective view showing a laser irradiation apparatus according to an embodiment of the present invention.

Fig. 2 is a front elevational view showing a laser irradiation apparatus according to an embodiment of the present invention.

Fig. 3A is a right side view showing a laser irradiation apparatus according to an embodiment of the present invention.

Fig. 3B is a cross-sectional view for explaining an optical path of a laser irradiation apparatus according to an embodiment of the present invention.

Fig. 4 is a schematic structural view showing a laser processing apparatus having a laser irradiation apparatus according to an embodiment of the present invention.

Fig. 5 is a perspective view for explaining a second rotation mechanism of the laser irradiation apparatus according to an embodiment of the present invention.

Fig. 6 is a front elevational view showing a second rotation mechanism of the laser irradiation apparatus according to an embodiment of the present invention.

Fig. 7A is an explanatory view (1) for explaining a diffraction phenomenon of an embodiment of the present invention.

Fig. 7B is an explanatory view (2) for explaining a diffraction phenomenon of an embodiment of the present invention.

Fig. 7C is an explanatory view (3) for explaining a diffraction phenomenon of an embodiment of the present invention.

Form for implementing the invention

Hereinafter, a laser irradiation apparatus according to an embodiment of the present invention will be described with reference to the drawings.

Figs. 1, 2, and 3A are a perspective view, a front view, and a right side view showing a laser irradiation apparatus 1 according to an embodiment of the present invention.

Fig. 3B is a cross-sectional view for explaining the optical path of the laser irradiation device 1.

Fig. 4 is a schematic structural view showing a laser processing apparatus 100 having a laser irradiation apparatus 1. Moreover, since FIG. 4 is a schematic structural view, there is also a portion in which the positional relationship is inconsistent with other patterns.

5 and 6 are a perspective view and a front view for explaining the second rotation mechanism 5 of the laser irradiation device 1.

The laser irradiation device 1 of the present embodiment is disposed, for example, as part of the laser processing apparatus 100 shown in Fig. 4, and irradiates laser light to the workpiece.

The workpiece can be exemplified by, for example, a glass substrate for a liquid crystal display or the like, a semiconductor substrate, or the like. When the substrate is a workpiece, the object to be processed may be, for example, a wiring pattern on the substrate, and a defect that does not require a residue existing in the photomask for exposure.

Further, in the present embodiment, the laser irradiation device 1 is partially described as the laser processing device 100, but the laser irradiation device 1, for example, may be used for other purposes such as an image projection device and an image scanning device.

The laser irradiation device 1 includes a micro-mirror array 2 shown in FIGS. 3B and 4 as a spatial modulation element which is two-dimensionally arranged as a deflection element formed by forming a laser beam having a desired shape into a desired shape; a laser beam irradiating the laser irradiation unit 3 of the micromirror array 2; a first rotation mechanism 4 for rotating one of the micromirror array 2 and the laser irradiation unit 3; and a micromirror array 2 and a laser The second rotating mechanism 5 in which the illuminating unit 3 is integrally rotated.

As shown in FIGS. 7A to 7C, the micromirrors 2a as the deflecting elements of the micromirror array 2 are arranged in a lattice shape, and the respective micromirrors 2a are turned on/off (ON/OFF), and the laser irradiation portion is modulated. 3 emitted laser light.

When the tilt angle of the rocking axis R is 0° (OFF), each of the micromirrors 2a is regularly arranged in a lattice shape in the vertical and horizontal directions on the reference plane M of the micromirror array 2, and can be present in accordance with the control signal. It is tilted in the predetermined direction when it is in the ON state. The micromirror array 2 can be, for example, an element such as a DMD (manufactured by Texas Instruments Co., Ltd.: digital micromirror device) in which a micromirror of 16 μm square is disposed in a rectangular opening region.

Each of the micromirrors 2a is supported by, for example, an elastic pin. Further, each of the micromirrors 2a is driven by a driving portion (not shown) that generates an electrostatic electric field in accordance with a control signal, and is shaken in two inclination angles of an open state and an off state, for example, ±12°.

The micromirror array 2 reflects the laser light L1 incident on the reference plane M at a certain incident angle, and the micromirror 2a in the open state is reflected toward the projection optical axis of the objective lens 106b side to form a modulation of the cross-sectional shape of the corresponding control signal. Light laser light L2.

As shown in FIG. 3B, the laser irradiation unit 3 includes a lens barrel 3a, a mirror 3b as an optical path deflecting portion, and an optical fiber mounting portion 3c. The optical fiber mounting portion 3c provided at the upper end of the lens barrel 3a is connected to the optical fiber 103 shown in Fig. 4, and the optical fiber 103 guides the laser light L1 pulsed by the laser light source 101. The input side of the optical fiber 103 is provided with a coupling lens 102 that concentrates the laser light L1 from the oscillating parallel beam of the laser light source 101 into a diameter smaller than the core diameter of the optical fiber 103.

The laser irradiation unit 3 expands the laser light L1 guided by the optical fiber 103 into an effective irradiation area that can illuminate the micromirror array 2, and deflects (reflects) the mirror 3b to illuminate the micromirror array 2.

Further, the processing light source uses a laser light source 101 that oscillates a laser beam having a plurality of wavelengths to form a substantially parallel beam and emits the light. The laser light source 101 used in the present embodiment can emit the second, third, and fourth harmonics using, for example, a YAG laser having a fundamental wavelength of λ1 = 1.064 μm (each wavelength λ2 = 532 nm, λ3 = 355 nm, and λ4 = 266 nm). ).

The first rotation mechanism 4 is a conventional angle measuring table that allows the upper stage to pass the reference plane M of the micromirror array 2 and the incident side optical axis of the objective lens 106b (the incident optical axis of the mirror 105 of the projection optical system). At the intersection of the intersections, the rotation axis A parallel to the reference plane M is the center rotation (arrow R1). The angle measuring table 4 is mounted with a goniometer pedestal 6 on its upper stage, and the angle measuring pedestal 6 is formed to allow the laser light L1 emitted by the laser illuminating unit 3 and the laser light L2 modulated by the micromirror array 2 to pass through. Through hole 6a.

A plurality of struts 7 are erected on the upper surface of the angle measuring pedestal 6, and a plurality of struts 7 support the micromirror holder 8 in which the micromirror array 2 is disposed vertically downward.

The angle measuring table (1st rotation mechanism) 4 is rotated about the rotation axis A by the angle measuring pedestal 6, and the micromirror array 2 which can be integrally mounted with the angle measuring pedestal 6 is rotated around the rotation axis A (Arrow R1) to any angle.

By using the goniometer (first rotation mechanism) 4, the micromirror array 2 is rotated in the direction of the arrow R1 with respect to the rotation axis A, so that the micromirror array 2 can be made to be the emission side optical axis of the laser irradiation unit 3. The laser light L1 is tilted to any angle. At this time, the tilt angle of the micromirror array 2 is adjusted by the angle measuring table 4, so that the light intensity distribution of the reflected light determined by the opening of each micromirror is maximized when the micromirrors of the micromirror array 2 are in an ON state. The Fraunhofer diffracted light 70 enters the opening of the projection optics. By rotating the micromirror array 2 around the rotation axis A by the angle measuring table 4, the incident angle θ ₀ of the laser light L1 irradiated by the laser irradiation portion 3 to the micromirror array 2 can be changed.

As shown in FIGS. 5 and 6, the second rotation mechanism 5 has two rocking support portions 5a and 5a which are erected on the base portion 9 and are opposed to each other, and are supported by the rocking support portions 5a and 5a. The shaking portion 5b. Further, the base portion 9 is formed with a through hole 9a through which the laser light L2 modulated by the micromirror array 2 passes.

The rocking portion 5b is pivotally supported (rotated) by the rocking support portions 5a and 5a around the rotation axis A coaxial with the rotation axis A of the angle measuring table (first rotation mechanism) 4.

The rocking portion 5b has a lower plate 5c for mounting the goniometer 4, and side plates 5d and 5e for supporting the lower plate 5c, and has a substantially U-shape when viewed from the front. The side plates 5d, 5e are rockably supported by the rocking support portions 5a, 5a at the upper end.

A goniometer (first rotation mechanism) 4 is provided on the upper surface of the lower plate 5c, and the lens barrel 3a of the laser irradiation unit 3 passes through the lower plate 5c, and the entire laser irradiation unit 3 is fixed near the lower end of the lens barrel 3a. The mirror 3b that deflects (reflects) the optical path of the laser irradiation unit 3 toward the micromirror array 2 side is attached to the front end portion of the lens barrel 3a of the laser irradiation unit 3, so that the lower plate 5c (the second rotation mechanism 5) is provided. When the rocking portion 5b) is rotated about the rotation axis A, the micromirror array 2 is inclined with respect to the optical axis of the laser light L1 folded back by the mirror 3b, and is fixed at the incident angle θ _{0 to} the micro mirror array. 2 is rotated integrally with the laser irradiation unit 3.

Therefore, by the rotation of the second rotation mechanism 5, both the micromirror array 2 and the laser irradiation unit 3 and the angle measuring table (first rotation mechanism) 4 are integrally rotated about the rotation axis A. Thereby, adjustment can be made so that the desired N times of diffracted light among the N times of diffracted light which occurs when the micromirror array 2 is in the ON state enters the input side opening of the projection optical system. Further, the lower plate 5c forms a through hole 5c-1 through which the laser light L2 modulated by the micromirror array 2 passes.

The laser processing apparatus 100 shown in Fig. 4 includes the above-described laser irradiation apparatus 1, a laser light source 101, a combined lens 102, an optical fiber 103, a control unit 104, a mirror 105, a projection optical system 106, a semi-transparent mirror 107, 108, observation light source 109, condensing lens 110, observation imaging lens 111, imaging element 112, and the like. The object to be processed in this embodiment is the substrate 202 placed on the mounting portion 201.

The control unit 104 is connected to the first rotation mechanism 4 and the second rotation mechanism 5 of the laser irradiation device 1, the laser light source 101, the imaging element 112, and the like, and performs operation control, image processing, and the like. Further, the control unit 104 controls the movable portion (machining head) of the laser processing apparatus 100 to be moved to the processing target position.

In the present embodiment, the device structure of the control unit 104 is a combination of a computer including a CPU, a memory, an input/output unit, an external memory device, and the like, and an appropriate hardware.

The projection optical system 106 constitutes an optical element group of an imaging optical system that is imaged on the processed surface 202a of the substrate 202 at a predetermined magnification by an image generated by the laser light L2 modulated by the micromirror array 2 and reflected in a certain direction, and The imaging lens 106a is disposed on the side of the micromirror array 2, and the objective lens 106b is disposed on the substrate 202. Further, the projection optical system 106 is disposed such that the reference plane M of the micromirror array 2 is substantially conjugate with the substrate 202.

The semi-transparent mirror 107 reflects the horizontal direction laser light L3 transmitted through the imaging lens 106a toward the vertical direction of the objective lens 106b. On the other hand, the semi-transparent mirror 108 transmits the laser light L4 reflected by the semi-transparent mirrors 107 and 108 vertically downward, and reflects the observation light L5 emitted from the observation light source 109 to the objective lens 106b.

The observation light source 109 is a light source that generates observation light L5 for illuminating the processable region on the processed surface 202a of the substrate 202. Further, a condensing lens 110 is provided between the observation light source 109 and the half mirror 108.

The observation imaging lens 111 is disposed above the semi-transparent mirror 107. Further, the observation imaging lens 111 is a light for reflecting the processed surface 202a illuminated by the observation light L5 and collecting the light by the objective lens 106b, and imaging the image. Optical element on the photographic surface of element 112.

The photographic element 112 is a photoelectric conversion device that images an image formed on a photographic surface, and is configured by, for example, a CCD or the like. The image signal photoelectrically converted by the imaging element 112 is sent to the control unit 104 electrically connected to the imaging element 112.

Hereinafter, the operation of the laser irradiation device 1 and the laser processing device 100 will be described.

In order to perform laser processing using the laser processing apparatus 100, as shown in FIG. 4, first, the substrate 202 is placed on the mounting table 201 as a workpiece.

Then, the control unit 104 moves the movable portion (processing head) of the laser processing apparatus 100 other than the laser light source 101 and the like, and acquires an image of the processable region of the processed surface 202a.

First, when the observation light source 109 is turned on, the observation light L5 is generated. A portion of the observation light L5 is reflected by the semi-transparent mirror 108, and the reflected light is collected by the objective lens 106b to illuminate the processable region on the processed surface 202a.

The reflected light reflected by the processed surface 202a is guided to the observation imaging lens 111 through the half mirror 107 and the half mirror 108. The light incident on the observation imaging lens 111 is imaged on the imaging surface of the imaging element 112.

The imaging element 112 photoelectrically converts the image of the imaged surface 202a to be imaged and sends it to the control unit 104. The control unit 104 removes noise, removes noise, and performs processing such as brightness correction as needed, and displays it on a display unit (not shown). Further, the control unit 104 converts the video signal into video data and memorizes it. In this way, an image of the workable area of the processed surface 202a can be obtained.

Next, the control unit 104 reads the stored image data and performs defect extraction. Further, the control unit 104 determines the type and size of the defect to be extracted, and when it is determined that the defect is to be repaired, the laser light is irradiated to the defective laser light by the defective image data on the substrate 202 indicated by the defective image data. The control signal is sent to the micromirror array 2.

Next, the control unit 104 sends a control signal for oscillating the laser light to the laser light source 101, and oscillates the laser light L1 from the laser light source 101 in accordance with the irradiation condition selected in advance by the substrate 202. The irradiation conditions of the laser light include, for example, a wavelength, an output, an oscillation pulse width, and the like.

The oscillated laser light L1 is incident on the optical fiber 103 by means of the lens 102, passes through two projection lenses of the lens barrel 3a, is reflected by the mirror 3b, and is projected onto the micromirror array 2, and is reflected by the respective micromirrors 2a on the micromirror array 2. .

Here, the condition for causing the modulated laser light L2 to be efficiently incident on the projection optical system 106 and projected onto the processed surface 202a will be described.

In order to regularly arrange the micromirrors 2a for the micromirror array 2, the light intensity distribution of the modulated laser light L2 is determined by the diffraction phenomenon of the micromirrors 2a.

For example, as shown in FIG. 7A, when the laser light L1 is incident with respect to the mirror opening face of the micromirror array 2 at an incident angle θ ₀ = 2‧ Φ , only the tilting angle Φ is turned counterclockwise with respect to the reference plane M. The laser light L2, which is reflected by the majority of the micromirrors 2a, generates the N diffracted lights 71 determined by the arrangement pitch of the micromirrors together with the Fraunhofer diffracted light 70 determined by the opening of the micromirrors. The light intensity distribution in the direction of the normal reflection of the laser light L2 is obtained by convolving the diffracted lights.

The Fraunhofer diffraction light 70 has a light intensity distribution which is determined by the opening of the micromirror 2a and which has a peak shape in the direction of the normal reflection of the micromirror 2a (in the present embodiment, the vertical downward direction). On the other hand, the N times of diffracted light 71 corresponds to the number of diffractions determined by the arrangement pitch of the micromirrors 2a and the wavelength of the laser light L1, and a discrete diffraction pattern in which the diffraction angle is dispersed is formed.

That is, the 0th-order diffracted light d _{0 is} used as the specular reflected light of the laser light L1 with respect to the opening (mirror surface) of the micromirror array 2 (in the present embodiment, the direction in which the clockwise rotation is rotated with respect to the vertical downward direction) Produced, N times of diffracted light d _{N is} generated in a direction in which the arrangement pitch of the micromirrors 2a and the wavelength of the laser light L1 are differently determined in a different manner (however, N=1, 2, ...) .

At this time, in a state in which the direction of the diffracted light of any one of the N times of the diffracted light 71 substantially coincides with the direction of the peak intensity of the Fraun and the Fission light 70, the micromirror 2a in the ON state can be turned on. When the reflected light L2 of the reflected light is incident on the projection optical system 106, the light intensity distribution of the convolution becomes large, so the diffraction efficiency is improved. Therefore, the light utilization efficiency can be improved.

For example, as in the case of FIG. 7A, when the d diffracted d ₃ light and the 4 diffracted d ₄ in the N times of the diffracted light 71 are only tilted by θ ₃ and θ ₄ (however, θ ₄ ≦ θ ₃ ), At least one of the diffracted lights is aligned with the direction of the peak intensity of the Fraun and Fiji diffracted lights 70, and the diffraction efficiency is improved to achieve good light utilization efficiency.

The direction of the peak intensity of the Fulang and Fiji diffracted light 70 is determined by the incident angle θ ₀ and the tilt angle Φ of the micromirror 2a, and the diffraction angle of the N times of diffracted light 71 is determined by the arrangement pitch of the micromirrors 2a and the wavelength of the laser light L1. Therefore, the information can be obtained by the control unit 104. For example, the second rotation mechanism 5 is rotated, and the directions of the peak intensities of the Fraun and Fiji diffracted lights 70 are aligned in the direction of the diffracted light of N times. Thereby, the diffracted light of the required intensity is obtained.

When the direction of the diffracted light of the required intensity does not enter the closed angle range of the projection optical system 106, the micromirror array 2 and the laser irradiating portion 3 are integrally rotated by the second rotating mechanism 5 to achieve the required intensity. The diffracted light enters at least the angular extent of the projection optics 106, if possible, to coincide with the optical axis of the projection optics 106.

For example, first, as shown by the broken line in FIG. 7B, the inclination of the micromirror array 2 in the ON state is changed by the first rotation mechanism 4, so that the laser light L1' is changed with respect to the reference plane M. The incident angle (θ ₀ + Δθ) is incident. According to the change of the incident angle, the diffraction direction of each of the diffracted lights changes. Further, by the micromirror array micromirror array 2 and the laser irradiation portion 2 integrally rotating 3, whereby, for example, to make a so-called 3-order diffracted light diffracted d ₃ of the same direction of the desired direction of the diffracted light The action coincides with the optical axis direction of the projection optical system 106.

When the rotation of the first rotation mechanism 4 and the rotation of the second rotation mechanism change the oscillation wavelength of the laser light source 101, it is preferable to perform the wavelength according to the wavelength.

For example, as shown in FIG. 7C, when the short-wavelength laser light L1' is incident by the micromirror array 2, the Fraunhofer diffracted light 70 is not different from the 7A diagram, but the N-order diffracted light 71 is based on The change in wavelength produces 0 times of diffracted light e ₀ in the direction of normal reflection of the reflecting surface of the micromirror array 2, and the diffracted direction of the higher order diffracted light in Fig. 7A produces N times of diffracted light e _N (however, N = 1, 2, ...). Therefore, the N-order diffracted light having the required intensity is guided to the projection optical system 106 by the rotation of the second rotary mechanism 5.

The OFF (OFF) light reflected by the micromirror 2a in an OFF state is reflected outside the range of the optical path connected to the imaging lens 106a, and is modulated by the reflection of the micromirror 2a in an ON state at an oblique angle. The laser light L2 of the light is reflected by the mirror 105, passes through the imaging lens 106a, reaches the semi-transparent mirror 107, and is reflected.

The laser light L4 reflected by the half mirror 107 is moved in the vertical downward direction, and the objective lens 106b is formed on the processed surface 202a. Thus, according to the processing data, the image of the modulation area is projected on the processed surface 202a. As a result, the laser light L4 is irradiated to the defect of the processed surface 202a, and the defect is removed.

By the end of the laser processing. After the processing, the image of the reworked surface 202a is obtained by the photographic element 112, and if necessary, the laser processing is repeated, and if there is an unremoved portion, re-laser processing is performed, or the workable area is moved to perform other parts. Laser processing.

In the present embodiment described above, the first rotation mechanism 4 rotates the micromirror array 2, and the second rotation mechanism 5 integrally rotates both the micromirror array 2 and the laser irradiation unit 3. Thereby, N times of diffracted light can be selected to maximize the diffraction efficiency.

Therefore, by rotating the micromirror array 2 by the first rotation mechanism 4, the incident angle θ _{0 of the} laser irradiation unit 3 with respect to the micromirror array 2 can be set so as to be determined by the opening (mirror surface) of each micromirror. Fraun and Fiji diffracted light (positively reflected light) become the maximum intensity. When the incident angle θ _{0 is} fixed, the micromirror array 2 and the laser irradiation unit 3 are integrally rotated by the second rotation mechanism 5, whereby the desired diffracted light can be simply guided to the projection optical system 106. .

Therefore, according to the present embodiment, the utilization efficiency of the laser light can be easily improved.

Further, the change in the utilization efficiency due to the change in the wavelength of the laser light L1 can be suppressed depending on the oscillation wavelength of the laser light source 101. Furthermore, even if there is unevenness in the tilt angle of the ON state of the micromirror 2a due to uneven manufacturing of the micromirror array 2, the laser light L1 corresponding to the tilt angle can be adjusted in each micromirror array 2. The incident angle θ ₀ can be adjusted so that the light use efficiency is good.

Further, in the present embodiment, the first rotation mechanism 4 can change the incident angle θ ₀ of the laser light L1 irradiated by the laser irradiation portion 3 with respect to the micromirror array 2 by the rotation of the micromirror array 2, Therefore, the adjustment of the incident angle θ ₀ can be performed easily and efficiently.

For example, when the micromirror array 2 and the laser irradiation unit 3 are respectively rotated by the angle measuring table, either the micromirror array 2 or the laser irradiation unit 3 is rotated in a state where the incident angle θ ₀ is set to When the required diffraction angles are the same, a so-called incident angle θ ₀ changes, and the effect of the fu and the diffracted light deviating from the optical axis is inefficient. In order to solve this problem, it is necessary to adjust the micromirror array 2 or the laser irradiation unit 3 several times, and a new problem of requiring time adjustment occurs.

In the present embodiment, the second rotation mechanism 5 integrally rotates the micromirror array 2, the laser irradiation unit 3, and the first rotation mechanism 4, so that the incident angle θ ₀ can be fixed once. The operation simply sets the desired diffracted light in the N times of diffracted light.

Further, in the present embodiment, the point at which the reference plane M of the micromirror array 2 intersects with the incident optical axis of the objective lens 106b side of the projection optical system is used as the rotation axis A and the second rotation of the laser irradiation device 1. Since the rotation center of the rotation axis A of the mechanism 5 makes it possible to more easily and efficiently set the incident angle θ ₀ and the N times of the diffracted light 71.

Further, in the embodiment, the rotation axis A of the first rotation mechanism 4 and the rotation axis A of the second rotation mechanism 5 are identical to each other, so that the adjustment of the incident angle θ ₀ can be easily and efficiently performed.

Further, in the present embodiment, an example in which only the micromirror array 2 and the micromirror array 2 in the laser irradiation unit 3 are rotated by the first rotation mechanism 4 will be described, but the first rotation mechanism 4 is used. Only by rotating the laser irradiation unit 3, the incident angle θ ₀ of the laser light L1 irradiated by the laser irradiation unit 3 with respect to the micromirror array 2 can be changed.

In the present embodiment, an example in which the entire laser irradiation unit 3 is rotated by the second rotation mechanism 5 will be described. However, even if only the mirror 3b of the laser irradiation unit 3 is rotated, for example, The incident angle θ _{0 of the} laser light L1 with respect to the micromirror array 2 is changed.

Further, in the present embodiment, the rotation axis A of the first rotation mechanism 4 and the rotation axis A of the second rotation mechanism 5 are the same as each other. However, if the rotation axes are the irradiation The intersection of the optical axis of the laser light L1 and the micromirror array 2 may also intersect each other.

Further, in the present embodiment, the first rotation mechanism 4 and the second rotation mechanism 5 are different from each other. For example, both of them are used as the angle measurement table of the first rotation mechanism 4, for example. The structure of the first rotation mechanism 4 and the second rotation mechanism 5 may be appropriately determined depending on the structure of the laser irradiation device 1 or the like.

Further, in the present embodiment, an example in which the rotation of the first rotation mechanism 4 (arrow R1) and the rotation of the second rotation mechanism 5 (arrow R2) are one-axis rotation will be described. The micromirror array 2, the laser irradiation unit 3, and the like are rotated about a rotation axis of two or more axes.

Further, in the present embodiment, an example in which the laser irradiation unit 3 irradiates the laser light L1 emitted from the laser light source 101 is described, but the laser irradiation unit 3 may have a structure having a laser light source.

1. . . Laser irradiation device

2. . . Micromirror array

2a. . . Micromirror

3. . . Laser irradiation department

3a. . . Lens barrel

3b. . . mirror

3c. . . Fiber installation

4. . . 1st rotation mechanism (horn angle table)

5. . . Second rotation mechanism

5a. . . Shake support

5b. . . Shake

5c. . . Lower plate

5c-1. . . Through hole

5d, 5e. . . Side panel

6. . . Angle measuring pedestal

6a. . . Through hole

7. . . pillar

8. . . Micro mirror holder

9. . . Base

9a. . . Through hole

70. . . Fulang and Feiguang

71. . . N times of diffracted light

100. . . Laser processing device

101. . . Laser source

102. . . Combined lens

103. . . optical fiber

104. . . Control department

105. . . Reflector

106. . . Projection optical system

106a. . . Imaging lens

106b. . . Objective lens

107,108. . . Semi-transparent mirror

109. . . Observation light source

110. . . Condenser lens

111. . . Imaging lens for observation

112. . . Photography component

201. . . Placement unit

202. . . Substrate

202a. . . Machined surface

L1, L2, L3, L4, L1'. . . laser

L5. . . Observation light

A. . . Rotary axis

M. . . Datum

R. . . Shake shaft

Fig. 1 is a perspective view showing a laser irradiation apparatus according to an embodiment of the present invention.

Fig. 2 is a front elevational view showing a laser irradiation apparatus according to an embodiment of the present invention.

Fig. 3A is a right side view showing a laser irradiation apparatus according to an embodiment of the present invention.

Fig. 3B is a cross-sectional view for explaining an optical path of a laser irradiation apparatus according to an embodiment of the present invention.

Fig. 4 is a schematic structural view showing a laser processing apparatus having a laser irradiation apparatus according to an embodiment of the present invention.

Fig. 5 is a perspective view for explaining a second rotation mechanism of the laser irradiation apparatus according to an embodiment of the present invention.

Fig. 6 is a front elevational view showing a second rotation mechanism of the laser irradiation apparatus according to an embodiment of the present invention.

Fig. 7A is an explanatory view (1) for explaining a diffraction phenomenon of an embodiment of the present invention.

Fig. 7B is an explanatory view (2) for explaining a diffraction phenomenon of an embodiment of the present invention.

Fig. 7C is an explanatory view (3) for explaining a diffraction phenomenon of an embodiment of the present invention.

1. . . Laser irradiation device

2. . . Micromirror array

3. . . Laser irradiation department

3a. . . Lens barrel

3c. . . Fiber installation

4. . . 1st rotation mechanism (horn angle table)

5. . . Second rotation mechanism

5a. . . Shake support

5b. . . Shake

5c. . . Lower plate

5c-1. . . Through hole

5d, 5e. . . Side panel

6. . . Angle measuring pedestal

6a. . . Through hole

7. . . pillar

8. . . Micro mirror holder

9. . . Base

9a. . . Through hole

A. . . Rotary axis

Claims (5)

A laser irradiation device is a laser irradiation device that irradiates laser light emitted from a laser light source to a workpiece, and is characterized in that: the spatial modulation component is disposed to intersect with an optical axis of the projection optical system. Positioning, and the plurality of deflecting elements are arranged in two dimensions, and the projection optical system is configured to guide the laser light to the workpiece, the plurality of deflecting elements are used to deflect the laser light; laser irradiation a portion that irradiates the reference surface of the spatial modulation element with the laser light emitted by the laser light source; and the first rotation mechanism uses the first rotation axis as a rotation center to cause the spatial modulation element And rotating the laser irradiation unit, wherein the first rotation axis is an intersection point between an optical axis of the projection optical system and a reference surface of the spatial modulation element; and a second rotation mechanism The second rotation axis is a rotation center, and a plane in which both the spatial modulation element and the laser irradiation unit are integrally attached is integrally rotated, and the second rotation axis passes through the projection optical system. An intersection of the optical axis and the reference surface of the spatial modulation element is rotated by the first rotation mechanism to rotate the spatial modulation element and the laser irradiation unit, thereby adjusting the inclination angle so that The intensity of the reflected light intensity determined by the openings of the respective deflecting elements is the largest, and the diffracted light of the Fiji enters the opening of the projection optical system, and in this state, the aforementioned plane is rotated by the second rotating mechanism to make the aforementioned The spatial modulation element and the aforementioned laser irradiation unit are integrally rotated, and The desired N times of diffracted light enters the opening of the aforementioned projection optical system. The laser irradiation device according to claim 1, wherein the first rotation mechanism is changed by the laser irradiation unit by rotating the spatial modulation element and the laser irradiation unit The angle of incidence of the aforementioned laser light with respect to the aforementioned spatial modulation element. The laser irradiation apparatus according to claim 1 or 2, wherein the second rotation mechanism rotates the plane in a state in which the spatial modulation element and the laser irradiation unit are both In this state, the spatial modulation element and the laser irradiation unit are rotated by the first rotation mechanism and fixed to the Folang and Fiji diffracted light to have maximum intensity. The state of the incident angle. A laser irradiation apparatus according to claim 1 or 2, wherein the first rotation axis is the same as the second rotation axis. The laser irradiation device according to claim 1, wherein the second rotation mechanism has two rocking support portions facing each other and a rocking portion supported by the rocking support portion, wherein the rocking portion has a U shape And having: a lower plane as the plane; and two side planes supporting both sides of the lower plane and supported by the rocking support portion in a rockable manner.