CN101898276B - Laser irradiation apparatus - Google Patents

Laser irradiation apparatus Download PDF

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Publication number
CN101898276B
CN101898276B CN201010177951.8A CN201010177951A CN101898276B CN 101898276 B CN101898276 B CN 101898276B CN 201010177951 A CN201010177951 A CN 201010177951A CN 101898276 B CN101898276 B CN 101898276B
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CN
China
Prior art keywords
laser
rotating mechanism
modulation element
spatial modulation
optical system
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Expired - Fee Related
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CN201010177951.8A
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Chinese (zh)
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CN101898276A (en
Inventor
福田达史
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Olympus Corp
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Olympus Corp
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/042—Automatically aligning the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/10—Scanning systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Laser Beam Processing (AREA)
  • Mechanical Light Control Or Optical Switches (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)

Abstract

The present invention provides a laser irradiation apparatus, capable of easily improving laser utilization efficiency. The laser irradiation apparatus (1) irradiates laser ejected from a laser source to an object to be processed and includes a space modulating element arranged at a position intersecting with an optical axis of a projection optical system, the space modulating element (2) is formed by disposing a plurality of deflexion elements for the laser in two dimension, wherein the projection optical system guides the laser to the object to be processed; a laser irradiation part (3), irradiating laser to the space modulating element (2); a first rotating mechanism (4), for rotating one of the space modulating element (2) and the laser irradiation part (3), wherein a rotating center ( rotating axis A) is an intersection point of the optical axis of the projection optical system and a fiducial face of the space modulating element (2); and a second rotating mechanism (5), for rotating the space modulating element (2) and the laser irradiation part (3) integrately, wherein the rotating center ( rotating axis A) is the intersection point of the optical axis of the projection optical system and the fiducial face of the space modulating element (2).

Description

Laser irradiation device
Technical field
The present invention relates to the laser irradiation device with spatial modulation element.
Background technology
Conventionally, there is known by irradiating to the desired region of machined object the laser processing device that laser carries out the processing of machined object.As this laser processing device, such as, there will be a known such laser repair device: in the manufacture of liquid crystal display etc., revise to the wiring pattern on glass substrate or for the defective part of the unwanted residue that exists in the photomask that exposes etc.
The laser irradiation device be used in such laser processing device utilizes variable rectangular aperture etc. to limit the size of the irradiation area of laser, but there will be a known the laser irradiation device employing the spatial modulation element such as micro mirror array in recent years.
Using the active optical component arranged regularly by multiple active optics component as micro mirror array under carrying out sharp light-struck situation, be divided into many diffraction lights by the laser after micro mirror array reflects.But, because microscopical rear side numerical aperture is general very little, so the diffraction light that divide into many cannot be made all incident.Therefore, if only setting microscopical optical axis based on the normal reflection direction of micro mirror, then the phenomenon that the utilization ratio of laser is reduced can produced.
Therefore, in patent document 1, propose such laser processing device: utilize rotating mechanism to make at least one party in LASER Light Source and spatial modulation element relative to the variably of light modulated illuminating optical system, make the diffraction direction of the light modulated of spatial modulation element consistent with light modulated illuminating optical system thus.
Patent document 1: Japanese Unexamined Patent Publication 2007-7660 publication
But, when have adjusted the gradient of LASER Light Source or spatial modulation element as the laser processing device recorded in above-mentioned patent document 1, to have target strength diffraction light select and the diffraction light making this select consistent with the optical axis of light modulated illuminating optical system be very difficulty, and this adjustment also needs a lot of time.
Summary of the invention
In view of above-mentioned actual conditions in the past, problem of the present invention is to provide a kind of laser irradiation device that easily can improve the utilization ratio of laser.
In order to solve the problem, the invention provides a kind of laser irradiation device, the laser penetrated from LASER Light Source irradiates to machined object by it, this laser irradiation device is configured to comprise: spatial modulation element, it is configured in the position crossing with the optical axis of projection optical system, this spatial modulation element is by forming being used for making multiple deflecting elements of described laser deflection to line up two-dimensionally, and wherein, described projection optical system is used for machined object described in described laser guide; Laser irradiating part, it irradiates described laser to described spatial modulation element; First rotating mechanism, it makes any one party in described spatial modulation element and described laser irradiating part rotate, and the center of rotation intersection point that to be the optical axis of described projection optical system crossing with the datum level of described spatial modulation element; And second rotating mechanism, it makes described spatial modulation element and described laser irradiating part rotate integratedly, and the center of rotation intersection point that to be the optical axis of described projection optical system crossing with the datum level of described spatial modulation element.
According to the present invention, the utilization ratio of laser easily can be improved.
Accompanying drawing explanation
Fig. 1 is the stereogram of the laser irradiation device represented involved by an embodiment of the invention.
Fig. 2 is the front view of the laser irradiation device represented involved by an embodiment of the invention.
Fig. 3 A is the right side view of the laser irradiation device represented involved by an embodiment of the invention.
Fig. 3 B is the sectional view of the light path for illustration of the laser irradiation device involved by an embodiment of the invention.
Fig. 4 is the summary construction diagram of the laser processing device representing the laser irradiation device had involved by an embodiment of the invention.
Fig. 5 is the stereogram of the second rotating mechanism for illustration of the laser irradiation device involved by an embodiment of the invention.
Fig. 6 is the front view of the second rotating mechanism for illustration of the laser irradiation device involved by an embodiment of the invention.
Fig. 7 A is the key diagram (one) for illustration of the diffraction phenomena in an embodiment of the invention.
Fig. 7 B is the key diagram (its two) for illustration of the diffraction phenomena in an embodiment of the invention.
Fig. 7 C is the key diagram (its three) for illustration of the diffraction phenomena in an embodiment of the invention.
Label declaration
1: laser irradiation device; 2: micro mirror array; 2a: tiny mirror; 3: laser irradiating part; 3a: lens barrel; 3b: speculum; 3c: optical fiber installation portion; 4: angle measurement frame (the first rotating mechanism); 5: the second rotating mechanisms; 5a: swinging mounting portion; 5b: swing part; 5c: lower panel; 5c-1: through hole; 5d, 5e: side panel; 6: angle measurement frame mount pad; 6a: through hole; 7: pillar; 8: micro mirror mount pad; 9: base portion; 9a: through hole; 100: laser processing device; 101: LASER Light Source; 102: coupled lens; 103: optical fiber; 104: control part; 105: speculum; 106: projection optical system; 106a: imaging len; 106b: object lens; 107,108: semi-transparent semi-reflecting lens; 109: observation light source; 110: collector lens; 111: observation imaging len; 112: imaging apparatus; 201: mounting portion; 202: substrate; 202a: machined surface.
Detailed description of the invention
Below, with reference to accompanying drawing, the laser irradiation device involved by embodiments of the present invention is described.
Fig. 1, Fig. 2 and Fig. 3 A is the stereogram of the laser irradiation device 1 represented involved by an embodiment of the invention, front view and right side view.
Fig. 3 B is the sectional view of the light path for illustration of laser irradiation device 1.
Fig. 4 is the summary construction diagram representing the laser processing device 100 with laser irradiation device 1.In addition, because Fig. 4 is summary construction diagram, so also location relation and the inconsistent part of other accompanying drawing.
Fig. 5 and Fig. 6 is stereogram for illustration of the second rotating mechanism 5 of laser irradiation device 1 and front view.
Laser irradiation device 1 involved by present embodiment such as the laser processing device 100 shown in Fig. 4 a part and configure, this laser irradiation device 1 to machined object irradiate laser.
As machined object, such as, can list the glass substrate, semiconductor substrate etc. for liquid crystal display etc.When with these substrates for machined object, as processing object, list wiring pattern on substrate or the such defect etc. of the unwanted residue for existing in the photomask that exposes.
In addition, in the present embodiment, the part of laser irradiation device 1 as laser processing device 100 is described, but laser irradiation device 1 also can be applied to other purposes such as such as image projection device or image displaying device etc.
Laser irradiation device 1 comprises: the micro mirror array 2 shown in Fig. 3 B and Fig. 4, and it is by the spatial modulation element of deflection component two-dimensional arrangements, and this deflection component is that the minor reflective eyeglass of shape expected is formed by making laser forming; Laser irradiating part 3, it irradiates laser to this micro mirror array 2; First rotating mechanism 4, it makes any one party in micro mirror array 2 and laser irradiating part 3 rotate; And second rotating mechanism 5, it makes both micro mirror array 2 and laser irradiating part 3 rotate integratedly.
About micro mirror array 2, as shown in Fig. 7 A ~ Fig. 7 C, tiny mirror 2a as deflection component is arranged in clathrate, opens (ON)/closedown (OFF) by making each tiny mirror 2a and spatial modulation is carried out to the laser sent by laser irradiating part 3.
When the angle of inclination of swinging axle R is the closed condition of 0 °, each tiny mirror 2a is configured to the clathrate in direction in length and breadth regularly on the datum level M of micro mirror array 2, when becoming open mode according to control signal, each tiny mirror 2a can tilt to predetermined direction.As micro mirror array 2, such as can adopt the open area and the element such as DMD (Digital Micromirror Device: DMD is manufactured by TexasInstruments company) formed that 16 μm of square tiny mirror are configured at rectangle.
Each tiny mirror 2a is such as supported on elastic hinge.In addition, each tiny mirror 2a is swing in two inclinations angle of open mode and closed condition, the scope of such as ± 12 ° by drive division (not shown), and described drive division produces static electric field according to control signal.
This micro mirror array 2 utilizes the tiny mirror 2a of open mode to make to reflect to the projection optical axis direction of object lens 106b side with the laser L1 of fixing incident angles relative to datum level M, thus forming laser L2, this laser L2 is the light modulated with the cross sectional shape corresponding with control signal.
As shown in Figure 3 B, laser irradiating part 3 has lens barrel 3a, as the speculum 3b in optical path-deflecting portion and optical fiber installation portion 3c.The optical fiber 103 shown in optical fiber installation portion 3c and Fig. 4 being arranged at the upper end of lens barrel 3a connects.This optical fiber 103 guides the laser L1 gone out by LASER Light Source 101 impulse hunting.The input side of optical fiber 103 is provided with coupled lens 102, this coupled lens 102 make from LASER Light Source 101 vibrate for collimated light beam laser L1 diametric shrinkage become less than the core diameter of optical fiber 103.
Laser irradiating part 3 will be guided the laser L1 come to be extended to effective irradiation area that can irradiate micro mirror array 2 beam diameter by optical fiber 103, and utilize speculum 3b to make it deflect (reflection) thus irradiate to micro mirror array 2.
In addition, as processing light source, employ and impulse hunting can go out have the laser of multiple wavelength and make it as the LASER Light Source 101 of almost parallel beam exit.The LASER Light Source 101 used in present embodiment employs the YAG laser of such as fundamental wavelength λ 1=1.064 μm, its can penetrate second, third, the 4th higher hamonic wave (wavelength is respectively λ 2=532nm, λ 3=355nm, λ 4=266nm).
First rotating mechanism 4 is known angle measurement frame (gonio stage), this angle measurement frame makes upper bracket rotate centered by the pivot center A parallel with datum level M (arrow R1), and this pivot center A is by the datum level M of micro mirror array 2 intersection point crossing with the light incident side optical axis (incident light axis of the speculum 105 of projection optical system) of object lens 106b.This angle measurement frame 4 support is provided with angle measurement frame mount pad 6 thereon.Be formed with through hole 6a at angle measurement frame mount pad 6, this through hole 6a is for making from the laser L1 of laser irradiating part 3 irradiation and the laser L2 transmission after being modulated by micro mirror array 2.
Erect at the upper surface of angle measurement frame mount pad 6 and be provided with multiple pillar 7.Multiple pillar 7 supports micro mirror mount pad 8, and micro mirror array 2 is vertical is configured at this micro mirror mount pad 8 facing downward.
Angle measurement frame (the first rotating mechanism) 4 makes angle measurement frame mount pad 6 rotate centered by pivot center A, and the micro mirror array 2 (along arrow R1) centered by pivot center A being integrally installed on angle measurement frame mount pad 6 can be made thus to rotate into arbitrarily angled.
By utilizing this angle measurement frame (the first rotating mechanism) 4 to make micro mirror array 2 rotate in arrow R1 direction relative to pivot center A, micro mirror array 2 can be made relative to become laser irradiating part 3 the laser L1 of exiting side optical axis be inclined to arbitrarily angled.Now, utilizing the angle of inclination of angle measurement frame 4 pairs of micro mirror arrays 2 to adjust, is the opening that maximum Fraunhofer diffraction light 70 enters into projection optical system to make light intensity distributions that determined by the opening of each tiny mirror when each tiny mirror of micro mirror array 2 is in open mode, reverberation.By utilizing angle measurement frame 4 to make micro mirror array 2 rotate centered by pivot center A, the laser L1 that irradiated by laser irradiating part 3 can be made relative to the incidence angle θ of micro mirror array 2 0variable.
As shown in Figure 5 and Figure 6, the second rotating mechanism 5 has: two swinging mounting portions 5a, 5a, and they are erect and arrange on the base part 9, and mutually opposing; And swing part 5b, its by swinging mounting portion 5a, 5a support.In addition, be formed with through hole 9a at base portion 9, this through hole 9a is for making the laser L2 transmission after being modulated by micro mirror array 2.
Swing part 5b is supported to can swings (rotation) centered by pivot center A by swinging mounting portion 5a, 5a, and the pivot center A of this pivot center A and angle measurement frame (the first rotating mechanism) 4 is same axis.
Swing part 5b has: lower panel 5c, and it is for installing angle measurement frame 4; With side panel 5d, 5e, it supports the both sides of this lower panel 5c, this swing part 5b in front view in roughly U-shaped.Side panel 5d, 5e are supported in upper end can swing by swinging mounting portion 5a, 5a.
The upper surface of lower panel 5c is provided with angle measurement frame (the first rotating mechanism) 4.In addition, the lens barrel 3a of laser irradiating part 3 is through lower panel 5c, and laser irradiating part 3 entirety is fixed on the lower end of lens barrel 3a.Be provided with speculum 3b at the end section of the lens barrel 3a of laser irradiating part 3, this speculum 3b makes the light path of laser irradiating part 3 turn (reflection) to micro mirror array 2 lateral deviation.Therefore, when lower panel 5c (the swing part 5b of the second rotating mechanism 5) rotates centered by pivot center A, micro mirror array 2 and laser irradiating part 3 are fixed into incidence angle θ at micro mirror array 2 relative to the inclined light shaft of the laser L1 after being turned back by speculum 3b 0state under rotate integratedly.
Therefore, by the rotation of the second rotating mechanism 5, both micro mirror array 2 and laser irradiating part 3 and angle measurement frame (the first rotating mechanism) 4 are rotated integratedly centered by pivot center A, and the N level time diffraction light that can be adjusted to the expectation in the N level time diffraction light making to produce when micro mirror array 2 is in open mode thus enters into the input side opening of projection optical system.In addition, be formed with through hole 5c-1 at lower panel 5c, this through hole 5c-1 is for making the laser L2 transmission after being modulated by micro mirror array 2.
Laser processing device 100 shown in Fig. 4 comprise above-mentioned laser irradiation device 1, LASER Light Source 101, coupled lens 102, optical fiber 103, control part 104, speculum 105, projection optical system 106, semi-transparent semi-reflecting lens 107,108, observation light source 109, collector lens 110, observation imaging len 111 and imaging apparatus 112 etc.Processing object in present embodiment is the substrate 202 be placed in mounting portion 201.
First rotating mechanism 4 and the second rotating mechanism 5, LASER Light Source 101 and the imaging apparatus 112 etc. of control part 104 and laser irradiation device 1 are connected, for carrying out action control and image procossing.In addition, control part 104 is moved it to processing object position by the moving part (processing head) of drived control laser processing device 100.
In the present embodiment, the apparatus structure of control part 104 is formed by computer and suitable hardware combinations, and described computer is made up of CPU, memory, input and output portion, external memory etc.
Speculum 105 makes to be deflected to horizontal direction by the laser L2 after micro mirror array 2 carries out spatial modulation from vertical direction down.
Projection optical system 106 is the optical element groups forming imaging optical system, this imaging optical system makes to utilize micro mirror array 2 to carry out spatial modulation and is imaged on the machined surface 202a of substrate 202 to the picture that the laser L2 after fixed-direction reflection produces with predetermined multiplying power, be configured with imaging len 106a in micro mirror array 2 side, above substrate 202, be configured with object lens 106b.In addition, projection optical system 106 is arranged to the datum level M and the substrate 202 roughly conjugation that make micro mirror array 2.
Semi-transparent semi-reflecting lens 107 makes to reflect along vertical direction down towards object lens 106b through the laser L3 of the horizontal direction of imaging len 106a.On the other hand, semi-transparent semi-reflecting lens 108 makes by semi-transparent semi-reflecting lens 107 to the laser L4 transmission after vertical direction reflection down, and the observation light L5 sent from observation light source 109 is reflected to object lens 106b.
Observation light source 109 is the light sources producing observation light L5, this observation light L5 on the machined surface 202a illuminating substrate 202 can machining area.In addition, between observation light source 109 and semi-transparent semi-reflecting lens 108, collector lens 110 is provided with.
Observation imaging len 111 is configured in the top of semi-transparent semi-reflecting lens 107.In addition, observation imaging len 111 is the machined surface 202a reflection for illuminating from observed light L5 and the optical element of photoimaging in the imaging surface of imaging apparatus 112 after being assembled by object lens 106b.
Imaging apparatus 112 carries out opto-electronic conversion to the image be imaged in imaging surface, and this imaging apparatus 112 is such as made up of CCD etc.Picture signal after utilizing imaging apparatus 112 to carry out opto-electronic conversion is sent to the control part 104 be electrically connected with imaging apparatus 112.
Below, the action of laser irradiation device 1 and laser processing device 100 is described.
When using laser processing device 100 to carry out Laser Processing, as shown in Figure 4, first, substrate 202 is placed in mounting table 201 as machined object.
Then, by control part 104, make the movable part (processing head) except LASER Light Source 101 grade of laser processing device 100 mobile, what obtain machined surface 202a can the image of machining area.
First, observation light L5 is produced by lighting observation light source 109.A part of observation light L5 is reflected by semi-transparent semi-reflecting lens 108, its reverberation assembled by object lens 106b thus illuminate on machined surface 202a can machining area.
Reverberation after machined surface 202a reflects is through object lens 106b, semi-transparent semi-reflecting lens 108, semi-transparent semi-reflecting lens 107 be directed to observation imaging len 111.Incide light imaging in the imaging surface of imaging apparatus 112 of observation imaging len 111.
The image of the machined surface 202a after imaging apparatus 112 pairs of imagings carries out opto-electronic conversion, and is sent to control part 104.In control part 104, as required, implement noise removing, brightness correction etc. to the picture signal of sending process and be shown in not shown display part.In addition, control part 104 converts picture signal to view data and stores.What so just obtain machined surface 202a can the image of machining area.
Then, control part 104 reads the view data that stores and carries out defect extraction.Then, control part 104 judges the kind of the defect extracted and size etc., when being judged as carrying out the defect of Repair gene, send drive control signal according to defect image data to micro mirror array 2, be irradiated to by the defect on the machined surface 202a of this defect image data representation to make laser.
Then, the control part 104 pairs of LASER Light Sources 101 send the control signal making laser generation, based on the illuminate condition selected in advance according to substrate 202, to vibrate laser L1 from LASER Light Source 101.As the illuminate condition of laser, such as, list wavelength, optical output power, oscillating impulse width etc.
The laser L1 that vibrates is incident to optical fiber 103 by coupled lens 102, through two pieces of projecting lens of lens barrel 3a, and is reflected by speculum 3b.Then, described laser L1 projects on micro mirror array 2, and is reflected by each tiny mirror 2a on micro mirror array 2.
Herein, to for making the laser L2 as light modulated incide projection optical system 106 expeditiously and the condition projecting to machined surface 202a is described.
Owing to being arranged with tiny mirror 2a regularly at micro mirror array 2, so determined by the diffraction phenomena based on tiny mirror 2a as the light intensity distributions of the laser L2 of light modulated.
Such as, as shown in Figure 7 A, as laser L1 relative to the speculum opening surface of micro mirror array 2 with incidence angle time incident, counterclockwise to tilt angle to diagram as relative to datum level M be in the laser L2 of the reverberation of multiple tiny mirror 2a of open mode, not only can produce the Fraunhofer diffraction light 70 determined by the opening of tiny mirror, and the N level that determined by the arrangement pitches of tiny mirror time diffraction light can be produced.The light intensity distributions in the normal reflection direction of laser L2 obtains by carrying out convolution (convolution) to these diffraction lights.
Fraunhofer diffraction light 70 is determined by the opening of tiny mirror 2a, and Fraunhofer diffraction light 70 possesses the light intensity distributions in the normal reflection direction (being vertical direction down in the present embodiment) of tiny mirror 2a with the bell shape of peak value.On the other hand, N level time diffraction light 71 and the diffraction progression determined by the arrangement pitches of tiny mirror 2a and the wavelength of laser L1 are formed as the discrete diffraction pattern that the angle of diffraction is disperseed accordingly.
That is, 0 grade diffraction light d 0normal reflection light as the opening relative to micro mirror array 2 (mirror surface) of laser L1 (is have rotated angle θ relative to vertical direction down clockwise to diagram in the present embodiment 0direction) and to produce, the direction by the arrangement pitches of tiny mirror 2a and the well-determined different angle of diffraction of the wavelength of laser L1 produces N level time diffraction light d n(wherein, N=1,2 ...).
Now, as long as can under the state roughly consistent with the direction of the peak strength of Fraunhofer diffraction light 70 of the direction of diffraction light of a certain progression in N level time diffraction light 71, the laser L2 of the reverberation of the tiny mirror 2a as open mode is made to incide projection optical system 106, the light intensity distributions then obtained by convolution is increased, and thus diffraction efficiency improves.Therefore, it is possible to improve light utilization ratio.
Such as, at 3 grades diffraction light d as Fig. 7 A, in N level time diffraction light 71 3with 4 grades diffraction light d 4tilted angle θ respectively 3and θ 4(wherein, θ 4≤ θ 3) when, by making one of them side's diffraction light consistent with the direction of the peak strength of Fraunhofer diffraction light 70, can diffraction efficiency be improved, realizing good light utilization ratio.
The peak strength direction of Fraunhofer diffraction light 70 is by incidence angle θ 0with the inclination angle of tiny mirror 2a determine, the angle of diffraction of N level time diffraction light 71 is determined by the arrangement pitches of tiny mirror 2a and the wavelength of laser L1, therefore, such as, by obtaining these information from control part 104, making the second rotating mechanism 5 rotate thus make the direction of the diffraction light of certain one-level of N level time time consistent with the direction of the peak strength of Fraunhofer diffraction light 70, the diffraction light of target strength can be obtained.
Within the scope of the opening angle that the direction of the diffraction light of this target strength does not enter into projection optical system 106, utilize the second rotating mechanism 5 that micro mirror array 2 and laser irradiating part 3 are rotated integratedly, thus make the diffraction light of target strength at least enter within the scope of the opening angle of projection optical system 106, if possible, make the diffraction light of this target strength consistent with the optical axis of projection optical system 106.
Such as, first, as shown in dotted line in Fig. 7 B, utilize the first rotating mechanism 4 to change the gradient being in the micro mirror array 2 of open mode, change to and make laser L1 ' relative to datum level M with incidence angle (θ 0+ Δ θ) incident.The diffraction direction of each diffraction light changes according to the change of this incidence angle.Then, utilize the second rotating mechanism 5 that micro mirror array 2 and laser irradiating part 3 are rotated integratedly, can realize thus making the such as secondary diffraction light D with 3 grades 3the direction of the consistent target diffraction light of diffraction direction with the consistent action of the optical axis direction of projection optical system 106.
Preferably, when changing the oscillation wavelength of LASER Light Source 101, carry out such based on the rotation of the first rotating mechanism 4 and the rotation based on the second rotating mechanism according to this wavelength.
Such as, as seen in figure 7 c, the laser L1 when utilizing micro mirror array 2 to make short wavelength " time incident, Fraunhofer diffraction light 70 does not change compared with the situation of Fig. 7 A; but N level time diffraction light 71 is according to the change of wavelength, and the normal reflection direction of the reflecting surface of micro mirror array 2 produces 0 grade diffraction light e 0, and in the diffraction direction that senior the diffraction light from Fig. 7 A is different, produce N level time diffraction light e n(wherein, N=1,2 ...).Therefore, the rotation of the second rotating mechanism 5 is utilized to guide the N level time diffraction light with target strength to projection optical system 106.
The pass black out that the tiny mirror 2a being in closed condition by inclination angle reflects is reflected to outside the scope of the light path being connected in imaging len 106a.The laser L2 as light modulated that the tiny mirror 2a being in open mode by inclination angle reflects is reflected by speculum 105 and is arrived semi-transparent semi-reflecting lens 107 by imaging len 106a and reflected.
Laser L4 after being reflected by semi-transparent semi-reflecting lens 107 advances along vertical direction down, and is imaged on machined surface 202a by object lens 106b.Like this, the image based on the modulation areas of process data is projected on machined surface 202a.Its result is, laser L4 is irradiated to the defect of machined surface 202a, thus removing defect.
Complete a Laser Processing.After this processing, imaging apparatus 112 is utilized again to obtain the image of machined surface 202a, repeatedly carry out above-mentioned Laser Processing as required, as long as there is not removed portion, just again carry out Laser Processing or can move in machining area and carry out the Laser Processing of other parts.
In present embodiment described above, the first rotating mechanism 4 makes micro mirror array 2 rotate, and the second rotating mechanism 5 makes both micro mirror array 2 and laser irradiating part 3 rotate integratedly.Thereby, it is possible to select N level time diffraction light, maximize to make diffraction efficiency.
Therefore, by utilizing the first rotating mechanism 4 to make micro mirror array 2 rotate, can to the incidence angle θ of laser irradiating part 3 relative to micro mirror array 2 0set, reach maximum to make the intensity of the Fraunhofer diffraction light (normal reflection light) determined by the opening of each tiny mirror (mirror surface).Securing this incidence angle θ 0state under, by utilizing the second rotating mechanism 5 to make micro mirror array 2 and laser irradiating part 3 unitary rotation, simply target diffraction light can be guided to projection optical system 106.
Thus, according to the present embodiment, the utilization ratio of laser can easily be improved.
In addition, the change of the light utilization ratio caused by the wavelength change of laser L1 can be suppressed according to the oscillation wavelength of LASER Light Source 101.In addition, even if there is the deviation at the tiny mirror 2a inclination angle in the on-state produced by the manufacture deviation etc. of micro mirror array 2, the incidence angle θ of the laser L1 corresponding with inclination angle can also be carried out to each micro mirror array 2 0adjustment, thus light utilization ratio can be adjusted to good.
In addition, in the present embodiment, the first rotating mechanism 4 makes the laser L1 that irradiated by laser irradiating part 3 relative to the incidence angle θ of micro mirror array 2 by making micro mirror array 2 rotate 0variable, therefore, it is possible to easily and effectively carry out incidence angle θ 0adjustment.
Such as, if utilize angle measurement frame to rotate to make micro mirror array 2 and laser irradiating part 3 respectively, then there is such problem: when setting incidence angle θ 0state under when making one party in micro mirror array 2 or laser irradiating part 3 rotate the angle of diffraction to quasiexpectation, incidence angle θ 0variation, Fraunhofer diffraction light departs from optical axis, thus efficiency can reduce.In order to eliminate this problem, needing repeatedly to adjust micro mirror array 2 or laser irradiating part 3, creating the new problem of spended time in adjustment.
In the present embodiment, because the second rotating mechanism 5 makes micro mirror array 2, laser irradiating part 3 and the first rotating mechanism 4 rotate integratedly, so can secure incidence angle θ 0state under to be set the diffraction light of the expectation in N level time diffraction light simply by once-through operation.
In addition, in the present embodiment, due to intersect using the incident light axis of the object lens 106b side of the datum level M of micro mirror array 2 and projection optical system o'clock as the pivot of the pivot center A of the pivot center A of the first rotating mechanism 4 and the second rotating mechanism 5, so can more easily and effectively carry out incidence angle θ 0with the setting of N level time diffraction light.
In addition, in the present embodiment, because the center of rotation axis A of the first rotating mechanism 4 and center of rotation axis A of the second rotating mechanism 5 is mutually the same, so can more easily and effectively carry out incidence angle θ 0adjustment.
In addition, in the present embodiment, the example utilizing the first rotating mechanism 4 only to make the micro mirror array 2 in micro mirror array 2 and laser irradiating part 3 rotate is illustrated, but by utilizing the first rotating mechanism 4 only to make laser irradiating part 3 rotate, the laser L1 that irradiated by laser irradiating part 3 also can be made relative to the incidence angle θ of micro mirror array 2 0variable.
In addition, in the present embodiment, to utilizing the second rotating mechanism 5 to make the example of laser irradiating part 3 unitary rotation be illustrated, but by only making the speculum 3b in laser irradiating part 3 rotate, laser L1 also can be made relative to the incidence angle θ of micro mirror array 2 0variable.
In addition, in the present embodiment, the example mutually the same to the pivot center A of the first rotating mechanism 4 and pivot center A of the second rotating mechanism 5 is illustrated, as long as but these pivot centers are through irradiating to the optical axis of the laser L1 of micro mirror array 2 and the intersection point of micro mirror array 2, then also can mutually intersect.
In addition, in the present embodiment, be illustrated for the situation that the first rotating mechanism 4 and the second rotating mechanism 5 are structures different from each other, but also suitably can determine the structure of the first rotating mechanism 4 and the second rotating mechanism 5 according to the structure etc. of laser irradiation device 1, such as, make the first rotating mechanism 4 and the second rotating mechanism 5 both sides be the such angle measurement frame etc. of the first rotating mechanism 4.
In addition, in the present embodiment, be illustrated for the situation of the rotation (arrow R2) of the rotation of the first rotating mechanism 4 (arrow R1) and the second rotating mechanism 5 round an axle, but micro mirror array 2 and laser irradiating part 3 also can be made to rotate centered by plural pivot center.
In addition, in the present embodiment, the example being irradiated the laser L1 sent from LASER Light Source 101 by laser irradiating part 3 is illustrated, but laser irradiating part 3 also can be configured to have LASER Light Source.

Claims (5)

1. a laser irradiation device, the laser penetrated from LASER Light Source irradiates to machined object by this laser irradiation device, it is characterized in that,
Described laser irradiation device comprises:
Spatial modulation element, it is configured in the position crossing with the optical axis of projection optical system, this spatial modulation element is by forming being used for making multiple deflecting elements of described laser deflection to line up two-dimensionally, and wherein, described projection optical system is used for machined object described in described laser guide;
Laser irradiating part, its datum level to described spatial modulation element irradiates the described laser penetrated from described LASER Light Source;
First rotating mechanism, it makes any one party in described spatial modulation element and described laser irradiating part rotate, and center of rotation is the first turning cylinder, this first turning cylinder is by the optical axis of the described projection optical system intersection point crossing with the datum level of described spatial modulation element; And
Second rotating mechanism, it makes the plate being provided with described spatial modulation element and described both laser irradiating parts integratedly rotate integratedly, and center of rotation is the second turning cylinder, this second turning cylinder is by the optical axis of the described projection optical system intersection point crossing with the datum level of described spatial modulation element
By described first rotating mechanism, any one party in described spatial modulation element and described laser irradiating part is rotated, regulate angle of inclination thus, light intensity distributions that determined by the opening of each described deflecting element, reverberation is made to be the opening that maximum Fraunhofer diffraction light enters into described projection optical system, in this condition, by described second rotating mechanism, described plate is rotated, described spatial modulation element and described both laser irradiating parts are rotated integratedly, makes the N level time diffraction light expected enter into the opening of described projection optical system.
2. laser irradiation device according to claim 1, is characterized in that,
Described first rotating mechanism rotates by making any one party in described spatial modulation element and described laser irradiating part, changes the described laser that irradiated by the described laser irradiating part incidence angle relative to described spatial modulation element.
3. laser irradiation device according to claim 1 and 2, is characterized in that,
Under being fixed on being made any one party in described spatial modulation element and described laser irradiating part rotate by described first rotating mechanism the state that described Fraunhofer diffraction light is the incidence angle of maximum intensity, described second rotating mechanism makes described plate rotate, and makes described spatial modulation element and described both laser irradiating parts rotate integratedly thus.
4. laser irradiation device according to claim 1 and 2, is characterized in that,
Described first turning cylinder is identical with described second turning cylinder.
5. laser irradiation device according to claim 1, is characterized in that,
Described second rotating mechanism has 2 mutually opposing swinging mounting portions, and the swing part supported by described swinging mounting portion,
Described swing part is U-shaped, has the lower panel as described plate, and the supporting both sides of described lower panel 2 side panel supported by described swinging mounting portion in the mode that can swing.
CN201010177951.8A 2009-05-26 2010-05-20 Laser irradiation apparatus Expired - Fee Related CN101898276B (en)

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