CN101354481B - Laser irradiation apparatus and laser processing system using the same - Google Patents

Laser irradiation apparatus and laser processing system using the same Download PDF

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Publication number
CN101354481B
CN101354481B CN2008101340880A CN200810134088A CN101354481B CN 101354481 B CN101354481 B CN 101354481B CN 2008101340880 A CN2008101340880 A CN 2008101340880A CN 200810134088 A CN200810134088 A CN 200810134088A CN 101354481 B CN101354481 B CN 101354481B
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China
Prior art keywords
laser
deflection
catoptron
irradiation device
spatial modulation
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CN2008101340880A
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Chinese (zh)
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CN101354481A (en
Inventor
有贺润子
中村达哉
高桥浩一
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Olympus Corp
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Olympus Corp
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0869—Devices involving movement of the laser head in at least one axial direction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Mechanical Light Control Or Optical Switches (AREA)

Abstract

The invention relates to a laser irradiating device and a laser processing system using the same. The laser processing system comprises a laser source; a reflecting mirror for causing the laser emitted from the laser source to deflect by a deflection surface supported movably; a reflector moving mechanism for configuring the deflection surface to deflect correspondingly to an optical axis P1 of the laser and move in the optical axis P1 direction; a space modulating element for modulating the laser deflected by the reflector in space and forming opening light towards the irradiated surface; and a projection optical system for projecting the opening light formed by the space modulating element to the processed surface.

Description

Laser irradiation device and use its laser-processing system
Technical field
The present invention relates to laser irradiation device and use the laser-processing system of this laser irradiation device.
Background technology
In the past, known laser processing device (laser irradiation device) through processing to the desired area illumination laser of machined object.For example, when making LCD etc., the device of the defective part such as unwanted residue that exist on the photomask that uses during as the wiring pattern on the finishing glass substrate, exposure, known have a laser reconditioning device.
For example, the laser processing device of record has: lasing light emitter in patent documentation 1 (japanese kokai publication hei 8-174242 communique); Carry the machine table of putting machined object; With tiny mirror array (Micromirror Arrays, microreflection lens array), switch the angle of a plurality of reflecting optics of tiny mirror array through On/Off (ON/OFF) control, on machined object, form pattern form arbitrarily.
But; As record in the patent documentation 2 (TOHKEMY 2006-350123 communique); In this laser processing device; Problem below existing: promptly when at fixed laser with respect to the state of the incident angle of tiny mirror array down during the change wavelength, the phenomenon of generation reduction laser utilization efficiency.
That is, in the laser processing device that uses the microreflection lens array, with the picture of microreflection lens array through the microscope reduced projection on machined object.The microreflection lens array is the structure of arranging small mirrors with equal intervals, so laser light reflected is divided into a plurality of diffraction lights from here.But general microscopical rear side numerical aperture is smaller, is divided into the whole incidents of a plurality of diffraction lights so can not make.
For example, Fig. 8 is the 2nd higher hamonic wave (wavelength X that can switch the YAG laser instrument 2=532nm) with the 3rd higher hamonic wave (wavelength X 3The angle distribution example of the diffraction light in=354.7nm) the laser processing device.That is the microscopical optical axis 502 that, will be plotted in incident in the angle distribution (α, β) of the diffraction light that reflects on the microreflection lens array is on the angle plane 501 at center.
In wavelength X 3The time, as figure in * mark shown in, near optical axis 502, have an order of diffraction (order of diffraction) 504.The small mirrors that is equivalent to the irradiation area of laser tilts so that to the direction reflector laser of optical axis 502, so become unique diffraction light that has than hard intensity near the order of diffraction 504 of optical axis 502.This order of diffraction 504 in the scope of microscopical rear side angular aperture 503, so can high strength ground to the machined object irradiating laser.
On the other hand, wavelength is being switched to λ 2The time, shown in the circle mark among the figure, near optical axis 502, there is not the order of diffraction, there are 4 orders of diffraction 505 in the position that separates equal angular.Therefore, the intensity of laser is scattered in these a plurality of orders of diffraction 505, and can not go into to inject microscopical rear side angular aperture 503.Though can make an order of diffraction incident through changing microscopical relatively incident angle, both just so can not improve laser utilization efficiency.
In the laser processing device (laser irradiation device) of patent documentation 2 records,, make the optical axis of light modulated projection optical system roughly consistent with the roughly the same direction of the diffraction light of a plurality of wavelength light generations to this problem.Specifically; According to a plurality of wavelength of laser and the arrangement pitches of minitype reflector; The pitch angle of adjustment microreflection lens array; Set thus normal reflection reflection of light direction make its become with each diffraction light identical direction, make the optical axis of light modulated projection optical system consistent with this reflection direction.
But, in above-mentioned laser irradiation device in the past, have following problem.
In the technology of patent documentation 2 records, because the pitch angle of adjustment minitype reflector, so because a plurality of wavelength light, and can not use microreflection lens array with versatility, existence needs to use the problem of high price microreflection lens array.
Summary of the invention
The present invention is exactly in view of the above problems and proposes, and its purpose is, a kind of laser irradiation device is provided and uses its laser-processing system, even the tilt angle varied of Wavelength of Laser and tiny mirror array also can obtain good light utilization ratio.
In order to address the above problem, laser irradiation device of the present invention constitutes to have: LASER Light Source; Optical path-deflecting portion, it makes the laser that penetrates from this LASER Light Source carry out deflection by the deflection plane of by movable supporting; Deflection plane travel mechanism, its deflection plane with this optical path-deflecting portion is configured as and makes it can be with respect to the optical axis deflection of said laser, and can on said optical axis direction, move; The spatial modulation element, it has carrying out spatial modulation by the laser after the deflection of said optical path-deflecting portion, and forms a plurality of tiny mirror towards the unlatching light of plane of illumination; And projection optical system, its unlatching optical projection that will be formed by this spatial modulation element is on said plane of illumination.
According to the present invention, the deflection plane that can change optical path-deflecting portion through deflection plane travel mechanism is with respect to the degree of tilt of laser beam axis, position on optical axis direction.Therefore, for penetrating from LASER Light Source and, can changing its incident angle and incoming position with respect to the spatial modulation element by the laser after the deflection plane deflection.Its result; For example under the situation of the wavelength that has switched LASER Light Source and the spatial modulation component variation make and can set incident angle, the incoming position that is fit to various situation according to these wavelength and pitch angle under the situation of tilt angle varied of tiny mirror of opening.
Laser-processing system of the present invention constitutes to be had: laser irradiation device of the present invention; Image pickup optical system, the said projection optical system arranged coaxial of itself and said laser irradiation device is so that be configured the shooting of the machined object on the plane of illumination of said laser irradiation device; Image pickup part, it is configured in the image position of this image pickup optical system; Image processing part; It carries out Flame Image Process to the image of being taken by this image pickup part; And extract the defective of said machined object, with the shape of the defective of extracting by this image processing part accordingly, this laser-processing system is modulated driving to the said spatial modulation element of said laser irradiation device; Laser after said machined object shines said spatial modulation carries out the processing of said machined object.
According to the present invention, owing to use laser irradiation device of the present invention, so have the action effect identical with laser irradiation device of the present invention.
According to laser irradiation device of the present invention and the laser-processing system of using it; Can change incident angle and the incoming position of laser through deflection plane travel mechanism with respect to spatial modulation element and tiny mirror; So when the tilt angle varied of Wavelength of Laser and tiny mirror array, also can obtain good light utilization ratio.
Description of drawings
Fig. 1 is the laser irradiation device of expression embodiment of the present invention and diagrammatic cross-section brief configuration, that comprise optical axis of the laser-processing system of using it.
Fig. 2 A, 2B, 2C are the constructed profiles of diffraction phenomena of spatial modulation element of the laser irradiation device of explanation embodiment of the present invention.
Fig. 3 is the functional-block diagram of brief configuration of control device of the laser-processing system of expression embodiment of the present invention.
Fig. 4 is the synoptic diagram of effect of deflection plane travel mechanism of the laser irradiation device of explanation embodiment of the present invention.
Fig. 5 is the synoptic diagram of structure of deflection plane travel mechanism of laser irradiation device of the 1st variation of expression embodiment of the present invention.
Fig. 6 is the schematic perspective view of structure of optical path-deflecting portion and deflection plane travel mechanism of laser irradiation device of the 2nd variation of expression embodiment of the present invention.
Fig. 7 is the synoptic diagram of structure of optical path-deflecting portion and deflection plane travel mechanism of laser irradiation device of the 3rd variation of expression embodiment of the present invention.
Fig. 8 is the angle distribution figure of angle distribution one example that is used to explain the diffraction light of laser processing device that can wavelength switching.
Embodiment
Below, with reference to description of drawings embodiment of the present invention.In institute's drawings attached,,, and omit identical explanation also to identical or suitable parts mark same numeral even embodiment is different.
[the 1st embodiment]
Laser irradiation device to the 1st embodiment of the present invention describes with the laser-processing system of using it.
Fig. 1 is the laser irradiation device of expression embodiment of the present invention and diagrammatic cross-section brief configuration, that comprise optical axis of the laser-processing system of using it.Fig. 2 A, 2B, 2C are the constructed profiles of diffraction phenomena of spatial modulation element of the laser irradiation device of explanation embodiment of the present invention.Fig. 3 is the functional-block diagram of brief configuration of control device of the laser-processing system of expression embodiment of the present invention.
Direction for ease of reference; XYZ coordinate among the figure ties up to and is set to identical position relation in each accompanying drawing; Vertical direction is expressed as the Z axle; Surface level is expressed as the XY plane, from Y axle negative direction towards the direction of the Y axle positive dirction direction consistent (this is also identical for other later accompanying drawings) during with top view.
The line of expression light beam is used to illustrate to draw the situation to certain some irradiating laser of sample among the figure.
The laser-processing system 100 of this embodiment is to the machined object irradiating laser and repairs the device of processing.For example; In the glass substrate of LCD (LCD) and semiconductor wafer substrate etc., be formed with on the substrate on the machined object of circuit pattern etc. through photolithographic processing steps; Detect under the situation of defective part such as overflowing of short circuit, photoresist of wiring portion for example, can be applicable to the finishing processing of removing defective part etc. to the laser-processing system 100 of this embodiment.
The brief configuration of laser-processing system 100 is as shown in Figure 1, comprises LASER Light Source 50, processing head 20, processing head travel mechanism 31, carries and put platform 21, control device 22, display part 30 and user interface 32.Put on the platform 21 adding to be carried by level man-hour to put carrying as the substrate 11 of machined object, and make machined surface 11a (plane of illumination), put the below that platform 21 is arranged on processing head 20 this year towards upside (Z axle positive dirction side).
LASER Light Source 50 is light sources of finishing processing usefulness.In this embodiment,, adopt the structure of forming by laser oscillator 1, coupled lens 2, optical fiber 3 and projecting lens 4 as the structure of LASER Light Source.Wherein, the projecting lens 4 of this embodiment is configured in the inside of processing head 20.
Laser oscillator 1 is used for excitation wavelength, exports the laser of having set, so that remove the defective on the substrate 11.For example, can adopt can impulse hunting YAG laser instrument etc. as laser oscillator 1.Laser oscillator 1 constitutes according to the finishing object and switches a plurality of oscillation wavelengths.
Laser oscillator 1 is electrically connected with control device 22, according to its vibration of control signal control from control device 22.
Coupled lens 2 is to make the laser that penetrates from laser oscillator 1 optical element in optical fiber 3 optically-coupled.
Optical fiber 3 is used for portion's transmission within it and is optically coupled in the laser on the fiber end face 3a through coupled lens 2, it is imported in the processing head 20, and it is penetrated from fiber end face 3b as laser 60.Laser 60 is penetrated after the internal transmission of optical fiber 3, so when the laser of laser oscillator 1 is Gaussian distribution, also can form the uniform diffusion light of light quantity distribution.
Projecting lens 4 is lens or the lens combination that have been set the projection multiplying power, is used for making the picture of fiber end face 3b can shine the modulation areas of the spatial modulation element 6 of narration at the back.Projecting lens 4 is fixed on the framework 20a of processing head 20.In this embodiment, as the optical axis P of an example explanation projecting lens 4 1Be configured to the example with Z axle almost parallel, but allocation position is not limited thereto.
Fig. 1 is a synoptic diagram, so in projection optical system, only drawn the light beam on the axle.Laser oscillator 1 is along the configuration of Z direction, but the allocation position of laser oscillator 1 and state are not limited thereto, and also can set through suitable arrangement optical fiber 3 becomes suitable allocation position and state.And, can also assemble the mode scrambler (Mode Scrambler) of the mode that is used for stable fiber.
The uniforming device of laser also can use other optical elements to replace this optical fiber 3.For example, can use fly's-eye lens (fly-eye lens), diffraction element, non-spherical lens and adopted the homogenizer etc. of the various structures such as parts of kaleidoscope formula bar (カ レ イ De type ロ Star De).
Processing head 20 constitutes and in framework 20a, is keeping catoptron 33 (optical path-deflecting portion), catoptron travel mechanism 34 (deflection plane travel mechanism), spatial modulation element 6, projection optical system 8, observes with light source 16, the observation structure with the optical element of imaging len 12, imaging apparatus 13 etc., device etc.; Wherein, this framework 20a remains and can put platform 21 and relatively move with respect to carrying along the XYZ direction of principal axis through the processing head travel mechanism 31 with suitable driver element.
In this embodiment; The relevant example that relatively moves is described; That is, processing head 20 is moved in the X-direction parallel with machined surface 11a with the direction (Z-direction) of machined surface 11a quadrature, put platform 21 substrate 11 is moved in Y direction through carrying through processing head travel mechanism 31.But relatively moving is not limited thereto, and for example also can adopt processing head 20 to move in Z-direction, carry and to put platform 21 and move in the XY direction, or carry put that platform 21 is fixed, the relatively moving of appropriate combination that processing head 20 moves etc. at the XYZ direction of principal axis.
Processing head travel mechanism 31 for example is fit to adopt ball-screw, linear motor etc.And, in the moving of small quantities such as focusing, also can make up uses such as piezoelectric element.
Catoptron 33 makes from the optical axis P of the laser 60 of projecting lens 4 ejaculations of LASER Light Source 50 1The face 33a of being deflected is reflected into the optical axis P towards spatial modulation element 6 2, laser 61 is deflected to along optical axis P 2Advance.The catoptron 33 mirror travel mechanism 34 that is reflected is movably supporting.
Catoptron travel mechanism 34 comprises makes catoptron 33 relative optical axis P 1The catoptron deflection 34a of portion of deflection and make catoptron 33 along optical axis P 1The parallel moving part 34b of the parallel catoptron that moves of direction.The parallel moving part 34b of catoptron deflection 34a of portion and catoptron is electrically connected with control device 22 respectively, can be according to direction, angle excursion and the parallel amount of movement of controlling the deflection of catoptron 33 from the control signal of control device 22.
Thus, can change optical axis P 2Direction and optical axis P 2Position on spatial modulation element 6.
Spatial modulation element 6 is used for the laser 61 that is deflected at deflection plane 33a is carried out spatial modulation, is made up of the DMD (Digital Micromirror Device, DMD) as the tiny mirror array.Promptly; Shown in Fig. 2 A; It is that the center can be with respect to a plurality of tiny mirror 6a of reference field M angle of inclination ± φ that spatial modulation element 6 makes with rotation axis R, and the direction of for example in both sides are the rectangular-shaped modulation areas of W * H, extending each limit is as orientation and two-dimensional arrangements.
The size of the angle of inclination φ of tiny mirror 6a is different and different according to device architecture etc., for example can from about 10 °～about 16 ° angular range, select.Reference field M can be configured to suitable towards, but in this embodiment,, the situation of tiny mirror 6a towards Z-direction negative direction side and the configuration of XY plane parallel that make is described as an example.
Each tiny mirror 6a of spatial modulation element 6 is by the static electric field that produces according to the control signal from control device 22; Under opening; For example, following in off position from reference field M rotation+φ (diagram is counterclockwise), from reference field M rotation-φ (diagram CW).Below, the light that reflects the tiny mirror 6a by opening calls unlatching light, and the light that reflects the tiny mirror 6a by closed condition calls the pass black out.In this embodiment, open the optical axis P of light 62 (with reference to Fig. 1) 3Be configured to for the Z-direction almost parallel.
The position of each tiny mirror 6a can utilize length to be expressed as (m, n) for the capable sequence number n (m, n are the integer more than 0) on the limit of H, and can be scaled the position coordinates on the reference field M according to the arrangement pitches of tiny mirror 6a for row sequence number m, the length on the limit of W.
Projection optical system 8 is the optical elements sets that constitute imaging optical system; This imaging optical system images in multiplying power β on the machined surface 11a of substrate 11 based on the picture that carries out through spatial modulation element 6 after the spatial modulation towards the unlatching light 62 of certain orientation reflection.Spatial modulation element 6 sides in projection optical system 8 dispose imaging len 8A, dispose object lens 8B in substrate 11 sides.
In this embodiment, a plurality of object lens 8B that multiplying power is different are being kept by converter mechanism and can switch.Therefore, through making the rotation of converter mechanism and switching object lens 8B, can change the multiplying power β of projection optical system 8.Below short of special instruction, object lens 8B refers to be selected the lens that are used for constituting projection optical system 8.
In this embodiment, the optical axis P of imaging len 8A 4With the X-direction configured in parallel, the optical axis P of object lens 8B 5With the Z-direction configured in parallel.
Therefore, between spatial modulation element 6 and imaging len 8A, be provided with catoptron 7, this catoptron 7 is used for reflection and opens light 62 and make it along optical axis P 4Incident.And, between imaging len 8A and object lens 8B, being provided with semi-transparent semi-reflecting lens 9, this semi-transparent semi-reflecting lens 9 is used for the light of reflecting & transmitting imaging len 8A and makes it along optical axis P 5Incident.
The projection multiplying power β of projection optical system 8 can suitably set according to the necessary machining precision on the machined surface 11a.For example, the image of the W of whole modulation areas * H size is the multiplying power of W ' * H ' on machined surface 11a.
In addition, the numerical aperture of imaging len 8A (NA) is made as the size that makes as the not incident of light of closing black out 63 reflections.
But observing with light source 16 is to produce the light source of the observation of the machining area inside on the machined surface 11a that is used to throw light on light 80, is set at the side of the light path between semi-transparent semi-reflecting lens 9 and the object lens 8B.
On the light path between semi-transparent semi-reflecting lens 9 and the object lens 8B, be provided with semi-transparent semi-reflecting lens 14 with observation with light source 16 position in opposite directions, this semi-transparent semi-reflecting lens 14 is used to make unlatching light 62 transmissions in semi-transparent semi-reflecting lens 9 reflections, and observation is reflected towards object lens 8B with light 80.And, between observation use light source 16 and semi-transparent semi-reflecting lens 14, be provided with the convergent lens of assembling to the illuminating bundle of suitable diameter with light 80 observing 15.
As observing, for example can adopt the suitable light sources such as xenon lamp and LED of generation visible light with light source 16.
Observe the upper side that is configured in semi-transparent semi-reflecting lens 9 with imaging len 12 (image pickup optical system), and with the optical axis P of object lens 8B 5Coaxial.Observing with imaging len 12 is to be used to make from being observed with the machined surface 11a reflection of light 80 illuminations and the optical element of photoimaging on the shooting face of imaging apparatus 13 (image pickup part) of assembling through object lens 8B.
Imaging apparatus 13 is used for the image that on shooting face, forms images is carried out opto-electronic conversion, for example utilizes formations such as CCD.Picture signal after the opto-electronic conversion is sent out the control device 22 that is electrically connected to imaging apparatus 13 through imaging apparatus 13.
Control device 22 is used to control the action of laser-processing system 100, and is as shown in Figure 3, is taken into portion 40, data store 43, spatial modulation element drives portion 41, apparatus control portion 42, travel mechanism's control part 35 and image processing part 44 by image and constitutes.
The apparatus structure of control device 22 is constituting by computing machine that utilizes CPU, storer, input and output portion and external memory etc. to constitute and suitable hardware in this embodiment.Data store 43 uses the storer of this computing machine and external memory to realize.Other structures realize through the program of being carried out corresponding each control function, processing capacity generation by CPU.
Image is taken into portion 40 and is used to be taken into the picture signal of obtaining through imaging apparatus 13, and obtains the two dimensional image of machined surface 11a.The two dimensional image that is taken into is sent out to the display part 30 that is made up of monitor etc. and shows, and sends to the data store 43 that is made up of video memory as view data 150 and store.
Spatial modulation element drives portion 41 controls the On/Off state of each tiny mirror 6a of spatial modulation element 6 according to the process data that is generated by image processing part 44.
Apparatus control portion 42 for example basis is controlled the action of laser-processing system 100 from the operation input of the user interface 32 of the suitable operation input block with guidance panel, keyboard, mouse etc.Apparatus control portion 42 and image be taken into portion 40, spatial modulation element drives portion 41, processing head travel mechanism 31, laser oscillator 1, observe and is electrically connected with light source 16, travel mechanism's control part 35, can control the action of each several part and the timing of moving.
Travel mechanism's control part 35 is controlled the catoptron deflection 34a of portion of catoptron travel mechanism 34, the action of the parallel moving part 34b of catoptron according to from the operation input of user interface 32 and the control signal of apparatus control portion 42.
Image processing part 44 is used for accessing the view data 150 that is stored in data store 43 and implements appropriate image processing, in this embodiment, has defective extraction portion 45 and process data generation portion 46.
45 pairs of view data of defective extraction portion 150 are carried out defective and are extracted processing, send to process data generation portion 46 to machining shape information as defect image data 151.
This defective is extracted to handle and also can be adopted known any defect extraction algorithms.For example, can calculate brightness poor of the view data obtained and the pictorial image data of the normal machined surface 11a of storage in advance, from the extracting data defective of utilizing certain threshold value that this difference data binaryzation is obtained.
Process data generation portion 46 and the machining shape information of sending from defective extraction portion 45 are accordingly; Generate the process data 152 (modulating data) of the On/Off (ON/OFF) of each tiny mirror 6a that controls spatial modulation element 6, so that can open light 62 to machined surface 11a irradiation.
In the laser-processing system 100 of above explanation; LASER Light Source 50, catoptron 33, catoptron travel mechanism 34, spatial modulation element 6, projection optical system 8 and the control device except that image processing part 44 22 constitute to machined surface 11a and go up the laser irradiation device 200 of irradiation through the laser after spatial modulation element 6 spatial modulation.This laser irradiation device 200 also can be used as the device that is independent of outside the laser-processing system 100.During this situation, can be as accepting and corresponding view data of machining shape and the laser processing device that carries out Laser Processing, perhaps as the image projection device that for example adopts laser of other purposes etc.
Below, the action of laser-processing system 100 is described.
Fig. 4 is the synoptic diagram of effect of deflection plane travel mechanism of the laser irradiation device of explanation embodiment of the present invention.
In laser-processing system 100, as shown in Figure 1 in order to carry out Laser Processing, at first put platform 21 and upload the substrate of putting as machined object 11 carrying.
Then, processing head 20 is moved, be set at initial Working position, but obtain the image of the machining area of machined surface 11a through processing head travel mechanism 31.That is, make and observe, it is produced observe with light 80 with light source 16 bright lamps.Observe with light 80 through semi-transparent semi-reflecting lens 14 antireflection parts, but this reflected light throws light on to the machining area of machined surface 11a in object lens 8B convergence.
Reflected light in machined surface 11a reflection is assembled on object lens 8B, and semi-transparent semi-reflecting mirror 14 is crossed in a part of transmission.And the light that should see through the part of semi-transparent semi-reflecting lens 14 passes through semi-transparent semi-reflecting lens 9 a transmissions part again, and is directed into observation with imaging len 12.Incident is observed photoimaging with imaging len 12 on the shooting face of imaging apparatus 13.
The image of 13 couples of machined surface 11a that formed images of imaging apparatus carries out opto-electronic conversion, and sends to image and be taken into portion 40.
Be taken in the portion 40 at image, as required the picture signal of being sent implemented to remove processing such as noise, gamma correction, be presented at then on the display part 30.And,, convert suitable picture signal regularly into view data 150 and be stored in the data store 43 according to the control signal of apparatus control portion 42.Like this, but obtain the image of the machining area of machined surface 11a.
Then, in image processing part 44, the view data 150 that defective extraction portion 45 is read be stored in the data store 43 is carried out defective and is extracted.And, judge the type and size of the defective of being extracted etc., be in the time of repairing the defective of processing being judged to be, send to process data generation portion 46 as defect image data 151.
But the modulation areas of the machining area of machined surface 11a and spatial modulation element 6 becomes conjugate relation through projection optical system 8; Because the projection multiplying power of projection optical system 8 is β; But so, make it corresponding with the position on the modulation areas of spatial modulation element 6 through being made as 1/ β to the position coordinates on the machining area doubly.
Like this; In process data generation portion 46; Generate process data 152 according to defect image data 151; Open the tiny mirror 6a of light 62 so that confirm to be controlled to be each position irradiation opening, that be used on the machined surface 11a that utilizes 151 expressions of defect image data, and drive spatial modulation element 6 and make these tiny mirror 6a be in opening, make other tiny mirror 6a be in closed condition.For example, the position (m, n) of corresponding each tiny mirror 6a, generate with opening be 1, closed condition is the process data 152 of the corresponding conduct table data of 0 numerical value.
The process data 152 that is generated sends to spatial modulation element drives portion 41.
Spatial modulation element drives portion 41 controls the pitch angle of each tiny mirror 6a of spatial modulation element 6 according to the control signal of apparatus control portion 42 and the process data 152 that is sent.
Then, apparatus control portion 42 is sent the control signal that makes laser pumping to laser oscillator 1, and the illuminate condition according to selecting in advance corresponding to substrate 11 makes from laser oscillator 1 exciting laser.As the illuminate condition of laser, for example can enumerate wavelength, light output, oscillating impulse width etc.
The laser that is encouraged is optically coupled in through coupled lens 2 on the fiber end face 3a of optical fiber 3, and penetrating the roughly uniform diverging light of light intensity distributions from fiber end face 3b is laser 60.
Laser 60 passes through projecting lens 4 along optical axis P 1Advance and in the deflection plane 33a of catoptron 33 reflection.And, as laser 61 along optical axis P 2The also projection of advancing is reflected through each tiny mirror 6a on the spatial modulation element 6 on spatial modulation element 6.
At this, about the relative optical axis P of deflection plane 33a 1Degree of tilt (being designated hereinafter simply as the degree of tilt of deflection plane 33a) and optical axis P 1The position of direction (being designated hereinafter simply as the optical axis direction position of deflection plane 33a); Reflected light at catoptron 33 is the tiny mirror 6a reflex time of laser 61 through the opening of spatial modulation element 6, drives catoptron travel mechanism 34 and makes that laser 61 can effectively incident projection optical system 8.
The degree of tilt of this deflection plane 33a and optical axis direction position, the wavelength information of the laser oscillator of collecting according to the operation of user interface 32 input with through apparatus control portion 42 1 etc., the travel mechanism's control part 35 through control device 22 calculates.
Be set as the pass black out 63 of the tiny mirror 6a reflection of closed condition through the pitch angle, outside the numerical aperture scope of imaging len 8A, reflect.
Be set as the unlatching light 62 of the tiny mirror 6a reflection of opening through the pitch angle, along optical axis P 3Advance and in catoptron 7 reflection, then along optical axis P 4Advance and incide imaging len 8A and assemble, arrive semi-transparent semi-reflecting lens 9 then and in semi-transparent semi-reflecting lens 9 reflections.
At the unlatching light 62 of semi-transparent semi-reflecting lens 9 reflection along optical axis P 5Advance, and image on the machined surface 11a through object lens 8B.
Like this, based on the image projection of the modulation areas of the unlatching light 62 of process data 152 on machined surface 11a.Its result, the defective of opening light 62 irradiation machined surface 11a, defective is removed.
More than finish a Laser Processing.
After this processing, obtain the image of machined surface 11a once more through imaging apparatus 13, repeat above-mentioned processing as required, if there is not removal portion, then carry out Laser Processing once more, carry out the Laser Processing of other parts but perhaps move machining area.
Below, in this embodiment, explain to be used to make the degree of tilt condition of opening light 62 effective incident projection optical systems 8 and the deflection plane 33a of projection on machined surface 11a.
In spatial modulation element 6, tiny mirror 6a arranges regularly, is confirmed by the diffraction phenomena that tiny mirror 6a causes so open the light intensity distributions of light 62.
For example shown in Fig. 2 A, when laser 61 with incident angle θ 0When=2 φ incide the reference field M of spatial modulation element 6, promptly open in the light 62 to the reflected light of a plurality of tiny mirror 6a of the opening of diagram counter clockwise direction angle of inclination φ, produce Fraunhofer diffraction 70 and diffraction 71 at relative datum face M.The light intensity distributions of opening light 62 obtains through making these diffraction lights carry out convolution algorithm.
Fraunhofer diffraction 70 confirms according to the aperture of tiny mirror 6a, possesses in the normal reflection direction (being Z axle negative direction in this example) of tiny mirror 6a and has the bell light intensity distributions of hanging of peak value.
On the other hand, diffraction 71 is the definite Discrete Distribution of wavelength by arrangement pitches and the laser 61 of tiny mirror 6a.That is 0 order diffraction light d, 0Result from the normal reflection light of reference field M of relative laser 61 (in this example for relative Z axle negative direction along diagram CW anglec of rotation θ 0Direction), on direction, produce N order diffraction light d by the well-determined different diffraction angle of wavelength of the arrangement pitches of tiny mirror 6a and laser 61 N(wherein, N=1,2 ...).
At this moment, if can be under the roughly consistent state of arbitrary grade the diffraction direction of light of diffraction 71 and the direction of the peak strength of Fraunhofer diffraction 70 incident projection optical system 8 because the light intensity distributions after the convolutional calculation increases, so diffraction efficiency improves.Therefore, can improve the light utilization ratio.
For example, under situation shown in Fig. 2 A, the direction of the peak strength of Fraunhofer diffraction 70 is consistent with the optical axis direction of projection optical system 8, at 3 order diffraction light d of diffraction 71 3, 4 order diffraction light d 4The difference tilt angle theta 3, θ 4(wherein, θ 4≤θ 3) situation under, be contained in the aperture angle scope of projection optical system 8 through making arbitrary at least diffraction light, can improve diffraction efficiency, realize good light utilization ratio.
The peak strength direction of Fraunhofer diffraction 70 is according to incident angle θ 0Confirm with the inclination angle phi of tiny mirror 6a; The angle of diffraction of diffraction 71 is confirmed according to the arrangement pitches of tiny mirror 6a and the wavelength of laser 61; So through obtaining these information from apparatus control portion 42, travel mechanism's control part 35 can judge whether direction and arbitrary diffraction direction of light of the peak strength of Fraunhofer diffraction 70 get in the aperture angle scope of projection optical system 8.
When which diffraction direction of light does not get in the aperture angle scope of projection optical system 8 yet; Travel mechanism's control part 35 makes deflection plane 33a deflection; Direction and arbitrary diffraction direction of light of the peak strength of Fraunhofer diffraction 70 are got in the aperture angle scope of projection optical system 8 at least; If possible, then make its optical axis consistent with projection optical system 8.
For example shown in the dotted line among Fig. 2 B, the degree of tilt that changes deflection plane 33a through catoptron travel mechanism 34 changes, and makes laser 61A with incident angle (θ 0+ Δ θ) incident reference field M.According to the variation of this incident angle, the diffraction direction of each diffraction light changes.Therefore, through suitable setting Δ θ, for example can realize making 4 order diffraction light D 4The diffraction direction action consistent with the optical axis direction of projection optical system 8.
At this moment, because relatively the normal reflection direction of tiny mirror 6a is also changing,, therefore in fact set the value that makes each diffraction direction all get into the Δ θ in the aperture angle scope of projection optical system 8 so the peak strength direction of Fraunhofer diffraction 70 changes.
This deflection plane 33a moves, and preferably when the oscillation wavelength of change laser oscillator 1, carries out according to its wavelength.
For example shown in Fig. 2 C, when the laser 61B through spatial modulation element 6 incident short wavelengths, Fraunhofer diffraction 70 is identical with situation shown in Fig. 2 A, but diffraction 71 is according to wavelength change, produces 0 order diffraction light e in the normal reflection direction of reference field M 0, produce N order diffraction light e in the diffraction direction different with the high progression diffraction light of Fig. 2 A N(wherein, N=1,2 ...).So, having diffraction light near the diffraction direction of the optical axis direction of projection optical system 8, the optical axis that for example becomes with projection optical system 8 forms angle theta 66 order diffraction light e 6, the light utilization ratio is different with Fig. 2 A.
Therefore, through with this angle theta 6 Move deflection plane 33a accordingly,, also can obtain good diffraction efficiency even during the change of the oscillation wavelength of laser oscillator 1.
About the angle initialization of the degree of tilt of deflection plane 33a, enumerate numerical example and describe.
Table 1 expression numerical example 1.Numerical example 1 is that the arrangement pitches at tiny mirror 6a is the inclination angle phi of the opening of 19.05 μ m, tiny mirror 6a when being φ=15.3deg, the setting example when being made as 266nm, 355nm, 532nm to the wavelength of laser 61.At this, each wavelength is corresponding to second higher hamonic wave, the 3rd higher hamonic wave and the 4th higher hamonic wave of YAG laser instrument.
Table 1 representes relative angle of diffraction each wavelength, 1 diffraction light (deg) respectively, near the optical axis P of projection optical system 8 3The incident angle θ of reference field M of the order of diffraction, space modulator element 6 of diffraction light 0Setting value, according to the diffraction efficiency (%) of the convolutional calculation of the intensity distributions of Fraunhofer diffraction and diffraction light, the optical axis P of projection optical system 8 relatively 3Angle (deg).
Table 1
Can know according to table 1, through being made as 30.8deg, 30.9deg, 30.7deg to the incident angle of space modulator element 6 respectively, thereby can be made as diffraction efficiency more than 57% according to each wavelength.At this moment, near optical axis P 3The order of diffraction of diffraction light be respectively 26,19,13, optical axis P relatively 3Angle be 0.08deg, 0.70deg, 0.17deg; So, the diffraction light of each wavelength is incided in the aperture angle scope of projection optical system 8 through being made as the numerical aperture of projection optical system 8 more than 0.012 accordingly with maximal value 0.7deg.
Below, table 2 expression numerical example 2.The arrangement pitches of numerical example 2 expression tiny mirror 6a is the inclination angle phi of the opening of 24 μ m, tiny mirror 6a when being φ=14.0deg, the setting example when being made as 330nm, 440nm, 660nm to the wavelength of laser 61.At this, each wavelength is corresponding to second higher hamonic wave, the 3rd higher hamonic wave and the 4th higher hamonic wave of Nd:YAG laser instrument.
In table 2, represent angle of diffraction (deg), the order of diffraction, the incident angle θ identical respectively with table 1 0Setting value, diffraction efficiency (%) and optical axis P relatively 3Angle (deg).
Table 2
Figure S2008101340880D00151
Can know according to table 2,, can be made as diffraction efficiency more than 83% through being made as 28.0deg, 27.9deg, 27.8deg to the incident angle of space modulator element 6 respectively according to each wavelength.At this moment, near optical axis P 3The order of diffraction of diffraction light be respectively 24,18,12, optical axis P relatively 3Angle be 0.15deg, 0.07deg, 0.017deg; So, the diffraction light of each wavelength is incided in the aperture angle scope of projection optical system 8 through being made as the numerical aperture of projection optical system 8 more than 0.003 accordingly with maximal value 0.15deg.
The deflection of this deflection plane 33a is suitable for for example when changing spatial modulation element 6 etc. the time, and also goes for adjusting the situation that the pitch angle of the opening of tiny mirror 6a changes because of the manufacture deviation of spatial modulation element 6.About the adjustment of this situation, utilize numerical example 3 explanations shown in the table 3.
Numerical example 3 is that the arrangement pitches in tiny mirror 6 is the wavelength of 17.9 μ m, laser 61 when being 355nm, and the inclination angle phi of the opening of tiny mirror 6a becomes φ=15.0deg, the example of 14.97nm.The pitch angle of tiny mirror 6a can be through making incident at a predetermined angle with reference to light and measure catoptrical in-position and test and obtain.
In table 3, represent angle of diffraction (deg), the order of diffraction, the incident angle θ identical with table 1 0Setting value, diffraction efficiency (%), optical axis P relatively 3The inclination angle phi of tiny mirror 6a of angle (deg) and opening.
Table 3
Figure S2008101340880D00161
The numerical example 3-a of table 3,3-b are illustrated in the constant θ of being of incident angle 0Under the situation of=30deg, inclination angle phi only changes 0.03deg, and diffraction efficiency changes 7%.
Numerical example 3-c representes through making deflection plane 33a deflection 0.5deg, and diffraction efficiency is recovered, and in the spatial modulation element 6 of φ=14.97deg, also can obtain the diffraction efficiency 80% identical with the spatial modulation element of φ=15deg 6.
In addition, when a deflection through catoptron 33 changes the degree of tilt of deflection plane 33a, will cause the incoming position of laser 61 space modulator elements 6 to depart from.In this embodiment, catoptron travel mechanism 34 has catoptron deflection 34a of portion and the parallel moving part 34b of catoptron, moves through combining the parallel of catoptron 33, can make on the optical axis of laser 61 accurate incident projection optical systems 8.
For example shown in Figure 4, deflection plane 33a keeps and makes and optical axis P at the mirror deflection 34a of portion that is reflected 1Intersection point Q when becoming the deflection center, be angle θ from the incident angle of space modulator element 6 0The state anglec of rotation (Δ θ/2) of catoptron 33A; And when the deflection of the position of catoptron 33B; Incident angle from the reference field M of the laser 61 space modulator elements 6 of LASER Light Source 50 is angle (θ+Δ θ); But depend on that apart from the distance of spatial modulation element 6, reflected light departs from spatial modulation element 6 sometimes, or depart from the effective range of projection optical system 8.
At this moment, make catoptron 33B at optical axis P through the parallel moving part 34b of catoptron 1Direction on for example only parallel displacement L, move it the position of catoptron 33C, can make reflected light accurately incide the position identical thus with the reflected light of catoptron 33A at catoptron 33C place.
According to this laser-processing system 100, make from the laser 60 of LASER Light Source 50 through the optical axis P relatively of catoptron travel mechanism 34 1Deflection, and through can be at optical axis P 1The deflection plane 33a deflection that direction moves, thus can to spatial modulation element 6 irradiation make space modulator element 6 reference field M and opening tiny mirror 6a the incident angle change and do not change the laser 61 of incoming position.Therefore; Need not change the pitch angle of the opening of tiny mirror 6a, can make the aperture angle scope of aiming at projection optical system 8 based on the Fraunhofer diffraction 70 in the aperture of tiny mirror 6a and based on the diffraction direction of the diffraction 71 of the arrangement pitches of tiny mirror 6a.As a result, can carry out the good laser radiation of light utilization ratio to machined surface 11a through projection optical system 8.
Therefore, through change the incident angle of laser 61 space modulator elements 6 according to the oscillation wavelength of laser oscillator 1, can suppress the variation of the light utilization ratio that the wavelength change by laser 61 causes.
And; Even there is the deviation at pitch angle of the opening of the tiny mirror 6a that causes because of the manufacture deviation of spatial modulation element 6 etc.; Also can adjust the incident angle of laser 61 according to the pitch angle of each spatial modulation element 6, be adjusted into good light utilization ratio.
Below, the 1st variation of this embodiment is described.
Fig. 5 is the synoptic diagram of structure of deflection plane travel mechanism of laser irradiation device of the 1st variation of expression embodiment of the present invention.
This variation has catoptron travel mechanism 36 shown in Figure 5 (deflection plane travel mechanism) and replaces the catoptron travel mechanism 34 of above-mentioned embodiment.Below, the difference of main explanation and above-mentioned embodiment.
Catoptron travel mechanism 36 is made up of the catoptron deflection 34a of portion identical with catoptron travel mechanism 34, the parallel moving part 34b of catoptrons, and is mounted for that to make catoptron 33 can be the center deflection with the some q of its end.And catoptron travel mechanism 36 is electrically connected with travel mechanism's control part 35 of control device 22.
When this situation; The parallel amount of movement of Z-direction is identical with above-mentioned embodiment; Can be definite through reflection position and the distance between the some q of considering the optical axis on the deflection plane 33a, and identical with above-mentioned embodiment, deflection plane 33a deflection is moved with parallel.
Below, the 2nd variation of this embodiment is described.
Fig. 6 is the schematic perspective view of structure of optical path-deflecting portion and deflection plane travel mechanism of laser irradiation device of the 2nd variation of expression embodiment of the present invention.
This variation is used mirror unit shown in Figure 6 37 (optical path-deflecting portion) and catoptron travel mechanism 38 (deflection plane travel mechanism) respectively, replaces the catoptron 33 and catoptron travel mechanism 34 of above-mentioned embodiment.Below, the difference of main explanation and above-mentioned embodiment.
Mirror unit 37 is as shown in Figure 6; With the one side of the installed surface 37a opposition side that is parallel to the XY plane; Be provided with deflection plane 37A, 37B, 37C side by side in Y direction, this deflection plane 37A, 37B, the degree of tilt of 37C in the ZX plane are different with the height on Z-direction.
Catoptron travel mechanism 38 is single shaft travel mechanisms, by extending the slide-and-guide device 38b that installs in not shown framework upper edge diagram Y direction; On the installed surface 37a that is fixed on mirror unit 37, and be provided as and constitute at the slider 38a that diagram Y direction in slide-and-guide device 38b upper edge moves.
Catoptron travel mechanism 38 is electrically connected with travel mechanism's control part 35 of control device 22, can be stepped mobile in Y direction according to the control signal of travel mechanism's control part 35.
In this variation, for example in advance according to 3 wavelength X of LASER Light Source 50 A, λ B, λ C, be best value with the degree of tilt of deflection plane 37A, 37B, the relative Z axle of 37C, the set positions of Z-direction.And, when the oscillation wavelength through apparatus control portion 42 switched laser oscillators 1, for example from wavelength X ASwitch to wavelength X CThe time, mirror unit 37 is moved, so that replace deflection plane 37A, by deflection plane 37C reflector laser 61 along Y direction.
Like this,,, needn't when each the switching, carry out the calculating of incident angle, can carry out the setting of deflection plane rapidly in advance the tilt quantity of deflection plane being defined as when a plurality of according to this variation.And, owing to do not carry out the deflection of this deflection plane relatively, so can simplify the structure of deflection plane travel mechanism.
In addition, in Fig. 6, each deflection plane is represented to change the example of shape at pitch angle to an axle parallel with the Y axle as the center, but also can be the shape that each deflection plane is suitably moved along Z-direction.
The 3rd variation of this embodiment is described below.
Fig. 7 is the synoptic diagram of structure of optical path-deflecting portion and deflection plane travel mechanism of laser irradiation device of the 3rd variation of expression embodiment of the present invention.
This variation is used mirror unit shown in Figure 7 39 (optical path-deflecting portion) and catoptron travel mechanism 48 (deflection plane travel mechanism) respectively, replaces the catoptron 33 and catoptron travel mechanism 34 of above-mentioned embodiment.Below, the difference of main explanation and above-mentioned embodiment.
As shown in Figure 7; Mirror unit 39 with the one side of the installed surface 39a opposition side that is parallel to the XY plane; Be provided with deflection plane 37A, 37B, 37C side by side in X-direction, this deflection plane 37A, 37B, the degree of tilt of 37C in the ZX plane are different with the height on Z-direction.
Catoptron travel mechanism 48 is single shaft travel mechanisms, is included in not shown framework upper edge diagram X-direction and extends the slide-and-guide device 48b that installs; Be provided as the slider 48a that can move in slide-and-guide device 48b upper edge X-direction, it has the stationary plane 48c of rear side installed surface 39a of each deflection plane of fixation reflex mirror unit 39 in Z axle positive dirction side.
Catoptron travel mechanism 48 is electrically connected with travel mechanism's control part 35 of control device 22, can be stepped mobile in Y direction according to the control signal of travel mechanism's control part 35.In addition; In Fig. 7; Represent each deflection plane in the configuration height of Z-direction along with towards X axle positive dirction and the example of shape that stepped increase forms; But also can be the shape that the configuration height of each deflection plane is suitably moved along Z-direction, for example can form indentation in the ZX section.
In this variation, with respect to above-mentioned the 2nd variation, make the configuration direction of deflection plane and the moving direction deflection of deflection plane, have and the identical action effect of above-mentioned the 2nd variation.
In addition; In above-mentioned explanation; Explained through the deflection of control part control deflection plane travel mechanism of travel mechanism and the example of the parallel amount of movement that moves, but deflection plane travel mechanism also can utilize formations such as mechanical type objective table, and can move with parallel through manually carrying out deflection.
During this situation, angle excursion and parallel amount of movement are for example calculated according to the pitch angle condition of wavelength and tiny mirror in advance, when mobile, carry out reference and get final product.Perhaps, also can keep watch on the light quantity of machined surface, and change amount of movement, the light quantity that one side is measured on the machined surface is simultaneously set.
Especially in the structure of above-mentioned the 2nd, the 3rd variation, deflection plane travel mechanism moves and optionally switches deflection plane in the stepping of single shaft direction, so do not need high-precision mobile accuracy, is suitable for manual operation.
In above-mentioned explanation; Explained that the laser that shines on the spatial modulation element 6 moves through the deflection of combination deflection plane with to the parallel of optical axis direction; When even incident angle changes; Example under the also constant situation of incoming position, but also can change incoming position as required, and processing head is moved to offset because of incoming position change the amount of movement on the machined surface that causes.
During this situation, simultaneously mobile phase is simultaneously carried out laser radiation to the irradiation position of spatial modulation element, so can disperse the irradiation load of laser to tiny mirror, can prolong the life-span of spatial modulation element.
In above-mentioned explanation, explained and utilized a laser oscillator to produce the example of a plurality of wavelength light that different a plurality of laser oscillators constitute but LASER Light Source also can make up oscillation wavelength.
In above-mentioned explanation; The situation that Laser Processing is used for the finishing processing of semiconductor wafer substrate etc. has been described; But machined object is not limited to these, for example also can be used for to multilayer film, coat film, the metal object that approaches and the Laser Processing of various machined objects such as organic object, semiconductor.

Claims (10)

1. laser irradiation device, it utilizes the spatial modulation element to the machined object irradiating laser according to machining shape information, it is characterized in that, and this laser irradiation device has:
LASER Light Source;
Optical path-deflecting portion, it makes the laser that penetrates from this LASER Light Source carry out deflection through deflection plane, so that towards said spatial modulation element;
Deflection plane travel mechanism; It has catoptron deflection portion and the parallel moving part of catoptron; This catoptron deflection portion changes the degree of tilt of the deflection plane of said optical path-deflecting portion with respect to the exiting side optical axis of said LASER Light Source, and the parallel moving part of this catoptron makes said deflection plane along parallel moving on the direction of the exiting side optical axis of said LASER Light Source;
Said spatial modulation element, its laser that has being undertaken by said optical path-deflecting portion after the deflection carries out spatial modulation and forms a plurality of tiny mirror towards the diffraction light of plane of illumination;
Projection optical system, its diffraction light projection that will be formed by said spatial modulation element is on said plane of illumination; And
Deflection plane travel mechanism control part, it controls the parallel moving part of said catoptron deflection portion and said catoptron, is included in the scope of aperture angle of said projection optical system so that carry out diffraction light after the spatial modulation by said spatial modulation element.
2. laser irradiation device according to claim 1; It is characterized in that; Said deflection plane travel mechanism control part utilizes said catoptron deflection portion to change the degree of tilt of said deflection plane; And utilize the parallel moving part of said catoptron to make said deflection plane parallel moving on optical axis direction, so that the diffraction light of any one-level in the N order diffraction light of the diffraction light after being modulated by said spatial modulation element is included in the scope of aperture angle of said projection optical system.
3. laser irradiation device according to claim 2; It is characterized in that; Said catoptron deflection portion changes the angle of inclination of said deflection plane, so that roughly consistent from the direction of the peak strength of the Fraunhofer diffraction that determines by the diffraction direction of light of selected any one-level in the N order diffraction light of the arrangement pitches of the said a plurality of tiny mirror the said spatial modulation element and the decision of said Wavelength of Laser, with aperture by said spatial modulation element.
4. laser irradiation device according to claim 2; It is characterized in that; The parallel moving part of said catoptron makes said deflection plane move along said exiting side optical axis direction, so that the diffraction light of any one-level of being selected by said catoptron deflection portion is included in the scope of aperture angle of said projection optical system.
5. according to each described laser irradiation device in the claim 1～3; It is characterized in that; Said LASER Light Source optionally penetrates the laser of a plurality of wavelength, and said catoptron deflection portion changes the angle of inclination of said deflection plane according to from the Wavelength of Laser that said LASER Light Source penetrated.
6. according to each described laser irradiation device in the claim 1～3; It is characterized in that it can be that the center is rotated with the deflection plane of said optical path-deflecting portion and the intersection point of said exiting side optical axis that said catoptron deflection portion remains said optical path-deflecting portion.
7. laser irradiation device according to claim 1 and 2 is characterized in that,
In said optical path-deflecting portion, highly different separately and have separately a plurality of deflection planes of mutually different degree of tilt and arrange along certain orientation,
The parallel moving part of said catoptron deflection portion and said catoptron makes said optical path-deflecting portion move and optionally dispose any in said a plurality of deflection plane along said certain orientation, and said deflection plane is moved with respect to said exiting side optical axis direction optical axis direction.
8. a laser-processing system is characterized in that, this laser-processing system has:
Each described laser irradiation device in the claim 1～5;
Image pickup optical system, the said projection optical system arranged coaxial of itself and said laser irradiation device is so that make a video recording to the machined object on the plane of illumination that is configured in this laser irradiation device;
Image pickup part, it is configured in the image position of this image pickup optical system; And
Image processing part, it carries out Flame Image Process to the image of being taken by this image pickup part, extracts the defective of said machined object,
With the shape of the defective of extracting through this image processing part accordingly; This laser-processing system is modulated driving to the said spatial modulation element of said laser irradiation device; Laser after said machined object shines said spatial modulation carries out the processing of said machined object.
9. a laser-processing system is characterized in that, this laser-processing system has:
The described laser irradiation device of claim 6;
Image pickup optical system, the said projection optical system arranged coaxial of itself and said laser irradiation device is so that make a video recording to the machined object on the plane of illumination that is configured in this laser irradiation device;
Image pickup part, it is configured in the image position of this image pickup optical system; And
Image processing part, it carries out Flame Image Process to the image of being taken by this image pickup part, extracts the defective of said machined object,
With the shape of the defective of extracting through this image processing part accordingly; This laser-processing system is modulated driving to the said spatial modulation element of said laser irradiation device; Laser after said machined object shines said spatial modulation carries out the processing of said machined object.
10. a laser-processing system is characterized in that, this laser-processing system has:
The described laser irradiation device of claim 7;
Image pickup optical system, the said projection optical system arranged coaxial of itself and said laser irradiation device is so that make a video recording to the machined object on the plane of illumination that is configured in this laser irradiation device;
Image pickup part, it is configured in the image position of this image pickup optical system; And
Image processing part, it carries out Flame Image Process to the image of being taken by this image pickup part, extracts the defective of said machined object,
With the shape of the defective of extracting through this image processing part accordingly; This laser-processing system is modulated driving to the said spatial modulation element of said laser irradiation device; Laser after said machined object shines said spatial modulation carries out the processing of said machined object.
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