KR101114738B1 - Size adjustabele aperture and sputter apparatus containing the same - Google Patents

Abstract

PURPOSE: A variable aperture and a sputter device including the same are provided to improve yield by using the same halftone materials when a halftone mask pattern is repaired. CONSTITUTION: A first column unit(150) has a first opening(155). The first opening unit passes sputter gas for a film which repairs defects of a pattern on a transparent substrate. A second column unit is formed on the upper side or lower side of the first column unit. The second column unit has a second opening unit(165) overlapped with the first opening unit. The second column unit controls the size of the area which passes the sputter gas.

Description

Variable aperture and sputter device including the same {SIZE ADJUSTABELE APERTURE AND SPUTTER APPARATUS CONTAINING THE SAME}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a variable aperture and a sputtering apparatus including the same, wherein when a defect occurs in a mask pattern, a variable aperture is formed in the sputtering apparatus to allow partial repair to a defective area. The present invention relates to a technology that enables sputtering in a local region in a half-tone mask as well as a binary mask.

In general, a general photo mask used when patterning by a photolithography process has a substrate, a light transmitting portion that completely transmits light and a light blocking portion that completely blocks the light.

Since the conventional general photo mask is inevitably embodying a single layer pattern, it can be used only in one cycle photolithography process that performs exposure and development and forms a pattern by etching.

Here, the general photo mask has a structure in which only one layer of pattern is realized, and thus it is uneconomical, so that a light transmitting part that completely transmits the light irradiated and formed on the substrate, a light blocking part that completely blocks the irradiated light, and is irradiated At this point in time, a half tone mask having a transflective portion that transmits only a part of light is developed.

In the prior art, the repair of the photo mask has a technique of using an additive material for greatly improving the adhesion.

In addition, there is a trimming technology that trims the pattern of the over-deposited area or removes the connection part beyond the mask pattern called a black spot defect, and on the contrary, is caused by a non-deposition or a deposition defect called a white spot defect. It consists of a technique of connecting the defects of the broken areas.

Here, each pixel may take a gray level value on a scale ranging from 0 to 255. Therefore, in order to generate a mask, the gray level value of the photographed picture is divided into two areas, that is, a defective non-masking area and a defect-free masking area.

Here, in the conventional method of connecting the open parts, the gray level should be matched to make halftones during the deposition process, and the deposition rate such as laser type, power, scan speed, and temperature is affected. There is a problem that needs to be tightly controlled.

In particular, the deposition rate of the laser and the source gas (Cr, Mo) used in the laser deposition is very fast, difficult to control the defect connection is difficult to meet the deposition conditions.

As a result, there is a problem that an over deposition occurs and an additional process of removing the deposition occurs.

Also, since local control is not easy, the halftone mask could not show the same transmittance as before. In other words, even when the film is re-formed using the same halftone material, the light source used for the film formation affects the surrounding halftone pattern, thereby causing a difference in transmittance between the newly formed portion and the existing portion.

Therefore, there is an inconvenience of using a halftone material having a different composition to match the transmittance.

According to the present invention, a spherical film forming apparatus includes a variable aperture that enables local repair, thereby improving the profile of the final photo mask pattern formed on the photo mask and simplifying the photo mask manufacturing process. It is an object of the present invention to provide a sputtering apparatus comprising a.

In addition, an object of the present invention is to provide a variable aperture and a driving method thereof that can easily modify the region to which the gas or laser beam for the sputter is irradiated for the local repair described above.

According to an embodiment of the present invention, a variable aperture may include a first column part and a first column part having a first opening through which a sputter gas is formed to form a defect repair film on a transparent substrate. And a second column portion provided below and having a second opening overlapping the first opening, and capable of adjusting the size of the region through which the sputter gas passes.

Here, the first opening or the second opening is characterized in that it is provided in the form of a triangle, square, circle, rhombus and other polygons.

In addition, the sputtering apparatus according to an embodiment of the present invention includes a chamber for forming a pattern on the transparent substrate using a sputter gas and the above-described variable aperture provided in the chamber. A driving unit for controlling the operation of allowing the first column portion and the second column portion to overlap and removing the first column portion and the second column portion from the upper portion of the transparent substrate during general film formation for forming a pattern on the transparent substrate; It is characterized by including.

The variable aperture according to another embodiment of the present invention is arranged to allow the first column portion to transmit the laser beam and the overlapping area of the first column portion to be adjusted under the first column portion, thereby providing the laser beam. A second column portion for adjusting the size of the region to be transmitted; a first light blocking portion formed inside or at the bottom of the first column portion to block an area other than an overlapping region of the first column portion and the second column portion; And a second light blocking part formed inside or at the bottom of the second column part to block an area other than an overlapping area of the first column part and the second column part.

Here, the cross section of the first column portion or the second column portion is characterized in that provided in the form of a triangle, a square, a circle, a rhombus and other polygons, the first column portion and the second column portion cross each other in the overlapping range It characterized in that it comprises a drive for controlling the operation to be arranged.

In this case, the driving unit is provided on the outside of the first column portion and the second column portion, respectively, or is provided on the inside of the first column portion and the second column portion, respectively.

In addition, the sputter repair tool including a variable aperture according to another embodiment of the present invention is a laser beam oscillator for supplying a laser beam to repair the defect of the pattern formed on the transparent substrate, and the laser supplied from the laser beam oscillator Irradiation of the laser beam by adjusting the intersection of the optical system for transmitting the beam to the repair position of the substrate, and the first column and the second column which is positioned below the optical system and continuously provided to penetrate the laser beam And a chamber for supplying a raw material for forming a re-formation pattern disposed under the variable aperture and for repairing a defect in the pattern.

Here, the laser beam oscillator is characterized in that using an infrared laser (IR) or ultraviolet laser (UV).

The optical system may further include a beam shaper for homogenizing and enlarging the laser beam from the laser oscillation means, a beam intensity adjusting unit for adjusting the intensity of the laser beam output from the beam shaper, and a laser beam passing through the beam intensity adjusting unit. And a revolver provided between the objective lens to be irradiated to the repair position of the substrate and the objective lens and the beam intensity control unit to rotate to change the magnification of the objective lens.

Next, the chamber is characterized by using the same raw material as the pattern.

Next, the repair tool includes a camera unit for comparing and reading a defective pattern image and a good pattern image photographed at the time of repairing the transparent substrate, and a controller for controlling the variable aperture by analyzing a reading result of the camera unit. It is done.

When using the variable aperture and the sputtering apparatus including the same according to the present invention, it can be easily performed under the same sputtering conditions as general film forming conditions only by performing a simple operation of adjusting the position of the column portion during repair.

Therefore, in the repair process using a laser as well as a binary mask as well as a binary mask, the defective portion of the photo mask pattern can be easily removed, and the re-film pattern can be easily removed on the removed portion. It provides the effect of being able to form.

Therefore, since the profile of the final pattern formed in a photomask can be improved and a photomask manufacturing process can be simplified, the efficiency of a photomask manufacturing process can be improved.

In addition, the present invention by using the same halftone material when repairing the halftone mask pattern, it is possible to omit the additional work for adjusting the transmittance, and provides an effect that can further improve the manufacturing yield.

1 is a perspective view showing a state in which a chrome pattern is formed by using a sputtering apparatus according to the present invention.
2 is a perspective view showing a state in which a halftone pattern is formed by using a sputtering apparatus according to the present invention.
3 is a cross-sectional view illustrating a variable aperture according to an exemplary embodiment of the present invention.
4 is a perspective view illustrating a variable aperture according to an exemplary embodiment of the present invention.
5 is a plan view illustrating a variable aperture according to another exemplary embodiment of the present invention.
6 is a perspective view illustrating a variable aperture according to another exemplary embodiment of the present invention.
7 is a perspective view of a variable aperture according to still another exemplary embodiment of the present invention.
8 is a perspective view showing a variable aperture and a sputter repair tool including the same according to another embodiment of the present invention.

Hereinafter, the variable aperture and the sputtering apparatus including the same will be described in detail based on the above object of the present invention.

Advantages and features of the present invention and methods for achieving them will be apparent with reference to the embodiments and drawings described below in detail. However, the present invention is not limited to the embodiments disclosed below, but can be implemented in various different forms, only the embodiments are to make the disclosure of the present invention complete, it is common in the art It is provided to fully inform those skilled in the art of the scope of the invention, which is to be defined only by the scope of the claims.

The process of forming the photomask pattern using the transparent substrate is performed using a chamber using a sputter gas, and the process of repairing the pattern after the formation of the pattern is performed by irradiating a laser to the raw material for forming the film formation pattern and applying the repositioning pattern to the defective part. By vapor deposition, a repairing method is used.

In particular, when repairing a defect portion generated in a halftone pattern of a half-tone mask, the defect portion is identified by identifying a position where a defect occurs, and 1) removing the defect portion of the halftone pattern. And 2) laser depositing a recoat pattern on the removed defect region.

Here, in the case of the halftone mask, the process of removing defects has been performed to minimize the difference in transmittance between the halftone pattern and the newly repaired refilm pattern, and to easily perform the process of forming the recoat pattern. It was a process.

In addition, when the re-coat pattern is formed of the existing halftone pattern composition material, a transmittance difference occurs. In order to minimize the difference, it was necessary to form the re-coat pattern with a new composition different from the existing halftone pattern composition material.

However, since the halftone mask repayment process requires a more complicated repair process than a binary mask using a chrome pattern, there are disadvantages in terms of efficiency such as process time and cost.

One of the reasons why the above disadvantageous process is performed is that the laser beam is irradiated to a region other than the defective portion in the laser beam irradiation process for forming the re-film pattern, thereby causing a difference in transmittance of the halftone pattern.

Therefore, in the present invention, the sputter repair tool is provided with a variable aperture allowing the laser beam to be locally irradiated only on the defective part and the re-film pattern to be formed only on the defective part, thereby repairing the halftone mask. I could simplify it.

1 is a perspective view showing a state in which a chrome pattern is formed by using a sputtering apparatus according to the present invention.

Referring to FIG. 1, after the chromium pattern 20 is formed on the transparent substrate 10, it can be seen that the re-formation pattern 30 is formed in a region where a defect occurs. In this case, since the chromium pattern 20 serves to completely block light, the material of the repositioning pattern 30 may be used in various ways because the chromium pattern 20 completely blocks the light.

Specific examples thereof include any one or two or more elements selected from Cr, Cu, Ag, Au, Al, Co, Fe, Mo, Ni, Pb, Ti, W, Zn, Si, O, N and C. It is preferable to form a refilm by using.

However, in this case, when the local film formation is not made, black spot defects may occur. Therefore, by using the variable aperture according to the present invention, it is possible to easily form the re-formation pattern 30 without occurrence of defects.

2 is a perspective view showing a state in which a halftone pattern is formed by using a sputtering apparatus according to the present invention.

Referring to FIG. 2, the chrome pattern 110 is formed on the transparent substrate 100, and the halftone pattern 120 is formed on the transparent substrate 100.

In this case, the stacked structure of the chrome pattern 110 and the halftone pattern 120 shows only one embodiment of the embodiment of the photomask pattern, and the present invention is not limited by the stacked structure.

Here, the defect portion is present in the halftone pattern 120 and the re-formation pattern 130 is formed on the defect portion. When the sputter repair tool according to the present invention is used, the defect portion is not removed as shown. The refilm pattern 130 may be formed.

In addition, by using the same composition as the existing halftone pattern 120, it is possible to save time and cost required to find a new composition material.

In this case, the composition of the halftone pattern 120 may be Mo _x O _y , Mo + Si, Mo + Si _x N _y , Mo + SiO ₂ , W _x O _y , W + Si, W + Si _x N _y , W + SiO ₂ , Cr, Cr + W + SiO ₂ , Cr + W + Si _x N _y , Cr _x O _y , Cr + Si, Cr + Si _x N _y , Cr + SiO ₂ , Cr + Mo + Si _x One or more selected from N _y , Cr + Mo + SiO ₂ , Cr + Mo + W + Si _x N _y, and Cr + Mo + W + SiO ₂ , but is not limited thereto.

Next, the variable aperture of the present invention that enables the repair process as described above will be described in more detail.

3 is a cross-sectional view illustrating a variable aperture according to an exemplary embodiment of the present invention. 4 is a perspective view illustrating a variable aperture according to an exemplary embodiment of the present invention.

3 and 4, assuming that a defect occurs in the pattern formed on the transparent substrate 100 as shown in FIG. 1 or FIG. 2, a cross-sectional view schematically illustrating a process of repairing a defective portion.

Here, since the sputter gas for film formation should be locally irradiated on the transparent substrate 100, the first column part 150 and the second column part 160 for controlling the film are provided.

In this case, the first column part 150 may be provided in a plate shape, and the planar area combined with the second column part 160 to cover the entire surface of the transparent substrate 100 may cover the entire transparent substrate 100. It should be large enough This is to allow the sputter gas to be irradiated locally upon repair.

And, the first column part 150 has a first opening 155 for partially passing the sputter gas for this local irradiation.

Next, a second opening 165 is provided above or below the first column unit 150 and overlaps the first opening 155 to control the size of the region through which the sputter gas passes. Two column portions 160 are provided.

In this case, the size relationship of the second column part 160 has the same characteristics as the first column part 150, and repair of the minute area by adjusting the overlapping area of the first opening part 155 and the second opening part 165. Deposition can be made possible.

For the repair film formation, the shape of the first opening 155 or the second opening 165 is not particularly limited, but it is preferable to have a triangle, square, circle, rhombus and other polygonal shapes as necessary. Do.

In addition, the sputtering apparatus according to an embodiment of the present invention includes a chamber for forming a pattern on the transparent substrate using a sputter gas and a variable aperture provided in the chamber.

That is, during repair, the first column part and the second column part overlap, and during the general film formation for forming a pattern on the transparent substrate, the first column part and the second column part should be removed from the upper portion of the transparent substrate. However, it is preferable to provide a separate drive unit for controlling such an operation.

In addition, the repair film formation as described above may be applied to a method using a laser sputter as well as a general sputtering device.

Therefore, hereinafter, a sputter repair tool using a laser will be described in detail, and a driving part for controlling the column part according to the present invention will be described in detail.

5 is a plan view illustrating a variable aperture according to another exemplary embodiment of the present invention.

Referring to FIG. 5, first, the cross-sectional shape is formed in a square shape, and the first column part 200 is provided in the form of a hollow column so as to allow the repair laser beam to pass therein, and the first column part 200 and the first column part 200. It is provided in the same form, and the second column portion 220 is provided so that the first column portion 200 and some regions overlap.

In this case, the first column part 200 and the second column part 220 need not always be provided in the same shape, and the cross-sectional shape is in the form of a triangle, a square, a rhombus, a circle, other polygons and a closed curve. Can be done.

Next, since portions of the first column part 200 and the second column part 220 except for the transmissive area 240 formed by overlapping the laser beam transmission should be blocked, the first column part 200 has a first The light blocking unit 210 may be provided, and the second column unit 220 may be provided with the second light blocking unit 230.

Here, the formation position or shape of the first light blocking portion 210 and the second light blocking portion 230 is not particularly limited, and as described above, the laser beam does not need to be transmitted in a portion other than the light transmitting region 240. It can be formed only to the extent that does not.

In addition, when the first column portion 200 and the second column portion 220 are provided in the form of a plate, as shown in FIG. 3 or FIG. 4, a separate light blocking portion does not have to be provided.

Next, in order to adjust the size of the light transmitting area 240 by overlapping the first column part 200 and the second column part 220, each column part is fixed to the X and Y axes, and then driving is controlled. Can be.

According to the exemplary embodiment shown in FIG. 5, the first column part 200 is fixed to the X axis and then driven in the left and right directions, while the second column part 220 is fixed to the Y axis and then driven in the vertical direction. The size of the overlapped light transmitting area 240 may be adjusted.

6 is a perspective view illustrating a variable aperture according to another exemplary embodiment of the present invention.

Referring to FIG. 6, a first column part 300 and a second column part 320 are provided, and are first and second light blocking parts provided in each column part, and the first column part 300 includes a first column part 300. It can be seen that the first inner spacers 310 and 315 are provided, and the second column portion 320 is provided with the second inner spacers 330 and 335.

Here, the inner spacer is shown in the form of two pieces, but the number is not limited in practice. Therefore, it is not a piece added from the outside, the inner side wall of the column portion may be swollen, and the entire inner space of each column portion is not filled, but only acts as a light blocking portion even if only a part is blocked. It doesn't matter at all.

Therefore, the variable aperture according to the present invention is not limited by the form of the first and second light blocking portions.

7 is a perspective view illustrating a variable aperture according to another exemplary embodiment of the present invention.

Referring to FIG. 7, as an embodiment of driving the first column part 300 and the second column part 320, first driving connected to the first driving part 400 and the second driving part 420, respectively. An embodiment of the control arm 410 and the second driving control arm 430 may be seen.

Referring to FIG. 5, the driving example has a higher degree of freedom than the movement between axes based on the X and Y axes.

In the present embodiment, in addition to the overlap area control of the first column unit 300 and the second column unit 320, there is an advantage that the repair position movement can also be easily controlled.

In addition, driving examples of the first column portion and the second column portion according to the present invention are not limited to the above two embodiments, and more various embodiments may be applied.

Although not shown, by providing a roller device and a gear control part in a portion where the first column part and the second column part contact each other, the overlapping area may be adjusted only by the internal driving device, not the external driving device.

In addition, by providing a magnetic force device in a portion where the first column portion and the second column portion are in contact with each other, the drive may be enabled.

Therefore, the variable aperture according to the present invention is not limited by the above driving method.

In addition, the driving method as described above may be easily applied to the variable aperture and the sputter device according to FIGS. 3 and 4.

8 is a perspective view showing a variable aperture and a sputter repair tool including the same according to another embodiment of the present invention.

Referring to FIG. 8, it can be seen that a local repair process is performed while operating a sputter repair tool on the transparent substrate 530.

In this case, the sputter repair tool according to the present invention includes a composition for re-forming and a chamber 550 for supplying a source gas.

Next, the variable aperture including the first column part 500 and the second column part 520 according to the present invention is disposed above the chamber 550, so that a local repair process may be more easily performed. Make sure

Next, the upper part of the variable aperture further includes an optical system and a laser beam oscillator, and the specific structure thereof is as follows.

Here, the laser beam oscillator may perform a trimming process to supply a laser beam to repair an overdeposited region of the mask pattern, or to repair a defective pattern of an area where the pattern is broken, but to repair a defect of the transparent substrate. Feed the laser beam while adjusting the deposition thickness.

Here, the laser beam may perform a trimming process when the black spot is defective using a laser of near ultraviolet (NUV) or less, or perform a chemical vapor deposition (CVD) process when the white spot is defective, and an infrared (IR) laser. And using near-ultraviolet (NUV) laser, but below pulse wave near-ultraviolet (NUV) laser or infrared (IR) laser is applied to repair in case of sunspot failure, and below continuous wave near-ultraviolet (NUV) laser to repair in white spot failure Apply.

Here, the laser upon repair due to the sunspot defect is not damaged by temperature when it has a pulse duration of 36 picoseconds or less.

Next, the laser beam oscillator emits a laser source but is capable of single pulse driving or repetitive pulse driving, and is oscillated by a diode pumped solid state laser method or a flash lamp pumped solid state laser method, and a picosecond (ps) to femtosecond (fs) pulse width, That is, it has a pulse width of 36 picoseconds (36 x 10 ^-12 seconds) or less. In addition, the laser beam oscillation unit is provided with one or a plurality and the wavelength band is used between 250 ~ 1064nm.

Furthermore, the laser beam oscillator oscillates the laser beam in a Q-switched manner, and includes neodymium YAG (Nd: YAG), neonium YLF (Nd: YLF) laser, sapphire (Ti: Sapphire) laser, and fiber oscillator (Fiber- Oscillator, Ytterbium (Yitterbium) and excimer (Excimer) laser at least one of the oscillation.

Next, the optical system transmits the laser beam supplied from the laser beam oscillator to the repair position of the transparent substrate so as to focus, and transmits the beam to the beam shaper, the beam intensity adjusting unit, the camera unit, the auto focus unit, the revolver, and the objective lens. It is composed of subdivisions.

Here, a laser beam shaper changes the laser oscillated at the laser beam oscillator into a homogenized beam and enlarges it to have a desired size during the process.

Next, the beam intensity adjusting unit adjusts the intensity of the laser beam output from the beam shaper, and comprises an attenuator and a power controller.

Next, an objective lens is provided. In the present invention, a camera unit is further provided between the beam intensity adjusting unit and the objective lens.

The camera unit acquires a repair image of the transparent substrate so as to focus the repair position between the laser beam intensity controller and the objective lens.

At this time, the camera unit outputs the machining position at the time of repairing the transparent substrate in real time, and in addition, the photographed image is provided to compare and inspect / check / check the presence or absence of defects before and after the repair through the control unit.

Next, an auto focus unit is provided between the camera unit and the objective lens to automatically focus the objective lens at the repair position or to move the objective lens in the direction of the transparent substrate or in the direction opposite to the transparent substrate.

Next, a revolver is provided above the objective lens to change the magnification of the objective lens. At this time, the objective lens rotation method can be used.

Next, a source gas supply unit connected to the chamber may be provided, which functions to supply the source gas to the transparent substrate when the transparent substrate is repaired.

Subsequently, the control unit basically controls to drive the variable aperture according to the present invention, wherein the laser beam oscillator, beam shaper, beam intensity control unit, camera unit, auto focus unit, revolver, source gas supply unit and It is possible to comprehensively control the monitoring unit to be described later.

At this time, the monitoring unit is connected to the camera unit for outputting the processing surface in real time when repairing the transparent substrate, in addition to receiving the image taken by the camera unit through the control unit to compare the presence or absence of defects and to check / check It is provided.

By using the variable aperture, the sputtering apparatus including the same, and the sputter repair tool described above, the repair process is performed under the same sputtering conditions as those of general film forming conditions by only a simple operation of adjusting the position of the column portion during repairing. It can be done easily.

Therefore, only a portion removed from the half-tone mask as well as the binary mask can be easily formed locally. In addition, the repair process may be more easily performed by easily removing a defective portion of the photo mask pattern using a laser beam.

Therefore, it is possible to improve the profile of the final pattern formed on the photo mask and simplify the photo mask manufacturing process.

While the present invention has been described in connection with what is presently considered to be practical exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It will be understood by those skilled in the art that the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. Therefore, it should be understood that the embodiments described above are exemplary in all respects and not restrictive.

10, 100, 530: transparent substrate 20, 110: chrome pattern
30, 130: Refilm pattern 120: Halftone pattern
150, 200, 300, 500: first column portion 155: first opening
160, 220, 320, 520: second column portion 165: second opening
210: first light blocking portion 230: second light blocking portion
240: light transmission area 550: chamber
310 and 315: first inner spacer 330 and 335: second inner spacer
400: first driving unit 410: first driving control arm
420: second drive unit 430: second drive control arm

Claims (12)

A first column portion having a first opening through which a sputter gas for forming a defect repair film of a pattern formed on a transparent substrate is passed; And
And a second column part disposed above or below the first column part and having a second opening overlapping the first opening part and capable of adjusting the size of the region through which the sputter gas passes. Variable aperture.
The method of claim 1,
The first opening or the second opening
Variable apertures, characterized in that provided in the form of triangles, squares, circles, rhombus and other polygons.
A chamber forming a pattern on the transparent substrate using a sputter gas; And
Including the variable aperture of claim 1 or claim 2 provided in the chamber;
Controls an operation of overlapping the first column portion and the second column portion during repair and removing the first column portion and the second column portion from the upper portion of the transparent substrate during general film formation for forming a pattern on the transparent substrate. Sputtering apparatus comprising a; drive unit.
delete delete delete delete delete delete delete delete delete

Images