TW201541771A - Laser processing apparatus and method - Google Patents

Abstract

The present invention relates to a laser processing apparatus and a laser processing method, the laser processing apparatus including: a laser unit configured to generate a laser beam and to split the laser beam; a scanner unit provided with a plurality of scanners that adjust a propagation direction of the laser beam, and configured to provide a propagation path of the laser beam; a guide unit disposed between the laser unit and the scanner unit, and configured to selectively guide the split laser beams to the scanners; an irradiation unit configured to irradiate the laser beams passing through the scanner unit on the substrate; and a photographing unit configured to photograph the substrate, thus monitor the substrate, and selectively use the wavelength of the laser beam.

Description

Laser processing apparatus and method

The present invention relates to a laser processing apparatus and method, and more particularly to a laser processing apparatus and method capable of monitoring a substrate and selectively using a wavelength of a laser.

Generally, various patterns such as circuit patterns are formed on a semiconductor wafer or a flat panel display such as a liquid crystal display (LCD). For example, a flat panel display includes an array substrate, a counter substrate, a liquid crystal layer, and the like. Forming a plurality of primitive electrodes arranged in a matrix configuration, a plurality of scan lines disposed along columns of the plurality of primitive electrodes, and rows along the plurality of scan lines on the array substrate among the components Multiple signal lines.

At the same time, defects such as overlapping of electrical signal lines may occur during the manufacturing process of the array substrate. When such a defect is generated, an excellent image may not be formed on the substrate. Therefore, the overlapping signal lines are cut off so as not to overlap each other, and this process is called "repair".

The repair process using a typical repair device is as follows. First, the substrate is placed on the platform, and the laser beam is based on the defect area input by the external test equipment. The information is illuminated on the substrate. The irradiated laser beam cuts off a predetermined portion of the defective area. In addition, the operator checks the repair area by a separate image unit.

However, during a typical repair, the operator can inspect the repaired area of the substrate after the repair work. That is, when the repair device incorrectly repairs the defect-free area, the operator may not immediately check for such an error repair operation. Therefore, even when the repair process is performed in the defect-free area, it is difficult for the operator to take a quick action to prevent such an error repair operation. At the same time, it is necessary to use laser beams having different wavelengths depending on the material of the substrate or the material of the pattern on the substrate. A typical repair device cannot selectively use laser beams having different wavelengths. Therefore, the pattern of the substrate or the substrate on which the repair process is performed may be limited.

[Prior Art Literature]

[Patent Literature]

(Patent Document 1) KR2013-0034474

The present invention provides a laser processing apparatus and method capable of selectively using the wavelength of a laser beam.

The present invention also provides a laser processing apparatus and method capable of monitoring a substrate in real time.

The present invention also provides a laser processing apparatus and method capable of performing precise work on a substrate and improving work efficiency.

According to an exemplary embodiment, there is provided a laser processing apparatus for processing a substrate, the laser processing apparatus comprising: a laser unit configured to generate a laser beam and separate the laser beam; a scanner unit equipped Adjusting the laser beam a plurality of scanners of propagation direction and configured to provide a propagation path of the laser beam; a directing unit disposed between the laser unit and the scanner unit and configured to selectively separate the separated laser beams Leading to a scanner; an illumination unit configured to illuminate a laser beam passing through a scanner unit on the substrate; and a camera unit configured to take a picture of the substrate.

The scanner unit can include a first scanner configured to adjust a direction of propagation of the laser beam having at least one of wavelengths of the laser beam; and a second scanner configured to adjust with A scanner to adjust the laser beam of different wavelengths of the wavelength of the laser beam in the direction of propagation.

At least one selected from the group consisting of the first scanner and the second scanner can adjust a plurality of laser beams having different wavelengths.

The guiding unit may include a blocking portion equipped with the same number of separated laser beams and configured to open and close a propagation path of the laser beam; and a laser mirror provided by the laser mirror A blocking portion is interposed between the first scanner and the blocking portion and the second scanner and is configured to direct a laser beam passing through the blocking portion to the scanner.

The illumination unit can include an objective lens configured to focus the laser beam onto the substrate.

The camera unit can include a camera configured to photograph the substrate; an illuminator configured to illuminate the substrate; and an autofocuser configured to correct a focus of the camera.

The laser processing apparatus may further comprise a controller configured to operate the laser unit, control operation of the guiding unit according to material of the substrate or material of the pattern on the substrate, and according to a laser beam passing through the guiding unit Wavelength selection The scanner that will be used by the scanner unit.

The controller can adjust the camera magnification of the camera according to the fineness of the pattern on the substrate.

When the substrate is inspected, the camera magnification of the camera can be roughly increased by 5 to 20 times, and can be roughly increased by 20 to 50 times when the substrate is processed by the controller.

According to another exemplary embodiment, there is provided a laser processing method for processing a substrate by using a laser, the laser processing method comprising: generating a laser beam; selecting a wavelength of the laser beam; photographing the substrate, and exposing the laser A light beam is irradiated on the substrate to process the substrate and monitor the substrate; and the laser processing is stopped when a failure occurs during processing of the substrate.

The selection of the wavelength of the laser beam may include selecting the wavelength of the laser beam based on the material of the substrate or the material of the pattern on the substrate.

The photographing of the substrate may include adjusting the photographic magnification according to the fineness of the pattern on the substrate.

Photographic photography of the substrate can include adjusting the photographic magnification based on the type of operation relative to the substrate.

When a failure occurs during processing of the substrate, the stopping of the laser processing may include adjusting the position of the substrate and reprocessing the substrate.

When the material of the pattern on the substrate is metal, the first wavelength laser beam may be selected, and when the material of the pattern on the substrate is indium tin oxide, a wavelength shorter than the wavelength of the first wavelength laser beam may be selected. A second wavelength laser beam.

The processing of the substrate may include repairing defects of the pattern formed on the substrate.

1‧‧‧ platform

10‧‧‧Substrate

100‧‧‧ Laser processing equipment

110‧‧‧Laser unit

120‧‧‧Guide unit

121, 121a, 121b, 121c‧‧‧ attenuators

122, 122a, 122b, 122c‧‧‧ blocking part

123, 123a, 123b, 123c‧‧ ‧ laser mirror

124, 124a, 124b‧‧‧ size adjusters

130‧‧‧Scanner unit

131, 131a, 131b‧‧‧ scanner

132, 132a, 132b‧‧ ‧focus lens

133, 133a, 133b‧‧‧ relay lens

134, 134a, 134b, 134c‧‧ ‧ scanning mirror

140‧‧‧Irradiation unit

141‧‧‧ objective lens

150‧‧‧Photo unit

151‧‧‧ camera

152‧‧‧ imaging unit

153‧‧‧ illuminator

154‧‧‧Auto Focuser

155, 155a, 155b, 155c, 155d‧‧ ‧ photographic mirror

156‧‧‧ cut-off filter

160‧‧‧ Controller

A, B, C, D‧‧‧ areas

The exemplary embodiments may be understood in more detail by the following description in conjunction with the accompanying drawings in which: FIG. 1 is a schematic diagram illustrating a laser processing apparatus in accordance with an exemplary embodiment.

FIG. 2 is a view illustrating a structure of a laser processing apparatus according to an exemplary embodiment.

(a) and (b) of FIG. 3 are views illustrating that the photographing unit adjusts the magnification according to the substrate processing work according to an exemplary embodiment.

(a) and (b) of FIG. 4 are views illustrating that the photographing unit adjusts the magnification according to the fineness of the pattern on the substrate, according to an exemplary embodiment.

FIG. 5 is a flowchart illustrating a laser processing method with respect to a substrate, according to an exemplary embodiment.

Hereinafter, specific embodiments will be described in detail with reference to the accompanying drawings. However, the invention may be embodied in different forms and should not be construed as being limited to the embodiments set forth herein. Rather, the embodiments are provided so that this disclosure will be thorough and complete, and the scope of the invention will be fully conveyed by those skilled in the art. In the figures, the dimensions of layers and regions are exaggerated for clarity of the description. The same reference numerals in the drawings denote the same elements.

FIG. 1 is a schematic diagram illustrating a laser processing apparatus according to an exemplary embodiment. FIG. 2 is a view illustrating a structure of a laser processing apparatus according to an exemplary embodiment. (a) and (b) of FIG. 3 are views illustrating that the photographing unit adjusts the magnification according to the substrate processing work according to an exemplary embodiment. (a) and (b) of FIG. 4 are views illustrating that the photographing unit adjusts the magnification according to the fineness of the pattern on the substrate, according to an exemplary embodiment. Figure 5 It is a flowchart showing a laser processing method with respect to a substrate according to an exemplary embodiment.

Referring to FIG. 1 or 2, a laser processing apparatus 100 according to an exemplary embodiment is a laser apparatus for processing a substrate 10 and includes a laser unit 110 that generates a laser beam and separates the laser beam; a scanner unit 130, comprising a plurality of scanners that adjust a propagation direction of the laser beam and providing a transmission path of the laser beam; a guiding unit 120 disposed between the laser unit 110 and the scanner unit 130 to separate the separated lightning The beam of light is directed to the scanner; an illumination unit 140 that illuminates the laser beam passing through the scanner unit 130 on the substrate 10; and a camera unit 150 that takes a picture of the substrate 10. In other words, the laser processing apparatus 100 may include the laser unit 110, the laser guiding unit 120, the scanner unit 130, the illumination unit 140, and the camera unit 150.

At this time, the laser processing apparatus 100 may be a device that repairs a defect of a pattern formed on the substrate 10. For example, the defect determination reference with respect to the substrate 10 may be the number of defective cells included in the substrate 10. Defective cells can be classified into bright cells and dark cells, and the tolerance of bright cells is more stringent than that of dark cells. Therefore, the bright unit is made dark to improve the yield of the substrate. Therefore, when the bright unit is darkened by impurities to repair the substrate 10, the black matrix material is melted by irradiating the laser thereon, and the bright unit can be darkened by guiding the molten black matrix material toward the impurities. The present invention is not limited to this, but can be applied to various laser processes.

When the substrate 10 is processed, the substrate 10 is placed on the stage 1. Although the laser processing apparatus 100 is supported by a gantry (not shown) to be moved, the laser processing apparatus 100 processes the substrate 10 on the platform 1. Meanwhile, when the platform 1 is movable, the platform 1 below the laser processing apparatus 100 moves the substrate 10 to the laser irradiation thereto. The area makes it possible to perform substrate processing. The present invention is not limited thereto, but the processing of the substrate 10 can be performed by moving the substrate 10 or the laser processing apparatus 100 by various methods.

The laser unit 110 can simultaneously oscillate laser beams having different wavelengths by using one source. The laser unit 110 includes a laser generator (not shown) that generates a laser beam and a laser oscillator (not shown) that separates the generated laser beam to oscillate laser beams having different wavelengths. For example, in an exemplary embodiment of the invention, an infrared (IR) laser beam (having a wavelength range of approximately 780 nm or longer) is separated into a visible laser beam (having a wavelength of approximately 380 nm to 780 nm) Range) and ultraviolet (UV) laser beams (having a wavelength range of approximately 380 nm or shorter) can simultaneously oscillate three types of laser beams. Therefore, laser beams having different wavelengths can be selectively used. The laser unit 100 is not limited thereto, but may include various laser sources. Further, the kind of the separated laser beam and the number of the oscillated laser beams are not limited thereto, but may be varied.

The guiding unit 120 includes a blocking portion 122 that blocks a propagation path of the laser beam. Further, the guiding unit 120 may include an attenuator 121; a laser mirror 123 that reflects a laser beam passing through the blocking portion 122 to the scanner unit 130; and a size adjuster 124.

The blocking portion 122 is provided with the same number of oscillated laser beams or separated laser beams. For example, in an exemplary embodiment of the present invention, the blocking portion 122 may include a first blocking portion 122a disposed on a propagation path of the infrared laser beam; and a second blocking portion 122b disposed on a propagation path of the visible laser beam And a third blocking portion 122c disposed on a propagation path of the ultraviolet laser beam. When the blocking portion 122 passes the laser beam, the laser beam is directed to the scanner unit 130 to illuminate the substrate 10. When the blocking portion 122 blocks the propagation path of the laser beam, since the laser beam does not reach the scanner unit 130, the laser beam is not irradiated on the substrate 10.

For example, when the pattern on the substrate 10 is made of a metal film, an infrared laser beam or a visible laser beam may be used; when the pattern on the substrate 10 is made of an organic film, an ultraviolet laser beam may be used; and when the substrate When the pattern on 10 is made of an indium tin oxide (ITO) film, a deep ultraviolet (DUV) laser beam (having a wavelength range of 300 nm or shorter) can be used. When the pattern on the substrate 10 is made of a metal thin film and an infrared ray (IR) laser beam is selected, the propagation path of the infrared laser beam can be opened by using the first blocking portion 122a, and can be used by using The second blocking portion 122b and the third blocking portion 122c block the propagation paths of the visible laser beam and the ultraviolet laser beam. In this case, only the infrared laser beam reaches the scanner unit 130 to be irradiated on the substrate 10. As described above, the substrate 10 can be processed by selecting a laser beam according to the material of the pattern on the substrate 10. However, the number of blocking portions 122 provided is not limited thereto, but may vary.

The attenuator 121 may be disposed on a propagation path of the laser beam to adjust an output power of the laser beam oscillated in the laser unit 110. The attenuator 121 is equipped with the same number of oscillated laser beams or separated laser beams. For example, in an exemplary embodiment of the present invention, the attenuator 121 may include a first attenuator 121a disposed between the first blocking portion 122a and the laser unit 110; and disposed at the second blocking portion 122b and the laser unit 110 A second attenuator 121b is disposed between; and a third attenuator 121c disposed between the third blocking portion 122c and the laser unit 110. Thus, in While the laser beam passes through each of the attenuators 121, its output power can also be adjusted.

The laser mirror 123 is disposed between the blocking portion 122 and the scanner unit 130 to guide the laser beam passing through the blocking portion 122 to the scanner unit 130. For example, in an exemplary embodiment of the present invention, the laser mirror 123 may include a first laser mirror 123a disposed between the first blocking portion 122a and a first scanner 131a described later; a second laser mirror 123b between the portion 122b and the second scanner 131b described later; and a second laser beam 123b and a second scanner disposed between the third blocking portion 122c and the second scanner 131b A third laser mirror 123c between 131b. The first laser mirror 123a can guide the infrared laser beam to the first scanner 131a. The second laser mirror 123b and the third laser mirror 123c can guide the visible laser beam and the ultraviolet laser beam to the second scanner 131b. At this time, the third laser mirror 123c may be a half mirror that reflects the ultraviolet laser beam and passes the laser beam reflected by the second laser mirror 123b to pass the laser beam. It is guided to the second scanner 131b. The number or arrangement position and kind of the laser mirrors 123 provided are not limited thereto, but may vary depending on the structure of the laser processing apparatus 100.

The size adjuster 124 can be disposed between the laser mirror 123 and the scanner unit 130. The aforementioned size adjuster 124 is used to adjust the beam size of the laser beam reflected by the laser mirror 123. The size adjuster 124 can be equipped with the same number of scanners 131 as provided. For example, in an exemplary embodiment of the present invention, the size adjuster 124 may include a first size adjuster 124a disposed between the first blocking portion 122a and the first scanner 131a; and a second blocking portion 122b and Between the second scanners 131b or between the third blocking portion 122c and the second scanner 131b The second size adjuster 124b. The elements of the guiding unit 120 are not limited thereto, but may be arranged or combined in different ways for use.

The scanner unit 130 includes a plurality of scanners 131 that adjust the propagation direction of the laser beam, and a relay lens 133 that guides the laser beam passing through the scanner 131 so as to be in the objective lens 141 of the illumination unit 140 described later. Within the scope of identification. Further, the scanner unit 130 may include a focus lens 132 and a scanning mirror 134.

The scanner 131 directs the laser beam with a desired path. The scanner 131 may be a mirror that reflects the laser beam and adjusts the angle of the mirror to freely change the direction of propagation of the laser beam. That is, the scanner 131 can process the substrate 10 by reflecting the laser beam at various angles.

In an exemplary embodiment, the scanner 131 may include a first scanner 131a that adjusts a propagation direction of a laser beam having at least one of wavelengths of a laser beam; and a second scanner 131b whose adjustment has The propagation direction of the laser beam having a wavelength different from the wavelength of the laser beam in the propagation direction is adjusted by the first scanner 131a. Further, at least one of the first scanner 131a or the second scanner 131b may adjust a propagation direction of a plurality of laser beams having different wavelengths.

For example, a coating capable of reflecting an infrared laser beam is formed on the first scanner 131a, and a coating capable of reflecting all of the visible laser beam and the ultraviolet laser beam may be formed on the second scanner 131b. Therefore, when the infrared laser beam is used, the guiding unit 120 can guide the infrared laser beam to the first scanner 131a, and when the visible laser beam or the ultraviolet laser beam is used, the guiding unit 120 can view the visible laser beam. Or the ultraviolet laser beam is directed to the second scanner 131b.

The wavelength of the laser beam reflected by the coating formed on the scanner 131 The scope is limited. That is, since the wavelength difference between the infrared laser beam and the ultraviolet laser beam is large, the infrared laser beam and the ultraviolet laser beam may not be reflected by one coating, but the visible laser beam and ultraviolet rays are visible. The wavelength difference between the laser beams is relatively small, so that the visible laser beam and the ultraviolet laser beam may be reflected by one coating. Therefore, when laser beams having very different wavelengths are selectively used, a plurality of scanners 131 can be provided to adjust the propagation path of the laser beams. Furthermore, since one scanner can reflect a plurality of laser beams having slightly different wavelengths, the number of scanners provided can be reduced as compared with the case of sufficiently providing a scanner that reflects the laser beams according to the respective wavelengths, This leads to a simplified device. The number of scanners 131 is not limited thereto, but the number of scanners provided may vary depending on the wavelength difference of the laser beam used.

The focus lens 132 is disposed between the guiding unit 120 and the scanner 131. The focus lens 132 is disposed so as to be movable upward and downward, and the focus lens can be moved up and down to adjust the focus size of the light beam on the substrate. That is, the focusing lens 132 is used to convert the laser beam reflected by the laser mirror 134 into a fine laser beam suitable for processing. The focus lens 132 can be equipped with the same number of scanners 131 as provided. For example, in an exemplary embodiment of the present invention, the focus lens 132 may include a first focus lens 132a disposed between the guiding unit 120 and the first scanner 131a, and disposed in the guiding unit 120 and the second scanner 131b. A second focusing lens 132b.

The relay lens 133 causes a laser beam reflected by the scanner 131 such that the reflected laser beam does not diverge but propagates accurately in the desired direction. That is, the relay lens 133 allows the laser beam passing through the scanner 131 to be within the incident range of the objective lens 141 described later. Generally, the laser light reflected by the scanner 131 The beam is incident directly on the objective lens 141. Therefore, a space in which the photographing unit 150 to be described later is disposed may not be formed due to physical restrictions between the scanner 131 and the objective lens 141. However, in the exemplary embodiment of the present invention, since a space is formed between the scanner 131 and the objective lens 141, the relay lens 133 may allow the laser beam reflected by the scanner 131 despite the increase in the distance therebetween. Within the recognition range of the objective lens 141, a space in which the camera unit 150 is disposed may be formed.

Further, the relay lens 133 may be provided with the same number of scanners 131 as provided. For example, in an exemplary embodiment of the present invention, the relay lens 133 may include a first relay lens 133a disposed between the first scanner 131a and the objective lens 141, and disposed in the second scanner 131b and the objective lens 141. A second relay lens 133b. Therefore, each of the relay lenses 133 guides the laser beam reflected by the scanner 131 to the incident range of the objective lens 141.

Scanning mirror 134 is used to reflect the laser beam in scanner 130. For example, in an exemplary embodiment of the present invention, the scanning mirror 134 may include a first scanning mirror 134a disposed between the guiding unit 120 and the first scanner 131a; disposed between the guiding unit 120 and the second scanner 131b. a second scanning mirror 134b; and a third scanning mirror 134c disposed between the second scanner 131b and the second relay lens 133b. The first scanning mirror 134a and the second scanning mirror 134b may respectively reflect the laser beams passing through the guiding unit to the first scanner 131a and the second scanner 131b. In addition, the third scanning mirror 134c may reflect the laser beam reflected by the second scanner 131b to the second relay lens 131b. However, the number or placement position of the scanning mirrors 134 is not limited thereto, but may vary depending on the structure of the laser processing apparatus 100. Further, the elements of the scanner unit 130 are not limited thereto, but may be disposed and combined in different manners for use.

The illumination unit 140 includes an objective lens 141 that focuses the laser beam onto the substrate 10. The objective lens 141 can compress the incident laser beam into a laser beam having a high energy density. Here, the laser beam passing through the scanner unit 130 is compressed by the objective lens 141 and focused on the substrate 10, thereby processing the substrate 10. The objective lens 141 is not limited thereto, but may be one of a variety of lenses capable of irradiating a laser beam onto the substrate 10.

The camera unit 150 is disposed between the relay lens 133 and the objective lens 141. The camera unit 150 includes a camera 151 that photographs the substrate 10; an illuminator 153 that illuminates the substrate 10; and an autofocuser 154 that corrects the focus of the camera 151. Further, the camera unit 150 may include a cut filter 156, an imaging unit 152, and a photographic mirror 155.

A charge-coupled device (CCD camera) can be used as the camera 151. The camera 151 photographs the processing of the substrate 10 on the stage 1 or the substrate 10. That is, when the illuminator 153 generates light, the illumination light is guided to the substrate 10, and the illumination light reflected by the substrate 10 is guided to the camera 151 by the imaging unit 152, so that the substrate 10 is photographed. Further, the photographic magnification of the camera 151 with respect to the substrate 10 can be adjusted. Therefore, although a problem occurs when the substrate 10 is processed, since the operator can monitor the substrate 10 in an instant, the operator can immediately check the generated problem to take action. The present invention is not limited to this, but a variety of cameras can be used.

The autofocuser 154 corrects the focus of the photographing unit 150 such that the focus of the photographing unit 150 is located on the surface of the substrate 10 to be photographed. That is, when the surface of the substrate 10 is uneven and thus the photographic area of the substrate 10 is moved, the photographic area before the movement and the photographic area after the movement have different heights, so that the focus of the photographing unit 150 can be changed. Therefore, since the auto focus 154 corrects the camera unit 150 The focus is so that the operator can easily monitor the substrate 10 by the camera unit 150.

The cut filter 156 is disposed between the camera 151 and the imaging unit 152 and serves to cut off the wavelength of the laser beam that can enter the camera 151.

The photo mirror 155 may include a first photo mirror 155a between the camera 151 and the objective lens 141 or between the first relay lens 133a and the objective lens 141; disposed between the third photo mirror 155c and the objective lens 141 described later or a second photo mirror 155b between the first photo mirror 155a and the objective lens 141; disposed between the fourth photo mirror 155d and the second photo mirror 155b described later or the second relay lens 133b and the second photo mirror 155b A third photographic mirror 155c; and a fourth photographic mirror 155d disposed between the third photographic mirror 155c and the illuminator 153 or between the third photographic mirror 155c and the autofocuser 154.

The first photo mirror 155a may guide light emitted from the illuminator 153 and then reflected by the substrate 10 to the camera 151, and guide the laser beam passing through the first relay lens 133a to the objective lens 141. The second photo mirror 155b may guide the laser beam passing through the first mirror 155a to the objective lens 141, or reflect the laser beam passing through the third mirror 155c or the illumination light reflected by the third mirror 155c to Objective lens 141.

The third photo mirror 155c may guide the laser beam passing through the second relay lens 133b to the second mirror 155b or reflect the illumination light reflected by the fourth mirror 155d to the second mirror 155b. The fourth mirror 155d may reflect the illumination light of the illuminator 153 to the third mirror 155c or direct the light reflected by the substrate 10 to the autofocuser 154. However, the number or position of the photo mirrors 155 is not limited thereto, but may vary depending on the structure of the laser processing apparatus 100. Further, the elements of the camera unit 150 are not limited thereto, but may be disposed and combined in different ways for use.

The controller 160 operates the laser unit 110 and according to the material of the substrate 10 or The material of the pattern on the substrate 10 controls the guiding unit 120. Further, the controller 160 may select the scanner 131 for use in the scanner unit 130 according to the wavelength of the laser beam passing through the guiding unit 120.

For example, the laser unit 110 can simultaneously oscillate laser beams having different wavelengths by the controller 160, for example, a visible laser beam and an ultraviolet laser beam. When the pattern on the substrate is made of Indium Tin Oxide (ITO), an ultraviolet laser beam of a laser beam can be selected. That is, the controller 160 can operate the first blocking portion 122a on the propagation path of the infrared laser beam and the second blocking portion 122b on the propagation path of the visible laser beam in the guiding unit 120 to block its propagation path . Further, the controller 160 may open the third blocking portion 122c on the propagation path of the ultraviolet laser beam to guide the ultraviolet laser beam to the second scanner 131b capable of reflecting the ultraviolet laser beam, and thus select the to be used Scanner 131.

The photographic magnification of the camera 151 can be adjusted by the controller 160 according to the type of work. For example, when the substrate 10 is inspected, the photographic magnification with respect to the substrate 10 can be automatically increased by approximately 5 to 10 times, and when the substrate 10 is processed, the photographic magnification with respect to the substrate 10 can be automatically increased by approximately 10 to 50 times. . The inspection of the substrate 10 may be to search for defects on the substrate 10 without irradiating the laser beam onto the substrate 10, and the processing of the substrate 10 may be performed by, for example, repairing by irradiating the laser beam onto the substrate 10. . Referring to (a) and (b) of FIG. 3, the area A in which the substrate 10 is photographed when the substrate 10 is inspected and the area B in which the substrate is photographed when the substrate 10 is processed may be different from each other. That is, at the time of inspection, since a relatively wide area is photographed in the case where the substrate 10 is photographed at a low magnification, the operator can be faster than the case of taking a picture with a relatively increased magnification at a relatively large magnification. The defect area on the substrate 10 is quickly searched. Meanwhile, when the substrate 10 is processed by the laser beam L, it is possible to take a picture of a narrow area of the substrate 10 with a greatly increased magnification. Therefore, the process of performing the work can be observed in detail, and the precise work can be performed. The present invention is not limited thereto, but this type of work may be different, and the photographic magnification of the camera 151 adjusted according to the type of work may vary.

The controller 160 can automatically adjust the photographic magnification of the camera 15 photographing the substrate 10 in accordance with the fineness of the pattern on the substrate 10. For example, referring to (a) and (b) of FIG. 4, the region C in which the complicated fine pattern of the substrate 10 is photographed and the region D in which the simple fine pattern is photographed may be different from each other. That is, since a large pattern is formed on the region C, the fineness of the larger pattern may be relatively simple, and since a fine pattern is formed on the region D, the fineness of the fine pattern may be relatively complicated. When the fineness of the pattern is simple, a wider area of the substrate 10 can be photographed, and when the fineness of the pattern is complicated, a narrower area can be photographed at a higher magnification. Therefore, the photographic magnification can be automatically adjusted in accordance with the fineness of the pattern on the substrate to perform precise work.

Further, the controller 160 can automatically adjust the photographic magnification of the camera 15 in accordance with the fineness and work of the pattern on the substrate. For example, when the fineness of the pattern on the substrate 10 is simple, the photographic magnification can be adjusted by 5 to 10 times when the substrate 10 is inspected, and the photographic magnification can be adjusted by 20 to 35 times when the substrate 10 is processed. When the fineness of the pattern on the substrate 10 is complicated, the photographic magnification can be adjusted 10 to 20 times when the substrate 10 is inspected, and the photographic magnification can be adjusted 35 to 50 times when the substrate 10 is processed. Therefore, the photographic magnification is automatically adjusted in accordance with the substrate and the work, which results in an improved operation execution speed and performing precise work. However, the photographic magnification of the substrate 10 is not limited thereto, but may vary.

A laser processing method according to an exemplary embodiment will be described below.

Referring to FIG. 5, a laser processing method according to an exemplary embodiment is a laser processing method of processing a substrate by laser and includes: generating a laser beam (S100); selecting a wavelength of the laser beam (S200); photographing the substrate Laser light is irradiated on the substrate to process the substrate and monitor the substrate (S300); and the laser processing is stopped when a defect is generated during processing of the substrate (S400). At this time, the processing of the substrate may include repairing defects of the pattern formed on the substrate.

When the controller 160 operates the laser unit 110, the laser unit 110 generates a laser beam and separates the generated laser beam to simultaneously oscillate the separated laser beam having different wavelengths. For example, in an exemplary embodiment, the infrared laser beam, the visible laser beam, and the ultraviolet laser beam can oscillate simultaneously in one source.

Next, the controller 160 may select a laser beam that is used according to the material of the substrate 10 and the material of the pattern on the substrate 10. That is, when the material of the pattern on the substrate (10) is metal, the first wavelength laser beam can be selected, and when the material is an organic material or indium tin oxide (ITO), it can be selected. A second wavelength laser beam having a wavelength shorter than a wavelength of the first wavelength laser beam. For example, when the material of the pattern on the substrate 10 is metal, the infrared laser beam is selected to be used, and the controller 160 can control the blocking portion 122 to open the propagation path of the infrared laser beam and turn off the visible laser beam and the ultraviolet laser beam. Propagation path. The infrared laser beam passing through the first blocking portion 122a can be reflected by the first laser mirror 123a and guided to the first scanner 131a. At this time, the controller 160 can control the operation of the attenuator 121 and the size adjuster 124 to adjust the output power or size of the laser beam to be suitable for operation.

Meanwhile, when the material of the pattern on the substrate 10 is indium tin For oxide, ITO, an ultraviolet laser beam having a wavelength shorter than the wavelength of the infrared laser beam can be selected. In this case, the controller 160 may control the blocking portion 122 to open the propagation path of the ultraviolet laser beam and turn off the propagation paths of the infrared laser beam and the visible laser beam. Therefore, the ultraviolet laser beam can be guided to the second scanner 131b. The present invention is not limited thereto, and a laser beam having a plurality of wavelengths may be selected depending on the material of the pattern on the substrate 10.

The type of laser beam that can be reflected by the scanner 131 may be limited. Therefore, when a plurality of laser beams are used, a plurality of scanners 131 can be provided to reflect a plurality of laser beams. In addition, depending on the wavelength of the laser beam, the laser beam is directed to a scanner 131 capable of reflecting the laser beam. That is, it is necessary to selectively use the scanner 131 in accordance with the wavelength of the laser beam. The scanner 131 directs the laser beam with a desired path. The controller 160 can adjust the angle of the scanner 131 to freely change the direction of propagation of the laser beam reflected by the scanner 131. That is, the scanner 131 can reflect the angle of the laser beam at various angles to perform various laser processing operations, for example, repairing defects existing on the substrate 10. Additionally, controller 160 can adjust the position of focus lens 132 to convert the laser beam into a fine laser beam suitable for processing.

The laser beam reflected by the scanner 131 is guided by the relay lens 133 so as to be disposed within the incident range of the objective lens 141 of the illumination unit 140. The objective lens 141 compresses the laser beam and focuses the laser beam on the substrate 10, thereby processing the substrate 10.

The camera unit 150 can take a picture of the processing of the substrate 10 or the substrate 10. The camera unit 150 can start taking pictures of the substrate 10 under the following conditions: 1) before the laser beam is generated, 2) when the laser beam is irradiated on the substrate 10, or 3) After the substrate 10 is processed. That is, the photographing of the substrate 10 and the processing of the substrate 10 can be performed by the described order or by a different order. Therefore, monitoring of the substrate 10 can be initiated when the operator wants to monitor the substrate 10.

The controller 160 can adjust the photographic magnification of the camera 151 according to the fineness of the pattern on the substrate. For example, when photographing an area in which the fineness of the pattern on the substrate 10 is complicated, the photographing magnification can be automatically increased to perform precise work. Meanwhile, when photographing a unit area in which the fineness of the pattern on the substrate 10 is simple, the photographing magnification is increased and less than the case where the pattern area is enlarged, which results in allowing a wider area to be monitored.

The controller 160 can adjust the photographic magnification according to the operation with respect to the substrate 10. For example, when inspecting the substrate 10, the controller 160 may adjust the magnification to view a wide area of the substrate 10, and when processing the substrate 10, the controller 160 may adjust the magnification to view a narrow area of the substrate 10. Therefore, when the substrate 10 is inspected, defects of the substrate 10 can be quickly detected, and when the substrate 10 is processed, precise work can be performed.

Further, the controller 160 can automatically adjust the photographic magnification of the camera 151 according to the fineness and work of the pattern on the substrate. For example, when the fineness of the pattern on the substrate 10 is simple, the photographic magnification can be adjusted by about 5 to 10 times when the substrate 10 is inspected, and the photographic magnification can be adjusted by about 20 to 35 times when the substrate 10 is processed. For example, when the fineness of the pattern on the substrate 10 is complicated, the photographic magnification can be adjusted by about 10 to 20 times when the substrate 10 is inspected, and the photographic magnification can be adjusted by about 35 to 50 times when the substrate 10 is processed. Therefore, the photographic magnification is automatically adjusted in accordance with the substrate and the work, which results in improved work execution speed and precision work. The photographic magnification with respect to the substrate 10 is not limited to this, but may be Variety.

When the substrate 10 is in an incorrect position, or incorrect coordinate information about a defect of the pattern of the substrate 10 is input into the laser processing apparatus 100, the laser erroneously illuminates on the defect-free area, making it possible to process the substrate. A failure occurred during the period. Since the operator monitors the substrate 10 by the camera unit 150, the operator can quickly check the erroneous operation. Therefore, the operator can stop the laser processing. Subsequently, the substrate 10 can be placed in the correct position, and a laser beam can be illuminated on the substrate 10 to reprocess the substrate 10. Therefore, when a failure occurs during the processing of the substrate, the failure can be quickly processed, which causes the defective portion to be reduced and the processing efficiency to be improved.

According to an exemplary embodiment, since the camera unit is provided, the operator can monitor the processing of the substrate and the substrate in real time. Therefore, even when a failure occurs during the processing of the substrate, the operator can monitor the substrate on time to handle the failure. Therefore, work efficiency can be improved. Further, the photographic magnification of the photographic unit can be adjusted according to the fineness of the substrate pattern or the type of work. Therefore, when it is necessary to repair the minute portion, precise work can be performed by increasing the photographic magnification.

Further, according to an exemplary embodiment, the wavelength of the laser beam may be selectively used. Therefore, since the wavelength of the laser beam can be selected according to the material of the pattern on the substrate or the substrate, the operation can be performed stably. Furthermore, since a laser beam having a plurality of wavelengths is selectively used, a pattern of a plurality of substrates or substrates can be repaired in one device. Therefore, the device can be simplified.

Although the laser processing apparatus and method have been described with reference to the specific embodiments, it is not limited thereto. Accordingly, it will be apparent to those skilled in the art that various modifications and changes can be made in the s 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。

100‧‧‧ Laser processing equipment

110‧‧‧Laser unit

120‧‧‧Guide unit

130‧‧‧Scanner unit

140‧‧‧Irradiation unit

150‧‧‧Photo unit

160‧‧‧ Controller

Claims (16)

A laser processing apparatus for processing a substrate, the laser processing apparatus comprising: a laser unit configured to generate a laser beam and separate the laser beam; a scanner unit equipped to adjust the mine a plurality of scanners that emit a direction of propagation of the beam, and configured to provide a propagation path of the laser beam; a guiding unit disposed between the laser unit and the scanner unit and configured to select Directly directing the separated laser beam to the scanner; an illumination unit configured to illuminate the laser beam passing through the scanner unit on the substrate; and a camera unit It is configured to take a picture of the substrate. A laser processing apparatus for processing a substrate according to claim 1, wherein the scanner unit includes a first scanner configured to adjust at least one of wavelengths having the laser beam a direction of propagation of the laser beam of the wavelength; and a second scanner configured to adjust a Ray having a wavelength different from a wavelength of the laser beam by the first scanner to adjust the direction of propagation Shoot the beam. A laser processing apparatus for processing a substrate according to claim 2, wherein at least one selected from the first scanner and the second scanner adjusts a plurality of laser beams having different wavelengths . A laser processing apparatus for processing a substrate according to claim 3, wherein the guiding unit comprises: a blocking portion provided to be identical to the separated laser beam a number and configured to open and close a propagation path of the laser beam; and a laser mirror provided between the blocking portion and the first scanner and the blocking portion Between the second scanners and configured to direct a laser beam passing through the blocking portion to the scanner. A laser processing apparatus for processing a substrate according to claim 1, wherein the illumination unit comprises an objective lens configured to focus the laser beam onto the substrate. A laser processing apparatus for processing a substrate according to claim 1, wherein the camera unit includes a camera configured to photograph the substrate; an illuminator configured to illuminate the substrate; An autofocuser configured to correct the focus of the camera. A laser processing apparatus for processing a substrate according to any one of claims 1 to 6, further comprising a controller configured to operate the laser unit Controlling the operation of the guiding unit according to the material of the substrate or the material of the pattern on the substrate, and selecting a scanner to be used by the scanner unit according to the wavelength of the laser beam passing through the guiding unit. A laser processing apparatus for processing a substrate according to claim 7, wherein the controller adjusts a photographic magnification of the camera according to a fineness of the pattern on the substrate. A laser processing apparatus for processing a substrate according to claim 8, wherein the photographic magnification of the camera is increased by about 5 to 20 times when the substrate is inspected, and When the controller processes the substrate, the phase The photographic magnification of the machine is increased by approximately 20 to 50 times. A laser processing method for processing a substrate by using a laser, the laser processing method comprising: generating a laser beam; selecting a wavelength of the laser beam; photographing the substrate, illuminating the laser beam The substrate is processed to process the substrate, and the substrate is monitored; and when a failure occurs during the processing of the substrate, the laser processing is stopped. A laser processing method for processing a substrate by using a laser according to claim 10, wherein the selection of the wavelength of the laser beam includes a pattern according to the substrate or the substrate The material selects the wavelength of the laser beam. A laser processing method for processing a substrate by using a laser according to claim 10, wherein the photographing of the substrate includes adjusting the photographic magnification according to a fineness of a pattern on the substrate. A laser processing method for processing a substrate by using a laser according to claim 10, wherein the photographing of the substrate includes adjusting the photographic magnification according to a type of operation with respect to the substrate. A laser processing method for processing a substrate by using a laser according to claim 10, wherein the stop of the laser processing includes an adjustment when a failure occurs during the processing of the substrate The position of the substrate is described and the substrate is reprocessed. Processing a substrate by using a laser as described in claim 11 a laser processing method, wherein when the material of the pattern on the substrate is metal, a first wavelength laser beam is selected, and when the material of the pattern on the substrate is indium tin oxide A second wavelength laser beam having a wavelength shorter than a wavelength of the first wavelength laser beam is selected. A laser processing method for processing a substrate by using a laser according to any one of claims 10 to 15, wherein the processing of the substrate includes repairing formation on the substrate Defects of the pattern.