TWI567374B - Defect observation device and laser processing apparatus including the same - Google Patents

Description

Defect observation device and laser processing apparatus including the same

The present invention relates to a defect observation apparatus and a laser processing apparatus including the same, and, more particularly, to a defect capable of enhancing visibility of defects on a substrate by selectively utilizing the color of illumination light An observation device and a laser processing apparatus including the defect observation device.

In general, various patterns such as circuits are formed on a flat panel display such as a semiconductor wafer or a liquid crystal display (LCD). For example, the flat panel display includes an array substrate, an opposite substrate, a liquid crystal layer, and the like. Wherein, a plurality of pixel electrodes arranged in a matrix form, a plurality of scan lines disposed along a row of the plurality of pixel electrodes, and a plurality of signals disposed along a row of the plurality of pixel electrodes are formed on the array substrate line.

Defects such as overlapping of electrical signal lines may occur during the manufacture of the array substrate. If a defect occurs, the image may not be displayed properly. Therefore, it is necessary to cut off the overlapping signal lines to prevent the respective signal lines from overlapping each other. This process is called "repair." Various substrates or patterns on which defects occur can be repaired.

Usually, it is determined whether or not repair is performed by observing a pattern formed on a substrate. That is, illumination light is emitted to the top surface of the substrate before the repair is performed to confirm the defects of the pattern. Although the illumination light is emitted by an inspection device, the illumination light may have a particular color or wavelength predetermined according to the inspection device. However, there are many defects that cannot be easily seen with an illumination light. Therefore, it is difficult to check the defects of the pattern and thus it is difficult to perform repair, thereby reducing work efficiency.

[Prior Art Literature] [Patent Literature]

(Patent Document 1) Korean Patent Application Publication No. 2012-0043850.

The present invention provides a defect observation device capable of selectively utilizing the color of illumination light and a laser processing apparatus including the defect observation device.

The present invention also provides a defect observation apparatus capable of improving visibility of defects to improve work efficiency and a laser processing apparatus including the same.

According to an exemplary embodiment, there is provided a defect observation device for observing a surface of a substrate, the defect observation device comprising: a camera for photographing the substrate; and an imaging system for forming a surface of the substrate on the camera And an illumination system for selecting at least one of a plurality of illumination lights having mutually different wavelengths to emit illumination light to the substrate.

The defect viewing device may include an autofocus system for correcting a focus of photographing the substrate.

The lighting system may include a first lighting unit, a second lighting unit, and a a third lighting unit for generating illumination light having a first wavelength, wherein the second illumination unit is configured to generate illumination light having a second wavelength, and the third illumination unit is configured to generate Illuminating light having a third wavelength for selecting one of the illumination lights or combining at least two illumination lights to transmit or reflect the illumination light in one direction.

The combining unit may include a first coated surface and a second coated surface, one surface of the first coated surface reflecting the illumination light having the first wavelength and the other surface transmitting the second wavelength Illuminating light, and one surface of the second coated surface reflects the illumination light having the third wavelength and the other surface transmits the illumination light having the second wavelength.

The combining unit may include a third coating surface and a fourth coating surface, one surface of the third coating surface reflecting the illumination light having the first wavelength and the other surface transmitting the second wavelength Illumination light, and one surface of the fourth coated surface reflects the illumination light having the third wavelength and the other surface transmits the illumination light having the first wavelength and the second The illumination of the wavelength.

The first illumination unit, the second illumination unit, and the third illumination unit generate visible light, and the illumination system can include a fourth illumination unit for generating a wavelength different from the visible light The wavelength of the illumination light.

The defect observing device may include a first aperture, a second aperture, and a collecting lens, wherein the first aperture is used to adjust a size of the illumination light combined in the combining unit, and the second aperture is used for adjusting a size of the illumination light generated by the fourth illumination unit, the concentrating lens for collecting the illumination light selected or combined in the combination unit or a place generated by the fourth illumination unit Said lighting.

According to another exemplary embodiment, there is provided a laser processing apparatus for processing a substrate, the laser processing apparatus comprising: a laser unit for generating a laser beam; and a scanner unit for adjusting the Generating a path of travel of the laser beam; an objective lens for illuminating the laser beam whose path has been adjusted by the scanner unit; and defect viewing means for selecting a plurality of wavelengths having mutually different wavelengths At least one of the illumination lights and the illumination light is emitted to the substrate to view the substrate.

The laser processing apparatus may include a beam adjustment unit disposed between the laser unit and the scanner unit to guide the laser generated by the laser unit Beam, thereby adjusting the size of the laser beam.

The defect observation device may include an illumination system to emit a plurality of illumination lights, and the illumination system includes a first illumination unit, a second illumination unit, a third illumination unit, and a combination unit, the first illumination unit for generating Illuminating light having a first wavelength for generating illumination light having a second wavelength, said third illumination unit for generating illumination light having a third wavelength, said combining unit for selecting One of the illumination lights or a combination of at least two illumination lights to transmit or reflect the illumination light in one direction.

The laser processing apparatus may include a control unit coupled to the defect observation device to determine a location to be emitted by the illumination system according to the substrate or according to a color of a pattern formed on the substrate The color wavelength of the illumination light.

The process of processing the substrate may include a process of repairing defects of a pattern formed on the substrate.

1‧‧‧ platform

10‧‧‧Substrate

100‧‧‧Laser processing equipment

110‧‧‧Laser unit

120‧‧‧Ball adjustment unit

121‧‧‧Attenuator

122‧‧‧Blocking parts

123‧‧‧Dimensional adjustment parts

124‧‧‧Laser mirror

130‧‧‧Scanner unit

131‧‧‧Scanner

132‧‧‧focus lens

133‧‧‧Laser relay lens

134‧‧‧Scanner mirror

140‧‧‧ objective lens

150‧‧‧Defect viewing device

151‧‧‧ camera

152‧‧‧ cut-off filter

153‧‧‧ imaging system

154‧‧‧Auto Focus System

155‧‧‧Lighting system

155a‧‧‧First lighting unit

155b‧‧‧Second lighting unit

155c‧‧‧3rd lighting unit

155d‧‧‧ combination unit

155d’‧‧‧ combination unit

155e‧‧‧Lighting relay lens

155f‧‧‧Fourth lighting unit

155g‧‧‧second aperture

155h‧‧‧ concentrating lens

155i‧‧‧first illumination mirror

155j‧‧‧second illumination mirror

155k‧‧‧first aperture

156‧‧‧Photographing mirror

156a‧‧‧first shooting mirror

156b‧‧‧second shooting mirror

156c‧‧‧ third shooting mirror

A1‧‧‧ first coated surface

A2‧‧‧Second coated surface

B1‧‧‧first incident surface

B2‧‧‧second incident surface

B3‧‧‧ third incident surface

B4‧‧‧ emitting surface

C1‧‧‧ third coated surface

C2‧‧‧4th coated surface

D1‧‧‧first incident surface

D2‧‧‧second incident surface

D3‧‧‧ third incident surface

D4‧‧‧ emitting surface

The exemplary embodiments can be understood in more detail by reading the following description in conjunction with the drawings.

FIG. 1 is a conceptual diagram of a laser processing apparatus in accordance with an example embodiment.

FIG. 2 is a view illustrating a structure of a laser processing apparatus according to an exemplary embodiment.

FIG. 3 is a view illustrating a structure of a combination unit and a lighting system according to an exemplary embodiment.

FIG. 4 is a view illustrating a structure of a combination unit and a lighting system according to another exemplary embodiment.

Hereinafter, specific embodiments will be described in detail with reference to the accompanying drawings. However, the invention may be embodied in many different forms and should not be construed as being limited to the embodiments described herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete. In the figures, the dimensions of layers and regions are exaggerated for clarity of illustration. The same reference numerals are used throughout the drawings to refer to the same elements.

1 is a conceptual diagram of a laser processing apparatus according to an exemplary embodiment, FIG. 2 is a view illustrating a structure of a laser processing apparatus according to an exemplary embodiment, and FIG. 3 is a combination unit and a lighting system illustrating an example according to an example embodiment A view of the structure, and FIG. 4 is a structural diagram illustrating a structure of a combination unit and an illumination system according to another exemplary embodiment.

Referring to FIG. 1 or FIG. 2, a laser processing apparatus 100 according to an exemplary embodiment is a laser apparatus for processing a substrate 10, which includes a laser unit 110, a scanner sheet Element 130, objective lens 140, and defect viewing device, laser unit 110 is used to generate a laser beam, scanner unit 130 is used to adjust the travel path of the generated laser beam, and objective lens 140 is used to pass the path of travel The laser beam adjusted by the scanner unit 130 is irradiated onto the substrate 10 for selecting at least one of a plurality of kinds of illumination lights having mutually different wavelengths and emitting the illumination light onto the substrate 10. To observe the substrate 10. Further, the laser processing apparatus 100 may further include a beam adjustment unit 120 for changing the size of the laser beam, and a control device unit (not shown) connected to the defect observation device 150. The laser processing apparatus 100 may be a device for repairing defects of a pattern formed on the substrate 10, but is not limited thereto. Alternatively, the laser processing apparatus 100 in accordance with an exemplary embodiment can be used in a variety of laser processing processes.

When the substrate 10 is processed, the substrate 10 is placed on the stage 1. In a state in which the laser processing apparatus 100 is supported by a gantry (not shown), the laser processing apparatus 100 processes the substrate 10 on the stage 1 while moving. Alternatively, when the stage 1 is movable, the stage 1 can move the substrate 10 to the area irradiated with the laser to move the substrate 10 while moving on the lower side of the laser processing apparatus 100, but is not limited thereto. Alternatively, substrate 10 or laser processing apparatus 100 can be moved in various ways to process substrate 10.

The laser unit 110 generates a laser beam and oscillates the laser beam to perform a laser processing process such as repair.

The beam adjustment unit 120 may be disposed between the laser unit 110 and the scanner unit 130. The beam adjustment unit 120 may vary the size of the laser beam generated by the laser unit 110 to direct the laser beam to the scanner unit 130. The beam adjustment unit 120 may include an attenuator 121, a blocking member 122, and a laser reflection. A mirror mirror 124 and a size adjustment member 123.

The attenuator 121 is disposed in the moving path of the laser beam to adjust the output of the laser beam oscillating in the laser unit 110. Thus, the laser beam is adjusted as it passes through the attenuator 121.

The blocking member 122 is disposed in the moving path of the laser beam to open and close the moving path of the laser beam. For example, when the blocking member 122 opens the path of movement of the laser beam to allow the laser beam to pass through, the laser beam is directed to the scanner unit 130 and then onto the substrate 10. On the other hand, when the blocking member 122 closes the moving path of the laser beam, the laser beam does not reach the scanner unit 130 and thus does not illuminate onto the substrate 10. Therefore, the blocking member 122 can function as a switching function to activate/deactivate a laser processing process such as repair.

A sizing component 123 can be disposed between the blocking component 122 and the scanner unit 130 to adjust the size of the laser beam reflected by the laser mirror 124. Therefore, the laser beam changes size while passing through the resizing unit 123.

The laser mirror 124 may be disposed between the blocking member 122 and the resizing member 123. The laser mirror 124 can reflect the laser beam passing through the blocking member 122 to the size adjusting member 123, but is not limited thereto. Alternatively, the number and location of the laser mirrors 124 may vary depending on the configuration of the laser processing apparatus 100.

The scanner unit 130 may include a scanner 131, a laser relay lens 133, a focus lens 132, and a scanner mirror 134 for adjusting a travel path of the laser beam, and a laser relay The lens 133 is used to enable the laser beam passing through the scanner 131 to be within the recognition range of the objective lens 140.

Scanner 131 induces the laser beam to the desired path. Scanner 131 can be a mirror for reflecting a laser beam. The laser beam adjusts the angle of the mirror to The direction of travel of the laser beam is varied. That is, the scanner 131 can reflect the laser beam at various angles such that the laser beam processes the substrate 10.

The focus lens 132 may be disposed between the beam adjustment unit 120 and the scanner 131. The focus lens 132 is vertically movable to adjust the size of the laser beam focused on the substrate 10 while moving vertically. That is, the focusing lens 132 can process the laser beam directed by the beam conditioning unit 120 to produce a fine laser beam suitable for processing.

The laser relay lens 133 may be disposed between the scanner 131 and the objective lens 140. The laser relay lens 133 can induce a laser beam such that the laser beam reflected by the scanner 131 does not diffuse but travels exactly in the desired direction. That is, the laser relay lens 133 enables the laser beam passing through the scanner 131 to be within the incident range of the objective lens 140. Therefore, since the space between the scanner 131 and the objective lens 140 is formed despite the scanner 131 being away from the objective lens 140, the laser relay lens 133 causes the laser beam reflected by the scanner 131 to be within the recognition range of the objective lens 140, thus A space for mounting the defect observation device 150 can be formed.

A scanner mirror 134 can be disposed between the focus lens 132 and the scanner 131. The scanner mirror 134 directs the laser beam passing through the focusing lens 132 to the scanner 131, but is not limited thereto. Alternatively, the number and location of the scanner mirrors 134 may vary depending on the configuration of the laser processing apparatus 100.

The objective lens 140 compresses the laser beam such that the laser beam has a high energy density. The laser beam passing through the scanner unit 130 is compressed by the objective lens 140 and then focused to the substrate 10 to perform a process for processing the substrate 10, but is not limited thereto. Alternatively, various lenses capable of illuminating the laser beam onto the substrate 10 can be used.

The defect observation device 150 may select one of the plurality of illumination lights having mutually different wavelengths or generate two or more illumination lights to combine the illumination lights to emit illumination light having various colors to the substrate 10. That is, the defect observation device 150 may include an illumination system 155 capable of emitting a plurality of illumination lights to select the color of the illumination light emitted to the substrate 10 according to the substrate 10 or according to the color of the pattern formed on the substrate 10. wavelength. When the color wavelength is selected to emit illumination light toward the top surface of the substrate 10, the illumination light may cause a color difference between the normal portion and the defective portion of the pattern. Therefore, the visibility of the defects of the pattern can be improved by the illumination light. Therefore, the defects of the pattern can be quickly detected for repair, thereby improving work efficiency.

A control unit (not shown) may be coupled to the defect observation device 150 and determine the color wavelength of the illumination light emitted by the illumination system 155 (which will be described below) according to the substrate or according to the color of the pattern formed on the substrate 10. For example, the control unit controls the operation of the lighting units 155a, 155b, and 155c, which will be described below. The control unit may activate one of the illumination units 155a, 155b, and 155c to generate illumination light, or activate two or more illumination units 155a, 155b to generate illumination light. Therefore, the selected one kind of illumination light may be emitted, or two or more kinds of illumination lights may be combined with each other in the combination unit 155d to be described below to emit illumination light having various colors. That is, the control unit controls the operations of the illumination units 155a, 155b, and 155c to determine the color of the illumination light.

The shooting mirror 156 may include a first shooting mirror 156a, a second shooting mirror 156b, and a third shooting mirror 156c. The first photographing mirror 156a may be disposed between the camera 151 and the objective lens 140 to reflect the illumination light reflected by the substrate 10 to the camera 151. Here, the photo reflected by the substrate 10 The moving path of the bright light and the moving path of the laser beam reflected by the scanner unit 130 may overlap each other. Thus, one surface of the first photographic mirror 156a can reflect illumination light and direct the illumination light to the camera 151, and the other surface can transmit the laser beam and direct the laser beam to the objective lens 140.

The second shooting mirror 156b may be disposed between the third shooting mirror 156c and the objective lens 140 to reflect the illumination light emitted by the illumination system 155 to the objective lens 140. Here, the moving path of the illumination light emitted by the illumination system 155 and the moving path of the laser beam reflected by the scanner unit 130 may overlap each other. Thus, one surface of the second photographic mirror 156b can reflect illumination light emitted by the illumination system 155 to the objective lens 140, and the other surface can transmit the laser beam and direct the laser beam to the objective lens 140.

The third photographic mirror 156c can be disposed between the autofocus system 154 and the second photographic mirror 156b or between the second photographic mirror 156b and the illumination system 155. One surface of the third photographic mirror 156c may reflect illumination light to the autofocus system 154, and the other surface may transmit illumination light generated by the illumination system 155 and direct the illumination light to the second photographic mirror 156b, but Not limited to this. Alternatively, the number and location of the shooting mirrors 156 may vary depending on the configuration of the laser processing apparatus 100.

Hereinafter, the structure of the defect observation device 150 according to an exemplary embodiment will be described in detail.

Referring to FIG. 2, the defect observation device 150 according to an exemplary embodiment may be a defect observation device for observing the surface of the substrate 10. The defect observation device may include a camera 151 for photographing the substrate 10, an imaging system 153 for facing the surface of the substrate 10 on the camera 151, and an illumination system 155 The image is imaged and illumination system 155 is used to select at least one of a variety of other illumination lights to emit illumination light to substrate 10. Further, the defect observation device 150 may include a cut filter 152, an autofocus system 154, and a photographic mirror 156. Although the defect observation device 150 is provided in the laser processing apparatus 100 according to an exemplary embodiment, the present invention is not limited thereto. For example, the defect observation device 150 may be separately provided to inspect the substrate 10 or in various devices or equipment for processing the substrate 10.

A charge-coupled device (CCD) camera can be used as the camera 151. The camera 151 photographs the process of processing the substrate 10 on the stage 1 or the substrate 10. That is, when the illumination system 155 generates light, the illumination light is induced to the substrate 10, and the illumination light reflected to the substrate 10 can be induced by the imaging system 153 to the camera 151 to photograph the substrate 10.

The autofocus system 154 corrects the focus of the defect viewing device 150 to enable the focus of the defect viewing device 150 to be accurately positioned on the surface of the substrate to be processed. That is, if the substrate has an uneven surface, when the area of the substrate 10 to be photographed is moved, the photographed areas before and after the movement may be different in height, thereby changing the focus of the defect observation device 150. Accordingly, the autofocus system 154 can correct the focus of the defect viewing device 150 to allow the operator to monitor the substrate 10 through the defect viewing device 150.

A cut filter 152 may be disposed between the camera 151 and the imaging system 153 to cut off the wavelength of the laser incident into the camera 151.

Referring to FIG. 3, an illumination system 155 according to an exemplary embodiment includes a first illumination unit 155a, a second illumination unit 155b, a third illumination unit 155c, and a combination unit 155d for generating illumination having a first wavelength. Light, the second illumination unit 155b is for generating illumination light having a second wavelength, the third illumination unit 155c is for generating illumination light having a third wavelength, and the combining unit 155d transmits or reflects the illumination light in one direction One, or combining at least two illumination lights with each other to transmit or reflect the combined light in one direction. Further, the illumination system 155 can include an illumination light relay lens 155e, a fourth illumination unit 155f, a first aperture 155k, a second aperture 155g, a concentrating lens 155h, and illumination mirrors 155i and 155j.

The wavelength can represent a single wavelength or a wavelength within a predetermined range. For example, according to an exemplary embodiment, the first wavelength may be illumination light having a red wavelength (723 nm to 647 nm), and the second wavelength may be illumination light having a green wavelength (575 nm to 492 nm), and The third wavelength may be illumination light having a blue wavelength (492 nm to 455 nm), but is not limited thereto. Alternatively, illumination light having wavelengths of various colors can be used.

The combining unit 155d includes a first coating surface A1 and a second coating surface A2, one surface of the first coating surface A1 reflects illumination light having the first wavelength and the other surface transmits illumination light having the second wavelength, One surface of the second coated surface A2 reflects illumination light having the third wavelength and the other surface transmits illumination light having the second wavelength.

For example, the combining unit 155d can be formed by coupling four triangular prisms in an X-cube manner. The combining unit 155d may include a first incident surface B1 facing the first illumination unit 155a, a second incident surface B2 facing the second illumination unit 155b, a third incident surface B3 facing the third illumination unit 155c, and a facing surface The incident surface B4 of the incident surface B2. Further, the combining unit 155d may further have a first coating surface A1 and a second coating surface A2 disposed in an X structure. However, the invention is not limited to this. Alternatively, a plurality of mirrors in which one surface reflects illumination light and the other surface transmits illumination light may be combined with each other for use.

When the first illumination unit 155a generates illumination light having a red wavelength, the illumination light may pass through the first incident surface B1 of the combining unit 155d and be reflected by the one surface of the first coating surface A1 in the combining unit 155d, Thereby the direction of travel to the emitting surface B4 is changed. When the second illumination unit 155b generates illumination light having a green wavelength, the illumination light may pass through the second incident surface B2 of the combining unit 155d and the first coating surface A1 or the second coating surface A2 in the combining unit 155d. The other surface is then emitted through the emitting surface B4. When the third illumination unit 155c generates illumination light having a blue wavelength, the illumination light may pass through the third incident surface B3 of the combining unit 155d and be reflected by the one surface of the second coating surface A2 within the combining unit 155d. , thereby changing the direction of travel to the emitting surface B4.

Therefore, when two or more kinds of illumination lights having mutually different wavelengths are generated, since the illumination lights are combined with each other by the combining unit 155d while being emitted in one direction, illumination light having various colors can be generated . Therefore, when the control unit controls the operations of the illumination units 155a, 155b, and 155c, illumination light having a desired wavelength can be emitted. Further, since the three illumination units 155a, 155b, and 155c generate illumination light having various colors, the structure of the illumination system 155 can be simplified as compared with a case in which all illumination units that generate each color are set to generate various colors. To improve space efficiency. However, the invention is not limited to this. For example, the number of illumination units and the color wavelength of the illumination light can vary.

For example, when the pattern formed on the substrate 10 has a red color, the control unit may activate the first lighting unit 155a, and the second lighting unit 155b and the third photo The clear unit 155c may not work. Therefore, illumination light having a red wavelength can be emitted onto the substrate 10. The emitted red illumination light is reflected by the pattern formed on the substrate 10 and then induced to the camera 151. However, when the pattern formed on the substrate 10 has a defect, the defective portion appears black to the camera 151 because the illumination light is not easily reflected by the defective portion. Therefore, the normal portion of the pattern formed on the substrate 10 appears red, and the defective portion of the pattern formed on the substrate 10 appears black, thereby improving visibility to defects. That is, when the color wavelength of the illumination light is selected according to the color of the pattern formed on the substrate, the defect of the pattern can be easily detected.

The first aperture 155k may be disposed in a moving path of the illumination light passing through the emission surface B4. Here, the first aperture 155k adjusts the size of the illumination light passing therethrough.

The illumination light relay lens 155e induces the reflected illumination light such that the illumination light passing through the combining unit 155d does not diffuse but travels accurately in a desired direction. That is, the illumination light relay lens 155e enables the illumination light passing through the combining unit 155d to be within the incident range of the objective lens 140, thereby causing the illumination light to reach the substrate 10.

The fourth lighting unit 155f may be separately provided with respect to the first lighting unit 155a, the second lighting unit 155b, the third lighting unit 155c, and the combining unit 155d to emit illumination light to the substrate 10. The fourth illumination unit 155f may generate illumination light having a wavelength different from the wavelength of visible light. For example, the fourth illumination unit 155f may generate infrared light (IR) as illumination light, and the first illumination unit 155a, the second illumination unit 155b, and the third illumination unit 155c may generate visible light. However, the invention is not limited to this. Alternatively, the fourth lighting unit 155f may generate various illumination lights having various wavelengths, and two or more fourth illumination units 155f may be disposed.

For example, a pattern may be placed over the pattern formed on the substrate 10, for example An upper film such as a black matrix. Although defects occur in the pattern formed on the substrate 10, when visible light is used as the illumination light, since the visible light does not pass through the upper film, it is difficult to detect the defects of the pattern. Here, when infrared light is used as the illumination light, the infrared light can pass through the upper film to reach the pattern, so that defects of the pattern are easily detected. Therefore, when the upper film is not disposed over the pattern on the substrate 10, the color wavelength of visible light can be selected via the first illumination unit 155a, the second illumination unit 155b, the third illumination unit 155c, and the combination unit 155d to emit illumination light. On the other hand, when an upper film is disposed over the pattern on the substrate 10, infrared light is emitted via the fourth illumination unit 155f to detect a defect of the pattern on the lower layer of the upper film.

The second aperture 155g may be disposed in a moving path of the infrared light generated by the fourth illumination unit 155f. Here, the second aperture 155g adjusts the size of the infrared light that passes therethrough.

The condenser lens 155h may be disposed in a moving path between the illumination light relay lens 155e and the objective lens 140 or between the second aperture 155g and the objective lens 140. The condensing lens 155h collects illumination light that is moved to the objective lens 140.

The illumination mirror may include a first illumination mirror 155i and a second illumination mirror 155h, the first illumination mirror 155i is disposed between the illumination light relay lens 155e and the condenser lens 155h, and the second illumination mirror 155h is disposed at the Two apertures 155g and the condenser lens 155h. Here, the first illumination mirror 155i may reflect the illumination light passing through the illumination light relay lens 155e to change the movement path to the condensing lens 155h. The second illumination mirror 155j can reflect the illumination light passing through the second aperture 155g to change the movement path to the condensing lens 155h.

Reflected by the first illumination mirror 155i and the second illumination mirror 155j The moving paths of the illumination light may overlap each other. Therefore, when the second illumination mirror 155j is disposed closer to the condenser lens 155h than the first illumination mirror 155i, the second illumination mirror 155j can transmit the illumination light reflected by the first illumination mirror 155i. That is, the second illumination mirror 155j can be a half mirror. One surface of the second illumination mirror 155j may reflect the illumination light generated by the fourth illumination unit 155f, and the other surface may transmit the illumination light passing through the combination unit 155d and guide the illumination light to the condenser lens 155h. However, the invention is not limited to this. Alternatively, the number, location, and type of illumination mirrors may vary depending on the configuration of the laser processing apparatus 100.

Hereinafter, the structure of the combining unit 155d' according to another exemplary embodiment will be described in detail.

Referring to FIG. 4, the combining unit 155d' includes a third coating surface C1 and a fourth coating surface C2, one surface of the third coating surface C1 reflects illumination light having a first wavelength and the other surface transmits illumination light having a second wavelength, One surface of the fourth coating surface C2 reflects illumination light having a third wavelength and the other surface transmits illumination light having the first wavelength and illumination light having the second wavelength.

For example, the combining unit 155d' may be a dichroic prism. The combining unit 155d' may include a first incident surface D1 facing the first illumination unit 155a, a second incident surface D2 facing the second illumination unit 155b, a third incident surface D3 facing the third illumination unit 155c, and facing The second incident surface D1 and the fourth coated surface C2 may be disposed in the combining unit 155d' and have an inequality (for example, '>') shape. However, the invention is not limited to this. Alternatively, a plurality of mirrors in which one surface reflects illumination light and the other surface transmits illumination light may be combined with each other for use.

When the first illumination unit 155a generates illumination light having a red wavelength, the illumination light may pass through the first incident surface D1 of the combining unit 155d' and then be the one of the third coating surface C1 within the combining unit 155d' The surface is reflected to pass through the other surface of the fourth coating surface C2, thereby changing the direction of travel to the emission surface D4. When the second illumination unit 155b generates illumination light having a green wavelength, the illumination light may pass through the second incident surface D2 of the combining unit 155d' and then pass through the third coating surface C1 or the fourth in the combining unit 155d'. The other surface of the surface C2 is coated to emit illumination light through the emission surface D4. When the third illumination unit 155c generates illumination light having a blue wavelength, the illumination light may pass through the third incident surface D3 of the combining unit 155d' and then be described by the second coating surface C2 within the combining unit 155d' A surface is reflected to change the direction of travel to the emitting surface D4.

Therefore, when one type of illumination light is selected, or two or more types of illumination light having mutually different wavelengths are generated, the illumination light can be combined with each other in the combining unit 155d' to generate illumination light having wavelengths of various colors. Therefore, when the control unit controls the operations of the illumination units 155a, 155b, and 155c, illumination light having a desired wavelength can be emitted. Therefore, when the color wavelength of the illumination light is selected according to the color of the pattern formed on the substrate, the visibility to the defect can be improved to easily detect the defect.

Although the defect observation device 155 is provided in the laser processing apparatus 100 according to an exemplary embodiment, the present invention is not limited thereto. For example, the defect viewing device 155 can be used independently or in various devices or equipment. Here, the defect observation device 155 can observe a substrate or a pattern formed on the substrate.

According to an exemplary embodiment, the illumination system may include the plurality of illumination units for generating illumination light having mutually different wavelengths to select to transmit to The color of the illumination light of the substrate. When the color of the emitted illumination light is selected according to the substrate or according to the pattern formed on the substrate, the visibility to the defect of the pattern can be improved by the illumination light, thereby easily detecting the defect. Therefore, the efficiency of the repair process is improved due to the rapid detection of defects to perform the repair process.

Furthermore, since the illumination system is simple in structure and produces illumination light having various colors, the apparatus can be simplified and space efficiency can be improved.

While the preferred embodiment of the present invention has been described in the embodiments of the embodiments of the present invention, various changes and modifications of the invention may be made without departing from the scope and spirit of the invention as defined by the appended claims. It will be apparent to those skilled in the art that various modifications and changes can be made in the present invention without departing from the spirit and scope of the invention.

1‧‧‧ platform

10‧‧‧Substrate

100‧‧‧Laser processing equipment

110‧‧‧Laser unit

120‧‧‧Ball adjustment unit

121‧‧‧Attenuator

122‧‧‧Blocking parts

123‧‧‧Dimensional adjustment parts

124‧‧‧Laser mirror

130‧‧‧Scanner unit

131‧‧‧Scanner

132‧‧‧focus lens

133‧‧‧Laser relay lens

134‧‧‧Scanner mirror

140‧‧‧ objective lens

150‧‧‧Defect viewing device

151‧‧‧ camera

152‧‧‧ cut-off filter

153‧‧‧ imaging system

154‧‧‧Auto Focus System

155‧‧‧Lighting system

155a‧‧‧First lighting unit

155b‧‧‧Second lighting unit

155c‧‧‧3rd lighting unit

155d‧‧‧ combination unit

155e‧‧‧Lighting relay lens

155f‧‧‧Fourth lighting unit

155g‧‧‧second aperture

155h‧‧‧ concentrating lens

155i‧‧‧first illumination mirror

155j‧‧‧second illumination mirror

155k‧‧‧first aperture

156‧‧‧Photographing mirror

156a‧‧‧first shooting mirror

156b‧‧‧second shooting mirror

156c‧‧‧ third shooting mirror

Claims (11)

A defect observation device for observing a surface of a substrate, the defect observation device comprising: a camera for photographing the substrate; an imaging system for forming an image of a surface of the substrate on the camera; and an illumination system Selecting at least one of a plurality of illumination lights having mutually different wavelengths to emit illumination light to the substrate; an autofocus system for correcting a focus of photographing the substrate; and a photographing mirror including the first a photographic mirror, a second photographic mirror, and a third photographic mirror, wherein the first photographic mirror is disposed between the camera and the objective lens, and the second photographic mirror is disposed at the third photographic mirror Between the objective lens and the objective lens, the third photographic mirror is disposed between the autofocus system and the second photographic mirror or between the second photographic mirror and the illumination system. The defect observation device of claim 1, wherein the illumination system comprises a first illumination unit, a second illumination unit, a third illumination unit, and a combination unit, wherein the first illumination unit is configured to generate the first a illuminating light of a wavelength, the second illuminating unit is configured to generate illuminating light having a second wavelength, the third illuminating unit is configured to generate illuminating light having a third wavelength, and the combining unit is configured to select the illuminating light One or a combination of at least two illumination lights to transmit or reflect the illumination light in one direction. The defect observation device of claim 2, wherein the combination unit comprises a first coated surface and a second coated surface, and a surface of the first coated surface reflects the illumination having the first wavelength Light and another surface transmission Illuminating light having the second wavelength, and one surface of the second coated surface reflects the illumination light having the third wavelength and the other surface transmits the illumination light having the second wavelength. The defect observation device of claim 2, wherein the combination unit comprises a third coating surface and a fourth coating surface, one surface of the third coating surface reflecting the illumination having the first wavelength Light and another surface transmits the illumination light having the second wavelength, and one surface of the fourth coated surface reflects the illumination light having the third wavelength and the other surface transmits the Illumination light of a first wavelength and illumination light having the second wavelength. The defect observation device of claim 2, wherein the first illumination unit, the second illumination unit, and the third illumination unit generate visible light, and the illumination system includes a fourth illumination unit. The fourth illumination unit is configured to generate illumination light having a wavelength different from the wavelength of the visible light. The defect observation device of claim 5, further comprising a first aperture, a second aperture, and a collecting lens, wherein the first aperture is used to adjust a size of the illumination light combined in the combination unit The second aperture is configured to adjust a size of the illumination light generated by the fourth illumination unit, the concentrating lens is configured to collect the illumination light selected or combined in the combination unit or The illumination light generated by the fourth illumination unit. A laser processing apparatus for processing a substrate, the laser processing apparatus comprising: a laser unit for generating a laser beam; and a scanner unit for adjusting a travel path of the generated laser beam; An objective lens for illuminating the laser beam whose travel path has been adjusted by the scanner unit; and a defect observation device for selecting at least one of a plurality of illumination lights having mutually different wavelengths and The substrate emits the illumination light to observe the substrate. The laser processing apparatus of claim 7, further comprising a beam adjustment unit, the beam adjustment unit being disposed between the laser unit and the scanner unit to guide the mine The laser beam is generated by a firing unit to adjust the size of the laser beam. The laser processing apparatus of claim 7, wherein the defect observing device comprises an illumination system for emitting a plurality of illumination lights, and the illumination system comprises a first illumination unit, a second illumination unit, and a third a lighting unit and a combining unit, the first lighting unit is configured to generate illumination light having a first wavelength, the second illumination unit is configured to generate illumination light having a second wavelength, and the third illumination unit is configured to generate The third wavelength of illumination light, the combining unit is configured to select one of the illumination lights or combine at least two illumination lights to transmit or reflect the illumination light in one direction. The laser processing apparatus of claim 9, further comprising a control unit connected to the defect observation device to be based on the substrate or according to a color of a pattern formed on the substrate A color wavelength of the illumination light emitted by the illumination system is determined. The laser processing apparatus according to any one of claims 8 to 10, wherein the process of processing the substrate comprises a process of repairing a defect of the pattern formed on the substrate.