TWI504464B - Defect correction device - Google Patents
Defect correction device Download PDFInfo
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- TWI504464B TWI504464B TW098137218A TW98137218A TWI504464B TW I504464 B TWI504464 B TW I504464B TW 098137218 A TW098137218 A TW 098137218A TW 98137218 A TW98137218 A TW 98137218A TW I504464 B TWI504464 B TW I504464B
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1306—Details
- G02F1/1309—Repairing; Testing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/10—Devices involving relative movement between laser beam and workpiece using a fixed support, i.e. involving moving the laser beam
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- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Laser Beam Processing (AREA)
Description
本發明係有關於一種以雷射光修正平板顯示器(FPD)、半導體晶圓等基板之缺陷的缺陷修正裝置。The present invention relates to a defect correcting device for correcting defects of a substrate such as a flat panel display (FPD) or a semiconductor wafer by laser light.
習知,採取以加工頭將從雷射光源射出之雷射光照射至基板,而修正基板之缺陷之方式。如此進行缺陷之裝置已知有以光纖連接雷射振盪器及加工頭之雷射加工裝置(參照專利文獻1)。Conventionally, a method in which a laser beam emitted from a laser light source is irradiated onto a substrate by a processing head to correct a defect of the substrate is adopted. A laser processing apparatus in which a laser oscillator and a processing head are connected by an optical fiber is known as a device for performing such a defect (see Patent Document 1).
上述專利文獻1記載之雷射加工裝置包含有固定於裝置端部之雷射振盪器、可在工作件上於水平2軸方向移動之可動式加工頭,並以光纖連結雷射振盪器與加工頭之間。The laser processing apparatus described in Patent Document 1 includes a laser oscillator fixed to an end portion of the device, a movable machining head movable in a horizontal axis direction on the workpiece, and a laser oscillator and processing by optical fiber. Between the heads.
日本專利公開公報平9-239578號Japanese Patent Laid-Open No. 9-239578
然而,上述專利文獻1記載之雷射加工裝置由於在以光纖分離之雷射振盪器及加工頭中僅使加工頭移動,故隨著加工頭之移動,光纖一再變形。However, in the laser processing apparatus described in Patent Document 1, since only the processing head is moved in the laser oscillator and the processing head separated by the optical fiber, the optical fiber is repeatedly deformed as the processing head moves.
當光纖一再變形時,有耐久性降低,光纖之芯線產生龜裂,而無法以均一強度分布之雷射光進行工作件之加工之弊端。When the optical fiber is repeatedly deformed, the durability is lowered, the core wire of the optical fiber is cracked, and the processing of the working member cannot be performed with the laser light of uniform intensity distribution.
又,當光纖一再變形時,由於光纖內之反射條件改變,故在光纖內傳送之雷射光之品質改變,而有無法以均一強度分布之雷射光進行基板之加工的弊端。Further, when the optical fiber is repeatedly deformed, since the reflection condition in the optical fiber changes, the quality of the laser light transmitted in the optical fiber changes, and there is a drawback that the substrate cannot be processed by the laser light having a uniform intensity distribution.
本發明之課題係提供可將具有均一強度分布之雷射光照射至基板之缺陷修正裝置。An object of the present invention is to provide a defect correcting device that can irradiate laser light having a uniform intensity distribution to a substrate.
為解決上述課題,本發明之缺陷修正裝置係以光纖將從雷射光源所射出之雷射光導光至加工頭,以修正基板上之缺陷部份者,其包含有:將前述基板保持在平面狀態的基板台;隔著前述基板台架設之門型高架;使前述基板台與前述高架中其中一者與另一者相對地移動之驅動機構;以可沿著前述高架之水平柱移動之狀態設置,並將前述雷射光與加工頭安裝成一體之安裝部;將一體地安裝於前述安裝部之前述雷射光源與前述加工頭間連結之光纖;及將前述光纖於相互不同之方向微小地彎曲,而調整光纖內之模態分布之複數個模態擾亂器。In order to solve the above problems, the defect correction device of the present invention guides a laser beam emitted from a laser light source to a processing head to correct a defective portion on the substrate, and includes: holding the substrate in a plane a substrate stage in a state; a gate type elevated frame interposed between the substrate stages; a driving mechanism for moving the substrate stage and the one of the elevated frames to move relative to the other; and moving along the horizontal column of the elevated frame a mounting portion for integrally mounting the laser beam and the processing head; an optical fiber integrally coupled between the laser light source and the processing head that is integrally mounted to the mounting portion; and the optical fibers are slightly different from each other A plurality of modal disturbances that are curved to adjust the modal distribution within the fiber.
在本發明中,由於雷射光源、光纖、加工頭及複數個模態擾亂器一體地移動,故雷射光源與加工頭之相對距離短,且光纖之安裝形狀固定,光纖不致產生變形。In the present invention, since the laser light source, the optical fiber, the processing head, and the plurality of modal disturbers move integrally, the relative distance between the laser light source and the processing head is short, and the mounting shape of the optical fiber is fixed, and the optical fiber is not deformed.
是故,根據本發明,可將具有均一強度分布之雷射光照射至基板。Therefore, according to the present invention, laser light having a uniform intensity distribution can be irradiated to the substrate.
以下,參照圖式,就本發明一實施形態之缺陷修正裝置作說明。Hereinafter, a defect correction device according to an embodiment of the present invention will be described with reference to the drawings.
第1A圖及第1B圖係顯示本發明一實施形態之缺陷修正裝置1之平面圖及正面圖。1A and 1B are a plan view and a front view showing a defect correction device 1 according to an embodiment of the present invention.
第2圖係用以說明缺陷修正裝置1之加工頭5之內部構造的概略結構圖。Fig. 2 is a schematic block diagram for explaining the internal structure of the machining head 5 of the defect correction device 1.
第3A圖及第3B圖係用以說明缺陷修正裝置1之光纖8及模態擾亂器11、12之概略側面圖及概略正面圖。3A and 3B are a schematic side view and a schematic front view for explaining the optical fiber 8 and the mode disturbers 11, 12 of the defect correction device 1.
缺陷修正裝置1係用於修復加工等,該修復加工係在液晶顯示器(LCD)等FPD之製程之光微影處理步驟形成有電路圖形之玻璃基板A檢測出配線部份之短路、光阻劑之溢出等缺陷時,以雷射光去除缺陷者。The defect correction device 1 is used for repair processing, etc., which is a short circuit of a wiring portion, a photoresist, which is formed by a glass substrate A in which a circuit pattern is formed in a process of photolithography of a process such as a liquid crystal display (LCD). In the case of a defect such as overflow, the defect is removed by laser light.
如第1A圖及第1B圖所示,缺陷修正裝置1包含有使基板A在保持水平之平面狀態下浮起之浮起台2、在此浮起台2之側邊,吸附保持基板A之一側緣部(與搬送方向平行之一邊),將之於X方向搬送之吸附搬送台3、隔著浮起台2,於與基板搬送方向垂直相交之Y方向架設之門型高架(移動機構)4、沿著此高架4之水平柱20,於Y方向一體地移動之加工頭5及雷射光源單元(雷射電源6、雷射光源7、光纖8及2個模態擾亂器11、12)。As shown in FIGS. 1A and 1B, the defect correcting device 1 includes a floating table 2 for floating the substrate A in a planar state in which it is horizontal, and a side of the floating holding table 2 on the side of the floating table 2 The side edge portion (one side parallel to the transport direction), the adsorption transfer table 3 that is transported in the X direction, and the gate type overhead (moving mechanism) that is placed in the Y direction perpendicular to the substrate transfer direction via the floating table 2 4. The processing head 5 and the laser light source unit (the laser power source 6, the laser light source 7, the optical fiber 8 and the two modal disturbance devices 11, 12) which are integrally moved in the Y direction along the horizontal column 20 of the overhead frame 4. ).
高架4具有用以使用以安裝加工頭5之頭安裝部18與用以安裝雷射電源6及雷射光源7之雷射光源單元安裝部19沿著水平柱20移動之移動機構。頭安裝部18以懸臂梁狀且以圖中未示之線性引導軌道及線性馬達可於Y方向移動之狀態設置於構成高架4之水平柱20之側邊。又,在頭安裝部18,將物鏡9朝向鉛直下方,而安裝有加工頭5。The overhead frame 4 has a moving mechanism for moving along the horizontal column 20 using the head mounting portion 18 for mounting the processing head 5 and the laser light source unit mounting portion 19 for mounting the laser power source 6 and the laser light source 7. The head mounting portion 18 is provided in a cantilever shape on the side of the horizontal column 20 constituting the overhead frame 4 in a state where the linear guide rail and the linear motor (not shown) are movable in the Y direction. Further, in the head mounting portion 18, the objective lens 9 is oriented vertically downward, and the processing head 5 is attached.
雷射光源單元安裝部19係以可沿著設置於水平柱20上面之軌道21,於Y方向滑動之狀態支撐之滑件,於水平柱20之鉛直上方配置重量較大之雷射電源6及雷射光源7。The laser light source unit mounting portion 19 is provided with a slider supported in a state of being slidable in the Y direction along a rail 21 provided on the upper surface of the horizontal column 20, and a laser power source 6 having a large weight is disposed vertically above the horizontal column 20 and Laser light source 7.
該等頭安裝部18及雷射光源單元安裝部19藉相互固定,而一體地於Y方向移動。The head mounting portion 18 and the laser light source unit mounting portion 19 are integrally fixed to each other and are moved in the Y direction.
要使用缺陷修正裝置1,進行玻璃基板A之後述顯微鏡檢查及雷射加工,乃在以圖中未示之搬送機器人等使基板A載置浮起於浮起台2上之狀態下,以具有基準銷及壓制銷之基板排列機構23定位。定位後,使吸附搬送台3上升,以吸附部3a吸附玻璃基板A,使吸附搬送台3之線性馬達驅動,而沿著線性引導軌道於X方向搬送。In the state in which the glass substrate A is subjected to the microscopic examination and the laser processing, the substrate A is placed on the floating table 2 by a transfer robot or the like (not shown). The substrate alignment mechanism 23 of the reference pin and the press pin is positioned. After the positioning, the adsorption transfer table 3 is raised, the glass substrate A is adsorbed by the adsorption unit 3a, and the linear motor of the adsorption transfer table 3 is driven to be transported in the X direction along the linear guide rail.
根據以配置於FDP製造線之圖形檢查裝置等界定之玻璃基板A之缺陷位置資訊,使加工頭5於Y方向移動,使吸附搬送台3於X方向移動,進行後述之顯微鏡檢查及雷射加工,藉此,可在玻璃基板A之幾乎全面範圍施行顯微鏡檢查及雷射加工。The processing head 5 is moved in the Y direction by the defect position information of the glass substrate A defined by the pattern inspection device or the like disposed on the FDP manufacturing line, and the adsorption transfer table 3 is moved in the X direction to perform microscopic inspection and laser processing described later. Thereby, microscopic examination and laser processing can be performed in almost the entire range of the glass substrate A.
在此,光纖8之入射側端面8a連接於雷射光源7,射出側端面8b連接於加工頭5之配置有投影透鏡(投影光學系統)41之入射埠側。Here, the incident side end surface 8a of the optical fiber 8 is connected to the laser light source 7, and the emission side end surface 8b is connected to the incident side of the processing head 5 on which the projection lens (projection optical system) 41 is disposed.
如第3A圖及第3B圖所示,於光纖8配置對光纖8從不同之方向施加按壓力,而生成微小彎曲之2個模態擾亂器11、12。又,光纖8形成有以與加工頭5之投影光學系統之光軸一致之狀態朝射出側端面8b延伸成一直線狀之直線部8c。此光纖8之直線部8c藉以固定構件將光纖8之一部份固定於雷射光源單元安裝部19,將光纖8之前端部安裝於加工頭5之輸入埠,而可將光纖8之射出側之一部份固定成直線狀。As shown in FIGS. 3A and 3B, the optical fibers 8 are arranged to apply a pressing force to the optical fibers 8 from different directions to generate the two mode disturbers 11, 12 which are slightly curved. Further, the optical fiber 8 is formed with a linear portion 8c extending in a straight line toward the emission-side end surface 8b in a state of being aligned with the optical axis of the projection optical system of the processing head 5. The straight portion 8c of the optical fiber 8 is fixed to the laser light source unit mounting portion 19 by a fixing member, and the front end portion of the optical fiber 8 is attached to the input port of the processing head 5, and the exit side of the optical fiber 8 can be used. One part is fixed in a straight line.
入射側之模態擾亂器11係隔著光纖8,於光纖一側配置2根螺絲11a、11c,於在此2根螺絲11a、11c之間之光纖8之另一側配置1根螺絲11b而構成。中央之螺絲11b將光纖8按壓至X軸之負方向,兩端之螺絲11a、11c將光纖8按壓至X軸之正方向。藉此,從入射側端面8a於Y軸方向延伸之光纖8在XY平面於X軸方向微小地彎曲。此時,亦可將兩側之2根螺絲11a、11c換成固定銷,扭擰正中央之1根螺絲11b,而對光纖8施加按壓力,使其微小地彎曲。又,亦可藉將正中央之螺絲11b換成固定銷,扭擰兩側之螺絲11a、11c,而對光纖8施加按壓力,使其微小地彎曲。The mode disturber 11 on the incident side is provided with two screws 11a and 11c on the side of the optical fiber via the optical fiber 8, and one screw 11b is disposed on the other side of the optical fiber 8 between the two screws 11a and 11c. Composition. The central screw 11b presses the optical fiber 8 to the negative direction of the X-axis, and the screws 11a and 11c at both ends press the optical fiber 8 to the positive direction of the X-axis. Thereby, the optical fiber 8 extending from the incident side end surface 8a in the Y-axis direction is slightly curved in the X-axis direction on the XY plane. At this time, the two screws 11a and 11c on both sides may be replaced with a fixing pin, and one screw 11b in the center may be twisted to apply a pressing force to the optical fiber 8 to be slightly bent. Further, the screw 11b in the center can be replaced with a fixing pin, and the screws 11a and 11c on both sides can be twisted, and a pressing force is applied to the optical fiber 8 to be slightly bent.
又,射出側之模態擾亂器12亦與入射側之模態擾亂器11同樣地,以3根螺絲12a、12b、12c構成。中央之螺絲12b將光纖8按壓至Z軸之正方向,兩端之螺絲12a、12c將光纖按壓至Z軸之負方向。藉此,於Y軸方向延伸之光纖8在YZ平面於Z軸方向微小地彎曲。Further, the mode disturber 12 on the emission side is also constituted by three screws 12a, 12b, and 12c similarly to the mode disturber 11 on the incident side. The central screw 12b presses the optical fiber 8 in the positive direction of the Z-axis, and the screws 12a and 12c at both ends press the optical fiber to the negative direction of the Z-axis. Thereby, the optical fiber 8 extending in the Y-axis direction is slightly curved in the ZZ direction in the YZ plane.
此時,亦可亦將兩側之2根螺絲12a、12c換成固定銷,扭擰正中央之1根螺絲11b,而對光纖8施加按壓力,使其微小地彎曲。又,亦可藉將正中央之螺絲12b換成固定銷,扭擰兩側之螺絲12a、12c,而對光纖8施加按壓力,使其微小地彎曲。At this time, the two screws 12a and 12c on both sides may be replaced with a fixing pin, and one screw 11b in the center may be twisted, and a pressing force is applied to the optical fiber 8 to be slightly bent. Further, the screw 12b in the center can be replaced with a fixing pin, and the screws 12a and 12c on both sides can be twisted to apply a pressing force to the optical fiber 8 to be slightly bent.
此外,模態擾亂器11、12之各螺絲藉螺合在形成於模態擾亂器11、12之圖中未示之殼體等的螺孔,而可調整光纖之按壓量。Further, the screws of the modal scramblers 11 and 12 are screwed to the screw holes of the casing or the like which are not shown in the drawings of the modal disturbers 11, 12, and the pressing amount of the optical fibers can be adjusted.
如上述,在本實施形態中,入射側模態擾亂器11及射出側模態擾亂器12可將光纖8於相互垂直相交之方向(X軸方向及Z軸方向)微小地彎曲。As described above, in the present embodiment, the incident side mode disturber 11 and the output side mode disturber 12 can slightly bend the optical fibers 8 in the directions (X-axis direction and Z-axis direction) perpendicular to each other.
在此,藉以各模態擾亂器11、12將光纖8微小地彎曲,可去除入射至為多模光纖之光纖8之雷射光的高次模,而獲得穩定之模態分布,因而,可以後述之加工頭5將具有均一之強度分布之雷射光照射至基板A。Here, the optical fibers 8 are slightly bent by the modal disturbers 11, 12, and the high-order mode of the laser light incident on the optical fiber 8 of the multimode fiber can be removed, thereby obtaining a stable modal distribution, and thus, it can be described later. The processing head 5 irradiates the substrate A with laser light having a uniform intensity distribution.
再者,在本實施形態中,藉2個模態擾亂器11、12將光纖8於相互垂直相交之方向微小地彎曲,可較以2個模態擾亂器將光纖於同一方向微小地彎折之情形更確實地去除高次模,因而,可獲得更穩定之模式分布。Furthermore, in the present embodiment, the optical fibers 8 are slightly bent in the direction perpendicular to each other by the two modal disturbers 11, 12, and the optical fibers can be slightly bent in the same direction by two modal scramblers. The situation removes the higher order modes more reliably, and thus, a more stable mode distribution can be obtained.
又,在本實施形態中,由於使用將光纖8於不同方向微小地彎曲之複數個模態擾亂器11、12,故可獲得較使用習知使光纖旋繞多次之模態擾亂器穩定之模式分布。Further, in the present embodiment, since a plurality of modal disturbers 11, 12 which slightly bend the optical fiber 8 in different directions are used, it is possible to obtain a mode in which the modal disturber which is conventionally used to circumscribe the optical fiber is stabilized a plurality of times. distributed.
此外,在本實施形態中,由於2個模態擾亂器11、12使光纖8於相互垂直相交之方向蜿蜒,故可獲得非常穩定之模態分布,若複數個模態擾亂器中之2個模態擾亂器使光纖8蜿蜒之方向不同時,該等構成之角度雖以接近垂直為理想,但可較於同一方向微小地彎曲之情形,有效地去除高次模。In addition, in the present embodiment, since the two modal scramblers 11, 12 cause the optical fibers 8 to 蜿蜒 in a direction perpendicular to each other, a very stable modal distribution can be obtained, if 2 of the plurality of modal scramblers When the modal disturbance device makes the directions of the optical fibers 8 不同 different, the angles of the constituents are ideal to be close to vertical, but the high-order modes can be effectively removed compared with the case where the same direction is slightly curved.
又,在本實施形態中,以模態擾亂器11、12之螺絲使光纖8蜿蜒,只要可將光纖8微小地彎曲,可使用銷、突起或者供光纖8插入之孔或溝蜿蜒形成之構件等,宜使用不易使光纖8損傷者。Further, in the present embodiment, the optical fibers 8 are twisted by the screws of the modal disturbers 11, 12, and as long as the optical fibers 8 can be slightly bent, pins, projections, or holes or grooves for inserting the optical fibers 8 can be used. For components and the like, it is preferable to use a member that is not easily damaged by the optical fiber 8.
又,在本實施形態中,各模態擾亂器11、12以3根螺絲或銷之組合構成,亦可將螺絲或銷配置5根、7根之奇數根螺絲,而可於同一方向形成複數微小之彎曲。Further, in the present embodiment, each of the mode disturbers 11 and 12 is constituted by a combination of three screws or pins, and five or seven odd-numbered screws may be arranged in the screw or the pin, and plural numbers may be formed in the same direction. Tiny bending.
本實施形態之直線部8c不是以固定光纖8之固定構件強制形成,而是因模態擾亂器11、12與加工頭5之位置關係,形成以一直線狀延伸,亦可藉以固定構件固定光纖8,而強制形成直線部8c。The linear portion 8c of the present embodiment is not forcibly formed by the fixing member of the fixed optical fiber 8, but is formed to extend in a straight line shape due to the positional relationship between the mode disturbers 11, 12 and the processing head 5, and the optical fiber 8 can be fixed by the fixing member. And the straight portion 8c is forcibly formed.
此外,直線部8c之長度L要使雷射光之強度分布均一,以50mm為佳,較佳可為100mm以上。Further, the length L of the straight portion 8c is such that the intensity distribution of the laser light is uniform, preferably 50 mm, preferably 100 mm or more.
又,在本實施形態,當驅動頭安裝部18時,頭安裝部18及雷射光源單元安裝部19一體地於Y方向驅動之結果,加工頭5及雷射單元(雷射電源6、雷射光源7、光纖8及模態擾亂器11、12)一體地於Y方向移動。即,即使使加工頭5移動,光纖8也不致變形,而在維持固定形態之狀態下,使其移動。Further, in the present embodiment, when the head mounting portion 18 is driven, the head mounting portion 18 and the laser light source unit mounting portion 19 are integrally driven in the Y direction, and the processing head 5 and the laser unit (the laser power source 6 and the lightning unit) The light source 7, the optical fiber 8, and the modal scramblers 11, 12) are integrally moved in the Y direction. That is, even if the processing head 5 is moved, the optical fiber 8 is not deformed, and is moved while maintaining the fixed state.
因此,由於即使加工頭5移動,雷射光源7、光纖8及模態擾亂器11、12一起移動,故光纖8不致變形,可將光纖8內之反射條件經常保持固定,而可使照射至基板A之雷射光之強度分布穩定。結果,可經常照射均一強度分布之雷射光,而可繼續高精確度之雷射加工。Therefore, since the laser light source 7, the optical fiber 8, and the mode disturbers 11, 12 move together even if the processing head 5 moves, the optical fiber 8 is not deformed, and the reflection conditions in the optical fiber 8 can be constantly kept fixed, and the irradiation can be performed until The intensity distribution of the laser light of the substrate A is stable. As a result, laser light of a uniform intensity distribution can be constantly irradiated, and high-precision laser processing can be continued.
又,由於在不使光纖8變形下結束,故可防止因一再使 用而易損傷之光纖8之惡化。Moreover, since the fiber 8 is not deformed, it can be prevented from being repeatedly caused. The deterioration of the optical fiber 8 which is easily damaged.
又,在本實施形態中,僅將較輕量之加工頭5安裝於懸臂梁狀之頭安裝部18,而將重量較大之雷射電源6及雷射光源7配置於門型水平柱20之鉛直上方,故於加工頭5移動時,可將施加於頭安裝部18之負荷抑制在最小限度。因而,可進行加工頭5之高精確度之移動,而可以良好精確度進行雷射加工。Further, in the present embodiment, only the lighter processing head 5 is attached to the cantilever beam head mounting portion 18, and the larger laser power source 6 and the laser light source 7 are disposed on the gate type horizontal column 20. Since the vertical direction of the lead is moved, the load applied to the head mounting portion 18 can be minimized. Thus, the high precision movement of the processing head 5 can be performed, and the laser processing can be performed with good precision.
又,在本實施形態中,以浮起台2使玻璃基板A浮起,而以吸附搬送台3使其於X方向移動,以高架4使加工頭5於Y方向移動,而進行在基板A之幾乎全面範圍之顯微鏡檢查及雷射加工,取而代之,亦可固定基板A,使高架4於X方向一直移動,而使加工頭5及雷射單元沿著高架4之水平柱20於Y方向移動。Further, in the present embodiment, the glass substrate A is floated by the floating table 2, and the adsorption transfer table 3 is moved in the X direction, and the processing head 5 is moved in the Y direction by the overhead 4 to perform the substrate A. Substantially comprehensive microscopic examination and laser processing, instead, the substrate A can be fixed so that the overhead frame 4 is always moved in the X direction, and the processing head 5 and the laser unit are moved along the horizontal column 20 of the overhead frame 4 in the Y direction. .
以下,一面特別參照第2圖,一面就缺陷修正裝置1之加工頭5之內部結構等作說明。Hereinafter, the internal structure of the processing head 5 of the defect correction device 1 will be described with reference to Fig. 2 in particular.
雷射光源7係修復加工用光源。在本實施形態中,如第3A圖及第3B圖所示,採用具有雷射振盪器7a、結合透鏡7b、半反射鏡7c及LED光源7e之結構。The laser light source 7 is a light source for repairing processing. In the present embodiment, as shown in Figs. 3A and 3B, a structure including a laser oscillator 7a, a coupling lens 7b, a half mirror 7c, and an LED light source 7e is employed.
雷射振盪器7a係為可去除玻璃基板A上之缺陷,而將設定了波長、輸出之雷射光振盪者,舉例言之,可適合採用脈衝可振盪之YAG雷射等。振盪波長可按修復對象,切換複數振盪波長。The laser oscillator 7a is a laser that can remove the defects on the glass substrate A and oscillates the laser light whose wavelength is set and output. For example, a pulse oscillatable YAG laser or the like can be suitably used. The oscillation wavelength can be switched to the complex object to switch the complex oscillation wavelength.
雷射振盪器7a電性連接於控制單元22,按來自控制單元22之控制信號,控制振盪。The laser oscillator 7a is electrically connected to the control unit 22, and controls the oscillation in accordance with a control signal from the control unit 22.
半反射鏡7c將以雷射振盪器7a於X軸負方向振盪之雷射光朝結合透鏡7b於Y軸負方向反射。又,半反射鏡7c供從LED光源7e朝向結合透鏡7b於Y軸負方向射出之光透過。The half mirror 7c reflects the laser light oscillated in the negative X-axis direction by the laser oscillator 7a toward the coupling lens 7b in the negative direction of the Y-axis. Further, the half mirror 7c transmits light that is emitted from the LED light source 7e toward the coupling lens 7b in the negative direction of the Y-axis.
由於半反射鏡7c將以雷射振盪器7a振盪之雷射光朝結合透鏡7b反射,而可配合裝置結構來決定雷射振盪器7a之振盪方向,故設計之自由度增加,並且可謀求省空間化。Since the half mirror 7c reflects the laser light oscillated by the laser oscillator 7a toward the coupling lens 7b, the oscillation direction of the laser oscillator 7a can be determined in accordance with the device structure, so that the degree of freedom in design is increased, and space can be saved. Chemical.
結合透鏡7b係用以將從雷射振盪器7a射出之雷射光與光纖3光結合之光學元件。The coupling lens 7b is an optical element for combining the laser light emitted from the laser oscillator 7a with the optical fiber 3.
光纖8係使以結合透鏡7b與光纖端面8a結合之雷射光在內部傳播而將之導引至加工頭5內,作為雷射光60,從光纖端面8b射出者。由於雷射光60在光纖8之內部傳播後射出,故即使雷射振盪器7a之雷射光為高斯分布,亦形成具光量分布均一化之擴大的光線。The optical fiber 8 causes the laser beam coupled to the fiber end surface 8a by the coupling lens 7b to propagate inside and guide it into the processing head 5, and as the laser light 60, is emitted from the fiber end surface 8b. Since the laser light 60 is emitted after being propagated inside the optical fiber 8, even if the laser light of the laser oscillator 7a has a Gaussian distribution, light having a uniform uniformity in light quantity distribution is formed.
此外,因第2圖係模式圖,故圖中顯示從雷射振盪器7a射出之雷射光光軸沿著Z方向,而在本實施形態,則如第3B圖所示,沿著X軸方向。惟,雷射振盪器7a之配置位置、姿勢不限於該等。In addition, since the second diagram is a schematic diagram, the optical axis of the laser beam emitted from the laser oscillator 7a is shown along the Z direction, and in the present embodiment, as shown in FIG. 3B, along the X-axis direction. . However, the arrangement position and posture of the laser oscillator 7a are not limited to these.
又,雷射光之均一化機構除了上述模態擾亂器11、12外,亦可為使用使用了其他光學元件、例如複眼透鏡、繞射元件、非球面透鏡或萬花筒型桿者等各種結構之均質機等的結構。Further, in addition to the above-described modal disturbers 11, 12, the uniformizing means of the laser light may be a homogeneous structure using various optical elements such as a fly-eye lens, a diffractive element, an aspherical lens or a kaleidoscope type rod. The structure of the machine, etc.
加工頭5於其殼體5a內保持有投影透鏡(投影光學系統) 41、空間調變元件42、照射光學系統43、觀察用光源44、觀察用成像透鏡45、拍攝元件46等光學元件或設備。The processing head 5 holds an optical element or device such as a projection lens (projection optical system) 41, a spatial modulation element 42, an illumination optical system 43, an observation light source 44, an observation imaging lens 45, and an imaging element 46 in the casing 5a. .
投影透鏡41係令固定於加工頭5之殼體5a之光纖8的光纖端面8b與空間調變元件42之基準面為共軛之關係的配置,係設定投影倍率,俾可使光纖端面8b之像照射空間調變元件42之調變區域全體之透鏡或透鏡群。The projection lens 41 is configured such that the fiber end surface 8b of the optical fiber 8 fixed to the casing 5a of the machining head 5 and the reference surface of the spatial modulation element 42 are conjugated, and the projection magnification is set so that the fiber end face 8b can be A lens or a lens group that illuminates the entire modulation region of the spatial modulation element 42.
在第2圖中,投影透鏡41之光軸P1設定於在ZY平面,隨著從Y軸正方向朝向負方向,而從Z軸正方向朝向負方向之傾斜方向。In Fig. 2, the optical axis P1 of the projection lens 41 is set in the ZY plane, and is inclined from the positive direction of the Z-axis toward the negative direction as it goes from the positive direction of the Y-axis to the negative direction.
空間調變元件42係將從投影透鏡41投射之雷射光61空間調變者,由微小鏡陣列之DMD(Digital Mirror Device)構成,可控制搖動之複數微小鏡在矩形之調變區域內以等間距二維排列。The spatial modulation element 42 is a spatial modulation of the laser light 61 projected from the projection lens 41, and is composed of a DMD (Digital Mirror Device) of a micro mirror array, and can control the shaking of the plurality of micro mirrors in the modulation region of the rectangle. The spacing is two-dimensionally arranged.
在本實施形態中,於雷射光61之光程上配置鏡47,將雷射光61之光軸P1於光軸P2之方向反射。而且雷射光61為沿著沿空間調變元件42基準面之法線之光軸P3作為啟動光62反射,而呈對空間調變元件42基準面之法線以所期角度入射之配置。此外,光軸P1、P2與啟動光62之光軸P3位於同一平面上。In the present embodiment, the mirror 47 is disposed on the optical path of the laser light 61, and the optical axis P1 of the laser light 61 is reflected in the direction of the optical axis P2. Further, the laser beam 61 is reflected as the start light 62 along the optical axis P3 along the normal line of the reference surface of the spatial modulation element 42, and is placed at a predetermined angle with respect to the normal line of the reference surface of the spatial modulation element 42. Further, the optical axes P1, P2 are located on the same plane as the optical axis P3 of the start light 62.
照射光學系統43係構成將以空間調變元件42空間調變而朝一定方向反射之啟動光62之像以所期之倍率於玻璃基板A上成像之成像光學系統的光學元件群,成像透鏡48配置於空間調變元件42側,物鏡9配置於玻璃基板A側。The illuminating optical system 43 constitutes an optical element group of the imaging optical system that images the image of the illuminating light 62 that is spatially modulated by the spatial modulating element 42 and is reflected in a certain direction at a desired magnification on the glass substrate A. The imaging lens 48 It is disposed on the side of the spatial modulation element 42 and the objective lens 9 is disposed on the side of the glass substrate A.
物鏡9由用以將玻璃基板A之抗蝕圖形加工之紫外線用物鏡等複數個物鏡構成。該等複數個物鏡以可以旋轉器機構切換之狀態保持,倍率彼此不同。因此,藉使旋轉器機構旋轉,切換物鏡9,可變更照射光學系統8之倍率。以下,只要未特別限制,物鏡9係指選擇構成照射光學系統43之透鏡。The objective lens 9 is composed of a plurality of objective lenses such as an objective lens for ultraviolet rays for processing a resist pattern of the glass substrate A. The plurality of objective lenses are held in a state in which the rotator mechanism can be switched, and the magnifications are different from each other. Therefore, by rotating the rotator mechanism and switching the objective lens 9, the magnification of the illuminating optical system 8 can be changed. Hereinafter, the objective lens 9 is a lens that selects the illumination optical system 43 as long as it is not particularly limited.
又,在本實施形態中,成像透鏡48之光軸P4配置成與Y軸方向平行,物鏡9之光軸P5配置成與Z軸方向平行。Further, in the present embodiment, the optical axis P4 of the imaging lens 48 is disposed in parallel with the Y-axis direction, and the optical axis P5 of the objective lens 9 is disposed in parallel with the Z-axis direction.
因此,於空間調變元件42與成像透鏡48間設置有反射啟動光62,使其沿著光軸P4入射之鏡49。而且於成像透鏡48與物鏡9間設置有反射透過成像透鏡48之光,使其沿著光軸P5入射之半反射鏡51。Therefore, a reflection start light 62 is provided between the spatial modulation element 42 and the imaging lens 48 so as to be incident on the mirror 49 along the optical axis P4. Further, between the imaging lens 48 and the objective lens 9, a half mirror 51 that reflects light transmitted through the imaging lens 48 and enters along the optical axis P5 is provided.
如此進行,光軸P4、P5與光軸P1、P2、P3位於同一平面上。即,構成從雷射光源7a以空間調變元件42之在啟動狀態之微小鏡反射,經由照射光學系統43而到達基板A之第1光軸之光軸P1~P5皆位於同一平面上。In this manner, the optical axes P4 and P5 are located on the same plane as the optical axes P1, P2, and P3. In other words, the micro-mirror reflection of the spatial modulation element 42 in the activated state from the laser light source 7a is formed, and the optical axes P1 to P5 of the first optical axis that reaches the substrate A via the illumination optical system 43 are located on the same plane.
又,鏡49及半反射鏡51皆僅於X軸周圍傾斜。Further, both the mirror 49 and the half mirror 51 are inclined only around the X-axis.
觀察用光源44係產生用以照明玻璃基板A上之可加工區域內之觀察用光70的光源,設置於半反射鏡51與物鏡9間之光程之側邊。The observation light source 44 generates a light source for illuminating the observation light 70 in the processable region on the glass substrate A, and is disposed on the side of the optical path between the half mirror 51 and the objective lens 9.
於在半反射鏡51與物鏡9間之光程上與觀察用光源44相對之位置設置使以半反射鏡51反射之啟動光62透過,將觀察用光70朝向物鏡9反射之半反射鏡52。而且於觀察用光源44與半反射鏡52間設置有將觀察用光70集光成適宜徑之照明光束之集光透鏡53。此外,集光透鏡53之光軸P6可在第1光軸所在之平面上,亦可在交叉之位置。A half mirror 52 that transmits the start light 62 reflected by the half mirror 51 and reflects the observation light 70 toward the objective lens 9 is disposed at a position opposite to the observation light source 44 in the optical path between the half mirror 51 and the objective lens 9. . Further, between the observation light source 44 and the half mirror 52, a collecting lens 53 for collecting the observation light 70 into an illumination beam of a suitable diameter is provided. Further, the optical axis P6 of the collecting lens 53 may be on the plane where the first optical axis is located, or may be at the intersection.
觀察用光源44可採用諸如產生可視光之氙燈或LED等適宜光源。此外,亦可設置具有自動對焦用光源之自動對焦單元,以控制物鏡9之前側焦點位置。The observation light source 44 can employ a suitable light source such as a xenon lamp or LED that produces visible light. In addition, an autofocus unit having a light source for autofocus may be provided to control the front focus position of the objective lens 9.
觀察用成像透鏡(拍攝光學系統) 45係在半反射鏡51之上方側與物鏡9之光軸P5配置於同軸,用以將從以觀察用光70所照明之玻璃基板A反射,而以物鏡9所集光之光於拍攝元件(拍攝部) 46之拍攝面上成像的光學元件。因此,光軸P5兼作為從基板A經由拍攝光學系統,到達拍攝部之第2光軸。此外,拍攝元件46係將於拍攝面上成像之圖像光電轉換者,由CCD等構成。The observation imaging lens (photographing optical system) 45 is disposed coaxially with the optical axis P5 of the objective lens 9 on the upper side of the half mirror 51 for reflecting the glass substrate A illuminated by the observation light 70, and is an objective lens. The optical elements of the nine collected light are imaged on the imaging surface of the imaging element (photographing unit) 46. Therefore, the optical axis P5 also serves as the second optical axis from the substrate A to the imaging unit via the imaging optical system. Further, the imaging element 46 is an image photoelectric converter that images on the imaging surface, and is constituted by a CCD or the like.
控制單元22之裝置結構在本實施形態中,由以CPU、記憶體、輸入輸出部、外部記憶裝置等構成之電腦與適宜之硬體之組合組成。控制單元22係依具有操作面板、鍵盤、滑鼠等適宜之操作輸入機構之用戶介面的操作輸入,控制缺陷修正裝置1之動作者,電性連接於雷射光源7、空間調變元件42、拍攝元件46,而可控制各自之動作及動作時間。In the present embodiment, the device configuration of the control unit 22 is composed of a combination of a computer including a CPU, a memory, an input/output unit, an external memory device, and the like, and a suitable hardware. The control unit 22 controls the actor of the defect correction device 1 according to an operation input of a user interface of an appropriate operation input mechanism such as an operation panel, a keyboard, a mouse, etc., and is electrically connected to the laser light source 7 and the spatial modulation component 42. The component 46 is photographed to control the respective actions and action times.
控制單元22對雷射振盪器7a送出使雷射光振盪之控制信號,依按基板A而預先選擇之照射條件,從雷射振盪器7a使雷射光振盪。雷射光之照射條件有波長、光輸出、振盪脈衝寬度等。The control unit 22 sends a control signal for oscillating the laser light to the laser oscillator 7a, and oscillates the laser light from the laser oscillator 7a in accordance with the irradiation conditions previously selected in accordance with the substrate A. The irradiation conditions of the laser light include a wavelength, a light output, an oscillation pulse width, and the like.
業經振盪之雷射光以結合透鏡7b與光纖8之光纖端面8a光結合,以上述模態擾亂器11、12及直線部8c從光纖端面8b射出光強度分布已均一化之發散光之雷射光60。The oscillating laser light is optically coupled to the fiber end face 8a of the optical fiber 8 by the combining lens 7b, and the laser light 60 of the divergent light whose light intensity distribution is uniform is emitted from the fiber end face 8b by the modal disturbers 11, 12 and the linear portion 8c. .
此外,在本實施形態中,就進行在FPD製程製造之玻璃基板A之缺陷修正的缺陷修正裝置1作了說明,缺陷修正裝置1亦可使用作為進行半導體晶圓基板之缺陷修正者。Further, in the present embodiment, the defect correction device 1 for correcting the defect of the glass substrate A manufactured by the FPD process is described. The defect correction device 1 can also be used as a defect corrector for performing the semiconductor wafer substrate.
第4A圖及第4B圖係用以說明本發明一實施形態變形例之缺陷修正裝置之雷射光源17的概略側面圖。4A and 4B are schematic side views for explaining a laser light source 17 of a defect correction device according to a modification of the embodiment of the present invention.
此外,在第4A圖及第4B圖中,以括弧將結合透鏡17b、半反射鏡17c及鏡17d之可動方向附上符號。Further, in FIGS. 4A and 4B, the movable directions of the coupling lens 17b, the half mirror 17c, and the mirror 17d are attached with symbols in parentheses.
本變形例之雷射光源17具有雷射振盪器17a、結合透鏡17b、作為反射構件之半反射鏡17c、及鏡17d。與上述實施形態之雷射光源7之不同主要係配置鏡17d之點以及結合透鏡17b、半反射鏡17c及鏡17d為可動式之點,與上述一實施形態同樣地,於光纖8配置有模態擾亂器11、12,且形成有直線部8c。The laser light source 17 of the present modification has a laser oscillator 17a, a coupling lens 17b, a half mirror 17c as a reflection member, and a mirror 17d. Unlike the laser light source 7 of the above-described embodiment, the point where the mirror 17d is disposed and the coupling lens 17b, the half mirror 17c, and the mirror 17d are movable, and the optical fiber 8 is placed in the same manner as in the above-described embodiment. The state disturbers 11, 12 are formed with a straight portion 8c.
如第4B圖所示,從雷射振盪器17a於X軸負方向射出之雷射光如第4A圖所示,以鏡17d於Z軸正方向反射,進一步,以半反射鏡17c於Y軸負方向反射,而入射至結合透鏡17b。此外,半反射鏡17c使從作為顯示雷射照射位置之引導光之LED光源17e朝向結合透鏡7b於Y軸負方向射出的光透過。As shown in Fig. 4B, the laser light emitted from the laser oscillator 17a in the negative direction of the X-axis is reflected in the positive direction of the Z-axis by the mirror 17d as shown in Fig. 4A, and further negatively reflected by the half mirror 17c on the Y-axis. The direction is reflected and incident on the combining lens 17b. Further, the half mirror 17c transmits light emitted from the LED light source 17e which is the guiding light for displaying the laser irradiation position toward the coupling lens 7b in the negative direction of the Y-axis.
而第2圖所示之空間調變元件42之微小鏡以等間距排列而於同一方向傾斜時,對雷射光P2作用作為繞射光柵。以鏡47反射之雷射光61按其波長與空間調變元件42之微小鏡的排列間距而繞射。On the other hand, when the micro mirrors of the spatial modulation element 42 shown in FIG. 2 are arranged at equal intervals and are inclined in the same direction, the laser light P2 acts as a diffraction grating. The laser light 61 reflected by the mirror 47 is diffracted by the wavelength of the arrangement and the arrangement pitch of the micro mirrors of the spatial modulation element 42.
因此,藉調整投影光學系統41、空間調變元件42及鏡47之傾斜,而將繞射光導光至成像透鏡48之光軸P4,可獲得繞射效率高之雷射光。Therefore, by adjusting the tilt of the projection optical system 41, the spatial modulation element 42, and the mirror 47, and guiding the diffracted light to the optical axis P4 of the imaging lens 48, laser light having high diffraction efficiency can be obtained.
此點本變形例之第4A圖及第4B圖所示之光纖8與上述一實施形態之第3A圖及第3B圖同樣地,除了從雷射光源7至投影光學系統41,以模態擾亂器11、12微小地彎曲,且形成直線部8c外,不進行留有多餘之鬆弛之繞圈。The optical fiber 8 shown in FIGS. 4A and 4B of the present modification is modally disturbed except for the laser light source 7 to the projection optical system 41 in the same manner as the third embodiment and the third embodiment of the above-described third embodiment. The devices 11 and 12 are slightly curved and formed outside the straight portion 8c, and no loop is left which allows excessive slack.
本變形例之結合透鏡17b可與半反射鏡17c、鏡17d及雷射振盪器17a分開,於Y軸方向(光軸方向)移動,換言之,可調整與半反射鏡17c、鏡17d及雷射振盪器17a之相對位置,可容許隨著投影光學系統41之傾斜調整,光纖8之入射側端面8a往Y軸方向移動。The combining lens 17b of the present modification can be separated from the half mirror 17c, the mirror 17d, and the laser oscillator 17a, and moved in the Y-axis direction (optical axis direction), in other words, the half mirror 17c, the mirror 17d, and the laser can be adjusted. The relative position of the oscillator 17a allows the incident side end face 8a of the optical fiber 8 to move in the Y-axis direction as the tilt of the projection optical system 41 is adjusted.
又,結合透鏡17b及半反射鏡17c可與鏡17d及雷射振盪器17a分開,於反射至鏡17d之雷射光之光軸方向的Z軸方向一體地移動,換言之,可調整與鏡17d及雷射振盪器17a之相對位置,而可容許隨著投影光學系統41之傾斜調整,光纖8之入射側端面8a往Z軸方向移動。Further, the coupling lens 17b and the half mirror 17c are separately movable from the mirror 17d and the laser oscillator 17a, and are integrally moved in the Z-axis direction of the optical axis direction of the laser beam reflected to the mirror 17d, in other words, the mirror 17d and the mirror 17d can be adjusted. The relative position of the laser oscillator 17a allows the incident side end face 8a of the optical fiber 8 to move in the Z-axis direction as the tilt of the projection optical system 41 is adjusted.
再者,結合透鏡17b、半反射鏡17c及鏡17d可與雷射振盪器17a分開,於Z軸方向(以雷射振盪器7a射出之雷射光之光軸方向)一體地移動,換言之,可調整與雷射振盪器17a之相對位置,可容許隨著投影光學系統41之傾斜調整,光纖8之入射側端面8a往X軸方向移動。Further, the combining lens 17b, the half mirror 17c, and the mirror 17d can be separated from the laser oscillator 17a and integrally moved in the Z-axis direction (the optical axis direction of the laser light emitted from the laser oscillator 7a), in other words, The position relative to the laser oscillator 17a is adjusted to allow the incident side end face 8a of the optical fiber 8 to move in the X-axis direction as the projection optical system 41 is tilted.
如以上,在本變形例中,結合透鏡17b以可調整與雷射振盪部17a之相對位置之狀態配置。又,結合透鏡17b及反射構件(半反射鏡17c及鏡17d)以可調整與雷射振盪器17a之相對位置之狀態配置。As described above, in the present modification, the coupling lens 17b is disposed in a state in which the relative position to the laser oscillation portion 17a can be adjusted. Further, the coupling lens 17b and the reflection member (the half mirror 17c and the mirror 17d) are disposed in a state in which the relative position to the laser oscillator 17a can be adjusted.
因此,藉使結合透鏡17b、半反射鏡17c及鏡17d與雷射振盪器17a分開,適宜移動,而容許光纖8之入射側端面8a之XYZ軸3軸方向之移動。Therefore, the coupling lens 17b, the half mirror 17c, and the mirror 17d are separated from the laser oscillator 17a, and are appropriately moved to allow the movement of the XYZ axis of the incident end surface 8a of the optical fiber 8 in the three-axis direction.
是故,在本變形例中,可使連接於光纖8之投影光學系統41自由傾斜,因而,藉將繞射光導光至成像透鏡48之光軸P4,可獲得繞射效率高之雷射光。Therefore, in the present modification, the projection optical system 41 connected to the optical fiber 8 can be freely inclined. Therefore, by irradiating the diffracted light to the optical axis P4 of the imaging lens 48, laser light having high diffraction efficiency can be obtained.
1...缺陷修正裝置1. . . Defect correction device
2...浮起台2. . . Floating platform
3...吸附搬送台3. . . Adsorption conveyor
3a...吸附部3a. . . Adsorption section
4...高架4. . . Elevated
5...加工頭5. . . Processing head
5a...殼體5a. . . case
6...雷射電源6. . . Laser power supply
7...雷射光源7. . . Laser source
7a,17a...雷射振盪器7a, 17a. . . Laser oscillator
7b,17b...結合透鏡7b, 17b. . . Combined lens
7c,17c,51,52...半反射鏡7c, 17c, 51, 52. . . Half mirror
7e,17e...LED光源7e, 17e. . . LED light source
8...光纖8. . . optical fiber
8a...入射側端面8a. . . Incident side end face
8b...射出側端面8b. . . Injection side end face
8c...直線部8c. . . Straight line
9...物鏡9. . . Objective lens
11,12...模態擾亂器11,12. . . Modal scrambler
11a-11c,12a-12c...螺絲11a-11c, 12a-12c. . . Screw
17,60,61...雷射光17,60,61. . . laser
17d,47,49...鏡17d, 47, 49. . . mirror
18...頭安裝部18. . . Head mounting
19...雷射光源單元安裝部19. . . Laser light source unit mounting section
20...水平柱20. . . Horizontal column
21...軌道twenty one. . . track
22...控制單元twenty two. . . control unit
23...基板排列機構twenty three. . . Substrate arrangement mechanism
41...投影透鏡41. . . Projection lens
42...空間調變元件42. . . Spatial modulation component
43...照射光學系統43. . . Illumination optical system
44...觀察用光源44. . . Observation light source
45...觀察用成像透鏡45. . . Imaging lens for observation
46...拍攝元件46. . . Shooting component
48...成像透鏡48. . . Imaging lens
53...集光透鏡53. . . Collecting lens
62...啟動光62. . . Start light
70...觀察用光70. . . Observation light
A...玻璃基板A. . . glass substrate
L...長度L. . . length
P1-P6...光軸P1-P6. . . Optical axis
第1A圖係顯示本發明一實施形態之缺陷修正裝置之平面圖。Fig. 1A is a plan view showing a defect correcting device according to an embodiment of the present invention.
第1B圖係顯示本發明一實施形態之缺陷修正裝置之正面圖。Fig. 1B is a front view showing a defect correction device according to an embodiment of the present invention.
第2圖係用以說明本發明一實施形態之缺陷修正裝置之加工頭內部構造的概略結構圖。Fig. 2 is a schematic block diagram showing the internal structure of a machining head of the defect correction device according to the embodiment of the present invention.
第3A圖係用以說明本發明一實施形態之缺陷修正裝置之光纖及模態擾亂器的概略側面圖。Fig. 3A is a schematic side view showing an optical fiber and a mode disturber for explaining a defect correction device according to an embodiment of the present invention.
第3B圖係用以說明本發明一實施形態之缺陷修正裝置之光纖及模態擾亂器的概略正面圖。Fig. 3B is a schematic front view showing an optical fiber and a mode disturber of the defect correction device according to the embodiment of the present invention.
第4A圖係用以說明本發明一實施形態變形例之缺陷修正裝置之雷射光源的概略側面圖。Fig. 4A is a schematic side view showing a laser light source for explaining a defect correction device according to a modification of the embodiment of the present invention.
第4B圖係用以說明本發明一實施形態變形例之缺陷修正裝置之雷射光源的概略正面圖。Fig. 4B is a schematic front view showing a laser light source of the defect correction device according to a modification of the embodiment of the present invention.
7...雷射光源7. . . Laser source
7a...雷射振盪器7a. . . Laser oscillator
7b...結合透鏡7b. . . Combined lens
7c...半反射鏡7c. . . Half mirror
7e...LED光源7e. . . LED light source
8...光纖8. . . optical fiber
8a...入射側端面8a. . . Incident side end face
8b...射出側端面8b. . . Injection side end face
8c...直線部8c. . . Straight line
11,12...模態擾亂器11,12. . . Modal scrambler
11a-11c,12a-12c...螺絲11a-11c, 12a-12c. . . Screw
41...投影透鏡41. . . Projection lens
L...長度L. . . length
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