201026419 六、發明說明： 【韻^明戶斤屬之_控_術^頁域^】 發明領域 本發明係有關於一種以雷射光修正平板顯示器 (FPD)、半導體晶圓等基板之缺陷的缺陷修正裝置。 t先*胡' 治^蚀3"】 發明背景 • 習知，採取以加工頭將從雷射光源射出之雷射光照射 至基板，而修正基板之缺陷之方式。如此進行缺陷之裝置 已知有以光纖連接雷射振盪器及加工頭之雷射加工裝置 . (參照專利文獻1)。 . 上述專利文獻1記載之雷射加工裝置包含有固定於裝 置％部之雷射振盪器、可在工作件上於水平2軸方向移動之 可動式加工頭，並以光纖連結雷射振盪器與加工頭之間。 專利文獻1 φ 日本專利公開公報平9-239578號 C !务明内3 發明揭示 發明欲解決之課題 然而’上述專利文獻1記載之雷射加工裝置由於在以光 纖分離之雷射振盪器及加工頭中僅使加工頭移動，故隨著 加工頭之移動，光纖一再變形。 當光纖一再變形時，有耐久性降低，光纖之芯線產生 龜裂’而無法以均一強度分布之雷射光進行工作件之加工 201026419 之弊端。 又，當光纖一再變形時，由於光纖内之反射條件改變， 故在光纖内傳送之雷射光之品質改變，而有無法以均一強 度分布之雷射光進行基板之加工的弊端。 本發明之課題係提供可將具有均一強度分布之雷射光 照射至基板之缺陷修正裝置。 用以欲解決課題之手段 為解決上述課題，本發明之缺陷修正裝置係以光纖將 從雷射光源所射出之雷射光導光至加王頭，以修正基板上 之缺陷部份者，其包含有：將前述基板贿在平面狀態的 基板台；隔著前述基板台架設之門型高架；使前述基板台 與刚述局架中其中一者與另一者相對地移動之驅動機構； 以可沿著前述高架之水平柱移動之狀態設置，並將前述雷 射光與加工頭安裝成一體之安裝部；將一體地安裝於前述 安裝部之前述雷射光源與前述加工頭間連結之光纖；及將 前述光纖於相互不同之方向微小地彎曲，而調整光纖内之 模態分布之複數個模態擾亂器。 發明效果 在本發明中，由於雷射光源、光纖、加工頭及複數個 模態擾亂器一體地移動，故雷射光源與加工頭之相對距離 短，且光纖之安裝形狀固定，光纖不致產生變形。 是故’根據本發明，可將具有均一強度分布之雷射光 照射至基板。 t實施冷式】 201026419 用以實施發明之最佳形態 以下’參照圖式’就本發明一實施形態之缺陷修正裝 置作說明。 第1A圖及第1 b圖係顯示本發明一實施形態之缺陷修 正裝置1之平面圖及正面圖。 第2圖係用以說明缺陷修正裝置1之加工頭5之内部構 造的概略結構圖。 φ 第3A圖及第3B圖係用以說明缺陷修正裝置1之光纖8 及模態擾礼器11、12之概略側面圖及概略正面圖。 缺陷修正裝置1係用於修復加工等，該修復加工係在液 . 晶顯示器（LCD)等FPD之製程之光微影處理步驟形成有電 - 路圖形之玻璃基板A檢測出配線部份之短路、光阻劑之溢出 等缺陷時，以雷射光去除缺陷者。 如第1A圖及第1B圖所示，缺陷修正裝置1包含有使基 板A在保持水平之平面狀態下浮起之浮起台2、在此浮起台2 φ 之侧邊’吸附保持基板A之一側緣部（與搬送方向平行之一 邊），將之於X方向搬送之吸附搬送台3、隔著浮起台2，於 與基板搬送方向垂直相交之γ方向架設之門型高架（移動機 構Μ、沿著此高架4之水平柱20，於Y方向一體地移動之加 工頭5及雷射光源單元（雷射電源6、雷射光源7、光纖8及2 個模態擾亂器11、12)。 高架4具有用以使用以安裝加工頭5之頭安裝部18與用 以安裝雷射電源6及雷射光源7之雷射光源單元安裝部19沿 著水平柱20移動之移動機構。頭安裝部18以懸臂梁狀且以 201026419 圖中未示之線性引導軌道及線性馬達可於γ方向移動之狀 態設置於構成高架4之水平柱20之側邊。又，在頭安裝部 18 ’將物鏡9朝向鉛直下方，而安裝有加工頭5。 雷射光源單元安裝部19係以可沿著設置於水平桎2〇上 面之軌道21 ’於γ方向滑動之狀態支撐之滑件，於水平柱2〇 之錯直上方配置重量較大之雷射電源6及雷射光源7。 該等頭安裝部18及雷射光源單元安裝部19藉相互固 定，而一體地於Υ方向移動。 要使用缺陷修正裝置1，進行玻璃基板Α之後述顯微鏡 檢查及雷射加工，乃在以圖中未示之搬送機器人等使基板A 載置浮起於浮起台2上之狀態下，以具有基準銷及壓制鎖之 基板排列機構23定位。定位後，使吸附搬送台3上升，以吸 附部3a吸附玻璃基板A，使吸附搬送台3之線性馬達驅動， 而沿著線性引導軌道於X方向搬送。 根據以配置於FDP製造線之圖形檢查裝置等界定之玻 璃基板A之缺陷位置資訊，使加工頭5於Y方向移動，使吸 附搬送台3於X方向移動，進行後述之顯微鏡檢查及雷射加 工，藉此，可在玻璃基板A之幾乎全面範圍施行顯微鏡檢查 及雷射加工。 在此，光纖8之入射側端面8a連接於雷射光源7，射出 側端面8b連接於加工頭5之配置有投影透鏡（投影光學系 統)41之入射埠側。 如第3A圖及第3B圖所示，於光纖8配置對光纖8從不同 之方向施加按壓力’而生成微小彎曲之2個模態擾亂器11、 201026419 12。又，光纖8形成有以與加工頭5之投影光學系統之光軸 一致之狀態朝射出側端面8b延伸成一直線狀之直線部gc。 此光纖8之直線部8c藉以固定構件將光纖8之一部份固定於 雷射光源單元安裝部19 ’將光纖8之前端部安裝於加工頭5 之輸入埠，而可將光纖8之射出側之一部份固定成直線狀。 入射侧之模態擾亂器11係隔著光纖8，於光纖一側配置 2根螺絲iia、iic，於在此2根螺絲lla、llc之間之光纖8之 另一側配置1根螺絲1 lb而構成。中央之螺絲11 b將光纖8按 壓至X軸之負方向，兩端之螺絲lla、lie將光纖8按壓至X 軸之正方向。藉此，從入射側端面8a於Y轴方向延伸之光纖 8在XY平面於X軸方向微小地彎曲。此時，亦可將兩側之2 根螺絲lla、lie換成固定銷，扭擰正中央之1根螺絲丨ib， 而對光纖8施加按壓力，使其微小地彎曲。又，亦可藉將正 中央之螺絲lib換成固定銷’扭擰兩側之螺絲iia、ilc，而 對光纖8施加按壓力，使其微小地彎曲。 又，射出側之模態擾亂器12亦與入射側之模態擾亂器 11同樣地，以3根螺絲12a、12b、12c構成。中央之螺絲12b 將光纖8按壓至Z轴之正方向，兩端之螺絲12a、i2c將光纖 按壓至Z軸之負方向。藉此，於γ軸方向延伸之光纖8在丫2 平面於Z軸方向微小地彎曲。 此時，亦可亦將兩側之2根螺絲12a、12c換成固定銷， 扭擰正中央之1根螺絲lib，而對光纖8施加按壓力，使其微 小地彎曲。又，亦可藉將正中央之螺絲12b換成固定銷，扭 擰兩側之螺絲12a、12c，而對光纖8施加按壓力，使其微小 7 201026419 地彎曲。 離擾二 ……藉螺合在形成於模 纖之按壓量 心擾亂器u、12之圖中未示之殼體等的螺 纖之按壓昔。 』調正先 如上述，在本實施形態中，入射側模態擾亂器^及射 側模態擾爾1器12可將光纖8於相互垂直相 方向及Z㈣向)微小地料。 方⑽轴 在此，藉以各模態擾亂器u、12將光纖8微小地彎曲， I去除入射至為多模光纖之光纖8之雷射光的高次模，而獲 得穩定之模態分布’因而，可以後述之加工頭5將具有均一 之強度分布之雷射光照射至基板A。 再者，在本實施形態中’藉2個模態擾礼器u ' Η將光 _於相互垂直相交之方向微小地彎曲，可較以⑽模態優 亂器將光纖於同-方向微小地彎折之情形更確實地 次模，因而，可獲得更穩定之模式分布。 又，在本實施形態中，由於使用將光纖8於不同方向微 小地彎曲之複數個模態擾亂器丨丨、12，故可獲得較使用習 知使光纖旋繞多次之模態擾亂器穩定之模式分布。 此外，在本實施形態中，由於2個模態擾亂器u、12使 光纖8於相互垂直相交之方向蜿蜒，故可獲得非常穩定之模 態分布，若複數個模態擾亂器中之2個模態擾亂器使光纖8 蜿蜒之方向不同時，該等構成之角度雖以接近垂直為理 想，但可較於同一方向微小地彎曲之情形，有效地去除高 次模。 201026419 又 在本實施形態中，以模態擾薦L器U、12q_ 光纖8婉蜒，只要可將光纖8微小地弯曲，可使用鎖、 或者供光朗f人之减溝婉蜒形成之構件等，宜使用= 使光纖8損傷者。 易 又，在本實施形態中，各模態擾亂器u、η以3根_ 或銷之組合構成，亦可將螺絲或銷配置5根、7根之奇數根 螺絲，而可於同一方向形成複數微小之彎曲。201026419 VI. Description of the Invention: [Dynamics] The control field of the invention is related to the defect of correcting defects of a flat panel display (FPD), a semiconductor wafer or the like by laser light. Correct the device. tFirst*Hu's governance^3"] Background of the invention • It is conventional to adopt a method in which a laser beam emitted from a laser light source is irradiated onto a substrate to correct defects of the substrate. A device for performing such a defect is known as a laser processing device in which a laser oscillator and a processing head are connected by an optical fiber (see Patent Document 1). The laser processing apparatus described in Patent Document 1 includes a laser oscillator fixed to a % of the device, a movable machining head movable in a horizontal axis direction on the workpiece, and a laser oscillator coupled to the laser. Between the processing heads. Patent Document 1 φ Japanese Patent Laid-Open Publication No. Hei 9-239578 C. The present invention discloses a problem to be solved by the invention. However, the laser processing apparatus described in the above Patent Document 1 is a laser oscillator and processing which is separated by an optical fiber. Only the machining head is moved in the head, so the fiber is deformed again and again as the machining head moves. When the optical fiber is repeatedly deformed, the durability is lowered, and the core wire of the optical fiber is cracked, and the processing of the workpiece can not be performed with the uniform intensity of the laser light. Further, when the optical fiber is repeatedly deformed, since the reflection condition in the optical fiber changes, the quality of the laser light transmitted in the optical fiber changes, and there is a drawback that the substrate cannot be processed by laser light having a uniform intensity distribution. SUMMARY OF THE INVENTION An object of the present invention is to provide a defect correcting device which can irradiate laser light having a uniform intensity distribution to a substrate. Means for Solving the Problem In order to solve the above problems, the defect correction device of the present invention is configured to guide a laser beam emitted from a laser light source to a king head to correct a defective portion on the substrate, which includes a substrate table in which the substrate is bribed in a planar state; a gate type elevated frame that is erected via the substrate substrate; and a driving mechanism that moves the substrate table and one of the just-in-between shelves relative to the other; a mounting portion that is disposed along the moving horizontal column and that mounts the laser beam and the processing head; and an optical fiber that is integrally connected to the mounting portion and is coupled between the laser light source and the processing head; and The plurality of modal disturbers that adjust the modal distribution in the optical fiber by slightly bending the optical fibers in mutually different directions. Effect of the Invention In the present invention, since the laser light source, the optical fiber, the processing head and the plurality of modal disturbers move integrally, the relative distance between the laser light source and the processing head is short, and the mounting shape of the optical fiber is fixed, and the optical fiber is not deformed. . According to the present invention, laser light having a uniform intensity distribution can be irradiated onto the substrate. t. The cold type is applied. 201026419 BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, a defect correcting device according to an embodiment of the present invention will be described with reference to the drawings. Figs. 1A and 1b are a plan view and a front view showing a defect correcting device 1 according to an embodiment of the present invention. Fig. 2 is a schematic structural view for explaining the internal structure of the machining head 5 of the defect correction device 1. φ 3A and 3B are schematic side views and schematic front views for explaining the optical fiber 8 and the modal disturbance devices 11 and 12 of the defect correction device 1. The defect correcting device 1 is used for repair processing or the like, and the repair processing is performed by a light lithography process in a process such as a liquid crystal display (LCD), and a glass substrate A having an electric path pattern is formed to detect a short circuit of the wiring portion. In the case of defects such as the overflow of the photoresist, the defect is removed by laser light. As shown in FIGS. 1A and 1B, the defect correcting device 1 includes a floating table 2 for floating the substrate A in a planar state in which it is held horizontally, and a substrate A on the side of the floating table 2 φ. One side edge portion (one side parallel to the conveying direction), the adsorption conveying table 3 that is conveyed in the X direction, and the door type overhead frame (moving mechanism) that is placed in the γ direction perpendicular to the substrate conveying direction via the floating table 2加工, along the horizontal column 20 of the overhead frame 4, the processing head 5 and the laser light source unit integrally moving in the Y direction (the laser power source 6, the laser light source 7, the optical fiber 8 and the two modal disturbance devices 11, 12) The overhead frame 4 has a moving mechanism for moving along the horizontal column 20 using the head mounting portion 18 for mounting the processing head 5 and the laser light source unit mounting portion 19 for mounting the laser power source 6 and the laser light source 7. The mounting portion 18 is disposed in a cantilever beam shape and is disposed on the side of the horizontal column 20 constituting the overhead frame 4 in a state in which the linear guide rail and the linear motor are not shown in the figure of 201026419, and can be moved in the γ direction. Further, the head mounting portion 18' The objective lens 9 is oriented vertically downward and is mounted with a processing head 5. Laser light The source unit mounting portion 19 is provided with a slider which is supported in a state of being slidable in the γ direction along the rail 21' provided on the horizontal 桎2〇, and a laser power source 6 having a large weight is disposed above the horizontal column 2〇. And the laser light source 7. The head mounting portion 18 and the laser light source unit mounting portion 19 are integrally fixed to each other in the x direction. To use the defect correcting device 1, the glass substrate is subjected to microscopic examination and laser irradiation. In the state in which the substrate A is placed on the floating table 2 by a transfer robot or the like, which is not shown, the substrate A is positioned by the substrate array mechanism 23 having the reference pin and the press lock. After the positioning, the adsorption is carried out. When the stage 3 is raised, the glass substrate A is adsorbed by the adsorption unit 3a, and the linear motor of the adsorption transfer table 3 is driven to be transported in the X direction along the linear guide track. The glass substrate defined by the pattern inspection device or the like disposed on the FDP manufacturing line is used. The defect position information of A moves the processing head 5 in the Y direction, moves the adsorption transfer table 3 in the X direction, and performs microscopic inspection and laser processing described later, whereby the glass substrate A can be almost comprehensively The microscope side and the laser processing are performed. Here, the incident side end face 8a of the optical fiber 8 is connected to the laser light source 7, and the exit side end face 8b is connected to the incident side of the processing head 5 where the projection lens (projection optical system) 41 is disposed. As shown in FIGS. 3A and 3B, two modal disturbers 11, 201026419 12 are formed on the optical fiber 8 to apply a pressing force to the optical fiber 8 from different directions. Further, the optical fiber 8 is formed with A straight line portion gc extending in a straight line toward the emission side end surface 8b in a state in which the optical axis of the projection optical system of the processing head 5 coincides. The linear portion 8c of the optical fiber 8 fixes a part of the optical fiber 8 to the laser light source by the fixing member. The unit mounting portion 19' attaches the front end portion of the optical fiber 8 to the input port of the processing head 5, and can fix one portion of the exit side of the optical fiber 8 in a straight line shape. The mode disturber 11 on the incident side is provided with two screws iia and iic on the side of the optical fiber via the optical fiber 8, and one screw 1 lb is disposed on the other side of the optical fiber 8 between the two screws 11a and 11c. And constitute. The central screw 11 b presses the optical fiber 8 to the negative direction of the X-axis, and the screws 11a and lie at both ends press the optical fiber 8 to the positive direction of the X-axis. Thereby, the optical fiber 8 extending from the incident side end surface 8a in the Y-axis direction is slightly curved in the X-axis direction on the XY plane. At this time, the two screws lla and lie on both sides may be replaced with a fixing pin, and one screw 丨 ib in the center may be twisted, and a pressing force is applied to the optical fiber 8 to be slightly bent. Further, by pressing the screw lib in the center to the fixing pin', the screws iia and ilc on both sides are twisted, and the pressing force is applied to the optical fiber 8 to be slightly bent. Further, the mode disturber 12 on the emission side is also constituted by three screws 12a, 12b, and 12c similarly to the mode disturber 11 on the incident side. The central screw 12b presses the optical fiber 8 in the positive direction of the Z-axis, and the screws 12a and i2c at both ends press the optical fiber to the negative direction of the Z-axis. Thereby, the optical fiber 8 extending in the γ-axis direction is slightly curved in the Z-axis direction on the 丫2 plane. At this time, the two screws 12a and 12c on both sides may be replaced with a fixing pin, and one screw lib in the center may be twisted, and a pressing force is applied to the optical fiber 8 to be slightly bent. Further, the screw 12b in the center can be replaced with a fixing pin, and the screws 12a and 12c on both sides can be twisted, and the pressing force is applied to the optical fiber 8 to bend the micro 7 201026419. The disturbance is caused by the screwing of the screw or the like which is not shown in the figure of the pressing amount of the core disturbers u, 12. MODIFICATION As described above, in the present embodiment, the incident side modal disturber and the side modal disturber 12 can microscopically feed the optical fibers 8 in the mutually perpendicular direction and the Z (four) direction. Here, the square (10) axis is used, whereby the optical fibers 8 are slightly bent by the modal disturbers u, 12, and the high-order mode of the laser light incident on the optical fiber 8 of the multimode fiber is removed, thereby obtaining a stable modal distribution. The processing head 5, which will be described later, irradiates the substrate A with laser light having a uniform intensity distribution. Furthermore, in the present embodiment, 'by the two modal disturbances u' Η, the light _ is slightly curved in a direction perpendicular to each other, and the optical fiber can be slightly in the same direction as the (10) modal stalker. The case of bending is more sub-mode, and thus, a more stable mode distribution can be obtained. Further, in the present embodiment, since a plurality of modal disturbers 丨丨, 12 which slightly bend the optical fiber 8 in different directions are used, it is possible to obtain a modal disturbance which is conventionally used to circulate the optical fiber a plurality of times. Pattern distribution. In addition, in the present embodiment, since the two modal disturbers u, 12 cause the optical fibers 8 to 蜿蜒 in a direction perpendicular to each other, a very stable modal distribution can be obtained, if 2 of the plurality of modal scramblers When the modal disturbers make the directions of the optical fibers 8 不同 different, the angles of the constituents are ideal to be close to vertical, but the high-order modes can be effectively removed compared with the case where the same direction is slightly curved. 201026419 In the present embodiment, the L device U, 12q_ fiber 8婉蜒 is erroneously modally used, and as long as the optical fiber 8 can be slightly bent, a lock or a member formed by a light-reducing groove can be used. It is advisable to use = to damage the fiber 8 . Further, in the present embodiment, each of the mode disturbers u and η is composed of a combination of three _ or pins, and five or seven odd-numbered screws may be arranged in the screw or the pin to form the same direction. Multiple tiny bends.
本實施形態之直線部8c不是以固定光纖8之固定構件 強制形成，而是因模態擾anu、12與加工頭5之位置關 係’形成[直線狀延伸，何藉簡定構件固定光纖8 ’ 而強制形成直線部8c。 此外，直線雜之長度L要使雷射光之強度分布均—， 以50mm為佳’較佳可為i〇〇mni以上。 又，在本實施形態，當驅動頭安裝部18時，頭安裝部 18及雷射單元安裝部lg-體地於γ方向驅動之結果，加工頭 5及雷射單元（雷射電源6、雷射光源7、光纖8及模態擾亂器 11、12)-體地於Y方向移動。即，即使使加工頭5移動光 纖8也不致變形，而在維持固定形態之狀態下，使其移動。 因此’由於即使加工頭5移動，雷射光源7、光纖S及模 態擾亂器11、12-起移動，故光纖8不致變形，可將光纖8 内之反射條件經常保持固定，而可使照射至基板A之雷射光 之強度分布穩定。結果，可經常照射均一強度分布之雷射 光，而可繼續高精確度之雷射加工。 又，由於在不使光纖8變形下結束，故可防止因一再使 201026419 用而易損傷之光纖8之惡化。 又，在本實施形態中，僅將較輕量之加工頭5安裝於懸 臂梁狀之頭安裝部18，而將重量較大之雷射電源6及雷射光 源7配置於門型水平柱20之鉛直上方，故於加工頭5移動 時，可將施加於安裝頭部78之負荷抑制在最小限度。因而， 可進行加工頭5之高精確度之移動，而可以良好精確度進行 雷射加工。 又，在本實施形態中，以浮起台2使玻璃基板A浮起， 而以吸附搬送台3使其於X方向移動，以高架4使加工頭5於 〇 Y方向移動，而進行在基板A之幾乎全面範圍之顯微鏡檢查 及雷射加工，取而代之，亦可固定基板A，使高架4於X方 向一直移動，而使加工頭5及雷射單元沿著高架4之水平柱 20於Y方向移動。 以下’一面特別參照第2圖，一面就缺陷修正裝置1之 加工頭5之内部結構等作說明。 雷射光源7係修復加工用光源。在本實施形態中，如第 3A圖及第3B圖所示，採用具有雷射振盪器乃、結合透鏡 ® 7b、半反射鏡7C及LED光源7e之結構。 雷射振盈器7a係為可去除玻璃基板a上之缺陷，而將設 疋了波長、輸出之雷射光振蘯者，舉例言之，可適合採用 脈衝可振盪之YAG雷射等。振盪波長可按修復對象，切換 複數振盪波長。 雷射振盪器7a電性連接於控制單元22，按來自控制單 元22之控制信號’控制振盪。 10 201026419 半反射鏡7("將以雷射振盪器7a於X軸負方向振盪之雷 射光朝結合透鏡7b於γ軸負方向反射。又，半反射鏡氕供從 LED光源7e朝向結合透鏡71)於¥軸負方向射出之光透過。 由於半反射鏡乃將以雷射振盪器7a振盪之雷射光朝結 合透鏡7b反射’而可配合裝置結構來決定雷射振盪器乃之 振盪方向，故設計之自由度增加，並且可謀求省空間化。 結合透鏡7b係用以將從雷射振盪器7&射出之雷射光與 光纖3光結合之光學元件。 響 光纖8係使以結合透鏡7b與光纖端面8a結合之雷射光 在内部傳播而將之導引至加工頭5内，作為雷射光6〇，從光 - 纖端面8b射出者。由於雷射光60在光纖8之内部傳播後射 出，故即使雷射振盪器7a之雷射光為高斯分布，亦形成具 光量分布均一化之擴大的光線。 此外，因第2圖係模式圖’故圖中顯示從雷射振蓋器7& 射出之雷射光光軸沿著Z方向，而在本實施形態，則如第33 φ 圖所示，沿著x軸方向。惟，雷射振盪器7a之配置位置、姿 勢不限於該等。 又’雷射光之均-化機構除了上述模態擾亂器u、12 外，亦可為使用使用了其他光學元件、例如複眼透鏡、繞 射元件、非球面透鏡或萬花筒型桿者等各種結構之均質機 等的結構。 加工頭5於其殼體5a内保持有投影透鏡（投影光學系 統)4卜空間調變元件42、照射光學系統43、觀察用光源44、 觀察用成像透鏡45、拍攝元件46等光學元件或設備。 201026419 投影透鏡41係令固定於加工頭5之殼體5a之光纖8的光 纖端面8b與空間調變元件42之基準面為共軛之關係的配 置’係設定投影倍率，俾可使光纖端面8b之像照射空間調 變元件42之調變區域全體之透鏡或透鏡群。 在第2圖中，投影透鏡41之光軸P1設定於在ZY平面， 隨著從Y轴正方向朝向負方向，而從Z轴正方向朝向負方向 之傾斜方向。 空間調變元件42係將從投影透鏡41投射之雷射光61空 間調變者，由微小鏡陣列之DMD(Digital Mirror Device)構 成’可控制搖動之複數微小鏡在矩形之調變區域内以等間 距二維排列。 在本實施形態中，於雷射光61之光程上配置鏡47，將 雷射光61之光軸P1於光轴P2之方向反射。而且雷射光61為 沿著沿空間調變元件42基準面之法線之光轴P3作為啟動光 62反射，而呈對空間調變元件42基準面之法線以所期角度 入射之配置。此外，光轴PI、P2與啟動光62之光軸P3位於 同一平面上。 照射光學系統43係構成將以空間調變元件42空間調變 而朝一定方向反射之啟動光62之像以所期之倍率於玻璃基 板A上成像之成像光學系統的光學元件群，成像透鏡48配置 於空間調變元件42側，物鏡9配置於玻璃基板a侧。 物鏡9由用以將玻璃基板A之抗蝕圖形加工之紫外線用 物鏡等複數個物鏡構成。該等複數個物鏡以可以旋轉器機 構切換之狀態保持，倍率彼此不同。因此，藉使旋轉器機 12 201026419 構旋轉’切換物鏡9，可變更照射光學系統8之倍率。以下，只 要未特別限制，物鏡9係指選擇構成照射光學系統43之透鏡。 又，在本實施形態中，成像透鏡48之光軸Ρ4配置成與γ 軸方向平行’物鏡9之光轴Ρ5配置成與Ζ軸方向平行。 因此，於空間調變元件42與成像透鏡48間設置有反射 啟動光62 ’使其沿著光軸Ρ4入射之鏡49。而且於成像透鏡 48與物鏡9間設置有反射透過成像透鏡48之光，使其沿著光 轴Ρ5入射之半反射鏡51。 如此進行，光軸Ρ4、Ρ5與光轴PI、Ρ2、Ρ3位於同一平 面上。即’構成從雷射光源7a以空間調變元件42之在啟動 狀態之微小鏡反射’經由照射光學系統43而到達基板A之第 1光軸之光軸P1〜P5皆位於同一平面上。 又’鏡49及半反射鏡51皆僅於X軸周圍傾斜。 觀察用光源44係產生用以照明玻璃基板a上之可加工 區域内之觀察用光70的光源，設置於半反射鏡51與物鏡9間 之光程之側邊。 於在半反射鏡51與物鏡9間之光程上與觀察用光源44 相對之位置設置使以半反射鏡51反射之啟動光62透過，將 觀察用光70朝向物鏡9反射之半反射鏡52。而且於觀察用光 源44與半反射鏡52間設置有將觀察用光70集光成適宜徑之 照明光束之集光透鏡53。此外，集光透鏡53之光轴P6可在 第1光軸所在之平面上，亦可在交叉之位置。 觀察用光源44可採用諸如產生可視光之氙燈或LED等 適宜光源。此外，亦可設置具有自動對焦用光源之自動對 13 201026419 焦單元’以控制物鏡9之前側焦點位置。 觀察用成像透鏡(拍攝光學系統)45係在半反射鏡51之 上方側與物鏡9之光軸P5配置於同軸，用以將從以觀察用光 7〇所照明之破璃基板a反射，而以物鏡9所集光之光於拍攝 元件(拍攝部)46之拍攝面上成像的光學元件。因此，光轴p5 兼作為從基板A經由拍攝光學系統，到達拍攝部之第2光 轴。此外’拍攝元件46係將於拍攝面上成像之圖像光電轉 換者，由CCD等構成。 控制單元22之裝置結構在本實施形態中，由以cpu、 記憶體、輸人輸出部、外部記憶裝置等構成之電腦與適宜 之硬體之組合組成。控制單元22係依具有操作面板、鍵盤、 滑鼠等適宜之操作輸人機構之用戶介面的操作輸入，控制 缺陷修正裝置丨之動作者，電性連接於雷射光源7、空間調 變元件42、拍攝元件46,而可㈣各自之動作及動作時間。 控制單疋22對雷射振盈器％送出使雷射光振盈之控制 信號，依按基板A而預先選擇之照射條件，從雷射㈣器％ 使雷射光《。雷射光之照射條件有波長、光輸出、振逢 脈衝寬度等。 業經振盘之雷射光以結合透鏡几與光纖8之光纖端面 如光結合，以上述模態擾㈣】卜12及直線部8谈光纖端 面处射出光強度分布已均—化之發散光之雷射光60。 此外，在本實施形態中，就進行在卿製程製造之玻 璃基板A之缺陷修正的缺陷修正裝置⑽了說明，缺陷修正 裝置1亦可賴作為崎铸體晶目基板之缺陷修正者。 201026419 第4A圖及第4B圖係用以說明本發明一實施形態變形 例之缺陷修正裝置之雷射光源17的概略側面圖。 此外，在第4A圖及第4B圖中，以括弧將結合透鏡17b、 半反射鏡17c及鏡17d之可動方向附上符號。 本變形例之雷射米源17具有雷射振蘯器17a、_結合透鏡 17b、作為反射構件之半反射鏡17c、及鏡17d。與上述實施 形態之雷射光源7之不同主要係配置鏡17d之點以及結合透 鏡17b、半反射鏡17c及鏡17d為可動式之點，與上述一實施 形態同樣地，於光纖8配置有模態擾亂器11、12，且形成有 直線部8c。 - 如第4B圖所示，從雷射振盪器17a於X軸負方向射出之 雷射光如第4A圖所示，以鏡17d於Z軸正方向反射，進一 步，以半反射鏡17c於Y轴負方向反射，而入射至結合透鏡 17b。此外，半反射鏡17c使從作為顯示雷射照射位置之引 導光之LED光源17e朝向結合透鏡7b於Y軸負方向射出的光 ❹ 透過。 而第2圖所示之空間調變元件4 2之微小鏡以等間距排 列而於同一方向傾斜時，對雷射光P2作用作為繞射光柵。 以鏡47反射之雷射光61按其波長與空間調變元件42之微小 鏡的排列間距而繞射。 因此，藉調整投影光學系統41、空間調變元件42及鏡 47之傾斜，而將繞射光導光至成像透鏡佔之光軸p4，可獲 得繞射效率南之雷射光。 此點本變形例之第4A圖及第4B圖所示之光纖8與上述 15 201026419 一實施形態之第3A圖及第3B圖同樣地，除了從雷射光源7 至投影光學系統41，以模態擾亂器11、12微小地彎曲，且 形成直線部8c外，不進行留有多餘之鬆弛之繞圈。 本變形例之結合透鏡17b可與半反射鏡17c、鏡17d及雷 射振盪器17分開，於Y軸方向（光軸方向）移動，換言之，可 調整與半反射鏡17c、鏡17d及雷射振盪器17c之相對位置， 可容許隨著投影光學系統41之傾斜調整，光纖8之入射侧端 面8a往Y軸方向移動。 又，結合透鏡17b及半反射鏡17c可與鏡17d及雷射振盪 器17a分開，於反射至鏡I7d之雷射光之光軸方向的Z軸方向 一體地移動，換言之，可調整與鏡17d及雷射振盪器17a之 相對位置’而可容許隨著投影光學系統41之傾斜調整，光 纖8之入射側端面8a往Z轴方向移動。 再者’結合透鏡17b、半反射鏡17c及鏡17d可與雷射振 盪器17a分開，於Z軸方向（以雷射振盪器7a射出之雷射光之 光軸方向）一體地移動，換言之，可調整與雷射振盪器17a 之相對位置’可容許隨著投影光學系統41之傾斜調整，光 纖8之入射側端面8a往X轴方向移動。 如以上’在本變形例中，結合透鏡17b以可調整與雷射 振盪部17a之相對位置之狀態配置。又，結合透鏡i7b及反 射構件（半反射鏡17c及鏡17d)以可調整與雷射振盪器i7a之 相對位置之狀態配置。 因此，藉使結合透鏡17b、半反射鏡17c及鏡17d與雷射 振盪器17a分開’適宜移動，而容許光纖8之入射側端面8a 16 201026419 之XYZ軸3軸方向之移動。 是故，在本變形例中，可使連接於光纖8之投影光學系 統41自由傾斜，因而，藉將繞射光導光至成像透鏡48之光 軸Ρ4，可獲得繞射效率高之雷射光。 I：圖式簡草説明3 第1Α圖係顯示本發明一實施形態之缺陷修正裝置之平 面圖。The linear portion 8c of the present embodiment is not forcibly formed by the fixing member of the fixed optical fiber 8, but is formed by the positional relationship between the mode disturbance anu and 12 and the machining head 5 [linear extension, and the fixed member fixing optical fiber 8' The straight portion 8c is forcibly formed. Further, the length L of the straight line is such that the intensity distribution of the laser light is - preferably 50 mm, preferably more than i 〇〇 mni. Further, in the present embodiment, when the head mounting portion 18 is driven, the head mounting portion 18 and the laser unit mounting portion lg are mechanically driven in the γ direction, and the processing head 5 and the laser unit (the laser power source 6 and the lightning unit) The light source 7, the optical fiber 8, and the modal disturbers 11, 12) are physically moved in the Y direction. That is, even if the processing head 5 is moved by the optical fiber 8, it is not deformed, but is moved while maintaining the fixed state. Therefore, since the laser light source 7, the optical fiber S, and the mode disturbers 11, 12 move even if the processing head 5 moves, the optical fiber 8 is not deformed, and the reflection conditions in the optical fiber 8 can be kept constant, and the irradiation can be performed. The intensity distribution of the laser light to the substrate A is stable. As a result, laser light of a uniform intensity distribution can be constantly irradiated, and high-precision laser processing can be continued. Further, since the optical fiber 8 is not deformed, the deterioration of the optical fiber 8 which is easily damaged by the use of the 201026419 can be prevented. Further, in the present embodiment, only the lighter processing head 5 is attached to the cantilever beam head mounting portion 18, and the larger laser power source 6 and the laser light source 7 are disposed on the gate type horizontal column 20. Since the vertical direction of the lead is moved, the load applied to the mounting head 78 can be minimized. Therefore, the high precision movement of the processing head 5 can be performed, and the laser processing can be performed with good precision. Further, in the present embodiment, the glass substrate A is floated by the floating table 2, and the adsorption transfer table 3 is moved in the X direction, and the processing head 5 is moved in the 〇Y direction by the overhead 4 to perform the substrate. Substantially comprehensive microscopic examination and laser processing of A, instead, the substrate A can be fixed so that the overhead frame 4 is always moved in the X direction, so that the processing head 5 and the laser unit are along the horizontal column 20 of the overhead frame 4 in the Y direction. mobile. The following description of the internal structure of the processing head 5 of the defect correction device 1 will be described with reference to Fig. 2 in particular. The laser light source 7 is a light source for repairing processing. In the present embodiment, as shown in Figs. 3A and 3B, a structure including a laser oscillator, a coupling lens ® 7b, a half mirror 7C, and an LED light source 7e is employed. The laser vibrator 7a is a laser that can remove the defects on the glass substrate a and is provided with a wavelength and output laser light. For example, a pulse oscillatable YAG laser or the like can be suitably used. The oscillation wavelength can be switched to the complex object to switch the complex oscillation wavelength. The laser oscillator 7a is electrically coupled to the control unit 22 to control the oscillation in accordance with a control signal ' from the control unit 22. 10 201026419 Half mirror 7 ("The laser light oscillating in the negative direction of the X-axis with the laser oscillator 7a is reflected in the negative direction of the γ-axis toward the coupling lens 7b. Further, the half mirror 氕 is supplied from the LED light source 7e toward the coupling lens 71) The light emitted in the negative direction of the ¥ axis passes through. Since the half mirror reflects the laser light oscillated by the laser oscillator 7a toward the coupling lens 7b and can determine the oscillation direction of the laser oscillator in accordance with the device structure, the degree of freedom in design increases, and space can be saved. Chemical. The coupling lens 7b is an optical element for combining the laser light emitted from the laser oscillator 7& and the optical fiber 3. The optical fiber 8 is such that the laser beam combined with the fiber end surface 8a by the coupling lens 7b propagates inside and is guided into the processing head 5, and is emitted as the laser beam 6b from the light-fiber end face 8b. Since the laser light 60 is emitted after being propagated inside the optical fiber 8, even if the laser light of the laser oscillator 7a has a Gaussian distribution, light having an enlarged uniformity of the light amount distribution is formed. In addition, in the second diagram, the schematic diagram shows that the laser beam emitted from the laser vibrator 7& is along the Z direction, and in the present embodiment, as shown in the 33rd φ diagram, along the The x-axis direction. However, the arrangement position and posture of the laser oscillator 7a are not limited to these. Further, in addition to the above-described modal scramblers u and 12, the laser light equalization mechanism may be of various structures such as a use of other optical elements such as a fly-eye lens, a diffractive element, an aspherical lens or a kaleidoscope type rod. Structure of homogenizer, etc. The processing head 5 holds an optical element or device such as a projection lens (projection optical system) 4, a spatial modulation element 42, an observation optical system 43, an observation light source 44, an observation imaging lens 45, and an imaging element 46 in the casing 5a. . 201026419 The projection lens 41 sets the projection magnification in the arrangement of the fiber end surface 8b of the optical fiber 8 fixed to the casing 5a of the machining head 5 and the reference surface of the spatial modulation element 42, so that the fiber end face 8b can be made. The image illuminates the entire lens or lens group of the modulation region of the spatial modulation element 42. In Fig. 2, the optical axis P1 of the projection lens 41 is set in the ZY plane, and is inclined from the positive direction of the Z-axis toward the negative direction as it goes from the positive direction of the Y-axis to the negative direction. The spatial modulation element 42 is a spatial modulation of the laser light 61 projected from the projection lens 41, and is composed of a DMD (Digital Mirror Device) of the micro mirror array, and the plurality of micro mirrors that can control the shaking are arranged in a rectangular modulation region. The spacing is two-dimensionally arranged. In the present embodiment, the mirror 47 is disposed on the optical path of the laser beam 61, and the optical axis P1 of the laser beam 61 is reflected in the direction of the optical axis P2. Further, the laser beam 61 is reflected as the start light 62 along the optical axis P3 along the normal line of the reference surface of the spatial modulation element 42, and is placed at a predetermined angle with respect to the normal line of the reference surface of the spatial modulation element 42. Further, the optical axes PI, P2 are located on the same plane as the optical axis P3 of the start light 62. The illuminating optical system 43 constitutes an optical element group of the imaging optical system that images the image of the illuminating light 62 that is spatially modulated by the spatial modulating element 42 and is reflected in a certain direction at a desired magnification on the glass substrate A. The imaging lens 48 It is disposed on the side of the spatial modulation element 42 and the objective lens 9 is disposed on the side of the glass substrate a. The objective lens 9 is composed of a plurality of objective lenses such as an ultraviolet objective lens for processing a resist pattern of the glass substrate A. The plurality of objective lenses are held in a state in which they can be switched by the rotator mechanism, and the magnifications are different from each other. Therefore, the magnification of the illumination optical system 8 can be changed by rotating the rotator machine 12 201026419 to switch the objective lens 9. Hereinafter, the objective lens 9 is a lens that selects the illumination optical system 43 as long as it is not particularly limited. Further, in the present embodiment, the optical axis Ρ 4 of the imaging lens 48 is disposed in parallel with the γ-axis direction. The optical axis Ρ 5 of the objective lens 9 is disposed in parallel with the Ζ-axis direction. Therefore, between the spatial modulation element 42 and the imaging lens 48, a mirror 49 that reflects the activation light 62' to enter the optical axis Ρ4 is provided. Further, between the imaging lens 48 and the objective lens 9, a half mirror 51 which reflects light transmitted through the imaging lens 48 and enters along the optical axis Ρ5 is provided. In this manner, the optical axes Ρ4 and Ρ5 are located on the same plane as the optical axes PI, Ρ2, and Ρ3. That is, the "optical mirror reflections constituting the activation state of the spatial modulation element 42 from the laser light source 7a" and the optical axes P1 to P5 of the first optical axis reaching the substrate A via the illumination optical system 43 are all on the same plane. Further, both the mirror 49 and the half mirror 51 are inclined only around the X-axis. The observation light source 44 generates a light source for illuminating the observation light 70 in the processable region on the glass substrate a, and is disposed on the side of the optical path between the half mirror 51 and the objective lens 9. A half mirror 52 that transmits the start light 62 reflected by the half mirror 51 and reflects the observation light 70 toward the objective lens 9 is disposed at a position opposite to the observation light source 44 in the optical path between the half mirror 51 and the objective lens 9. . Further, a collecting lens 53 for illuminating the observation light 70 into an appropriate diameter is provided between the observation light source 44 and the half mirror 52. Further, the optical axis P6 of the collecting lens 53 may be on the plane where the first optical axis is located, or may be at the intersection. The observation light source 44 may employ a suitable light source such as a xenon lamp or LED that produces visible light. In addition, an automatic pair 13 201026419 focal unit with a light source for autofocus can be provided to control the front focus position of the objective lens 9. The observation imaging lens (photographing optical system) 45 is disposed coaxially with the optical axis P5 of the objective lens 9 on the upper side of the half mirror 51, and is used to reflect the glass substrate a illuminated by the observation light 7? An optical element that is imaged on the imaging surface of the imaging element (imaging portion) 46 by the light collected by the objective lens 9. Therefore, the optical axis p5 also serves as the second optical axis from the substrate A to the imaging unit via the imaging optical system. Further, the imaging element 46 is an image photoelectric converter that is imaged on the imaging surface, and is constituted by a CCD or the like. In the present embodiment, the device configuration of the control unit 22 is composed of a combination of a computer composed of a CPU, a memory, an input unit, an external memory device, and the like, and a suitable hardware. The control unit 22 controls the operator of the defect correction device according to an operation input of a user interface of an appropriate operation input mechanism such as an operation panel, a keyboard, a mouse, and the like, and is electrically connected to the laser light source 7 and the spatial modulation component 42. , the imaging element 46, and (4) the respective actions and operating time. The control unit 22 sends a control signal for the laser oscillation to the laser oscillator, and the laser light is irradiated from the laser (fourth) according to the pre-selected illumination condition according to the substrate A. The irradiation conditions of the laser light include a wavelength, a light output, a resonance pulse width, and the like. The laser light of the oscillating disk is combined with the fiber end face of the optical fiber 8 such as light, and the modal disturbance (4) 】 12 and the linear portion 8 are used to talk about the light intensity distribution at the end face of the optical fiber. Light 60. Further, in the present embodiment, the defect correcting device (10) for correcting the defect of the glass substrate A manufactured by the process of the invention is described. The defect correcting device 1 may be used as a defect corrector for the crystal substrate. 201026419 4A and 4B are schematic side views for explaining a laser light source 17 of a defect correction device according to a modification of the embodiment of the present invention. Further, in FIGS. 4A and 4B, the movable directions of the coupling lens 17b, the half mirror 17c, and the mirror 17d are attached with symbols in parentheses. The laser rice source 17 of the present modification has a laser vibrator 17a, a conjugate lens 17b, a half mirror 17c as a reflection member, and a mirror 17d. Unlike the laser light source 7 of the above-described embodiment, the point where the mirror 17d is disposed and the coupling lens 17b, the half mirror 17c, and the mirror 17d are movable, and the optical fiber 8 is placed in the same manner as in the above-described embodiment. The state disturbers 11, 12 are formed with a straight portion 8c. - As shown in Fig. 4B, the laser light emitted from the laser oscillator 17a in the negative direction of the X-axis is reflected by the mirror 17d in the positive direction of the Z-axis as shown in Fig. 4A, and further, the half-mirror 17c is on the Y-axis. Reflected in the negative direction and incident on the combining lens 17b. Further, the half mirror 17c transmits the light emitted from the LED light source 17e which is the guide light for displaying the laser irradiation position toward the negative direction of the Y-axis of the coupling lens 7b. On the other hand, when the micro mirrors of the spatial modulation element 42 shown in Fig. 2 are arranged at equal intervals and are inclined in the same direction, the laser beam P2 acts as a diffraction grating. The laser light 61 reflected by the mirror 47 is diffracted by the arrangement pitch of the micromirrors of the spatial modulation element 42 in accordance with the wavelength thereof. Therefore, by adjusting the tilt of the projection optical system 41, the spatial modulation element 42, and the mirror 47, and directing the diffracted light to the optical axis p4 of the imaging lens, the laser light having the diffraction efficiency south can be obtained. The optical fiber 8 shown in FIGS. 4A and 4B of the present modification is the same as the 3A and 3B of the embodiment of the above-mentioned 15 201026419, except for the laser light source 7 to the projection optical system 41. The state disturbers 11, 12 are slightly curved, and are formed outside the straight portion 8c, and no loop is left which allows excessive slack. The combining lens 17b of the present modification can be separated from the half mirror 17c, the mirror 17d, and the laser oscillator 17, and moved in the Y-axis direction (optical axis direction), in other words, the half mirror 17c, the mirror 17d, and the laser can be adjusted. The relative position of the oscillator 17c allows the incident side end face 8a of the optical fiber 8 to move in the Y-axis direction as the tilt of the projection optical system 41 is adjusted. Further, the coupling lens 17b and the half mirror 17c are separately movable from the mirror 17d and the laser oscillator 17a, and are integrally moved in the Z-axis direction of the optical axis direction of the laser beam reflected to the mirror I7d, in other words, the mirror 17d and the mirror 17d can be adjusted. The relative position ' of the laser oscillator 17a' allows the incident side end face 8a of the optical fiber 8 to move in the Z-axis direction as the tilt of the projection optical system 41 is adjusted. Furthermore, the 'combined lens 17b, the half mirror 17c and the mirror 17d can be separated from the laser oscillator 17a and moved integrally in the Z-axis direction (in the direction of the optical axis of the laser light emitted from the laser oscillator 7a), in other words, The adjustment of the relative position to the laser oscillator 17a allows the incident side end face 8a of the optical fiber 8 to move in the X-axis direction as the tilt of the projection optical system 41 is adjusted. As described above, in the present modification, the coupling lens 17b is disposed in a state in which the relative position to the laser oscillation portion 17a can be adjusted. Further, the lens i7b and the reflection member (the half mirror 17c and the mirror 17d) are disposed in a state in which the position relative to the laser oscillator i7a can be adjusted. Therefore, the combined lens 17b, the half mirror 17c, and the mirror 17d are separated from the laser oscillator 17a to be appropriately moved, and the XYZ axis of the incident end surface 8a 16 201026419 of the optical fiber 8 is allowed to move in the three-axis direction. Therefore, in the present modification, the projection optical system 41 connected to the optical fiber 8 can be freely inclined. Therefore, by irradiating the diffracted light to the optical axis Ρ4 of the imaging lens 48, laser light having high diffraction efficiency can be obtained. I: Fig. 3 is a plan view showing a defect correcting device according to an embodiment of the present invention.
第1Β圖係顯示本發明一實施形態之缺陷修正裝置之正 面圖。 第2圖係用以說明本發明一實施形態之缺陷修正裝置 之加工頭内部構造的概略結構圖。 第3 Α圖係用以說明本發明一實施形態之缺陷修正装置 之光纖及模態擾亂器的概略侧面圖。 第3B圖係用以說明本發明一實施形態之缺陷修正装置 之光纖及模態擾亂器的概略正面圖。 第4 A圖係用以說明本發明一實施形態變形例之缺陷修 正裝置之雷射光源的概略側面圖。 > 第4 B圖係用以說明本發明一實施形態變开)例之缺灰 正裝置之雷射光源的概略正㈣。 ’ 【主要元件符鱿說明】 4.. .肉架 5.. .加工頭 5a...殼體 6.. .雷射電源 1·..缺陷修正裝置 2.. .浮起台 3.. .吸附搬送台 3a...吸附部 17 201026419 7...雷射光源 21...軌道 7a,17a...雷射振盪器 22...控制單元 7b,17b...結合透鏡 23...基板排列機構 7c,17c,51,52...半反射鏡 41...投影透鏡 7e,17e…LED光源 42...空間調變元件 8…光纖 43...照射光學系統 8a...入射側端面 44...觀察用光源 8b...射出侧端面 45...觀察用成像透鏡 8c...直線部 46...拍攝元件 9...物鏡 48...成像透鏡 11,12...模態擾亂器 53...集光透鏡 1 la-llc, 12a-12c.··螺絲 62...啟動光 17,60,61...雷射光 70...觀察用光 17d,47,49 …鏡 A...玻璃基板 18...頭安裝部 L...長度 19.. .雷射光源單元安裝部 20.. .水平柱 P1-P6…光轴Fig. 1 is a front elevational view showing a defect correcting device according to an embodiment of the present invention. Fig. 2 is a schematic block diagram showing the internal structure of a machining head of the defect correction device according to the embodiment of the present invention. Fig. 3 is a schematic side view showing an optical fiber and a mode disturber for explaining a defect correcting device according to an embodiment of the present invention. Fig. 3B is a schematic front view showing an optical fiber and a mode disturber for explaining a defect correction device according to an embodiment of the present invention. Fig. 4A is a schematic side view showing a laser light source for explaining a defect correction device according to a modification of the embodiment of the present invention. > Fig. 4B is a schematic view (4) of a laser light source for explaining the ashless positive device according to an embodiment of the present invention. ' [Main component symbol description] 4.. Meat rack 5.. Processing head 5a... Housing 6.. Laser power supply 1.·. Defect correction device 2.. Floating table 3.. Adsorption transfer table 3a... adsorption unit 17 201026419 7... laser light source 21... track 7a, 17a... laser oscillator 22... control unit 7b, 17b... combined with lens 23. .. substrate arrangement mechanism 7c, 17c, 51, 52 ... half mirror 41 ... projection lens 7e, 17e ... LED light source 42 ... spatial modulation element 8 ... optical fiber 43 ... illumination optical system 8a. .. incident side end surface 44... observation light source 8b... emission side end surface 45... observation imaging lens 8c... linear portion 46... imaging element 9... objective lens 48... imaging lens 11,12...modal disturber 53...collector lens 1 la-llc, 12a-12c.··screw 62...starting light 17,60,61...laser light 70...observation Light 17d, 47, 49 ... mirror A... glass substrate 18... head mounting portion L... length 19: laser light source unit mounting portion 20.. horizontal column P1-P6... optical axis
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