CN101354481B - 激光照射装置及使用其的激光加工系统 - Google Patents
激光照射装置及使用其的激光加工系统 Download PDFInfo
- Publication number
- CN101354481B CN101354481B CN2008101340880A CN200810134088A CN101354481B CN 101354481 B CN101354481 B CN 101354481B CN 2008101340880 A CN2008101340880 A CN 2008101340880A CN 200810134088 A CN200810134088 A CN 200810134088A CN 101354481 B CN101354481 B CN 101354481B
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- laser
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- catoptron
- irradiation device
- spatial modulation
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Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0869—Devices involving movement of the laser head in at least one axial direction
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
- Mechanical Light Control Or Optical Switches (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007193549 | 2007-07-25 | ||
| JP2007-193549 | 2007-07-25 | ||
| JP2007193549A JP5137488B2 (ja) | 2007-07-25 | 2007-07-25 | レーザ照射装置およびそれを用いたレーザ加工システム |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101354481A CN101354481A (zh) | 2009-01-28 |
| CN101354481B true CN101354481B (zh) | 2012-11-28 |
Family
ID=40307363
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008101340880A Expired - Fee Related CN101354481B (zh) | 2007-07-25 | 2008-07-24 | 激光照射装置及使用其的激光加工系统 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5137488B2 (enExample) |
| KR (1) | KR20090012106A (enExample) |
| CN (1) | CN101354481B (enExample) |
| TW (1) | TW200912375A (enExample) |
Families Citing this family (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5346690B2 (ja) * | 2009-05-26 | 2013-11-20 | オリンパス株式会社 | レーザ照射装置 |
| TWI594828B (zh) * | 2009-05-28 | 2017-08-11 | 伊雷克托科學工業股份有限公司 | 應用於雷射處理工件中的特徵的聲光偏轉器及相關雷射處理方法 |
| JP5393406B2 (ja) * | 2009-11-06 | 2014-01-22 | オリンパス株式会社 | パターン投影装置、走査型共焦点顕微鏡、及びパターン照射方法 |
| DE102010020183B4 (de) * | 2010-05-11 | 2013-07-11 | Precitec Kg | Laserschneidkopf und Verfahren zum Schneiden eines Werkstücks mittels eines Laserschneidkopfes |
| KR101114738B1 (ko) * | 2010-09-27 | 2012-02-29 | 주식회사 피케이엘 | 가변형 어퍼쳐 및 이를 포함하는 스퍼터 장치 |
| JP5644481B2 (ja) * | 2010-12-24 | 2014-12-24 | コニカミノルタ株式会社 | 画像投影装置 |
| JP5678693B2 (ja) * | 2011-01-31 | 2015-03-04 | コニカミノルタ株式会社 | 画像投影装置 |
| US10688527B2 (en) | 2011-09-22 | 2020-06-23 | Delta Electronics, Inc. | Phosphor device comprising plural phosphor agents for converting waveband light into plural color lights with different wavelength peaks |
| TWI669833B (zh) * | 2016-04-19 | 2019-08-21 | 台達電子工業股份有限公司 | 螢光劑裝置 |
| JP6049391B2 (ja) | 2011-10-17 | 2016-12-21 | 株式会社東芝 | レーザ照射装置及びレーザ照射ヘッドの健全性診断方法 |
| KR101299234B1 (ko) * | 2011-11-01 | 2013-08-22 | 주식회사 이오테크닉스 | 2빔 가공이 가능한 레이저 가공 장치 및 방법 |
| CN102489876B (zh) * | 2011-11-11 | 2014-06-25 | 北京中科思远光电科技有限公司 | 一种采用激光辅助加热的激光退火方法及装置 |
| JP5720586B2 (ja) * | 2012-01-19 | 2015-05-20 | コニカミノルタ株式会社 | 画像投映装置 |
| JP6321932B2 (ja) * | 2013-09-24 | 2018-05-09 | 株式会社小糸製作所 | 車両用前照灯 |
| JP6868766B2 (ja) * | 2017-03-15 | 2021-05-12 | パナソニックIpマネジメント株式会社 | レーザ加工システム |
| WO2019244339A1 (ja) * | 2018-06-22 | 2019-12-26 | オリンパス株式会社 | 照明装置および内視鏡システム |
| CN111940892B (zh) * | 2019-05-14 | 2023-06-02 | 雷科股份有限公司 | 用于切割低介电值材料晶圆的快速切换光路架构 |
| CN113634877A (zh) * | 2020-04-27 | 2021-11-12 | 大族激光科技产业集团股份有限公司 | 一种激光加工装置及方法 |
| CN111751806A (zh) * | 2020-07-29 | 2020-10-09 | 深圳元戎启行科技有限公司 | 准直装置、激光雷达发射系统和激光雷达收发系统 |
| US12403548B2 (en) * | 2020-08-19 | 2025-09-02 | Panasonic Intellectual Property Management Co., Ltd. | Laser processing apparatus and laser processing method |
| JP7730643B2 (ja) * | 2020-08-21 | 2025-08-28 | 浜松ホトニクス株式会社 | レーザ加工装置及びレーザ加工方法 |
| JP7609624B2 (ja) * | 2020-12-16 | 2025-01-07 | 株式会社ダイヘン | レーザヘッド |
| KR102674642B1 (ko) * | 2023-08-31 | 2024-06-12 | 주식회사 에이비파트너스 | 용접 품질 검사장치 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1644296A (zh) * | 2004-01-20 | 2005-07-27 | 日立比亚机械股份有限公司 | 激光加工设备 |
| US7023462B2 (en) * | 2004-01-19 | 2006-04-04 | Fuji Photo Film Co., Ltd. | Multibeam exposure device |
| CN1880004A (zh) * | 2005-06-17 | 2006-12-20 | 奥林巴斯株式会社 | 激光加工方法和装置 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6171194A (ja) * | 1984-09-14 | 1986-04-12 | Mitsubishi Electric Corp | レ−ザ加工装置 |
| JPH0483488A (ja) * | 1990-07-26 | 1992-03-17 | Toshiba Corp | 映像信号伝送システムと映像信号送信装置及び映像信号受信装置 |
| JPH0483488U (enExample) * | 1990-11-28 | 1992-07-21 | ||
| JPH1158052A (ja) * | 1997-08-26 | 1999-03-02 | Nippon Steel Corp | レーザ加工装置 |
| JP5048899B2 (ja) * | 2001-09-28 | 2012-10-17 | オリンパス株式会社 | 顕微鏡 |
| WO2006100780A1 (ja) * | 2005-03-24 | 2006-09-28 | Olympus Corporation | リペア方法及びその装置 |
| JP5036144B2 (ja) * | 2005-06-28 | 2012-09-26 | オリンパス株式会社 | レーザ加工装置 |
-
2007
- 2007-07-25 JP JP2007193549A patent/JP5137488B2/ja not_active Expired - Fee Related
-
2008
- 2008-07-22 TW TW097127768A patent/TW200912375A/zh unknown
- 2008-07-23 KR KR1020080071608A patent/KR20090012106A/ko not_active Ceased
- 2008-07-24 CN CN2008101340880A patent/CN101354481B/zh not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7023462B2 (en) * | 2004-01-19 | 2006-04-04 | Fuji Photo Film Co., Ltd. | Multibeam exposure device |
| CN1644296A (zh) * | 2004-01-20 | 2005-07-27 | 日立比亚机械股份有限公司 | 激光加工设备 |
| CN1880004A (zh) * | 2005-06-17 | 2006-12-20 | 奥林巴斯株式会社 | 激光加工方法和装置 |
Non-Patent Citations (2)
| Title |
|---|
| JP特開2006-350123A 2006.12.28 |
| JP特開平11-58052A 1999.03.02 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20090012106A (ko) | 2009-02-02 |
| JP2009028742A (ja) | 2009-02-12 |
| TW200912375A (en) | 2009-03-16 |
| CN101354481A (zh) | 2009-01-28 |
| JP5137488B2 (ja) | 2013-02-06 |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20121128 Termination date: 20140724 |
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| EXPY | Termination of patent right or utility model |