CN101354481B - 激光照射装置及使用其的激光加工系统 - Google Patents

激光照射装置及使用其的激光加工系统 Download PDF

Info

Publication number
CN101354481B
CN101354481B CN2008101340880A CN200810134088A CN101354481B CN 101354481 B CN101354481 B CN 101354481B CN 2008101340880 A CN2008101340880 A CN 2008101340880A CN 200810134088 A CN200810134088 A CN 200810134088A CN 101354481 B CN101354481 B CN 101354481B
Authority
CN
China
Prior art keywords
laser
deflection
catoptron
irradiation device
spatial modulation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2008101340880A
Other languages
English (en)
Chinese (zh)
Other versions
CN101354481A (zh
Inventor
有贺润子
中村达哉
高桥浩一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Olympus Corp
Original Assignee
Olympus Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olympus Corp filed Critical Olympus Corp
Publication of CN101354481A publication Critical patent/CN101354481A/zh
Application granted granted Critical
Publication of CN101354481B publication Critical patent/CN101354481B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03Observing, e.g. monitoring, the workpiece
    • B23K26/032Observing, e.g. monitoring, the workpiece using optical means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/083Devices involving movement of the workpiece in at least one axial direction
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/0869Devices involving movement of the laser head in at least one axial direction
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00Articles made by soldering, welding or cutting
    • B23K2101/36Electric or electronic devices

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Mechanical Light Control Or Optical Switches (AREA)
CN2008101340880A 2007-07-25 2008-07-24 激光照射装置及使用其的激光加工系统 Expired - Fee Related CN101354481B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007193549 2007-07-25
JP2007-193549 2007-07-25
JP2007193549A JP5137488B2 (ja) 2007-07-25 2007-07-25 レーザ照射装置およびそれを用いたレーザ加工システム

Publications (2)

Publication Number Publication Date
CN101354481A CN101354481A (zh) 2009-01-28
CN101354481B true CN101354481B (zh) 2012-11-28

Family

ID=40307363

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2008101340880A Expired - Fee Related CN101354481B (zh) 2007-07-25 2008-07-24 激光照射装置及使用其的激光加工系统

Country Status (4)

Country Link
JP (1) JP5137488B2 (enExample)
KR (1) KR20090012106A (enExample)
CN (1) CN101354481B (enExample)
TW (1) TW200912375A (enExample)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5346690B2 (ja) * 2009-05-26 2013-11-20 オリンパス株式会社 レーザ照射装置
TWI594828B (zh) * 2009-05-28 2017-08-11 伊雷克托科學工業股份有限公司 應用於雷射處理工件中的特徵的聲光偏轉器及相關雷射處理方法
JP5393406B2 (ja) * 2009-11-06 2014-01-22 オリンパス株式会社 パターン投影装置、走査型共焦点顕微鏡、及びパターン照射方法
DE102010020183B4 (de) * 2010-05-11 2013-07-11 Precitec Kg Laserschneidkopf und Verfahren zum Schneiden eines Werkstücks mittels eines Laserschneidkopfes
KR101114738B1 (ko) * 2010-09-27 2012-02-29 주식회사 피케이엘 가변형 어퍼쳐 및 이를 포함하는 스퍼터 장치
JP5644481B2 (ja) * 2010-12-24 2014-12-24 コニカミノルタ株式会社 画像投影装置
JP5678693B2 (ja) * 2011-01-31 2015-03-04 コニカミノルタ株式会社 画像投影装置
US10688527B2 (en) 2011-09-22 2020-06-23 Delta Electronics, Inc. Phosphor device comprising plural phosphor agents for converting waveband light into plural color lights with different wavelength peaks
TWI669833B (zh) * 2016-04-19 2019-08-21 台達電子工業股份有限公司 螢光劑裝置
JP6049391B2 (ja) 2011-10-17 2016-12-21 株式会社東芝 レーザ照射装置及びレーザ照射ヘッドの健全性診断方法
KR101299234B1 (ko) * 2011-11-01 2013-08-22 주식회사 이오테크닉스 2빔 가공이 가능한 레이저 가공 장치 및 방법
CN102489876B (zh) * 2011-11-11 2014-06-25 北京中科思远光电科技有限公司 一种采用激光辅助加热的激光退火方法及装置
JP5720586B2 (ja) * 2012-01-19 2015-05-20 コニカミノルタ株式会社 画像投映装置
JP6321932B2 (ja) * 2013-09-24 2018-05-09 株式会社小糸製作所 車両用前照灯
JP6868766B2 (ja) * 2017-03-15 2021-05-12 パナソニックIpマネジメント株式会社 レーザ加工システム
WO2019244339A1 (ja) * 2018-06-22 2019-12-26 オリンパス株式会社 照明装置および内視鏡システム
CN111940892B (zh) * 2019-05-14 2023-06-02 雷科股份有限公司 用于切割低介电值材料晶圆的快速切换光路架构
CN113634877A (zh) * 2020-04-27 2021-11-12 大族激光科技产业集团股份有限公司 一种激光加工装置及方法
CN111751806A (zh) * 2020-07-29 2020-10-09 深圳元戎启行科技有限公司 准直装置、激光雷达发射系统和激光雷达收发系统
US12403548B2 (en) * 2020-08-19 2025-09-02 Panasonic Intellectual Property Management Co., Ltd. Laser processing apparatus and laser processing method
JP7730643B2 (ja) * 2020-08-21 2025-08-28 浜松ホトニクス株式会社 レーザ加工装置及びレーザ加工方法
JP7609624B2 (ja) * 2020-12-16 2025-01-07 株式会社ダイヘン レーザヘッド
KR102674642B1 (ko) * 2023-08-31 2024-06-12 주식회사 에이비파트너스 용접 품질 검사장치

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1644296A (zh) * 2004-01-20 2005-07-27 日立比亚机械股份有限公司 激光加工设备
US7023462B2 (en) * 2004-01-19 2006-04-04 Fuji Photo Film Co., Ltd. Multibeam exposure device
CN1880004A (zh) * 2005-06-17 2006-12-20 奥林巴斯株式会社 激光加工方法和装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6171194A (ja) * 1984-09-14 1986-04-12 Mitsubishi Electric Corp レ−ザ加工装置
JPH0483488A (ja) * 1990-07-26 1992-03-17 Toshiba Corp 映像信号伝送システムと映像信号送信装置及び映像信号受信装置
JPH0483488U (enExample) * 1990-11-28 1992-07-21
JPH1158052A (ja) * 1997-08-26 1999-03-02 Nippon Steel Corp レーザ加工装置
JP5048899B2 (ja) * 2001-09-28 2012-10-17 オリンパス株式会社 顕微鏡
WO2006100780A1 (ja) * 2005-03-24 2006-09-28 Olympus Corporation リペア方法及びその装置
JP5036144B2 (ja) * 2005-06-28 2012-09-26 オリンパス株式会社 レーザ加工装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7023462B2 (en) * 2004-01-19 2006-04-04 Fuji Photo Film Co., Ltd. Multibeam exposure device
CN1644296A (zh) * 2004-01-20 2005-07-27 日立比亚机械股份有限公司 激光加工设备
CN1880004A (zh) * 2005-06-17 2006-12-20 奥林巴斯株式会社 激光加工方法和装置

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
JP特開2006-350123A 2006.12.28
JP特開平11-58052A 1999.03.02

Also Published As

Publication number Publication date
KR20090012106A (ko) 2009-02-02
JP2009028742A (ja) 2009-02-12
TW200912375A (en) 2009-03-16
CN101354481A (zh) 2009-01-28
JP5137488B2 (ja) 2013-02-06

Similar Documents

Publication Publication Date Title
CN101354481B (zh) 激光照射装置及使用其的激光加工系统
JP5522443B2 (ja) 走査型共焦点顕微鏡検査の改善、およびその関連技術
CN101298117B (zh) 激光加工装置
CN101147093B (zh) 维修方法及其装置
CN201345033Y (zh) 高速多光束并行激光直写装置
TW200938959A (en) Optical lighting device and exposure device
CN101477306A (zh) 高速多光束并行激光直写装置
CN101733545B (zh) 缺陷修复装置
KR20140052840A (ko) 레이저 조사 유닛 및 레이저 가공 장치
KR100501075B1 (ko) 광학현미경장치
CN1880004B (zh) 激光加工装置
JPH0375846B2 (enExample)
KR101287982B1 (ko) 레이저 가공 방법 및 장치
JP2020069486A (ja) レーザ加工装置
TWI527651B (zh) 雷射照射裝置
KR20120092988A (ko) 레이저 다이오드를 이용한 마킹용 ic 타이틀러
CN112817180A (zh) 应用于lcos系统位相调制工作台的高速运动控制方法及系统
WO2025229813A1 (ja) 露光装置及び露光方法
CN112817184A (zh) 应用于lcos系统位相调制工作台的低速运动控制方法及系统

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20121128

Termination date: 20140724

EXPY Termination of patent right or utility model