KR20090012106A - 레이저 조사 장치 및 이것을 사용한 레이저 가공 시스템 - Google Patents

레이저 조사 장치 및 이것을 사용한 레이저 가공 시스템 Download PDF

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Publication number
KR20090012106A
KR20090012106A KR1020080071608A KR20080071608A KR20090012106A KR 20090012106 A KR20090012106 A KR 20090012106A KR 1020080071608 A KR1020080071608 A KR 1020080071608A KR 20080071608 A KR20080071608 A KR 20080071608A KR 20090012106 A KR20090012106 A KR 20090012106A
Authority
KR
South Korea
Prior art keywords
laser
light
deflection
irradiation apparatus
deflection surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020080071608A
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English (en)
Korean (ko)
Inventor
준코 아루가
다쓰야 나카무라
고이치 다카하시
Original Assignee
올림푸스 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 올림푸스 가부시키가이샤 filed Critical 올림푸스 가부시키가이샤
Publication of KR20090012106A publication Critical patent/KR20090012106A/ko
Ceased legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0869—Devices involving movement of the laser head in at least one axial direction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Mechanical Light Control Or Optical Switches (AREA)
KR1020080071608A 2007-07-25 2008-07-23 레이저 조사 장치 및 이것을 사용한 레이저 가공 시스템 Ceased KR20090012106A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2007-00193549 2007-07-25
JP2007193549A JP5137488B2 (ja) 2007-07-25 2007-07-25 レーザ照射装置およびそれを用いたレーザ加工システム

Publications (1)

Publication Number Publication Date
KR20090012106A true KR20090012106A (ko) 2009-02-02

Family

ID=40307363

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020080071608A Ceased KR20090012106A (ko) 2007-07-25 2008-07-23 레이저 조사 장치 및 이것을 사용한 레이저 가공 시스템

Country Status (4)

Country Link
JP (1) JP5137488B2 (enExample)
KR (1) KR20090012106A (enExample)
CN (1) CN101354481B (enExample)
TW (1) TW200912375A (enExample)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20100127707A (ko) * 2009-05-26 2010-12-06 올림푸스 가부시키가이샤 레이저 조사 장치
KR101114738B1 (ko) * 2010-09-27 2012-02-29 주식회사 피케이엘 가변형 어퍼쳐 및 이를 포함하는 스퍼터 장치
CN102489876A (zh) * 2011-11-11 2012-06-13 北京中科思远光电科技有限公司 一种采用激光辅助加热的激光退火方法及装置
WO2013065947A1 (ko) * 2011-11-01 2013-05-10 주식회사 이오테크닉스 2빔 가공이 가능한 레이저 가공 장치 및 방법
US9662744B2 (en) 2011-10-17 2017-05-30 Kabushiki Kaisha Toshiba Laser irradiation device and method of diagnosing the health of a laser irradiation head
CN114074214A (zh) * 2020-08-21 2022-02-22 浜松光子学株式会社 激光加工装置和激光加工方法

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI594828B (zh) * 2009-05-28 2017-08-11 伊雷克托科學工業股份有限公司 應用於雷射處理工件中的特徵的聲光偏轉器及相關雷射處理方法
JP5393406B2 (ja) * 2009-11-06 2014-01-22 オリンパス株式会社 パターン投影装置、走査型共焦点顕微鏡、及びパターン照射方法
DE102010020183B4 (de) * 2010-05-11 2013-07-11 Precitec Kg Laserschneidkopf und Verfahren zum Schneiden eines Werkstücks mittels eines Laserschneidkopfes
JP5644481B2 (ja) * 2010-12-24 2014-12-24 コニカミノルタ株式会社 画像投影装置
JP5678693B2 (ja) * 2011-01-31 2015-03-04 コニカミノルタ株式会社 画像投影装置
US10688527B2 (en) 2011-09-22 2020-06-23 Delta Electronics, Inc. Phosphor device comprising plural phosphor agents for converting waveband light into plural color lights with different wavelength peaks
TWI669833B (zh) * 2016-04-19 2019-08-21 台達電子工業股份有限公司 螢光劑裝置
JP5720586B2 (ja) * 2012-01-19 2015-05-20 コニカミノルタ株式会社 画像投映装置
JP6321932B2 (ja) * 2013-09-24 2018-05-09 株式会社小糸製作所 車両用前照灯
JP6868766B2 (ja) * 2017-03-15 2021-05-12 パナソニックＩｐマネジメント株式会社 レーザ加工システム
WO2019244339A1 (ja) * 2018-06-22 2019-12-26 オリンパス株式会社 照明装置および内視鏡システム
CN111940892B (zh) * 2019-05-14 2023-06-02 雷科股份有限公司 用于切割低介电值材料晶圆的快速切换光路架构
CN113634877A (zh) * 2020-04-27 2021-11-12 大族激光科技产业集团股份有限公司 一种激光加工装置及方法
CN111751806A (zh) * 2020-07-29 2020-10-09 深圳元戎启行科技有限公司 准直装置、激光雷达发射系统和激光雷达收发系统
US12403548B2 (en) * 2020-08-19 2025-09-02 Panasonic Intellectual Property Management Co., Ltd. Laser processing apparatus and laser processing method
JP7609624B2 (ja) * 2020-12-16 2025-01-07 株式会社ダイヘン レーザヘッド
KR102674642B1 (ko) * 2023-08-31 2024-06-12 주식회사 에이비파트너스 용접 품질 검사장치

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6171194A (ja) * 1984-09-14 1986-04-12 Mitsubishi Electric Corp レ−ザ加工装置
JPH0483488A (ja) * 1990-07-26 1992-03-17 Toshiba Corp 映像信号伝送システムと映像信号送信装置及び映像信号受信装置
JPH0483488U (enExample) * 1990-11-28 1992-07-21
JPH1158052A (ja) * 1997-08-26 1999-03-02 Nippon Steel Corp レーザ加工装置
JP5048899B2 (ja) * 2001-09-28 2012-10-17 オリンパス株式会社 顕微鏡
JP2005203697A (ja) * 2004-01-19 2005-07-28 Fuji Photo Film Co Ltd マルチビーム露光装置
JP4184288B2 (ja) * 2004-01-20 2008-11-19 日立ビアメカニクス株式会社 レーザ加工機
WO2006100780A1 (ja) * 2005-03-24 2006-09-28 Olympus Corporation リペア方法及びその装置
JP4429974B2 (ja) * 2005-06-17 2010-03-10 オリンパス株式会社 レーザ加工方法および装置
JP5036144B2 (ja) * 2005-06-28 2012-09-26 オリンパス株式会社 レーザ加工装置

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20100127707A (ko) * 2009-05-26 2010-12-06 올림푸스 가부시키가이샤 레이저 조사 장치
KR101114738B1 (ko) * 2010-09-27 2012-02-29 주식회사 피케이엘 가변형 어퍼쳐 및 이를 포함하는 스퍼터 장치
US9662744B2 (en) 2011-10-17 2017-05-30 Kabushiki Kaisha Toshiba Laser irradiation device and method of diagnosing the health of a laser irradiation head
WO2013065947A1 (ko) * 2011-11-01 2013-05-10 주식회사 이오테크닉스 2빔 가공이 가능한 레이저 가공 장치 및 방법
KR101299234B1 (ko) * 2011-11-01 2013-08-22 주식회사 이오테크닉스 2빔 가공이 가능한 레이저 가공 장치 및 방법
CN102489876A (zh) * 2011-11-11 2012-06-13 北京中科思远光电科技有限公司 一种采用激光辅助加热的激光退火方法及装置
CN114074214A (zh) * 2020-08-21 2022-02-22 浜松光子学株式会社 激光加工装置和激光加工方法

Also Published As

Publication number Publication date
JP2009028742A (ja) 2009-02-12
TW200912375A (en) 2009-03-16
CN101354481A (zh) 2009-01-28
CN101354481B (zh) 2012-11-28
JP5137488B2 (ja) 2013-02-06

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