200918223 九、發明說明： 【發'明屬々貝】 發明領域 本發明係有關於一種使用以數位微鏡裝置 5鏡陣列等之空間調變元件之雷射加工裝置，特== -種在液晶顯示裝置等之基板之製造過程中，可藉拍攝搁 取基板上之缺陷領域，並配合該缺陷領域之形狀進行修正 之雷射修復裝置。 L· ^ 10 發明背景 迄今’雷射加工袭置中，已知有一種可藉複數微鏡調 移照射被加工物之雷射光束，而使雷射光束照射之範圍、 圖形為可變，以進行加工之裝置。 上述雷射加工裝置中，由於朝具有微面積之微鏡面照 15射高輸出之雷射光束，故微鏡容易發生歷時劣化，一旦微 鏡劣化，則可迠發生諸如微鏡之鏡面之傾斜發生異常而使 雷射光束之照射位置偏移，或於加工領域發生加工瑕疵， 或損壞無須加工之領域及已加工之領域之問題。 為解決上述問題，有一種曝光裝置業已揭露，其係於 20由複數微鏡所構成之微鏡陣列之一之數位微鏡裝置(Digital Micromirror Device :以下簡稱&DMD)劣化時，可藉移動 s又於DMD或雷射光束之入射側之光罩，而將雷射光束照射 領域移動至尚未劣化之DMD上（參照諸如專利文獻1}。其 次，可測定其劣化狀態之機構之例則已揭露可藉雷射光束 5 200918223 射出日寸間累積叶數器推定劣化狀態者'可於相當於受刻劃 媒材之位£上測定光能，而由光能之減少檢知劣化狀態 者、可藉設於各描繪領域之光檢知器測定散射光而由其增 大之變化檢知劣化狀態者。 5 又，亦已揭露一種採用大於雷射光束照射所使用之範 圍之DMD，而拍攝微鏡之反射光中偏向遠離被加工物之方 向之雷射光束，以檢知微鏡之劣化^件，並使DMD整體滑 _、、避免使用已檢知之劣化兀件，而改變照射領域以避開 劣化元件’並提昇加工可靠性者(參照諸如專利文獻2)。 【專利文獻1】日本專利公開公報特開⑼_號 (第4〜8頁、第7、10、13圖） 【專利文獻2】日本專利公開公報特開2刪-奶刚號 【】 發明揭示 ίο 發明欲解決之問題 一然而’使用上述習知之微鏡陣列之雷射加工裝置中， :=:Γ增加而於DMD全面產生劣化元件，則即㈣ 2陣列滑移’亦可能形成無法避開劣化4之狀態而益 後=Γ’叫彡勝止_4置，待料微鏡陣列 吏用雷射加JL裝置，故諸如於被加 線内使用雷射加工“#曰，士 生產 Μ置時’财必須停止製造生產線之問 20 200918223 亦可賴料之㈣領域，持續進行 射加工裝置及雷射力nJL方法。 種雷 用以解決問題之手段 本發明為解決上述問題，而採用下述之構造。 即，依據本發明之一態樣，本 含有：空間調變元件，由複數微小可動工裝置包 依所需步壯料姑Λ “件排列構成，以 W狀對被加工物照射由雷射光源射出 投射光學系統，配置成使前述空間調變元件與^光束； 10 物位於共概位置上；照射領域控制據=被加工 定，領域，控制前述空間調變元件之動:::前已設 =檢知機構，檢知構成前述空間調變元 件中之動作瑕疲之微小可動元件；及㈣小可動70 控制，於已由命_ 控制機構，可進行 之微小可動科之位置與前為動作喊 :r 發明效果 依據本發明，可於已檢知 照射領域重叠時，利用僅包含未疲之微鏡之位置與 微鏡之正常領域，對被加工物分°麵作瑕疮之領域之 在無法避開動作㈣之微鏡而‘次進行照射，故即便 下，亦可確保預定之照射領域 ^工物之加工之狀態 11方得續使用雷射加工裝置。 用以實施發明之最佳形態 20 200918223 以下，就本發明之實施例參照圖示加以說明。所有圖 不中’即便實施例不同，仍就同一或相當之構件附以相同 之標號，並省略共通之說明。 [第1實施例] 5 以下，說明本發明第1實施例之雷射加工裝置。 第1圖係說明本發明第1實施例之雷射加工裝置之概略 構造之模式的構造說明圖。第2圖係說明本發明第1實施例 之雷射加工裝置之長孔構造之說明圖。第3圖係說明本發明 第1實施例之雷射加工裝置之微鏡陣列之截面方向之構造 及動作之截面說明圖。第4圖係顯示由反射面側觀察本發明 第1實施例之雷射加工裝置之微鏡陣列所得之狀態之模式 的平面說明圖及顯示可說明其動作之被加工物上之影響之 一例之平面說明圖。第5圖係說明本發明第1實施例之雷射 加工裝置之拍攝元件所攝得之影像之一例之模式說明圖。 15 第1圖中，雷射加工裝置50包含雷射光源1(光源部）、照 明光學系統3、數位微鏡裝置(DMD)4(微鏡陣列）、聚光透鏡 5、波長選擇鏡6、物鏡7、中繼光學系統1〇、衰減濾波器u、 第2拍攝元件12(拍攝元件）、第2影像處理部13(偏向動作檢 知機構）、控制器14(發光控制機構）、致動器驅動器15、-2〇軸位移致動器16(移動機構）、拍攝光學系統17、第1拍攝元 件18、第1影像處理部19、長孔25、領域控制器26及警告機 構27。其次，雷射加工裝置5〇可投影具有已於試料9(被加 工物）上形成有預定圖形之預定之光輸出與波長之雷射光 束2A，而藉其光能加工試料9之表面。光能之加工則可為諸 200918223 如加熱、溶融、汽化、裁切、曝光記錄等。 雷射光源1係可產生用以加工試料9之雷射光束2者。雷 射光束2之光輸出及波長則可對應試料9之加工部分之材質 之吸光之波長特性，設定成加工效率良好之光輸出、振盪 5波長。雷射光束2之光亮、光滅、調節等發光控制則藉後述 之控制器14所生成之控制訊號101而進行。 舉例言之，液晶基板等玻璃基板上已形成光罩之光阻 膜之加工時，可使用YAG雷射（基本波長Al = 1〇64#m(微 米）），而適當採用可振盪第2、第3、第4諧振波(個別波長入 10 2=532nm、λ 3=355ηηι、；U=266mn)之脈寬為數職程度， 峰值輸出為數MW程度之脈衝者，作為雷射光。 照明光學系統3係由可將雷射光源丨所產生之雷射光束 2轉為業經截面強度分布之一致化後之大致平行光束之光 學系統所構成，而配置於雷射光束2之光路徑上。上述照明 15光學系統3之構造已知有諸如使用複眼透鏡、繞射元件、非 球面透鏡、KALEID0柱狀透鏡者等各種構造，故可視需要 而採用任一種構造。 長孔25配置於雷射光源1至DMD4之間，❿光學地設計 2成僅有通過長孔25之開口部之雷射光束2可朝DMm入射。 長孔25如第2圖所示’由長孔零件25八及258之2個零件 所構成。其等則裝設於未圖示之χγ載台機構上，並分別朝 XY轴方向為馬達所控制，且同時亦可朝Χ0Υ0方向進行控 制藉則述XY載台機構，即可改變腿〇4之開口部之大小， 或使開口部之中心位置滑移，而進行控制。另，此時之驅 200918223 動解像度至少與構成DMD4之微鏡之像素尺寸相同，χγ方 向之移動範圍則為可使用於單次之雷射照射之DMD4之領 域内之任何微鏡皆可單獨進行照射之範圍。 開口部之形狀並無特別限制，但宜僮可能配合微鏡之 5配置形狀，以縮小雷射光束2之難領域之面積與微鏡使用 領域之面積之差異。即，若微鏡配置成矩形，則開口部亦 形成矩形，微鏡若配置成放射狀，則開口部亦形成放射狀。 -旦輸入㈣資料，即予配合而使長孔25之開口部擴 大縮小及滑移，而進行僅使雷射光束2照射已輸入之領域之 10 控制。 作為空間調變元件之DMD4係於可動鏡排列面牝上， 由各自之傾斜角可獨立切換之複數可動鏡面如(參照第3圖） 大致無間隙地進行2次元排列而成之微鏡陣列。 各可動鏡面4a之傾斜角之切換係藉後述之領域控制器 15 26所生成之控制訊號H)6而進行。—旦藉控制訊號1〇6而選 擇開狀態，則可動鏡面4a將形成對可動鏡排列面牝僅傾斜 傾斜角</>A之離滅4A。又’-旦藉控制訊號刪選擇關狀 態，則相同地，將形成僅傾斜傾斜角知之關狀態鏡4β。 其次，開狀態鏡4A可使雷射光束2朝接近試料9之第1 2〇方向而偏向成雷射光束2A，關狀態鏡48則可使雷射光束] 朝遠離試料9之第2方向偏向成雷射光束2β。 本第1實施例-如第3圖所示，係以第i方向係可動鏡排 列面4b之法線方向’第2方向則為對可動鏡排列面仙之法線 方向僅傾斜角度之方向為例進行謂^日月。 200918223 在此，雷射光束2之入射方向係與第1方向不同之方 向。又’傾斜角φΑ、0B係夾隔可動鏡排列面4b而分別朝反 向傾斜之傾斜角。因此，下式（1)及式(2)可得成立。 θ>=2略.........式⑴ 5 θ〇=^θ{-{-2χφΒ.......... ) 在此’角度化係雷射光束2對可動鏡排列面牝之入射 角，而為(Γ以外之角度。 可動鏡排列面4b之大小遠大於已藉照明光學系統3而 經截面強度分布之一致化後之雷射光束2之光束徑’各可動 1〇鏡面4a則構成遠小於雷射光束2之光束徑。 DMD4可採用諸如投影器等所使用者之相同構造。 即，可採用藉 MEMS(Micro Electro Mechanical Systems)技 術，而使大小10微米（ym)四方程度且表面藉金屬膜蒸鍍等 而形成咼效之反射面之可動鏡面4a，排列成諸如8〇〇χ6〇〇個 15程度之陣列狀，並分別對可動鏡排列面4b以±12。程度之傾 斜角（Φα=<Αβ=1 2。)形成傾斜狀態者等。 雷射光束2之光束截面之大小、形狀及可動鏡排列面仆 之大小，可對應加工種類及被加工物等而設為適當之形 狀、大小，其一例則可為雷射光束2具有光束徑扣mm之圓 2〇形截面，可動鏡排列面4b之大小則採用8mmx6mm程度之構 造。 聚光透鏡5與物鏡7可構成對DIy[D4照射之雷射光束〕 中，對試料9上投射雷射光束2A之投射光學系統，可動鏡排 列面4b與試料9之加工面則設成呈共軛關係。又，可動鏡排 11 200918223 列面仆與試料9之加工面亦可對光轴大致呈垂直狀態。加工 面即便對光軸傾斜，若加工部分尚在容許範圍内則無妨， 可動鏡排列面4b亦可容許一鏡面之尺寸與投射光學系統之 NA所決定之焦點深度内之傾斜。 5 構成上述投射光學系統時，舉例言之，可採用成像側 無限遠之設計之光學系統作為物鏡7，而配置成可使物體側 焦點位置位於試料9上’並使用與物鏡7同樣為無限遠設計 之透鏡作為聚光透鏡5，而配置成使物體側焦點位置位於可 動鏡面4a上。 10 即，藉上述投射光學系統，可朝試料9上投射已為開狀 態鏡4A所反射之雷射光束2A，並於試料9上形成對應開狀 態鏡4A之配置之適當倍率之影像資料。 另’試料9之近旁則設有可藉可見光照明試料9上之可 見光照明部8。可見光照明部8則可採用諸如波長分布於由 15可見光之較長波長領域至紅外線波長領域之画素燈等。 又’聚光透鏡5與物鏡7之中間部之光路徑上，配置有 大致100%可穿透雷射光束2A之波長光，並可大致反射 10 0 %之可見光照明部8之可見波長領域之光之波長選擇鏡 6 〇 20 因此，由可見光照明部8所照射之照明光一旦為試料9 所漫反射形成照明反射光2〇，則照明反射光20將為物鏡7所 聚光’並反向行進於投射光學系統之光路徑上而到達波長 選擇鏡6，再為波長選擇鏡6所反射而自投射光學系統分歧 射出。 12 200918223 因波長選擇鏡6而分歧之照明反射光20之光路徑上，則 沿光路徑而依序配置有拍攝光學系統17、第1拍攝元件18。 拍攝光學系統17係可使入射光之像成像於預定之成像 面上之光學系統，舉例言之，可採用已將物體面設於無限 5边處之光學系統。本第1實施例中，由於照明反射光20係入 射光’故試料9之影像可成像於成像面。 第1拍攝元件18係於拍攝光學系統17之成像面上配置 有拍攝面之諸如由CCD等所構成之拍攝元件。其次，其與 第1影像處理部19電性連接，並可就拍攝光學系統17所投影 1〇之像進行光電換能，再對第1影像處理部19加以送出作為影 像資料105。 第1影像處理部19則與領域控制器26電性連接，並可對 領域控制器26送出DMD4之各可動鏡面4a之開關狀態之代 表資料102。 15 領域控制器26(照射領域控制機構)可依據經第1影像處 理部19而由第1拍攝元件18送出之影像資料1〇5，算出試料9 上需要加工之部位之位置，而生成可由陣列排列中選出對 應上述部位之可動鏡面如，並使其形成開狀態鏡4人，且使 對應其餘部位之可動鏡面4a形成關狀態鏡4B之控制訊號 106且，可決疋自第丨影像處理部丨9接收之資料jo?之矩陣 之尺寸，並對DMD4傳送控制訊號106以進行控制。 此之所謂輯’仙⑽如試料9上之應照射領域，作 為位於光學上共輛位置之讓以之投影後，以微鏡為基準而 決定之領域。 13 200918223 進而，領域控制器26可基於來自第1影像處理部丨9與後 述之第2影像處理部13之資訊，而管理構成DMD4i各微鏡 之劣化程度，並因應其劣化程度而進行DMD4之使用模式之 切換。使用模式則有一般模式與劣化對應模式之分。 5 DMD4尚未劣化時為一般模式，矩陣之尺寸將直接對 DMD4傳送資料102。然而，一旦由控制器14接收領域分割 指令109，即切換為劣化對應模式，此時則將分割資料1〇2 之矩陣。即，將分割試料9上之缺陷領域。其次，藉分割使 矩陣之尺寸縮小而加以傳送，並對警告機構27送出警告指 10 令 110。 領域控制器26之影像處理在可由試料9之影像算出需 要加工之部位之位置時，可採用任一種影像處理。舉例言 之，可採用設定加工部位與加工瑕疵或未加工部位之亮度 值所對應之閾值，而使試料9上之影像二進位化，再與預設 15之應加工部位之形狀比較，而算出需要加工之加工瑕疵或 未加工部位之位置之影像處理。 舉例言之，二進位化後之影像如第4(b)圖所示，分布於 以斜線代表之範圍内，而得到圖形22a、22be在此，為求 簡便，故以正方形圖示雷射光束2之照射範圍。實際之照射 〇範圍之形狀則亦可為諸如圓形、矩形等其它形狀。 另，上述影像上之任意領域則對應可動鏡面4a之陣列 狀之排列，而分割成可藉開狀態鏡4A使雷射光束2A分別到 達之棋盤格狀之投影領域21。舉例言之，已儲存有各領域 之中心座標與對各投影領域21導引雷射光束2八之可動鏡面 14 200918223 4a之面編號作為分別對應之排列資料。 另’應加工部位之資訊亦已分別送交各投影領域21， 舉例言之’領域控制器26中即記憶有不具影像之領域23a、 23b是否為應加工領域之資訊。 5 因此’藉比較判定對各投影領域21之影像分布與是否 應加工σ卩位之資訊’即可判定加工瑕庇及未加工部位。即 便領域23a ' 23b為應加工部位，若判定為未加工領域，則 將生成可切換對應領域23a、23b之可動鏡面4a、4a之傾斜 角’並形成開狀態鏡4A、4A之控制訊號1〇6。 10 本例中，對應領域23a、23b之可動鏡面4a在第4(a)圖 中’則分別為可動鏡面4C、4D。 中繼光學系統1〇係可經配合第2拍攝元件12之感度而 減弱至適當光量之衰減濾波器11，而對第2拍攝元件12上投 〜雷射光束2B之光學系統，可動鏡面4a與第2拍攝元件12 15之拍攝面則設成呈共軛關係。 衰減濾波器11則可適當採用諸如以鋁等金屬膜蒸鍍於 玻璃上而成之反射型衰減濾波器，或使用積層蒸鍍介電體 而成之介電體多層膜之衰減濾波器等。 中繼光學系統10與衰減濾波器11則構成本第1實施例 20之檢知光學系統。 第2拍攝元件丨2係於中繼光學系統丨〇之成像面上配置 有拍攝面之諸如由CCD等所構成之拍攝元件。其次，其與 第2〜像處理部13電性連接，並可就中繼光學系統10所投影 之像進行光電換能，再對第2影像處理部13加以送出作為影 15 200918223 像資料103。 第2影像處理部13可依據由第2拍攝元件12送出之影像 資料103 ’而指定可可動鏡面4a中已形成關狀態鏡犯者，並 生成資料104，而對已電性連接之可動模版24加以送出。 5 可指定關狀態鏡4B之影像處理，可採用諸如設定略低 於關狀態鏡4B所反射而穿透中繼光學系統1〇、衰減渡波器 11之雷射光束2B之亮度之閾值，而使第2拍攝元件12所拍攝 之影像二進位化’再使閨值以上之領域與DMD4上之可動鏡 面4a之排列位置相關之影像處理。 10 舉例言之，進行對應第4(b)圖之圖形22a、22b之加工 時，因正常加工時’在其外之領域内，可動鏡面如已形成 關狀態鏡犯，故第2拍攝元件^可攝得已逆轉圖形瓜、挪 之圖形44(參照第5_)。反之，—旦攝㈣形44，則可判 定對應圖形44之位置之可動鏡面4a為關狀態鏡4b。 15 ㈣器14係可進行雷射加卫裝置5 G之整體控制之控制 部，並與領域控制器26、第2影像處理部13、雷射光源卜 致動器驅動器15分別電性連接。 控制為14之主要控制則包含發光控制、偏向動作檢知 控制及照射領域移動控制。 2 0纟光控制可切換為以加工試料9所需之雷射能（光輸出） 進行毛光之加工核式’以及以即便雷射光束2到達試料9亦 不致使。式料9發生變化程度之較低輪出進行發光之事前發 光模式。另’除藉雷射統丨進行事前發練式，亦可於雷 射光源1與照明光學系統3之間設置半透鏡等反射光學元 16 200918223 件，並没置遠低於LED等雷射之輸出之光源，使其發光而 與雷射光源1對DMD4之照射同樣地進行照射。 加工模式時’舉例言之’將進行發光控制，而進行峰 值輸出為P2而振盪周期為數則“程度之脈衝振盪。又，事前 5發光模式時，舉例言之，將進行發光控制，而進行峰值輸 出為Pi之相同脈衝振盪。 偏向動作檢知控制在本第1實施例中，係可比較經領域 控制斋26而接收之資料1〇2與來自第2影像處理部13之資料 104 ’而判定DMD4之偏向動作狀態，並於檢知偏向動作瑕 10疵0守，進行照射領域移動控制之控制。因此，本第丨實施例 之控制器14兼用作為偏向動作檢知機構。 照射領域移動控制係藉致動器驅動器15而驅動二軸位 移致動器16,並使讓〇4沿可動鏡排歹,⑽扑之面内進行2次 元移動之控制。 另檢知光學系統、第2拍攝元件12、第2影像處理部 13及控彻1侧構成動作職元件檢知機構。 -軸位移致動H丨6 (空間調變元件滑移機構）係可使 20 DMD4於沿可動㈣列面4b之平面_動，而不致使可動鏡 面4a之傾斜角對雷射光束2改變之移動機構，II自致動器驅 動器15接收移動控制訊號114，即可朝二軸方向進行驅動。 移動方向之最小移動量舰成至少可正確料㈣ 之單個程度單位。 又’二軸位移致動器16可設定滑移範圍，而使被加工 面上之麵4之左上叙微鏡所照射者之_照射位置，亦 17 200918223 可為設於右下端之微鏡所照射。 致動器之種類可採用較適用者。舉例言之，可採用組 合有藉滾珠螺桿輸送機構或線性馬達等朝一軸方向驅動之 致動器之機構。 5 致動器驅動器15係可對應來自控制器14之控制訊號 100’而生成可驅動二軸位移致動器16之移動控制訊號114。 警告機構27則可接收來自領域控制器26之警告指令 110，而使用對話、訊號塔等，對雷射加工裝置5〇之使用I 報知DMD4已劣化之訊息。一度接收之警告指令11〇之資訊 10在更換DMD4之前，將繼續保留，並於其間持續進行罄告。 更換DMD4後，警告指令11〇之資訊則將重設。 以下，就本第1實施例之雷射加工裝置5〇之動作進行説 明。 首先，說明一般模式之雷射加工步驟。 15 藉雷射加工裝置5〇進行加工時，將開啓未圖示之電濾 開關’而進行適當之初始化，再置入試料9。 DMD4—旦經初始化，各可動鏡面4a之傾斜角即設成第 3圖所示之0B，並設定成關狀態鏡4B。 可見光照明部8 —旦發光，即如第1圖所示，照明光將 2〇為試料9所反射’由可見光組成之照明反射光20則為物鏡7 所聚光。其次，大致100%為波長選擇鏡6所反射，而朝拍 攝光學糸統17入射，再於第1拍攝元件18之拍攝面上成像試 料9之像。 影像資料105將由第1拍攝元件18送至第1影像處理部 18 200918223 19，並由試料9之影像得到應加工部位之資訊。 假設得到第4(b)圖所示之圖形22a、221)之影像後，依據 記憶於領域控制器26之資訊，已判定領域23a、23b係加工 瑕疵部。 5 舉例言之，加工瑕疵部係電路圖形之短路部或外露之 多餘圖形，而須進行加熱、昇華等加工’以去除圖形22a、 22b之短路部或多餘圖形。 因此，領域控制器26為對領域23a、23b照射雷射光束 2A，而對DMD4送出可使對應該等領域之可動鏡面4a形成 10 開狀態鏡4A之控制訊號1〇6。又，開狀態鏡4A之設定資訊 則作為資料102而由第1影像處理部19送至領域控制器26。 以下’以可形成開狀態鏡4A之可動鏡面4a為第4(a)圖 中之可動鏡面4C、4D而進行說明。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laser processing apparatus using a spatial modulation element such as a mirror array of a digital micromirror device, etc. In the manufacturing process of the substrate of the display device or the like, the laser repairing device which corrects the defect area on the substrate and corrects the shape of the defect area can be taken. L· ^ 10 Background of the Invention So far, in the laser processing, there is known a laser beam that can be used to illuminate a workpiece by a plurality of micromirrors, so that the range and pattern of the laser beam irradiation are variable, A device for processing. In the above laser processing apparatus, since the micro-mirror surface having a micro-area is irradiated with a high-output laser beam, the micro-mirror is liable to be deteriorated over time, and once the micro-mirror is deteriorated, a tilt of a mirror such as a micromirror may occur. Abnormally shifting the position of the laser beam, or processing in the field of processing, or damage to the field of processing and the field of processing. In order to solve the above problems, an exposure apparatus has been disclosed which can be moved when a digital micromirror device (Digital Micromirror Device: & DMD) which is one of the micro mirror arrays composed of a plurality of micromirrors is degraded. s on the incident side of the DMD or the laser beam, and moves the laser beam irradiation field to the DMD which has not deteriorated (refer to, for example, Patent Document 1). Secondly, an example of a mechanism capable of measuring the deterioration state has been It is disclosed that the laser beam 5 200918223 can be used to estimate the deterioration state of the accumulated leaf device between the day and the day, and the light energy can be measured on the position corresponding to the scribed medium, and the deterioration state can be detected by the decrease of the light energy. It is possible to detect the state of deterioration by measuring the scattered light by the light detector provided in each drawing area. 5 Further, it has been disclosed that a DMD is used which is larger than the range used for laser beam irradiation. The reflected light of the micromirror is deflected away from the laser beam in the direction of the object to be processed, to detect the deterioration of the micromirror, and to slide the DMD as a whole, and to avoid using the detected deterioration component, and to change the illumination field to avoid (1) Patent Document 1 Japanese Patent Laid-Open Publication No. (9) No. (pages 4 to 8, 7, 10, 13) Japanese Patent Laid-Open Publication No. 2-Drawing No. [Invention Disclosure] The invention is intended to solve the problem. However, in the laser processing apparatus using the above-described micromirror array, :=:Γ increases and the DMD is fully generated. Degraded components, that is, (4) 2 array slips ' may also form a state in which the deterioration 4 cannot be avoided, and then the 微 Γ 彡 彡 彡 彡 , , , , , , , , 待 待 待 待 待 待 待 待 待 待 待 待 待 待 微 微 微 微 微 微 微 微 微Laser processing is used in the line to be added. ##曰, When the production is set up, the company must stop manufacturing the production line. 20 200918223 It is also possible to continue the processing equipment and laser nJL method in the field of (4). Means for Solving the Problems In order to solve the above problems, the present invention adopts the following configuration. That is, according to one aspect of the present invention, the present invention includes: a spatial modulation element, which is packaged by a plurality of micro kinetic devices. Aunt Gu Irradiating the workpiece in a W shape, the projection light source is emitted from the laser light source, and is arranged such that the spatial modulation element and the light beam are located at a common position; the illumination field control data is processed, the field is controlled, and the The movement of the spatial modulation component::: previously set = detection mechanism, to detect the micro-movable components that constitute the action fatigue in the aforementioned spatial modulation component; and (4) the small movable 70 control, which has been controlled by the control mechanism, According to the present invention, it is possible to use the position of the micromirror and the normal field of the micromirror when the overlap of the irradiated fields is detected. In the field of acne, the surface of the processed material can not be avoided by the micro-mirror of the action (4), so even if it is under, the predetermined irradiation field can be ensured. Injection processing device. BEST MODE FOR CARRYING OUT THE INVENTION 20 200918223 Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the drawings, the same or equivalent components are designated by the same reference numerals, and the common description is omitted. [First Embodiment] 5 Hereinafter, a laser processing apparatus according to a first embodiment of the present invention will be described. Fig. 1 is a structural explanatory view showing a schematic configuration of a laser processing apparatus according to a first embodiment of the present invention. Fig. 2 is an explanatory view showing a long hole structure of a laser processing apparatus according to a first embodiment of the present invention. Fig. 3 is a cross-sectional explanatory view showing the structure and operation of the cross-sectional direction of the micromirror array of the laser processing apparatus according to the first embodiment of the present invention. Fig. 4 is a plan explanatory view showing a mode in which the state of the micromirror array of the laser processing apparatus according to the first embodiment of the present invention is observed from the side of the reflecting surface, and an example of the influence on the workpiece on which the operation is performed. Plane illustration. Fig. 5 is a schematic explanatory view showing an example of an image obtained by an imaging element of the laser processing apparatus according to the first embodiment of the present invention. In the first drawing, the laser processing apparatus 50 includes a laser light source 1 (light source unit), an illumination optical system 3, a digital micromirror device (DMD) 4 (micromirror array), a collecting lens 5, and a wavelength selective mirror 6. The objective lens 7, the relay optical system 1A, the attenuation filter u, the second imaging element 12 (imaging element), the second image processing unit 13 (biasing operation detecting means), the controller 14 (lighting control means), and actuation The actuator driver 15, the x-axis displacement actuator 16 (moving mechanism), the imaging optical system 17, the first imaging element 18, the first image processing unit 19, the long hole 25, the field controller 26, and the warning mechanism 27. Next, the laser processing apparatus 5 can project a laser beam 2A having a predetermined light output and wavelength which has been formed with a predetermined pattern on the sample 9 (worked object), and the surface of the sample 9 is processed by the light energy. The processing of light energy can be 200918223 such as heating, melting, vaporization, cutting, exposure recording and so on. The laser source 1 is capable of generating a laser beam 2 for processing the sample 9. The light output and the wavelength of the laser beam 2 correspond to the wavelength characteristics of the light absorption of the material of the processed portion of the sample 9, and are set to a light output with good processing efficiency and an oscillation wavelength of 5 wavelengths. The illumination control of the laser beam 2, such as illumination, photo-off, and adjustment, is performed by a control signal 101 generated by the controller 14 to be described later. For example, when processing a photoresist film on which a photomask is formed on a glass substrate such as a liquid crystal substrate, a YAG laser (basic wavelength Al = 1 〇 64 #m (micrometer)) can be used, and the oscillating second is suitably employed. The third and fourth resonance waves (individual wavelengths of 10 2 = 532 nm, λ 3 = 355 ηηι, and U = 266 nm) have a pulse width of several degrees, and the peak output is a pulse of several MW, as laser light. The illumination optical system 3 is composed of an optical system capable of converting the laser beam 2 generated by the laser source 为 into a substantially parallel beam which is uniform in cross-sectional intensity distribution, and is disposed on the optical path of the laser beam 2 . The configuration of the above-described illumination 15 optical system 3 is known in various configurations such as the use of a fly-eye lens, a diffractive element, an aspherical lens, and a KALEID0 lenticular lens, and any configuration can be employed as needed. The elongated hole 25 is disposed between the laser light sources 1 to DMD4, and is optically designed so that only the laser beam 2 passing through the opening of the long hole 25 can be incident toward the DMm. The long hole 25 is composed of two parts of the long hole parts 25 and 258 as shown in Fig. 2 . The device is mounted on a χγ stage mechanism (not shown), and is controlled by a motor in the XY-axis direction, and can also be controlled in the direction of Χ0Υ0, and the XY stage mechanism can be changed to change the leg 〇4. The size of the opening is controlled or the center position of the opening is slipped. In addition, at this time, the driving resolution 200918223 is at least the same as the pixel size of the micromirror constituting the DMD4, and the moving range of the χγ direction is such that any micromirror in the field of the DMD4 for single laser irradiation can be separately performed. The range of exposure. The shape of the opening portion is not particularly limited, but it may be suitable for the shape of the micromirror 5 to reduce the difference between the area of the hard field of the laser beam 2 and the area of the micromirror. That is, when the micromirrors are arranged in a rectangular shape, the openings are also formed in a rectangular shape, and if the micromirrors are arranged in a radial shape, the openings are also formed in a radial shape. Once the (4) data is input, the opening of the long hole 25 is enlarged, reduced, and slipped, and the control is performed only by irradiating the laser beam 2 with the input field. The DMD 4 as the spatial modulation element is a micromirror array in which the plurality of movable mirrors can be independently switched by the tilt angles of the DMDs 4, and the plurality of movable mirrors can be independently arranged without any gaps (see FIG. 3). The switching of the tilt angle of each of the movable mirrors 4a is performed by a control signal H)6 generated by the domain controller 1526, which will be described later. Once the control state is selected by the control signal 1〇6, the movable mirror surface 4a is formed to be inclined only by the tilt angle of the movable mirror array surface </>A. Further, in the same manner, the off state state mirror 4β is formed only by the tilt angle. Next, the open state mirror 4A can deflect the laser beam 2 toward the first beam direction of the sample 9 toward the laser beam 2A, and the off state mirror 48 can bias the laser beam toward the second direction away from the sample 9. The laser beam is 2β. In the first embodiment, as shown in FIG. 3, the direction of the normal direction of the movable mirror array surface 4b in the i-th direction is the direction in which the second direction is the inclination angle of the normal direction of the movable mirror array surface. The example is called ^ day and month. 200918223 Here, the incident direction of the laser beam 2 is different from the direction of the first direction. Further, the inclination angles φ Α and 0B are inclined angles which are inclined toward the opposite directions by the movable mirror array surface 4b. Therefore, the following formulas (1) and (2) can be established. θ>=2 s...(1) 5 θ〇=^θ{-{-2χφΒ..........) Here, the angled laser beam 2 is movable The incident angle of the mirror array is ,, and is an angle other than Γ. The size of the movable mirror array surface 4b is much larger than the beam diameter of the laser beam 2 after the uniformity of the cross-sectional intensity distribution by the illumination optical system 3 The movable mirror surface 4a constitutes a beam diameter much smaller than that of the laser beam 2. The DMD 4 can be constructed in the same manner as a user such as a projector. That is, the MEMS (Micro Electro Mechanical Systems) technology can be used to make the size 10 micrometers. (ym) a movable mirror surface 4a having a square surface and a surface formed by vapor deposition of a metal film to form a reflective surface, such as an array of 8 〇〇χ 6 〇〇 15 degrees, and respectively for the movable mirror array surface 4b ±12. The degree of inclination (Φα=<Αβ=1 2) is the state of the inclined state, etc. The size and shape of the beam section of the laser beam 2 and the size of the movable mirror arrangement surface can correspond to the type of processing and the The workpiece or the like is set to an appropriate shape and size, and an example thereof may be a circle in which the laser beam 2 has a beam diameter of mm. 2 〇-shaped cross-section, the size of the movable mirror arrangement surface 4b is about 8mm x 6mm. The concentrating lens 5 and the objective lens 7 can constitute a pair of laser beams 2A for the DIy [D4 irradiated laser beam] on the sample 9. In the projection optical system, the movable mirror array surface 4b and the processing surface of the sample 9 are arranged in a conjugate relationship. Further, the movable mirror row 11 200918223 can be placed on the processing surface of the sample 9 to be substantially perpendicular to the optical axis. Even if the surface is inclined to the optical axis, if the processed portion is within the allowable range, the movable mirror array surface 4b can also allow the size of a mirror surface to be inclined within the depth of focus determined by the NA of the projection optical system. In the system, for example, an optical system of an infinity design on the imaging side can be used as the objective lens 7 and configured such that the object-side focus position is on the sample 9' and a lens designed to be infinity as the objective lens 7 is used as a cluster. The optical lens 5 is disposed such that the object-side focus position is located on the movable mirror surface 4a. 10 That is, by the above-described projection optical system, the thunder reflected by the open state mirror 4A can be projected onto the sample 9. The light beam 2A is formed on the sample 9 to form image data of an appropriate magnification corresponding to the arrangement of the open state mirror 4A. In addition, near the sample 9, a visible light illumination portion 8 on the sample 9 can be illuminated by visible light, and the visible light illumination portion 8 is provided. A pixel lamp such as a wavelength distribution in a longer wavelength region from 15 visible light to an infrared wavelength region may be employed. Further, a substantially 100% penetrable laser is disposed on the optical path between the condenser lens 5 and the intermediate portion of the objective lens 7. The wavelength of the light beam 2A, and the wavelength selective mirror 6 〇 20 of the light in the visible wavelength region of the visible light illumination portion 8 is substantially reflected. Therefore, the illumination light irradiated by the visible light illumination portion 8 is diffused and reflected by the sample 9 When the illumination reflected light 2 is formed, the illumination reflected light 20 will be condensed by the objective lens 7 and travel backward in the optical path of the projection optical system to reach the wavelength selective mirror 6, and then self-projected by the wavelength selective mirror 6 The optical system is split and shot. 12 200918223 In the light path of the illumination reflected light 20 which is branched by the wavelength selection mirror 6, the imaging optical system 17 and the first imaging element 18 are sequentially arranged along the optical path. The photographing optical system 17 is an optical system that images an image of incident light on a predetermined imaging surface. For example, an optical system in which an object surface is provided at an infinite five sides can be employed. In the first embodiment, since the illumination reflected light 20 is incident on the light, the image of the sample 9 can be imaged on the image forming surface. The first imaging element 18 is an imaging element such as a CCD or the like in which an imaging surface is disposed on an imaging surface of the imaging optical system 17. Then, it is electrically connected to the first image processing unit 19, and photoelectrically converts the image projected by the imaging optical system 17, and then the first image processing unit 19 is sent as the image data 105. The first video processing unit 19 is electrically connected to the field controller 26, and can send the representative data 102 of the switching states of the movable mirrors 4a of the DMD 4 to the field controller 26. 15 The field controller 26 (the illumination field control means) can calculate the position of the portion to be processed on the sample 9 based on the image data 1〇5 sent from the first imaging device 18 via the first image processing unit 19, thereby generating an array. In the arrangement, the movable mirror surface corresponding to the above portion is selected and formed into an open state mirror 4, and the movable mirror surface 4a corresponding to the remaining portion is formed into the control signal 106 of the off state mirror 4B, and may be determined from the second image processing portion. 9 The size of the matrix of the received data is transmitted, and the control signal 106 is transmitted to the DMD 4 for control. The so-called "Sen" (10) is the field to be irradiated in the sample 9 as a reference for the position of the optically common vehicle, and is determined based on the micromirror. Further, the field controller 26 can manage the degree of deterioration of each of the micromirrors constituting the DMD 4i based on the information from the first image processing unit 丨9 and the second image processing unit 13 to be described later, and perform DMD4 in accordance with the degree of deterioration. Use mode switching. The usage mode is divided into a general mode and a degraded corresponding mode. 5 When DMD4 has not deteriorated, it is the normal mode, and the size of the matrix will directly transmit data 102 to DMD4. However, once the domain segmentation instruction 109 is received by the controller 14, i.e., switched to the degradation corresponding mode, the matrix of the data 1 〇 2 will be split at this time. That is, the defect area on the sample 9 will be divided. Next, the size of the matrix is reduced by the division and transmitted, and a warning command is issued to the warning mechanism 27. The image processing of the field controller 26 can be performed by any type of image processing when the position of the portion to be processed can be calculated from the image of the sample 9. For example, the threshold corresponding to the brightness value of the processed portion or the unprocessed portion can be set, and the image on the sample 9 can be binary-digitized, and then compared with the shape of the predetermined processing portion of the preset 15 to calculate Image processing of the position of the machined or unprocessed part that needs to be machined. For example, the image after binarization is distributed in the range represented by the oblique line as shown in FIG. 4(b), and the patterns 22a and 22be are obtained here. For the sake of simplicity, the laser beam is illustrated by a square. 2 range of illumination. The shape of the actual illumination 〇 range may also be other shapes such as a circle, a rectangle, and the like. Further, any field on the above-mentioned image corresponds to the array of the movable mirrors 4a, and is divided into the projection field 21 in which the laser beam 2A can be reached by the state mirror 4A. For example, the central coordinates of each field and the surface number of the movable mirror surface 14 200918223 4a for each of the projection fields 21 are stored as corresponding arrangement data. The information on the part to be processed has also been sent to each of the projection fields 21, for example, the field controller 26 stores whether or not the fields 23a, 23b having no images are information in the field to be processed. 5 Therefore, it is possible to determine the processing of the sheltered and unprocessed parts by comparing the image distribution of each projection field 21 with the information of whether or not the σ position should be processed. Even if the field 23a ' 23b is the portion to be processed, if it is determined to be the unprocessed area, the inclination angle ' of the movable mirror faces 4a, 4a of the corresponding fields 23a, 23b can be switched and the control signals 1A of the open state mirrors 4A, 4A are formed. 6. In the present example, the movable mirrors 4a of the corresponding fields 23a and 23b are movable mirrors 4C and 4D, respectively, in Fig. 4(a). The relay optical system 1 can be attenuated to the appropriate amount of light by the attenuation filter 11 in accordance with the sensitivity of the second imaging element 12, and the optical system of the laser beam 2B can be applied to the second imaging element 12, the movable mirror 4a and The imaging surface of the second imaging element 12 15 is set to be in a conjugate relationship. As the attenuation filter 11, a reflection type attenuating filter obtained by vapor-depositing a metal film such as aluminum on glass or an attenuating filter of a dielectric multilayer film formed by laminating a dielectric material can be suitably used. The relay optical system 10 and the attenuation filter 11 constitute the detection optical system of the first embodiment 20. The second imaging element 丨 2 is an imaging element such as a CCD or the like in which an imaging surface is disposed on an imaging surface of the relay optical system 丨〇. Then, it is electrically connected to the second image processing unit 13, and photoelectrically converts the image projected by the relay optical system 10, and then the second image processing unit 13 is sent as the image 103. The second image processing unit 13 can designate the off-state mirror in the movable mirror surface 4a based on the image data 103' sent from the second imaging element 12, and generate the data 104, and the electrically connected movable template 24 can be electrically connected. Send it out. 5 The image processing of the off-state mirror 4B can be specified, and the threshold value of the brightness of the laser beam 2B that is reflected by the mirror 4B and penetrates the relay optical system 1 〇 and the attenuation waver 11 can be used, for example, so that the threshold value can be set. The image captured by the second imaging element 12 is binary-enhanced and the image processing related to the arrangement position of the movable mirror surface 4a on the DMD 4 is made. 10 For example, when the processing of the patterns 22a and 22b corresponding to the figure 4(b) is performed, the movable mirror surface is formed as a closed state mirror in the field outside the normal processing, so the second imaging element ^ You can take a picture 44 (see section 5_) that has been reversed. On the other hand, if the (four) shape 44 is used, it is determined that the movable mirror surface 4a corresponding to the position of the pattern 44 is the off state mirror 4b. The (four) device 14 is a control unit that can perform overall control of the laser-assisted device 5G, and is electrically connected to the field controller 26, the second image processing unit 13, and the laser light source actuator driver 15, respectively. The main control with control 14 includes illumination control, bias motion detection control, and illumination field motion control. The 20 纟 light control can be switched to the laser processing nucleus for the laser energy (light output) required for processing the sample 9 and to prevent the laser beam 2 from reaching the sample 9 even if it is reached. The material 9 has a lower degree of change and the light is emitted before the light is emitted. In addition, in addition to the laser training system, a reflective optical element 16 200918223 such as a semi-lens can be disposed between the laser light source 1 and the illumination optical system 3, and is not far below the laser such as LED. The light source that is output is illuminated to emit light in the same manner as the irradiation of the DMD 4 by the laser light source 1. In the machining mode, 'exemplary' will perform illuminating control, and the peak output will be P2 and the oscillation period will be several. "The degree of pulse oscillation. In addition, in the first 5 illuminating mode, for example, the illuminating control will be performed, and the peak will be performed. The same pulse oscillation is outputted as Pi. In the first embodiment, the bias motion detection control can be compared with the data 1〇2 received by the domain control unit 26 and the data 104' from the second image processing unit 13. The deflection operation state of the DMD 4 is controlled by the detection of the deflection operation and the control of the movement control of the illumination field. Therefore, the controller 14 of the third embodiment is also used as the deflection operation detection mechanism. The two-axis displacement actuator 16 is driven by the actuator driver 15, and the 〇4 is guided along the movable mirror, and the control of the 2-dimensional movement is performed in the plane of the (10) flap. The optical system and the second imaging element 12 are also detected. The second image processing unit 13 and the control unit 1 constitute an operational component detecting mechanism. - Axis displacement actuation H丨6 (spatial modulation element slip mechanism) allows 20 DMD4 to be along the movable (four) column surface 4b. flat_ The moving mechanism that does not change the tilt angle of the movable mirror 4a to the laser beam 2, II receives the motion control signal 114 from the actuator driver 15, and can be driven in the two-axis direction. The minimum moving amount of the moving direction is At least the single degree unit of (4) can be correctly made. Also, the 'two-axis displacement actuator 16 can set the slip range, and the position of the left side of the surface 4 on the surface to be processed is the illumination position of the person who is irradiated by the micromirror. 17 200918223 It can be irradiated to the micromirror provided at the lower right end. The type of the actuator can be applied to a suitable one. For example, a mechanism combining an actuator driven by a ball screw conveying mechanism or a linear motor in an axial direction can be employed. The actuator driver 15 can generate a motion control signal 114 that can drive the two-axis displacement actuator 16 corresponding to the control signal 100' from the controller 14. The warning mechanism 27 can receive the warning command from the domain controller 26. 110, using a dialogue, a signal tower, etc., to use the laser processing device 5 to notify the DMD4 that the message has deteriorated. The information received once the warning command 11 is replaced before the DMD4 is replaced. The continuation of the continuation of the slogan is continued. After the replacement of the DMD 4, the information of the warning command 11 将 will be reset. The following describes the operation of the laser processing apparatus 5 本 according to the first embodiment. Laser processing of the mode. 15 When machining is performed by the laser processing device 5〇, the electro-filter switch 'not shown' is turned on and initialized appropriately, and then the sample 9 is placed. DMD4 is initialized, each movable mirror The inclination angle of 4a is set to 0B shown in Fig. 3, and is set to the off-state mirror 4B. The visible light illumination unit 8 is illuminated, that is, as shown in Fig. 1, the illumination light is reflected by the sample 9 The illuminating reflected light 20 composed of visible light is collected by the objective lens 7. Next, approximately 100% is reflected by the wavelength selective mirror 6, and is incident on the imaging optical system 17, and the image of the sample 9 is imaged on the imaging surface of the first imaging element 18. The image data 105 is sent from the first imaging element 18 to the first image processing unit 18 200918223 19, and information on the portion to be processed is obtained from the image of the sample 9. Assuming that the images of the patterns 22a and 221) shown in Fig. 4(b) are obtained, the determined fields 23a and 23b are processed in accordance with the information stored in the field controller 26. 5 For example, the short-circuited portion of the circuit pattern or the exposed redundant pattern is processed, and heating, sublimation, etc. are performed to remove the short-circuited portion or redundant pattern of the patterns 22a, 22b. Therefore, the field controller 26 irradiates the fields 23a, 23b with the laser beam 2A, and sends the control signal 1"6 to the DMD 4 so that the movable mirror 4a corresponding to the field can be formed into the 10th state mirror 4A. Further, the setting information of the on-state mirror 4A is sent to the field controller 26 as the material 102 by the first image processing unit 19. Hereinafter, the movable mirror surface 4a of the openable state mirror 4A will be described as the movable mirror surface 4C, 4D in the fourth (a) drawing.
DMD4 —旦接收控制訊號1 〇6，即將可動鏡面4c、4D 15 "^成傾斜角么，而形成開狀態鏡4A。在此，假設可動鏡面DMD4 Once the control signal 1 〇6 is received, the movable mirrors 4c, 4D 15 " are inclined, and the open state mirror 4A is formed. Here, assuming a movable mirror
4C已屆其壽命，而發生動作瑕疵，無法控制在正確之傾斜 角0 20 习，由咐疋你丨則稭徑制器14而發出雷射光束2，並以 事前發光模式對DMD4照射已藉照明光學系統3而使截面強 度-致而經整形之雷射光束2。舉例言之，可對第4⑷圖所 不之照射領域24A照射。其次，對應各可動鏡面如之傾斜角 叙生動作瑕疵，而形成關狀態鏡4B。 可動鏡面4D可正常動作，故設成開狀態鏡4A。 19 200918223 因此，藉可動鏡面4D偏向之雷射光束从將為聚光透鏡 5所聚光’再大致⑽％穿透波長選擇制，“物鏡7所聚 光，並到達試料9上，而照射第4(b)圖之領域231^。 /另’為關狀態鏡顿反射之雷射光束2β將穿透中繼光 5學系統ίο、城濾波器n而投影於第2拍攝元件处，舉例 言之，可拍攝如第5⑻圖所示之圖形45之像，並對第2影像 處理部13加以送出作為影像資料1〇3。 第2影像處理部U則可就該影像崎影像處理，而指定 已為關狀態鏡4Β之可動鏡純，而對控·14加以送出作 10 為資料104。 控制益Η騎比較闕魅制器％而接收之資料收 與來自第2影像處理部13之資料咖，判定相當於應已為開 狀態鏡4Α之領域46之可動鏡面化已發生動作瑕庇(偏向動 作檢知控制）。 15 丨述判定之結果，將由控制器Η進行照射領域移動控 制。移動方向、移動量除已檢知動作瑕疵部分以外，可任 意設定。其次，重複上述步驟，待關狀態鏡4B之狀態正常， 即結束事前發光動作，而控制器14即對雷射光源m出控制 訊號101，而開始進行加工步驟。 20 加工步驟時’第4(b)®之領域23a、23b將加熱昇華，而 將圖形22a、22b修復為正常狀態。 以上即為-般模式之雷射加工步驟。然而，若劣化進 而惡化’則即便基於事前發光模式所得之來自第2影像處理 部13之貢料1〇4與來自第丨影像處理部19之資料丨〇2而移 20 200918223 動，若控制器14檢知已劣化之微鏡侵入欲使用於照射之領 域，則將切換至劣化對應模式。 以下’參照第6及7圖說明劣化模式。 在此，第6(a)圖係顯示DMD4之微鏡領域（矩陣之最外 5 緣）内之矩形形狀之照射領域(缺陷等）所對應之微鏡之使用 領域之模式圖，第6(b)圖係顯示DMD4之中央部分發生一劣 化之DMD4之狀態之模式圖。又，第7圖係將欲照射之領域 上下二分為並未劣化之矩形形狀之領域後與DMD4側對應 之模式圖。 10 在此’欲照射之領域及與其對應之DMD4係呈光學上 共軛之位置關係，故以DMD4側之矩陣加以顯示於附圖。 控制器14一旦經領域控制器26接收資料1〇2，即進行分 割判定。由於初始係一般模式，故分割判定為NO，領域尺 寸即直接對控制器14及長孔25分別傳送作為控制訊號 15 107、1〇8 〇 其次，控制器14則進行偏向動作檢知控制，並比較經 領域控制器2 6而接收之資料i 〇 2與事前發光模式時對D μ D 4 照射雷射光並以第2拍攝元件12拍攝之影像於第2影像處理 2 13中經影像處理而指定已劣化之微鏡後之資料iQ4，而搜 20哥不使帛已劣化之微鏡<dmd4之位置，即，最佳使用位 置。然而，此時如第6(b)圖所示，一旦劣化之微鏡擴散，則 何使DMD4滑移’亦無法避開劣化之微鏡，結果則無法找 出最佳使用位置。此時，則判斷由一般模式切換為劣化對 應模式。 21 200918223 控制器14在劣化對應模式下’則對領域控制器％通知 辨識編號及領域分割指令109。接收該領域分割指令1〇9之 領域控制器26則如第7圖所示，將原已保存之資料1〇2之矩 陣二分為第1矩陣與第2矩陣。此時，分割方法可將使用領 5域朝諸如上下以矩形形狀加以分割。對D M D 4側投影而觀察 時之縱橫則可分割成微鏡之ΐγ@χ8個之二領域。因此，以 DMD側之17個χ8個之微鏡領域為基準，進行分割對應上述 領域之試料之領域之處理。 在此’分割方法宜儘可能採用可將面積一分為二之方 10法。舉例言之，可採用先求出面之重心位置，再就該重心 朝上下、左右、斜向等而進行分割之方法。其次，並個別 予以編制固有之辨識編號而加以保存。 然後’同時亦對警告機構27通知警告指令。接收挲 告指令110之警告機構27則對雷射加工裝置％之操作者於 15 監視器上或藉訊號塔等發出DMD4已劣化之警告。在此，逖 告之時機不僅限於以上所述，舉例言之，亦可計算偏向動 作檢知控制時已使D M D 4滑移之次數，而於滑移已達規定次 數以上時進行警告。 其次，領域控制器26將先對控制器14傳送第1矩陣作為 20控制資料。在此，再藉進行偏向動作檢知控制，而基於DMD4 之可使用領域找出最佳使用位置。此時，由於已劣化之微 鏡上侧縱橫設有17個χ8個之可使用領域，故可使用該領域 進行照射，控制器14則藉進行DMD4之照射領域移動控制， 而對致動器驅動器15下達指示，以藉控制二軸位移致動器 22 200918223 16，而使DMD4朝下方移動一個微鏡量。 順利疋成雷射光束2之照射後，控制器丨4即對領域控制 器26要求次—矩陣之資料。領域控制器26則對應該要:而 ^控制器M傳送第2矩陣之資料。在此，則與心矩陣相同， 字進仃偏向動作檢知控制。其次，若無問題，則進行照射 =域移動控制'然而’若在此假設因事前發光模式之雷射 “、射‘致產生新的劣化微鏡，或因缺陷部分之 =找出最佳使用位置，則藉前述相同之步驟再次就第2矩 車之領域進行領域分割。 10 15 以上之處理，將在資料102之全域完成之前反覆進行。 一上即便在使DMD4滑移亦無法避開已劣化之微鏡 +下亦可持續使用雷射加工裝置50。又，藉警告DMD4 之$化㈣知操作者，即可使㈣者在雷射加卫裝置难 去使用之前進行維修之準備，故可縮短雷射加 停機時間。 另，上述第1實施例之偏向動作檢知控制時，是否為最 佳使用位置之判斷係就單一微鏡為單位而進行。然而，僅 有一個微鏡劣化時，可能因繞射現象而不致實質影響雷射 口此，右動作瑕疵*之微鏡之數量超過預設之每單位 20面積數量，則判定由上述複數微鏡所構成之領域為劣化 區，右劣化區包含於照射區之内，則亦可判斷並非最佳使 用位置。 即便微鏡發生單體之故障，亦可能不影響加工，故如 此即可進而延長DMD4之使用期間。 23 200918223 又，本實施例中切換至劣化對應模式之判斷係依偏向 動作檢知控制時是否找出最佳使用位置而進行，但亦可預 設作為基準之已劣化之微鏡之數量，而管理已劣化之微於 之數量’並在發生大於預設之閾值之微鏡劣化之前，設成 5 一般模式，而於已劣化之微鏡數量超過閾值時，乃切換成 劣化對應模式。 又，亦可設成預先掌握一般模式時之DMD4之整體戋 部分之反射亮度，而於上述反射亮度低於預設之閾值時， 切換成劣化對應模式。 10 另，亦可管理對DMD4之雷射照射時間或雷射照射次 數，而於超過預設之雷射照射時間或雷射照射次數時，切 換成劣化對應模式。 又，上述第1實施例中，一般模式定義為「不為領域控 制器26所分割而可使用之狀態」，劣化對應模式則定義為 15 「若分割領域即可使用之狀態」，但亦可定義一般模式為 「不使DMD4滑移即可使用之狀態」，而使劣化對應模式為 「若使DMD4滑移即可使用之狀態」。 又，本實施例中，偏向動作檢知控制之照射領域移動 控制係使用二軸位移致動器16而進行DMD4之移動動作，值 〇亦可改設可載置試料9之可移動於垂直二軸上之二軸移動 載〇，而控制該二軸移動載台以使1)]^〇4與試料9相對移 動，或將雷射加工裝置50整體搭載於可朝垂直之二軸方向 移動之移動桁架裝置，而使DMD4與試料9相對移動，以進 订“、、射領域移動控制。即，可為切換DMD4之控制對象之微 24 200918223 鏡之控制。 另’本發明之各實施例雖已以製造液晶顯示裝置等之 基板之過程中’可藉拍攝擷取基板上之缺陷領域’而配合 前述缺陷領域之形狀進行修正之雷射修復裝置為例進行說 5明，但本發明亦可適用於不具備用以擷取缺陷之拍攝系統 之雷射加工裝置。即，可省略拍攝光學系統17、第1拍攝元 件18、第1影像處理部19、波長選擇鏡6等，而代之以設置 已對領域控制器26輸入有加工部位之資料之加工資訊記憶 部。又’亦可對領域控制器26自該加工資訊記憶部輸入加 10 工部位之資料。 以上，已參照圖示而說明本發明之各實施例，但本發 明可適用之雷射加工裝置，凡可執行其功能者，即不受限 於上述各實施例等，亦可為單體之裝置，或由複數裝置構 成之系統或統合裝置、可經LAN、WAN等網路進行處理 15系統，則不待言。 之 亦即，本發明不受限於上述之各實施例等，在未逸、 本發明要|之範圍内，即可採用各種構造或形狀。 【阳式簡單說明】 第1圖係說明本發明第1實施例之雷射加工裝置之概略 20構造之模式的構造說明圖。 第2圖係說明本發明第1實施例之雷射加工裝 之構造之說明圖。 長孔 第3圖係說明本發明第丨實施例之雷射加工筆 夏之 陣列之截面方向之構造及動作之截面說明圖。 25 200918223 第4 (a)、（b)圖係顯示由反射面側觀察本發明第1實施例 之雷射加工裝置之微鏡陣列所得之狀態之模式的平面說明 圖及顯示可說明其動作之被加工物上之影像之一例之平面 說明圖。 5 第5 (a)、（b)圖係說明本發明第1實施例之雷射加工裝置 之拍攝元件所攝得之影像之一例之模式說明圖。 第6(a)、（b)圖係模式地顯示使用/不使用及已劣化/正常 之微鏡之例者。 第7圖係顯示已將資料之矩陣一分為二之例者。 10 【主要元件符號說明】 卜2···雷射光源 9…試料 2A、2B…雷射光束 10…中繼光學系統 3···照明光學系統 ll···衰減濾波器 4…數位微鏡裝置DMD 12…第2拍攝元件 4a···可動鏡面 13…第2影像處理部 4b…可動鏡排列面 14…控制器 4A…開狀態鏡 15…致動器驅動器 4B…關狀態鏡 16…二4由位移致動器 4C、4D···可動鏡面 Π···拍攝光學系統 5…聚光透鏡 18…第1拍攝元件 6…波長選擇鏡 19…第1影像處理部 7…物鏡 20…照明反射光 8···可見光照明部 21···投影領域 26 200918223 22a、22b…圖形 100、10l···控制訊號 23a、23b…領域 102…資料 24A…照射領域 103···影像資料 25…長孔 104…資料 25A、25B...長孔零件 105…影像資料 26…領域控制器 106、107、108···控制訊號 27…警告機構 109···領域分割指令 44、45…圖形 110…警告指令 46…領域 114…移動控制訊號 50…雷射加工裝置 274C has its life span, and the action 瑕疵 can not be controlled at the correct tilt angle 0 20 ha, because you 丨 秸 秸 径 制 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 The illumination optics 3 illuminates the beam 2 with a cross-sectional intensity. For example, the field of illumination 24A, which is not shown in Figure 4(4), can be illuminated. Next, the action mirror 叙 is formed corresponding to the tilt angle of each movable mirror surface to form the off state mirror 4B. Since the movable mirror 4D can operate normally, it is set to the open state mirror 4A. 19 200918223 Therefore, the laser beam deflected by the movable mirror 4D is selected from the condensing light of the condensing lens 5 and then approximately (10)% of the transmission wavelength is selected, "the objective lens 7 is condensed and reaches the sample 9, and the illumination is irradiated. 4(b) The field of the figure 231^. / The other part of the laser beam 2β that is the mirror reflection of the off state will penetrate the relay light system ίο, the city filter n and project on the second imaging element, for example The image of the pattern 45 shown in Fig. 5(8) can be imaged, and the second image processing unit 13 can be sent as the image data 1〇3. The second image processing unit U can specify the image processing. The movable mirror of the closed state mirror 4 is pure, and the control 14 is sent out as 10 for the data 104. The control data is received and compared with the information received from the second image processing unit 13 The determination is equivalent to the movable mirroring of the field 46 that is already in the open state mirror 4 (the biasing motion detection control). 15 As a result of the determination, the controller Η performs the irradiation field movement control. In addition to the detected motion, the amount of movement can be Arbitrarily set. Next, repeating the above steps, the state of the state mirror 4B to be turned off is normal, that is, the pre-lighting operation is ended, and the controller 14 outputs the control signal 101 to the laser light source m, and starts the processing step. 20 During the processing step The fields 23a, 23b of the 4th (b)® will be sublimated by heating, and the patterns 22a, 22b will be restored to the normal state. The above is the laser processing step of the general mode. However, if the deterioration is deteriorated, then even based on the prior illumination The data from the second image processing unit 13 and the data from the second image processing unit 19 are shifted by 20 200918223, and the controller 14 detects that the deteriorated micromirror is invaded and is used for illumination. In the field, the mode is switched to the deterioration corresponding mode. The following describes the deterioration mode with reference to Figures 6 and 7. Here, Figure 6(a) shows the rectangle in the micromirror field of the DMD4 (the outermost 5 edges of the matrix). A pattern diagram of the field of use of the micromirrors corresponding to the area of illumination of the shape (defects, etc.), and Fig. 6(b) is a schematic diagram showing the state of a degraded DMD 4 in the central portion of the DMD 4. Further, Fig. 7 Area to be illuminated The upper and lower divisions are divided into the pattern of the shape of the rectangular shape that has not deteriorated, and the pattern corresponding to the DMD4 side. 10 In this case, the field to be irradiated and the corresponding DMD4 system are optically conjugated, so the matrix on the DMD4 side is used. The controller 14 performs the segmentation determination once it receives the data 1〇2 via the domain controller 26. Since the initial system is in the normal mode, the segmentation determination is NO, and the domain size is directly for the controller 14 and the long hole 25, respectively. The transmission is performed as the control signal 15 107, 1 〇 8 〇, and the controller 14 performs the deviation motion detection control, and compares the data i 〇 2 received by the domain controller 26 with the D μ D 4 when the pre-light emission mode is received. The laser light and the image captured by the second imaging element 12 are subjected to image processing in the second image processing 2 13 to specify the deteriorated micromirror data iQ4, and the search 20 does not cause the degraded micromirror <dmd4 The location, that is, the best use location. However, at this time, as shown in Fig. 6(b), if the degraded micromirror is diffused, the DMD4 slips and the degraded micromirror cannot be avoided, and as a result, the optimum use position cannot be found. At this time, it is judged that the normal mode is switched to the deterioration corresponding mode. 21 200918223 The controller 14 is in the degradation corresponding mode, and then the domain controller % is notified of the identification number and the domain division command 109. The domain controller 26 that receives the domain segmentation instruction 1〇9 divides the matrix of the originally saved data 1〇2 into the first matrix and the second matrix as shown in FIG. At this time, the dividing method can divide the use collar 5 into a rectangular shape such as up and down. When viewing the D M D 4 side projection, the vertical and horizontal directions can be divided into two fields of 微γΐ8 of the micromirror. Therefore, the processing of the field corresponding to the sample in the above-mentioned field is performed on the basis of the field of 17 χ8 micromirrors on the DMD side. In this case, the division method should be as long as possible to divide the area into two. For example, it is possible to first determine the position of the center of gravity of the face, and then divide the center of gravity toward the top, bottom, left, and right directions. Secondly, the inherent identification numbers are individually compiled and saved. Then, the warning mechanism 27 is also notified of the warning command. The warning mechanism 27 that receives the warning command 110 issues a warning that the DMD 4 has deteriorated to the operator of the laser processing apparatus on the 15 monitor or the borrowing tower. Here, the timing of the announcement is not limited to the above, and for example, the number of times the D M D 4 has been slipped during the bias motion detection control can be calculated, and the warning is issued when the slip has reached the prescribed number of times or more. Next, the domain controller 26 will first transmit the first matrix to the controller 14 as 20 control data. Here, the bias motion detection control is performed again, and the best use position is found based on the usable field of DMD4. At this time, since the degraded micromirror has 17 fields and 8 fields in the upper and lower sides, the field can be used for illumination, and the controller 14 performs the movement control of the DMD4 by the field, and the actuator driver is used. 15 gives an indication to move the DMD 4 downward by one micromirror by controlling the two-axis displacement actuator 22 200918223 16 . After successfully illuminating the laser beam 2, the controller 丨4 requests the field controller 26 for the sub-matrix data. The domain controller 26 corresponds to: and ^ controller M transmits the data of the second matrix. Here, as with the heart matrix, the word is biased toward the motion detection control. Secondly, if there is no problem, then the illumination = domain movement control 'however', if it is assumed here that the laser of the pre-emission mode is "shooting", a new degraded micromirror is generated, or the defect portion is used to find the best use. For the location, the field segmentation of the second car is again carried out by the same steps as above. 10 15 The above processing will be repeated before the completion of the data 102. Even if the DMD4 is slipped, it cannot be avoided. The laser processing device 50 can also be used under the degraded micromirror +. Moreover, by warning the operator of the DMD4 (four), the operator can prepare for the repair before the laser security device is difficult to use. Further, in the case of the deflection operation detection control of the first embodiment, the determination as to whether or not the optimum use position is performed is performed in units of a single micromirror. However, only one micromirror is deteriorated. It may be that the diffraction phenomenon does not substantially affect the laser port. If the number of micromirrors of the right action 超过* exceeds the preset number of 20 areas per unit, it is determined that the field composed of the plurality of micromirrors is a degraded area. If the degraded area is included in the irradiation area, it can be judged that it is not the optimal use position. Even if the micromirror has a single unit failure, the processing may not be affected, so that the use period of the DMD 4 can be extended. 23 200918223 In the embodiment, the determination to switch to the deterioration corresponding mode is performed according to whether the optimal use position is found when the motion detection control is biased, but the number of degraded micromirrors as the reference may be preset, and the deteriorated micro-mirror is managed. The quantity is set to 5 in the normal mode before the micromirror deterioration is greater than the preset threshold, and when the number of degraded micromirrors exceeds the threshold, the mode is switched to the degraded corresponding mode. The brightness of the whole part of the DMD4 in the normal mode is grasped, and when the reflected brightness is lower than the preset threshold, the mode is switched to the degradation corresponding mode. 10 In addition, the laser irradiation time or laser irradiation to the DMD4 can be managed. The number of times is changed to the deterioration corresponding mode when the preset laser irradiation time or the number of laser irradiations is exceeded. Further, in the first embodiment, the general mode definition In the case of "the state that is not usable for the division of the domain controller 26", the deterioration corresponding mode is defined as 15 "the state that can be used if the division field is used", but the general mode can also be defined as "the DMD4 is not slipped. In the state of use, the deterioration corresponding mode is "a state in which the DMD 4 can be used if it is slipped". Further, in the present embodiment, the illumination field movement control of the deviation motion detection control uses the two-axis displacement actuator 16 to perform the movement operation of the DMD 4, and the value 〇 can also be changed to the movable sample 9 which can be moved to the vertical two. The two axes on the shaft move the load, and the two-axis moving stage is controlled to move the 1)]^4 to the sample 9, or to mount the laser processing device 50 in the vertical direction. The truss device is moved, and the DMD 4 and the sample 9 are relatively moved to subscribe to the ", and the field of field movement control. That is, the control of the micro- 24 200918223 mirror for switching the control of the DMD 4 can be performed. In the process of manufacturing a substrate such as a liquid crystal display device, a laser repairing device that can be corrected by matching the shape of the defect field by taking a defect field on the substrate can be used as an example, but the present invention can also be used. It is suitable for a laser processing apparatus that does not have an imaging system for capturing defects. That is, the imaging optical system 17, the first imaging element 18, the first image processing unit 19, the wavelength selection mirror 6, etc. can be omitted and replaced with Settings already The field controller 26 inputs the processing information storage unit having the data of the processed portion. Further, the field controller 26 may input the data of the 10 working parts from the processing information storage unit. The present invention has been described above with reference to the drawings. Each of the embodiments, but the laser processing apparatus to which the present invention is applicable, which is not limited to the above embodiments, may be a single device or a system composed of a plurality of devices or It is needless to say that the integrated device can be processed by a network such as a LAN or a WAN. However, the present invention is not limited to the above-described embodiments and the like, and is not within the scope of the present invention. Various structures or shapes can be used. [First description of the simplification] Fig. 1 is a structural explanatory view showing a mode of the structure of the schematic structure 20 of the laser processing apparatus according to the first embodiment of the present invention. Fig. 2 is a view showing the first embodiment of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 3 is a cross-sectional explanatory view showing the structure and operation of the cross-sectional direction of the array of laser-processed pens in the third embodiment of the present invention. 25 200918223 4 ( a), (b) A plan view showing a mode in which the micromirror array of the laser processing apparatus according to the first embodiment of the present invention is viewed from the side of the reflecting surface, and an example of an image on the workpiece on which the operation can be described. 5(a) and (b) are diagrams for explaining an example of an image of an image obtained by an imaging element of a laser processing apparatus according to a first embodiment of the present invention. (b) The figure shows the example of using/not using and degraded/normal micromirrors. Figure 7 shows the example in which the matrix of data has been divided into two. 10 [Description of main component symbols] 2···Laser light source 9...sample 2A, 2B...laser beam 10...relay optical system 3···illumination optical system ll···attenuation filter 4...digital micromirror device DMD 12...second imaging element 4a··· movable mirror surface 13...second image processing unit 4b...movable mirror array surface 14...controller 4A...open state mirror 15...actuator driver 4B...off state mirror 16...two 4 by displacement actuator 4C, 4D··· movable mirror Π···Photographing optical system 5...Condenser lens 18...first shot Element 6...wavelength selection mirror 19...first image processing unit 7...object lens 20...illumination reflected light 8···visible light illumination unit 21···projection area 26 200918223 22a, 22b...pattern 100, 10l··· control signal 23a 23b...field 102...data 24A...irradiation area 103···image data 25...long hole 104...data 25A,25B...long hole part 105...image material 26...field controller 106,107,108··· Control signal 27...Warning mechanism 109··· Domain segmentation command 44, 45...Graph 110...Warning command 46...Field 114...Moving control signal 50...Laser processing device 27