TW200844020A - Stage device - Google Patents

Stage device Download PDF

Info

Publication number
TW200844020A
TW200844020A TW097106465A TW97106465A TW200844020A TW 200844020 A TW200844020 A TW 200844020A TW 097106465 A TW097106465 A TW 097106465A TW 97106465 A TW97106465 A TW 97106465A TW 200844020 A TW200844020 A TW 200844020A
Authority
TW
Taiwan
Prior art keywords
divided
stage device
base
base frame
elevated
Prior art date
Application number
TW097106465A
Other languages
English (en)
Chinese (zh)
Inventor
Yasuhito Nakamori
Tatsuya Yoshida
Original Assignee
Sumitomo Heavy Industries
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Heavy Industries filed Critical Sumitomo Heavy Industries
Publication of TW200844020A publication Critical patent/TW200844020A/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

Landscapes

  • Machine Tool Units (AREA)
TW097106465A 2007-03-27 2008-02-25 Stage device TW200844020A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007081987A JP4328364B2 (ja) 2007-03-27 2007-03-27 ステージ装置

Publications (1)

Publication Number Publication Date
TW200844020A true TW200844020A (en) 2008-11-16

Family

ID=39114853

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097106465A TW200844020A (en) 2007-03-27 2008-02-25 Stage device

Country Status (4)

Country Link
JP (1) JP4328364B2 (https=)
KR (1) KR20080087724A (https=)
CN (1) CN101274407A (https=)
TW (1) TW200844020A (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4964853B2 (ja) * 2008-09-24 2012-07-04 住友重機械工業株式会社 ステージ装置
JP5550255B2 (ja) * 2009-04-28 2014-07-16 株式会社日立製作所 ペースト塗布装置及び塗布方法
JP5380225B2 (ja) * 2009-09-24 2014-01-08 株式会社日立ハイテクノロジーズ ガラス基板の検査装置
JP6025516B2 (ja) * 2012-11-15 2016-11-16 三菱重工業株式会社 取付加工機および加工方法
JP2014195805A (ja) * 2014-05-19 2014-10-16 芝浦メカトロニクス株式会社 ペースト塗布装置
CN111715943A (zh) * 2019-03-22 2020-09-29 江苏中朕智能工程有限公司 一种停车场道闸管理系统闸杆裁剪用切割机

Also Published As

Publication number Publication date
JP4328364B2 (ja) 2009-09-09
CN101274407A (zh) 2008-10-01
KR20080087724A (ko) 2008-10-01
JP2008023698A (ja) 2008-02-07

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